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Device NoDIR-091-033 Prepared date07-20-2005 Prepared byJaine Tsai
Technical Data Sheet
1.9mm Round Subminiature “Z-Bend” Lead Infrared LED
IR91-21C/F10
Features
Small double-end package
High reliability
Low forward voltage
Good spectral matching
to Si photodetector
Pb free
The product itself will remain within RoHS compliant version.
Descriptions
IR91-21C/F10 is an infrared emitting diode in miniature
SMD package which is molded in a water clear plastic with
spherical top view lens. The device is spectrally matched
with silicon photodiode and phototransistor.
Applications
PCB mounted infrared sensor
Infrared emitting for miniature light barrier
Floppy disk drive
Optoelectronic switch
Smoke detector
Device Selection Guide Chip
LED Part No. Material Lens Color
IR GaAlAs Water Clear
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Device NoDIR-091-033 Prepared date07-20-2005 Prepared byJaine Tsai
1.9± 0.2 2.5± 0.1
0.5± 0.1
2.2± 0.2
0.4± 0.1
1. 0.1 1. 0.1
0.15± 0.05
3.05± 0.2
4.3± 0.2
5.8± 0.2
0.65± 0.1
1.4± 0.1 1.3± 0.1
2.7± 0.1
R0.8± 0.1
0.75± 0.1
0.6+0.13
- 0
IR91-21C/F10
Package Dimensions
Notes: 1.All dimensions are in millimeters
2.Tolerances unless dimensions ±0.1mm
Absolute Maximum Ratings (Ta=25)
Parameter Symbol Rating Units
Continuous Forward Current IF 65 mA
Peak Forward Current IFP 1.0 A
Reverse Voltage VR 5 V
Operating Temperature Topr -40 ~ +85
Storage Temperature Tstg -40 ~ +85
Soldering Temperature Tsol 260
Power Dissipation at(or below)
25Free Air Temperature Pd 130 mW
Notes: *1:IFP Conditions--Pulse Width100μs and Duty1%.
*2:Soldering time5 seconds.
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Device NoDIR-091-033 Prepared date07-20-2005 Prepared byJaine Tsai
IR91-21C/F10
Electro-Optical Characteristics (Ta=25)
Parameter Symbol Condition Min. Typ. Max. Units
IF=20mA 3.0 5.0
Radiant Intensity Ee IF=100mA
Pulse Width100μs ,Duty1% -- 25 --
mW /sr
Peak Wavelength λp IF=20mA -- 940 -- nm
Spectral Bandwidth Δλ IF=20mA -- 45 -- nm
IF=20mA -- 1.2 1.5
IF=100mA
Pulse Width100μs ,Duty1% -- 1.4 1.8
Forward Voltage VF
IF=1A -- 2.6 4.0
V
Reverse Current IR VR=5V -- -- 10
μA
View Angle 2θ1/2 IF=20mA -- 25 -- deg
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Device NoDIR-091-033 Prepared date07-20-2005 Prepared byJaine Tsai
0-25 0 4020 60 10080
20
40
60
100
80
120
140
75
-25 025 50 100
900
920
940
960
980
0
20
40
60
80
100 IF=20mA
Ta=25° C
880 980
900 920 940 960 1020
1000 1040
0
10
101
102
3
104
1234
IR91-21C/F10
Typical Electro-Optical Characteristics Curves
Fig.1 Forward Current vs. Fig.2 Spectral Distribution
Ambient Temperature
Fig.3 Peak Emission Wavelength Fig.4 Forward Current
Ambient Temperature vs. Forward Voltage
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Device NoDIR-091-033 Prepared date07-20-2005 Prepared byJaine Tsai
1
IF-Forward Current
(
mA
)
10
10010
110
23
104
Ie-Radiant Intensity(mW/sr)
10
100
1000
25 50 75 100 120
IF=20mA
1
3
5
7
25
1
1.1
1.2
1.3
50 75 100 120
IF=20mA
-20
0.6
0.9
0.7
0.8
1.0
0.20.4 0 0.2 0.4 0.6
50
70
80
60
40
30
-10 02010
IR91-21C/F10
Typical Electro-Optical Characteristics Curves
Fig.5 Relative Intensity vs. Fig.6 Relative Radiant Intensity vs.
Forward Current Angular Displacement
Fig.7 Relative Intensity vs. Fig.8 Forward Voltage vs.
Ambient Temperature(°C) Ambient Temperature(°C)
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Device NoDIR-091-033 Prepared date07-20-2005 Prepared byJaine Tsai
IR91-21C/F10
Precautions For Use
1. Over-current-proof
Customer must apply resistors for protection , otherwise slight voltage shift will cause big
current change ( Burn out will happen ).
2. Storage
2.1 Do not open moisture proof bag before the products are ready to use.
2.2 Before opening the package, the LEDs should be kept at 30 or less and 90%RH or less.
2.3 The LEDs should be used within a year.
2.4 After opening the package, the LEDs should be kept at 30 or less and 70%RH or less.
2.5 The LEDs should be used within 168 hours (7 days) after opening the package.
2.6 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
Baking treatment : 60±5 for 24 hours.
3. Soldering Condition
3.1 Pb-free solder temperature profile
3.2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
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Device NoDIR-091-033 Prepared date07-20-2005 Prepared byJaine Tsai
IR91-21C/F10
4.Soldering Iron
Each terminal is to go to the tip of soldering iron temperature less than 280 for 3
seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more
intervals, and do soldering of each terminal. Be careful because the damage of the product is often
started at the time of the hand solder.
5.Repairing
Repair should not be done after the LEDs have been soldered. When repairing is
unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed
beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
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Device NoDIR-091-033 Prepared date07-20-2005 Prepared byJaine Tsai
IR91-21C/F10
Reliability Test Item And Condition
The reliability of products shall be satisfied with items listed below.
Confidence level90%
LTPD10%
NO. Item Test Conditions Test Hours/
Cycles
Sample
Sizes
Failure
Judgement
Criteria
Ac/Re
1 REFLOW Soldering TEMP.260℃±5
5secs
6Mins 22pcs 0/1
2 Temperature Cycle H : +100 15mins
5mins
L : -40 15mins
50Cycles 22pcs 0/1
3 Thermal Shock H :+100 5mins
10secs
L :-10 5mins
50Cycles 22pcs 0/1
4 High Temperature
Storage
TEMP.+100 1000hrs 22pcs 0/1
5 Low Temperature
Storage
TEMP.-40 1000hrs 22pcs 0/1
6 DC Operating Life IF=20mA 1000hrs 22pcs 0/1
7 High Temperature/
High Humidity
85 / 85% R.H 1000hrs 22pcs
IRU×2
EeL×0.8
VFU×1.2
UUpper
Specification
Limit
LLower
Specification
Limit
0/1
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Device NoDIR-091-033 Prepared date07-20-2005 Prepared byJaine Tsai
RoHS
IR91-21C/F10
Packing Quantity Specification
1.1000PCS/1Bag20Bags/1Box
2.10Boxes/1Carton
Label Form Specification
CPN: Customer’s Production Number
P/N : Production Number
QTY: Packing Quantity
CAT: Ranks
HUE: Peak Wavelength
REF: Reference
LOT No: Lot Number
MADE IN TAIWAN: Production Place
Notes
1. Above specification may be changed without notice. EVERLIGHT will reserve authority on
material change for above specification.
2. When using this product, please observe the absolute maximum ratings and the instructions
for using outlined in these specification sheets. EVERLIGHT assumes no responsibility for
any damage resulting from use of the product which does not comply with the absolute
maximum ratings and the instructions included in these specification sheets.
3. These specification sheets include materials protected under copyright of EVERLIGHT
corporation. Please don’t reproduce or cause anyone to reproduce them without
EVERLIGHT’s consent.
EVERLIGHT ELECTRONICS CO., LTD. Tel: 886-2-2267-2000, 2267-9936
Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Fax: 886-2267-6244, 2267-6189, 2267-6306
Tucheng, Taipei 236, Taiwan, R.O.C http:\\www.everlight.com
IR91-21C/F10