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Surface Mount Rectifier
Features:
• Low Prole Package
• For Surface Mounted Applications
• Built-In Strain Relief, Ideal for Automated Placement
• High Temperature Soldering : 250°C/10 seconds at Terminals
• Easy Pick and Place
• Ultrafast Recovery Times for High Efciency
• Low Forward Voltage, Low Power Loss
Mechanical Data
• Case : JEDEC DO-214AA, molded plastic over passivated chip
• Terminals : solder plated, solderable per MIL-STD-750, method 2026
• Polarity : Colour band denotes cathode end
• Weight : 0.002oz, 0.064g
Maximum Ratings and Thermal Characteristics
Ratings at 25°C ambient temperature unless otherwise specied
Note:
(1) PCB mounted on 0.2ʺ × 0.2ʺ (5 × 5mm2) copper pad areas
Characteristic Symbol US1J-13-F US1K-13-F US1M-13-F Units
Maximum repetitive peak reverse voltage VRRM 600 800 1,000 V
Maximum RMS voltage VRWS 420 560 700 V
Maximum DC blocking voltage V DC 600 800 1,000 V
Maximum average forward rectied current at TL=110°C IF(AV) 1 A
Peak forward surge current 8.3ms single half sine-wave
superimposed on rated load (JEDEC Method) IFSM 30 A
Maximum instantaneous forward voltage at 1A VF1.7 V
Maximum DC reverse current TA=25°C
at rated DC blocking voltage TA=125°C IR5
100 μA
Maximum reverse recovery time
at IF=0.5A IR=1.A Irr=0.25A trr 75 ns
Typical junction capacitance at 4V,1MHz CJ15 pF
Maximum thermal resistance (Note1) RθJA
RθJL
55
20 °CW
Operating junction and storage temperature range TJ, TSTG -55 to +150 °C
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Page <2> V1.025/02/13
Surface Mount Rectifier
www.element14.com
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www.newark.com
Page <3> V1.025/02/13
Surface Mount Rectifier
DO-214AC(SMA)
Dim. Min. Max.
A 4.25 4.65
B2.4 2.8
C 1.85 2.15
D 4.85 5.35
E0.2 Typ.
F0.9 1.5
G 0.2 Max.
H1.9 2.3
I 1.35 1.65
Dimensions : Millimetres
Dimensions : Millimetres
Package Outline Dimensions
Soldering Footprint
Device Package Shipping
US1J-13-F
US1K-13-F
US1M-13-F
DO-214AC(SMA) 5,000 / Tape & Reel
Package Information
Description Part Number
Surface Mount Rectier
US1J-13-F
US1K-13-F
US1M-13-F
Part Number Table
Important Notice : This data sheet and its contents (the “Information”) belong to the members of the Premier Farnell group of companies (the “Group”) or are licensed to it. No licence is granted
for the use of it other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change
without notice and replaces all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any
error in or omission from it or for any use made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any
assumptions based on information included or omitted. Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the
Group was aware of the possibility of such loss or damage arising) is excluded. This will not operate to limit or restrict the Group’s liability for death or personal injury resulting from its negligence.
Multicomp is the registered trademark of the Group. © Premier Farnell plc 2012.