IRHMS597260 Pre-Irradiation
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For footnotes refer to the last page
Source-Drain Diode Ratings and Characteristics
Parameter Min Typ Max Units Test Conditions
ISContinuous Source Current (Body Diode) — — -30
ISM Pulse Source Current (Body Diode) À— — -120
VSD Diode Forward Voltage — — -5.0 V Tj = 25°C, IS = -30A, VGS = 0V Ã
trr Reverse Recovery Time — — 300 ns Tj = 25°C, IF = -30A, di/dt ≤ -100A/µs
QRR Reverse Recovery Charge — — 6.0 µCV
DD ≤ -50V Ã
ton Forward Turn-On Time Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.
A
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
Parameter Min Typ Max Units Test Conditions
BVDSS Drain-to-Source Breakdown Voltage -200 — — VGS = 0V, ID = -1.0mA
∆BVDSS/∆TJTemperature Coefficient of Breakdown — -0.25 — V/°C Reference to 25°C, ID = -1.0mA
Voltage
RDS(on) Static Drain-to-Source On-State — — 0.103 VGS = -12V, ID = -19A
Resistance
VGS(th) Gate Threshold Voltage -2.0 — -4.0 VDS = VGS, ID = -1.0mA
gfs Forward Transconductance 23 — — VDS > -15V, IDS = -19A Ã
IDSS Zero Gate Voltage Drain Current — — -10 VDS= -160V ,VGS=0V
— — -25 VDS = -160V,
VGS = 0V, TJ = 125°C
IGSS Gate-to-Source Leakage Forward — — -100 VGS = -20V
IGSS Gate-to-Source Leakage Reverse — — 100 VGS = 20V
QgTotal Gate Charge — — 180 VGS =-12V, ID = -30A
Qgs Gate-to-Source Charge — — 75 nC VDS = -100V
Qgd Gate-to-Drain (‘Miller’) Charge — — 50
td(on) Turn-On Delay Time — — 50 VDD = -100V, ID = -30A
trRise Time — — 100 VGS =-12V, RG = 1.20Ω
td(off) Turn-Off Delay Time — — 190
tfFall Time — — 175
LS + LDTotal Inductance — 4.0 —
Ciss Input Capacitance — 7170 — VGS = 0V, VDS = -25V
Coss Output Capacitance — 920 — pF f = 1.0MHz
Crss Reverse Transfer Capacitance — 86 —
nA
Ã
nH
ns
µA
Note: Corresponding Spice and Saber models are available on International Rectifier Website.
Thermal Resistance
Parameter Min Typ Max Units Test Conditions
RthJC Junction-to-Case — — 0.6
RthCS Case-to-Sink — 0.21 — °C/W
RthJA Junction-to-Ambient — — 48 Typical socket mount
Ω
S
V
V
Measured from Drain lead (6mm /.25in.from
package) to Source lead (6mm /0.25in.
from package) with Source wires internally
bonded from Source Pin to Drain Pad