JULY 2000 - REVISED JANUARY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4xxxL3AJ Overvoltage Protector Series
TISP4070L3AJ THRU TISP4395L3AJ
BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
Device Symbol
SMA (DO-214AC) Package
25% Smaller Placement Area than SMB
Ion-Implanted Breakdown Region
Precise and Stable Voltage
SMAJ Package (Top View)
Rated for International Surge Wave Shapes
How To Order
Device V
DRM
V
V
(BO)
V
‘4070 58 70
‘4080 65 80
‘4090 70 90
‘4125 100 125
‘4145 120 145
‘4165 135 165
‘4180 145 180
‘4220 160 220
‘4240 180 240
‘4260 200 260
‘4290 230 290
‘4320 240 320
‘4350 275 350
‘4360 290 360
‘4395 320 395
MDXXCCE
12R (B) T (A)
T
R
SD4XAA
Terminals T and R correspond to the
alternative line designators of A and B
Wave Shape Standard ITSP
A
2/10 µs GR-1089-CORE 125
8/20 µs IEC 61000-4-5 100
10/160 µs FCC Part 68 65
10/700 µs ITU-T K.20/21/45 50
10/560 µs FCC Part 68 40
10/1000 µs GR-1089-CORE 30
............................................ UL Recognized Components
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Device Package Carrier Order As
TISP4xxxL3AJ SMA (DO-214AC) Embossed Tape Reel Pack TISP4xxxL3AJR-S
Insert xxx value correspondin
g
to protection volta
g
es of 070, 080, 090, etc.
*RoHS COMPLIANT
JULY 2000 - REVISED JANUARY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
These devices are designed to limit overvoltages on the telephone line. Overvoltages are normally caused by a.c. power system or lightning
flash disturbances which are induced or conducted on to the telephone line. A single device provides 2-point protection and is typically used
for the protection of 2-wire telecommunication equipment (e.g. between the Ring and Tip wires for telephones and modems). Combinations of
devices can be used for multi-point protection (e.g. 3-point protection between Ring, Tip and Ground).
The protector consists of a symmetrical voltage-triggered bidirectional thyristor. Overvoltages are initially clipped by breakdown clamping until
the voltage rises to the breakover level, which causes the device to crowbar into a low-voltage on state. This low-voltage on state causes the
current resulting from the overvoltage to be safely diverted through the device. The high crowbar holding current helps prevent d.c. latchup as
the diverted current subsides.
The TISP4xxxL3 range consists of fifteen voltage variants to meet various maximum system voltage levels (58 V to 320 V). They are
guaranteed to voltage limit and withstand the listed international lightning surges in both polarities. These protection devices are in an SMAJ
(JEDEC DO-214AC with J-bend leads) plastic package. These devices are supplied in embossed tape reel carrier pack. For alternative voltage
and holding current values, consult the factory. For higher rated impulse currents, the 50 A 10/1000 TISP4xxxM3AJ series in SMA and the 100
A 10/1000 TISP4xxxH3BJ series in SMB are available.
TISP4xxxL3AJ Overvoltage Protector Series
Description
Absolute Maximum Ratings, TA = 25 °C (Unless Otherwise Noted)
Rating Symbol Value Unit
Repetitive peak off-state voltage, (see Note 1)
‘4070
‘4080
‘4125
‘4145
‘4165
‘4180
‘4220
‘4240
‘4260
‘4290
‘4350
‘4360
‘4395
VDRM
± 58
± 65
‘4090 ± 70
±100
±120
±135
±145
±160
±180
±200
±230
‘4320 ±240
±275
±290
±320
V
Non-repetitive peak on-state pulse current (see Notes 2, 3 and 4)
ITSP A
2/10 µs (GR-1089-CORE, 2/10 µs voltage wave shape) 125
8/20 µs (IEC 61000-4-5, combination wave generator, 1.2/50 voltage, 8/20 current) 100
10/160 µs (FCC Part 68, 10/160 µs voltage wave shape) 65
5/310 µs (ITU-T K.20/21/45, K.44 10/700 µs voltage wave shape) 50
5/310 µs (FTZ R12, 10/700 µs voltage wave shape) 50
10/560 µs (FCC Part 68, 10/560 µs voltage wave shape) 40
10/1000 µs (GR-1089-CORE, 10/1000 µs voltage wave shape) 30
Non-repetitive peak on-state current (see Notes 2, 3 and 4)
ITSM
18
7
1.6
A
20 ms (50 Hz) full sine wave
1 s (50 Hz) full sine wave
1000 s 50 Hz/60 Hz a.c.
Junction temperature TJ-40 to +150 °C
Storage temperature range T
stg -65 to +150 °C
NOTES: 1. For voltage values at lower temperatures, derate at 0.13 %/°C.
2. Initially, the TISP4xxxL3 must be in thermal equilibrium with T
J=25°C.
3. The surge may be repeated after the TISP4xxxL3 returns to its initial conditions.
4. EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint dimensions connected with 5 A rated printed wiring
track widths. Derate current values at -0.61 %/°C for ambient temperatures above 25 °C.
JULY 2000 - REVISED JANUARY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4xxxL3AJ Overvoltage Protector Series
Recommended Operating Conditions
Electrical Characteristics, TA = 25 °C (Unless Otherwise Noted)
Component Min Typ Max Unit
RS
series resistor for FCC Part 68, 10/560 type A surge survival 12
series resistor for FCC Part 68, 9/720 type B surge survival 0
series resistor for GR-1089-CORE first-level and second-level surge survival 23
series resistor for K.20, K.21 and K.45 1.5 kV, 10/700 surge survival 0
series resistor for K.20, K.21 and K.45 coordination with a 400 V primary protector 7
Parameter Test Conditions Min Typ Max Unit
I
DRM
Repetitive peak off-
state current V
D
= V
DRM
T
A
= 25 °C
T
A
= 85 °C
±5
±10 µA
V
(BO)
Breakover voltage dv/dt = ±250 V/ms, R
SOURCE
= 300
‘4070
‘4080
‘4090
‘4125
‘4145
‘4165
‘4180
‘4220
‘4240
‘4260
‘4290
‘4320
‘4350
‘4360
‘4395
±70
±80
±90
±125
±145
±165
±180
±220
±240
±260
±290
±320
±350
±360
±395
V
I
(BO)
Breakover current dv/dt = ±250 V/ms, R
SOURCE
= 300 ±0.8 A
I
H
Holding current I
T
=±5 A, di/dt = +/-30 mA/ms ±0.15 ±0.60 A
dv/dt Critical rate of rise of
off-state voltage Linear voltage ramp, Maximum ramp value < 0.85V
DRM
±5 kV/µs
I
D
Off-state current
‘4070, V
D
=±52 V
‘4080, V
D
=±59 V
‘4090, V
D
=±63 V
‘4125, V
D
=±90 V
‘4145, V
D
=±108 V
‘4165, V
D
=±122 V
‘4180, V
D
=±131 V
‘4220, V
D
=±144 V
‘4240, V
D
=±162 V
‘4260, V
D
=±180 V
‘4290, V
D
=±207 V
‘4320, V
D
=±216 V
‘4350, V
D
=±248 V
‘4360, V
D
=±261 V
‘4395, V
D
=±288 V
±2µA
I
D
Off-state current
D
=±50 VV±10 µA
JULY 2000 - REVISED JANUARY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Thermal Characteristics
TISP4xxxL3AJ Overvoltage Protector Series
Electrical Characteristics, TA = 25 °C (Unless Otherwise Noted) (Continued)
Coff Off-state capacitance
f=1MHz, V
d=1V rms, V
D=±1V
f=1MHz, V
d=1V rms, V
D=±50 V
4070 thru 4090
4125 thru ‘4220
4240 thru ‘4395
4070 thru ‘4090
4125 thru ‘4220
4240 thru ‘4395
53
40
33
25
18
14
64
48
40
30
22
17
pF
Parameter Test Conditions Min Typ Max Unit
Parameter Test Conditions Min Typ Max Unit
RθJA Junction to free air thermal resistance
EIA/JESD51-3 PCB, IT = ITSM(1000),
TA = 25 °C, (see Note 75) 115
°C/W
265 mm x 210 mm populated line card,
4-layer PCB, IT = ITSM(1000), TA = 25 °C52
NOTE 5: EIA/JESD51-2 environment and PCB has standard footprint dimensions connected with 5 A rated printed wiring track widths.
JULY 2000 - REVISED JANUARY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4xxxL3AJ Overvoltage Protector Series
Parameter Measurement Information
Figure 1. Voltage-Current Characteristic for T and R Terminals
All Measurements are Referenced to the R Terminal
-v VDRM
IDRM
VD
IH
IT
VT
ITSM
ITSP
V(BO)
I(BO)
ID
Quadrant I
I
Switching
Characteristic
+v
+i
V(BO)
I(BO)
VD
ID
IH
IT
VT
ITSM
ITSP
-i
Quadrant III
Switching
Characteristic PMXXAAB
VDRM
IDRM
JULY 2000 - REVISED JANUARY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4xxxL3AJ Overvoltage Protector Series
Typical Characteristics
Figure 2.
OFF-STATE CURRENT
vs
JUNCTION TEMPERATURE
T
J - Junction Temperature - °C
-25 0 25 50 75 100 125 150
|ID| - Off-State Current - µA
0·001
0·01
0·1
1
10 TC4LAG
VD = ±50 V
Figure 3.
T
J - Junction Temperature - °C
NORMALIZED BREAKOVER VOLTAGE
vs
JUNCTION TEMPERATURE
-25 0 25 50 75 100 125 150
Normalized Breakover Voltage
0.90
0.95
1.00
1.05
1.10
1.15 TC4LAF
Figure 4.
On-State Current - A
ON-STATE CURRENT
vs
ON-STATE VOLTAGE
VT - On-State Voltage - V
0.7 1.5 2 3 4 5 7 101
IT -
0.5
0.7
1.5
2
3
4
5
7
15
20
30
40
50
1
10
TA = 25 °C
tW = 100 µs
TC4MAM
'4070
THRU
'4090
'4125
THRU
'4220
'4240
THRU
'4395
Figure 5.
Junction Temperature - °C
TJ -
-25 0 25 50 75 100 125 150
Normalized Holding Current
0.4
0.5
0.6
0.7
0.8
0.9
1.5
2.0
1.0
TC4LAD
NORMALIZED HOLDING CURRENT
vs
JUNCTION TEMPERATURE
JULY 2000 - REVISED JANUARY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4xxxL3AJ Overvoltage Protector Series
Typical Characteristics
Figure 6.
NORMALIZED CAPACITANCE
vs
OFF-STATE VOLTAGE
VD - Off-state Voltage - V
0.5 1 2 3 5 10 20 30 50 100150
Capacitance Normalized to VD = 0
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1TC4LABC
'4070 THRU '4090
'4240 THRU '4395
'4125 THRU '4220
TJ = 25 °C
Vd = 1 Vrms
Figure 7.
DIFFERENTIAL OFF-STATE CAPACITANCE
vs
RATED REPETITIVE PEAK OFF-STATE VOLTAGE
VDRM - Repetitive Peak Off-State Voltage - V
50 60 70 80 90 150 200 250 300 350100
C - Differential Off-State Capacitance - pF
10
15
20
25
30
C = Coff(-2 V) - Coff(-50 V)
TCLAEB
TYPICAL CAPACITANCE ASYMMETRY
vs
OFF-STATE VOLTAGE
Figure 6.
Off-state Voltage - V
VD
23 11 4 5 7 20 30 40 500
|Coff(+VD)- Coff(-VD) | — Capacitance Asymmetry — pF
0
1
Vd = 1 V rms, 1 MHz
Vd = 10 mV rms, 1 MHz
TC4LBB
JULY 2000 - REVISED JANUARY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4xxxL3AJ Overvoltage Protector Series
Rating and Thermal Information
Figure 9.
NON-REPETITIVE PEAK ON-STATE CURRENT
vs
CURRENT DURATION
t - Current Duration - s
0.01 0.1 1 10 100
ITSM(t) - Non-Repetitive Peak On-State Current - A
1.5
2
3
4
5
6
7
8
9
15
20
10
TI4LAI
VGEN = 600 Vrms, 50/60 Hz
RGEN = 1.4*VGEN/ITSM(t)
EIA/JESD51-2 ENVIRONMENT
EIA/JESD51-3 PCB
T
A = 25 °C
Figure 10.
VDRM DERATING FACTOR
vs
MINIMUM AMBIENT TEMPERATURE
TAMIN - Minimum Ambient Temperature - °C
-35 -25 -15 -5 5 15 25-40 -30 -20 -10 0 10 20
Derating Factor
0.93
0.94
0.95
0.96
0.97
0.98
0.99
1.00 TI4LADB
'4070 THRU '4090
'4125 THRU '4220
'4240 THRU '4395
JULY 2000 - REVISED JANUARY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
MECHANICAL DATA
TISP4xxxL3AJ Overvoltage Protector Series
Recommended Printed Wiring Land Pattern Dimensions
Device Symbolization Code
Devices will be coded as below. As the device parameters are symmetrical, terminal 1 is not identified.
Carrier Information
For production quantities, the carrier will be embossed tape reel pack. Evaluation quantities may be shipped in bulk pack or embossed tape.
SMA Land Pattern
MDXX BIC
2.34
(.092)
1.90
(.075)
2.16
(.085)
DIMENSIONS ARE: MILLIMETERS
(INCHES)
Device Symbolization
Code
TISP4070L3 4070L
TISP4080L3 4080L
TISP4090L3 4090L
TISP4125L3 4125L
TISP4145L3 4145L
TISP4165L3 4165L
TISP4180L3 4180L
TISP4220L3 4220L
TISP4240L3 4240L
TISP4260L3 4260L
TISP4290L3 4290L
TISP4320L3 4320L
TISP4350L3 4350L
TISP4360L3 4360L
TISP4395L3 4395L
Carrier Standard Quantity
Embossed Tape Reel Pack 5,000
“TISP” is a trademark of Bourns, Ltd., a Bourns Company and Registered in U.S. Patent and Trademark Office.
“Bourns” is a registered trademark of Bourns, Inc. in the U.S. and other countries.