CPC1008N Single-Pole, Normally Open 4-Pin SOP OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 100 150 8 Units VP mArms / mADC Features * 1500Vrms Input/Output Isolation * Small 4-Pin SOP Package * Low Drive Power Requirements * High Reliability * Arc-Free With No Snubbing Circuits * No EMI/RFI Generation * Halogen-Free * Tape & Reel Version Available * Flammability Rating UL 94 V-0 Description CPC1008N is a miniature, low-voltage, low on-resistance, single-pole, normally open (1-Form-A) solid state relay in a 4-Pin SOP package. It uses IXYS Integrated Circuits Division's patented, optically coupled, OptoMOS architecture to provide 1500Vrms of input/output isolation. Using IXYS Integrated Circuits Division's state of the art double-molded vertical construction packaging, the CPC1008N is one of the world's smallest relays. It is ideal for replacing larger, less-reliable reed and electromechanical relays. Applications * Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Meters (Watt-Hour, Water, Gas) * Medical Equipment--Patient/Equipment Isolation * Security Systems * Aerospace * Industrial Controls * Reed Relay Replacement Approvals * UL Recognized Component: File E76270 * CSA Certified Component: Certificate 1172007 * EN/IEC 60950-1 Certified Component: Certificate B 13 12 82667 003 Ordering Information Part # CPC1008N CPC1008NTR Description 4-Pin SOP (100/tube) 4-Pin SOP (2000/reel) Pin Configuration + Control - Control 1 4 Load 3 2 Load Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton DS-CPC1008N-R11 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC1008N Absolute Maximum Ratings @ 25C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Ratings Units 100 5 50 1 Input Power Dissipation 70 Total Power Dissipation 1 400 Isolation Voltage, Input to Output (60 Seconds) 1500 Operational Temperature -40 to +85 Storage Temperature -40 to +125 1 VP V mA A mW mW Vrms C C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements Derate linearly 3.33 mW / C Electrical Characteristics @ 25C Parameter Conditions Symbol Output Characteristics Load Current Continuous 1 IL Peak t=10ms ILPK On-Resistance 2 IL=150mA RON Off-State Leakage Current VL=100VP ILEAK Switching Speeds ton Turn-On IF=5mA, VL=10V Turn-Off toff COUT Output Capacitance IF=0mA, VL=50V, f=1MHz Input Characteristics Input Control Current to Activate 3 IL=150mA IF Input Control Current to Deactivate IF Input Voltage Drop IF=5mA VF IR Reverse Input Current VR=5V Common Characteristics Capacitance, Input to Output VIO=0V, f=1MHz CIO 1 2 3 2 Min Typ Max Units - 4.8 - 150 350 8 1 mArms / mADC mAP - 1 0.17 6 2 1 - 0.2 0.9 - 0.45 1.2 - 2 1.5 10 mA mA V A - 1 - pF A ms pF Load current derates linearly from 150mA @ 25oC to 120mA @ 85oC. Measurement taken within 1 second of on time. For high temperature operation (>60C) a minimum LED drive current of 4mA is recommended. www.ixysic.com R11 INTEGRATED CIRCUITS DIVISION CPC1008N PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) Device Count (N) Device Count (N) 20 20 15 10 5 15 10 5 1.250 1.255 1.260 1.265 1.270 LED Forward Voltage (V) 0.85 1.275 Typical IF for Switch Operation (N=50, IL=100mA) 10 5 0.38 0.40 0.42 0.45 0.47 LED Current (mA) 0.50 10 5 Typical Blocking Voltage Distribution (N=50) 20 1.1 1.0 -40 -20 4.8 5.0 5.2 On-Resistance (:) 5.4 20 40 60 Temperature (C) 80 5 5.6 106 2.5 0.25 2.0 0.20 1.5 1.0 0.5 112 115 118 121 Blocking Voltage (VP) 124 0.15 0.10 0.05 0.00 0 100 109 Typical Turn-Off Time vs. LED Forward Current 0.0 0 Typical IF for Switch Operation vs. Temperature (IL=120mA) 1.0 4.6 Turn-Off Time (ms) Turn-On Time (ms) 1.2 IF=50mA IF=20mA IF=10mA IF=5mA IF=2mA 10 Typical Turn-On Time vs. LED Forward Current 1.6 1.3 15 0 4.4 Typical LED Forward Voltage Drop vs. Temperature 1.4 5 0.166 0.168 0.170 0.172 0.174 0.176 0.178 Turn-Off Time (ms) 15 0.53 1.5 10 1.15 0 0 LED Forward Voltage (V) 0.95 1.00 1.05 1.10 Turn-On Time (ms) Device Count (N) Device Count (N) Device Count (N) 15 0.90 Typical On-Resistance Distribution (N=50, IF=2mA, IL=150mA) 20 20 15 0 0 0 Typical Turn-Off Time (N=50, IF=5mA, IL=100mA) 20 Device Count (N) 25 Typical Turn-On Time (N=50, IF=5mA, IL=100mA) 10 20 30 LED Current (mA) 40 50 0 10 20 30 LED Current (mA) 40 50 Typical Turn-Off Time vs. Temperature Typical Turn-On Time vs. Temperature 1.0 1.6 0.6 0.4 0.2 1.2 Turn-Off Time (ms) 0.8 Turn-On Time (ms) LED Current (mA) 1.4 IF=5mA 1.0 0.8 0.6 IF=10mA 0.4 0.8 IF=10mA IF=5mA 0.6 0.4 0.2 0.2 0.0 0.0 0.0 -40 -20 0 20 40 60 Temperature (C) 80 100 -40 -20 0 20 40 60 Temperature (C) 80 100 -40 -20 0 20 40 60 Temperature (C) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. R11 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1008N PERFORMANCE DATA* Typical On-Resistance vs. Temperature (IF=2mA, IL=120mA) 10 Typical Load Current vs. Load Voltage (IF=2mA) 200 160 6 4 2 Load Current (mA) Load Current (mA) On-Resistance (:) 150 8 100 50 0 -50 -100 -40 -20 0 20 40 60 Temperature (C) 80 -200 -1.0 100 118 20 116 114 112 0.0 0.5 Load Voltage (V) -40 -20 0 20 40 60 Temperature (C) 80 -40 Typical Leakage vs. Temperature (VL=100V) -20 10 0 20 40 60 Temperature (C) 80 100 Output Capacitance vs. Load Voltage (IF=2mA, f=1MHz) 50 15 100 120 1.0 0 108 130 100 -0.5 5 110 140 Output Capacitnace (pF) 25 Leakage (nA) Blocking Voltage (VP) Typical Blocking Voltage vs. Temperature 120 150 110 -150 0 Maximum Load Current vs. Temperature (IF=5mA) 40 30 20 10 0 -40 -20 0 20 40 60 Temperature (C) 80 100 10s 100s 0 20 40 60 Load Voltage (V) 80 100 Energy Rating Curve Load Current (A) 1.0 0.8 0.6 0.4 0.2 0.0 10Ps 100Ps 1ms 10ms 100ms Time (s) 1s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R11 INTEGRATED CIRCUITS DIVISION CPC1008N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1008N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)C or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (Tc) Dwell Time (tp) Max Reflow Cycles CPC1008N 260C 30 seconds 3 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R11 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1008N MECHANICAL DIMENSIONS CPC1008N 4.089 0.025 (0.161 0.001) Recommended PCB Land Pattern 0.203 Typ (0.008 Typ) 0.55 (0.022) 6.096 0.102 (0.240 0.004) 3.810 0.025 (0.150 0.001) 0.559 0.127 (0.022 0.005) 5.50 (0.217) 0.910 0.025 (0.036 0.001) Pin 1 2.54 Typ (0.100 Typ) 1.45 (0.057) 2.030 0.025 (0.080 0.001) 2.54 (0.10) Pin to package standoff: 0.064 0.040 (0.0025 0.0015) 0.481 (0.019) 0-0.1 (0-0.004) Dimensions mm (inches) 0.381 TYP. (0.015 TYP.) CPC1008NTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=12.00 (0.472) B0=4.70 (0.185) K0=2.70 (0.106) K1=2.30 (0.091) P=8.00 (0.315) A0=6.50 (0.256) User Direction of Feed Dimensions mm (inches) Embossed Carrier Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division's Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC1008N-R11 (c)Copyright 2017, IXYS Integrated Circuits Division OptoMOS(R) is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 5/25/2017