PC354NJ0000F
Series
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC354)
2. Package resin : UL flammability grade (94V-0)
■ Features
■ Agency approvals/Compliance
1. Hybrid substrates that require high density mounting.
2. Programmable controllers
■ Applications
Mini-flat Package,
AC Input Photocoupler
1. 4-pin Mini-flat package
2. Double transfer mold package (Ideal for Flow
Soldering)
3. AC input type
4. High collector-emitter voltage (VCEO : 80V)
5. High isolation voltage between input and output
(Viso(rms) : 3.75kV)
6. Lead-free and RoHS directive compliant
■ Description
PC354NJ0000F Series contains an IRED optically
coupled to a phototransistor.
It is packaged in a 4-pin Mini-flat package.
Input-output isolation voltage(rms) is 3.75kV.
Collector-emitter voltage is 80V and CTR is 20% to
400% at input current of ±1mA.
1
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
PC354NJ0000F Series
Sheet No.: D2-A00602EN
Date Jun. 30. 2005
© SHARP Corporation
■ Internal Connection Diagram
1
2
4
3
1
2
3
4
AnodeAnode/Cathode
Cathode/Anode
Emitter
Collector
2
Sheet No.: D2-A00602EN
■ Outline Dimensions (Unit : mm)
4 3
1 2
4.4±0.2
5.3±0.3
2.6±0.2
0.1±0.1
3.6±0.3
2.54±0.25
0.4±0.1
0.5+0.4
−0.2
7.0+0.2
−0.7
Epoxy resin
45˚
6˚
0.2±0.05
354
Primary
side mark
SHARP mark
"S"
Rank mark
Date code
Factory identification mark
PC354NJ0000F Series
Product mass : approx. 0.1g
Plating material : SnCu (Cu : TYP. 2%)
Date code (2 digit)
Rank mark
Refer to the Model Line-up table
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
Mark
A
B
C
D
E
F
H
J
K
L
M
N
Mark
P
R
S
T
U
V
W
X
A
B
C
Mark
1
2
3
4
5
6
7
8
9
O
N
D
Month
January
February
March
April
May
June
July
August
September
October
November
December
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
·
·
·
·
·
·
2nd digit
Month of production
1st digit
Year of production
Factory identification mark
Factory identification Mark
no mark
Country of origin
Japan
Indonesia
China
* This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see
the actual status of the production.
3
repeats in a 20 year cycle
Sheet No.: D2-A00602EN
PC354NJ0000F Series
Sheet No.: D2-A00602EN
■ Electro-optical Characteristics
Parameter Conditions
Forward voltage
Terminal capacitance
Collector dark current
Collector-emitter breakdown voltage
Emitter-collector breakdown voltage
Transfer
charac-
teristics
Collector current
Collector-emitter saturation voltage
Isolation resistance
Floating capacitance
MIN.
−
−
−
6
0.2
−
5×1010
−
80
−
−
TYP.
1.2
30
−
−
−
0.1
1×1011
0.6
−
4
3
MAX.
1.4
250
100
−
4.0
0.2
−
1.0
−
18
18
Unit
V
pF
nA
V
mA
V
Ω
pF
V
µs
µs
Symbol
VF
Ct
ICEO
BVCEO
BVECO
IC
VCE (sat)
RISO
tr
tf
Cf
Response time Rise time
Fall time
Input
Output
IF=±20mA
V=0, f=1kHz
VCE=50V, IF=0
IC=0.1mA, IF=0
IE=10µA, IF=0
IF=±1mA, VCE=5V
IF=±20mA, IC=1mA
V=0, f=1MHz
VCE=2V, IC=2mA, RL=100Ω
DC500V, 40 to 60%RH
(Ta=25˚C)
■ Absolute Maximum Ratings (Ta=25˚C)
Parameter Symbol Unit
Input
Forward current mA
*1 Peak forward current A
Power dissipation mW
Output
Collector-emitter voltage
V
Emitter-collector voltage
V
Collector current mA
Collector power dissipation
mW
Total power dissipation mW
*2 Isolation voltage
Operating temperature ˚C
Storage temperature ˚C
*3 Soldering temperature
IF
IFM
P
VCEO
VECO
IC
PC
Ptot
Viso (rms)
Topr
Tstg
Tsol ˚C
*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1 minute, f=60Hz
*3 For 10s
Rating
±50
±1
70
80
6
50
150
170
−30 to +100
−40 to +125
260
3.75 kV
4
PC354NJ0000F Series
Sheet No.: D2-A00602EN
■ Model Line-up
IC [mA]
(
I
F
=±1mA, V
CE
=5V, T
a
=25˚C
)
with or without
A
0.2 to 4.0
0.5 to 1.5
Rank mark
PC354NJ0000F
PC354N1J000F
PC354NTJ000F
PC354N1TJ00F
3 000 pcs/reel
Taping
750 pcs/reel
Package
Model No.
5
Please contact a local SHARP sales representative to inquire about production status.
PC354NJ0000F Series
Sheet No.: D2-A00602EN
300
250
200
150
100
50
0
170
05010025
Total power dissipation Ptot (mW)
−30
Ambient temperature Ta (˚C)
Fig.4 Total Power Dissipation vs. Ambient
Temperature
Forward current IF (mA)
Forward voltage VF (V)
50˚C 25˚C
0˚C
0 0.5 1 1.5 2 2.5 3 3.5
10
100
1
−25˚C
Ta=75˚C
Fig.6 Forward Current vs. Forward Voltage
Duty ratio
10
100
Peak forward current IFM (mA)
10
−3
10
−2
10
−1
Pulse width≤100µs
Ta=25˚C
10 000
1 000
1
Fig.5 Peak Forward Current vs. Duty Ratio
0255075100 125
70
60
50
40
30
20
10
0
Forward current IF (mA)
−30
Ambient temperature Ta(˚C)
Fig.1 Forward Current vs. Ambient
Temperature
Diode power dissipation P (mW)
100
80
120
60
40
20
005055100
70
−30
Ambient temperature Ta (˚C)
Fig.2 Diode Power Dissipation vs. Ambient
Temperature
00255075100 125
200
150
100
50
Collector power dissipation PC (mW)
−30
Ambient temperature Ta (˚C)
Fig.3 Collector Power Dissipation vs.
Ambient Temperature
6
PC354NJ0000F Series
Sheet No.: D2-A00602EN
Fig.11 Collector Dark Current vs. Ambient
Temperature
0.01 0.1 1 10
10
0.1
1
100
Response time (µs)
VCE=2V
IC=2mA
Ta=25˚C
ts
td
tf
tr
Load resistance RL (kΩ)
Fig.12 Response Time vs. Load Resistance
50
0
−30 100020
150
100
40 8060
Ambient temperature Ta (˚C)
Relative current transfer ratio (%)
IF=5mA
VCE=5V
Fig.9 Relative Current Transfer Ratio vs.
Ambient Temperature
60 8040
0.16
200 100−30
0
0.14
0.12
0.08
0.1
0.06
0.04
0.02
Collector-emitter saturation voltage
VCE (sat) (V)
Ambient temperature Ta (˚C)
IF=20mA
IC=1mA
Fig.10 Collector - emitter Saturation Voltage
vs. Ambient Temperature
7
10
20
0
30
40
50
20mA
10mA
5mA
1mA
Collector-emitter voltage VCE (V)
Collector current IC (mA)
Ta=25˚C
IF=30mA
PC (MAX.)
012345678910
Fig.8 Collector Current vs. Collector-emitter
Voltage
0
300
200
100
400
500
0.1 1 10 100
Current transfer ratio CTR (%)
Forward current IF (mA)
VCE=5V
Ta=25˚C
Fig.7 Current Transfer Ratio vs. Forward
Current
PC354NJ0000F Series
Collector dark current ICEO (A)
Ambient temperature Ta (˚C)
806040200−30 100
10−5
10−6
10−7
10−8
10−9
10−10
10−11
VCE=50V
Sheet No.: D2-A00602EN
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
8
10%
90%
Output
Input
Input Output
RL
VCC
RD
ts
td
trtf
Please refer to the conditions in Fig.12
VCE
Fig.13 Test Circuit for Response Time
5.6
0
1.4
2.8
4.2 1mA
3mA
5mA
7mA
Forward current IF (mA)
Collector-emitter saturation voltage
VCE (sat) (V)
Ta=25˚C
IC=0.5mA
012345678910
Fig.14 Collector-emitter Saturation Voltage
vs. Forward Current
PC354NJ0000F Series
Sheet No.: D2-A00602EN
■ Design Considerations
While operating at IF<1.0mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
9
● Design guide
PC354NJ0000F Series
● Recommended Foot Print (reference)
1.5
2.54
0.8
6.3
(Unit : mm)
Sheet No.: D2-A00602EN
■ Manufacturing Guidelines
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
● Soldering Method
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 260˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
10
PC354NJ0000F Series
1234
300
200
100
00
(˚C)
Terminal : 260˚C peak
( package surface : 250˚C peak)
Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
(min)
Sheet No.: D2-A00602EN
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Cleaning instructions
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
● Presence of ODC
11
PC354NJ0000F Series
Sheet No.: D2-A00602EN
12
● Tape and Reel package
1. 3 000pcs/reel
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
A
12.0±0.3
B
5.5±0.1
C
1.75±0.1
D
8.0±0.1
E
2.0±0.1
H
7.4±0.1
I
0.3±0.05
J
3.1±0.1
K
4.0±0.1
F
4.0±0.1
G
φ1.5+0.1
−0
FE
I
DJ
G
B
A
C
H
5˚
MAX.
K
H
Dimensions List (Unit : mm)
a
c
e
g
f
b
d
a
370
b
13.5±1.5
c
80±1.0
d
13±0.5
e
21±1.0
f
2.0±0.5
g
2.0±0.5
Dimensions List (Unit : mm)
Pull-out direction
[Packing : 3 000pcs/reel]
Reel structure and Dimensions
Direction of product insertion
■ Package specification
PC354NJ0000F Series
Sheet No.: D2-A00602EN
2. 750pcs/reel
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
13
A
12.0±0.3
B
5.5±0.1
C
1.75±0.1
D
8.0±0.1
E
2.0±0.1
H
7.4±0.1
I
0.3±0.05
J
3.1±0.1
K
4.0±0.1
F
4.0±0.1
G
φ1.5+0.1
−0
FE
I
DJ
G
B
A
C
H
Dimensions List (Unit : mm)
5˚
MAX.
K
H
a
c
e
g
f
b
d
a
180
b
13.5±1.5
c
80±1.0
d
13±0.5
e
21±1.0
f
2.0±0.5
g
2.0±0.5
Dimensions List (Unit : mm)
Pull-out direction
[Packing : 750pcs/reel]
Reel structure and Dimensions
Direction of product insertion
PC354NJ0000F Series
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems
related to any intellectual property right of a third party
resulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials,
structure, and other contents described herein at any
time without notice in order to improve design or
reliability. Manufacturing locations are also subject to
change without notice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in
whole or in part, without the express written permission
of SHARP. Express written permission is also required
before any use of this publication may be made by a
third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this
publication.
14
Sheet No.: D2-A00602EN
■ Important Notices
PC354NJ0000F Series
[E181]
