Dimensions
General Specifications
Chip Terminations
50
Alumina Terminations
Alumina Chip Terminations
Features
•DC - 6.0 GHz
•10-40 Watts
•Low Cost
•Alumina Ceramic
•Non-Nichrome Resistive
Element
•Low VSWR
•100% Tested
Ω
1
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Available on Tape and Reel for Pick and Place Manufacturing.
Note: See table for dimensions.
PRELIMINAR
PRELIMINARY
Y
PART NUMBER WIDTH LENGTH THK. A
RFP-060120A25X50 0.060 0.120 0.025 0.030
RFP-100200A25X50 0.100 0.200 0.025 0.030
RFP-250250A4X50 0.250 0.250 0.040 0.040
RFP-250375A4X50 0.250 0.375 0.040 0.040
RFP-375250A4X50 0.375 0.250 0.040 0.050
RFP-375375A4X50 0.375 0.375 0.040 0.050
Resistive Element: Thick film
Substrate: Alumina ceramic
Terminals: Thick film silver
Resistance Value: 50 ohms, ±2%
Notes: Tolerance is ±.010, unless otherwise specified. Operating
temperature is -55°C to +125°C (see chart). Designed to meet or
exceed applicable portions of MIL-E-5400. All dimensions are in
inches.
Specifications subject to change without notice.
Outline Drawing
VER. 12/5/01
Alumina Chip Terminations
Alumina Terminations
2
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Suggested Mounting Procedures
BOARD HIGHER
THAN LEAD.
BOARD LOWER
THAN LEAD.
SCALE:
NOT RECOMMENDED APPLICATION
Available on Tape and Reel for Pick and Place Manufacturing.
Typical Performance
PRELIMINAR
PRELIMINARY
Y
PART NUMBER VALUE (OHM) POWER (WATTS) MAX VSWR FREQ. (GHz)
RFP-060120A25X50 50 10 1.25:1 6.0
RFP-100200A25X50 50 20 1.25:1 6.0
RFP-250250A4X50 50 30 1.25:1 3.0
RFP-250375A4X50 50 40 1.25:1 3.0
RFP-375250A4X50 50 40 1.20:1 2.5
RFP-375375A4X50 50 40 1.20:1 2.5
Power Derating
100
125
1007550
25
50
0
25
HEAT SINK TEMPERATURE — °C
75
% OF RATED POWER
MIN.
SCALE:
WITH LEAD.
BOARD EVEN
.025
BOARD LOWER
THAN LEAD.
SUGGESTED STRESS RELIEF METHODS
(2 PLACES)
1. Make sure that the devices are mounted on flat surfaces
(.001” under the device) to optimize the heat transfer.
2. Position device on mounting surface and solder in place
using an indalloy type or an SN63 type solder.
3. Solder leads in place using a 60/40 type solder with a
controlled temperature iron (700°F).
