November 2012
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
SG1577 • Rev. 1.0.6
SG1577 — Dual Synchronous DC/DC Controller
SG1577
Dual Synchronous DC/DC Controller
Features
Integrated Two Sets of MOSFET Drivers
Two Independent PWM Controllers
Constant Frequency Operation: Free-running Fixed
Frequency Oscillator Programmable: 60 kHz to
320 kHz
Wide Range Input Supply Voltage: 8~15 V
Programmable Output as Low as 0.7 V
Internal Error Amplifier Reference Voltage:
0.7 V ±1.5%
Two Soft-Start / EN Functions
Programmable Over-Current Protection (OCP)
30 V HIGH Voltage Pin for Bootstrap Voltage
Output Over-Voltage Protection (OVP)
SOP 20-Pin
Applications
CPU and GPU Vcore Power Supply
Power Supply Requiring Two Independent Outputs
Description
The SG1577 is a high-efficiency, voltage-mode, dual-
channel, synchronous DC/DC PWM controller for two
independent outputs. The two channels are operated
out of phase. The internal reference voltage is trimmed
to 0.7 V ±1.5%. It is connected to the error amplifier’s
positive terminal for voltage feedback regulation. The
soft-start circuit ensures the output voltage can be
gradually and smoothly increased from zero to its final
regulated value. The soft-start pin can also be used for
chip-enable function. When two soft-start pins are
grounded, the chip is disabled and the total operation
current can be reduced to under 0.55 mA. The fixed-
frequency is programmable from 60 kHz to 320 kHz.
The Over-Current Protection (OCP) level can be
programmed by an external current sense resistor. It
has two integrated sets of internal MOSFET drivers.
SG1577 is available in the 20-pin SOP package.
Ordering Information
Part Number Operating
Temperature Range Package Packing
Method
SG1577SY -40°C to +85°C 20-Lead, Small Outline Package (SOP-20) Tape & Reel
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
SG1577 • Rev. 1.0.6 2
SG1577 — Dual Synchronous DC/DC Controller
Application Diagram
Figure 1. Typical Application
Internal Block Diagram
Figure 2. Functional Block Diagram
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
SG1577 • Rev. 1.0.6 3
SG1577 — Dual Synchronous DC/DC Controller
Marking Diagram
Figure 3. Top Mark
F ZXYTT
SG1577
TPM
F: Fairchild Logo
Z: Plant Code
X: 1-Digit Year Code for SOP
Y: 1-Digit Week Code for SOP
TT: 2-Digit Die Run Code
T: Package Type (S = SOP)
P: Z=Lead Free + ROHS
Compatible
Y=Green Package
M: Manufacture Flow Code
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
SG1577 • Rev. 1.0.6 4
SG1577 — Dual Synchronous DC/DC Controller
Pin Configuration
Figure 4. SOP-20 Pin Configuration (Top View)
Pin Definitions
Name Pin # Type Description
RT 1 Frequency Select
Switching frequency programming pin. An external resistor connecting from
this pin to GND can program the switching frequency. The switching
frequency would be 60 kHz when RT is open and become 320 kHz when a
30 kΩ RT resistor is connected.
IN1 2 Feedback
Inverting input of the error amplifier. It is normally connected to the
switching power supply output through a resistor divider.
COMP1 3 Compensation
Output of the error amplifier and input to the PWM comparator. It is used
for feedback loop compensation.
SS1/ENB 4 Soft Start/Enable
A 10 µA internal current source charging an external capacitor for soft start.
Pull down this pin and pin 17 can disable the chip.
CLP1 5 Over Current
Protection
Over-current protection for high-side MOSFET. Connect a resistor from this
pin to the high-side supply voltage to program the OCP level.
BST1 6 Boost Supply Supply for high-side driver. Connect to the internal bootstrap circuit.
DH1 7 High-Side Drive Channel 1, high-side MOSFET gate driver pin.
CLN1 8 Switch Node
Switch-node connection to inductor. For channel 1 high-side driver’s
reference ground.
DL1 9 Low-Side Drive Low-side MOSFET gate driver pin.
PGND 10 Driver Ground Driver circuit GND supply. Connect to low-side MOSFET GND.
VCC 11 Power Supply Supply voltage input.
DL2 12 Low-Side Drive Low-side MOSFET gate driver pin.
CLN2 13 Switch Node
Switch-node connection to inductor. For channel 2, high-side driver’s
reference ground.
DH2 14 High-Side Drive Channel 2 high-side MOSFET gate driver pin.
BST2 15 Boost Supply Supply for high-side driver. Connect to the internal bootstrap circuit.
CLP2 16 Over-Current
Protection
Over-current protection for the high-side MOSFET. Connect a resistor from
this pin to the high-side supply voltage to program the OCP level.
SS2/ENB 17 Soft-Start/Enable
A 10 µA internal current source charging an external capacitor for soft start.
Pull down this pin and pin 4 can disable the chip.
COMP2 18 Compensation
Output of the error amplifier and input to the PWM comparator. It is used
for feedback-loop compensation.
IN2 19 Feedback
Inverting input of the error amplifier. It is normally connected to the
switching power supply output through a resistor divider.
GND 20 Control Ground Control circuit GND supply.
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
SG1577 • Rev. 1.0.6 5
SG1577 — Dual Synchronous DC/DC Controller
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only. All voltage values, except differential voltages, are given with
respect to the network ground terminal. Stresses beyond those listed under "absolute maximum ratings" may cause
permanent damage to the device.
Symbol Parameter Min. Max. Unit
VCC Supply Voltage, VCC to GND 16 V
BST1(or 2) - CLN1(or 2) BST1(2) to CLN1(2) 16 V
CLN1(or 2) -GND CLN1(2) to GND for 100 ns Transient -4 18 V
BST1(or 2) - GND BST1(2) to GND for 100 ns Transient 30 V
DH1(or 2) - CLN1(or 2) 16 V
CLN1(or 2), DL1(or 2) -0.3 VCC+0.3 V
PGND PGND to GND ±1 V
ΘJA Thermal Resistance, Junction-to-Air 90 °C/W
TJ Operating Junction Temperature -40 +125 °C
TSTG Storage Temperature Range -65 +150 °C
ESD Human Body Model, JESD22-A114 2.5 kV
Charged Device Model, JESD22-C101 750 V
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol Parameter Min. Max. Unit
VCC Supply Voltage +8 +15 V
TA Operating Ambient Temperature -40 +85 °C
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
SG1577 • Rev. 1.0.6 6
SG1577 — Dual Synchronous DC/DC Controller
Electrical Characteristics
VCC=12 V, TA =25°C, unless otherwise noted.
Symbol Parameter Conditions Min. Typ. Max. Unit
Oscillator
fosc Oscillator Frequency RRT=OPEN 54 60 66
KHz
RRT=GND 288 320 352
fosc,rt Total Accuracy 20 kΩRRT -10 10 %
DON_MAX Maximum Duty Cycle 85 90 95 %
Error Amplifier
VREF Internal Reference Voltage VCC=8 V, VCC=15 V 0.6895 0.7000 0.7105 V
VREF Temperature Coefficient(1) T
A=0~85°C 0.03 mV/°C
AVOL Open-Loop Voltage Gain 77 dB
BW Unity Gain Bandwidth 3.5 MHz
PSRR Power Supply Rejection Ratio 50 dB
ISOURCE Output Source Current IN1=IN2=0.6 V 60 80 100 µA
ISINK Output Sink Current IN1=IN2=0.8 V 500 µA
VH COMP Output Voltage IN1=IN2=0.6 V 5 V
VL COMP Output Voltage IN1=IN2=0.8 V 100 mV
Soft Start
ISOURCE Soft-Start Charge Current VCLPVCLN 8 10 12 µA
ISINK Soft-Start Discharge Current VCLPVCLN 0.8 1.0 1.2 µA
Protections
IOSCET OC Sink Current VCC=12 V 90 120 150 µA
TOT Over-Temperature 150 °C
TOT_hys Over-Temperature Hysteresis 20 °C
VOVP Over-Voltage Protection of IN VOVP/VIN 112 125 %
Output
IDH High-Side Current Source VBST - VCLN=12 V,VDH -
VCLN=6 V 1.0 1.7 A
RDH High-Side Sink Resistor VBST - VCLN=12 V 3.3 4.0
IDL Low-Side Current Source VCC=12 V,VDL=6 V 1.0 1.7 A
RDL Low-Side Sink Resistor VCC=12 V 3.1 4
tDT Dead Time(2) V
CC=12 V, DH and DL=1000 pF 10 40 70 ns
Total Operating Current
ICC_OP Operating Supply Current VCC=12 V, No Load 3.3 4.3 5.3 mA
ICC_SBY Standby Current (Disabled) SS1/ENB=SS2/ENB=0 V 0.55 1.00 mA
Notes:
1. Not test in production, 30 pcs sample.
2. When VDL falls less than 2 V relative to VDH rising to 2 V.
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
SG1577 • Rev. 1.0.6 7
SG1577 — Dual Synchronous DC/DC Controller
Typical Performance Characteristics
Unless otherwise noted, values are for VCC=12 V, TA=+25°C, and according to Figure 1.
Figure 5. V5p0 Power On with 1.6 A Load Figure 6. V3p3 Power On with 3 A Load
Figure 7. V5p0 Power On with 15 A Load Figure 8. V3p3 Power On with 8 A Load
Figure 9. V5p0 Power Off with 15 A Load Figure 10. V3p3 Power Off with 8 A Load
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
SG1577 • Rev. 1.0.6 8
SG1577 — Dual Synchronous DC/DC Controller
Typical Performance Characteristics (Continued)
Unless otherwise noted, values are for VCC=12 V, TA=+25°C, and according to Figure 1.
Figure 11. 3p3 and V5p0 Phase Shift with L ight Load Figure 12. V3p3 and V5p0 Phase Shift
with Heavy Load
Figure 13. Dead Time with Light Load (Rise Edge) Figure 14. Dead Time with Light Load (Fall Edge)
Figure 15. Dead Time with Heavy Load (Rise Edge) Figure 16. Dead Time with Heavy Load (Fall Edge)
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
SG1577 • Rev. 1.0.6 9
SG1577 — Dual Synchronous DC/DC Controller
Typical Performance Characteristics (Continued)
Unless otherwise noted, values are for VCC=12 V, TA=+25°C, and according to Figure 1.
Figure 17. Load Transient Response (Step-Up)
20k Ω/22 nF in Compensation Loop Figure 18. Load Transient Response (Step-Down)
20 kΩ/22 nF in Compensation Loop
Figure 19. Over-Current Protection (OCP) Figure 20. Over-Current Protection (Hiccup Mode)
90
100
110
120
130
140
150
-40-25-105203550658095
Temperature (oC)
Iocset (uA)
Iocset 1
Iocset 2
Figure 21. Over-Voltage Protection (OVP) Figure 22. IOCSET vs. Temperature
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
SG1577 • Rev. 1.0.6 10
SG1577 — Dual Synchronous DC/DC Controller
Functional Description
The SG1577 is a dual-channel voltage-mode PWM
controller. It has two sets of synchronous MOSFET
driving circuits. The two channels are running 180-
degrees out of phase. The following descriptions
highlight the advantages of the SG1577 design.
Soft-Start
An internal startup current (10 µA) flows out of SS/EN
pin to charge an external capacitor. During the startup
sequence, SG1577 isn’t enabled until the SS/ENB pin is
higher than 1.2 V. From 1.2 V to (1.2 + 1.6 x DON /
DON_MAX) V, PWM duty cycle gradually increases
following SS/ENB pin voltage to bring output rising. After
(1.2 + 1.6 x DON / DON_MAX) V, the soft-start period ends
and SS/ENB pin continually goes up to 4.8 V. When
input power is abnormal, the external capacitor on SS
pin is shorted to ground and the chip is disabled.
TSOFTSTART = CSS/ENB x 1.6 x DON / DON_MAX / ISOURCE (1)
Over-Current Protection (OCP)
Over-current protection is implemented by sensing the
voltage drop across the drain and the source of
external high-side MOSFET. Over-current protection is
triggered when the voltage drop on external high-side
MOSFET’s RDS(ON) is greater than the programmable
current limit voltage threshold. 120 µA flowing through
an external resistor between input voltage and the CLP
pin sets the threshold of current limit voltage. When
over-current condition is true, the system is protected
against the cycle-by-cycle current limit. A counter
counts a series of over-current peak values to eight
cycles; the soft-start capacitor is discharged by a 1 µA
current until the voltage on SS pin reaches 1.2 V.
During the discharge period, the high-side driver is
turned off and the low-side driver is turned on. Once
the voltage on SS/ENB pin is under 1.2 V, the normal
soft-start sequence is initiated and the 10 µA current
charges the soft-start capacitor again.
IL(OCP)= [(RSENSE x IOCSET + VOFFSET) / RDS(ON) -
(VIN - VOUT) x VOUT / (fOSC x LOUT x VIN x 2) ] (2)
where, VOFFSET (=10 mV) is the offset voltage
contributed by the internal OCP comparator.
Design Notes
VCC noise/spike affects the offset voltage of the OCP
comparator Figure 23 shows the VOFFSET1/2 vs. VCC
variation curve, which is a simulation result by IC
internal circuitry. Calculate the OCP variation between
VCC=12 V and VCC=4 V. For Ch1 or Ch2, VOFFSET /
RDS(ON) = 172 mV / 9 m = 19 A is affected. VCC>10 V is
the recommended range; lower, and the comparator’s
offset voltage is large.
Prevent CLN Noise in SG1577
To prevent noise/spike on CLN from affecting OCP
judgment, SG1577 internal has a 500 ns blanking time
to filter out this noise/spike on CLN at each turn-on
cycle and counts for eight cycles of CLP>CLN, then
OCP is asserted.
V
OFFSET
of OCP Comparator
0
20
40
60
80
100
120
140
160
180
200
220
240
4 6 8 10 12 14 16
V CC (V )
V
OFFSET
(m V )
Figure 23. VOFFSET1/2 vs. VCC
Error Amplifier
The IN1 and IN2 pins are connected to the
corresponding internal error amplifier’s inverting input
and the outputs of the error amplifiers are connected to
the corresponding COMP1 and COMP2 pins. The
COMP1 and COMP2 pins are available for control-loop
compensation externally. Non-inverting inputs are
internally tied to a fixed 0.7 V ±1.5% reference voltage.
Oscillator Operation
The SG1577 has a frequency-programmable oscillator.
The oscillator is running at 60 kHz when the RT pin is
floating. The oscillator frequency can be adjusted from
60 kHz up to 320 kHz by an external resistor RRT
between RT pin and the ground. The oscillator
generates a sawtooth wave that has 90% rising duty.
Sawtooth wave voltage threshold is from 1.2 V to 2.8 V.
The frequency of oscillator can be programmed by the
following equation:
fOSC, RT(kHz) = 60kHz + 8522 / RRT(k) (3)
Output Driver
The high-side gate drivers need an external
bootstrapping circuit to provide the required boost
voltage. The highest gate driver’s output (15 V is the
allowed) on high-side and low-side MOSFETs forces
external MOSFETs to have the lowest RDS(ON), which
results in higher efficiency.
Over-Temperature Protection (OTP)
The device is over-temperature protected. When chip
temperature is over 150°C, the chip enters tri-state
(high-side driver is turned off). The hysteresis is 20°C.
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
SG1577 • Rev. 1.0.6 11
SG1577 — Dual Synchronous DC/DC Controller
Type II Compensation Design
(for Output Capacitors with High ESR)
SG1577 is a voltage-mode controller; the control loop is
a single voltage feedback path, including an error
amplifier and PWM comparator, as shown in Figure 24.
To achieve fast transient response and accurate output
regulation, an adequate compensator design is
necessary. A stable control loop has a 0 dB gain
crossing with -20 dB/decade slope and a phase margin
greater than 45°.
Figure 24. Closed Loop
1. Modulator Frequency Equations
The modulator transfer function is the small-signal
transfer function of VOUT/VE/A. This transfer function is
dominated by a DC gain and the output filter (LO and CO)
with a double-pole frequency at fLC and a zero at FESR.
The DC gain of the modulator is the input voltage (VIN)
divided by the peak-to-peak oscillator voltage
VRAMP(=1.6 V). The first step is to calculate the complex
conjugate poles contributed by the LC output filter. The
output LC filter introduces a double pole,
-40 dB / decade gain slope above its corner resonant
frequency, and a total phase lag of 180°. The resonant
frequency of the LC filter expressed as:
OO
P(LC) CLπ2
1
f
××
= (4)
The next step of compensation design is to calculate the
ESR zero. The ESR zero is contributed by the ESR
associated with the output capacitance. Note that this
requires that the output capacitor should have enough
ESR to satisfy stability requirements. The ESR zero of
the output capacitor is expressed as:
ESRC2
1
f
O
)ESR(Z ××
=
π
(5)
2. Compensation Frequency Equations
The compensation network consists of the error
amplifier and the impedance networks ZC and Zf, as
Figure 24 shows.
Figure 25. Compensation Loop
)C//C(R2
1
f
CR2
1
f
0f
212
2P
22
1Z
1P
××
=
××
=
=
π
π
(6)
Figure 26 shows the DC-DC converter gain vs.
frequency. The compensation gain uses external
impedance networks ZC and Zf to provide a stable,
high-bandwidth loop.
High crossover frequency is desirable for fast transient
response, but often jeopardizes the system stability. To
cancel one of the LC filter poles, place the zero before
the LC filter resonant frequency. Place the zero at 75%
of the LC filter resonant frequency. Crossover frequency
should be higher than the ESR zero, but less than 1/5 of
the switching frequency. The second pole should be
placed at half the switching frequency.
Figure 26. Bode Plot
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
SG1577 • Rev. 1.0.6 12
SG1577 — Dual Synchronous DC/DC Controller
Layout Considerations
Layout is important in high-frequency switching converter
design. If designed improperly, PCB can radiate
excessive noise and contribute to converter instability.
Place the PWM power stage components first. Mount all
the power components and connections in the top layer
with wide copper areas. The MOSFETs of buck,
inductor, and output capacitor should be as close to
each other as possible to reduce the radiation of EMI
due to the high-frequency current loop. If the output
capacitors are placed in parallel to reduce the ESR of
capacitor, equal sharing ripple current should be
considered. Place the input capacitor near the drain of
high-side MOSFET. In multi-layer PCB, use one layer as
power ground and have a separate control signal ground
as the reference for all signals. To avoid the signal
ground being affected by noise and have best load
regulation, it should be connected to the ground terminal
of output.
Follow the below guidelines for best performance:
1 A two-layer printed circuit board is recommended.
2 Use the bottom layer of the PCB as a ground plane
and make all critical component ground connections
through vias to this layer.
3 Keep the metal running from the CLNx terminal to
the output inductor short.
4 Use copper-filled polygons on the top (and bottom,
if two-layer PCB) circuit layers for the CLN node.
5 The small-signal wiring traces from the DLx and
DHx pins to the MOSFET gates should be kept
short and wide enough to easily handle the several
amps of drive current.
6 The critical, small-signal components include any
bypass capacitors (SMD-type of capacitors applied
at VCC and SSx/ENB pins), feedback components
(resistor divider), and compensation components
(between INx and COMPx pins). Position those
components close to their pins with a local, clear
GND connection or directly to the ground plane.
7 Place the bootstrap capacitor near the BSTx and
CLNx pins.
8 The resistor on the RT pin should be near this pin
and the GND return should be short and kept away
from the noisy MOSFET’s GND (which is short
together with IC’s PGND pin to GND plane on back
side of PCB).
9 Place the compensation components close to the
INx and COMPx pins.
10 The feedback resistors for both regulators should
be located as close as possible to the relevant INx
pin with vias tied straight to the ground plane as
required.
11 Minimize the length of the connections between the
input capacitors, CIN, and the power switchers
(MOSFETs) by placing them nearby.
12 Position both the ceramic and bulk input capacitors
as close to the upper MOSFET drain as possible
and make the GND returns (from the source of
lower MOSFET to VIN capacitor GND) short.
13 Position the output inductor and output capacitors
between the upper MOSFET and lower MOSFET
and the load.
14 AGND should be on the clearer plane and kept
away from the noisy MOSFET GND.
15 PGND should be short, together with MOSFET
GND, then through vias to GND plane on the
bottom of PCB.
16 Prevent spike happen on CLN pin a proper snubber
circuit for CLN and GND is recommend.
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
SG1577 • Rev. 1.0.6 13
SG1577 — Dual Synchronous DC/DC Controller
Physical Dimensions
2.65 MAX
0.20±0.10
0.10 C
C
12.80±0.20 A
SEE DETAIL A
0.33
0.20
NOTES: UNLESS OTHERWISE SPECIFIED
A) THIS PACKAGE CONFORMS TO JEDEC MS-013.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
FLASH OR BURRS.
D) LANDPATTERN RECOMMENDATION IS FSC DESIGN
PIN ONE
INDICATOR
0.25
1
1.27
0.51
0.35
10
BCA
M
10.325
20 11
11.430
7.50±0.10
B
X 45°
0.75
0.25
(R0.10)
(R0.10)
0.40~1.27
SEATING PLANE
(1.40)
0.25
GAGE PLANE
DETAIL A
SCALE: 2:1
SEATING PLANE
1.27 TYP
0.50 TYP
LAND PATTERN RECOMMENDATION
1.25 TYP
11.930
11.430
8.422
10.922
PIN #1
INDICATOR
1
20
1
20
PIN #1
INDICATOR 1
20
OPTION 1 OPTION 2 OPTION 3
PIN #1
INDICATOR
PIN#1 IDENTIFICATION OPTIONS
HALF MOON & PIN 1 HALF MOON ONLY PIN 1 ONLY
E) FILENAME AND REVISION: M20BREV4
Figure 27. 20-Lead, Small Outline Package (SOP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide term s and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
SG1577 • Rev. 1.0.6 14
SG1577 — Dual Synchronous DC/DC Controller