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TIWI-UB2 EM BOARD
User Guide
Last updated
February 11, 2016
TiWi-uB2 Module
EM BOARD USER GUIDE
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Table of Contents
User Guide 1
1 Introduction .......................................................................................................................... 3
1.1 Purpose & Scope ....................................................................................................................... 3
1.2 Applicable Documents ............................................................................................................... 3
1.3 Revision History ......................................................................................................................... 3
2 TiWi-uB2 Module Description ................................................................................................. 4
3 TiWi-uB2 EM Board Hardware ................................................................................................ 5
3.1 Antenna ..................................................................................................................................... 5
3.2 Connectors ................................................................................................................................ 5
3.3 Required Signals between EM Board and Host Device ............................................................ 6
3.4 Connecting EM Board to Host Platform .................................................................................... 7
3.5 Power Supply............................................................................................................................. 7
3.6 Serial Interfaces ......................................................................................................................... 7
3.7 HCI UART .................................................................................................................................. 8
3.8 PCM Interface ............................................................................................................................ 8
3.9 Option 1: Using EM Connectors ................................................................................................ 8
3.10 Option 2: Using Single Row Headers ...................................................................................... 11
3.11 Using J7 with USB to Serial Converter .................................................................................... 12
4 Schematic ............................................................................................................................ 13
4.1 Bill Of Material (BOM) .............................................................................................................. 14
5 Application Development ..................................................................................................... 15
5.1 Overview .................................................................................................................................. 15
5.2 Development Tools .................................................................................................................. 15
6 Contacting LS Research ........................................................................................................ 20
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1 Introduction
1.1 Purpose & Scope
The purpose of this document is to provide details regarding the setup and use of the TiWi-uB2
module on an EM board. This document covers a description of the EM board and its features
and a brief tutorial on how to operate the module EM board.
1.2 Applicable Documents
TiWi-uB2 Datasheet (330-0100)
TiWi-uB2 Antenna Design Guide (330-0106)
1.3 Revision History
Date
Change Description
Revision
2/19/2012
Initial release
1.0
5/28/2013
Updated Figure 8 TiWi-uB2 EM Board Schematic
1.1
Table 1 Revision History
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2 TiWi-uB2 Module Description
The TiWi-uB2 EM “Evaluation Module” Board is an evaluation platform for the LS Research TiWi-
uB2 Bluetooth and Bluetooth Low Energy (BLE) module. Communication between the TiWi-uB2
module, which is a slave, and the host device is through a UART interface.
The TiWi-uB2 EM Board contains an on board chip antenna and U.FL connector. The EM board
is intended for evaluation purposes when used in conjunction with various Texas Instruments
MSP430 and Stellaris development boards.
Figure 1 TiWi-uB2 EM Board Top
Figure 2 TiWi-uB2 EM Board Bottom
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3 TiWi-uB2 EM Board Hardware
3.1 Antenna
The TiWi-uB2 EM Board contains an on board chip antenna which is modular certified for FCC
15.247 and IC RSS-210, as well as compliant to the RF requirements for ETSI
EN 300 328 and ETSI EN 301 489. The antenna layout and circuitry on the EM Board can be
replicated on a custom designed PCB assembly. Assuming the design/layout is followed exactly
as that which is on the EM Board, the custom PCB will retain the modular certification. Below
are details on the certifications.
FCC ID: TFB-BT1, 15.247
IC ID: 5969A-BT1, RSS 210
3.2 Connectors
There are two primary connectors on the TiWi-uB2 EM Board (J1 & J2). These provide a standard
interface to Texas Instruments development platforms (See Section 3.9).
Two additional non populated connectors (J4 & J5) provide access to all of the significant signals
on the module on a standard, single row 2mm pitch header.
1
6
5
4
2
3
7
89
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Figure 3 TiWi-uB2 EM Board Top Side Connectors
Numbered Item
Connector
Description
1
J4
This is a non-populated connector that exposes signals from the
module. Refer to Table 6 for more details.
2
JP2
This jumper is used to configure the audio PCM interface as a
master or slave by switching the direction of the level shifter for
the AUD_CLK and FSYNC signals.
3
JP1
This jumper is used to select the onboard 32kHz slow clock or
external 32kHz slow clock.
4
J5
This is a non-populated connector that exposes signals from the
module. Refer to Table 7 for more details.
5
J6
This connector is not populated by default. It can be used to
power the EM board.
6
J8
This connector is not populated by default. It give the user access
to 1.8V, GND, and SLOW_CLK_IN
7
J7
This connector is not populated by default. It is designed to be
used with an external USB to Serial module. See section 3.11
8
JP4
This jumper is used to break 1.8V to the Module for VIO current
measurements.
9
JP3
This jumper is used to break 3.3V to the Module for VBAT current
measurements.
Table 2 TiWi-uB2 EM Board Top Side Connectors
3.3 Required Signals between EM Board and Host Device
In addition to power and ground, there are three signals required for connecting a TiWi-uB2
module to a host device. See Table 3 below for details on these connections.
Signal Name
Description
VCC
Power to the module (2.2 to 4.8 Volts)
GND
Ground
/SHUT_DN
Active low module reset which is an input to the module and an output from the host
device.
HCI_TX
HCI UART transmit pin which is an output from the module and an input to the host
device.
HCI_RX
HCI UART receive pin which is an input to the module and an output from the host
device.
Table 3 TiWi-uB2 Required Connections
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3.4 Connecting EM Board to Host Platform
The TiWi-uB2 EM Board is intended to allow for evaluation of and early development with a
TiWi-uB2 module. The EM Board has two “EM” connectors on the bottom of the board that
allows for easy connection to various Texas Instruments microcontroller development
platforms. The primary development platform is the MSP430F5438 Experimenter Board.
It is also possible to adapt the TiWi-uB2 EM Board to work with microcontroller platforms that
do not have support for the EM connectors. Sections 3.9 and 3.10 describe the two options for
adapting an EM Board to work with other microcontroller platforms.
3.5 Power Supply
3.5.1 VBAT
VBAT requires a 3.0V to 4.8V DC power supply.
3.5.2 VDD_IO
VDD_IO requires a 1.8V DC power supply.
Figure 4 Power Supply
3.6 Serial Interfaces
There are two serial interfaces to the module, HCI UART and PCM. Each interface is described
below.
Figure 5 Serial Interfaces
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3.7 HCI UART
This is the main interface between the host microcontroller and the module. The Bluetooth
UART may also be used to download external patches from the host to the TiWi-uB2. The UART
interface supports baud rates from 9600bps to 4Mbps.
BT debug pin: The debug interface (TX_DBG) helps customers to debug the HW/SW issues for
their application (not pictured).
3.8 PCM Interface
The PCM Interface can connect to linear PCM Codec devices in master or slave mode. In master
mode, the TiWi-uB2 generates the PCM_CLK and PCM_SYNC signals, and in slave mode, these
signals are provided by another master on the PCM interface and are inputs to the TiWi-uB2.
Figure 6 PCM Interface
3.9 Option 1: Using EM Connectors
Either build a PCB which has the EM Board mating connectors which will allow for plugging the
TiWi-uB2 EM Board into, or solder wires to EM Board mating connectors that can then be wired
into whatever development platform is being used.
Below are two suggestions for the mating EM connectors.
Through hole connector: Samtec TFM-110-01-S-D-WT
Surface Mount connector: Samtec SFM-110-02-L-D-A
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If building a PCB that has the mating EM Board connectors, the connectors need to be lined up
and spaced 1.2” apart as shown in Figure 7.
1.2"
J1 J2
19
2
20
1
19
2
20
1
Figure 7 Host PCB EM Mating Connector Arrangement (Top View)
Refer to Table 4 and Table 5 below for details on the signals brought out to the EM connectors
J1 and J2.
J1 Pin
Number
Pin Name
Module
Pin Type
Description
1, 19
GND
Ground
3
HCI_CTS
DI
HCI UART CTS pin. This should be controlled by the host UART
RTS pin. (VCC logic level)
5
SLOW_CLK
DI
External slow clock input. If the user does not want to use the
32kHz clock on the EM board, an external clock can be supplied
on this pin. (VCC logic level)
7
HCI_RX
DI
HCI UART receive pin. This should be connected to the host UART
transmit pin. (VCC logic level)
9
HCI_TX
DO
HCI UART transmit pin. This should be connected to the host
UART receive pin. (VCC logic level)
Table 4 EM Connector J1
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J2 Pin
Number
Pin Name
Module
Pin Type
Description
2
GND
Ground
7, 9
VCC
PI
Power to the module.
8
AUD_OUT
DO
PCM data output (VCC logic level)
10
AUD_IN
DI
PCM data input (VCC logic level)
11
FSYNC
DIO
PCM frame sync (VCC logic level)
17
AUD_CLK
DIO
PCM clock (VCC logic level)
18
HCI_RTS
DO
HCI UART RTS pin. This should be connected to the host UART CTS
pin. (VCC logic level)
19
/SHUT_DN
DI
Module shutdown pin (active low, VCC logic level)
Table 5 EM Connector J2
DI = Digital Input; DO = Digital Output; DIO = Digital Input/Output; PI = Power Input
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3.10 Option 2: Using Single Row Headers
Solder single row 12 pin 2mm headers into locations J4 and J5 on the EM Board, and then build
a wiring harness between the headers on the EM Board and the microcontroller development
platform of interest.
Below is a suggestion for the 12 pin 2mm headers.
Sullins NRPN121PAEN-RC
Refer to Table 6 and Table 7 below for details on the signals brought out to the single row
headers J4 and J5.
J4 Pin
Number
Pin Name
Module
Pin
Type
Description
1
NC
No Connect, leave this pin unconnected.
2
HCI_CTS
DI
HCI UART CTS input (VCC logic level). Connect to host UART
RTS pin.
3
HCI_RTS
DO
HCI UART RTS output (VCC logic level). Connect to host UART
CTS pin.
4
HCI_TX
DO
HCI UART transmit pin (VCC logic level). Connect to host
UART receive pin.
5
HCI_RX
DI
HCI UART receive pin (VCC logic level). Connect to host
UART transmit pin.
6
NC
No Connect, leave this pin unconnected.
7
GND
Ground
8
/SHUT_DN
DI
Active low module shut down (VCC logic level) that should
be controlled by the host device.
9
/SHUT_DN_1.8V
DI
Active low module shut down (1.8V side of level shifter).
12
GND
Ground
Table 6 Single Row Header J4
DI = Digital Input; DO = Digital Output; PI = Power Input
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J5 Pin
Number
Pin Name
Module
Pin
Type
Description
1
FSYNC
DIO
PCM frame sync (VCC logic level)
2
AUD_CLK
DIO
PCM clock (VCC logic level)
3
AUD_OUT
DIO
PCM data output (VCC logic level)
4
AUD_IN
DIO
PCM data input (VCC logic level)
5
VCC
PI
2.2 to 3.6 Volts
6
NC
No Connect, leave this pin unconnected.
7
GND
Ground
8
SLOW_CLK_3.3V
DO
External 32.768kHz clock input (VCC logic level)
9
TX_DBG
DO
Debug UART. Internal use only. (VCC logic level)
10
VIO
PI
1V8 VIO supply
11
1V8_PG
PI
1V8 power good signal. Used to enable level shifters.
12
GND
GND
Ground
Table 7 Single Row Header J5
DI = Digital Input; DO = Digital Output; DIO = Digital Input/Output; PI = Power Input
3.11 Using J7 with USB to Serial Converter
J7 is provided for interfacing the TiWi-uB2 Module to a USB-to-Serial converter, or similar serial
device capable of providing 1.8V logic level data.
J7 Pin
Number
Pin Name
Module
Pin Type
Description
1
1.8V
PI
1.8V DC from EM board
2
NC
No Connect, leave this pin unconnected.
3
GND
GND
System Ground
4
HCI_TX_1.8V
DO
UART TX 1.8V Logic Level. Connect to host UART receive pin.
5
HCI_RX_1.8V
DI
UART RX 1.8V Logic Level. Connect to host UART transmit pin.
Table 8 Single Row Header J7
DI = Digital Input; DO = Digital Output; DIO = Digital Input/Output; PI = Power Input;
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4 Schematic
Figure 8 TiWi-uB2 EM Board Schematics
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4.1 Bill Of Material (BOM)
Reference
Pop Opt
Part Number
Description
ANT1
2450AT43B100
CHIP ANTENNA 2.4GHz
C1-4 C7-11 C13
GRM155R71C104KA88
0402 SIZE SMT CERAMIC CAPACITOR
C12 C14
NP
GRM155R71C104KA88
0402 SIZE SMT CERAMIC CAPACITOR
C5 C15 C17
NP
250R05L0R3AV4T
0201 SIZE SMT CERAMIC CAPACITOR
C6
GRM21BR71C105KA01L
CAP CER 1.0UF 16V 20% X7R 0805
C16
250R05L2R4BV4T
0201 SIZE SMT CERAMIC CAPACITOR
J1 J2
SFM-110-02-L-D-A
SOCKET STRIP,.050" (1.27mm) PITCH, SMT
J3
U.FL-R-SMT(01)
MINIATURE COAXIAL RECEPTACLE
J4 J5
NP
NRPN121PAEN-RC
12 PIN 2MM HEADER
J6
NP
640456-2
2 PIN 0.1" POLARIZED FRICTION LOCK
J7
NP
PTC05SGBN
5 PIN 0.1" HEADER
J8
NP
PBC03SAAN
3 PIN 0.1" HEADER
JP1 JP2
NRPN031PAEN-RC
3 PIN 2MM HEADER
JP3 JP4
PBC02SAAN
2 PIN 0.1" HEADER
JMP1 JMP2
M22-1900005
2.0 mm SHUNT JUMPER
JMP3 JMP4
M7567-05
.1" SHUNT JUMPER
L1
L-07C2N7SV6T
MONOLITHIC 0402 SIZE SMT INDUCTOR
L2
ERJ-2GE0R00X
RES 0.0 OHM 1/10W 0402 SMD
L3
L-07C2N2SV6T
MONOLITHIC 0402 SIZE SMT INDUCTOR
L4
L-07C5N6KV6T
MONOLITHIC 0402 SIZE SMT INDUCTOR
LED1
APTD1608CGCK
LIGHT EMITTING DIODE, 0603 SMT, GREEN
LED2
APTD1608SYCK
LIGHT EMITTING DIODE, 0603 SMT, YELLOW
LED3
APTD1608QBC/D
LIGHT EMITTING DIODE, 0603 SMT, BLUE
MOD1
450-0104
TiWi-uB2 Module
MOD2
NP
DLP-TXRX-G
USB to Serial Adapter
Q1-3
FDV301N
N-CHANNEL LOGIC LEVEL ENHANCEMENT
Q4
FDN340P
P-CHANNEL POWER TRENCH MOSFET
R1 R3
ERJ-2GEJ104X
THICK FILM 0402 SMT RESISTOR
R2
ERJ-2RKF4020X
THICK FILM 0402 SMT RESISTOR
R4 R6
ERJ-2GEJ271X
THICK FILM 0402 SMT RESISTOR
R5 R19
ERJ-2GEJ103X
THICK FILM 0402 SMT RESISTOR
R7
ERJ-2GE0R00X
RES 0.0 OHM 1/10W 0402 SMD
R8
NP
ERJ-2GE0R00X
RES 0.0 OHM 1/10W 0402 SMD
R9 - R18
0402 SMT RESISTOR PLACE Holder
U1
TPS73118MDBVREP
150mA LOW DROPOUT LINEAR REGULATOR
U2 U3 U4
SN74AVC4T245RSVR
4-BIT DUAL SUPPLY BUS TRANSCEIVER
U7
NCP303LSN09T1G
VOLTAGE DETECTOR
X1
ASDK2-32.768KHZ-LRT
CRYSTAL OSCILLATOR
Table 9 TiWi-uB2 EM Board BOM
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5 Application Development
5.1 Overview
The TiWi-uB2 EM Board used in conjunction with a Bluetooth stack running on TI’s
MSP430BT5438 or Stellaris LM3S9B96 microcontroller (MCU) will reduce design barriers and
provides a highly flexible platform to enable customer’s early prototyping capabilities of
embedded Bluetooth applications. The ready-to-go wireless platforms simplify the
development process of pre-integrated and pre-validated Bluetooth serial link on an
MSP430BT5438 or LM3S9B96 system.
For an overview of development platforms and software examples see CC256x Bluetooth.
5.2 Development Tools
5.2.1 MSP430 Hardware
Hardware required for initial evaluation and development include:
2 - TiWi-uB2 EM Boards
1 - TI MSP430 USB Debugging Interface
2 - TI MSP430F5438 Experimenter Boards
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5.2.2 Stellaris Hardware
1 - TiWi-uB2 EM Board
1 - TI MSP430 USB Debugging Interface
1 - TI Stellaris LM3S9B96 EM2 Expansion Board
1 - TI DK-LM3S9D96
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5.2.3 Software
Software required for initial evaluation and development include:
Stellaris
Bluetopia®+LE SDK
CC256x_Bluetopia_Stack
Stellaris DK-LM3S9B96 SDK
Integrated BT Profiles
Classic Bluetooth
SPP
A2DP
Figure 9 TiWi-uB2 EM Board with Stellaris DK-LM3S9B96
TiWi-uB2 Module
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MSP430
Bluetopia
Bluetopia®+LE SDK
CC256x_Bluetopia_Stack
CC256x MSP430 Bluetopia Basic Demo APPS
Integrated BT Profiles
Classic Bluetooth
SPP
Bluetooth Low Energy
GATT
ANP
HRP
HTP
PASP
This Bluetooth software solution is licensed from Stonestreet One. The Bluetopia®+LE SDK is
comprised of Single Mode and Dual Mode offering implementing the Bluetooth 4.0
specification. Bluetopia®+LE stack is built upon the solid foundation of the Bluetopia protocol
stack that is currently being used in millions of consumer and industrial devices and that was
first qualified in 2000 `
TiWi-uB2 + MSP430 Bluetopia Basic Demo APPS allows users to evaluate TI's CC256x Bluetooth
device by using the TiWi-uB2 EM board and the MSP-EXP430F5438 board. The CC256x+MSP430
Bluetooth sample applications code are provided to enable a rich out-of-box experience to the
user. The application allows the user to use a console to send Bluetooth commands, setup a
Bluetooth Device to accept connections, connect to a remote Bluetooth device and
communicate over Bluetooth.
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Figure 10 TiWi-uB2 EM Board with MSP430F5438 Experimenter Board
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6 Contacting LS Research
Headquarters LS Research, LLC
W66 N220 Commerce Court
Cedarburg, WI 53012-2636
USA
Tel: 1(262) 375-4400
Fax: 1(262) 375-4248
Website www.lsr.com
Wiki www.lsr.com/products-wiki
Technical Support www.lsr.com/products-forum
Sales Contact sales@lsr.com
The information in this document is provided in connection with LS Research (hereafter referred to as “LSR”)
products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by
this document or in connection with the sale of LSR products. EXCEPT AS SET FORTH IN LSR’S TERMS AND
CONDITIONS OF SALE LOCATED ON LSR’S WEB SITE, LSR ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS
ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO,
THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT.
IN NO EVENT SHALL LSR BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR
INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS
INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT,
EVEN IF LSR HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. LSR makes no representations or
warranties with respect to the accuracy or completeness of the contents of this document and reserves the right
to make changes to specifications and product descriptions at any time without notice. LSR does not make any
commitment to update the information contained herein. Unless specifically provided otherwise, LSR products are
not suitable for, and shall not be used in, automotive applications. LSR’s products are not intended, authorized, or
warranted for use as components in applications intended to support or sustain life.
