Ericsson Internal
PRODUCT SPECIFICATION 1 (4)
Prepared (also subject responsible if other) No.
EMENZHE 1/1301-BMR 654 Uen
Approved Checked Date Rev Reference
SEC/D (Julia You) EWEIXIE 2009-07-17 F
Key Features
• Industry standard Sixteenth-brick
33.0 x 22.9 x 8.3 mm (1.3 x 0.9 x 0.327 in.)
• High efficiency, typ. 93.4 % at 5 Vout 50 % load
• 1500 Vdc input to output isolation
• Meets safety requirements according to IEC/EN/UL
60950
• More than 1.6 million hours MTBF
General Characteristics
• 1+1 parallelable
• Input under voltage protection
• Over temperature protection
• Output over voltage protection
• Output short circuit protection
• Remote control
• Highly automated manufacturing ensures quality
• ISO 9001/14001 certified supplier
Safety Approvals Design for Environment
Meets requirements in high-
temperature lead-free soldering
processes.
Ericsson Internal
TABLE OF CONTENTS 1 (1)
Prepared (also subject responsible if other) No.
SEC/S David Xie
Approved Checked Date Rev Reference
EAB/FJB/GMF (Natalie Johansson) MICIOLE 2009-06-26 E
Contents
Ordering Information .............................................................2
General Information .............................................................2
Safety Specification .............................................................3
Absolute Maximum Ratings .............................................................4
Electrical Specification
5.0V, 20 A / 100 W PKU 4101B PI ......................................5
12.0V, 8.3 A / 100 W PKU 4104B PI ......................................8
EMC Specification ........................................................... 11
Operating Information ...........................................................12
Thermal Consideration ........................................................... 13
Connections ...........................................................13
Mechanical Information ...........................................................14
Soldering Information ...........................................................16
Delivery Information ...........................................................17
Product Qualification Specification ........................................................... 18
E
PKU 4000B PI series Intermediate Bus Converters
Input 36-75 V, Output up to 20 A / 100 W
EN/LZT 146 376 R3B July 2009
© Ericsson AB
Technical Specification
Ericsson Internal
PRODUCT SPECIFICATION 2 (4)
Prepared (also subject responsible if other) No.
EMENZHE 1/1301-BMR 654 Uen
Approved Checked Date Rev Reference
SEC/D (Julia You) EWEIXIE 2009-07-17 F
Ordering Information
Product program Output
PKU 4101B PI 5.0 V, 20 A / 100 W
PKU 4104B PI 12.0 V, 8.3 A / 100 W
Product number and Packaging
PKU XXXXX n1 n2 n3 n4
Options n1 n2 n3 n4
Mounting x
Remote Control logic x
Lead length x
Delivery package information x
Options Description
n1
n2
n3
n4
PI
SI
P
LA
LB
/B
/C
Through hole
Surface mount
Negative *
Positive
5.30 mm *
3.69 mm
4.57 mm
Tray
Tape and Reel
Example a through-hole mounted, positive logic, short pin
product with tray packaging would be PKU 4101B PIPLA/B.
* Standard variant (i.e. no option selected).
General Information
Reliability
The Mean Time Between Failure (MTBF) is calculated at
full output power and an operating ambient temperature
(TA) of +40°C, which is a typical condition in Information
and Communication Technology (ICT) equipment. Different
methods could be used to calculate the predicted MTBF
and failure rate which may give different results. Ericsson
Power Modules currently uses two different methods,
Ericsson failure rate data system DependTool and
Telcordia SR332.
Predicted MTBF for the series is:
- 1.6 million hours according to Telcordia SR332, issue
1, Black box technique.
The Ericsson failure rate data system is based on field
tracking data. The data corresponds to actual failure rates
of components used in ICT equipment in temperature
controlled environments (TA = -5...+65°C).
Telcordia SR332 is a commonly used standard method
intended for reliability calculations in ICT equipment. The
parts count procedure used in this method was originally
modelled on the methods from MIL-HDBK-217F, Reliability
Predictions of Electronic Equipment. It assumes that no
reliability data is available on the actual units and devices
for which the predictions are to be made, i.e. all predictions
are based on generic reliability parameters.
Compatibility with RoHS requirements
The products are compatible with the relevant clauses and
requirements of the RoHS directive 2002/95/EC and have a
maximum concentration value of 0.1% by weight in
homogeneous materials for lead, mercury, hexavalent
chromium, PBB and PBDE and of 0.01% by weight in
homogeneous materials for cadmium.
Exemptions in the RoHS directive utilized in Ericsson
Power Modules products include:
- Lead in high melting temperature type solder (used to
solder the die in semiconductor packages)
- Lead in glass of electronics components and in
electronic ceramic parts (e.g. fill material in chip
resistors)
- Lead as an alloying element in copper alloy containing
up to 4% lead by weight (used in connection pins made
of Brass)
Quality Statement
The products are designed and manufactured in an
industrial environment where quality systems and methods
like ISO 9000, 6σ (sigma), and SPC are intensively in use
to boost the continuous improvements strategy. Infant
mortality or early failures in the products are screened out
and they are subjected to an ATE-based final test.
Conservative design rules, design reviews and product
qualifications, plus the high competence of an engaged
work force, contribute to the high quality of our products.
Warranty
Warranty period and conditions are defined in Ericsson
Power Modules General Terms and Conditions of Sale.
Limitation of Liability
Ericsson Power Modules does not make any other
warranties, expressed or implied including any warranty of
merchantability or fitness for a particular purpose (including,
but not limited to, use in life support applications, where
malfunctions of product can cause injury to a person’s
health or life).
© Ericsson AB 2009
The information and specifications in this technical
specification is believed to be correct at the time of
publication. However, no liability is accepted for
inaccuracies, printing errors or for any consequences
thereof. Ericsson AB reserves the right to change the
contents of this technical specification at any time without
prior notice.
E
PKU 4000B PI series Intermediate Bus Converters
Input 36-75 V, Output up to 20 A / 100 W
EN/LZT 146 376 R3B July 2009
© Ericsson AB
Technical Specification
2
Ericsson Internal
PRODUCT SPECIFICATION 3 (4)
Prepared (also subject responsible if other) No.
EMENZHE 1/1301-BMR 654 Uen
Approved Checked Date Rev Reference
SEC/D (Julia You) EWEIXIE 2009-07-17 F
Safety Specification
General information
Ericsson Power Modules DC/DC converters and DC/DC
regulators are designed in accordance with safety
standards IEC/EN/UL60950, Safety of Information
Technology Equip m ent.
IEC/EN/UL60950 contains requirements to prevent injury
or damage due to the following hazards:
• Electrical shock
• Energy hazards
• Fire
• Mechanical and heat hazards
• Radiation hazards
• Chemical hazards
On-board DC-DC converters and DC/DC regulators are
defined as component power supplies. As components
they cannot fully comply with the provisions of any Safety
requirements without “Conditions of Acceptability”.
Clearance between conductors and between conductive
parts of the component power supply and conductors on
the board in the final product must meet the applicable
Safety requirements. Certain conditions of acceptability
apply for component power supplies with limited stand-off
(see Mechanical Information for further information). It is
the responsibility of the installer to ensure that the final
product housing these components complies with the
requirements of all applicable Safety standards and
Directives for the final product.
Component power supplies for general use should comply
with the requirements in IEC60950, EN60950 and
UL60950 “Safety of information technology equipment”.
There are other more product related standards, e.g.
IEEE802.3af “Ethernet LAN/MAN Data terminal equipment
power”, and ETS300132-2 “Power supply interface at the
input to telecommunications equipment; part 2: DC”, but all
of these standards are based on IEC/EN/UL60950 with
regards to safety.
Ericsson Power Modules DC/DC converters and DC/DC
regulators are UL60950 recognized and certified in
accordance with EN60950.
The flammability rating for all construction parts of the
products meets requirements for V-0 class material
according to IEC 60695-11-10.
The products should be installed in the end-use equipment,
in accordance with the requirements of the ultimate
application. Normally the output of the DC/DC converter is
considered as SELV (Safety Extra Low Voltage) and the
input source must be isolated by minimum Double or
Reinforced Insulation from the primary circuit (AC mains) in
accordance with IEC/EN/UL60950.
Isolated DC/DC converters
It is recommended that a slow blow fuse with a rating twice
the maximum input current per selected product be used at
the input of each DC/DC converter. If an input filter is used
in the circuit the fuse should be placed in front of the input
filter.
In the rare event of a component problem in the input filter
or in the DC/DC converter that imposes a short circuit on
the input source, this fuse will provide the following
functions:
• Isolate the faulty DC/DC converter from the input
power source so as not to affect the operation of
other parts of the system.
• Protect the distribution wiring from excessive
current and power loss thus preventing hazardous
overheating.
The galvanic isolation is verified in an electric strength test.
The test voltage (Viso) between input and output is
1500 Vdc or 2250 Vdc for 60 seconds (refer to product
specification).
Leakage current is less than 1 µA at nominal input voltage.
24 V DC systems
The input voltage to the DC/DC converter is SELV (Safety
Extra Low Voltage) and the output remains SELV under
normal and abnormal operating conditions.
48 and 60 V DC systems
If the input voltage to the DC/DC converter is 75 Vdc or
less, then the output remains SELV (Safety Extra Low
Voltage) under normal and abnormal operating conditions.
Single fault testing in the input power supply circuit should
be performed with the DC/DC converter connected to
demonstrate that the input voltage does not exceed
75 Vdc.
If the input power source circuit is a DC power system, the
source may be treated as a TNV2 circuit and testing has
demonstrated compliance with SELV limits and isolation
requirements equivalent to Basic Insulation in accordance
with IEC/EN/UL60950.
Non-isolated DC/DC regulators
The input voltage to the DC/DC regulator is SELV (Safety
Extra Low Voltage) and the output remains SELV under
normal and abnormal operating conditions.
E
PKU 4000B PI series Intermediate Bus Converters
Input 36-75 V, Output up to 20 A / 100 W
EN/LZT 146 376 R3B July 2009
© Ericsson AB
Technical Specification
3
Ericsson Internal
PRODUCT SPECIFICATION 1 (8)
Prepared (also subject responsible if other) No.
EQUENXU 2/1301-BMR 654 Uen
Approved Checked Date Rev Reference
SEC/D (Julia You) ESECZHW 2009-07-17 D
Absolute Maximum Ratings
Characteristics min typ max Unit
Tref Operating Temperature (see Thermal Consideration section) -40 +125 °C
TS Storage temperature -55 +125 °C
VI Input voltage -0.5 +80 V
Viso Isolation voltage (input to output test voltage) 1500 Vdc
Vtr Input voltage transient (tp 100 ms) 100 V
VRC Remote Control pin voltage (see Operating Information section) -0.5 10 V
Stress in excess of Absolute Maximum Ratings may cause permanent damage. Absolute Maximum Ratings, sometimes referred to as no destruction limits, are normally tested
with one parameter at a time exceeding the limits of Output data or Electrical Characteristics. If exposed to stress above these limits, function and performance may degrade in
an unspecified manner.
Fundamental Circuit Diagram
E
PKU 4000B PI series Intermediate Bus Converters
Input 36-75 V, Output up to 20 A / 100 W
EN/LZT 146 376 R3B July 2009
© Ericsson AB
Technical Specification
4
Ericsson Internal
PRODUCT SPECIFICATION 2 (8)
Prepared (also subject responsible if other) No.
EQUENXU 2/1301-BMR 654 Uen
Approved Checked Date Rev Reference
SEC/D (Julia You) ESECZHW 2009-07-17 D
5 V, 20 A / 100 W Electrical Specification PKU 4101B PI
Tref = -40 to +90ºC, VI = 36 to 75 V, unless otherwise specified under Conditions.
Typical values given at: Tref = +25°C, VI= 53 V, max IO, unless otherwise specified under Conditions.
Cout = 2000 µF, for details see note 1.
Characteristics Conditions min typ Max Unit
VI Input voltage range 36 75 V
VIoff Turn-off input voltage 29 30 32 V
VIon Turn-on input voltage 30 32 35 V
CI Internal input capacitance 3.3 µF
PO Output power 0 100 W
50 % of max IO 93.1
max IO 91.9
50 % of max IO , VI = 48 V 93.4
η Efficiency
max IO, VI = 48 V 91.8
%
Pd Power Dissipation max IO 8.5 11 W
Pli Input idling power IO = 0 A, VI = 53 V 1.8 W
PRC Input standby power VI = 53 V (turned off with RC) 0.11 W
fs Switching frequency 0-100 % of max IO 250 kHz
VOi Output voltage initial setting and
accuracy
Tref = +25°C, VI = 53 V,
50 % of max IO 4.8 5.0 5.2 V
Output voltage tolerance band 0-100 % of max IO 4.5 5.5 V
Idling voltage IO = 0 A 5.0 5.5 V
Line regulation max IO 0.06 0.25 V
Load regulation VI = 53 V, 0-100 % of max IO 0.4 0.6 V
Vtr Load transient
voltage deviation ±40 mV
ttr Load transient recovery time
VI = 53 V, Load step 25-75-25 % of
max IO, di/dt = 5 A/µs.
80 µs
tr Ramp-up time
(from 10−90 % of VOi) 5 6 10 ms
ts Start-up time
(from VI connection to 90 % of VOi)
15 18 21 ms
max IO 1.5 ms
tf VI shut-down fall time
(from VI off to 10 % of VO) IO = 0 % of max IO 22 s
RC start-up time max IO
16 ms
max IO
1.5 ms
tRC RC shut-down fall time
(from RC off to 10 % of VO) IO = 0 % of max IO
22 s
IO Output current 0 20 A
Ilim Current limit threshold Tref < max Tref 25 A
Isc Short circuit current Tref = 25ºC, VO = 0.5V 32 A
VOac Output ripple & noise See ripple & noise section,
max IO, VOi 20 50 mVp-p
OVP Over voltage protection Tref = +25°C, VI = 53 V, 0-100 % of
max IO 6.2 V
Note 1: Low ESR type (ESR approx 11 mΩ). Minimum recommended capacitance for monotonic start up at 0 % load is 1000 µF / 20 mΩ.
E
PKU 4000B PI series Intermediate Bus Converters
Input 36-75 V, Output up to 20 A / 100 W
EN/LZT 146 376 R3B July 2009
© Ericsson AB
Technical Specification
5
Ericsson Internal
PRODUCT SPECIFICATION 3 (8)
Prepared (also subject responsible if other) No.
EQUENXU 2/1301-BMR 654 Uen
Approved Checked Date Rev Reference
SEC/D (Julia You) ESECZHW 2009-07-17 D
5 V, 20 A / 100 W Typical Characteristics PKU 4101B PI
Efficiency Power Dissipation
70
75
80
85
90
95
0 4 8 121620[A]
[%]
36 V
48 V
53 V
75 V
0
3
6
9
12
0 4 8 121620
[A]
[W]
36 V
48 V
53 V
75 V
Efficiency vs. load current and input voltage at Tref = +25°C Dissipated power vs. load current and input voltage at Tref = +25°C
Output Current Derating
4
8
12
16
20
24
0 20 40 60 80 100 [°C]
[A]
3.0 m/s
2.0 m/s
1.5 m/s
1.0 m/s
Nat. Conv.
Available load current vs. ambient air temperature and airflow at
VI = 53 V. See Thermal Consideration section.
Output Characteristics Current Limit Characteristics
4.5
4.8
5.0
5.3
5.5
0 4 8 121620[A]
[V]
36 V
48 V
53 V
75 V
0
1
2
3
4
5
6
12 16 20 24 28 32 36 [A]
[V]
36 V
48 V
53 V
75 V
Output voltage vs. load current at Tref = +25°C Output voltage vs. load current at IO > max IO , Tref = +25°C
E
PKU 4000B PI series Intermediate Bus Converters
Input 36-75 V, Output up to 20 A / 100 W
EN/LZT 146 376 R3B July 2009
© Ericsson AB
Technical Specification
6
Ericsson Internal
PRODUCT SPECIFICATION 4 (8)
Prepared (also subject responsible if other) No.
EQUENXU 2/1301-BMR 654 Uen
Approved Checked Date Rev Reference
SEC/D (Julia You) ESECZHW 2009-07-17 D
5 V, 20 A / 100 W Typical Characteristics PKU 4101B PI
Start-up Shut-down
Start-up enabled by connecting VI at:
Tref = +25°C, VI = 53 V,
IO = 20 A.
Top trace: output voltage (2 V/div.).
Bottom trace: input voltage (50 V/div.).
Time scale: (5 ms/div.).
Shut-down enabled by disconnecting VI at:
Tref = +25°C, VI = 53 V,
IO = 20 A resistive load.
Top trace: output voltage (2 V/div.).
Bottom trace: input voltage (50 V/div.).
Time scale: (0.2 ms/div.).
Output Ripple & Noise Output Load Transient Response
Output voltage ripple at:
Tref = +25°C, VI = 53 V,
IO = 20 A.
Trace: output voltage (20 mV/div.).
Time scale: (2 µs/div.). Output voltage response to load current step-change
Tref =+25°C, VI = 53 V, Cout = 2000 µF.
Top trace: output voltage (200 mV/div.).
Bottom trace: load current (5 A/div.).
Time scale: (0.1 ms/div.).
E
PKU 4000B PI series Intermediate Bus Converters
Input 36-75 V, Output up to 20 A / 100 W
EN/LZT 146 376 R3B July 2009
© Ericsson AB
Technical Specification
7
Ericsson Internal
PRODUCT SPECIFICATION 5 (8)
Prepared (also subject responsible if other) No.
EQUENXU 2/1301-BMR 654 Uen
Approved Checked Date Rev Reference
SEC/D (Julia You) ESECZHW 2009-07-17 D
12V, 8.3A / 100 W Electrical Specification PKU 4104B PI
Tref = -40 to +90ºC, VI = 36 to 75 V, unless otherwise specified under Conditions.
Typical values given at: Tref = +25°C, VI = 53 V, max IO, unless otherwise specified under Conditions.
Characteristics Conditions min typ Max Unit
VI Input voltage range 36 75 V
VIoff Turn-off input voltage 29 30 32 V
VIon Turn-on input voltage 30 32 35 V
CI Internal input capacitance 3.3 µF
PO Output power 0 100 W
50 % of max IO 92
max IO 93
50 % of max IO , VI = 48 V 92.5
η Efficiency
max IO, VI = 48 V 93.3
%
Pd Power Dissipation max IO 7.0 10.5 W
Pli Input idling power IO = 0 A, VI = 53 V 3.2 W
PRC Input standby power VI = 53 V (turned off with RC) 0.1 W
fs Switching frequency 0-100 % of max IO 250 kHz
VOi Output voltage initial setting and
accuracy
Tref = +25°C, VI = 53 V,
50 % of max IO 11.5 12 12.5 V
Output voltage tolerance band 0-100 % of max IO 10.8 13.2 V
Idling voltage IO = 0 A 11.7 12.9 V
Line regulation max IO 0.2 0.65 V
Load regulation VI = 53 V, 0-100 % of max IO 0.7 1.0 V
Vtr Load transient
voltage deviation ±100 mV
ttr Load transient recovery time
VI = 53 V, Load step 25-75-25 % of
max IO, di/dt = 5 A/µs.
See note 1: 90 µs
tr Ramp-up time
(from 10−90 % of VOi) 4 8 12 ms
ts Start-up time
(from VI connection to 90 % of VOi)
14 18 24 ms
max IO 0.1 ms
tf VI shut-down fall time
(from VI off to 10 % of VO) IO = 0 % of max IO 0.9 s
RC start-up time max IO 17 ms
max IO 0.18 ms
tRC RC shut-down fall time
(from RC off to 10 % of VO) IO = 0 % of max IO 1 s
IO Output current 0 8.3 A
Ilim Current limit threshold Tref < max Tref 14 A
Isc Short circuit current Tref = 25ºC 18 A
VOac Output ripple & noise See ripple & noise section,
max IO, VOi 50 100 mVp-p
OVP Over voltage protection Tref = +25°C, VI = 53 V, 0-100 % of
max IO 13.4 V
Note 1: Capacitance on the output is 1000 µF (ceramics, ESR approx 5 mΩ)
E
PKU 4000B PI series Intermediate Bus Converters
Input 36-75 V, Output up to 20 A / 100 W
EN/LZT 146 376 R3B July 2009
© Ericsson AB
Technical Specification
8
Ericsson Internal
PRODUCT SPECIFICATION 6 (8)
Prepared (also subject responsible if other) No.
EQUENXU 2/1301-BMR 654 Uen
Approved Checked Date Rev Reference
SEC/D (Julia You) ESECZHW 2009-07-17 D
12V, 8.3A / 100W Typical Characteristics PKU 4104B PI
Efficiency Power Dissipation
70
75
80
85
90
95
0246810[A]
[%]
36 V
48 V
53 V
75 V
0
2
4
6
8
10
12
14
0246810[A]
[W]
36 V
48 V
53 V
75 V
Efficiency vs. load current and input voltage at Tref = +25°C Dissipated power vs. load current and input voltage at Tref = +25°C
Output Current Derating
0
2
4
6
8
10
0 20406080100[°C]
[A]
3.0 m/s
2.0 m/s
1.5 m/s
1.0 m/s
Nat. Conv.
Available load current vs. ambient air temperature and airflow at
VI = 53 V. See Thermal Consideration section.
Output Characteristics Current Limit Characteristics
10.8
11.2
11.6
12.0
12.4
12.8
13.2
0246810[A]
[V]
36 V
48 V
53 V
75 V
0
3
6
9
12
15
6 8 10 12 14 16 18 20 [A]
[V]
36 V
48 V
53 V
75 V
Output voltage vs. load current at Tref = +25°C Output voltage vs. load current at IO > max IO , Tref = +25°C
E
PKU 4000B PI series Intermediate Bus Converters
Input 36-75 V, Output up to 20 A / 100 W
EN/LZT 146 376 R3B July 2009
© Ericsson AB
Technical Specification
9
Ericsson Internal
PRODUCT SPECIFICATION 7 (8)
Prepared (also subject responsible if other) No.
EQUENXU 2/1301-BMR 654 Uen
Approved Checked Date Rev Reference
SEC/D (Julia You) ESECZHW 2009-07-17 D
12V, 8.3A / 100W Typical Characteristics PKU 4104B PI
Start-up Shut-down
Start-up enabled by connecting VI at:
Tref = +25°C, VI = 53 V,
IO = 8.3 A resistive load.
Top trace: output voltage (5 V/div.).
Bottom trace: input voltage (50 V/div.).
Time scale: (5 ms/div.).
Shut-down enabled by disconnecting VI at:
Tref = +25°C, VI = 53 V,
IO = 8.3 A resistive load.
Top trace: output voltage (5 V/div.).
Bottom trace: input voltage (50 V/div.).
Time scale: (0.2 ms/div.).
Output Ripple & Noise Output Load Transient Response
Output voltage ripple at:
Tref = +25°C, VI = 53 V,
IO = 8.3 A
Trace: output voltage (50 mV/div.).
Time scale: (2 µs/div.). Output voltage response to load current step-
change Tref =+25°C, VI = 53 V, Cout = 1000 µF.
Top trace: output voltage (1 V/div.).
Bottom trace: load current (5 A/div.).
Time scale: (0.1 ms/div.).
E
PKU 4000B PI series Intermediate Bus Converters
Input 36-75 V, Output up to 20 A / 100 W
EN/LZT 146 376 R3B July 2009
© Ericsson AB
Technical Specification
10
Ericsson Internal
PRODUCT SPECIFICATION 1 (4)
Prepared (also subject responsible if other) No.
EAB/FJB/GKJ Pontus Melchert 3/1301-BMR 654 Uen
Approved Checked Date Rev Reference
EAB/FJB/GKF (Natalie Johansson) See § 1 2009-03-03 D
EMC Specification
Conducted EMI measured according to EN55022, CISPR 22
and FCC part 15J (see test set-up). See Design Note 009 for
further information. The fundamental switching frequency is
250 kHz for PKU 4101B.
Conducted EMI Input terminal value (typ)
EMI without filter @ Vi = 48 V, max Io.
External filter (class B)
Required external input filter in order to meet class B in
EN 55022, CISPR 22 and FCC part 15J.
L1 L2
C1
C3
C4
C2
C5 Load
DC/DC
C6
Filter components:
C1, 2, 6 = 1 μF/100 V
Ceramic
C3, 4 = 2.2 nF/1500 V
Ceramic
C5 = 100 μF/100 V
Electrolytic
L1,L2 = 1.47 mH
2.8 A, Common Mode
EMI with filter @ Vi = 48 V, max Io.
Test set-up
Layout recommendation
The radiated EMI performance of the DC/DC converter will
depend on the PCB layout and ground layer design.
It is also important to consider the stand-off of the DC/DC
converter. With regards to the isolation requirements avoid
placing a conductor which is connected to the primary side
below the DC/DC converter.
If a ground layer is used, it should be connected to the output
of the DC/DC converter and the equipment ground or chassis.
A ground layer will increase the stray capacitance in the PCB
and improve the high frequency EMC performance.
Output ripple and noise
Output ripple and noise measured according to figure below.
See Design Note 022 for detailed information.
Output ripple and noise test setup
LOAD
Conductor from OUT to capacitors = 50 mm (1.97 in)
10 µF 100 nF
50 mm
BNC Connector
to Scope
+
+OUT
-OUT
Tantalum CapacitorCeramic Capacitor
E
PKU 4000B PI series Intermediate Bus Converters
Input 36-75 V, Output up to 20 A / 100 W
EN/LZT 146 376 R3B July 2009
© Ericsson AB
Technical Specification
11
Ericsson Internal
PRODUCT SPECIFICATION 2 (4)
Prepared (also subject responsible if other) No.
EAB/FJB/GKJ Pontus Melchert 3/1301-BMR 654 Uen
Approved Checked Date Rev Reference
EAB/FJB/GKF (Natalie Johansson) See § 1 2009-03-03 D
Operating information
Input Voltage
The input voltage range 36 to 75 Vdc meets the requirements
of the European Telecom Standard ETS 300 132-2 for normal
input voltage range in –48 and –60 Vdc systems, -40.5 to -
57.0 V and –50.0 to -72 V respectively.
The absolute maximum continuous input voltage is 80 Vdc.
Turn-off Input Voltage
The DC/DC converters monitor the input voltage and will turn
on and turn off at predetermined levels.
The minimum hysteresis between turn on and turn off input
voltage is 1 V.
Remote Control (RC)
The products are fitted with a
remote control function referenced
to the primary negative input
connection (- In), with negative and
positive logic options available.
The RC function allows the
converter to be turned on/off by an
external device like a
semiconductor or mechanical
switch. The RC pin has an internal
pull up resistor to + In.
The maximum required sink current is 0.4 mA. When the RC
pin is left open, the voltage generated on the RC pin is max
5 V. The maximum allowable leakage current of the switch is
50 μA. With “negative logic” the converter will turn on when
the input voltage is applied with the RC connected to the - In.
Turn off is achieved by leaving the RC pin open, or connected
to a voltage higher than 5 V referenced to –In.
The second option is “positive logic” remote control, which can
be ordered by adding the suffix “P” to the end of the part
number. The converter will turn on when the input voltage is
applied with the RC pin open. Turn off is achieved by
connecting the RC pin to the - In. To ensure safe turn off the
voltage difference between RC pin and the - In pin shall be
less than 1 V. The converter will restart automatically when
this connection is opened.
Input and Output Impedance
The impedance of both the input source and the load will
interact with the impedance of the DC/DC converter. It is
important that the input source has low characteristic
impedance. The converters are designed for stable operation
without external capacitors connected to the output. The
performance in some applications can be enhanced by
addition of external capacitance as described under External
Decoupling Capacitors. If the input voltage source contains
significant inductance, the addition of a 100 µF capacitor
across the input of the converter will ensure stable operation.
The capacitor is not required when powering the DC/DC
converter from an input source with an inductance below
10 µH.
External Decoupling Capacitors
When powering loads with significant dynamic current
requirements, the voltage regulation at the point of load can
be improved by addition of decoupling capacitors at the load.
The most effective technique is to locate low ESR ceramic
and electrolytic capacitors as close to the load as possible,
using several parallel capacitors to lower the effective ESR.
The ceramic capacitors will handle high-frequency dynamic
load changes while the electrolytic capacitors are used to
handle low frequency dynamic load changes. Ceramic
capacitors will also reduce any high frequency noise at the
load. It is equally important to use low resistance and low
inductance PCB layouts and cabling.
For further information please contact your local Ericsson
Power Modules representative.
Parallel Operation
Two converters may be paralleled for redundancy (1+1) if the
total power is equal or less than POmax for one unit. To
secure the function o-ring diodes may be used.
Pre-bias Start-up
These products has pre-bias start up functionality and will not
sink current during start up if a pre-bias source is present at
the output terminal up to the min-value of output voltage
tolerance band, i.e 4.5 V for a 5 V version and 10.8 V for a 12
V version. Nor will there be any under or over shoot.
See Design Note 026 for detailed information.
Over Temperature Protection (OTP)
The converters are protected from thermal overload by an
internal over temperature shutdown circuit.
When Tref as defined in thermal consideration section
exceeds 135°C the converter will shut down. The DC/DC
converter will resume normal operation automatically when the
temperature has dropped approx 22°C below the temperature
threshold.
Over Voltage Protection (OVP)
The converters have output over voltage protection that will
clamp the output voltage to a continous fixed level. After
removal of the over voltage condition the converter will
resume to normal operation automatically.
Over Current Protection (OCP)
The converters include current limiting circuitry for protection
at continuous overload.
The output voltage will decrease towards zero for output
currents in excess of max output current (max IO). The
DC/DC converter will resume normal operation after removal
of the overload. The load distribution should be designed for
the maximum output short circuit current specified.
E
PKU 4000B PI series Intermediate Bus Converters
Input 36-75 V, Output up to 20 A / 100 W
EN/LZT 146 376 R3B July 2009
© Ericsson AB
Technical Specification
12
Ericsson Internal
PRODUCT SPECIFICATION 3 (4)
Prepared (also subject responsible if other) No.
EAB/FJB/GKJ Pontus Melchert 3/1301-BMR 654 Uen
Approved Checked Date Rev Reference
EAB/FJB/GKF (Natalie Johansson) See § 1 2009-03-03 D
Thermal Consideration
General
The converters are designed to operate in different thermal
environments and sufficient cooling must be provided to
ensure reliable operation.
Cooling is achieved mainly by conduction, from the pins to the
host board, and convection, which is dependent on the airflow
across the converter. Increased airflow enhances the cooling
of the converter.
The Output Current Derating graph found in the Output
section for each model provides the available output current
vs. ambient air temperature and air velocity at Vin = 53 V.
The DC/DC converter is tested on a 254 x 254 mm,
35 µm (1 oz), 16-layer test board mounted vertically in a wind
tunnel with a cross-section of 305 x 305 mm.
Proper cooling of the DC/DC converter can be verified by
measuring the temperature at reference point. The
temperature at this position should not exceed the max values
provided in the table below.
See Design Note 019 for further information.
Position Device Designation Max value
Reference 4101B PI Tref 120ºC
Reference 4104B PI Tref 115ºC
Definition of reference temperature (Tref)
The reference temperature is used to monitor the temperature
limits of the product. Temperatures above maximum Tref are
not allowed and may cause degradation or permanent
damage to the product. Tref is also used to define the
temperature range for normal operating conditions.
Tref is defined by the design and used to guarantee safety
margins, proper operation and high reliability of the module.
Connections
Top View
Pin Designation Function
1 +In Positive Input
2 RC Remote Control
3 -In Negative Input
4 -Out Negative Output
5 +Out Positive Output
Reference
E
PKU 4000B PI series Intermediate Bus Converters
Input 36-75 V, Output up to 20 A / 100 W
EN/LZT 146 376 R3B July 2009
© Ericsson AB
Technical Specification
13
Ericsson Internal
PRODUCT SPEC. MECH. 1 (3)
Prepared (also subject responsible if other) No.
EPANHON 4/1301-BMR 654 Uen
Approved Checked Date Rev Reference
SEC/D [Julia You] See §1 2009-02-10 C
Mechanical Information- Surface mount version
E
PKU 4000B PI series Intermediate Bus Converters
Input 36-75 V, Output up to 20 A / 100 W
EN/LZT 146 376 R3B July 2009
© Ericsson AB
Technical Specification
14
Ericsson Internal
PRODUCT SPEC. MECH. 2 (3)
Prepared (also subject responsible if other) No.
EPANHON 4/1301-BMR 654 Uen
Approved Checked Date Rev Reference
SEC/D [Julia You] See §1 2009-02-10 C
Mechanical Information- Hole mount version
E
PKU 4000B PI series Intermediate Bus Converters
Input 36-75 V, Output up to 20 A / 100 W
EN/LZT 146 376 R3B July 2009
© Ericsson AB
Technical Specification
15
Ericsson Internal
PRODUCT SPEC.MECH. 1 (4)
Prepared (also subject responsible if other) No.
EXXUYNG 5/1301-BMR 654 Uen
Approved Checked Date Rev Reference
SEC/D [Betty Wu] See §1 2009-01-13 E
Soldering Information - Surface Mounting
The surface mount product is intended for forced convection or
vapor phase reflow soldering in SnPb or Pb-free processes.
The reflow profile should be optimised to avoid excessive
heating of the product. It is recommended to have a sufficiently
extended preheat time to ensure an even temperature across
the host PCB and it is also recommended to minimize the time
in reflow.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board, since cleaning residues may affect
long time reliability and isolation voltage.
Minimum Pin Temperature Recommendations
Pin number 5 is chosen as reference location for the minimum
pin temperature recommendation since this will likely be the
coolest solder joint during the reflow process.
SnPb solder processes
For SnPb solder processes, a pin temperature (T
PIN
) in excess
of the solder melting temperature, (T
L
, 183°C for Sn63Pb37) for
more than 30 seconds and a peak temperature of 210°C is
recommended to ensure a reliable solder joint.
Lead-free (Pb-free) solder processes
For Pb-free solder processes, a pin temperature (T
PIN
) in
excess of the solder melting temperature (T
L
, 217 to 221°C for
SnAgCu solder alloys) for more than 30 seconds and a peak
temperature of 235°C on all solder joints is recommended to
ensure a reliable solder joint.
General reflow process specifications SnPb eutectic Pb-free
Average ramp-up (T
PRODUCT
) 3°C/s max 3°C/s max
Typical solder melting (liquidus)
temperature T
L
183°C 221°C
Minimum reflow time above T
L
30 s 30 s
Minimum pin temperature T
PIN
210°C 235°C
Peak product temperature T
PRODUCT
225°C 260°C
Average ramp-down (T
PRODUCT
) 6°C/s max 6°C/s max
Maximum time 25°C to peak 6 minutes 8 minutes
T
PRODUCT
maximum
T
PIN
minimum
Time
Pin
profile
Product
profile
T
L
Time in
reflow
Time in preheat
/ soak zone
Time 25°C to peak
Temperature
Maximum Product Temperature Requirements
Top of the product PCB near pin 2 is chosen as reference
location for the maximum (peak) allowed product temperature
(T
PRODUCT
) since this will likely be the warmest part of the
product during the reflow process.
SnPb solder processes
For SnPb solder processes, the product is qualified for MSL 1
according to IPC/JEDEC standard J-STD-020C.
During reflow T
PRODUCT
must not exceed 225 °C at any time.
Pb-free solder processes
For Pb-free solder processes, the product is qualified for MSL 3
according to IPC/JEDEC standard J-STD-020C.
During reflow T
PRODUCT
must not exceed 260 °C at any time.
Dry Pack Information
Products intended for Pb-free reflow soldering processes are
delivered in standard moisture barrier bags according to
IPC/JEDEC standard J-STD-033 (Handling, packing, shipping
and use of moisture/reflow sensitivity surface mount devices).
Using products in high temperature Pb-free soldering
processes requires dry pack storage and handling. In case the
products have been stored in an uncontrolled environment and
no longer can be considered dry, the modules must be baked
according to J-STD-033.
Thermocoupler Attachment
Pin 5 for measurement of minimum pin
(solder joint) temperature, T
PIN
Pin 2 for measurement of maximum product
temperature, T
PRODUCT
E
PKU 4000B PI series Intermediate Bus Converters
Input 36-75 V, Output up to 20 A / 100 W
EN/LZT 146 376 R3B July 2009
© Ericsson AB
Technical Specification
16
Ericsson Internal
PRODUCT SPEC.MECH. 2 (4)
Prepared (also subject responsible if other) No.
EXXUYNG 5/1301-BMR 654 Uen
Approved Checked Date Rev Reference
SEC/D [Betty Wu] See §1 2009-01-13 E
Soldering Information - Hole Mounting
The hole mounted product is intended for plated through hole
mounting by wave or manual soldering. The pin temperature is
specified to maximum 270°C for maximum 10 seconds.
A maximum preheat rate of 4°C/s and maximum preheat
temperature of 150°C is suggested. When soldering by hand,
care should be taken to avoid direct contact between the hot
soldering iron tip and the pins for more than a few seconds in
order to prevent overheating.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board. The cleaning residues may affect
long time reliability and isolation voltage.
Delivery Package Information
The surface mount products are delivered in antistatic injection
molded trays (Jedec design guide 4.10D standard) and in
antistatic carrier tape (EIA 481 standard).
The through-hole mount products are delivered in antistatic
injection molded trays (Jedec design guide 4.10D standard).
Carrier Tape Specifications
Material Antistatic PS
Surface resistance < 10
7
Ohm/square
Bakeability The tape is not bakable
Tape width, W 56 mm [2.2 inch]
Pocket pitch, P
1
36 mm [1.42 inch]
Pocket depth, K
0
8.7 mm [0.343 inch]
Reel diameter 380 mm [15 inch]
Reel capacity 200 products /reel
Reel weight Rounded 3 kg/full reel
Pin 1
User tape feed direction
Round holes
Elon
g
ated holes
Pocket pitch, P1
Tape width, W
EIA standard carrier tape
Pocket depth, K0
Side view
Top view
Tray Specifications
Material Antistatic PPE
Surface resistance 10
5
< Ohm/square < 10
12
Bakability The trays can be baked at maximum
125°C for 48 hours]
Tray thickness 18.5 mm [0.728 inch]
Box capacity 150 products (5 full trays/box)
Tray weight 190 g empty, 600 g full tray
X= Vacuum pickup area
All dimensions in mm [inch]
Tolerances: X.xx mm ±0.13 mm [0.005], X.x mm ±0.26 mm [0.01]
Note: tray dimensions refer to pocket center. For exact location of
product pick up surface, refer to mechanical drawing.
E
PKU 4000B PI series Intermediate Bus Converters
Input 36-75 V, Output up to 20 A / 100 W
EN/LZT 146 376 R3B July 2009
© Ericsson AB
Technical Specification
17
Ericsson Internal
PRODUCT SPEC.MECH. 3 (4)
Prepared (also subject responsible if other) No.
EXXUYNG 5/1301-BMR 654 Uen
Approved Checked Date Rev Reference
SEC/D [Betty Wu] See §1 2009-01-13 E
Product Qualification Specification
Characteristics
External visual inspection IPC-A-610
Change of temperature
(Temperature cycling) IEC 60068-2-14 Na
Temperature range
Number of cycles
Dwell/transfer time
-40 to 100°C
1000
15 min/0-1 min
Cold (in operation) IEC 60068-2-1 Ad Temperature T
A
Duration
-45°C
72 h
Damp heat IEC 60068-2-67 Cy
Temperature
Humidity
Duration
85°C
85 % RH
1000 hours
Dry heat IEC 60068-2-2 Bd Temperature
Duration
125°C
1000 h
Electrostatic discharge
susceptibility
IEC 61340-3-1, JESD 22-A114
IEC 61340-3-2, JESD 22-A115
Human body model (HBM)
Machine Model (MM)
Class 2, 2000 V
Class 3, 200 V
Immersion in cleaning solvents IEC 60068-2-45 XA, method 2
Water
Glycol ether
Isopropyl alcohol
55°C
35°C
35°C
Mechanical shock IEC 60068-2-27 Ea Peak acceleration
Duration
100 g
6 ms
Moisture reflow sensitivity
1
J-STD-020C Level 1 (SnPb-eutectic)
Level 3 (Pb Free)
225°C
260°C
Operational life test MIL-STD-202G, method 108A Duration 1000 h
Resistance to soldering heat
2
IEC 60068-2-20 Tb, method 1A Solder temperature
Duration
270°C
10-13 s
Robustness of terminations IEC 60068-2-21 Test Ua1
IEC 60068-2-21 Test Ue1
Through hole mount products
Surface mount products
All leads
All leads
Solderability
IEC 60068-2-58 test Td
1
IEC 60068-2-20 test Ta
2
Preconditioning
Temperature, SnPb Eutectic
Temperature, Pb-free
Preconditioning
Temperature, SnPb Eutectic
Temperature, Pb-free
150°C dry bake 16 h
215°C
235°C
Steam ageing
235°C
245°C
Vibration, broad band random IEC 60068-2-64 Fh, method 1
Frequency
Spectral density
Duration
10 to 500 Hz
0.07 g
2
/Hz
10 min in each direction
Notes
1
Only for products intended for reflow soldering (surface mount products)
2
Only for products intended for wave soldering (plated through hole products)
E
PKU 4000B PI series Intermediate Bus Converters
Input 36-75 V, Output up to 20 A / 100 W
EN/LZT 146 376 R3B July 2009
© Ericsson AB
Technical Specification
18
