SN54AHC139, SN74AHC139
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS
SCLS259K − DECEMBER 1995 − REVISED MARCH 2003
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DOperating Range 2-V to 5.5-V VCC
DDesigned Specifically for High-Speed
Memory Decoders and Data-Transmission
Systems
DIncorporate Two Enable Inputs to Simplify
Cascading and/or Data Reception
DLatch-Up Performance Exceeds 250 mA Per
JESD 17
DESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
3212019
910111213
4
5
6
7
8
18
17
16
15
14
2A
2B
NC
2Y0
2Y1
1B
1Y0
NC
1Y1
1Y2
1A
1G
NC
2Y3
2Y2
V
2G
1Y3
GND
NC
SN54AHC139 ...FK PACKAGE
(TOP VIEW)
CC
NC − No internal connection
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1G
1A
1B
1Y0
1Y1
1Y2
1Y3
GND
VCC
2G
2A
2B
2Y0
2Y1
2Y2
2Y3
SN54AHC139 ...J OR W PACKAGE
SN74AHC139 ...D, DB, DGV, N, NS
OR PW PACKAGE
(TOP VIEW)
SN74AHC139 . . . RGY PACKAGE
(TOP VIEW)
116
89
2
3
4
5
6
7
15
14
13
12
11
10
2G
2A
2B
2Y0
2Y1
2Y2
1A
1B
1Y0
1Y1
1Y2
1Y3
1G
2Y3 V
GND
CC
description/ordering information
The ’AHC139 devices are dual 2-line to 4-line decoders/demultiplexers designed for 2-V to 5.5-V VCC operation.
These devices are designed to be used in high-performance memory-decoding or data-routing applications
requiring very short propagation delay times. In high-performance memory systems, these decoders can be
used to minimize the effects of system decoding. When used with high-speed memories utilizing a fast enable
circuit, the delay times of these decoders and the enable time of the memory usually are less than the typical
access time of the memory. This means that the effective system delay introduced by the decoders is negligible.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
QFN − RGY Tape and reel SN74AHC139RGYR HA139
PDIP − N Tube SN74AHC139N SN74AHC139N
SOIC D
Tube SN74AHC139D
AHC139
SOIC − D Tape and reel SN74AHC139DR AHC139
−40°C to 85°CSOP − NS Tape and reel SN74AHC139NSR AHC139
SSOP − DB Tape and reel SN74AHC139DBR HA139
TSSOP PW
Tube SN74AHC139PW
HA139
TSSOP − PW Tape and reel SN74AHC139PWR HA139
TVSOP − DGV Tape and reel SN74AHC139DGVR HA139
CDIP − J Tube SNJ54AHC139J SNJ54AHC139J
−55°C to 125°CCFP − W Tube SNJ54AHC139W SNJ54AHC139W
55 C
to
125 C
LCCC − FK Tube SNJ54AHC139FK SNJ54AHC139FK
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Copyright © 2003, Texas Instruments Incorporated
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SN54AHC139, SN74AHC139
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS
SCLS259K − DECEMBER 1995 − REVISED MARCH 2003
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
description/ordering information (continued)
The active-low enable (G) input can be used as a data line in demultiplexing applications. These
decoders/demultiplexers feature fully buffered inputs, each of which represents only one normalized load to its
driving circuit.
FUNCTION TABLE
(each decoder/demultiplexer)
INPUTS
OUTPUTS
G
SELECT OUTPUTS
GB A Y0 Y1 Y2 Y3
H X X H H H H
L L LLHHH
L L HHLHH
L H LHHLH
L H H H H H L
logic diagram (positive logic)
Select
Inputs
Select
Inputs
2B
2A
2G
1B
1A
1G
Data
Outputs
2Y3
2Y2
2Y1
2Y0
1Y3
1Y2
1Y1
1Y0
1
2
3
15
14
13
4
5
6
7
12
11
10
9
Pin numbers shown are for the D, DB, DGV, J, N, NS, PW, RGY, and W packages.
SN54AHC139, SN74AHC139
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS
SCLS259K − DECEMBER 1995 − REVISED MARCH 2003
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, VO (see Note 1) −0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0) −20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0 or VO > VCC) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO (VO = 0 to VCC) ±25 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±75 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): D package 73°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): DB package 82°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): DGV package 120°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): N package 67°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): NS package 64°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): PW package 108°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 3): RGY package 39°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
3. The package thermal impedance is calculated in accordance with JESD 51-5.
recommended operating conditions (see Note 4)
SN54AHC139 SN74AHC139
UNIT
MIN MAX MIN MAX UNIT
VCC Supply voltage 2 5.5 2 5.5 V
VCC = 2 V 1.5 1.5
VIH High-level input voltage VCC = 3 V 2.1 2.1 V
VIH
High level
input
voltage
VCC = 5.5 V 3.85 3.85
V
VCC = 2 V 0.5 0.5
VIL Low-level input voltage VCC = 3 V 0.9 0.9 V
VIL
Low level
input
voltage
VCC = 5.5 V 1.65 1.65
V
VIInput voltage 0 5.5 0 5.5 V
VOOutput voltage 0 VCC 0 VCC V
VCC = 2 V −50 −50 mA
IOH High-level output current VCC = 3.3 V ± 0.3 V −4 −4
mA
IOH
High level
output
current
VCC = 5 V ±0.5 V −8 −8 mA
VCC = 2 V 50 50 mA
IOL Low-level output current VCC = 3.3 V ±0.3 V 4 4
mA
IOL
Low level
output
current
VCC = 5 V ±0.5 V 8 8 mA
Δt/Δv
Input transition rise or fall rate
VCC = 3.3 V ± 0.3 V 100 100
ns/V
Δt/ΔvInput transition rise or fall rate VCC = 5 V ±0.5 V 20 20 ns/V
TAOperating free-air temperature −55 125 −40 85 °C
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
SN54AHC139, SN74AHC139
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS
SCLS259K − DECEMBER 1995 − REVISED MARCH 2003
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
V
TA = 25°C SN54AHC139 SN74AHC139
UNIT
PARAMETER TEST CONDITIONS VCC MIN TYP MAX MIN MAX MIN MAX UNIT
2 V 1.9 2 1.9 1.9
IOH = −50 mA3 V 2.9 3 2.9 2.9
V
OH
IOH
50
mA
4.5 V 4.4 4.5 4.4 4.4 V
VOH
IOH = −4 mA 3 V 2.58 2.48 2.48
V
IOH = −8 mA 4.5 V 3.94 3.8 3.8
2 V 0.1 0.1 0.1
IOL = 50 mA3 V 0.1 0.1 0.1
V
OL
IOL
50
mA
4.5 V 0.1 0.1 0.1 V
VOL
IOL = 4 mA 3 V 0.36 0.5 0.44
V
IOL = 8 mA 4.5 V 0.36 0.5 0.44
IIVI = 5.5 V or GND 0 V to 5.5 V ±0.1 ±1* ±1mA
ICC VI = VCC or GND, IO = 0 5.5 V 4 40 40 mA
CiVI = VCC or GND 5 V 2 10 10 pF
* On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.
switching characteristics over recommended operating free-air temperature range,
VCC = 3.3 V ±0.3 V (unless otherwise noted) (see Figure 1)
FROM TO LOAD TA = 25°C SN54AHC139 SN74AHC139
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
CAPACITANCE MIN TYP MAX MIN MAX MIN MAX UNIT
tPLH
AorB
Y
7.2** 11** 1** 13** 1 13
ns
tPHL
A or B Y CL = 15 pF 7.2** 11** 1** 13** 1 13 ns
tPLH
G
Y
6.4** 9.2** 1** 11** 1 11
ns
tPHL
GY CL = 15 pF 6.4** 9.2** 1** 11** 1 11 ns
tPLH
AorB
Y
9.7 14.5 1 16.5 1 16.5
ns
tPHL
A or B Y CL = 50 pF 9.7 14.5 1 16.5 1 16.5 ns
tPLH
G
Y
8.9 12.7 1 14.5 1 14.5
ns
tPHL
GY CL = 50 pF 8.9 12.7 1 14.5 1 14.5 ns
** On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ±0.5 V (unless otherwise noted) (see Figure 1)
FROM TO LOAD TA = 25°C SN54AHC139 SN74AHC139
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
CAPACITANCE MIN TYP MAX MIN MAX MIN MAX UNIT
tPLH
AorB
Y
5** 7.2** 1** 8.5** 1 8.5
ns
tPHL
A or B Y CL = 15 pF 5** 7.2** 1** 8.5** 1 8.5 ns
tPLH
G
Y
4.4** 6.3** 1** 7.5** 1 7.5
ns
tPHL
GY CL = 15 pF 4.4** 6.3** 1** 7.5** 1 7.5 ns
tPLH
AorB
Y
6.5 9.2 1 10.5 1 10.5
ns
tPHL
A or B Y CL = 50 pF 6.5 9.2 1 10.5 1 10.5 ns
tPLH
G
Y
5.9 8.3 1 9.5 1 9.5
ns
tPHL
GY CL = 50 pF 5.9 8.3 1 9.5 1 9.5 ns
** On products compliant to MIL-PRF-38535, this parameter is not production tested.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
SN54AHC139, SN74AHC139
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS
SCLS259K − DECEMBER 1995 − REVISED MARCH 2003
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance No load, f = 1 MHz 13 pF
PARAMETER MEASUREMENT INFORMATION
50% VCC
VCC
VCC
0 V
0 V
th
tsu
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
Data Input
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
VCC
0 V
50% VCC
50% VCC
Input
Out-of-Phase
Output
In-Phase
Output
Timing Input
50% VCC
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
Output
Control
Output
Waveform 1
S1 at VCC
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
VOL
VOH
tPZL
tPZH
tPLZ
tPHZ
≈VCC
0 V
50% VCC VOL + 0.3 V
50% VCC
≈0 V
VCC
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
TEST S1
VCC
0 V
50% VCC
tw
VOLTAGE WAVEFORMS
PULSE DURATION
Input
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
From Output
Under Test
CL
(see Note A)
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
S1
VCC
RL = 1 kΩ
GND
From Output
Under Test
CL
(see Note A)
Test
Point
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
Open
50% VCC
50% VCC 50% VCC
50% VCC
50% VCC 50% VCC
50% VCC 50% VCC
VOH − 0.3 V
Figure 1. Load Circuit and Voltage Waveforms
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74AHC139D ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC139DBLE OBSOLETE SSOP DB 16 TBD Call TI Call TI
SN74AHC139DBR ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC139DBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC139DBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC139DE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC139DG4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC139DGVR ACTIVE TVSOP DGV 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC139DGVRE4 ACTIVE TVSOP DGV 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC139DGVRG4 ACTIVE TVSOP DGV 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC139DR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC139DRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC139DRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC139N ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74AHC139NE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74AHC139NSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC139NSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC139NSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC139PW ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC139PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC139PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC139PWLE OBSOLETE TSSOP PW 16 TBD Call TI Call TI
SN74AHC139PWR ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC139PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC139PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC139RGYR ACTIVE VQFN RGY 16 3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
PACKAGE OPTION ADDENDUM
www.ti.com 21-Dec-2009
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
no Sb/Br)
SN74AHC139RGYRG4 ACTIVE VQFN RGY 16 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 21-Dec-2009
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74AHC139DBR SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74AHC139DGVR TVSOP DGV 16 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1
SN74AHC139DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
SN74AHC139NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74AHC139PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74AHC139RGYR VQFN RGY 16 3000 330.0 12.4 3.8 4.3 1.5 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74AHC139DBR SSOP DB 16 2000 367.0 367.0 38.0
SN74AHC139DGVR TVSOP DGV 16 2000 367.0 367.0 35.0
SN74AHC139DR SOIC D 16 2500 333.2 345.9 28.6
SN74AHC139NSR SO NS 16 2000 367.0 367.0 38.0
SN74AHC139PWR TSSOP PW 16 2000 367.0 367.0 35.0
SN74AHC139RGYR VQFN RGY 16 3000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUAR Y 1996 – REVISED AUGUST 2000
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50 4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
112
24 13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
382416
4,90
5,103,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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