Phycomp Product specification
Trimmable chip resistors
sizes 1206 and 0805 RC02TR/12TR
2003 May 20 Rev.9 5 www.yageo.com
TEST AND REQUIREMENTS
Essentially all tests are carried out in
accordance with the schedule of
“IEC publication 60115-8”, category
55/155/56 (rated temperature range
−55 to +155 °C; damp heat, lon g
term, 56 days). The testing also
covers the requirements specified by
EIA and EIAJ.
The tests are carried out in
accordance with IEC publication
60068, “Recommended basic
climatic and mechanical robustness
testing procedure for electronic
components” and under standard
atmospheric conditions in
accordance with “IEC 60068-1”,
subclause 5.3.
Unless otherwise specified the
following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 45% to 75%
Air pressure: 86 kPa to 106 kPa
(860 mbar to 1060 mbar).
Table 3 Test procedures and requirements
IEC
60115-8
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
4.17 20 (Ta) solderability unmounted chips completely
immersed for 2 ±0.5 s in a solder bath
at 235 ±2 °C
good tinning (≥95% covered);
no visible damage
4.18 20 (Tb) resistance to
soldering heat 10 ±1 s; 260 ±5 °C ∆R/R max.: ±(0.5% + 0.05 Ω)
4.19 14 (Na) rapid change of
temperature 30 minutes at LCT and
30 minutes at UCT; 5 cycles ∆R/R max.: ±(0.5% + 0.05 Ω)
bending resistors mounted on a 90 mm glass
epoxy resin PCB (FR4), bending:
3 mm for RC02TR, 5 mm for RC12TR
no visible damage
∆R/R max.: ±(0.5% + 0.05 Ω)
56 days; 40 ±2 °C; 93 +2/−3% RH;
loaded with 0.01 Pn
R ≤ 1 MΩ ∆R/R max.: ±(1.0% + 0.05 Ω)
4.24.2 3 (Ca) damp heat
(steady state)
R > 1 MΩ ∆R/R max.: ±(1.5% + 0.05 Ω)
1000 hours +48/−0 hours; 70 ±2 °C;
nominal dissipation;
1.5 hours on and 0.5 hours off
R ≤ 1 MΩ ∆R/R max.: ±(1% + 0.05 Ω)
4.25.1 endurance
R > 1 MΩ ∆R/R max.: ±(1.5% + 0.05 Ω)
4.6.1.1 insulation
resistance 100 V (DC) after 1 minute,
metal block method Rins min.: 103 MΩ
4.13 short time
overload room temperature; P = 6.25 × Pn;
5 s (V ≤ 2 × Vmax for RC02TR,
V ≤ 200 V for RC12TR)
∆R/R max.: ±(1% + 0.05 Ω)
In Table 3 the tests and
requirements are listed with
reference to the relevant clauses of
“IEC publications 60115-8 and
60068”; a short description of the
test procedure is also given. In some
instances deviations from the IEC
recommendations were necessary
for our method of specifying.
All soldering tests are performed
with mildly activat ed flux.