MSP Vishay Sfernice Precision Surface Mount Resistors Wirewound or Metal Film Technologies FEATURES * Wide range of ohmic values * Low temperature coeffi cient * Good electrical insulation * Good mechanical strength * High power The MSP design is compatible with surface mounting equipment and can withstand wave and refl ow soldering techniques. Specially designed for surface mounting, the MSP series uses either wirewound or metal fi lm technology. The molded package ensures mechanical and climatic protection as well as high dielectric insulation. DIMENSIONS in millimeters MSP RECOMMENDED SOLDERING AREAS E Z W X X A C B F F D TECHNICAL SPECIFICATIONS RESISTIVE TECHNOLOGY WIREWOUND Vishay Sfernice Series MSP 2B MSP 3B MSP 1C MSP 2C 1W 2W 2.5 W 0.5 W 1W 5% 0.04 2.2K 0.04 4.7K 0.04 13K - - 2% 0.04 2.2K 0.04 4.7K 0.05 13K - - 1% 0.04 2.2K 0.04 4.7K 0.05 13K 10 332K 0.4 2.2K 0.4 4.7K 0.3 13K 10 332K Power Dissipation at + 25 C Ohmic Range In Relation to Tolerance 0.5 % 0.1 % Limiting Element Voltage Critical Resistance Average Weight (in g) www.vishay.com 1 METAL FILM MSP 1B 10 332K Consult VISHAY SFERNICE 10 1M 10 1M 10 332K 50V 120 V 200 V 300 V 350V - - - 180K 122.5K 0.2 0.8 1.5 0.2 0.8 For technical questions, contact: sfer@vishay.com Document Number: 50003 Revision: 01-May-06 MSP Precision Surface Mount Resistors Wirewound or Metal Film Technologies Vishay Sfernice PERFORMANCE CONDITIONS Wirewound Metal Film TESTS Dielectric w/s Voltage TEST RESULTS 500 V RMS (0.1 % + 0.05) 0.25 % 0.05 % 5 Pr/5 s (0.25 % + 0.05) 0.25 % 0.15 % 5 cycles - 55 C + 200 C - 55 C + 125 C (0.5 % + 0.05) Ins. resistance > 100M 0.5 % Ins. resistance > 100M 0.2 % Ins. resistance > 103M Short Time Overload Climatic Sequence REQUIREMENTS Wirewound NF C 83-210 Metal Film NF C 83-230 Humidity (Steady State) 56 days 95 % RH 10 days low load (0.5 % + 0.05) Ins. resistance > 100M 1% Ins. resistance > 100M 0.3 % Ins. resistance > 103M Vibration 10/ 2000 Hz 10/ 500 Hz (0.25 % + 0.05) 0.25 % 0.05 % Load Life Pr + 25 C 2000 h 1000 h Pr + 25 C 90/30 cycle (0.5 % + 0.05) Ins. resistance 1G 1% 0.5 % (0.25 % + 0.05) 0.25 % + 0.05 0.2 % Thermal Shock 260 C 10 s MSP B - Wirewound Technology TEMPERATURE COEFFICIENT IN THE TEMPERATURE RANGE - 55C + 200C OHMIC RANGE NF C 83-210 LIMITS <1 100 ppm/C 1 to < 10 50 ppm/C 10 25 ppm/C TYPICAL VALUE 50 pm/C + 0 to - 20 ppm/C MSP C - Metal Film Technology TEMPERATURE COEFFICIENT IN THE TEMPERATURE RANGE - 55 C + 155 C OHMIC RANGE MSP 1C 10 to 332K MSP 2C K3: 50ppm/C K4: 25ppm/C > 332K - K3: 50 ppm/C SURFACE MOUNTING Soldering cycle: 2 minutes at 215 C or 10 seconds at 260 C or with an iron 40 W: 3 seconds at 350 C. Soldering is possible by wave, reflow and vapor phase. NON INDUCTIVE WINDING Non inductive (Ayrton Perry) winding available. Please consult VISHAY SFERNICE. Document Number: 50003 Revision: 01-May-06 For technical questions, contact: sfer@vishay.com www.vishay.com 2 MSP Precision Surface Mount Resistors Wirewound or Metal Film Technologies Vishay Sfernice POWER RATING CHART 125 % RATED POWER 100 75 MSP B 50 MSP C 25 0 0 50 100 150 200 250 300 AMBIENT TEMPERATURE IN C TEMPERATURE RISE 200 SP M 1B 150 MS P M C 100 1 M SP SP 2 2 3 B B C M SP HOT SPOT TEMPERATURE IN C 250 50 0 0 0.5 1 1.5 2 2.5 3 RATED POWER IN WATTS PACKAGING In bulk (plastic bag of 10 units or multiples). In tube : MSP1 70 units per tube MSP2 50 units per tube MSP3 40 units per tube In reel of 500 units for MSP1 and MSP2. MARKING SFERNICE trademark, ohmic value (in ), tolerance (in %), series and style, technology , manufacturing date. ORDERING INFORMATION MSP 1 B NI 1.6K 1% SERIES STYLE TECHNOLOGY NON INDUCTIVE OHMIC VALUE TOLERANCE B: Wirewound C: Metal Film WINDING Optional www.vishay.com 3 For technical questions, contact: sfer@vishay.com PACKAGING Optional Document Number: 50003 Revision: 01-May-06 Legal Disclaimer Notice Vishay Notice Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc., or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Vishay for any damages resulting from such improper use or sale. Document Number: 91000 Revision: 08-Apr-05 www.vishay.com 1