XTREME-GUARD™ ESD Suppressors
Surface Mount Polymeric Electrostatic Discharge Suppressors
© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/06/16
XTREME-GUARDTM ESD Suppressors protect sensitive
electronic equipment against extreme ESD conditions, in
very small 0402 and 0603 footprints. This series product is
specifically designed to suppress fast-rising ESD transients
up to 30kV while adding virtually no capacitance to the
circuit, which helps preserve signal integrity and minimize
data loss. It is a RoHS compliant, halogen free, and Pb free
and Pb free ESD Suppressor.
Description
Features
Applications
• Wearable Devices
• Notebooks/Laptops/PCs
• Gaming Consoles
• Smart TVs
• Smart Phones
• Tablets
• Set Top Boxes
• Networking and Wireless
Hardware
• Stationary and Portable
Medical Devices
• High ESD Rating up to
30kV Contact/Air
Discharge
• RoHS compliant, lead-free
and halogen-free
• Ultra-low capacitance
• Low leakage current
• Fast response time
• Bi-directional
• Withstands multiple
ESD strikes
• Compatible with
pick-and-place processes
• Available in 1000, 5000,
and 10000 piece reels
(EIA-RS481)
• High rated voltage up to
32V maximum
• High operating
temperature at 125ºC
Equivalent Circuits
Reflow Solder Wave Solder
1.27 (0.050")
0.76 (0.030")
3.30
(0.130")
3.05
(0.120")
1.27 (0.050")
0.51 (0.020")
0.76 (0.030") 0.76 (0.030")
1.66 +/- 0.06
(0.066" +/- 0.003”) 0.15 +/- 0.08
(0.006" +/- 0.003”)
0.84 +/- 0.05
(0.033" +/- 0.002”)
0.36 (0.014")
1.04
(0.041") REF
0.43 +/- 0.18
(0.017" +/- 0.007”)
Equivalent Circuit
Reference Dimensions:
2
1
0402 and 0603 Devices
Product Characteristics
Part Number Lines
Protected
Component
Package
Available as
Halogen-Free
XGD10402 1 0402 Ye s
XGD10603 1 0603 Ye s
Electrical Characteristics
Specification XGD10402 XGD10603 Notes
ESD Capability:
I
EC 61000-4-2
Contact Discharge (typical)
IEC 61000-4-2 Air Discharge (typical)
30kV
30kV
30kV
30kV
The ESD capability measured by direct and air discharge
method is subject to testing equipment and conditions.
Numerous factors could affect the reliability and reproducibility
of the direct and air discharge test results.
Trigger Voltage (typical)
Clamping Voltage (typical)
250V
40V
400V
40V
Measured per IEC 61000-4-2
8kV Direct Discharge Method
Trigger Voltage (typical)
Clamping Voltage (typical)
150V
40V
300V
28V Measured using 500V TLP Direct Discharge Method
Rated Voltage (maximum) 24V max 32V max
Capacitance (typical) 0.04 pF 0.09 pF Measured at 250MHz
Response Time <1nS <1nS
Leakage Current (typical) <1nA @24V <1nA @24V
ESD Pulse Withstand 1000
pulses min
1000
pulses min
Some shifting in characteristics may occur when tested over
multiple pulses at a very rapid rate
Note: Testing performed on Littelfuse test setup as described in Typical Test Setup Section on page 4 of this document.
XGD Series
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life
saving applications unless otherwise expressly indicated.
XTREME-GUARD™ ESD Suppressors
Surface Mount Polymeric Electrostatic Discharge Suppressors
© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/06/16
Typical Device Capacitance Typical ESD Response
0.01
0.10
1. 00
100 1,000 10,000
Frequency (MHz)
XGD10402
XGD10603
Capacitance (pF)
XGD10603
XGD10402
Signal Integrity: USB3.0 5Gbps
Signal Integrity : USB3.0 5Gbps
Without XGDWith XGD Device
Signal Integrity : USB3.1 10Gbps
With XGD DeviceWithout XGD
Signal Integrity : USB3.0 5Gbps
Without XGDWith XGD Device
Signal Integrity : USB3.1 10Gbps
With XGD DeviceWithout XGD
Without XGD Device With XGD Device
Signal Integrity: USB3.1 10Gbps
Signal Integrity : USB3.0 5Gbps
Without XGDWith XGD Device
Signal Integrity : USB3.1 10Gbps
With XGD DeviceWithout XGD
Signal Integrity : USB3.0 5Gbps
Without XGDWith XGD Device
Signal Integrity : USB3.1 10Gbps
With XGD DeviceWithout XGD
Without XGD Device With XGD Device
XTREME-GUARD™ ESD Suppressors
Surface Mount Polymeric Electrostatic Discharge Suppressors
© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/06/16
Environmental Specifications
Operating and Storage
Temperature -65°C to +125°C
Moisture Resistance
0402 and 0603 series:
85°C, 85% RH, 1000 hours
40°C, 95% RH, 1000 hours
Thermal Shock
MIL-STD-202, Method 107,
-65°C to 125°C, 30 min. cycle,
10 cycles
Vibration
MIL-STD-202, Method 201, (10
to 55 to 10 Hz, 1 min. cycle, 2
hrs each in X-Y-Z)
Chemical Resistance MIL-STD-202, Method 215
Physical Specifications
Materials Body: Glass Epoxy
Terminations: Copper/Nickel/Tin
Solderability MIL-STD-202, Method 208
Soldering
Parameters
Wave solder - 260°C, 10 seconds maximum
Reflow solder - 260°C, 30 seconds maximum
Design Consideration
Because of the fast rise-time of the ESD transient, proper
placement of XTREME-GUARD™ suppressors are a key
design consideration to achieving optimal ESD suppression.
The devices should be placed on the circuit board as close to
the source of the ESD transient as possible. Install XTREME-
GUARD™ suppressors (connected from signal/data line
to ground) directly behind the connector so that they are
the first board-level circuit component encountered by the
ESD transient.
Soldering Parameters
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
P
reheat
Ramp-up
R
amp-up
Ramp-down
amp-d
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (min to max) (ts)60 – 180 seconds
Average ramp up rate (Liquidus Temp
(TL) to peak 3°C/second max
TS(max) to TL - Ramp-up Rate 3°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL)60 – 150 seconds
Peak Temperature (TP)260°C
Time within 5°C of actual peak
Temperature (tp)10 – 30 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP)8 minutes max
Based on IPC/JEDEC J-STD-020
Packaging
Part Number Quantity & Packaging Code Quantity Packaging Option Packaging Specification
XGD10402 KR 10000 Tape & Reel (7” reel) EIA RS-481-1 (IEC 286, part 3)
XGD10603 MR 1000 Tape & Reel (7” reel) EIA RS-481-1 (IEC 286, part 3)
XGD10603 NR 5000 Tape & Reel (7” reel) EIA RS-481-1 (IEC 286, part 3)
XTREME-GUARD™ ESD Suppressors
Surface Mount Polymeric Electrostatic Discharge Suppressors
© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/06/16
Typical Test Setup
AGILENT INFINIIUM
1.5 GHz 8 GS/s
30dB PASTERNAK ATTENUATOR
PE7025-30
TEKTRONIX LOW CAP PROBE
6158 (20x TIP)
RESISTANCE
TEST FIXTURE
QUADTECH 1865
RESISTANCE METER
COMPUTER
FARADAY CAGE
ESD PULSE GENERATOR
TEST BOARD W/ DUT
ESD TEST FIXTURE
Tape and Reel Specifications
Description 0402 Series
(mm)
0603 Series
(mm)
Ct - Cover tape thickness 0.05 0.05
Dd - Drive hole diameter 1.50 1.50
Ds - Drive hole spacing 4.00 4.00
Pd - Pocket depth 0.56 0.58
Ph - Pocket height 1. 14 1.85
Ps - Pocket spacing 2.00 4.00
Pw - Pocket width 0.62 1.02
Tt - Carrier tape thickness 0.65 0.65
Tw - Carrier tape width 8.00 8.00
Tw
Ds
Ph
Pd
Dd
CtPs
Pw
Tt
Part Numbering System
XGD 1 0603 NR
QUANTITY &
PACKAGING CODE:
MR = 1000 pieces, tape & reel
NR = 5000 pieces, tape & reel
KR = 10,000 pieces, tape & reel
LINES PROTECTED:
1 = 1 line
DEVICE SIZE CODE:
0402 = 0402 (1005)
0603 = 0603 (1608)
LEAD-FREE
XTREME-GUARD™
ESD SUPPRESSORS
Dimensions
0402 Device 0603 Device
Reflow Solder Only
Recommended Pad Layout
1.55
(0.061")
.584 (0.023")
0.381 (0.015")
0.559 (0.022")
1.02 ± 0.05
(0.040" ± 0.002") 0.09 +/- 0.05
(0.004" ± 0.002")
0.51 ± 0.05
(0.020" ± 0.002")
0.46 ± 0.05
(0.018" ± 0.002")
0.23 ± 0.10
(0.009" ± 0.004")
Reference Dimensions:
Dimensions: mm (inch) Dimensions: mm (inch)
Reow Solder Wave Solder
0.76 (0.030")
3.30
(0.130")
3.05
(0.120")
0.51 (0.020")
0.76 (0.030")
0.76 (0.030")
1.27 (0.050") 1.27 (0.050")
Reflow Solder Only
Recommended Pad Layout
1.55
(0.061")
.584 (0.023")
0.381 (0.015")
0.559 (0.022")
1.68 ± 0.08
(0.066" ± 0.003") 0.19 +/- 0.08
(0.008" ± 0.003")
0.84 ± 0.05
(0.033" ± 0.002")
0.46 ± 0.05
(0.018" ± 0.002")
0.43 ± 0.18
(0.017" ± 0.007")
Reference Dimensions: