SPEC NO. 05-08-5014 REV. U RH1014M, QUAD PRECISION OPERATIONAL AMPLIFIER
LINEAR TECHNOLOGY CORPORATION Page 1 of 18
REVISION RECORD
REV
DESCRIPTION
DATE
0
INITIAL RELEASE
06/12/96
A
PAGE 2, ADDED PARAGRAPHS 3.2.1 AND 3.2.2 TO IDENTIFY “01” AND “02” AS PACKAGE
OPTIONS. CHANGED THE PART NUMBER FROM”RH1014MWB14 TO “RH1014MWB”.
PAGE 5, PARAGRAPH 5.6.10, NOTE – CORRECTED TYPO ON ITEM PARAGRAPH NUMBER
FROM”4.6.1” TO”5.6.1” AND “4.6.10” TO “5.6.10”.
PAGE 6 AND 7 – ADDED θja AND θjc , Tj MAX TO CASE OUTLINES. CHANGED THE “WB14”
TO “WB” ON FIGURE 2 CASE OUTLINE.
PAGE 8 – CHANGED TERMINAL CONNECTIONS DWG FOR “WB” PACKAGE, OPTION 2.
05/12/97
B
PAGE 4, PARAGRAPH 5.4.2, GROUP B INSPECTION WAS REDEFINED. PARAGRAPH 5.4.3,
GROUP D INSPECTION WAS REDEFINED.
PARAGRAPH 5.5.1, SOURCE INSPECTION WAS REDEFINED.
PAGE 8, FIGURE 4 – CORRECTED TYPO ON PIN 11 CONNECTION: SHOULD BE “V-“.
10/08/97
C
PAGE 2, PARAGRAPH 3.2.2 – CHANGED PACKAGE TYPE FROM 14 LEAD BOTTOM BRAZED
FLATPACK TO 14 LEAD FLATPACK, GLASS SEAL.
PAGE 3, ADDED PARAGRAPH 3.8.1 AND 3.8.2
PAGE 7, FIGURE 2, PAGE 8, FIGURE 4, PAGE 11, FIGURE 7, PAGE 12, FIGURE 8, CHANGED
PACKAGE TYPE FROM 14 LEAD BOTTOM BRAZED FLATPACK TO 14 LEAD CERPAK.
11/25/97
D
PAGE 16, CHANGED VOS MIN DELTA LIMIT FROM –60 µV TO –200 µV, AND CHANGED VOS
MAX DELTA LIMIT FROM 60 µV TO 200 µV.
12/18/97
E
PAGE 2, WAS ADDED TO ACCOMMODATE REVISION RECORD.
PAGE 4, CORRECTED OPTION NUMBER FROM ”02” to “01”, PARA 3.8.1 AND CORRECTED
OPTION NUMBER FROM ”03” TO “02”, PARA 3.8.2.
PAGE 5, AMENDED PARAGRAPHS 4.1 AND 4.1.1. TAKING EXCEPTION TO ANALYSIS OF
CATASTROPHIC FAILURES.
03/13/98
F
PAGE 17, CHANGED DELTA LIMITS ON +IB FROM –3 AND 3 TO –4 AND 4.
CHANGED DELTA LIMITS ON –IB FROM –3 AND 3 TO –4 AND 4.
05/15/98
G
PAGE 8, CORRECTED PACKAGE OUTLINE DRAWING FOR FIGURE 2 CASE OUTLINE, (W)
FLAT PACK 14 LEAD GLASS SEAL.
01/11/99
H
PAGE 7, 8, FIGURE 1, 2, CHANGED θja AND θjc.
09/29/99
J
PAGE 3, PARAGRAPH 3.2.1, 3.2.2, HAD FIGURES 1 AND 2 REMOVED.
PAGE 4, PARAGRAPH 3.7 CHANGED VERBIAGE FROM “SPECIFIED IN TABLE III” TO “AND
AS SPECIFIED IN TABLE III HEREIN”, LINE 2. PARAGRAPH 3.9, ADDED “HEREIN” AFTER
“TABLE II”, LINE 2.
PAGE 5, PARAGRAPH 4.3, ADDED “HEREIN” AFTER “TABLE III”, LINE 2. PARAGRAPH 4.4.1,
ADDED “HEREIN” AFTER “TABLE II”, LINE 2.
CONTINUED ON NEXT PAGE…
11/17/99
REVISION RECORD AND DESCRIPTION CONTINUED ON NEXT PAGE.
CAUTION: ELECTROSTATIC DISCHARGE SENSITIVE PART
REVISION
PAGE NO.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
INDEX
REVISION
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
REVISION
PAGE NO.
18
INDEX
REVISION
U
ORIG
LINEAR TECHNOLOGY CORPORATION
DSGN
MILPITAS, CALIFORNIA
ENGR
TITLE:
MFG
MICROCIRCUIT, LINEAR,
CM
RH1014M, QUAD PRECISION
QA
OPERATIONAL AMPLIFIER
PROG
SIZE
CAGE
CODE
DRAWING
NUMBER
REV
FUNCT
64155
05-08-5014
U
APPLICATION
SIGNOFFS
DATE
CONTRACT:
FOR OFFICIAL USE ONLY
SPEC NO. 05-08-5014 REV. U RH1014M, QUAD PRECISION OPERATIONAL AMPLIFIER
LINEAR TECHNOLOGY CORPORATION Page 2 of 18
REVISION RECORD
REV
DESCRIPTION
DATE
J
PARAGRAPH 4.4.2.2, CHANGED VERBIAGE I LINE 1 FROM “ALL FOOTNOTES OF TABLE IIA OF
MIL-STD-883” TO “ALL FOOTNOTES PERTAINING TO TABLE IIA IN MIL-STD-883”.
PARAGRAPH 4.4.3.2, CHANGED VERBIAGE IN LINE 1 FROM “ALL FOOTNOTES OF TABLE IV OF
MIL-STD-883” TO “ALL FOOTNOTES PERTAINING TO TABLE IV IN MIL-STD-883”.
11/17/99
K
PAGE 8, CHANGED THETA JA TO θJA=160C/W AND THETA JC TO θJC=40C/W FROM
θJA=160C/W, θJC=40C/W.
08/30/00
L
CORRECTION TO REVISION K, REVISION RECORD. SHOULD BE PAGE 8, CHANGED THETA
JA TO θJA=160C/W AND THETA JC TO θJC=40C/W FROM θJA=165C/W, θJC=13C/W.
ADDED PAGE 3 WAS ADDED TO ACCOMMODATE REVISION RECORDS.
CONVERSION FROM WORD PERFECT TO MICROSOFT WORD. REDUCED SPEC PAGES TO
14 TOTAL.
PAGE 4:
PARAGRAPH 3.2.1 AND 3.2.2, ADDED THE WORD “OPTION” PRECEDING THE NUMBER OF EACH
LTC PART NUMBER FOR BETTER CUSTOMER ORDERING CONVENIENCE.
PAGE 5:
PARAGRAPH 3.6, CHANGED “TABLE IA” TO “TABLE II”.
PARAGRAPH 3.7, CHANGED “TABLE III” TO “TABLE IV”.
PARAGRAPHS 3.8.1 AND 3.8.2, ADDED THE PACKAGE TYPES AND OPTIONS AFTER EACH
FIGURE.
PARAGRAPH 3.9, CHANGED “TABLE II” TO “TABLE III”.
PARAGRAPHS 3.10.1 AND 3.10.2, ADDED THE PACKAGE TYPES AFTER EACH FIGURE.
PARAGRAPHS 3.10.3, REMOVED REFERENCE TO GOLD PLATED (WB) PACKAGE.
PARAGRAPH 3.11.1 WAS CHANGED FROM “…dosage rate of approximately 20 Rads per
second” TO “…dosage rate of less than or equal to 10 Rads per second”.
PAGE 6:
PARAGRAPHS 4.1 THROUGH 4.4.2.1 CHANGES WERE DONE TO CLARIFY GROUP SAMPLING.
PAGE 7:
PARAGRAPH 4.4.3 CHANGE WAS DONE TO CLARIFY GROUP SAMPLING.
PARAGRAPHS 4.5 THROUGH 4.5.2, CHANGED PARAGRAPH NUMBERS FROM “5.Ø” TO “4.5”.
PARAGRAPHS 4.6 THROUGH 4.6.10, CHANGED PARAGRAPH NUMBERS FROM “6.Ø” TO “4.6
THROUGH “4.6.10”
PARAGRAPHS 4.6.2 THROUGH 4.6.4 WERE RE-WRITTEN. THESE DATA PROVIDED, AND DATA
AVAILABLE.
PARAGRAPH 4.6.10 NOTE, ADDED FURTHER EXPLANATION OF MINIMUM DELIVERED DATA.
03/26/02
SPEC NO. 05-08-5014 REV. U RH1014M, QUAD PRECISION OPERATIONAL AMPLIFIER
LINEAR TECHNOLOGY CORPORATION Page 3 of 18
REVISION RECORD
REV
DESCRIPTION
DATE
L
PARAGRAPH 5.Ø CHANGED PARAGRAPH NUMBER FROM “7.Ø” TO “5.Ø”.
PAGES 8 THROUGH 15, ALL FIGURE TITLES CHANGED TO HAVE DEVICE OPTIONS AND
PACKAGE TYPES AT TOP OF PAGE, AND HAVE ALL FIGURES AT BOTTOM OF PAGE.
PAGE 12, NOTE 2 WAS CHANGED FROM 171C TO +152C, NOTE 3 WAS CHANGED FROM
150C TO +125C, NOTE 4 HAD A FREQUENCY LIMIT ADDED, NOTES 5 AND 6 WERE
DELETED AND REPLACE WITH A NEW NOTE 5.
PAGES 16 THROUGH 18, SCANNED DIRECTLY FROM DATA SHEET.
3/26/02
M
PAGE 1:
CORRECTED THE CAGE CODE NUMBER FROM 94155 TO 64155.
PAGE 9:
CORRECTED OPTION 2, FIGURE 2 HEADER, CASE OUTLINE, FROM W10 GLASS SEALED
FLATPACK / 10 LEADS CASE OUTLINE TO W14 GLASS SEALED FLATPACK / 14 LEADS CASE
OUTLINE.
PAGE 10:
CORRECTED OPTION 2, FIGURE 4, TERMINAL CONNECTION, FROM WB PACKAGE 14-
LEAD METAL SEALED BOTTOM BRAZED TO W PACKAGE 14 LEAD FLATPACK GLASS
SEALED.
5/30/02
N
PAGE 5:
CHANGED INITIAL RATE OF RADS TO 240 RADS/SEC.
3/16/05
P
PAGE 6, CHANGED IN BOTH PARAGRAPHS 4.2, 4.3 IN CONJUNCTION TO 3.3 CHANGED
TO 3.4 AND PARAGRAPH 4.3 CHANGED 3.1.1 TO 3.1 AND 3.2.1 TO 3.1.1
12/10/07
R
PAGE 5, PARAGRAPH 3.103 CHANGED TO ALLOY 42 PACKAGE REQUIREMENT.
PARAGRAPH 3.11.1 CHANGED VERBIAGE.
05/01/08
S
PAGE 5, ADDED PARAGRAPH 3.10 FOR 60 TEMP. CYCLES AT EOL. REST OF THE
PARAGRAPHS WERE RE-NUMBERED.
02/12/09
T
PAGE 12, CORRECTED BURN-IN NEGATAIVE VOLTAGE FROM V1 TO V2.
03/08/12
U
Changed the +IB and -IB ‘Max Endpoint Limit’ from 0 to +30 on page 18.
SPEC NO. 05-08-5014 REV. U RH1014M, QUAD PRECISION OPERATIONAL AMPLIFIER
LINEAR TECHNOLOGY CORPORATION Page 4 of 18
1.0 SCOPE:
1.1 This specification defines the performance and test requirements for a microcircuit processed to a space
level manufacturing flow.
2.0 APPLICABLE DOCUMENTS:
2.1 Government Specifications and Standards: the following documents listed in the Department of Defense
Index of Specifications and Standards, of the issue in effect on the date of solicitation, form a part of this
specification to the extent specified herein.
SPECIFICATIONS:
MIL-PRF-38535 Integrated Circuits (Microcircuits) Manufacturing, General Specification for
MIL-STD-883 Test Method and Procedures for Microcircuits
MIL-STD-1835 Microcircuits Case Outlines
2.2 Order of Precedence: In the event of a conflict between the documents referenced herein and the contents
of this specification, the order of precedence shall be this specification, MIL-PRF-38535 and other
referenced specifications.
3.0 REQUIREMENTS:
3.1 General Description: This specification details the requirements for the RH1014, Operational Amplifier,
processed to space level manufacturing flow.
3.2 Part Number:
3.2.1 Option 1 – RH1014MJ (CERDIP, 14 LEAD)
3.2.2 Option 2 – RH1014MW (FLATPACK, GLASS SEAL, 14 LEAD)
3.3 Part Marking Includes:
3.3.1 LTC Logo
3.3.2 LTC Part Number (See Paragraph 3.2)
3.3.3 Date Code
3.3.4 Serial Number
3.3.5 ESD Identifier per MIL-PRF-38535, Appendix A
SPEC NO. 05-08-5014 REV. U RH1014M, QUAD PRECISION OPERATIONAL AMPLIFIER
LINEAR TECHNOLOGY CORPORATION Page 5 of 18
3.4 The Absolute Maximum Ratings:
Supply Voltage
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
+22V
Differential Input Voltage
.
.
.
.
.
.
.
.
.
.
+30V
Input Voltage
.
.
.
.
.
.
.
.
.
Equal to Positive Supply Voltage
.
.
.
.
.
.
.
.
5V Below Negative Supply Voltage
Output Short Circuit Duration 1/
.
.
.
.
.
.
.
.
.
.
.
Indefinite
Operating Temperature Range
.
.
.
.
.
.
.
.
.
.
.
-55C to 125C
Storage Temperature Range
.
.
.
.
.
.
.
.
.
.
.
.
-65C to 150C
Lead Temperature (Soldering, 10 sec.)
.
.
.
.
.
.
.
.
.
300C
1/ Parameter is guaranteed by design, characterization, or correlation to other
tested parameters.
3.5 Electrostatic discharge sensitivity, ESDS, shall be Class 1.
3.6 Electrical Performance Characteristics: The electrical performance characteristics shall be as specified in
Table I and Table II.
3.7 Electrical Test Requirements: Screening requirements shall be in accordance with 4.1 herein,
MIL-STD-883, Method 5004, and as specified in Table IV herein.
3.8 Burn-In Requirement:
3.8.1 Option 1 (Ceramic Dip) Static Burn-In, Figure 5; Dynamic Burn-In, Figure 6.
3.8.2 Option 2 (Glass Sealed Flatpack) : Static Burn-In, Figure 7; Dynamic Burn-In, Figure 8.
3.9 Delta Limit Requirement: Delta limit parameters are specified in Table III herein, are calculated after each
burn-in, and the delta rejects are included in the PDA calculation.
3.10 Part Number Option 2: The manufacturer performs 60 Temperature Cycles per MIL-STD-883, TM1010,
Condition C at end of line testing.
3.11 Design, Construction, and Physical Dimensions: Detail design, construction, physical dimensions, and
electrical requirements shall be specified herein.
3.11.1 Mechanical / Packaging Requirements: Case outlines and dimensions are in accordance with
Figure 1 (Ceramic Dip/14 Leads) and Figure 2 (Glass Sealed Flatpack/14 Leads).
3.11.2 Terminal Connections: The terminal connections shall be as specified in Figure 3 (Ceramic
Dip/14 Leads) and Figure 4 (Glass Sealed Flatpack/14 Leads).
3.11.3 Lead Material and Finish: The lead material shall be Alloy 42 for option 1, 2. The lead finishes
shall be hot solder dip (Finish letter A) in accordance with MIL-PRF-38535.
3.12 Radiation Hardness Assurance (RHA):
3.12.1 The manufacturer shall perform a lot sample test as an internal process monitor for total dose
radiation tolerance. The sample test is performed with MIL-STD-883 TM1019 Condition A as
a guideline.
SPEC NO. 05-08-5014 REV. U RH1014M, QUAD PRECISION OPERATIONAL AMPLIFIER
LINEAR TECHNOLOGY CORPORATION Page 6 of 18
3.12.2 For guaranteed radiation performance to MIL-STD-883, Method 1019, total dose irradiation,
the manufacturer will provide certified RAD testing and report through an independent test
laboratory when required as a customer purchase order line item.
3.12.3 Total dose bias circuit is specified in Figure 9.
3.13 Wafer Lot Acceptance: Wafer lot acceptance shall be in accordance with MIL-PRF-38535, Appendix A,
except for the following: Topside glassivation thickness shall be a minimum of 4KÅ.
3.14 Wafer Lot Acceptance Report: SEM is performed per MIL-STD-883, Method 2018 and copies of SEM
photographs shall be supplied with the Wafer Lot Acceptance Report as part of a Space Data Pack when
specified as a customer purchase order line item.
4.0 VERIFICATION (QUALITY ASSURANCE PROVISIONS)
4.1 Quality Assurance Provisions: Quality Assurance provisions shall be in accordance with MIL-PRF-38535.
Linear Technology is a QML certified company and all Rad Hard candidates are assembled on qualified
Class S manufacturing lines.
4.2 Sampling and Inspection: Sampling and Inspection shall be in accordance with MIL-STD-883, Method
5005 with QML allowed and TRB approved deviations in conjunction with paragraphs 3.1.1, 3.2.1, and
3.4 of the test method.
4.3 Screening: Screening requirements shall be in accordance with MIL-STD-883, Method 5004 with QML
allowed and TRB approved deviations in conjunction with paragraphs 3.1, 3.1.1, and 3.4 of the test
method. Electrical testing shall be as specified in Table IV herein.
4.3.1 Analysis of catastrophic (open/short) failures from burn-in will be conducted only when a lot fails
the burn-in or re-burn-in PDA requirements.
4.4 Quality Conformance Inspection: Quality conformance inspection shall be in accordance with 4.2 and 4.3
herein and as follows:
4.4.1 Group A Inspection: Group A inspection shall be performed in accordance with 4.1 herein, per
MIL-STD-883, Method 5005, and specified in Table IV herein.
4.4.2 Group B Inspection: When purchased, a full Group B is performed on an inspection lot. As a
minimum, Subgroup B2 (Resistance to Solvents / Mark Permanency) and Subgroup B3
(Solderability) are performed prior to the first shipment from any inspection lot and Attributes
provided when a Full Space Data Pack is ordered. Subgroup B5 (Operating Life) is performed on
each wafer lot. This subgroup may or may not be from devices built in the same package style as
the current inspection lot. Attributes and variables data for this subgroup will be provided upon
request at no charge.
4.4.2.1 Group B, Subgroup 2c = 10% Group B, Subgroup 5 = *5%
(*per wafer or inspection lot
Group B, Subgroup 3 = 10% whichever is the larger quantity)
Group B, Subgroup 4 = 5% Group B, Subgroup 6 = 15%
4.4.2.2 All footnotes pertaining to Table IIa in MIL-STD-883, Method 5005 apply. The quantity
(accept number) of all other subgroups are per MIL-STD-883, Method 5005, Table IIa.
SPEC NO. 05-08-5014 REV. U RH1014M, QUAD PRECISION OPERATIONAL AMPLIFIER
LINEAR TECHNOLOGY CORPORATION Page 7 of 18
4.4.3 Group D Inspection: When purchased, a full Group D is performed on an inspection lot. As a
minimum, periodic full Group D sampling is performed on each package family for each assembly
location every 26 weeks. A generic Group D Summary is provided when a full Space Data Pack is
ordered.
4.4.3.1 Group D, Subgroups 3, 4 and 5 = 15% each (Sample Size Series).
4.4.3.2 All footnotes pertaining to Table IV in MIL-STD-883, Method 5005 apply. The
quantity (accept number) or sample number and accept number of all other subgroups
are per MIL-STD-883, Method 5005, Table IV.
4.5 Source Inspection:
4.5.1 The manufacturer will coordinate Source Inspection at wafer lot acceptance and pre-seal internal
visual.
4.5.2 The procuring activity has the right to perform source inspection at the supplier’s facility prior to
shipment for each lot of deliverables when specified as a customer purchase order line item. This
may include wafer lot acceptance and final data review.
4.6 Deliverable Data: Deliverable data that will ship with devices when a Space Data Pack is ordered:
4.6.1 Lot Serial Number Sheets identifying all devices accepted through final inspection by serial
number.
4.6.2 100% attributes (completed lot specific traveler; includes Group A Summary)
4.6.3 Burn-In Variables Data and Deltas (if applicable)
4.6.4 Group B2, B3, and B5 Attributes (Variables data, if performed on lot shipping)
4.6.5 Generic Group D data (4.4.3 herein)
4.6.6 SEM photographs (3.13 herein)
4.6.7 Wafer Lot Acceptance Report (3.13 herein)
4.6.8 X-Ray Negatives and Radiographic Report
4.6.9 A copy of outside test laboratory radiation report if ordered
4.6.10 Certificate of Conformance certifying that the devices meet all the requirements of this
specification and have successfully completed the mandatory tests and inspections herein.
Note: Items 4.6.1 and 4.6.10 will be delivered as a minimum, with each shipment. This is noted
on the Purchase Order Review Form as “No Charge Data”.
5.0 Packaging Requirements: Packaging shall be in accordance with Appendix A of MIL-PRF-38535. All devices
shall be packaged in conductive material or packaged in anti-static material with an external conductive field
shielding barrier.
SPEC NO. 05-08-5014 REV. U RH1014M, QUAD PRECISION OPERATIONAL AMPLIFIER
LINEAR TECHNOLOGY CORPORATION Page 8 of 18
DEVICE OPTION 1
CERAMIC DIP / 14 LEADS CASE OUTLINE
NOTE: 1. LEAD DIMENSIONS APPLY TO SOLDER DIP OR TIN PLATE LEADS.
2. THIS DIMENSION ALLOWS FOR OFF-CENTER LID, MENISCUS, AND GLASS OVERRUN.
FIGURE 1
θja = 95C/W
θjc = 25C/W
Tj Max = 174C
LEAD COUNT, N
D MAX
14
Ø.785 (19.939)
SPEC NO. 05-08-5014 REV. U RH1014M, QUAD PRECISION OPERATIONAL AMPLIFIER
LINEAR TECHNOLOGY CORPORATION Page 9 of 18
DEVICE OPTION 2
W14, GLASS SEALED FLATPACK / 14 LEADS CASE OUTLINE
NOTE: 1. THIS DIMENSION ALLOWS FOR OFF-CENTER
LID, MENISCUS AND GLASS OVER RUN.
NOTE: 2. INCREASE DIMENSION BY 0.003 INCH WHEN
LEAD FINISH IS APPLIED (SOLDER DIPPED).
θja = +160C/W
θjc = +40C/W
FIGURE 2
SPEC NO. 05-08-5014 REV. U RH1014M, QUAD PRECISION OPERATIONAL AMPLIFIER
LINEAR TECHNOLOGY CORPORATION Page 10 of 18
TERMINAL CONNECTIONS
OPTION 1, CERAMIC DIP / 14 LEAD
FIGURE 3
OPTION 2, GLASS SEALED FLATPACK / 14 LEADS
FIGURE 4
SPEC NO. 05-08-5014 REV. U RH1014M, QUAD PRECISION OPERATIONAL AMPLIFIER
LINEAR TECHNOLOGY CORPORATION Page 11 of 18
STATIC BURN-IN CIRCUIT
OPTION 1, CERAMIC DIP / 14 LEADS
FIGURE 5
SPEC NO. 05-08-5014 REV. U RH1014M, QUAD PRECISION OPERATIONAL AMPLIFIER
LINEAR TECHNOLOGY CORPORATION Page 12 of 18
DYNAMIC BURN-IN CIRCUIT
OPTION 1, CERAMIC DIP / 14 LEADS
FIGURE 6
NOTES:
1. Unless otherwise specified, component tolerances shall be per
military specification.
2. Tj = +152C maximum
3. Ta = +125C.
4. Burn-in Voltages: V1 = +20V to +22V
V2 = -20V to –22V
5. RL = 715
Ω
SPEC NO. 05-08-5014 REV. U RH1014M, QUAD PRECISION OPERATIONAL AMPLIFIER
LINEAR TECHNOLOGY CORPORATION Page 13 of 18
STATIC BURN-IN CIRCUIT
OPTION 2, FLATPACK, GLASS SEAL / 14 LEADS
FIGURE 7
SPEC NO. 05-08-5014 REV. U RH1014M, QUAD PRECISION OPERATIONAL AMPLIFIER
LINEAR TECHNOLOGY CORPORATION Page 14 of 18
DYNAMIC BURN-IN CIRCUIT
OPTION 2, FLATPACK, GLASS SEAL / 14 LEADS
FIGURE 8
SPEC NO. 05-08-5014 REV. U RH1014M, QUAD PRECISION OPERATIONAL AMPLIFIER
LINEAR TECHNOLOGY CORPORATION Page 15 of 18
TOTAL DOSE BIAS CIRCUIT
FIGURE 9
SPEC NO. 05-08-5014 REV. U RH1014M, QUAD PRECISION OPERATIONAL AMPLIFIER
LINEAR TECHNOLOGY CORPORATION Page 16 of 18
TABLE I: ELECTRICAL CHARACTERISTICS (PRE-IRRADIATION)
See Applicable notes on next page.
SPEC NO. 05-08-5014 REV. U RH1014M, QUAD PRECISION OPERATIONAL AMPLIFIER
LINEAR TECHNOLOGY CORPORATION Page 17 of 18
TABLE II: ELECTRICAL CHARACTERISTICS (POST-IRRADIATION)
SPEC NO. 05-08-5014 REV. U RH1014M, QUAD PRECISION OPERATIONAL AMPLIFIER
LINEAR TECHNOLOGY CORPORATION Page 18 of 18
TABLE III: POST BURN-IN ENDPOINTS AND DELTA LIMIT REQUIREMENTS
TA = 25C, VS = +15V, VCM = 0V unless otherwise noted
ENDPOINT LIMIT
DELTA
PARAMETER
MIN
MAX
MIN
MAX
UNITS
Vos
-300
300
-200
200
µV
+IB
-30
+30
-4
4
nA
-IB
-30
+30
-4
4
nA
TABLE IV: ELECTRICAL TEST REQUIREMENTS
