CPC2017N Dual Normally Open 8-Pin SOIC OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) LED Current to operate Rating 60 120 16 1 Units VP mArms / mADC mA Features * Designed for use in Security Systems Complying with EN50130-4 * 1500Vrms Input/Output Isolation * TTL/CMOS Compatible Input * Arc-Free With No Snubbing Circuits * No EMI/RFI Generation * Immune to Radiated EM Fields * SMD Pick & Place, Wave Solderable * Tape & Reel Version Available * Small 8-Pin SOIC Package Applications * Security * Passive Infrared Detectors (PIR) * Data Signalling * Sensor Circuitry * Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Medical Equipment--Patient/Equipment Isolation * Aerospace * Industrial Controls Description The CPC2017N is a miniature device with two independent 1-Form-A solid state relays in an 8-Pin SOIC package that employs optically coupled MOSFET technology to provide 1500Vrms of input/output isolation. Optically coupled outputs that use the patented OptoMOS architecture are controlled by a highly efficient GaAIAs infrared LED. The CPC2017N uses IXYS Integrated Circuits Division's state of the art, double-molded, vertical construction packaging to produce one of the world's smallest relays. The CPC2017N offers substantial board space savings over the competitor's larger 8-Pin SOIC relay. Approvals * UL Certified Component: File E76270 * CSA Certified Component: Certificate 1172007 * EN/IEC 60950-1 Certified Component: TUV Certificate B 10 05 49410 006 Ordering Information Part # CPC2017N CPC2017NTR Description 8-Pin SOIC (50/tube) 8-Pin SOIC (2000/reel) Pin Configuration 8 1 + Control Load 7 2 - Control Load 6 3 + Control Load 4 5 - Control Load Switching Characteristics of Normally Open (Form A) Devices Form-A IF 90% 10% ILOAD Pb DS-CPC2017N-R03 e3 ton www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC2017N Absolute Maximum Ratings @ 25C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Total Power Dissipation 1 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Ratings 60 5 50 1 600 1500 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW Vrms C C Derate linearly 5mW / C Electrical Characteristics @ 25C Parameter Output Characteristics Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Capacitance Input to Output Input Characteristics Input Control Current to Activate 3 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current 1 2 3 2 Conditions Symbol Min Typ Max Units IF=1mA t =10ms IL=120mA VL=60VP IL ILPK RON ILEAK - 7.1 - 120 350 16 1 mArms / mADC mAP ton toff COUT - - 1.25 0.45 25 1 3 3 - IF IF VF IR 0.1 0.9 - 0.40 0.35 1.2 - 1 1.4 10 IF=5mA, VL=10V VL=50V, f=1MHz IL=120mA IF=5mA VR=5V A ms pF pF mA mA V A Load current derates linearly from 120mA @ 25oC to 60mA @80oC, and must be derated for both poles operating simultaneously. Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60oC) a LED drive current of 3mA is recommended. www.ixysic.com R03 INTEGRATED CIRCUITS DIVISION CPC2017N PERFORMANCE DATA* 25 Device Count (N) Device Count (N) 30 25 20 15 10 Typical Turn-On Time (N=50, IF=5mA, IL=120mA, TA=25C) Typical Turn-Off Time (N=50, IF=5mA, IL=120mA, TA=25C) 25 20 Device Count (N) 35 Typical LED Forward Voltage Drop (N=50, IF=5mA, TA=25C) 15 10 5 20 15 10 5 5 0 0 Typical IF for Switch Operation (N=50, IL=120mA, TA=25C) 25 20 Device Count (N) Device Count (N) 25 15 10 0 0.45 0.50 0.55 1.3 1.4 1.5 1.6 0.26 0.30 0.32 0.34 0.36 0.38 Turn-Off (ms) Typical IF for Switch Dropout (N=50, IL=120mA, TA=25C) Typical On-Resistance Distribution (N=50, IF=1mA, IL=120mA, TA=25C) 35 30 25 20 15 10 5 0 0.30 0.60 0.35 LED Current (mA) 35 0.28 Turn-On (ms) 10 0 0.40 1.2 15 5 0.35 1.1 20 5 0.30 0 1.0 1.19 1.21 1.23 1.25 LED Forward Voltage Drop (V) Device Count (N) 1.17 0.40 0.45 0.50 LED Current (mA) 0.55 6.8 0.60 6.9 7.0 7.1 7.2 7.3 7.4 On-Resistance (:) Typical Blocking Voltage Distribution (N=50, TA=25C) Device Count (N) 30 25 20 15 10 5 0 80 82 84 86 88 90 92 Blocking Voltage (VP) Typical Turn-On vs. LED Forward Current (IL=120mA) IF=50mA IF=20mA IF=10mA 1.5 1.4 1.3 1.2 1.1 1.0 -40 IF=5mA IF=2mA IF=1mA -20 0 20 40 60 Temperature (C) 80 100 3.0 2.7 2.4 2.1 1.8 1.5 1.2 0.9 0.6 0.3 0 Typical Turn-Off vs. LED Forward Current (IL=120mA) 0.7 0.6 Turn-Off (ms) 1.6 Turn-On (ms) LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature 0.5 0.4 0.3 0.2 0.1 0 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 0 5 10 15 20 25 30 35 40 45 50 LED Forward Current (mA) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R03 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC2017N PERFORMANCE DATA* Typical IF for Switch Operation vs. Temperature (IL=60mA) 3.0 3.5 2.0 1.5 1.0 Turn-Off (ms) 3.0 Turn-On (ms) LED Current (mA) 2.5 Typical Turn-On vs. Temperature (IL=50mA) IF=2mA 2.5 2.0 IF=5mA 1.5 0.5 0 -40 14 -20 0 20 40 60 Temperature (C) 80 1.0 -40 100 -20 0 20 40 60 Temperature (C) 80 130 100 120 8 Instantaneous IF=5mA 6 50 0 -50 4 -100 2 -40 -150 -1.5 -20 0 20 40 60 Temperature (C) 80 100 91 0.016 89 0.014 87 Leakage (PA) Blocking Voltage (VP) Typical Blocking Voltage vs. Temperature 85 83 81 0 20 40 60 Temperature (C) 80 100 110 100 90 80 70 -1.0 -0.5 0 0.5 Load Voltage (V) 1.0 60 1.5 -40 Typical Leakage vs. Temperature (Measured Across Pins 3 & 4) (VL=60V) -20 0 20 40 60 Temperature (C) 80 100 10s 100s Energy Rating Curve 1.0 0.012 0.010 0.008 0.006 0.004 79 -20 Maximum Load Current vs. Temperature (IF=2mA) Load Current (mA) Steady State IF=2mA 150 Load Current (A) 10 Load Current (mA) On-Resistance (:) IF=5mA IF=5mA -40 IF=2mA 12 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 100 Typical Load Current vs. Load Voltage (IF=1mA, TA=25C) Typical On-Resistance vs. Temperature (IL=60mA) Typical Turn-Off vs. Temperature (IL=50mA) 0.8 0.6 0.4 0.2 0.002 77 -40 -20 0 20 40 60 Temperature (C) 80 100 0 -40 -20 0 20 40 60 Temperature (C) 80 100 0.0 10Ps 100Ps 1ms 10ms 100ms Time 1s *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R03 INTEGRATED CIRCUITS DIVISION CPC2017N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC2017N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC2017N 260C for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R03 e3 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC2017N MECHANICAL DIMENSIONS CPC2017N 1.016 0.025 (0.040 0.001) 9.347 0.203 (0.368 0.008) Pin 1 2.184 MAX (0.086 MAX) PCB Land Pattern 5.60 (0.22) 1.30 (0.051) 6.096 0.102 (0.240 0.004) 3.810 0.051 (0.150 0.002) 2.540 TYP (0.100 TYP) 0.203 0.025 (0.008 0.001) 0.432 0.127 (0.017 0.005) 2.54 (0.100) 0.55 (0.022) Lead to Package Standoff MIN 0.0254 (0.001) (MAX 0.102 (0.004) 0.838 0.102 (0.033 0.004) Dimensions mm (inches) 0.381 0.051 (0.015 0.002) CPC2017N Tape & Reel 1.75 0.10 330.2 DIA. (13.00 DIA.) 4.00 0.10 8.00 0.10 2.00 0.10 Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 1.20 7.50 0.10 O1.50 +0.1, -0 6.50 9.65 0.10 16.00 0.30 Embossed Carrier 3.50 6.55 0.10 O1.50 MIN Embossment 2.35 0.10 NOTES: 1. All dimensions in millimeters 2. 10 sprocket hole pitch cumulative tolerance 0.20. 3. Carrier camber is within 1mm in 250mm. 4. Tape material : Black Conductive Polystyrene Alloy. 2.85 0.10 5. All dimensions meet EIA-481-C requirements. 6. Thickness : 0.30 0.05mm. 7. Component load per 13" reel : 2000 pcs. For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division's Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC2017N-R03 (c)Copyright 2012, IXYS Integrated Circuits Division OptoMOS(R) is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/17/2012