COMe-bSC2 Document Revision 140 www.kontron.com Table of Contents 1 User Information..................................................................................6 1.1 About This Document.................................................................................................................... 6 1.2 Copyright Notice.......................................................................................................................... 6 1.3 Trademarks................................................................................................................................. 6 1.4 Standards................................................................................................................................... 6 1.5 Warranty.................................................................................................................................... 7 1.6 Technical Support......................................................................................................................... 7 2 Introduction........................................................................................8 2.1 Product Description...................................................................................................................... 8 2.2 Naming clarification..................................................................................................................... 8 2.3 Understanding COM Express(R) Functionality....................................................................................... 8 2.4 COM Express(R) Documentation......................................................................................................... 9 2.5 COM Express(R) Benefits.................................................................................................................. 9 3 Product Specification..........................................................................10 3.1 Modules & Accessories................................................................................................................. 10 3.2 Functional Specification............................................................................................................... 12 3.3 Block Diagram............................................................................................................................ 18 3.4 Variant Matrix............................................................................................................................ 19 3.5 3.5.1 3.5.2 3.5.3 3.5.4 3.5.5 3.5.6 3.6 Electrical Specification................................................................................................................ 20 Supply Voltage........................................................................................................................... 20 Power Supply Rise Time................................................................................................................ 20 Supply Voltage Ripple.................................................................................................................. 20 Power Consumption..................................................................................................................... 20 ATX Mode.................................................................................................................................. 21 Single Supply Mode..................................................................................................................... 21 Power Control............................................................................................................................ 22 3.7 3.7.1 3.7.2 3.8 Environmental Specification......................................................................................................... 23 Temperature Specification............................................................................................................ 23 Humidity................................................................................................................................... 23 Standards and Certifications......................................................................................................... 24 3.9 MTBF........................................................................................................................................ 26 3.10 Mechanical Specification.............................................................................................................. 27 3.11 Module Dimensions..................................................................................................................... 27 3.12 Thermal Management.................................................................................................................. 28 3.13 Heatspreader............................................................................................................................. 28 3.14 Onboard Fan Connector................................................................................................................ 29 4 Features and Interfaces.......................................................................30 4.1 S5 Eco Mode.............................................................................................................................. 30 4.2 Rapid Shutdown......................................................................................................................... 31 www.kontron.com COMe-bSC2 / 4.3 LPC.......................................................................................................................................... 33 4.4 Serial Peripheral Interface (SPI).................................................................................................... 34 4.5 SPI boot.................................................................................................................................... 34 4.6 M.A.R.S.................................................................................................................................... 35 4.7 Fast I2C.................................................................................................................................... 36 4.8 EAPI, JIDA & PLD Driver................................................................................................................ 37 4.9 K-Station 2................................................................................................................................ 38 4.10 KeAPI....................................................................................................................................... 39 4.11 GPIO - General Purpose Input and Output.........................................................................................40 4.12 Dual Staged Watchdog Timer......................................................................................................... 41 4.13 Speedstep Technology................................................................................................................. 42 4.14 C-States.................................................................................................................................... 43 4.15 Hyper Threading......................................................................................................................... 44 4.16 VID-x....................................................................................................................................... 45 4.17 Intel(R) Turbo Boost Technology and AVX...........................................................................................46 4.18 Shared Graphics Interfaces........................................................................................................... 47 4.19 Display Configuration.................................................................................................................. 49 4.20 Hybrid Graphics / Multi-monitor.................................................................................................... 53 4.21 Intel(R) Wireless Display................................................................................................................ 55 4.22 Intel(R) vProTM technology.............................................................................................................. 56 4.23 ACPI Suspend Modes and Resume Events.......................................................................................... 57 4.24 USB......................................................................................................................................... 58 5 System Resources...............................................................................59 5.1 Interrupt Request (IRQ) Lines........................................................................................................ 59 5.2 Memory Area............................................................................................................................. 60 5.3 I/O Address Map......................................................................................................................... 60 5.4 Peripheral Component Interconnect (PCI) Devices..............................................................................61 5.5 I2C Bus..................................................................................................................................... 61 5.6 JILI I2C Bus............................................................................................................................... 61 5.7 SDVO I2C Bus............................................................................................................................. 61 5.8 System Management (SM) Bus....................................................................................................... 62 6 Connectors........................................................................................63 6.1 Connector Location..................................................................................................................... 63 7 Pinout List.........................................................................................64 7.1 General Signal Description............................................................................................................ 64 7.2 Connector X1A Row A................................................................................................................... 65 7.3 Connector X1A Row B................................................................................................................... 67 7.4 Connector X1B Row C................................................................................................................... 69 7.5 Connector X1B Row D................................................................................................................... 71 8 BIOS Operation...................................................................................73 4 COMe-bSC2 / User Information 8.1 Determining the BIOS Version........................................................................................................ 73 8.2 BIOS Update.............................................................................................................................. 73 8.3 8.3.1 8.4 8.4.1 8.4.2 8.4.3 8.4.4 8.4.5 8.4.6 Setup Guide............................................................................................................................... 75 Start AMI(R) Aptio Setup Utility....................................................................................................... 75 BIOS Setup................................................................................................................................ 77 Main........................................................................................................................................ 77 Advanced.................................................................................................................................. 79 Chipset................................................................................................................................... 105 Boot....................................................................................................................................... 122 Security.................................................................................................................................. 124 Save & Exit............................................................................................................................... 126 5 COMe-bSC2 / User Information 1 1.1 User Information About This Document This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this document is accurate, the information contained within is supplied "as-is" and is subject to change without notice. For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of third parties are concerned. 1.2 Copyright Notice Copyright (c) 2003-2012 Kontron Europe GmbH All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the express written permission of Kontron Europe GmbH. DIMM-PC(R), PISA(R), ETX(R), ETXexpress(R), microETXexpress(R), X-board(R), DIMM-IO(R) and DIMM-BUS(R) are trademarks or registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG. 1.3 Trademarks The following lists the trademarks of components used in this board. IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp. Microsoft is a registered trademark of Microsoft Corp. Intel is a registered trademark of Intel Corp. All other products and trademarks mentioned in this manual are trademarks of their respective owners. 1.4 Standards Kontron Europe GmbH is certified to ISO 9000 standards. 6 COMe-bSC2 / User Information 1.5 Warranty This Kontron Europe GmbH product is warranted against defects in material and workmanship for the warranty period from the date of shipment. During the warranty period, Kontron Europe GmbH will at its discretion decide to repair or replace defective products. Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed. The warranty does not apply to defects resulting from improper or inadequate maintenance or handling by the buyer, unauthorized modification or misuse, operation outside of the product's environmental specifications or improper installation or maintenance. Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron Europe GmbH that are caused by a faulty Kontron Europe GmbH product. 1.6 Technical Support Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are committed to making our product easy to use and will help you use our products in your systems. Please consult our Web site at http://www.kontron.com/support for the latest product documentation, utilities, drivers and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and software. In any case you can always contact your board supplier for technical support. 7 COMe-bSC2 / Introduction 2 Introduction 2.1 Product Description In 2011, Intel(R) introduced its first quad core CPU suitable for the COM Express(R) platform. With the quad-core CPU CoreTM i7-2715QE and the dual-core CPUs CoreTM i3/i5/i7, COM Express(R) reaches ground-breaking performance values: both for CPU and GPU rankings. With various CPUs COMe-bSC# serves your individual performance needs, starting with a 1.0 GHz version Celeron(R) 807UE. Kontron's COMe-bSC# is available as COM Express(R) basic form factor (125x95mm) for Pin-out Type 2 (COMe-bSC2) and Pin-out Type 6 (COMe-bSC6) with or without ECC DDR2 memory support. 2.2 Naming clarification COM Express(R) defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer, packaged as a super component. COMe-bXX# modules are Kontron's COM Express(R) modules in basic form factor (125mm x 95mm), formerly known as ETXexpress(R) COMe-cXX# modules are Kontron's COM Express(R) modules in compact form factor (95mm x 95mm), formerly known as microETXexpress(R) COMe-mXX# modules are Kontron's COM Express(R) modules in mini form factor (55mm x 84mm), formerly known as nanoETXexpress The product names for Kontron COM Express(R) Computer-on-Modules consist of a short form of the industry standard (COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames (XX) and the pin-out type (#) followed by the CPU Name. 2.3 Understanding COM Express(R) Functionality All Kontron COM Express(R) basic and compact modules contain two 220pin connectors; each of it has two rows called Row A & B on primary connector and Row C & D on secondary connector. COM Express(R) Computer-on-modules feature the following maximum amount of interfaces according to the PICMG module Pin-out type: Feature Pin-Out Type 1 Pin-Out Type 10 Pin-Out Type 2 Pin-Out Type 6 HD Audio 1x 1x 1x 1x Gbit Ethernet 1x 1x 1x 1x Serial ATA 4x 4x 4x 4x Parallel ATA - - 1x - PCI - - 1x - PCI Express x1 6x 6x 6x 8x 1x PCI Express x16 (PEG) - - 1x USB Client 1x 1x - - USB 2.0 8x 8x 8x 8x USB 3.0 - 2x - 4x VGA 1x - 1x 1x LVDS Dual Channel Single Channel Dual Channel Dual Channel DP++ (SDVO/DP/HDMI/DVI) 1x optional 1x 3x shared with PEG 3x LPC 1x 1x 1x 1x External SMB 1x 1x 1x 1x External I2C 1x 1x 1x 1x GPIO 8x 8x 8x 8x SDIO 1x optional 1x optional - - UART (2-wire COM) - 2x - 2x FAN PWM out - 1x - 1x 8 COMe-bSC2 / Introduction 2.4 COM Express(R) Documentation This product manual serves as one of three principal references for a COM Express(R) design. It documents the specifications and features of COMe-bSC2. Additional references are are available from your Kontron Support or from PICMG(R): The COM Express(R) Specification defines the COM Express(R) module form factor, pin-out, and signals. This document is available from the PIGMG website by filling out the order form. The COM Express(R) Design Guide by PICMG serves as a general guide for baseboard design, with a focus on maximum flexibility to accommodate a wide range of COM Express(R) modules. Some of the information contained within this product manual applies only to certain product revisions (CE: xxx). If certain information applies to specific product revisions (CE: xxx) it will be stated. Please check the product revision of your module to see if this information is applicable. 2.5 COM Express(R) Benefits COM Express(R) modules are very compact, highly integrated computers. All Kontron COM Express(R) modules feature a standardized form factor and a standardized connector layout that carry a specified set of signals. Each COM is based on the COM Express(R) specification. This standardization allows designers to create a single-system baseboard that can accept present and future COM Express(R) modules. The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place connectors precisely where needed for the application on a baseboard designed to optimally fit a system's packaging. A single baseboard design can use a range of COM Express(R) modules with different size and pin-out. This flexibility can differentiate products at various price/performance points, or to design future proof systems that have a built-in upgrade path. The modularity of a COM Express(R) solution also ensures against obsolescence as computer technology evolves. A properly designed COM Express(R) baseboard can work with several successive generations of COM Express(R) modules. A COM Express(R) baseboard design has many advantages of a custom, computer-board design but delivers better obsolescence protection, greatly reduced engineering effort, and faster time to market. 9 COMe-bSC2 / Product Specification 3 3.1 Product Specification Modules & Accessories The COM Express(R) basic sized Computer-on-Module COMe-bSC2 (CHR2 / HudsonBay) follows pin-out Type 2 and is compatible to PICMG specification COM.0 Rev 2.0. The COMe-bSC2 based on latest Huron River platform is available in different variants to cover the demand of different performance, price and power: Commercial grade ECC modules (0C to 60C operating) Product Number Product Name Processor PCH Memory PEG TPM 38013-0000-21-4 COMe-bSC2 i7-2715QE ECC Intel(R) CoreTM i7-2715QE QM67 2x DDR3-ECC Graphics HD3000 YES YES USB 2.0 8x 38013-0000-22-2 COMe-bSC2 i7-2655LE ECC Intel(R) CoreTM i7-2655LE QM67 2x DDR3-ECC HD3000 YES YES 8x 38013-0000-15-2 COMe-bSC2 i7-2610UE ECC Intel(R) CoreTM i7-2610UE QM67 2x DDR3-ECC HD3000 YES YES 8x 38013-0000-25-2 COMe-bSC2 i5-2515E ECC Intel(R) CoreTM i5-2515E QM67 2x DDR3-ECC HD3000 YES YES 8x 38013-0000-21-2 COMe-bSC2 i3-2310E ECC Intel(R) CoreTM i3-2310E QM67 2x DDR3-ECC HD3000 YES YES 8x 38013-0000-13-2 COMe-bSC2 i3-2340UE ECC Intel(R) CoreTM i3-2340UE QM67 2x DDR3-ECC HD3000 YES YES 8x 38013-0000-16-1 COMe-bSC2 B810E HM65ECC Intel(R) Celeron(R) B810E HM65 2x DDR3-ECC HD YES YES CE 1.x.x: 6x CE 2.x.x: 8x 38013-0000-11-1 COMe-bSC2 847E HM65 ECC Intel(R) Celeron(R) 847E HM65 2x DDR3-ECC HD YES YES CE 1.x.x: 6x CE 2.x.x: 8x 38013-0000-14-0 COMe-bSC2 827E HM56 ECC Intel(R) Celeron(R) 827E HM65 2x DDR3-ECC HD YES YES CE 1.x.x: 6x CE 2.x.x: 8x 38013-0000-10-0 COMe-bSC2 807UE HM65 ECC Intel(R) Celeron(R) 807UE HM65 1x DDR3-ECC HD - YES CE 1.x.x: 6x CE 2.x.x: 8x USB 2.0 Commercial grade non-ECC modules (0C to 60C operating) Product Number Product Name Processor PCH Memory PEG TPM 38022-0000-16-1 COMe-bSC2 B810E Intel(R) Celeron(R) B810E HM65 2x DDR3 Graphics HD YES YES 8x 38022-0000-11-1 COMe-bSC2 847E Intel(R) Celeron(R) 847E HM65 2x DDR3 HD YES YES 8x 38022-0000-14-0 COMe-bSC2 827E Intel(R) Celeron(R) 827E HM65 2x DDR3 HD YES YES 8x 38022-0000-10-0 COMe-bSC2 807UE Intel(R) Celeron(R) 807UE HM65 1x DDR3 HD - YES 8x Extended temperature ECC modules (E1, -25C to 75C operating) Product Number Product Name Processor PCH Memory PEG TPM 38013-0000-22-2EXT COMe-bSC2 i7-2655LE ECC E1 Intel(R) CoreTM i7-2655LE QM67 2x DDR3-ECC Graphics HD3000 YES - USB 2.0 38013-0000-15-2EXT COMe-bSC2 i7-2610UE ECC E1 Intel(R) CoreTM i7-2610UE QM67 2x DDR3-ECC HD3000 YES - 8x 38013-0000-11-1EXT COMe-bSC2 847E ECC E1 Intel(R) Celeron(R) 847E HM65 2x DDR3-ECC HD YES - CE 1.x.x: 6x CE 2.x.x: 8x 38013-0000-14-0EXT COMe-bSC2 827E ECC E1 Intel(R) Celeron(R) 827E HM65 2x DDR3-ECC HD YES - CE 1.x.x: 6x CE 2.x.x: 8x 38013-0000-10-0EXT COMe-bSC2 807UE ECC E1 Intel(R) Celeron(R) 807UE HM65 1x DDR3-ECC HD - - CE 1.x.x: 6x CE 2.x.x: 8x USB 2.0 8x Industrial grade modules (XT, -40C to 85C operating) Product Number Product Name Processor PCH Memory PEG TPM 38018-0000-22-2 COMe-bSC2 i7-2655LE ECC XT Intel(R) CoreTM i7-2655LE QM67 2x DDR3-ECC HD3000 YES YES 8x 38018-0000-15-2 COMe-bSC2 i7-2610UE ECC XT Intel(R) CoreTM i7-2610UE QM67 2x DDR3-ECC HD3000 YES YES 8x 10 Graphics COMe-bSC2 / Product Specification Accessories Product Number Carrier Boards 38102-0000-00-1 COM Express(R) Reference Carrier Type 2 (8mm COMe connector) 38104-0000-00-0 COM Express(R) Eval Carrier Type 2 (Niles Canyon, 5mm COMe connector) 38104-0000-00-1 COM Express(R) Eval Carrier Type 2 (Topanga Canyon, 5mm COMe connector) Product Number ECC Memory for 38013-xxxx-xx-x 97016-1024-13-0 DDR3-1333 SODIMM 1GB ECC 97016-2048-13-0 DDR3-1333 SODIMM 2GB ECC 97016-4096-13-0 DDR3-1333 SODIMM 4GB ECC 97016-8192-13-0 DDR3-1333 SODIMM 8GB ECC 97016-1024-13-2 DDR3-1333 SODIMM 1GB ECC E2 97016-2048-13-2 DDR3-1333 SODIMM 2GB ECC E2 97016-4096-13-2 DDR3-1333 SODIMM 4GB ECC E2 97016-8192-13-2 DDR3-1333 SODIMM 8GB ECC E2 Product Number Non-ECC Memory for 38022-xxxx-xx-x 97015-2048-16-0 DDR3-1600 SODIMM 2GB 97015-4096-16-0 DDR3-1600 SODIMM 4GB 97015-8192-16-0 DDR3-1600 SODIMM 8GB 97015-2048-16-2 DDR3-1600 SODIMM 2GB E2 97015-4096-16-2 DDR3-1600 SODIMM 4GB E2 97015-8192-16-2 DDR3-1600 SODIMM 8GB E2 Product Number Cooling & Mounting 38013-0000-99-0 HSP COMe-bSC/IP thread (for CPUs up to 25W TDP) 38013-0000-99-1 HSP COMe-bSC/IP through (for CPUs up to 25W TDP) 38013-0000-99-2 HSP COMe-bSC/IP heatpipe thread (for CPUs up to 45W TDP ) 38013-0000-99-3 HSP COMe-bSC/IP heatpipe through (for CPUs up to 45W TDP) 38013-0000-99-0C05 HSK COMe-bSC/IP active setscrew thread 38013-0000-99-0C06 HSK COMe-bSC/IP passive setscrew thread 36099-0000-99-0 COMe Active Uni Cooler (for CPUs up to 20W TDP) 36099-0000-99-1 COMe Passive Uni Cooler (for CPUs up to 10W TDP) 38017-0000-00-0 COMe Mount KIT 8mm 1set 38017-0000-00-5 COMe Mount KIT 5mm 1set 38017-0100-00-5 COMe Mount KIT 5mm 100sets 38017-0100-00-0 COMe Mount Kit 8mm 100sets Product Number Adapter & Cables 9-5000-0352 ADA-LVDS-DVI 18bit (LVDS to DVI converter) 9-5000-0353 ADA-LVDS-DVI 24bit (LVDS to DVI converter) 96006-0000-00-7 ADA-Type2-DP3 (Adapter Card Type 2 module to 3x DisplayPort) 96006-0000-00-8 ADA-DP-LVDS (DP to LVDS adapter) 96082-0000-00-0 KAB-ADAPT-DP-DVI (DP to DVI adapter cable) 96083-0000-00-0 KAB-ADAPT-DP-VGA (DP to VGA adapter cable) 96084-0000-00-0 KAB-ADAPT-DP-HDMI (DP to HDMI adapter cable) 96079-0000-00-0 KAB-HSP 200mm (Cable adapter to connect FAN to module) 96079-0000-00-2 KAB-HSP 40mm (Cable adapter to connect FAN to module) 11 COMe-bSC2 / Product Specification 3.2 Functional Specification Processor The 32nm Intel(R) 2nd Gen CoreTM i7/i5/i3/Celeron(R) embedded (Sandy Bridge) CPU family with 31x24mm package size (FCBGA1023 socket) supports: Intel(R) Turbo Boost Technology 2.0 Intel(R) 64 Intel(R) Virtualization Technology (VT-x) Intel(R) Virtualization Technology for Directed I/O (VT-d) AES New Instructions (AES-NI) Intel(R) Anti-Theft Technology Intel(R) Hyper-Threading Technology Enhanced Intel SpeedStep(R) Technology Idle States (C-States) Intel(R) Smart Cache Thermal Monitoring Technologies Intel(R) Fast Memory Access Intel(R) Flex Memory Access Integrated Intel(R) HD Graphics with Dynamic Frequency Optional available (with customized BIOS): Intel(R) vPROTM Technology including: Intel(R) Active Management Technology (AMT) Intel(R) Trusted Execution Technology (TXT) The integrated Intel(R) HD3000 Graphics supports: GraphicsTechnology GT2 with 12 Execution Units Intel(R) Quick Sync Video Intel(R) InTruTM 3D Technology Intel(R) Wireless Display Intel(R) Flexible Display Interface (Intel(R) FDI) Intel(R) Clear Video HD Technology Dual Display The integrated Intel(R) HD Graphics supports: GraphicsTechnology GT1 with 6 Execution Units Dual Display 12 COMe-bSC2 / Product Specification Intel(R) - CoreTM Celeron(R) i7-2715QE i7-2655LE i7-2610UE # of Cores 4 2 2 2 2 2 2 2 1 # of Threads 8 4 4 4 4 4 2 2 1 1 Clock Speed 2100MHz 2200MHz 1500MHz 2500MHz 2100MHz 1300MHz 1600MHz 1100MHz 1400MHz 1000MHz Max Turbo Frequency 3000MHz 2900MHz 2400MHz 3100MHz - - - - - - 45W 25W 17W 35W 35W 17W 35W 17W 17W 10W C-States C0-C7 C0-C7 C0-C7 C0-C7 C0-C7 C0-C7 C0-C3 C0-C3 C0-C3 C0-C3 Smart Cache 6MB 4MB 4MB 3MB 3MB 3MB 2MB 2MB 1.5MB 1MB Bus/Core Ratio 12-21 8-22 8-15 8-25 8-21 8-13 8-16 8-11 8-14 8-10 TDP i5-2515E i3-2310E i3-2340UE B810E 847E 827E 807UE 1 Min Memory Type DDR3-1066 DDR3-1066 DDR3-1066 DDR3-1066 DDR3-1066 DDR3-1066 DDR3-1066 DDR3-1066 DDR3-1066 DDR3-1066 Max Memory Type DDR3-1600 DDR3-1333 DDR3-1333 DDR3-1333 DDR3-1333 DDR3-1333 DDR3-1333 DDR3-1333 DDR3-1333 DDR3-1333 Max Memory Size # of Memory Channels Graphics Model 16GB 16GB 16GB 16GB 16GB 16GB 16GB 16GB 16GB 2 2 2 2 2 2 2 2 2 4GB 1 HD3000 HD3000 HD3000 HD3000 HD3000 HD3000 HD HD HD HD GFX Base Frequency 650MHz 650MHz 350MHz 650MHz 650MHz 350MHz 650MHz 350MHz 350MHz 350MHz GFX Max Dynamic Frequ. 1200MHz 1000MHz 850MHz 1100MHz 1050MHz 800MHz 1000MHz 800MHz 800MHz 800MHz Quick Sync Video Yes Yes Yes Yes Yes Yes - - - - InTruTM 3D Yes Yes Yes Yes Yes Yes - - - - Wireless Display Yes Yes Yes Yes Yes Yes - - - - Clear Video HD Yes Yes Yes Yes Yes Yes - - - - PCI Express Graphics Yes Yes Yes Yes Yes Yes Yes Yes Yes - vPROTM (optional) Yes Yes Yes Yes - - - - - - TXT (optional) Yes Yes Yes Yes - - - - - - AES-NI Yes Yes Yes Yes - - - - - - VT-x Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes VT-d Yes Yes Yes Yes - - - - - - Anti-Theft Yes Yes Yes Yes Yes Yes - - - - The Bus/Core Ratio shows the possible CPU Performance settings (CPU Ratio) from the max Efficiency Ratio (LFM = Lowest Frequency Mode) to the maximum non-turbo Ratio (HFM = Highest Frequency Mode). If enabled in Setup, CPU Clock is fixed to Ratio*100MHz. This feature is not supported with updated EFI Core available with BIOS CHR2R111 or newer. Memory 2x DDR3 SO-DIMM Sockets Memory Type DDR3-1066/1333 ECC/nonECC Maximum Size Technology Chipset The Intel(R) 6-Series Platform Controller Hub Cougar Point supports: PCI Express Revision 2.0 PCI Express Configurations x1, x2, x4 Intel(R) Virtualization Technology for Directed I/O (VT-d) Intel(R) Trusted Execution Technology (TXT) Intel(R) vPro Technology Intel(R) Active Management Technology 7.0 Intel(R) Anti-Theft Technology Intel(R) Rapid Storage Technology 13 16GB Dual Channel COMe-bSC2 / Product Specification PCH comparison Feature QM67 HM65 TDP 3.9W 3.9W VT-d YES NO TXT YES NO vPRO YES NO AMT YES NO Rapid Storage YES NO SATA RAID YES NO The Intel(R) vPro Technology including Trusted Execution Technology (TXT) and Active Management Technology (AMT) is not supported by default on COMe-bSC2. Please contact your local sales or support for custom BIOS variants supporting vPro. A test version is available on EMD Customer Section. Graphics Core The integrated Intel(R) GMA HD/HD3000 (Gen6) supports: Graphics Core Render Clock Execution Units / Pixel Pipelines Max Graphics Memory GFX Memory Bandwidth (GB/s) GT1 /GT2, Base clock: 350/650 MHz GT Turbo: up to 1200 MHz GT2: 12EU / GT1: 6EU 1720MB 21.3 GFX Memory Technology DVMT 5.0 API (DirectX/OpenGL) 10.1 / 3.1 Shader Model Hardware accelerated Video Independent/Simultaneous Displays Display Port HDCP support 4.0 MPEG2, VC-1, AVC, Blu-ray (+3D) 2 DP 1.1a / eDP HDCP 1.4 Monitor output CRT max Resolution TV out: 2048x1536 - LVDS LVDS Bits/Pixel 1x18 / 2x18 (from PCH) LVDS Bits/Pixel with dithering 1x24 / 2x24 (from PCH) LVDS max Resolution: 1920x1200 PWM Backlight Control: YES Supported Panel Data: JILI2/JILI3/EDID/DID Display Interfaces Discrete Graphics Digital Display Interface DDI1 1x PEG 2.0 (not on Cel. 807UE) DP++/SDVOB Digital Display Interface DDI2 DP++ Digital Display Interface DDI3 DP++/eDP Maximum Resolution on DDI 2560x1600 14 COMe-bSC2 / Product Specification PEG Configuration The x16 PCI Express Graphics Port (PEG) is compatible to standard PCI Express devices like Ethernet or RAID controllers. The COMe-bSC2 supports following PEG Port configuration when used as PCI Express Interface: 1x16 1x8 1x4 1x2 1x1 The internal PCI Express controller can be re-configured to support up to 3 PCIe ports. The following port configurations are available via hardware strap options (customized article): 2x8 (lanes #0-7 + #8-15) 1x8 + 2x4 (lanes #0-7 + #8-11 + #12-15) Storage - onboard SSD - SD Card support JMB368 PCIe2PATA IDE Interface Serial-ATA 2x SATA 6Gb/s, 2x SATA 3Gb/s SATA AHCI NCQ, HotPlug, Staggered Spinup, eSATA, PortMultiplier SATA RAID 0, 1, 5, 10, MATRIX (QM67 only) If SATA AHCI or RAID is disabled in setup, the SATA Interface only supports 3Gb/s transfer rate and Staggered Spin-Up Connectivity USB 2.0 up to 8x USB 2.0 USB 3.0 - USB Client PCI PCI External Masters PCI Express Max PCI Express PCI Express x2/x4 configuration Ethernet Ethernet controller 15 PEX8112 PCIe2PCI 4 5x PCIe x1 Gen2 6x PCIe without PCIe2PATA Bridge YES (Softstrap option) 10/100/1000 Mbit Intel(R) 82579LM (Lewisville) COMe-bSC2 / Product Specification PCI Express Configuration The COMe-bSC2 only supports x1 PCIexpress lane configuration by default. Following x2/x4 configurations are possible via Management Engine Softstrap Options: PCIe Port #0 Configuration0 Port #1 x1 Port #2 x1 Port #5* Port #6* x1 Port #3 x1 Port #4 x1 - - - x1 x1 x1 x1 x1 x1 x1 x1 x1 Configuration1 x2 Configuration2 x2 x2 Configuration3 x2 x2 x2 Configuration4 x2 x2 x2 x1 Configuration5 x4 Configuration6 x4 x1 x2 Configuration7 x4 x2 Configuration8 x4 Port #7* x1 x1 x2 x1 x1 x1 x1 x1 x2 x4 - *PCIe Ports #5 to #7 are only available without PCIe2PATA Bridge, PCIe2PCI Bridge and without Ethernet Controller - Configuration0 (default) and Configuration5 (modified FlashDescriptor) are provided in BIOS download package available on EMD Customer Section Ethernet The Intel(R) 82579LM (Lewisville) ethernet supports: Jumbo Frames MACsec IEEE 802.1 AE Time Sync Protocol Indicator WOL (Wake On LAN) PXE (Preboot eXecution Environment) Misc Interfaces and Features Audio HD Audio + DisplayPort dual stream Analog Devices ADT7490 Onboard Hardware Monitor Trusted Platform Module Infineon SLB9635TT / Atmel AT97SC3204 - Miscellaneous Kontron Features External I2C Bus Fast I2C, MultiMaster capable YES M.A.R.S. support Embedded API PICMG EAPI / JIDA32 / KEAPI Custom BIOS Settings / Flash Backup Watchdog support Additional features All solid capacitors (POSCAP). No tantalum capacitors used. Optimized RTC Battery monitoring to secure highest longevity Real fast I2C with transfer rates up to 40kB/s. Discharge logic on all onboard voltages for highest reliability 16 YES Dual Staged COMe-bSC2 / Product Specification Power Features Singly Supply Support YES Supply Voltage 8.5V - 18V (20V@nonECC) ACPI ACPI 4.0 S-States S0, S3, S4, S5 S5 Eco Mode YES Misc Power Management DPST 6.0 Power Consumption and Performance Full Load Power Consumption 13.5 - 73W Kontron Performance Index 4996 - 22225 Kontron Performance/Watt 367 - 589 *Measured Values. Please note the maximum Power Consumption with activated Turbo Mode in chapter Turbo 2.0 Detailed Power Consumption measurements in all states and benchmarks for CPU, Graphics and Memory performance are available in Application Note KEMAP054 at EMD Customer Section. Supported Operating Systems The COMe-bSC2 supports: Microsoft Windows XP x86/x64 Microsoft Windows XP embedded Microsoft Windows Vista x86/x64 Microsoft Windows 7 x86/x64 Microsoft Windows Embedded Standard 7 (WES7) x86/x64 Microsoft Windows 8 x86/x64 Linux VxWorks 6.8, 6.9 32bit, 6.9 64bit 17 COMe-bSC2 / Product Specification 3.3 18 Block Diagram COMe-bSC2 / Product Specification 3.4 Variant Matrix The COMe-bSC2 is available in several configurations. The following table shows major differences of available standard modules: Product Name COMe-bSC2 ECC COMe-bSC2 ECC COMe-bSC2 ECC E1 COMe-bSC2 ECC E1 COMe-bSC2 ECC XT COMe-bSC2 Part.No. 38013-xxxx-xx-x 38013-xxxx-xx-x 38013-xxxx-xx-xEXT 38013-xxxx-xx-xEXT 38018-xxxx-xx-x 38022-xxxx-xx-x Temperature Grade commercial commercial extended extended industrial commercial PCB/Project Code CHR2 CHR2 CHR2 CHR2 Hudson Bay CCR2 BIOS/UEFI CHR2Rxxx CHR2Rxxx CHR2Rxxx CHR2Rxxx CHR2Rxxx CHR2Rxxx HW Revision CE 1.x.x CE 2.x.x CE 1.x.x CE 2.x.x All All DDR3 Memory ECC ECC ECC ECC ECC non-ECC USB #6/#7 Support with QM67 PCH only Yes with QM67 PCH only Yes Yes Yes eDP Support on DDI3 No Yes No Yes No Yes TPM Infineon FW 1.02 Infineon FW 3.17 No No Atmel AT97SC3204 Infineon FW 3.17 onboard HWM ADT7490 ADT7490 ADT7490 ADT7490 ADT7490 NCT7802Y 19 COMe-bSC2 / Product Specification 3.5 Electrical Specification 3.5.1 Supply Voltage Following supply voltage is specified at the COM Express(R) connector: 8.5V - 18V (20V@nonECC) VCC: 5V DC +/- 5% Standby: 2.5V - 3.3V RTC: - 5V Standby voltage is not mandatory for operation. - Extended Temperature (E1) variants are validated for 12V supply only 3.5.2 Power Supply Rise Time The input voltages shall rise from 10% of nominal to within the regulation ranges within 0.1ms to 20ms. There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point following the ATX specification 3.5.3 Supply Voltage Ripple Maximum 100 mV peak to peak 0 - 20 MHz 3.5.4 Power Consumption The maximum Power Consumption of the different COMe-bSC2 variants is 13.5 - 73W (100% CPU load on all cores; 90C CPU temperature). Further information with detailed measurements are available in Application Note KEMAP054 available on EMD Customer Section. Information there is available after registration. 20 COMe-bSC2 / Product Specification 3.5.5 ATX Mode By connecting an ATX power supply with VCC and 5VSB, PWR_OK is set to low level and VCC is off. Press the Power Button to enable the ATX PSU setting PWR_OK to high level and powering on VCC. The ATX PSU is controlled by the PS_ON# signal which is generated by SUS_S3# via inversion. VCC can be 8.5V - 18V (20V@nonECC) in ATX Mode. On Computer-onModules supporting a wide range input down to 4.75V the input voltage shall always be higher than 5V Standby (VCC > 5VSB). State PWRBTN# PWR_OK V5_StdBy PS_ON# VCC G3 x x 0V x 0V S5 high low 5V high 0V S5 S0 PWRBTN Event low high 5V high low 0 V VCC S0 high high 5V low VCC 3.5.6 Single Supply Mode In single supply mode (or automatic power on after power loss) without 5V Standby the module will start automatically when VCC power is connected and Power Good input is open or at high level (internal PU to 3.3V). PS_ON# is not used in this mode and VCC can be 8.5V - 18V (20V@nonECC). To power on the module from S5 state press the power button or reconnect VCC. Suspend/Standby States are not supported in Single Supply Mode. State PWRBTN# PWR_OK V5_StdBy VCC G3 x x x 0 G3 S0 high open / high x connecting VCC S5 high open / high x VCC S5 S0 PWRBTN Event open / high x reconnecting VCC Signals marked with "x" are not important for the specific power state. There is no difference if connected or open. All ground pins have to be tied to the ground plane of the carrier board. 21 COMe-bSC2 / Product Specification 3.6 Power Control Power Supply The COMe-bSC2 supports a power input from 8.5V - 18V (20V@nonECC). The supply voltage is applied through the VCC pins (VCC) of the module connector. Power Button (PWRBTN#) The power button (Pin B12) is available through the module connector described in the pinout list. To start the module via Power Button the PWRBTN# signal must be at least 50ms (50ms t < 4s, typical 400ms) at low level (Power Button Event). Pressing the power button for at least 4seconds will turn off power to the module (Power Button Override). Power Good (PWR_OK) The COMe-bSC2 provides an external input for a power-good signal (Pin B24). The implementation of this subsystem complies with the COM Express(R) Specification. PWR_OK is internally pulled up to 3.3V and must be high level to power on the module. Reset Button (SYS_RESET#) The reset button (Pin B49) is available through the module connector described in the pinout list. The module will stay in reset as long as SYS_RESET# is grounded. If available, the BIOS setting for "Reset Behavior" must be set to "Power Cycle". Modules with Intel(R) Chipset and active Management Engine does not allow to hold the module in Reset out of S0 for a long time. At about 10s holding the reset button the ME will reboot the module automatically SM-Bus Alert (SMB_ALERT#) With an external battery manager present and SMB_ALERT# (Pin B15) connected the module always powers on even if BIOS switch "After Power Fail" is set to "Stay Off". 22 COMe-bSC2 / Product Specification 3.7 Environmental Specification 3.7.1 Temperature Specification General Kontron Specification Operating Non-operating 0C to +60C -30C to +85C Extended Temperature (E1) -25C to +75C -30C to +85C Industrial grade by Screening (XT) -40C to +85C -40C to +85C Industrial grade by Design (E2) -40C to +85C -40C to +85C Commercial grade Please see chapter Product Specification for available variants for extended or industrial temperate grade With Kontron heatspreader plate assembly The operating temperature defines two requirements: the maximum ambient temperature with ambient being the air surrounding the module. the maximum measurable temperature on any spot on the heatspreader's surface Without Kontron heatspreader plate assembly The operating temperature is the maximum measurable temperature on any spot on the module's surface. 3.7.2 Humidity 93% relative Humidity at 40C, non-condensing (according to IEC 60068-2-78) 23 COMe-bSC2 / Product Specification 3.8 Standards and Certifications RoHS The COMe-bSC2 is compliant to the directive 2002/95/EC on the restriction of the use of certain hazardous substances (RoHS) in electrical and electronic equipment. CE marking The COMe-bSC2 is CE marked according to Low Voltage Directive 2006/95/EC - Test standard EN60950 Component Recognition UL 60950-1 The COM Express(R) basic form factor Computer-on-Modules are Recognized by Underwriters Laboratories Inc. Representative samples of this component have been evaluated by UL and meet applicable UL requirements. UL Listings: NWGQ2.E304278 NWGQ8.E304278 WEEE Directive WEEE Directive 2002/96/EC is not applicable for Computer-on-Modules. Conformal Coating Conformal Coating is available for Kontron Computer-on-Modules and for validated SO-DIMM memory modules. Please contact your local sales or support for further details. 24 COMe-bSC2 / Product Specification Shock & Vibration The COM Express(R) basic form factor Computer-on-Modules successfully passed shock and vibration tests according to IEC/EN 60068-2-6 (Non operating Vibration, sinusoidal, 10Hz-4000Hz, +/-0.15mm, 2g) IEC/EN 60068-2-27 (Non operating Shock Test, half-sinusoidal, 11ms, 15g) EMC Validated in Kontron reference housing for EMC the COMe-bSC2 follows the requirements for electromagnetic compatibility standards EN55022 25 COMe-bSC2 / Product Specification 3.9 MTBF The following MTBF (Mean Time Before Failure) values were calculated using a combination of manufacturer's test data, if the data was available, and the Telcordia (Bellcore) issue 2 calculation for the remaining parts. The calculation methode used is "Telcordia Method 1 Case 3" in a ground benign, controlled environment (GB,GC). This particular method takes into account varying temperature and stress data and the system is assumed to have not been burned in. Other environmental stresses (extreme altitude, vibration, salt water exposure, etc) lower MTBF values. System MTBF (hours): 222498 @ 40C Fans usually shipped with Kontron Europe GmbH products have 50,000-hour typical operating life. The above estimates assume no fan, but a passive heat sinking arrangement Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above figures and need to be considered for separately. Battery life depends on both temperature and operating conditions. When the Kontron unit has external power; the only battery drain is from leakage paths. 26 COMe-bSC2 / Product Specification 3.10 Mechanical Specification Dimension 95.0 mm x 125.0 mm Hight approx. 12mm (0.4") CAD drawings are available at EMD CustomerSection 3.11 27 Module Dimensions COMe-bSC2 / Product Specification 3.12 Thermal Management A heatspreader plate assembly is available from Kontron Europe GmbH for the COMe-bSC2. The heatspreader plate on top of this assembly is NOT a heat sink. It works as a COM Express(R)-standard thermal interface to use with a heat sink or other cooling device. External cooling must be provided to maintain the heatspreader plate at proper operating temperatures. Under worstcase conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature of 60 C or less. The aluminum slugs and thermal pads on the underside of the heatspreader assembly implement thermal interfaces between the heatspreader plate and the major heat-generating components on the COMe-bSC2. About 80 percent of the power dissipated within the module is conducted to the heatspreader plate and can be removed by the cooling solution. You can use many thermal-management solutions with the heatspreader plates, including active and passive approaches. The optimum cooling solution varies, depending on the COM Express(R) application and environmental conditions. Please see the COM Express(R) Design Guide for further information on thermal management. 3.13 Heatspreader Documentation and CAD drawings of COMe-bSC2 heatspreader and cooling solutions is provided at http://emdcustomersection.kontron.com. 28 COMe-bSC2 / Product Specification 3.14 Onboard Fan Connector Location of the FAN Connector Specification of the FAN Connector: Part number (Molex) J8: 53261-0390 Mates with: 51021-0300 Crimp terminals: 50079-8100 Pin assignment Pin1: Tacho, Pin2: VCC, Pin3: GND Electrical characteristic Module Input Voltage FAN Output Voltage Max. FAN Output Current 8.5 - 13V 13 - 18V 8.5 - 13V 13V 350mA 200mA To connect a standard FAN with 3pin connector to the module please use adaptor cable KAB-HSP 200mm (96079-0000-00-0) or KAB-HSP 40mm (96079-0000-00-2) 29 COMe-bSC2 / Features and Interfaces 4 4.1 Features and Interfaces S5 Eco Mode Kontron's new high-efficient power-off state S5 Eco enables lowest power-consumption in soft-off state - less than 1 mA compared to the regular S5 state this means a reduction by at least factor 200! In the "normal" S5 mode the board is supplied by 5V_Stb and needs usually up to 300mA just to stay off. This mode allows to be switched on by power button, RTC event and WakeOnLan, even when it is not necessary. The new S5 Eco mode reduces the current tremendously. The S5 Eco Mode can be enabled in BIOS Setup, when the BIOS supports this feature. Following prerequesites and consequences occur when S5 Eco Mode is enabled The power button must be pressed at least for 200ms to switch on. Wake via Powerbutton only. "Power On After Power Fail"/"State after G3": only "stay off" is possible 30 COMe-bSC2 / Features and Interfaces 4.2 Rapid Shutdown Overview For the COMe-bSC2 ECC XT (38018-xxxx-xx-x), Kontron has implemented a rapid shutdown function. It works as follows: 1) An active-high shutdown signal is asserted by the COM Express Eval Type 2 carrier board via pin C67 of the COM Express connector. The characteristics of the shutdown signal are as follows: Amplitude 5.0V +/- 5% Source impedance < = 50 ohms Rise time 1uS Duration >= 20uS The assertion of this signal causes all COMe-bSC2 ECC XT power regulators to be disabled and the internal power supply rails to be discharged by crowbar circuits. The shutdown circuitry provides internal energy storage that maintains crowbar activation for at least 2mS following the de-assertion of the shutdown signal. The circuit also incorporates a weak input pulldown resistor so that the COMe-bSC2XT module will operate normally in systems where the rapid shutdown functionality is not used and pin C67 of the COM Express is left unconnected. 2) Simultaneously with the leading edge of shutdown, the 12V (main) input power to the COMe-bSC2 ECC XT module is removed and these input power pins are externally clamped to ground though a crowbar circuit located on the COM Express Type 2 carrier board. This external clamping circuit must maintain a maximum resistance of approximately 1 ohm and be activated for a minimum of 2mS. 3) Simultaneously with the leading edge of shutdown, the 5V (standby) input power to the COMe-bSC2XT module is removed, if present. External clamping on these pins is not necessary. Crowbar implementation details As a tool for designing the internal crowbars, Kontron developed tallied the total capacitance present on each of the COMe-bSC2 ECC XT internal power rails, and calculates the required discharge resistance in order to achieve the desired voltage decay time constant. The principal design criteria are that each supply rail must decay to 37% of initial value (equivalent to 1RC) within 300uS, and to below 1.5V within 2mS. Analysis of the results shows that the 25 or so power rails in the COMe-bSC2 ECC XT design fall into four general classes. Each class of power rails has a corresponding discharge strategy. 1) Power Input Rails: The main 12V power input rail incorporates about 300uF of distributed capacitance. This rail must be discharged by an external crowbar located on the carrier board, which must provide a shunt resistance of approximately 1 ohm. The peak power dissipation in this crowbar resistance will be relatively high (on the order of 150W when the crowbar is activated), but will diminish very rapidly as the input capacitors discharge. 2) Low Voltage, High Power Rails: Each of these 5 "major" internal supply rails has an output voltage in the 1.0 V to 1.5V range, and each rail has between 1500uF and 3300uF of output capacitance. The required discharge resistances for these rails are in the range of 0.1 to 0.2 ohm, and peak discharge currents are in the range of 8 to 16A. The discharge circuit for each rail is implemented with a "pulse withstanding" thick-film SMT resistor in series with a lowRDSon MOSFET. The resistor peak powers are in the 8W to 20W range; depending on PCB layout considerations either a single resistor or multiple smaller resistors may be used to achieve sufficient pulse handling capability. Because of the relatively high currents in the discharge paths, these crowbar circuits require wide copper traces and careful component placement adjacent to the output components of the corresponding power supplies. 31 COMe-bSC2 / Features and Interfaces 3) Low Voltage, Low Power Rails: These rails have voltages of 1.8V or less and capacitances under 1000uF, with peak discharge currents <3A. The discharge circuits for these rails are also implemented with resistor(s) and a low-RDSon MOSFET. In some cases, the peak pulse power dissipation in the resistor(s) is low enough that specialty "pulse withstanding" resistors are not required. 4) Medium Voltage Rails: These 3.3V and 5V rails typically have relatively small output capacitances and peak discharge currents <1A. The discharge circuits for these rails are typically implemented with conventional resistor(s) and a lowRDSon MOSFET. Shutdown input circuit details The shutdown input pin to the COMe-bSC2 ECC XT module is coupled through a series Schottky diode and a small series resistor to the gates of all crowbar MOSFETs, connected in parallel. All crowbar MOSFETs are N-channel "logic level" parts that have are specified for operation at Vgs = 4.5V. Three additional components are connected in parallel between the MOSFET gates and ground: A capacitor that provides energy storage to keep the MOSFETs conducting for several mS after the shutdown signal is de-asserted. A high-value resistor that provides a discharge path for the capacitor as well as a pulldown resistance (to insure that the shutdown circuits remain inactive if the shutdown pin is left floating). A 6.2V zener diode that protects the MOSFET gates from damage due to input ESD or input overdrive. In order to insure that the crowbars do not "fight" active switching regulators while the input capacitors are being discharged, the shutdown circuit rapidly crowbars the 5V rail, with a time constant <10uS. The 5V rail powers most of the remaining switching regulators, and as its voltage falls below about 4V those regulators enter under-voltage lockout mode and cease to operate. Additionally, by using the UVLO mechanism in the design of the COMe-bSC2XT, Kontron minimizes the risk of inadvertently affecting the standard power sequencing logic for such modules. Two of the switching regulators do not require the 5V supply for operation, and in those two cases it will be necessary to clamp the enable inputs to ground when shutdown begins. 32 COMe-bSC2 / Features and Interfaces 4.3 LPC The Low Pin Count (LPC) Interface signals are connected to the LPC Bus bridge located in the CPU or chipset. The LPC low speed interface can be used for peripheral circuits such as an external Super I/O Controller, which typically combines legacy-device support into a single IC. The implementation of this subsystem complies with the COM Express(R) Specification. Implementation information is provided in the COM Express(R) Design Guide maintained by PICMG. Please refer to the official PICMG documentation for additional information. The LPC bus does not support DMA (Direct Memory Access) and a clock buffer is required when more than one device is used on LPC. This leads to limitations for ISA bus and SIO (standard I/Os like Floppy or LPT interfaces) implementations. All Kontron COM Express(R) Computer-on-Modules imply BIOS support for following external baseboard LPC Super I/O controller features for the Winbond/Nuvoton 5V 83627HF/G and 3.3V 83627DHG-P: 83627HF/G Phoenix BIOS AMI CORE8 AMI Aptio PS/2 YES YES YES COM1/COM2 YES YES YES LPT YES YES YES HWM YES YES NO Floppy NO NO NO GPIO NO NO NO 83627DHG-P Phoenix BIOS AMI CORE8 AMI Aptio PS/2 YES YES YES COM1/COM2 YES YES YES LPT YES YES YES HWM NO NO NO Floppy NO NO NO GPIO NO NO NO Features marked as not supported do not exclude OS support (e.g. HWM can be accessed via SMB). For any other LPC Super I/O additional BIOS implementations are necessary. Please contact your local sales or support for further details. 33 COMe-bSC2 / Features and Interfaces 4.4 Serial Peripheral Interface (SPI) The Serial Peripheral Interface Bus or SPI bus is a synchronous serial data link standard named by Motorola that operates in full duplex mode. Devices communicate in master/slave mode where the master device initiates the data frame. Multiple slave devices are allowed with individual slave select (chip select) lines. Sometimes SPI is called a "four wire" serial bus, contrasting with three, two, and one wire serial buses. The SPI interface can only be used with a SPI flash device to boot from external BIOS on the baseboard. 4.5 SPI boot The COMe-bSC2 supports boot from an external SPI Flash. It can be configured by pin A34 (BIOS_DIS#0) and pin B88 (BIOS_DIS1#) in following configuration: BIOS_DIS0# BIOS_DIS1# Function open open Boot on-module BIOS GND open Boot baseboard LPC FWH open GND Baseboard SPI = Boot Device 1, on-module SPI = Boot Device 2 GND GND Baseboard SPI = Boot Device 2, on-module SPI = Boot Device 1 By default only SPI Boot Device 1 is used in configuration 3 & 4. Both SPI Boot Devices are used by splitting the BIOS with modified descriptor table in customized versions only Using an external SPI flash To programm an external SPI flash follow these steps: Connect a SPI flash with correct size (similar to BIOS ROM file size) to the module SPI interface Open pin A34 and B88 to boot from the module BIOS Boot the module to DOS with access to the BIOS image and Firmware Update Utility provided on EMD Customer Section Connect pin B88 (BIOS_DIS1#) to ground to enable the external SPI flash Execute Flash.bat to flash the complete BIOS image to the external SPI flash reboot Your module will now boot from the external SPI flash when BIOS_DIS1# is grounded. 34 COMe-bSC2 / Features and Interfaces 4.6 M.A.R.S. The Smart Battery implementation for Kontron Computer-on-Modules called Mobile Application for Rechargeable Systems is a BIOS extension for external Smart Battery Manager or Charger. It includes support for SMBus charger/selector (e.g. Linear Technology LTC1760 Dual Smart Battery System Manager) and provides ACPI compatibility to report battery information to the Operating System. Reserved SM-Bus addresses for Smart Battery Solutions on the carrier: 8-bit Address 7-bit Address Device 12h 0x09 SMART_CHARGER 14h 0x0A SMART_SELECTOR 16h 0x0B SMART_BATTERY 35 COMe-bSC2 / Features and Interfaces 4.7 Fast I2C The COMe-bSC2 supports a CPLD implemented LPC to I2C bridge using the WISHBONE I2C Master Core provided from opencores.org. The I2C Interface supports transfer rates up to 40kB/s and can be configured in Setup Specification for external I2C: Speed up to 400kHz Compatible to Philips I2C bus standard Multi-Master capable Clock stretching support and wait state generation Interrupt or bit-polling driven byte-by-byte data-transfers Arbitration lost interrupt with automatic transfer cancellation Start/Stop signal generation/detection Bus busy detection 7bit and 10bit addressing 36 COMe-bSC2 / Features and Interfaces 4.8 EAPI, JIDA & PLD Driver K-Station 2 including the Kontron PLD / Board Driver for new generation modules is a replacement for former JIDA16/JIDA32 BIOS implementations. It consists of hardware drivers providing access to features like Watchdog, I2C Bus or GPIO implemented in the onboard Programmable Logic Device (CPLD). The Board Driver supports the official PICMG embedded API (EAPI) and for backwards compatibility the former used Kontron JIDA32 API. The driver and API supports 32bit and 64bit operating systems. Please refer to EMD Customer Section for detailed documentation and Board Driver downloads. Usage of Kontron Board Driver The Kontron Board Driver featureset is similiar to JIDA32 except: CPU Performance setting (manual Throttling) I2C Backlight Control only, no PWM support 37 COMe-bSC2 / Features and Interfaces 4.9 K-Station 2 Based on the JIDA32 interface users can implement advanced board functionality in their application. As an example utility Kontron provides K-Station 2 for 32 and 64bit Windows XP, Vista or 7. K-Station 2 is a summary of command line utilities (Shell Tools) for easy access to JIDA32 interface provide by the PLD Board Driver. Second part of K-Station is a JAVA based example GUI which gives a view an all available features using the Shell Tools. Following K-Station 2 Shell Tools (K-Tools) are available: KSystemSummary.exe (System Information) KGenInfo.exe (Module Information) KEthernet.exe (LAN Information) KCPUPerf.exe (CPU control) KHWMon.exe (Hardware Monitoring) KI2CBus.exe (I2C and SMBus access) KIOPort.exe (GPIO control) KStorage.exe (JIDA EEPROM access to user bytes) KVGATool.exe (LVDS Backlight control) KWDog.exe (Watchdog control) K-Station 2 is available on EMD Customer Section. The Installer allows following installation methods: Light Target Installation for JIDA32 and EAPI driver only Medium Target Installation for JIDA32 and EAPI with K-Tools Full Target Installation for JIDA32 and EAPI with K-Tools and K-Station 2 GUI Host Installation with Sources and Documentation For silent installation use command msiexec /quiet /i K-Station_2xxx_xxx.msi 38 COMe-bSC2 / Features and Interfaces 4.10 KeAPI The Kontron embedded API (KeAPI) is an extension of the PICMG EAPI mainly with additional remote functionality. It consists of hardware drivers providing access to features like Watchdog, I2C Bus or GPIO and a QT based user interface KEAPI GUI. KeAPI is part of standard BSPs for modules based on AMI APTIO (UEFI). Please refer to EMD Customer Section for detailed documentation and downloads. Usage of KeAPI 39 COMe-bSC2 / Features and Interfaces 4.11 GPIO - General Purpose Input and Output The COMe-bSC2 offers 4 General Purpose Input (GPI) pins and 4 General Purpose Output (GPO) pins. On a 3.3V level digital in- and outputs are available. Signal Pin Description GPI0 A54 General Purpose Input 0 GPI1 A63 General Purpose Input 1 GPI2 A67 General Purpose Input 2 GPI3 A85 General Purpose Input 3 GPO0 A93 General Purpose Output 0 GPO1 B54 General Purpose Output 1 GPO2 B57 General Purpose Output 2 GPO3 B63 General Purpose Output 3 Configuration The GPI and GPO pins can be configured via JIDA32/K-Station. Please refer to the JIDA32/K-Station manual in the driver download packet on our customer section. 40 COMe-bSC2 / Features and Interfaces 4.12 Dual Staged Watchdog Timer Basics A watchdog timer (or computer operating properly (COP) timer) is a computer hardware or software timer that triggers a system reset or other corrective action if the main program, due to some fault condition, such as a hang, neglects to regularly service the watchdog (writing a "service pulse" to it, also referred to as "kicking the dog", "petting the dog", "feeding the watchdog" or "triggering the watchdog"). The intention is to bring the system back from the nonresponsive state into normal operation. The COMe-bSC2 offers a watchdog which works with two stages that can be programmed independently and used one by one. Time-out events Reset A reset will restart the module and starts POST and operating system new. NMI A non-maskable interrupt (NMI) is a computer processor interrupt that cannot be ignored by standard interrupt masking techniques in the system. It is typically used to signal attention for non-recoverable hardware errors. SCI A system control interrupt (SCI) is a OS-visible interrupt to be handled by the OS using AML code Delay Might be necessary when an operating system must be started and the time for the first trigger pulse must extended. (Only available in the first stage) WDT Signal only This setting triggers the WDT Pin on baseboard connector (COM Express(R) Pin B27) only Cascade: Does nothing, but enables the 2nd stage after the entered time-out. WDT Signal B27 on COM Express(R) Connector offers a signal that can be asserted when a watchdog timer has not been triggered within time. It can be configured to any of the 2 stages. Deassertion of the signal is automatically done after reset. If deassertion during runtime is necessary please ask your Kontron technical support for further help. 41 COMe-bSC2 / Features and Interfaces 4.13 Speedstep Technology The Intel(R) processors offers the Intel(R) Enhanced SpeedStepTM technology that automatically switches between maximum performance mode and battery-optimized mode, depending on the needs of the application being run. It let you customize high performance computing on your applications. When powered by a battery or running in idle mode, the processor drops to lower frequencies (by changing the CPU ratios) and voltage, conserving battery life while maintaining a high level of performance. The frequency is set back automatically to the high frequency, allowing you to customize performance. In order to use the Intel(R) Enhanced SpeedStepTM technology the operating system must support SpeedStepTM technology. By disabling the SpeedStep feature in the BIOS, manual control/modification of CPU performance is possible. Setup the CPU Performance State in the BIOS Setup or use 3rd party software to control CPU Performance States. 42 COMe-bSC2 / Features and Interfaces 4.14 C-States New generation platforms include power saving features like SuperLFM, EIST (P-States) or C-States in O/S idle mode. Activated C-States are able to dramatically decrease power consumption in idle mode by reducing the Core Voltage or switching of parts of the CPU Core, the Core Clocks or the CPU Cache. Following C-States are defined: C-State Description Function C0 Operating CPU fully turned on C1 Halt State Stops CPU main internal clocks via software C1E Enhanced Halt Similar to C1, additionally reduces CPU voltage C2 Stop Grant Stops CPU internal and external clocks via hardware C2E Extended Stop Grant Similar to C2, additionally reduces CPU voltage C3 Deep Sleep Stops all CPU internal and external clocks C3E Extended Stop Grant Similar to C3, additionally reduces CPU voltage C4 Deeper Sleep Reduces CPU voltage C4E Enhanced Deeper Sleep Reduces CPU voltage even more and turns off the memory cache C6 Deep Power Down Reduces the CPU internal voltage to any value, including 0V C7 Deep Power Down Similar to C6, additionally LLC (LastLevelCache) is switched off C-States are usually enabled by default for low power consumption, but active C-States my influence performance sensitive applications or real-time systems. Active C6-State may influence data transfer on external Serial Ports Active C7-State may cause lower CPU and Graphics performance It's recommended to disable C-States / Enhanced C-States in BIOS Setup if any problems occur. 43 COMe-bSC2 / Features and Interfaces 4.15 Hyper Threading Hyper Threading (officially termed Hyper Threading Technology or HTT) is an Intel(R)-proprietary technology used to improve parallelization of computations performed on PCs. Hyper-Threading works by duplicating certain sections of the processor--those that store the architectural state but not duplicating the main execution resources. This allows a HyperThreading equipped processor to pretend to be two "logical" processors to the host operating system, allowing the operating system to schedule two threads or processes simultaneously. Hyper Threading Technology support always relies on the Operating System. 44 COMe-bSC2 / Features and Interfaces 4.16 VID-x The processor implements the VID-x feature for improved control of core voltage levels when the processor enters a reduced power consumption state. VID-x applies only when the processor is in the Intel Dynamic Acceleration Technology performance state and one or more cores are in low-power state (i.e., CC3/CC4/CC6). VID-x provides the ability for the processor to request core voltage level reductions greater than one VID tick. The amount of VID tick reduction is fixed and only occurs while the processor is in Intel Dynamic Acceleration Technology mode. This improved voltage regulator efficiency during periods of reduced power consumption allows for leakage current reduction which results in platform power savings and extended battery life. When in Intel Dynamic Acceleration Technology mode, it is possible for both cores to be active under certain internal conditions. In such a scenario the processor may draw a Instantaneous current (ICC_CORE_INST) for a short duration of tINST; however, the average ICC current will be lesser than or equal to ICCDES current specification. 45 COMe-bSC2 / Features and Interfaces 4.17 Intel(R) Turbo Boost Technology and AVX For applications that are particularly power-hungry, the new processors provide enhanced Intel(R) Turbo Boost technology. This automatically shifts processor cores and processor graphics resources to accelerate performance, tailoring a workload to give users an immediate performance boost for their applications whenever needed. Another innovation is the enhancement to the 256-bit instruction set, known as Intel(R) Advanced Vector Extensions (AVX). AVX delivers improved performance, rich functionality and the ability to manage, rearrange and sort data in a better way. The new instruction set accelerates floating-point intensive applications such as "number crunchers" or digital processing of images, videos and audio data. Intel(R) Turbo Boost Technology 2.0 Intel has optimized Intel(R) Turbo Boost Technology to provide even more performance when needed on the latestgeneration Intel(R) microarchitecture. Intel(R) Turbo Boost Technology 2.0 automatically allows processor cores to run faster than the base operating frequency if it's operating below power, current, and temperature specification limits. Intel Turbo Boost Technology 2.0 is activated when the Operating System (OS) requests the highest processor performance state (P0). The maximum frequency of Intel Turbo Boost Technology 2.0 is dependent on the number of active cores. The amount of time the processor spends in the Intel Turbo Boost Technology 2.0 state depends on the workload and operating environment. Any of the following can set the upper limit of Intel Turbo Boost Technology 2.0 on a given workload: Number of active cores Estimated current consumption Estimated power consumption Processor temperature When the processor is operating below these limits and the user's workload demands additional performance, the processor frequency will dynamically increase until the upper limit of frequency is reached. Intel Turbo Boost Technology 2.0 has multiple algorithms operating in parallel to manage current, power, and temperature to maximize performance and energy efficiency. Note: Intel Turbo Boost Technology 2.0 allows the processor to operate at a power level that is higher than its rated upper power limit (TDP) for short durations to maximize performance. 46 COMe-bSC2 / Features and Interfaces 4.18 Shared Graphics Interfaces On COM Express(R) pin-out Type 2 based Computer-on-Modules the PCI Express Graphics interface is usually multiplexed with several digital display interfaces like SDVO, DisplayPort, HDMI or TMDS if supported by the chipset. The new generation Huron River platform no longer shares it's interfaces. For full backwards compatibility the COMe-bSC2 includes multi-staged PCIexpress 2.0 switches to provide a shared graphics output on PEG Interface similar to former platforms. It offers full functionality like auto detection for external Graphics or SDVO devices. PEG Interface pin-outs COM Express x16 PCI Express SDVO HDMI & DVI Display Port Pin Name Pin Name Pin name Description Pin name description pin name description D52 PEG_TX[0]+ B14 HSOp(0) SDVOB_RED_P Digital Video B red TMDS_B_DATA 2_P HDMI Port B Data2 DPB_LANE0_P DisplayPort B Lane0 output D53 PEG_TX[0]- B15 HSOn(0) SDVOB_RED_N output differential pair TMDS_B_DATA 2_N output differential pair DPB_LANE0_N differential pair D55 PEG_TX[1]+ B19 HSOp(1) SDVOB_GRN_P Digital Video B green TMDS_B_DATA 1_P HDMI Port B Data1 DPB_LANE1_P DisplayPort B Lane1 output D56 PEG_TX[1]- B20 HSOn(1) SDVOB_GRN_N output differential pair TMDS_B_DATA 1_N output differential pair DPB_LANE1_N differential pair D58 PEG_TX[2]+ B23 HSOp(2) SDVOB_BLU_P Digital Video B blue TMDS_B_DATA 0_P HDMI Port B Data0 DPB_LANE2_P DisplayPort B Lane2 output D59 PEG_TX[2]- B24 HSOn(2) SDVOB_BLU_N output differential pair TMDS_B_DATA 0_N output differential pair DPB_LANE2_N differential pair D61 PEG_TX[3]+ B27 HSOp(3) SDVOB_CK_P Digital Video B clock TMDS_B_CLK _P HDMI Port B Clock output DPB_LANE3_P DisplayPort B Lane3 output D62 PEG_TX[3]- B28 HSOn(3) SDVOB_CK_N differential pair TMDS_B_CLK _N differential pair DPB_LANE3_N differential pair D65 PEG_TX[4]+ B33 HSOp(4) - - TMDS_C_DATA2 HDMI Port C _P Data2 output DPC_LANE0_P DisplayPort C Lane0 output D66 PEG_TX[4]- B34 HSOn(4) - - TMDS_C_DATA2 differential _N pair DPC_LANE0_N differential pair D68 PEG_TX[5]+ B37 HSOp(5) - - TMDS_C_DATA1 HDMI Port C _P Data1 output DPC_LANE1_P DisplayPort C Lane1 output D69 PEG_TX[5]- B38 HSOn(5) - - TMDS_C_DATA1 differential _N pair DPC_LANE1_N differential pair D71 PEG_TX[6]+ B41 HSOp(6) - - TMDS_C_DATA0 HDMI Port C _P Data0 output DPC_LANE2_P DisplayPort C Lane2 output D72 PEG_TX[6]- B42 HSOn(6) - - TMDS_C_DATA0 differential _N pair DPC_LANE2_N differential pair D74 PEG_TX[7]+ B45 HSOp(7) - - TMDS_C_CLK _P HDMI Port C Clock output DPC_LANE3_P DisplayPort C Lane3 output D75 PEG_TX[7]- B46 HSOn(7) - - TMDS_C_CLK _N differential pair DPC_LANE3_N differential pair D78 PEG_TX[8]+ B50 HSOp(8) - - TMDS_D_DATA 2_P HDMI Port D Data2 output DPD_LANE0_P DisplayPort D Lane0 output D79 PEG_TX[8]- B51 HSOn(8) - - TMDS_D_DATA 2_N differential pair DPD_LANE0_N differential pair D81 PEG_TX[9]+ B54 HSOp(9) - - TMDS_D_DATA 1_P HDMI Port D Data1 output DPD_LANE1_P DisplayPort D Lane1 output D82 PEG_TX[9]- B55 HSOn(9) - - TMDS_D_DATA 1_N differential pair DPD_LANE1_N differential pair D85 PEG_TX[10]+ B58 HSOp(10) - - TMDS_D_DATA HDMI Port D DPD_LANE2_P DisplayPort D 47 COMe-bSC2 / Features and Interfaces 0_P Data0 output D86 PEG_TX[10]- B59 HSOn(10) - - TMDS_D_DATA 0_N differential pair DPD_LANE2_N differential pair D88 PEG_TX[11]+ B62 HSOp(11) - - TMDS_D_CLK _P HDMI Port D Clock output DPD_LANE3_P DisplayPort D Lane3 output D89 PEG_TX[11]- B63 HSOn(11) - - TMDS_D_CLK _N differential pair DPD_LANE3_N - D91 PEG_TX[12]+ B66 HSOp(12) - - - - - - D91 PEG_TX[12]- B67 HSOn(12) - - - - - - D94 PEG_TX[13]+ B70 HSOp(13) - - - - - - D95 PEG_TX[13]- B71 HSOn(13) - - - - - - D98 PEG_TX[14]+ B74 HSOp(14) - - - - - - D99 PEG_TX[14]- B75 HSOn(14) - - - - - - D101 PEG_TX[15]+ B78 HSOp(15) - - - - - - D102 PEG_TX[15]- B79 HSOn(15) - - - - - - C52 PEG_RX[0]+ A16 HSIp(0) SDVO_TVCLKIN _P Digital Video TVOUT sync - - - - C53 PEG_RX[0]- A17 HSIn(0) SDVO_TVCLKIN _N clock input differential - - - - C55 PEG_RX[1]+ A21 HSIp(1) SDVO_INT_P Digital Video B interrupt - - - - C56 PEG_RX[1]- A22 HSIn(1) SDVO_INT_N differential pair - - - - C58 PEG_RX[2]+ A25 HSIp(2) SDVO_STALL_P Digital Video Field Stall - - DPB_AUX_P DisplayPort B Aux output C59 PEG_RX[2]- A26 HSIn(2) SDVO_STALL_N differential pair - - DPB_AUX_N differential pair C61 PEG_RX[3]+ A29 HSIp(3) - - TMDS_B_HPD# - DPB_HPD# DisplayPort B Hotplug detect C62 PEG_RX[3]- A30 HSIn(3) - - - - - - C65 PEG_RX[4]+ A35 HSIp(4) - - - - - - C66 PEG_RX[4]- A36 HSIn(4) - - - - - - C65 PEG_RX[5]+ A39 HSIp(5) - - - - - - C66 PEG_RX[5]- A40 HSIn(5) - - - - - - C71 PEG_RX[6]+ A43 HSIp(6) - - - - DPC_AUX_P DisplayPort C Aux input C72 PEG_RX[6]- A44 HSIn(6) - - - - DPC_AUX_N differential pair C74 PEG_RX[7]+ A47 HSIp(7) - - TMDS_C_HPD# - DPC_HPD# DisplayPort C Hotplug detect C74 PEG_RX[7]- A48 HSIn(7) - - - - - - C78 PEG_RX[8]+ A52 HSIp(8) - - - - - - C79 PEG_RX[8]- A53 HSIn(8) - - - - - - C81 PEG_RX[9]+ A56 HSIp(9) - - - - - - C82 PEG_RX[9]- A57 HSIn(9) - - - - - - C85 PEG_RX[10]+ A60 HSIp(10) - - - - DPD_AUX_P DisplayPort D Aux input C86 PEG_RX[10]- A61 HSIn(10) - - - - DPD_AUX_N differential pair C88 PEG_RX[11]+ A64 HSIp(11) - - TMDS_D_HPD# - DPD_HPD# DisplayPort D Hotplug detect C89 PEG_RX[11]- A65 HSIn(11) - - - - - - C91 PEG_RX[12]+ A68 HSIp(12) - - - - - - C92 PEG_RX[12]- A69 HSIn(12) - - - - - - C94 PEG_RX[13]+ A72 HSIp(13) - - - - - - C95 PEG_RX[13]- A73 HSIn(13) - - - - - - C98 PEG_RX[14]+ A76 HSIp(14) - - - - - - C99 PEG_RX[14]- A77 HSIn(14) - - - - - - C101 PEG_RX[15]+ A80 HSIp(15) - - - - - - C102 PEG_RX[15]- A81 HSIn(15) - - - - - - D73 SDVO_CLK B17 PRSNT2# SDVO_CTRL_CL K SDVO I2C clock line DDPB_CTRLCLK HDMI port B Control Clock - - C73 SDVO_DATA B31 PRSNT2#1 SDVO_CTRL_DA SDVO I2C data TA line DDPB_CTRLDAT HDMI port B A Control Data DDPB_CTRLDAT only used as A boot strap D63 RSVD - - - - DDPC_CTRLCLK HDMI port C Control Clock - - D64 RSVD - - - - DDPC_CTRLDAT A HDMI port C Control Data DDPC_CTRLDAT A only used as boot strap C97 RSVD - - - - DDPD_CTRLCLK HDMI port D Control Clock - - D83 RSVD - - - - DDPD_CTRLDAT HDMI port D A Control Data DDPD_CTRLDAT only used as A boot strap 48 Lane2 output COMe-bSC2 / Features and Interfaces 4.19 Display Configuration The chapter describes possible display configurations and supported features for the integrated Intel(R) GMA HD/HD3000 (Gen6) graphics. Dual Display Configurations in O/S Display LVDS DID LVDS2DVI SDVO2LVDS SDVO2DVI N/A N/A - CRT S LVDS fix S S S DP/eDP S DP2DVI S S S S S S CRT S - A A A A A A A A A A LVDS fix S A - - - A A A A A* A A LVDS DID S A - - - A A A A A* A A LVDS2DVI S A - - - A A A A A* A A DP S A A A A A A A A A A A DP2DVI S A A A A A A A A A A A DP2HDMI S A A A A A A A A A A A DP2CRT S A A A A A A A A A A A eDP - - - - - - - - - - - SDVO2LVDS S A A* A* A* A A A A - - - SDVO2DVI S A A A A A A A A - - - SDVO2CRT S A A A A A A A A - - - - DP2HDMI DP2CRT SDVO2DVI: only supported if BIOS DDI1 is enabled and set to SDVO - DVI 1.0 or SDVO - DVI-I SDVO2CRT: only supported if BIOS DDI1 is enabled and set to SDVO - DVI-I S = Single Display A = All Modes (Single Display, Clone Mode, Extended Desktop) A* = All Modes, but requires a customized BIOS - = Not supported N/A = Display not attached 49 SDVO2CRT COMe-bSC2 / Features and Interfaces Dual Display configurations in Setup and POST Display LVDS DID LVDS2DVI DP2HDMI DP2CRT SDVO2LVDS SDVO2DVI SDVO2CRT N/A N/A - CRT S LVDS fix S S S DP/eDP S DP2DVI S S S S S - CRT S - C C* Twin C C C C C C - LVDS fix S C - - - C C C C C*1 C - LVDS DID S C* - - - C* C* C* C* C*1 C* - LVDS2DVI S Twin - - - C C C C C*1 C - DP S C C C* C C C C C C* C* - DP2DVI S C C C* C C C C C C* C* - DP2HDMI S C C C* C C C C C C* C* - DP2CRT S C C C* C C C C C C* C* - eDP - - - - - - - - - - - - SDVO2LVDS S C C*1 C*1 C*1 C* C* C* C* - - - SDVO2DVI S C C C* C C* C* C* C* - - - SDVO2CRT - - - - - - - - - - - - SDVO2DVI: only supported if BIOS DDI1 is enabled and set to SDVO - DVI 1.0 or SDVO - DVI-I S = Single Display C = Clone Mode C* = Clone Mode, requires manual display configuration in setup. With Auto detection LVDS only is supported C*1 = Clone Mode, but requires a customized BIOS Twin = Twin Mode with 2 Displays on Display Pipe 1. - = Not supported N/A = Display not attached In Clone Mode Display Pipe 2 only shows VESA Modes in POST, Setup and EFI Shell. DOS, Windows boot or the Windows Installation is using VGA Mode which is not supported by Display Pipe 2. With CRT and LVDS with EDID (e.g. LVDS2DVI Adapter) the Twin Mode is active without VESA mode restrictions 50 COMe-bSC2 / Features and Interfaces eDP - embedded Display Port Intel(R) 6 & 7-Series Chipset based Computer-on-modules support the embedded Display Port shared on Digital Display Interface DDI3. To enable the eDP, LVDS must be switched off by hardware strap option. This feature is implemented in COMe-bSC2 (starting with hardware revision CE 2.x.x) and COMe-bIP2/6 by external strap option on the carrier board. The General Purpose Input GPI3 (COM Express Pin A85) is pulled-up with 10kOhm on the module. Leaving GPI3 open on the baseboard enables LVDS (default configuration). To enable the eDP instead of LVDS GPI3 must be pulled-down with a resistor 1kOhm or tied directly to GND during boot-up. The GPIO should not be used during boot-up until CB_RESET# becomes inactive Digital Display Interface Features The integrated Intel(R) GMA HD/HD3000 (Gen6) graphics supports: High-bandwidth Digital Content Protection (HDCP) on HDMI and DisplayPort with up to 2 HDCP streams simultaneously One active Protected Audio and Video Path (PAVP) session on HDMI or DisplayPort Dual Stream DP/HDMI Audio if activated in BIOS (See BIOS Chapter HDAudio Configuration) and O/S (HDMI codec DDI enabled) DP/HDMI/DVI Hot-plug (low-active) Supported Audio Formats on HDMI and DisplayPort Audio Formats HDMI DisplayPort AC-3 Dolby Digital YES NO Dolby Digital Plus YES NO DTS-HD YES NO LPCM, 192kHz/24bit, 8 channel YES YES (Up to 2 channel 96kHz, 24bit) Dolby True HD, DTS HD Master Audio YES NO DDI Design Consideration For sufficient signal quality baseboard designs with long signal lanes or impedance leaps may require an Equalicer or Redriver for the digital display interfaces Monitor Hot-plug detection is usually high-active. On COMe-bSC2 the hot-plug is low active and requires conversion on the baseboard SDVO can be used for external conversion to VGA, LVDS, TV-out and requires additional hardware on your baseboard DisplayPort can be used directly or with external adapters for HDMI, DVI or VGA HDMI or DVI usage on a baseboard requires a level shifter Find more details for DDI usage as DisplayPort, HDMI or DVI with schematic examples available on http://emdcustomersection.kontron.com 51 COMe-bSC2 / Features and Interfaces DVI-I Design Topology DVI-I is supported on PCH Digital Display Port B (COM DDI1) only. The implementation involves routing VGA and DVI-D signals to DVI-I connector: VGA port RGB signals should be routed to Analog RGB pins on the DVI-I connector DVI Data and Clock signals on PCH Digital Display Port B should be routed to TMDS Data 0, 1 and 2 pins and TMDS Clock pin of DVI-I connector respectively DVI HPD signals should be routed to the HPD pin of the DVI-I connector DVI DDC Clock and Data signals on PCH Digital Display Port B should be routed to the DDC Clock and Data pins of the DVI-I connector. 52 COMe-bSC2 / Features and Interfaces 4.20 Hybrid Graphics / Multi-monitor The COMe-bSC2 supports Hybrid Multi-monitor function which is one form of Intel's Hybrid Graphics where integrated graphics (in Chipset or CPU) is available to operate simultaneously with external PEG; PCIe or PCI graphics. This feature enables concurrent function of Intel's integrated Graphics Processing Unit (GPU/iGFX) along with a discrete GPU solution, allowing for operability of greater than two independently-driven displays. The O/S will handle control of the multiple GPU display adapters appropriately. For example, WindowsXP supports The Microsoft Windows XP Display Driver Model (XPDM) which allows loading and support of multiple graphics drivers. Windows 7 continues that legacy XPDM support but also adds WDDM v1.1 which, like XPDM, allows for simultaneous multiple graphics drivers (Windows Vista WDDM v1.0 did not allow this capability). Operating system applications will be adapter-unaware through use of the O/S GUI APIs and will utilize the adapter associated with the primary display, regardless of which display the image is located on. Some applications may be adapter-aware, e.g., full-screen applications and system applications like the compositor. A number of software tools designed to assist multimonitor use are available from third parties. One example is the UltraMon* utility for multimonitor systems, which helps with the position of applications, assists desktop wallpapers and screen savers in multi-monitor configurations. Hybrid Multi-monitor mode is recommended to be accomplished using a discrete third-party PCI Express graphics card either into the PEG slot of the platform or into an available PCI Express slot routed off of the I/O subsection of the chipset. Requirements Baseboard supporting PEG (alternatively PCIe or PCI) Module BIOS which allows switching between iGFX and discrete GPU (iGFX must be set to primary boot display) O/S supporting heterogeneous display adapters (Linux / WindowsXP / Windows 7) Setup a Multi-monitor system Start without the discrete GPU seated in the system Select IGD as Primary Boot Display in BIOS Setup Boot into O/S and install drivers requested for the integrated GPU Shut down the system and insert the discrete GPU Boot into O/S and install drivers requested for the discrete GPU (if necessary in Safe mode) Set the Windows Display properties as referenced below (example: WindowsXP) 53 COMe-bSC2 / Features and Interfaces In most cases the graphical user interfaces (e.g. ATI Catalyst Control Center) for both GPUs may not run properly. It's recommended to use O/S implemented Display Properties like in screenshot above Detailed documentation is available in Intel Paper 323214 54 COMe-bSC2 / Features and Interfaces 4.21 Intel(R) Wireless Display Intel(R) Wireless Display, most commonly known as WiDi, is a wireless display standard developed by Intel, based on the existing Wi-Fi standard. It allows a portable device or computer to send up to 1080p HD video and 5.1 surround sound to a compatible display wirelessly. The COMe-bSC2 supports WiDi in combination with following requirements: CPU: Core(TM) i7 Core(TM) i5 Core(TM) i3 One of the following Wireless Devices: Intel(R) Centrino(R) Wireless-N 1000, 1030, 2200, or 2230 Intel(R) Centrino(R) Wireless-N 2200 for Desktop Intel(R) Centrino(R) Advanced-N 6200, 6205, 6230, or 6235 Intel(R) Centrino(R) Advanced-N 6205 for Desktop Intel(R) Centrino(R) Wireless-N + WiMAX 6150 Intel(R) Centrino(R) Advanced-N + WiMAX 6250 Intel(R) Centrino(R) Ultimate-N 6300 Operating System: Windows 7 64-bit, Home Premium, Ultimate or Professional Windows 7 32-bit, Home Premium, Ultimate, Professional or Basic Windows 8 32-bit and 64-bit editions Software: Intel(R) My WiFi Technology (Intel(R) MWT) Intel(R) Wireless Display pre-installed and enabled A Intel(R) WiDi compatible streaming target such as: WiDi Adapter (e.g. Belkin ScreenCast, D-Link DHD-131, NETGEAR Push2TV ...) HDTV's with built in WiDi Support (e.g. LG Smart TV ...) Any other WiDi compatible CE Devices (e.g. Netgear Media Player NTV200S ...) 55 COMe-bSC2 / Features and Interfaces 4.22 Intel(R) vProTM technology Kontron and Intel(R) are addressing the security and manageability challenges facing embedded systems today with the implementation of Intel(R) vProTM technology to enable: System integrity Secure isolation Remote systems management First, system integrity is the ability to identify whether the system hardware or system software has been modified without authorization. When a system's integrity is known, the system can be thought of as a trusted system. Second, secure isolation is the ability to use platform hardware to separate processes, resources, and data on the system such that they cannot interact with each other in unintended ways. By providing hardware-assisted isolation, there are limitless security, privacy, and cost savings that can be realized through consolidation and workload isolation. Finally, remote systems management is the ability to troubleshoot, perform power management or system verification through secure channels. Significant cost savings and efficiencies can be realized through remote management allowing for increased system up time and the ability to manage or diagnose a system, even when powered down. Intel(R) vProTM technology itself is special functionality designed into the both the processor and the chipset. The three technologies that comprise Intel(R) vProTM technology are: Intel Virtualization Technology (Intel(R) VT), Intel Trusted Execution Technology (Intel(R) TXT) and Intel Active Management Technology (Intel(R) AMT). Intel(R) VT provides hardware-based assists making secure isolation more efficient and decreases the virtualization footprint, lowering the effective attack surface of a solution. This hardware-based technology can help to protect applications and information by running multiple operating systems (OSs) in isolation on the same physical system. A virtual guest OS can be created in an entirely separate space on the physical system to run specialized or critical applications. Virtual environments leverage Intel(R) VT for memory, CPU, and Directed I/O virtualization. Intel(R) TXT provides the ability to use hardware-based mechanisms to verify system integrity during the boot process. It also provides system memory scrubbing that protects against soft reset attacks. Virtualized environments take advantage of Intel(R) TXT launch environment verification to establish a dynamic root of trust providing added security to hypervisor or virtual machine monitor (VMM). Mechanisms employed by Intel(R) AMT include domain authentication, session keys, persistent data storage in the Intel(R) AMT hardware, and access control lists. Only firmware images that are digitally signed by Intel are permitted to load and execute. This set of hardware-based features is targeted for businesses and allows remote access to the system, whether wired or wireless, for management and security tasks. Because of the special hardware capabilities provided by Intel(R) AMT, out of band access is available even when the OS is not functional or system power is off. Intel(R) TXT and Intel(R) AMT are disabled by default. Please contact your local sales or support for BIOS versions with full vProTM support 56 COMe-bSC2 / Features and Interfaces 4.23 ACPI Suspend Modes and Resume Events The COMe-bSC2 supports the S3 state (=Save to Ram). S4 (=Save to Disk) is not supported by the BIOS (S4_BIOS) but S4_OS is supported by the following operating systems: Windows XP Windows Vista Windows 7 The following events resume the system from S3: USB Keyboard (1) USB Mouse (1) Power Button WakeOnLan (2) The following events resume the system from S4: Power Button WakeOnLan (2) The following events resume the system from S5: Power Button WakeOnLan (2) (1) OS must support wake up via USB devices and baseboard must power the USB Port with StBy-Voltage (2) WakeOnLan must be enabled in BIOS setup and driver options 57 COMe-bSC2 / Features and Interfaces 4.24 USB The COMe-bSC2 is available in different variants affecting the USB routing: COM COMe-bSC2 ECC w/QM67 COMe-bSC2 ECC w/HM65 COMe-bSC2 ECC COMe-bSC2 ECC XT COMe-bSC2 Part.No. 38013-xxxx-xx-x 38013-xxxx-xx-x 38013-xxxx-xx-x 38018-xxxx-xx-x 38022-xxxx-xx-x HW Rev. HW Rev CE 1.x.x HW Rev CE 1.x.x HW Rev CE 2.x.x all all COMe USB#0 USB0 from EHCI1 USB0 from EHCI1 USB0 from EHCI1 USB0 from EHCI1 USB0 from EHCI1 COMe USB#1 USB1 from EHCI1 USB1 from EHCI1 USB1 from EHCI1 USB1 from EHCI1 USB1 from EHCI1 COMe USB#2 USB2 from EHCI1 USB2 from EHCI1 USB2 from EHCI1 USB2 from EHCI1 USB2 from EHCI1 COMe USB#3 USB3 from EHCI1 USB3 from EHCI1 USB3 from EHCI1 USB3 from EHCI1 USB3 from EHCI1 COMe USB#4 USB4 from EHCI1 USB4 from EHCI1 USB8 from EHCI2 USB4 from EHCI1 USB8 from EHCI2 COMe USB#5 USB5 from EHCI1 USB5 from EHCI1 USB9 from EHCI2 USB5 from EHCI1 USB9 from EHCI2 COMe USB#6 USB6 from EHCI1 not available USB10 from EHCI2 USB8 from EHCI2 USB10 from EHCI2 COMe USB#7 USB7 from EHCI1 not available USB11 from EHCI2 USB9 from EHCI2 USB11 from EHCI2 Internal PCH Configuration Due to the internal chipset configuration the Cougar Point supports up to 4 external USB Hubs only. 58 COMe-bSC2 / System Resources 5 5.1 System Resources Interrupt Request (IRQ) Lines IRQ # Used For Available Comment 0 Timer0 No - 1 Keyboard No - 2 Cascade No - 3 COM2 No Type2: External SIO COM2, Type6: onboard COM2 4 COM1 No Type2: External SIO COM1, Type6: onboard COM1 5 COM3 Note(4) Type2: not used, Type6: External SIO COM1 6 - Yes - 7 SIO LPT No - 8 RTC No - 9 ACPI No - 10 COM4 Note(4) Type2: not used, Type6: External SIO COM2 11 SMBus No - 12 PS/2 Mouse No - 13 FPU No - 14 - Yes - 15 - Yes - 16 LNK A No PCIe RP 0 + PCIe RP 4 + USB EHCI#1 + Intel ME + I.G.D.; Note(3) 17 LNK B No PCIe2Pata (Type2 only) + PCIe RP 1 + PCIe RP 5; Note(3) 18 LNK C No PCIe2PCI (Type2 only) + PCIe RP 2 + PCIe RP 6; Note(3) 19 LNK D No PCIe RP 3 + SATA AHCI; Note(3) 20 LNK E No Note(3) 21 LNK F No Note(3) 22 LNK G No Note(3) 23 LNK H No USB EHCI#2 (1) If the "Used For" device is disabled in setup, the corresponding interrupt is available for other device. (2) Not available if ACPI is used (3) ACPI OS decides on particular IRQ usage (4) Depends on system configuration (onboard COM Port support and external SIO presence) 59 COMe-bSC2 / System Resources 5.2 Memory Area The first 640 kB of DRAM are used as main memory. Using DOS, you can address 1 MB of memory directly. Memory area above 1 MB (high memory, extended memory) is accessed under DOS via special drivers such as HIMEM.SYS and EMM386.EXE, which are part of the operating system. Please refer to the operating system documentation or special textbooks for infor- mation about HIMEM.SYS and EMM386.EXE. Other operating systems (Linux or Windows versions) allow you to address the full memory area directly. Upper Memory Used for Available Comment A0000h - BFFFFh VGA Memory No Mainly used by graphic controller C0000h - CFFFFh VGA BIOS No Used by onboard VGA ROM D0000h - DFFFFh - Yes Free for shadow RAM in standard configurations. E0000h - FFFFFh System BIOS No Fixed 20000000h-201FFFFFh IGFX No Fixed 40000000h-401FFFFFh IGFX No Fixed E0000000h-FEAFFFFFh PCIe Config Space No Fixed FED00000h-FED003FFh HPET No Fixed FED10000h-FED17FFFh MCH No Fixed FED18000h-FED18FFFh DMI No Fixed FED19000h-FED19FFFh EPBA No Fixed FED1C000h-FED1FFFFh RCBA No Fixed FED20000h FED3FFFFh TXT No Fixed FED40000h FED44FFFh TPM No Fixed FED45000h FED8FFFFh TPM No Fixed FED90000h-FED93FFFh VT-d No Fixed FEE00000h-FEEFFFFFh IOxAPIC No Fixed FF000000h-FFFFFFFFh BIOS Flash No Fixed 5.3 I/O Address Map The I/O-port addresses of the are functionally identical to a standard PC/AT. All addresses not mentioned in this table should be available. We recommend that you do not use I/O addresses below 0100h with additional hardware for compatibility reasons, even if available. I/O Address Used for Available Comment 0000 - 001F System Ressources No Fixed 0020 - 003F Interrupt Controller 1 No Fixed 002E - 002F Ext. SIO No Fixed 0040 - 005F Timer, Counter No Fixed 004E - 004F TPM No Fixed 0060 - 006F Keyboard controller No Fixed 0070 - 007F RTC and CMOS Registers No Fixed 0080 BIOS Postcode No Fixed 0081 - 009F DMA Controller No Fixed 00A0 - 00BF Interrupt Controller No Fixed 00C0 - 00DF DMA Controller No Fixed 00F0 - 00FF Math Coprocessor No Fixed 0290 - 029F Ext. SIO No Fixed 03B0 - 03DF VGA No Fixed 0400 - 047F Chipset No Fixed 04D0 - 04D1 Chipset No Fixed 0500 - 057F Chipset No Fixed 0680 - 069F Chipset No Fixed 0A80 - 0A81 CPLD No Fixed 0B78 - 0B7F Chipset No Fixed 0CF8 - 0CFF Chipset No Fixed 60 COMe-bSC2 / System Resources 5.4 Peripheral Component Interconnect (PCI) Devices All devices follow the Peripheral Component Interconnect 2.3 (PCI 2.3) respectivily the PCI Express Base 1.0a specification. The BIOS and OS control memory and I/O resources. Please see the PCI 2.3 specification for details. PCI Device B:D:F PCI IRQ Interface Comment Host Bridge 0:0:0 None internal Chipset P.E.G. Root Port 0:1:0 LNK A internal Chipset Video Controller 0:2:0 LNK A internal Chipset XHCI 0:20:0 LNK A internal Chipset ME 0:22:0 LNK A internal Chipset GbE 0:25:0 LNK E PCIe Chipset HDA 0:27:0 LNK G PCIe Chipset PCIe Port 0 0:28:0 LNK A internal Chipset PCIe Port 0 Slot - A/B/C/D PCIe Port 0 PCIe Port 1 0:28:1 LNK A internal Chipset PCIe Port 1 Slot - B/C/D/A PCIe Port 1 PCIe Port 2 0:28:2 LNK A internal Chipset PCIe Port 2 Slot - C/D/A/B PCIe Port 2 PCIe Port 3 0:28:3 LNK A internal Chipset PCIe Port 3 Slot - D/A/B/A PCIe Port 3 PCIe Port 4 0:28:4 LNK A internal Chipset PCIe Port 4 Slot - A/B/C/D PCIe Port 4 PCIe Port 5 0:28:5 LNK A internal Chipset PCIe Port 5 Slot - B/C/D/A PCIe Port 5 PCIe Port 6 0:28:6 LNK A internal Chipset PCIe Port 6 Slot - C/D/A/B PCIe Port 6 PCIe Port 7 0:28:7 LNK A internal Chipset EHCI 0:29:0 LNK H internal Chipset LPC Bridge 0:31:0 - internal Chipset SATA 0:31:2 LNK D internal Chipset SMBus 0:31:3 LNK C internal Chipset PCIe2PATA X:00:0 LNK A PCIe Slot 5 PCIe2PCI Y:00:0 LNK A PCIe Slot 6 5.5 I2C Bus I2C Address Used For Available Comment 58h S5 Eco No S5 Eco Resistor A0h JIDA-EEPROM No Module EEPROM AEh FRU-EEPROM No Recommended for Baseboard EEPROM I2C Address Used For Available Comment A0h JILI-EEPROM No EEPROM for JILI Data 5.6 5.7 JILI I2C Bus SDVO I2C Bus I2C Address Used For Available Comment - - - - 61 COMe-bSC2 / System Resources 5.8 System Management (SM) Bus The 8-bit SMBus addresses uses the LSB (Bit 0) for the direction. Bit0 = 0 defines the write address, Bit0 = 1 defines the read address for the device. The 8-bit addresses listed below shows the write adress for all devices. 7-bit SMBus adresses shows the device address without Bit0. 8-bit Address 7-bit Address Device Comment SMBus 12h 0x09 SMART_CHARGER Not to be used with any SM bus device except a charger SMB 14h 0x0A SMART_SELECTOR Not to be used with any SM bus device except a selector or manager SMB 16h 0x0B SMART_BATTERY Not to be used with any SM bus device except a battery SMB 30h 0x18 DDR3 Thermal Sensor Chan. A Do not use under any circumstances SMB 34h 0x1A DDR3 Thermal Sensor Chan. B Do not use under any circumstances SMB 58h 0x2C HWM NCT7802Y (non ECC Design) Do not use under any circumstances SMB 5Ch 0x2E HWM ADT7490 (ECC Design) Do not use under any circumstances SMB A0h 0x50 DDR3 channel A SPD Do not use under any circumstances SMB A4h 0x52 DDR3 channel B SPD Do not use under any circumstances SMB C8h 0x64 Ethernet 82579 Do not use under any circumstances SML0 A JIDA Bus No. like in former Modules cannot be provided because the EAPI driver implementation enumerates the I2C busses dynamically. Please follow the initialisation process like it is provided in the EAPI specification. 62 COMe-bSC2 / Connectors 6 Connectors The pinouts for Interface Connectors X1A and X1B are documented for convenient reference. Please see the COM Express(R) Specification and COM Express(R) Design Guide for detailed, design-level information. 6.1 63 Connector Location COMe-bSC2 / Pinout List 7 7.1 Pinout List General Signal Description Type Description I/O-3,3 Bi-directional 3,3 V IO-Signal I/O-5T Bi-dir. 3,3V I/O (5V Tolerance) I/O-5 Bi-directional 5V I/O-Signal I-3,3 3,3V Input I/OD Bi-directional Input/Output Open Drain I-5T 3,3V Input (5V Tolerance) OA Output Analog OD Output Open Drain O-1,8 1,8V Output O-3,3 3,3V Output O-5 5V Output DP-I/O Differential Pair Input/Output DP-I Differential Pair Input DP-O Differential Pair Output PU Pull-Up Resistor PD Pull-Down Resistor PWR Power Connection To protect external power lines of peripheral devices, make sure that: the wires have the right diameter to withstand the maximum available current the enclosure of the peripheral device fulfills the fire-protection requirements of IEC/EN60950 64 COMe-bSC2 / Pinout List 7.2 Connector X1A Row A Pin Signal Description Type Termination Comment A1 GND Power Ground PWR - - A2 GBE0_MDI3- GBE0_MDI3_N / Ethernet Receive Data - DP-I - - A3 GBE0_MDI3+ GBE0_MDI3_P / Ethernet Receive Data - DP-I - - A4 GBE0_LINK100# GBE0_LINK100# / Ethernet Speed LED O-3,3 - - A5 GBE0_LINK1000# GBE0_LINK1000# / Ethernet Speed LED O-3,3 - - A6 GBE0_MDI2- GBE0_MDI2_N / Ethernet Receive Data - DP-I - - A7 GBE0_MDI2+ GBE0_MDI2_P / Ethernet Receive Data - DP-I - - A8 GBE0_LINK# GBE0_LINK# / LAN Link LED OD - - A9 GBE0_MDI1- GBE0_MDI1_N / Ethernet Receive Data - DP-I - - A10 GBE0_MDI1+ GBE0_MDI1_P / Ethernet Receive Data + DP-I - - A11 GND Power Ground PWR - - A12 GBE0_MDI0- GBE0_MDI0_N / Ethernet Transmit Data - DP-O - - A13 GBE0_MDI0+ GBE0_MDI0_P / Ethernet Transmit Data + DP-O - - A14 GBE0_CTREF GBE0_CTREF O-1,8 - n. c. on module, because not needed with 82579LM A15 SUS_S3# PM_SLP_S3_EXT# O-3,3 PD 10k - A16 SATA0_TX+ SATA_TX0_P / SATA 0 Transmit Data + DP-O - - A17 SATA0_TX- SATA_TX0_N / SATA 0 Transmit Data - DP-O - - A18 SUS_S4# PM_SLP_S4# O-3,3 - - A19 SATA0_RX+ SATA_RX0_P / SATA 0 Receive Data + DP-I - - A20 SATA0_RX- SATA_RX0_N / SATA 0 Receive Data - DP-I - - A21 GND Power Ground PWR - - A22 SATA2_TX+ SATA_TX2_P / SATA 2 Transmit Data + DP-O - - A23 SATA2_TX- SATA_TX2_N / SATA 2 Transmit Data - DP-O - - A24 SUS_S5# PM_SLP_S5# O-3,3 - - A25 SATA2_RX+ SATA_RX2_P / SATA 2 Receive Data + DP-I - - A26 SATA2_RX- SATA_RX2_N / SATA 2 Receive Data - DP-I - - A27 BATLOW# PM_BATLOW# / Battery Low I-3,3 PU 8k25 3,3V (S5) - A28 ATA_ACT# ATA_LED# / SATA LED OD-3,3 - - A29 AC/HDA_SYNC HDA_SYNC / HD Audio Sync O-3,3 PD 1MEG - A30 AC/HDA_RST# HDA_RST# / HD Audio Reset O-3,3 - - A31 GND Power Ground PWR - - A32 AC/HDA_BITCLK HDA_BITCLK / HD Audio Clock O-3,3 - - A33 AC/HDA_SDOUT HDA_SDOUT / HD Audio Data O-3,3 - int. PD 20k in PCH A34 BIOS_DIS0# BIOS_DIS0# I-3,3 - - A35 THRMTRIP# EXT_THRMTRIP# O-3,3 PU 10k 3,3V (S0) - A36 USB6- USB6_N / USB Data - Port6 DP-I/O - int. PD 20k in PCH / 5V tolerant A37 USB6+ USB6_P / USB Data + Port6 DP-I/O - int. PD 20k in PCH / 5V tolerant A38 USB_6_7_OC# USB_67_OC# / USB OverCurrent Port 6/7 I-3,3 PU 10k 3,3V (S5) - A39 USB4- U SB4_N / USB Data - Port4 DP-I/O - int. PD 20k in PCH / 5V tolerant A40 USB4+ USB4_P / USB Data + Port4 DP-I/O - int. PD 20k in PCH / 5V tolerant A41 GND Power Ground PWR - - A42 USB2- USB2_N / USB Data - Port2 DP-I/O - int. PD 20k in PCH / 5V tolerant A43 USB2+ USB2_P / USB Data + Port2 DP-I/O - int. PD 20k in PCH / 5V tolerant A44 USB_2_3_OC# USB_23_OC# / USB OverCurrent Port 2/3 I-3,3 PU 10k 3,3V (S5) - A45 USB0- USB0_N / USB Data - Port0 DP-I/O - int. PD 20k in PCH / 5V tolerant A46 USB0+ USB0_P / USB Data + Port0 DP-I/O - int. PD 20k in PCH / 5V tolerant A47 VCC_RTC V_BAT PWR 3V - - A48 EXCD0_PERST# EXCD0_PERST#/Express card reset O-3,3 - - A49 EXCD0_CPPE# EXCD0_CPPE#/ capable c. request I-3,3 PU 8k25 3,3V (S0) - A50 LPC_SERIRQ LPC_SERIRQ / Serial Interrupt Request I/O-3,3 PU 10k 3,3V (S0) - A51 GND Power Ground PWR - - A52 PCIE_TX5+ opt. PCI Express lane 5 + Transmit Nc - just available if PCIe2PATA bridge is not stuffed A53 PCIE_TX5- opt. PCI Express lane 5 - Transmit Nc - just available if PCIe2PATA bridge is not stuffed A54 GPI0 EXT_GPI0 / General Purpose Input 0 I-3,3 PU 10k 3,3V (S0) - A55 PCIE_TX4+ PCI Express lane 4 + Transmit DP-O - - A56 PCIE_TX4- PCI Express lane 4 - Transmit DP-O - - A57 GND Power Ground PWR - - A58 PCIE_TX3+ PCI Express lane 3 + Transmit DP-O - - A59 PCIE_TX3- PCI Express lane 3 - Transmit DP-O - - A60 GND Power Ground PWR - - A61 PCIE_TX2+ PCI Express lane 2 + Transmit DP-O - - A62 PCIE_TX2- PCI Express lane 2 - Transmit DP-O - - 65 COMe-bSC2 / Pinout List A63 GPI1 EXT_GPI1 / General Purpose Input 1 I-3,3 PU 10k 3,3V (S0) - A64 PCIE_TX1+ PCI Express lane 1 + Transmit DP-O - - A65 PCIE_TX1- PCI Express lane 1 - Transmit DP-O - - A66 GND Power Ground PWR - - A67 GPI2 EXT_GPI2 / General Purpose Input 2 I-3,3 PU 10k 3,3V (S0) - A68 PCIE_TX0+ PCI Express lane 0 + Transmit DP-O - - A69 PCIE_TX0- PCI Express lane 0 - Transmit DP-O - - A70 GND Power Ground PWR - - A71 LVDS_A0+ LVDS_A_DATA0_P / LVDS Channel A Data0+ DP-O - - A72 LVDS_A0- LVDS_A_DATA0_N / LVDS Channel A Data0- DP-O - - A73 LVDS_A1+ LVDS_A_DATA1_P / LVDS Channel A Data1+ DP-O - - A74 LVDS_A1- LVDS_A_DATA1_N / LVDS Channel A Data1- DP-O - - A75 LVDS_A2+ LVDS_A_DATA2_P/ LVDS Channel A Data2+ DP-O - - A76 LVDS_A2- LVDS_A_DATA2_N / LVDS Channel A Data2 - DP-O - - A77 LVDS_VDD_EN LVDS_VDD_EN / LVDS Panel Power Control O-3,3 PD 100k - A78 LVDS_A3+ LVDS_A_DATA3_P / LVDS Channel A Data3+ DP-O - - A79 LVDS_A3- LVDS_A_DATA3_N / LVDS Channel A Data3- DP-O - - A80 GND Power Ground PWR - - A81 LVDS_A_CK+ LVDS_A_CLK_P / LVDS Channel A Clock+ DP-O - - A82 LVDS_A_CK- LVDS_A_CLK_N / LVDS Channel A Clock- DP-O - - A83 LVDS_I2C_CK LVDS_DDC_CLK / JILI I2C Clock I/O-3,3 PU 2k21 3,3V (S0) - A84 LVDS_I2C_DAT LVDS_DDC_DATA / JILI I2C Data I/O-3,3 PU 2k21 3,3V (S0) - A85 GPI3 EXT_GPI3 / General Purpose Input 3 I-3,3 PU 10k 3,3V (S0) - A86 KBD_RST# KBD_RST# / Keyboard Reset I-3,3 PU 10k 3,3V (S0) - A87 KBD_A20GATE KBD_A20GATE I-3,3 PU 8k25 3,3V (S0) - A88 PCIE0_CK_REF+ CLK_PCIE_CON_P DP-O - - A89 PCIE0_CK_REF- CLK_PCIE_CON_N DP-O - - A90 GND Power Ground PWR - - A91 SPI_POWER V3.3_SPI_POWER O-3,3 - power supply pin for external SPI flash A92 SPI_MISO SPI_SO / SPI slave output I-3,3 - int. PU 20k in PCH A93 GPO0 EXT_GPO0 / General Purpose Output 0 O-3,3 PD 10k - A94 SPI_CLK SPI_CLK / SPI clock O-3,3 - - A95 SPI_MOSI SPI_SI / SPI slave input O-3,3 - int. PD 20k in PCH A96 GND Power Ground PWR - - A97 TYPE10# n.c. for type 2 module Nc - - A98 RSVD n.c. Nc - - A99 RSVD n.c. Nc - - A100 GND Power Ground PWR - - A101 RSVD n.c. Nc - - A102 RSVD n.c. Nc - - A103 RSVD n.c. Nc - - A104 VCC_12V main input voltage (8.5-18V) PWR 8.5-18V - - A105 VCC_12V main input voltage (8.5-18V) PWR 8.5-18V - - A106 VCC_12V main input voltage (8.5-18V) PWR 8.5-18V - - A107 VCC_12V main input voltage (8.5-18V) PWR 8.5-18V - - A108 VCC_12V main input voltage (8.5-18V) PWR 8.5-18V - - A109 VCC_12V main input voltage (8.5-18V) PWR 8.5-18V - - A110 GND Power Ground PWR - - 66 COMe-bSC2 / Pinout List 7.3 Connector X1A Row B Pin Signal Description Type Termination B1 GND Power Ground PWR - - B2 GBE0_ACT GBE0_ACT# / Ethernet Activity LED OD - - B3 LPC_FRAME# LPC_FRAME# / LPC Frame Indicator O-3,3 - - B4 LPC_AD0 LPC_AD0 / LPC Adress & DATA Bus I/O-3,3 - int. PU 20k in PCH B5 LPC_AD1 LPC_AD1 / LPC Adress & DATA Bus I/O-3,3 - int. PU 20k in PCH B6 LPC_AD2 LPC_AD2 / LPC Adress & DATA Bus I/O-3,3 - int. PU 20k in PCH B7 LPC_AD3 LPC_AD3 / LPC Adress & DATA Bus I/O-3,3 - int. PU 20k in PCH B8 LPC_DRQ0# LPC_DRQ#0 / LPC Request 0 I-3,3 PU 2k 3,3V (S0) int. PU 20k in PCH B9 LPC_DRQ1# LPC_DRQ#1 / LPC Request 1 I-3,3 PU 2k 3,3V (S0) int. PU 20k in PCH B10 LPC_CLK CLK_LPC_33M_EXT /33MHz LPC clock O-3,3 - - B11 GND Power Ground PWR - - B12 PWRBTN# EXT_PWRBTN# / Power Button I-3,3 PU 20k 3,3V (S5eco) - B13 SMB_CK SMB_CLK_ EXT / SMBUS Clock O-3,3 PU 3k3 3,3V (S5) - B14 SMB_DAT SMB_DATA_EXT / SMBUS Data I/O-3,3 PU 3k3 3,3V (S5) - B15 SMB_ALERT# SMB_ALERT# / SMBUS Interrupt I/O-3,3 PU 1k0 3,3V (S5) - B16 SATA1_TX+ SATA_TX1_P / SATA 1 Transmit Data + DP-O - - B17 SATA1_TX- SATA_TX1_N / SATA 1 Transmit Data - DP-O - - B18 SUS_STAT# PM_SUS_ STAT# O-3,3 - - B19 SATA1_RX+ SATA_RX1_P / SATA 1 Receive Data + DP-I - - B20 SATA1_RX- SATA_RX1_N / SATA 1 Receive Data - DP-I - - B21 GND Power Ground PWR - - B22 SATA3_TX+ SATA_TX3_P / SATA 3 Transmit Data + DP-O - - B23 SATA3_TX- SATA_TX3_N / SATA 3 Transmit Data - DP-O - - B24 PWR_OK EXT_PWR_OK / Power OK I-3,3 PU 511k 3,3V pullup voltage depends on ATX or single supply mode B25 SATA3_RX+ SATA_RX3_P / SATA 3 Receive Data + DP-I - - B26 SATA3_RX- SATA_RX3_N / SATA 3 Receive Data - DP-I - - B27 WDT WDT / Watch Dog Timer O-3,3 - - B28 AC/HDA_SDIN2 HDA_SDIN2_ICH/ HD Audio Serial Input Data 2 I-3,3 - int. PD 20k in PCH B29 AC/HDA_SDIN1 HDA_SDIN1_ICH/ HD Audio Serial Input Data 1 I-3,3 - int. PD 20k in PCH B30 AC/HDA_SDIN0 HDA_SDIN0_ICH/ HD Audio Serial Input Data 0 I-3,3 - int. PD 20k in PCH B31 GND Power Ground PWR - - B32 SPKR HDA_SPKR / Speaker O-3,3 - int. PD 20k in PCH B33 I2C_CK I2C_CLK_EXT / I2C clock O-3,3 PU 2k21 3,3V (S5) - B34 I2C_DAT I2C_DATA_EXT / I2C data I/O-3,3 PU 2k21 3,3V (S5) - B35 THRM# PM_THRM# / Over Temperature I-3,3 PU 10k 3,3V (S0) - B36 USB7- USB7_N / USB Data - Port7 DP-I/O - int. PD 20k in PCH / 5V tolerant B37 USB7+ USB7_P / USB Data + Port7 DP-I/O - int. PD 20k in PCH / 5V tolerant B38 USB_4_5_OC# USB_45_OC# / USB OverCurrent Port 4/5 I-3,3 PU 10k 3,3V (S5) - B39 USB5- USB5_N / USB Data - Port5 DP-I/O - int. PD 20k in PCH / 5V tolerant B40 USB5+ USB5_P / USB Data + Port5 DP-I/O - int. PD 20k in PCH / 5V tolerant B41 GND Power Ground PWR - - B42 USB3- USB3_N / USB Data - Port3 DP-I/O - int. PD 20k in PCH / 5V tolerant B43 USB3+ USB3_P / USB Data + Port3 DP-I/O - int. PD 20k in PCH / 5V tolerant B44 USB_0_1_OC# USB_01_OC# / USB OverCurrent Port 0/1 I-3,3 PU 10k 3,3V (S5) - B45 USB1- USB1_N / USB Data - Port1 DP-I/O - int. PD 20k in PCH / 5V tolerant B46 USB1+ USB1_P / USB Data + Port1 DP-I/O - int. PD 20k in PCH / 5V tolerant B47 EXCD1_PERST# EXCD1_PERST# / Express card reset O-3,3 - - B48 EXCD1_CPPE# EXCD1_CPPE# / capable c. request I-3,3 PU 8k25 3,3V (S0) - B49 SYS_RESET# EXT_SYS_RESET# / Reset Input I-3,3 PU 10k 3,3V (S5) - B50 CB_RESET# CB_RESET# / Carrier board Reset O-3,3 - - B51 GND Power Ground PWR - - B52 PCIE_RX5+ opt. PCI Express lane 5 + receive Nc - just available if PCIe2PATA bridge is not stuffed B53 PCIE_RX5- opt. PCI Express lane 5 - receive Nc - just available if PCIe2PATA bridge is not stuffed B54 GPO1 EXT_GPO1 / General Purpose Output 1 O-3,3 PD 10k - B55 PCIE_RX4+ PCI Express lane 4 + receive DP-I - - B56 PCIE_RX4- PCI Express lane 4 - receive DP-I - - B57 GPO2 EXT_GPO2 / General Purpose Output 2 O-3,3 PD 10k - B58 PCIE_RX3+ PCI Express lane 3 + receive DP-I - - B59 PCIE_RX3- PCI Express lane 3 - receive DP-I - - B60 GND Power Ground PWR - - B61 PCIE_RX2+ PCI Express lane 2 + receive DP-I - - 67 Comment COMe-bSC2 / Pinout List B62 PCIE_RX2- PCI Express lane 2 - receive DP-I - - B63 GPO3 EXT_GPO3 / General Purpose Output 3 O-3,3 PD 10k - B64 PCIE_RX1+ PCI Express lane 1 + receive DP-I - - B65 PCIE_RX1- PCI Express lane 1 - receive DP-I - - B66 WAKE0# PCIE_WAKE# I/O-3,3 PU 10k 3,3V (S5) - B67 WAKE1# WAKE1# I-3,3 PU 10k 3,3V (S5) - B68 PCIE_RX0+ PCI Express lane 0 + receive DP-I - - B69 PCIE_RX0- PCI Express lane 0 - receive DP-I - - B70 GND Power Ground PWR - - B71 LVDS_B0+ LVDS_B_DATA0_P / LVDS Channel B Data0+ DP-O - - B72 LVDS_B0- LVDS_B_DATA0_N / LVDS Channel B Data0- DP-O - - B73 LVDS_B1+ LVDS_B_DATA1_P / LVDS Channel B Data1+ DP-O - - B74 LVDS_B1- LVDS_B_DATA1_N / LVDS Channel B Data1- DP-O - - B75 LVDS_B2+ LVDS_B_DATA2_P/ LVDS Channel B Data2+ DP-O - - B76 LVDS_B2- LVDS_B_DATA2_N / LVDS Channel B Data2 - DP-O - - B77 LVDS_B3+ LVDS_B_DATA3_P / LVDS Channel B Data3+ DP-O - - B78 LVDS_B3- LVDS_B_DATA3_N / LVDS Channel B Data3- DP-O - - B79 LVDS_BKLT_EN LVDS_BKLT_CTRL / Panel Backlight ON O-3,3 PD 100k - B80 GND Power Ground PWR - - B81 LVDS_B_CK+ LVDS_B_CLK_P / LVDS Channel B Clock+ DP-O - - B82 LVDS_B_CK- LVDS_B_CLK_N / LVDS Channel B Clock- DP-O - - B83 LVDS_BKLT_CTRL LVDS_BKLT_CTRL / Backlight Brightness Contr. O-3,3 - - B84 VCC_5V_SBY +V_STBY_ETX / 5V Standby PWR 5V (S5) - - B85 VCC_5V_SBY +V_STBY_ETX / 5V Standby PWR 5V (S5) - - B86 VCC_5V_SBY +V_STBY_ETX / 5V Standby PWR 5V (S5) - - B87 VCC_5V_SBY +V_STBY_ETX / 5V Standby PWR 5V (S5) - - B88 BIOS_DIS1# BIOS_DIS1# I-3,3 - - B89 VGA_RED CRT_RED / Analog Video RGB-RED OA PD 150R - B90 GND Power Ground PWR - - B91 VGA_GRN CRT_GREEN / Analog Video RGB-GREEN OA PD 150R - B92 VGA_BLU CRT_BLUE / Analog Video RGB-BLUE OA PD 150R - B93 VGA_HSYNC CRT_HSYNC / Analog Video H-Sync O-3,3 - - B94 VGA_VSYNC CRT_VSYNC / Analog Video V-Sync O-3,3 - - B95 VGA_I2C_CK CRT_DDC_CLK / Display Data Channel Clock I/O-5 PU 2k21 5V (S0) - B96 VGA_I2C_DAT CRT_DDC_DATA / Display Data Channel Data I/O-5 PU 2k21 5V (S0) - B97 SPI_CS# SPI_CS# / SPI chip select O-3,3 - - B98 RSVD n. c. nc - - B99 RSVD n. c. nc - - B100 GND Power Ground PWR - - B101 RSVD n. c. nc - - B102 RSVD n. c. nc - - B103 RSVD n. c. nc - - B104 VCC_12V main input voltage (8.5-18V) PWR 8.5-18V - - B105 VCC_12V main input voltage (8.5-18V) PWR 8.5-18V - - B106 VCC_12V main input voltage (8.5-18V) PWR 8.5-18V - - B107 VCC_12V main input voltage (8.5-18V) PWR 8.5-18V - - B108 VCC_12V main input voltage (8.5-18V) PWR 8.5-18V - - B109 VCC_12V main input voltage (8.5-18V) PWR 8.5-18V - - B110 GND Power Ground PWR - - 68 COMe-bSC2 / Pinout List 7.4 Connector X1B Row C Pin Signal Description Type Termination Comment C1 GND Power Ground PWR - - C2 IDE_D7 IDE Data Bus I/O-5T - - C3 IDE_D6 IDE Data Bus I/O-5T - - C4 IDE_D3 IDE Data Bus I/O-5T - - C5 IDE_D15 IDE Data Bus I/O-5T - - C6 IDE_D8 IDE Data Bus I/O-5T - - C7 IDE_D9 IDE Data Bus I/O-5T - - C8 IDE_D2 IDE Data Bus I/O-5T - - C9 IDE_D13 IDE Data Bus I/O-5T - - C10 IDE_D1 IDE Data Bus I/O-5T - - C11 GND Power Ground PWR - - C12 IDE_D14 IDE Data Bus I/O-5T - - C13 IDE_IORDY IDE I/O Ready I-5T PU 4k7 3,3V (S0) - C14 IDE_IOR# IDE I/O Read I/O-3,3 - - C15 PCI_PME# PCI Power Management Event I/O-3,3 - int. PU 20k in PCH C16 PCI_GNT2# PCI Bus Grant 2 O-3,3 - - C17 PCI_REQ2# PCI Bus Request 2 I-5T PU 2k7 3,3V (S0) - C18 PCI_GNT1# PCI Bus Grant 1 O-3,3 - - C19 PCI_REQ1# PCI Bus Request 1 I-5T PU 2k7 3,3V (S0) - C20 PCI_GNT0# PCI Bus Grant 0 O-3,3 - - C21 GND Power Ground PWR - - C22 PCI_REQ0# PCI Bus Reqest 0 I-5T PU 2k7 3,3V (S0) - C23 PCI_RST# PCI Bus Reset O-3,3 - - C24 PCI_AD0 PCI Adress & Data Bus line I/O-5T - - C25 PCI_AD2 PCI Adress & Data Bus line I/O-5T - - C26 PCI_AD4 PCI Adress & Data Bus line I/O-5T - - C27 PCI_AD6 PCI Adress & Data Bus line I/O-5T - - C28 PCI_AD8 PCI Adress & Data Bus line I/O-5T - - C29 PCI_AD10 PCI Adress & Data Bus line I/O-5T - - C30 PCI_AD12 PCI Adress & Data Bus line I/O-5T - - C31 GND Power Ground PWR - - C32 PCI_AD14 PCI Adress & Data Bus line I/O-5T - - C33 PCI_C/BE1# PCI Bus Command and Byte enables 1 I/O-5T - - C34 PCI_PERR# PCI Bus Grant Error I/O-5T PU 2k7 3,3V (S0) - C35 PCI_LOCK# PCI Bus Lock I/O-5T PU 2k7 3,3V (S0) - C36 PCI_DEVSEL# PCI Bus Device Select I/O-5T PU 2k7 3,3V (S0) - C37 PCI_IRDY# PCI Bus Bus Initiator Ready I/O-5T PU 2k7 3,3V (S0) - C38 PCI_C/BE2# PCI Bus Command and Byte enables 2 I/O-5T - - C39 PCI_AD17 PCI Adress & Data Bus line I/O-5T - - C40 PCI_AD19 PCI Adress & Data Bus line I/O-5T - - C41 GND Power Ground PWR - - C42 PCI_AD21 PCI Adress & Data Bus line I/O-5T - - C43 PCI_AD23 PCI Adress & Data Bus line I/O-5T - - C44 PCI_C/BE3# PCI Bus Command and Byte enables 3 I/O-5T - - C45 PCI_AD25 PCI Adress & Data Bus line I/O-5T - - C46 PCI_AD27 PCI Adress & Data Bus line I/O-5T - - C47 PCI_AD29 PCI Adress & Data Bus line I/O-5T - - C48 PCI_AD31 PCI Adress & Data Bus line I/O-5T - - C49 PCI_IRQA# PCI Bus Interrupt Request A I-5T PU 2k7 3,3V (S0) - C50 PCI_IRQB# PCI Bus Interrupt Request B I-5T PU 2k7 3,3V (S0) - C51 GND Power Ground PWR - - C52 PEG_RX0+ PCIexpress Graphics Receive + (0) DP-I - - C53 PEG_RX0- PCIexpress Graphics Receive - (0) DP-I - - C54 TYPE0# n.c. for type 2 module nc - - C55 PEG_RX1+ PCIexpress Graphics Receive + (1) DP-I - - C56 PEG_RX1- PCIexpress Graphics Receive - (1) DP-I - - C57 TYPE1# n.c. for type 2 module nc - - C58 PEG_RX2+ PCIexpress Graphics Receive + (2) DP-I - - C59 PEG_RX2- PCIexpress Graphics Receive - (2) DP-I - - C60 GND Power Ground PWR - - C61 PEG_RX3+ PCIexpress Graphics Receive + (3) DP-I - - C62 PEG_RX3- PCIexpress Graphics Receive - (3) DP-I - - C63 RSVD n.c. nc - - C64 RSVD n.c. nc - - 69 COMe-bSC2 / Pinout List C65 PEG_RX4+ PCIexpress Graphics Receive + (4) DP-I - - C66 PEG_RX4- PCIexpress Graphics Receive - (4) DP-I - - C67 RSVD n.c. nc - - C68 PEG_RX5+ PCIexpress Graphics Receive + (5) DP-I - - C69 PEG_RX5- PCIexpress Graphics Receive - (5) DP-I - - C70 GND Power Ground PWR - - C71 PEG_RX6+ PCIexpress Graphics Receive + (6) DP-I - - C72 PEG_RX6- PCIexpress Graphics Receive - (6) DP-I - - C73 SDVO_DATA SDVO_CTRLDATA I/O-3,3 - opt. PU 2k21 3,3V (S0) = enable SDVO/DP B interface C74 PEG_RX7+ PCIexpress Graphics Receive + (7) DP-I - - C75 PEG_RX7- PCIexpress Graphics Receive - (7) DP-I - - C76 GND Power Ground PWR - - C77 RSVD n.c. nc - - C78 PEG_RX8+ PCIexpress Graphics Receive + (8) DP-I - - C79 PEG_RX8- PCIexpress Graphics Receive - (8) DP-I - - C80 GND Power Ground PWR - - C81 PEG_RX9+ PCIexpress Graphics Receive + (9) DP-I - - C82 PEG_RX9- PCIexpress Graphics Receive - (9) DP-I - - C83 RSVD n.c. nc - - C84 GND Power Ground PWR - - C85 PEG_RX10+ PCIexpress Graphics Receive + (10) DP-I - - C86 PEG_RX10- PCIexpress Graphics Receive - (10) DP-I - - C87 GND Power Ground PWR - - C88 PEG_RX11+ PCIexpress Graphics Receive + (11) DP-I - - C89 PEG_RX11- PCIexpress Graphics Receive - (11) DP-I - - C90 GND Power Ground PWR - - C91 PEG_RX12+ PCIexpress Graphics Receive + (12) DP-I - - C92 PEG_RX12- PCIexpress Graphics Receive - (12) DP-I - - C93 GND Power Ground PWR - - C94 PEG_RX13+ PCIexpress Graphics Receive + (13) DP-I - - C95 PEG_RX13- PCIexpress Graphics Receive - (13) DP-I - - C96 GND Power Ground PWR - - C97 RSVD DPD_CTRL_CLK I/O-3,3 - - C98 PEG_RX14+ PCIexpress Graphics Receive + (14) DP-I - - C99 PEG_RX14- PCIexpress Graphics Receive - (14) DP-I - - C100 GND Power Ground PWR - - C101 PEG_RX15+ PCIexpress Graphics Receive + (15) DP-I - - C102 PEG_RX15- PCIexpress Graphics Receive - (15) DP-I - - C103 GND Power Ground PWR - - C104 VCC_12V main input voltage (8.5-18V) PWR 8.5-18V - - C105 VCC_12V main input voltage (8.5-18V) PWR 8.5-18V - - C106 VCC_12V main input voltage (8.5-18V) PWR 8.5-18V - - C107 VCC_12V main input voltage (8.5-18V) PWR 8.5-18V - - C108 VCC_12V main input voltage (8.5-18V) PWR 8.5-18V - - C109 VCC_12V main input voltage (8.5-18V) PWR 8.5-18V - - C110 GND Power Ground PWR - 70 - COMe-bSC2 / Pinout List 7.5 Connector X1B Row D Pin Signal Description Type Termination Comment D1 GND Power Ground PWR - - D2 IDE_D5 IDE Data Bus I/O-5T - - D3 IDE_D10 IDE Data Bus I/O-5T - - D4 IDE_D11 IDE Data Bus I/O-5T - - D5 IDE_D12 IDE Data Bus I/O-5T - - D6 IDE_D4 IDE Data Bus I/O-5T - - D7 IDE_D0 IDE Data Bus I/O-5T - - D8 IDE_REQ IDE Data Bus I/O-5T PD 5k62 - D9 IDE_IOW# IDE IO Write O-3,3 - - D10 IDE_ACK# IDE DMA Acknowledge O-3,3 - - D11 GND Power Ground PWR - - D12 IDE_IRQ IDE Interrupt Request I-5T PD 10k - D13 IDE_A0 IDE Adress Bus O-3,3 - - D14 IDE_A1 IDE Adress Bus O-3,3 - - D15 IDE_A2 IDE Adress Bus O-3,3 - - D16 IDE_CS1# IDE Chip Select Channel 0 O-3,3 - - D17 IDE_CS3# IDE Chip Select Channel 1 O-3,3 - - D18 IDE_RESET# IDE Hard Drive Reset O-3,3 PU 10k 3,3V (S0) - D19 PCI_GNT3# PCI Bus Grant 3 O-3,3 - - D20 PCI_REQ3# PCI Bus Reqest 0 I-5T PU 2k7 3,3V (S0) - D21 GND Power Ground PWR - - D22 PCI_AD1 PCI Adress & Data Bus line I/O-5T - - D23 PCI_AD3 PCI Adress & Data Bus line I/O-5T - - D24 PCI_AD5 PCI Adress & Data Bus line I/O-5T - - D25 PCI_AD7 PCI Adress & Data Bus line I/O-5T - - D26 PCI_C/BE0# PCI Bus Command and Byte enables 0 I/O-5T - - D27 PCI_AD9 PCI Adress & Data Bus line I/O-5T - - D28 PCI_AD11 PCI Adress & Data Bus line I/O-5T - - D29 PCI_AD13 PCI Adress & Data Bus line I/O-5T - - D30 PCI_AD15 PCI Adress & Data Bus line I/O-5T - - D31 GND Power Ground PWR - - D32 PCI_PAR PCI Bus Parity I/O-5T - - D33 PCI_SERR# PCI Bus System Error I/O-5T PU 2k7 3,3V (S0) - D34 PCI_STOP# PCI Bus Stop I/O-5T PU 2k7 3,3V (S0) - D35 PCI_TRDY# PCI Bus Target Ready I/O-5T PU 2k7 3,3V (S0) - D36 PCI_FRAME# PCI Bus Cycle Frame I/O-5T PU 2k7 3,3V (S0) - D37 PCI_AD16 PCI Adress & Data Bus line I/O-5T - - D38 PCI_AD18 PCI Adress & Data Bus line I/O-5T - - D39 PCI_AD20 PCI Adress & Data Bus line I/O-5T - - D40 PCI_AD22 PCI Adress & Data Bus line I/O-5T - - D41 GND Power Ground PWR - - D42 PCI_AD24 PCI Adress & Data Bus line I/O-5T - - D43 PCI_AD26 PCI Adress & Data Bus line I/O-5T - - D44 PCI_AD28 PCI Adress & Data Bus line I/O-5T - - D45 PCI_AD30 PCI Adress & Data Bus line I/O-5T - - D46 PCI_IRQC# PCI Bus Interrupt Request C I-5T PU 2k7 3,3V (S0) - D47 PCI_IRQD# PCI Bus Interrupt Request D I-5T PU 2k7 3,3V (S0) - D48 PCI_CLKRUN# PCI Clock Run I-5T PU 8k25 3,3V (S0) - D49 PCI_M66EN PCI 66MHz enable I-5T PD 1k - D50 PCI_CLK CLK_PCI_33M_EXT / PCI Clock 33MHz O-3,3 - - D51 GND Power Ground PWR - - D52 PEG_TX0+ PCIexpress Graphics Transmit + (0) DP-O - - D53 PEG_TX0- PCIexpress Graphics Transmit - (0) DP-O - - D54 PEG_LANE_RV# PCIexpress Graphics Lane Reversal I-3,3 - - D55 PEG_TX1+ PCIexpress Graphics Transmit + (1) DP-O - - D56 PEG_TX1- PCIexpress Graphics Transmit - (1) DP-O - - D57 TYPE2# n.c. for type 2 module nc - - D58 PEG_TX2+ PCIexpress Graphics Transmit + (2) DP-O - - D59 PEG_TX2- PCIexpress Graphics Transmit - (2) DP-O - - D60 GND Power Ground PWR - - D61 PEG_TX3+ PCIexpress Graphics Transmit + (3) DP-O - - D62 PEG_TX3- PCIexpress Graphics Transmit - (3) DP-O - - D63 RSVD DPC_CTRL_CLK I/0-3,3 - - D64 RSVD DPC_CTRL_DATA I/0-3,3 - int. PD 20k in PCH 71 COMe-bSC2 / Pinout List D65 PEG_TX4+ PCIexpress Graphics Transmit + (4) DP-O - - D66 PEG_TX4- PCIexpress Graphics Transmit - (4) DP-O - - D67 GND Power Ground PWR - - D68 PEG_TX5+ PCIexpress Graphics Transmit + (5) DP-O - - D69 PEG_TX5- PCIexpress Graphics Transmit - (5) DP-O - - D70 GND Power Ground PWR - - D71 PEG_TX6+ PCIexpress Graphics Transmit + (6) DP-O - - D72 PEG_TX6- PCIexpress Graphics Transmit - (6) DP-O - - D73 SDVO_CLK SDVO_CTRLCLK I/O-3,3 - - D74 PEG_TX7+ PCIexpress Graphics Transmit + (7) DP-O - - D75 PEG_TX7- PCIexpress Graphics Transmit - (7) DP-O - - D76 GND Power Ground PWR - - D77 IDE_CBLID IDE_CBLID# / IDE cable type detect I/0-3,3 PD 10k - D78 PEG_TX8+ PCIexpress Graphics Transmit + (8) DP-O - - D79 PEG_TX8- PCIexpress Graphics Transmit - (8) DP-O - - D80 GND Power Ground PWR - - D81 PEG_TX9+ PCIexpress Graphics Transmit + (9) DP-O - - D82 PEG_TX9- PCIexpress Graphics Transmit - (9) DP-O - - D83 RSVD DPD_CTRL_DATA I/O-3,3 - int. PD 20k in PCH D84 GND Power Ground PWR - - D85 PEG_TX10+ PCIexpress Graphics Transmit + (10) DP-O - - D86 PEG_TX10- PCIexpress Graphics Transmit - (10) DP-O - - D87 GND Power Ground PWR - - D88 PEG_TX11+ PCIexpress Graphics Transmit + (11) DP-O - - D89 PEG_TX11- PCIexpress Graphics Transmit - (11) DP-O - - D90 GND Power Ground PWR - - D91 PEG_TX12+ PCIexpress Graphics Transmit + (12) DP-O - - D92 PEG_TX12- PCIexpress Graphics Transmit - (12) DP-O - - D93 GND Power Ground PWR - - D94 PEG_TX13+ PCIexpress Graphics Transmit + (13) DP-O - - D95 PEG_TX13- PCIexpress Graphics Transmit - (13) DP-O - - D96 GND Power Ground PWR - - D97 PEG_ENABLE# PCIexpress Graphics Enable I-3,3 PU 10k 3,3V (S0) - D98 PEG_TX14+ PCIexpress Graphics Transmit + (14) DP-O - - D99 PEG_TX14- PCIexpress Graphics Transmit - (14) DP-O - - D100 GND Power Ground PWR - - D101 PEG_TX15+ PCIexpress Graphics Transmit + (15) DP-O - - D102 PEG_TX15- PCIexpress Graphics Transmit - (15) DP-O - - D103 GND Power Ground PWR - - D104 VCC_12V main input voltage (8.5-18V) PWR 8.5-18V - - D105 VCC_12V main input voltage (8.5-18V) PWR 8.5-18V - - D106 VCC_12V main input voltage (8.5-18V) PWR 8.5-18V - - D107 VCC_12V main input voltage (8.5-18V) PWR 8.5-18V - - D108 VCC_12V main input voltage (8.5-18V) PWR 8.5-18V - - D109 VCC_12V main input voltage (8.5-18V) PWR 8.5-18V - - D110 GND Power Ground PWR - - The termination resistors in these tables are already mounted on the module. Refer to the design guide for information about additional termination resistors. 72 COMe-bSC2 / BIOS Operation 8 BIOS Operation The module is equipped with AMI(R) Aptio, which is located in an onboard SPI serial flash memory. 8.1 Determining the BIOS Version The AMI(R) Aptio version is displayed in the main menu of the setup utility. BIOS Vendor: American Megatrends Core Version: x.x.x.x BIOS Date: mm/dd/yyyy hh:mm:ss BIOS Version: CHR2 / HudsonBayRXXX 8.2 BIOS Update Kontron provides continous BIOS updates for Computer-on-Modules. The updates are provided for download on http://emdcustomersection.kontron.com with a detailed change description within the according Product Change Notification (PCN). Please register for EMD Customer Section to get access to BIOS downloads and PCN service. Modules with BIOS Region/Setup only inside the flash can be updated with AFU utilities (usually 1-3MB BIOS binary file size) directly. Modules with Intel(R) Management Engine, Ethernet, Flash Descriptor and other options additionally to the BIOS Region (usually 4-8MB BIOS binary file size) requires a different update process with Intel Flash Utility FPT and a wrapper to backup and restore configurations and the MAC address. Therefore it is strongly recommended to use the batch file inside the BIOS download package available on EMD Customer Section. Boot the module to DOS/EFI Shell with access to the BIOS image and Firmware Update Utility provided on EMD Customer Section Execute Flash.bat in DOS or Flash.nsh in EFI Shell Any modification of the update process may damage your module! 73 COMe-bSC2 / BIOS Operation Backup the BIOS / Create a BIOS with custom defaults: Change your BIOS settings according your needs Save and Exit Setup with option "Save as User Defaults". Your customized settings are now stored inside the flash in a second area additional to the manufacturer defaults Boot the module to DOS or EFI Shell with access to the update utilities Extract the BIOS region including your custom defaults with afuefix64.efi CBIOS.bin /O in EFI Shell or afudos.exe CBIOS.rom /O in DOS Now you can clone the BIOS with your customized default settings to other modules or external SPI flashes with above mention AFU utilites. On modules with Management Engine and Ethernet inside the Flash the same BIOS core version should already be programmed on the target. AMI APTIO update utilities for DOS, EFI Shell and Windows are available for free at AMI.com: http://www.ami.com/support/downloads/amiflash.zip 74 COMe-bSC2 / BIOS Operation 8.3 Setup Guide The Aptio Setup Utility changes system behavior by modifying the Firmware configuration. The setup program uses a number of menus to make changes and turn features on or off. Functional keystrokes in POST: Key Function DEL Enter Setup F2 Enter Setup F7 Boot Menu 8.3.1 Start AMI(R) Aptio Setup Utility To start the AMI(R) BIOS setup utility, press <DEL> or <F2> when the following string appears during bootup. Press <DEL> to enter Setup The Info Menu then appears. The Setup Screen is composed of several sections: Setup Screen Location Function Menu Bar Top Lists and selects all top level menus. Legend Bar Right side Bottom Lists setup navigation keys. Item Specific Help Window Right side Top Help for selected item. Menu Window Left Center Selection fields for current menu. 75 COMe-bSC2 / BIOS Operation Menu Bar The menu bar at the top of the window lists different menus. Use the left/right arrow keys to make a selection. Legend Bar Use the keys listed in the legend bar on the bottom to make your selections or exit the current menu. The table below describes the legend keys and their alternates. Key Function or Arrow key Select a menu. or Arrow key Select fields in current menu. <Home> or <End> Move cursor to top or bottom of current window. <PgUp> or <PgDn> Move cursor to next or previous page. +/- Change Option <Enter> Execute command or select submenu. <F1> General Help window. <F2> Previous Values <F3> Load the optimized default configuration. <F4> Save and exit. <Esc> Exit menu. Selecting an Item Use the or key to move the cursor to the field you want. Then use the + and - keys to select a value for that field. The Save Value commands in the Exit menu save the values displayed in all the menus. Displaying Submenus Use the or key to move the cursor to the submenu you want. Then press <Enter>. A pointer ( ) marks all submenus. Item Specific Help Window The Help window on the right side of each menu displays the Help text for the selected item. It updates as you move the cursor to each field. General Help Window Pressing <F1> on a menu brings up the General Help window that describes the legend keys and their alternates. Press <Esc> to exit the General Help window. 76 COMe-bSC2 / BIOS Operation 8.4 BIOS Setup 8.4.1 Main Feature Options Description System Language English Choose the system default language. English supported only System Date [mm/dd/yyyy] Set the Date. Use 'Tab' to switch between Date elements System Time [hh:mm:ss] Set the Time. Use 'Tab' to switch between Time elements 77 COMe-bSC2 / BIOS Operation 78 COMe-bSC2 / BIOS Operation 8.4.2 79 Advanced COMe-bSC2 / BIOS Operation PCI Subsystem Settings Feature Options Description PCI ROM Priority Legacy ROM EFI Compatible ROM In case of multiple Option ROMs (Legacy and EFI Compatible), specifies what PCI Option ROM to launch PCI Latency Timer 32 ... 248 PCI Bus Clocks Value to be programmed into PCI Latency Timer Register VGA Palette Snoop Disabled Enabled Enables or Disables VGA Palette Registers Snooping PERR# Generation Disabled Enabled Enables or Disables PCI Device to Generate PERR# SERR# Generation Disabled Enabled Enables or Disables PCI Device to Generate SERR# 80 COMe-bSC2 / BIOS Operation ACPI Settings Feature Options Description Enable ACPI Auto Configuration Disabled Enabled Enables or Disables BIOS ACPI Auto Configuration Enable Hibernation Disabled Enabled Enables or Disables System ability to Hibernate (OS/S4 Sleep State) ACPI Sleep State Suspend Disabled S3 (StR) Select the highest ACPI sleep state the system will enter when the SUSPEND button is pressed Lock Legacy Resources Disabled Enabled Enables or Disables Lock of Legacy Resources 81 COMe-bSC2 / BIOS Operation Trusted Computing Feature Options Description TPM Support Disable Enable Enables or Disables TPM support. O.S. will not show Security Device. TCG EFI protocol and INT1A interface will not be available TPM State Disabled Enabled Enable/Disable Security Device. Note: Your Computer will reboot during restart in order to change Sate of the Device Pending Operation None Enable Take Ownership Disable Take Ownership TPM Clear Schedule an Operation for the Security Device. Note: Your Computer will reboot during restart in order to change Sate of the Device 82 COMe-bSC2 / BIOS Operation CPU Configuration Feature Options Description Hyper-Threading Disabled Enabled Enables/Disables the Intel(R) Hyper Threading Technology HTT supported by Core i7/i5 Active Proc Cores All 1 2 3 Number of cores to enable in each processors package Execute Disable Bit Disabled Enabled XD can prevent certain classes of malicious buffer overflow attacks when combined with a supporting OS Hardware Prefetcher Disabled Enabled Turn on/off the MLC streamer prefetcher Adj. Cache Line Pref. Disabled Enabled Turn on/off prefetching of adjacent cache lines Intel Virtualization Technology Disabled Enabled When enabled, a VMM can utilize the additional hardware capabilities provided by Vanderpool Technology 83 COMe-bSC2 / BIOS Operation CPU Information 84 COMe-bSC2 / BIOS Operation CPU PPM Configuration Feature Options Description CPU DTS Disabled Enabled Enable/Disable CPU DTS SMI. If disabled, ACPI can't provide current temperature and passive cooling is not possible EIST Disabled Enabled Enable/Disable the Intel Speedstep Technology Turbo Mode Disabled Enabled Enables/Disables the Intel Processor Turbo Mode 2.0 CPU C3 Report Disabled Enabled Enable/Disable CPU C3 (ACPI C2) report to OS CPU C6 Report Disabled Enabled Enable/Disable CPU C6 (ACPI C3) report to OS CPU C7 Report Disabled Enabled Enable/Disable CPU C7 (ACPI C3) report to OS Long duration pwr lim 0 Long duration power limit in Watts, 0 meanse: use factory defaults Long duration time 28 Time window which the long duration power is maintained Short duration power limit 0 Short duration power limit in Watts, 0 meanse: use factory defaults TCC active offset 0 Offset from the factory TCC activation temperature 85 COMe-bSC2 / BIOS Operation Miscellaneous Feature Options Description S5 Eco Disabled Enabled Reduce supply current in Soft Off State S5 to less than 1mA. If enabled, power button is the only wakeup source in S5. See chapter S5 Eco for more details Reset Button Behavior Chipset Reset Power Cycle Select the behavior of Reset Button. Select Power Cycle to hold the module in reset while reset button is pressed 86 COMe-bSC2 / BIOS Operation Watchdog Feature Options Description Auto-reload Disabled Enabled Enable automatic reload of watchdog timers on timeout Global Lock Disabled Enabled If set to enabled, all Watchdog registers (except WD_KICK) become read only until the board is reset Stage 1 Mode Disabled Reset NMI SCI Delay WDT Signal only Select Action for first Watchdog stage - Assert WDT Signal Disabled Enabled Enable/Disable assertion of WDT signal to baseboard on stage timeout - Stage 1 Timout 1s 5s 10s 30s 1m 3m 10m 30m Select Timeout value for first watchdog stage Stage 2 Mode Disabled Reset NMI SCI WDT Signal only Select Action for second Watchdog stage - Assert WDT Signal Disabled Enabled Enable/Disable assertion of WDT signal to baseboard on stage timeout - Stage 2 Timout 1s 5s 10s 30s 1m 3m 10m 30m Select Timeout value for second watchdog stage 87 COMe-bSC2 / BIOS Operation Smart Battery Configuration Feature Options Description M.A.R.S. Disabled AUTO Charger Manager Preset M.A.R.S. Smart Battery System mode. System must be restarted to reflect mode changes 88 COMe-bSC2 / BIOS Operation Battery Information 89 COMe-bSC2 / BIOS Operation Generic LPC Decode Ranges Feature Options Description Generic LPC Decode 1 Disabled Enabled Enable generic LPC decode range - Base Address 0100h Base address of the generic decode range. Valid between 0100h - FFF0h. Must be 8-byte alligned - Length 0008h Length of the generic decode range. Valid between 0800h - 0100h. Must be multiple of 8. Generic LPC Decode 2 Disabled Enabled Enable generic LPC decode range - Base Address 0100h Base address of the generic decode range. Valid between 0100h - FFF0h. Must be 8-byte alligned - Length 0008h Length of the generic decode range. Valid between 0800h - 0100h. Must be multiple of 8. 90 COMe-bSC2 / BIOS Operation Thermal Configuration Feature Options Description Critical Trip Point POR 15C ... 119C This value controls the temperature of the ACPI Critical Trip Point - the point in which the OS will shut the system off. Note: 100C is the Plan Of Record (POR) for all Intel mobile processors ActTPnt Low Temp Disabled 15C .. 55C ... 95C This value controls the temperature of the ACPI Active Trip Point - the point in which the OS will turn the processor fan on Active Trip Point Low Fan Speed. ActTPoint Low Fan Speed 70 Active Trip Point Low Fan Speed in percentage. Value must be between 33% - 100%. This is the speed at which fan will run when Active Trip Point Low is crossed. Active Trip Point High Disabled 15C ... 79C ... 95C This value controls the temperature of the ACPI Active High Trip Point - the point in which the OS will turn the processor fan on Active Trip Point High Fan Speed. Passive Trip Point Disabled 15C ... 95C ... 119C This value controls the temperature of the ACPI Passive Trip Point - the point in which the OS will begin throttling the processor - Passive TC1 Value 1 This value sets the TC1 value for the ACPI Passive Cooling Formula. Range 1 - 16 - Passive TC2 Value 5 This value sets the TC2 value for the ACPI Passive Cooling Formula. Range 1 - 16 - Passive TSP Value 10 This item sets the TSP value for the ACPI Passive Cooling Formula. It represents in tenth of a second how often the OS will read the temperature when passive cooling is enabled. Range 2 - 32 91 COMe-bSC2 / BIOS Operation Passive Cooling The ACPI OS assesses the optimum CPU performance change necessary to lower the temperature using the following equation P[%] = TC1(Tn-Tn-1) + TC2(Tn-Tt) P is the performance delta, Tt is the target temperature = passive cooling trip point. The two coefficients TC1 and TC2 and the sampling period TSP are hardware dependent constants the end user must supply. It's up to the end user to set the cooling preference of the system by setting the appropriate trip points in the BIOS setup. See chapter 12 of the ACPI specification (www.acpi.info) for more details 92 COMe-bSC2 / BIOS Operation PCH-FW Configuration 93 COMe-bSC2 / BIOS Operation USB Configuration Feature Options Description Legacy USB Support Enabled Disabled AUTO Enables Legacy USB support. AUTO option disables legacy support if no USB devices are connected. DISABLE option will keep USB devices available only for EFI applications. USB3.0 Support Enabled Disabled Enable/Disable USB3.0 (XHCI) Controller support. On Type 2 board only supported by external PCIe Card - XHCI Hand-off Enabled Disabled This is a workaround for OSes without XHCI hand-off Support. The XHCI ownership change should be claimed by XHCI driver EHCI Hand-off Enabled Disabled This is a workaround for OSes without EHCI hand-off Support. The EHCI ownership change should be claimed by EHCI driver USB Beep Enabled Disabled Send speaker beep for device attach / detach USB transfer time-out 1sec 5sec 10sec 20sec The time-out value for Control, Bulk and Interrupt transfers Device reset time-out 10sec 20sec 30sec 40sec USB mass storage device Start Unit command time-out Device power-up delay AUTO Manual Maximum time the device will take before it properly reports itself to the Host controller. 'AUTO' uses default value: for a Root port it is 100ms, for a Hub port the delay is taken from Hub descriptor Device power-up delay in seconds 5 Delay range is 1...40 seconds, in one second increments 94 COMe-bSC2 / BIOS Operation Super IO Configuration This setup option is available if a LPC SuperI/O Nuvoton 83627 is present on the baseboard. By default the COMe-bSC2 supports the legacy interfaces of a 5V 83627HF(J) or 3.3V 83627DHG-P on external LPC. The SIO hardware monitor is not supported in setup. 95 COMe-bSC2 / BIOS Operation Serial Port 0 Configuration Feature Options Description Serial Port Disabled Enabled Enable or Disable Serial Port (COM) 0 Change Settings AUTO IO=3F8h; IRQ=4; IO=3F8h, IRQ=3,4,5,6,7,10,11,12; IO=2F8h, IRQ=3,4,5,6,7,10,11,12; IO=3E8h, IRQ=3,4,5,6,7,10,11,12; IO=2E8h, IRQ=3,4,5,6,7,10,11,12; Select an optimal setting for SuperIO device. Device Mode Standard Serial Port Mode IrDA 1.0 (HP SIR) Mode ASKIR Mode Change the Serial Port mode. 96 COMe-bSC2 / BIOS Operation Serial Port 1 Configuration Feature Options Description Serial Port Disabled Enabled Enable or Disable Serial Port (COM) 1 Change Settings AUTO IO=2F8h; IRQ=3; IO=3F8h, IRQ=3,4,5,6,7,10,11,12; IO=2F8h, IRQ=3,4,5,6,7,10,11,12; IO=3E8h, IRQ=3,4,5,6,7,10,11,12; IO=2E8h, IRQ=3,4,5,6,7,10,11,12; Select an optimal setting for SuperIO device. Device Mode Standard Serial Port Mode IrDA 1.0 (HP SIR) Mode ASKIR Mode Change the Serial Port mode. 97 COMe-bSC2 / BIOS Operation Parallel Port Configuration Feature Options Description Parallel Port Disabled Enabled Enable or Disable the Parallel Port (LPT/LPTE) Change Settings AUTO IO=378h; IRQ=5; IO=378h, IRQ=5,6,7,10,11,12; IO=278h, IRQ=5,6,7,10,11,12; IO=3BCh, IRQ=5,6,7,10,11,12; IO=378h; IO=278h; IO=3BCh; Select an optimal setting for SuperIO device. Device Mode Standard Parallel Port Mode EPP Mode ECP Mode EPP Mode & ECP Mode Change the Printer Port mode. 98 COMe-bSC2 / BIOS Operation H/W Monitor Hardware Monitor measurements and configuration for the onboard Analog Devices ADT7490. Feature Value/Options Description DTS xxC Shows the calculated temperature of Tcasemax - Digital Thermal Sensor CPU xxC Shows the measured temperature of the CPU Diode with onboard HWM PCH xxC Shows the internal Platform Controller Hub temperature CPU Fan Pulse 1 2 3 4 Select the number of pulses the fan produces during one revolution CPU FAN xxxx rpm Shows the fan speed of onboard FAN connector Battery x.xx V Shows the RTC Battery Voltage 5.0V Standby x.xx V Shows the 5V Standby Voltage Widerange Vcc x.xx V Shows the Module Main Input Voltage 99 COMe-bSC2 / BIOS Operation JMB36X ATA Controller Configuration Feature Options Description ATA Controller Disabled IDE Mode Enable/Disable the onboard PATA Controller 100 COMe-bSC2 / BIOS Operation Serial Port Console Redirection Feature Options Description Console Redirection Disabled Enabled Enable/Disable Serial Port COM0 Console Redirection Console Redirection Disabled Enabled Enable/Disable Serial Port COM1 Console Redirection Serial Port Console Redirection is not allowed to activate at more than one port simultaneously 101 COMe-bSC2 / BIOS Operation COM0/COM1 Console Redirection Settings Feature Options Description Terminal Type VT100 VT100+ VT_UTF8 ANSI VT100: ASCII char set. VT100+: Extends VT100 to support color, function keys, etc. VT-UTF8: Uses UTF8 encoding to map Unicode chars onto 1 or more bytes ANSI: Extended ASCII char set. Bits per second 9600 19200 38400 57600 115200 Selects serial port transmission speed. The speed must be matched on the other side. Long or noisy lines may require lower speeds Data Bits 7 8 Data Bits Parity None Even Odd Mark Space A parity bit can be sent with the data bits to detect some transmission errors. Even: parity bit is 0 if the num of 1's in the data bits is even. Odd: parity bit is 0 if num of 1's in the data bits is odd. Mark: parity bit is always 1. Space: Parity bit is always 0. Mark and Space Parity do not allow for error detection. Stop Bits 1 2 Stop Bits indicate the end of a serial data packet. (A Start bit indicates the beginning). The standard setting is 1 stop bit. Communication with slow devices may require more than 1 stop bit. Flow Control None Hardware RTS/CTS Flow control can prevent data loss from buffer overflow. When sending data, if the receiving buffers are full, a 'stop' signal can be sent to stop the data flow. Once the buffers are empty, a 'start' signal can be sent to restart the flow. Hardware flow control uses two wires to send start/stop signals Recorder Mode Disabled Enabled With this mode enabled only text will be sent. This is to capture terminal data. Resolution 100x31 Disabled Enabled Enables or disables extended terminal resolution Legacy OS Redirection Resolution 80x24 80x25 On Legacy OS, the Number of Rows and Columns supported redirection 102 COMe-bSC2 / BIOS Operation Intel ICC Feature Options Description Use Wdog Timer w/ ICC Disabled Enabled Enable Watchdog Timer operation for ICC. If enabled, Watchdog Timer will be started after ICC-related changes. This timer detects platform instability caused by wrong clock settings Unused Clocks off Disabled Enabled Disabled: all clocks turned on. Enabled: clocks for empty PCI/PCIe slots will be turned off to save power. Platform must be powered off for changes to take effect Lock ICC registers Static only All registers All registers: all ICC registers will be locked. Static only: only static ICC registers will be locked. ICC Profile 0 Choose clock profile 103 COMe-bSC2 / BIOS Operation Clock Spread Spectrum Feature Options Description New SSC spread / 0.01% 50 Clock spectrum spread in 0.01% increments. Determines sprectrum deviation away from base frequency. Allowed range is limited by Max supported SSC. Changes will not be applied unless 'Apply settings' is pressed Apply settings immediately - Changes will be applied immediately, but forgotten after reboot. Does not require reboot. This mode of making changes is more likely to cause platform instability and spontaneous restart Apply settings once after reboot - Changes will be applied once, after the next reboot, and then forgotten. Use it to try changes that are too aggressive for immediate application Apply settings permanently after reboot - Changes will be applied permanently, starting after the next reboot. Use it to provide changes that are verified and safe 104 COMe-bSC2 / BIOS Operation 8.4.3 105 Chipset COMe-bSC2 / BIOS Operation SystemAgent Configuration Feature Options Description VT-d Disabled Enabled Check to enable Intel(R) Virtualization Technology for Directed I/O (VT-d) Capability function for SA 106 COMe-bSC2 / BIOS Operation Graphics Configuration Feature Options Description Gfx Turbo IMON Curr 31 Graphics turbo IMON current values supported (14-31) Primary Display Auto IGFX PEG PCI Select which of IGFX/PEG/PCI Graphics device should be Primary Display Internal Graphics Auto Disabled Enabled Keep IGFX enabled based on the setup options Load IGFX VBIOS Disabled Enabled Enable or disable CSM load IGFX VBIOS GTT Size 1MB 2MB Select the GTT Size Aperture Size 128MB 256MB Select the Aperture Size DVMT Pre-Allocated 0M ... 64M ... 512M Select DVMT 5.0 Pre-Allocated (Fixed) Graphics Memory size used by the Internal Graphics device 107 COMe-bSC2 / BIOS Operation LCD Control Feature Options Description Prim IGFX Boot Disp Auto CRT LVDS EFP 1 EFP 2 EFP 3 Select the Integrated Graphics Video Device which will be activated during POST. This has no effect if external graphics devices arepresent Sec IGFX Boot Disp Disabled CRT LVDS EFP 1 EFP 2 EFP 3 Select Secondary Integrated Graphics Display Device Int. LVDS Panel Type AUTO VGA 640x480 1x18 WVGA 800x480 1x18 SVGA 800x600 1x18 XGA 1024x768 1x18 XGA 1024x768 1x24 WXGA 1280x768 1x24 WXGA 1280x768 1x24 WXGA 1280x800 1x18 WXGA 1366x768 1x24 WXGA+ 1440x900 2x18 WXGA+ 1440x900 2x24 SXGA 1280x1024 2x18 SXGA 1280x1024 2x24 WSXGA+ 1680x1050 2x18 WSXGA+ 1680x1050 2x24 UXGA 1600x1200 2x18 UXGA 1600x1200 2x24 WUXGA 1920x1200 2x18 WUXGA 1920x1200 2x24 Select LCD panel used by Internal Graphics Device by selecting the appropriate setup item Panel Color Depth 18 Bit 24 Bit For internal LVDS EDID detection, select the Panel Color Depth Backlight Control None/External PWM PWM Inverted I2C Backlight Control Setting Backlight Value 128 Set LCD backlight brightness (0-255) 108 COMe-bSC2 / BIOS Operation SDVO Device Disabled SDVO - DVI 1.0 SDVO - DVI-I SDVO - LVDS Selects the SDVO Device For SDVO2DVI solutions select 'SDVO - DVI 1.0' or 'SDVO - DVI-I'. For SDVO2CRT select 'SDVO - DVI-I'. 109 COMe-bSC2 / BIOS Operation SystemAgent PCIe Configuration Feature Options Description PEG0 - Gen X Auto Gen1 Gen2 Configure PEG0 B0:D1:F0 Gen1-Gen2 PEG1 - Gen X Auto Gen1 Gen2 Configure PEG1 B0:D1:F1 Gen1-Gen2 PEG2 - Gen X Auto Gen1 Gen2 Configure PEG2 B0:D1:F2 Gen1-Gen2 PEG3 - Gen X Auto Gen1 Gen2 Configure PEG3 B0:D6:F0 Gen1-Gen2 Enable PEG Enabled Disabled HW Select Enable the PEG slot. If available, the option 'HW Select' checks the PEG_Enable# signal PEG ASPM Disabled Auto ASPM L0s ASPM L1 ASPM L0sL1 Control ASPM support for the PEG Device. This has no effect if PEG is not the currently active device ASPM L0s Root Port Only Endpoint Port Only Both Root and Endpoint Ports Enable PCIe ASPM L0s De-emphasis Control -6 dB -3.5 dB Configure the De-emphasis control on PEG 110 COMe-bSC2 / BIOS Operation Memory Configuration Feature Options Description DIMM Profile Default DIMM provile XMP profile 1 XMP Profile 2 Select DIMM timing profile that should be used Memory Frequency Auto 1067 1333 1600 1867 2133 Maximum Memory Frequency Selections in MHz ECC Support Disabled Enabled Enable/disable DDR3 ECC Support Max TOLUD Dynamic 1 - 3.5GB Maximum Value of TOLUD. Dynamic assignment would adjust TOLUD automatically based on largest MMIO length of installed graphic controller. Manual TOLUD setting from 1GB to 3.5GB in 0.25GB steps MRC FastBoot Disabled Enabled Enable/Disable MRC FastBoot Memory Remap Disabled Enabled Enable/Disable Memory Remap above 4GB 111 COMe-bSC2 / BIOS Operation GT - Power Management Control RC6 (Render Standby) 112 Disabled Enabled Check to enable render standby support COMe-bSC2 / BIOS Operation PCH-IO Configuration Launch Storage OpROM Disabled Enabled Enable or Disable Boot Option for Legacy Mass Storage Devices with Option ROM CLKRUN# logic Disabled Enabled Enable the CLKRUN# logic to stop the PCI clocks High Precision Timer Disabled Enabled Enable or Disable the High Precision Event Timer Restore AC Power Loss Power Off Power On Select AC power state when power is re-applied after a power failure 113 COMe-bSC2 / BIOS Operation LAN Configuration PCH LAN Controller Enabled Disabled Enable/Disable onboard NIC Launch PXE OpROM Disabled Enabled Enable/Disable Boot Option for Legacy Network Devices Wake on LAN Disabled Enabled Enable/Disable integrated LAN to wake the system 114 COMe-bSC2 / BIOS Operation SATA Configuration Feature Options Description SATA Controller Enabled Disabled Enable/Disable SATA Device SATA Mode Selection IDE AHCI RAID Determines how SATA controller(s) operate SATA Test mode Disabled Enabled Enable or disable Test Mode Delay of the OROM UI Splash Screen 2 SEC 4 SEC 6 SEC 8 SEC This specify the delay of the OROM UI Splash Screen in a normal status Aggressive LPM Support Disabled Enabled Enable PCH to aggressively enter link power state 115 COMe-bSC2 / BIOS Operation Serial ATA Port 0/1/2/3 Configuration Feature Options Description PORT 0 PORT 1 PORT 2 PORT 3 Enabled Disabled Enable or Disable SATA Port Hot Plug Disabled Enabled Designates this port as Hot Pluggable External SATA Disabled Enabled Enable/Disable eSATA Support SATA Device Type Hard Disk Drive Solid State Drive Identify the SATA port is connected to Solid State Driver or Hard Disk Drive Spin Up Device Disabled Enabled If enabled for any of the ports Staggered Spin Up will be performed and only the drives which have this option enabled will spin up at boot. Otherwise all drives spin up at boot 116 COMe-bSC2 / BIOS Operation HDA Configuration Feature Options Description High Definition Audio Disabled Enabled Auto Control Detection of the High definition audio (Azalia) device. Disabled = HDaudio will be unconditionally disabled. Enabled = HDaudio will be unconditionally enabled. Auto = HDaudio will be enabled if present, disabled otherwise HDA PME Enable Disabled Enabled Enable/Disable Power Management capability of Audio Controller DP/HDMI Codec Disabled Enabled Enable/Disable internal DisplayPort/HDMI audio codec HDMI codec DDI1 Disabled Enabled Enable/Disable internal HDMI codec for DDI1 HDMI codec DDI2 Disabled Enabled Enable/Disable internal HDMI codec for DDI2 HDMI codec DDI3 Disabled Enabled Enable/Disable internal HDMI codec for DDI3 Enable "DisplayPort/HDMI Codec" to activate DisplayPort Audio. Enabling "HDMI Codec DDIx" activates Audio on each HDMI Port but the DDI works as HDMI Port only and cannot be used as DisplayPort or DVI 117 COMe-bSC2 / BIOS Operation USB Configuration Feature Options Description EHCI1 Enabled Disabled Control the USB EHCI (USB 2.0) functions. One EHCI controller must always be enabled EHCI2 Enabled Disabled Control the USB EHCI (USB 2.0) functions. One EHCI controller must always be enabled USB Per-Port Control Disabled Enabled Control each of the USB ports (0-9) disabling USB Port #0 USB Port #1 USB Port #2 USB Port #3 USB Port #4 USB Port #5 USB Port #6 USB Port #7 Disabled Enabled Control each of the USB ports (0-9) disabling 118 COMe-bSC2 / BIOS Operation PCI Express Configuration Feature Options Description PCIe Clock Gating Disabled Enabled Enable or Disable PCI Express Clock Gating for each root port DMI Link ASPM Control Disabled L0s L1 L0sL1 Controls Active State Power Management on both NB side and SB side of the DMI Link DMI Link Ext Synch Disabled Enabled Controls Extended Synch on SB side of the DMI Link PCI ExpressCard 0 PCI ExpressCard 1 Port 0 Port 1 Port 2 Port 3 Port 4 Port 5 Disabled Controls PCIe Port for ExpressCard support 119 COMe-bSC2 / BIOS Operation PCI Express Root Port 0/1/2/3/4/5 Feature Options Description PCI Express Root Port Disabled Enabled Control the PCI Express Root Port Automatic ASPM Disabled L0s L1 L0sL1 Auto Automatically enable ASPM based on reported capabilities and known issues URR Disabled Enabled Enable or Disable PCI Express Unsupported Request Reporting FER Disabled Enabled Enable or Disable PCI Express Device Fatal Error Reporting NFER Disabled Enabled Enable or Disable PCI Express Device Non-Fatal Error Reporting CER Disabled Enabled Enable or Disable PCI Express Device Correctable Error Reporting CTO Disabled Enabled Enable or Disable PCI Express Completion Timer Timeout SEFE Disabled Enabled Enable or Disable Root PCI Express System Error on Fatal Error SENFE Disabled Enabled Enable or Disable Root PCI Express System Error on NonFatal Error SECE Disabled Enabled Enable or Disable Root PCI Express System Error on Correctable Error PME SCI Disabled Enabled Enable or Disable PCI Express PME SCI Hot Plug Disabled Enabled Enable or Disable PCI Express Hot Plug PCIe Speed Auto Gen1 Gen2 Configure PCIe Speed Extra Bus Reserved 0 Extra Bus Reserved (0-7) for bridges behind this Root Bridge Reserved Memory 10 Reserved Memory and Prefetchable Memory (1-20 MB) Range for this Root Bridge 120 COMe-bSC2 / BIOS Operation Reserved I/O 121 4 Reserved I/O (4k/8k(12k/16k/20k) Range for this Root Bridge COMe-bSC2 / BIOS Operation 8.4.4 Boot Feature Options Description Setup Prompt Timeout 1 Number of seconds to wait for setup activation key. 65535 (0xFFFF) means idefinite waiting. 0 means no wait (not recommended) Bootup NumLock State On Off Select the keyboard NumLock state Quiet Boot Disabled Enabled Enables/Disables Quiet Boot option (Boot logo) New HDD Priority Low High Boot priority for new connected HDD GateA20 Active Upon Request Always Upon Request: GA20 can be disabled using BIOS services. Always: do not allow disabling GA20; this option is useful when any RT code is executed above 1MB Option ROM Messages Force BIOS Keep Current Set display mode for Option ROM Interrupt 19 Capture Disabled Enabled Enabled: Allows Option ROMs to trap INT19 Boot Option #1 Boot Option #2 Boot Option #3 ... Boot Device Disabled Set the system boot order by device group Hard Drive BBS Priorities - Set the order of the legacy devices in this group CD/DVD ROM Drive BBS Priorities - Set the order of the legacy devices in this group Floppy Drive BBS Priorities - Set the order of the legacy devices in this group 122 COMe-bSC2 / BIOS Operation Boot Option Priority By default, AMI APTIO uses following boot priority if at least on device of a group is connected: Boot Option #1: Prio 1 Hard Disk Boot Option #2: Built-in EFI Shell Boot Option #3: Prio 1 HDD UEFI boot option Boot Option #4: Prio 1 CD/DVD ROM Drive Boot Option #5: Prio 1 Floppy UEFI boot option Boot Option #6: Prio 1 Floppy Drive HDD and CD/DVD-ROM group internal drive priority The internal device priority for Hard Disks and Optical drives is: 1. SATA #0-3 2. PATA 3. USB 123 COMe-bSC2 / BIOS Operation 8.4.5 Security Feature Options Description Set Administrator Password - Set the Administrator Password for Setup Access User Password - Set User Password HDDx - Set HDD Password 124 COMe-bSC2 / BIOS Operation Set HDD Password Feature Options Description Set User Password - Set HDD User Password. Advisable to Power Cycle System after Setting Hard Disk Passwords Set Master Password - Set HDD Master Password. Advisable to Power Cycle System after Setting Hard Disk Passwords 125 COMe-bSC2 / BIOS Operation 8.4.6 Save & Exit Feature Options Description Save Changes and Exit - Exit system setup after saving the changes Discard Changes and Exit - Exit system setup without saving any changes Save Changes and Reset - Reset system after saving the changes Discard Changes and Reset - Reset system without saving any changes Save Changes - Save changes made so far to any of the setup options Discard Changes - Discard changes made so far to any of the setup options Restore Defaults - Restore/Load Default values for all the setup options Save as User Defaults - Save the changes made so far as User Defaults Restore User Defaults - Restore the User Defaults to all the setup options Boot Override List of all boot options Boot directly from selected device . . . . . . . . .. . . . . . . . . . . 126 COMe-bSC2 / BIOS Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . 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