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Overview
The IS66/67WVE4M16EALL/BLL/CLL and IS66/67WVE4M16TALL/BLL/CLL integrated memory device
containing 64Mbit Pseudo Static Random Access Memory using a self-refresh DRAM array organized as 4M
words by 16 bits. The device includes several power saving modes : Partial Array Refresh mode where
data is retained in a portion of the array and Deep Power Down mode. Both these modes reduce standby
current drain. The die has separate power rails, VDDQ and VSSQ for the I/O to be run from a separate
power supply from the device core.
Asynchronous and page mode interface
Dual voltage rails for optional performance
ALL: VDD 1.7V~1.95V, VDDQ 1.7V~1.95V
BLL: VDD 2.7V~3.6V, VDDQ 2.7V~3.6V
CLL: VDD 1.7V~1.95V, VDDQ 2.7V~3.6V
Page mode read access
Interpage Read access : 60ns, 70ns
Intrapage Read access : 25ns
Low Power Consumption
Asynchronous Operation < 30 mA
Intrapage Read < 23mA
Standby < 200 uA (max.) at -40°C~85°C
Deep power-down (DPD)
ALL/CLL: < 3µA (Typ)
BLL: < 10µA (Typ)
Low Power Feature
Temperature Controlled Refresh
Partial Array Refresh
Deep power-down (DPD) mode
Operating temperature Range
Industrial: -40°C~85°C
Automotive A1: -40°C~85°C
Automotive A2: -40°C~105°C
Packages:
48-ball TFBGA
64Mb Async/Page PSRAM
Features
Copyright © 2018 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its
products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services
described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information
and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or
malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or
effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to
its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Notes:
1. The 48-pin TSOP-I package option is not yet available. Please contact SRAM Marketing at sram@issi.com
for additional information.
AUGUST 2018
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General Description
PSRAM products are high-speed, CMOS pseudo-static random access memory developed
for low-power, portable applications. The 64Mb DRAM core device is organized
as 4 Meg x 16 bits. These devices include the industry-standard, asynchronous memory
interface found on other low-power SRAM or pseudo-SRAM (PSRAM) offerings.
For seamless operation on an asynchronous memory bus, PSRAM products incorporated a
transparent self-refresh mechanism. The hidden refresh requires no additional support
from the system memory controller and has no significant impact on device read/write
performance.
A user-accessible configuration registers (CR) defines how the PSRAM device performs on-
chip refresh and whether page mode read accesses are permitted. This register is
automatically loaded with a default setting during power-up and can be updated at any
time during normal operation.
Special attention has been focused on current consumption during self-refresh. This
product includes two system-accessible mechanisms to minimize refresh current.
Setting sleep enable (ZZ#) to LOW enables one of two low-power modes: partial-array
refresh (PAR) or deep power-down (DPD). PAR limits refresh to only that part of the
DRAM array that contains essential data. DPD halts refresh operation altogether and is
used when no vital information is stored in the device. The system-configurable refresh
mechanisms are accessed through the CR.
[ Functional Block Diagram]
Address
Decode Logic
Configuration Register
(CR)
4096K X 16
DRAM
Memory Array
Input
/Output
Mux
And
Buffers
DQ0~DQ15
A0~A21
Control
Logic
CE#
WE#
OE#
LB#
UB#
ZZ#
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48Ball TFBGA Ball Assignment
[Top View]
(Ball Down)
1 2 3 4 5 6
A
B
C
D
E
F
G
H
LB# OE# A0
DQ8 UB# A3
DQ9 DQ10 A5
VSSQ DQ11 A17
DQ14 DQ13 A14
DQ15 A19 A12
A18 A8 A9
A1 A2 ZZ#
A4 CE# DQ0
A6 DQ1 DQ2
A7 DQ3 VDD
A15 DQ5 DQ6
A13 WE# DQ7
A10 A11 A20
VDDQ DQ12 A21 A16 DQ4 VSS
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Signal Descriptions
All signals for the device are listed below in Table 1.
Symbol Type Description
VSS Power Supply All VSS supply pins must be connected to Ground
VSSQ Power Supply All VSSQ supply pins must be connected to Ground
DQ0~DQ15 Input / Output Data Inputs/Outputs (DQ0~DQ15)
A0~A21 Input Address Input(A0~A21)
LB# Input Lower Byte select
UB# Input Upper Byte select
CE# Input Chip Enable/Select
OE# Input Output Enable
WE# Input Write Enable
ZZ# Input Sleep enable : When ZZ# is LOW, the CR can be loaded, or the device
can enter one of two low-power modes ( DPD or PAR).
Table 1. Signal Descriptions
ALL: VDD 1.7V~1.95V, VDDQ 1.7V~1.95V
BLL: VDD 2.7V~3.6V, VDDQ 2.7V~3.6V
CLL: VDD 1.7V~1.95V, VDDQ 2.7V~3.6V
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Functional Description
All functions for the device are listed below in Table 2.
Mode Power CE# WE# OE# UB#/LB# ZZ# DQ
[15:0]4Note
Standby Standby H X X X H High-Z 2,5
Read Active L H L L H Data-Out 1,4
Write Active L L X L H Data-In 1,3,4
No operation Idle L X X X H X 4,5
PAR PAR H X X X L High-Z 6
DPD DPD H X X X L High-Z 6
Load
Configuration
register
Active L L X X L High-Z
Table 2. Functional Descriptions
Notes
1. When UB# and LB# are in select mode (LOW), DQ0~DQ15 are affected as shown.
When only LB# is in select mode, DQ0~DQ7 are affected as shown. When only UB# is
in select mode, DQ8~DQ15 are affected as shown.
2. When the device is in standby mode, control inputs (WE#, OE#), address inputs, and data
inputs/outputs are internally isolated from any external influence.
3. When WE# is active, the OE# input is internally disabled and has no effect on the I/Os.
4. The device will consume active power in this mode whenever addresses are changed.
5. Vin=VDDQ or 0V, all device pins be static (unswitched) in order to achieve standby current.
6. DPD is enabled when configuration register bit CR[4] is “0”; otherwise, PAR is enabled.
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Functional Description
In general, this device is high-density alternatives to SRAM and Pseudo SRAM products popular
in low-power, portable applications.
The 64Mb device contains a 64Mb DRAM core organized as 4,194,304 addresses by
16 bits. This device include the industry-standard, asynchronous memory interface found on
other low-power SRAM or PSRAM offerings
Page mode access is also supported as a bandwidth-enhancing extension to the asynchronous
read protocol.
Power-Up Initialization
PSRAM products include an on-chip voltage sensor that is used to launch the power-up
initialization process. Initialization will load the CR with its default settings (see Table 3).
VDD and VDDQ must be applied simultaneously. When they reach a stable level above
VDD, the device will require 150μs to complete its self-initialization process ( see Figure 1).
During the initialization period, CE# should remain HIGH. When initialization is complete,
the device is ready for normal operation.
Figure 1: Power-Up Initialization Timing
VDD
Device Initialization
tPU > 150us Device ready for
normal operation
VDD
VDDQ
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Bus Operating Modes
PSRAM products incorporates the industry-standard, asynchronous interface. This bus interface
supports asynchronous Read and WRITE operations as well as page mode READ operation for
enhanced bandwidth. The supported interface is defined by the value loaded into the CR.
Asynchronous Mode Operation
PSRAM products power up in the asynchronous operating mode. This mode uses the industry-
standard SRAM control interface (CE#, OE#, WE#, and LB#/UB#).
READ operations are initiated by bringing CE#, OE#, and LB#/UB# LOW while keeping WE# HIGH
(see Figure 2). Valid data will be driven out of the I/Os after the specified access time has elapsed.
WRITE operations occur when CE#,WE#, and LB#/UB# are driven LOW (see Figure 3). During
WRITE operations, the level of OE# is a “Don’t Care”; WE# overrides OE#. The data to be written is
latched on the rising edge of CE#, WE#, or LB#/UB#, whichever occurs first. WE# LOW time must be
limited to tCEM.
Address
DQ0-
DQ15
CE#
UB#/LB#
OE#
WE#
VALID
ADDRESS
VALID
DATA
Figure 2. Asynchronous Read Operation
tRC = READ cycle Time
< tCEM
Notes:
1. tCEM during Asynchronous Read Operation does not apply to IS66/67WVE4M16TALL/BLL/CLL.
(1)
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Page Mode READ Operation
Page mode is a performance-enhancing extension to the legacy asynchronous READ
operation. In page-mode-capable products, an initial asynchronous read access is
preformed, then adjacent addresses can be read quickly by simply changing the low-
order address. Addresses A[3:0] are used to determine the members of the 16-address
PSRAM page. Any change in addresses A[4] or higher will initiate a new tAA access time.
Figure 4 shows the timing for a page mode access.
Page mode takes advantage of the fact that adjacent addresses can be read faster than
random addresses. WRITE operations do not include comparable page mode functionality.
The CE# LOW time is limited by refresh considerations. CE# must not stay LOW longer
than tCEM.
UB#/LB# Operation
The UB#/LB# enable signals accommodate byte-wide data transfers. During READ operations,
enabled bytes are driven onto the DQ. The DQ signals associated with a disabled byte are
put into a High-Z state during a READ operation. During WRITE operations, disabled bytes
are not transferred to the memory array. and the internal value remains unchanged. During
a WRITE cycle the data to be written is latched on the rising edge of CE#, WE#, LB# or UB#,
whichever occurs first.
When both the UB#/LB# are disabled (HIGH) during an operation, the device prevents the
data bus from receiving or transmitting data. Although the device may appear to be deselected,
it remains in active mode as long as CE# remains LOW.
Figure 4. Page Mode READ Operation
Address
DQ0-
DQ15
CE#
UB#/LB#
OE#
WE#
tAA
ADD3ADD2ADD1ADD0
D0 D1 D2 D3
tAPA tAPA tAPA
< tCEM
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Low-Power Feature
Standby Mode Operation
During standby, the device current consumption is reduced to the level necessary to
perform the DRAM refresh operation. Standby operation occurs when CE# and ZZ# are HIGH.
The device will enter a reduced power state upon completion of a READ or WRITE
operations when the address and control inputs remain static for an extended period of time.
This mode will continue until a change occurs to the address or control inputs.
Temperature Compensated Refresh
Temperature compensated refresh (TCR) is used to adjust the refresh rate depending on the
device operating temperature. DRAM technology requires more frequent refresh operations to
maintain data integrity as temperatures increase. More frequent refresh is required due to the
increased leakage of the DRAM's capacitive storage elements as temperatures rise. A decreased
refresh rate at lower temperatures will result in a savings in standby current.
TCR allows for adequate refresh at four different temperature thresholds: +15°C, +45°C, +70°C,
and +85°C. The setting selected must be for a temperature higher than the case temperature of
the device. If the case temperature is +50°C, the system can minimize self refresh current
consumption by selecting the +70°C setting. The +15°C and +45°C settings would result in
inadequate refreshing and cause data corruption.
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Partial-Array Refresh
Partial-array refresh (PAR) restricts refresh operation to a portion of the total memory
array. This feature enables the device to reduce standby current by refreshing only that
part of the memory array that is absolutely necessary. The refresh options are full array,
and none of the array. Data stored in addresses not receiving refresh will become
corrupted. Read and WRITE operations are ignored during PAR operation.
The device only enters PAR mode if the sleep bit in the CR has been set HIGH (CR[4] = 1).
PAR can be initiated by taking the ZZ# ball to the LOW state for longer than 10us.
Returning ZZ# to HIGH will cause an exit from PAR, and the entire array will be immediately
available for READ and WRITE operations.
Alternatively, PAR can be initiated using the CR software-access sequence (see “Software
Access to the Configuration Register”). Using this method, PAR is enabled
immediately upon setting CR[4] to “1” However, using software access to write to the CR
alters the function of ZZ# so that ZZ# LOW no longer initiates PAR, even though ZZ#
continues to enable WRITEs to the CR. This functional change persists until the next
time the device is powered up.
Deep Power-Down Operation
Deep power-down (DPD) operation disables all refresh-related activity. This mode is
used if the system does not require the storage provided by the PSRAM device. Any
stored data will become corrupted upon entering DPD. When refresh activity has been
re-enabled, the PSRAM device will require 150μs to perform an initialization procedure
before normal operations can resume. READ and WRITE operations are ignored during
DPD operation.
The device can only enter DPD if the sleep bit in the CR has been set LOW (CR[4] =0).
DPD is initiated by bringing ZZ# to the LOW state for longer than 10us. Returning ZZ# to
HIGH will cause the device to exit DPD and begin a 150us initialization process. During
this time, the current consumption will be higher than the specified standby levels, but
considerably lower than the active current specification.
Driving ZZ# LOW puts the device in PAR mode if the SLEEP bit in the CR has been set
HIGH (CR[4] = 1).
The device should not be put into DPD using the CR software-access sequence.
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Configuration Registers Operation
The configuration register (CR) defines how the PSRAM device performs a transparent self refresh.
Altering the refresh parameters can dramatically reduce current consumption during standby mode.
Page mode controls is embedded in the CR. This register can be updated any time the device is
operating in a standby state. The control bits used in the CR are shown in Table 3. At power-up,
the CR is set to 0070h.
Access Using ZZ#
The CR can be loaded using a WRITE operation immediately after ZZ# makes a HIGH-to-LOW
transition (see Figure 5). The values placed on addresses A[21:0] are latched into the CR on the
rising edge of CE# or WE#, whichever occurs first. LB#/UB# are “Don’t Care.” Access using ZZ#
is WRITE only.
Figure 5: Load Configuration Register Operation Using ZZ#
Address
CE#
ZZ#
WE#
VALID
ADDRESS
t < 500ns
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Software Access Sequence
The contents of the CR can be read or modified using a software access sequence. The
nature of this access mechanism can potentially eliminate the need for the ZZ# ball.
If the software-access mechanism is used, ZZ# can simply be tied to VDDQ; the port line
typically used for ZZ# control purposes will no longer be required. However, ZZ# should
not be tied to VDDQ if the system will use DPD; DPD cannot be enabled or disabled using
the software-access sequence.
The CR is loaded using a four-step sequence consisting of two READ operations followed
by two WRITE operations (see Figure 6). The READ sequence is virtually identical
except that an asynchronous READ is performed during the fourth operation (see
Figure 7).
The address used during all READ and WRITE operations is the highest address of the
PSRAM device being accessed (3FFFFFh); the content of this address is not changed by
using the software-access sequence. The data bus is used to transfer data into or out of
bit[15:0] of the CR.
Writing to the CR using the software-access sequence modifies the function of the ZZ#
ball. After the software sequence loads the CR, the level of the ZZ# ball no longer enables
PAR operation. PAR operation is updated whenever the software-access sequence loads
a new value into the CR. This ZZ# functionality will remain active until the next time the
device is powered up. The operation of the ZZ# ball is not affected if the software-access
sequence is only used to read the contents of the CR. Use of the software-access sequence
does not affect the performance of standard (ZZ#-controlled) CR loading.
Figure 6 : Configuration Register Write
Notes :
1. CR : 0000h
MAX
ADDRESS
OUTPUT
DATA
MAX
ADDRESS
OUTPUT
DATA
MAX
ADDRESS MAX
ADDRESS
CR
VALUE IN
*Note1
OE#
Address
DQ0-
DQ15
CE#
UB#/LB#
WE#
Read Read Write Write
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Bit Number Definition Remark
21 –8 Reserved All Must be set to “0”
7 Page 0 = Page mode disabled (default)
1 = Page mode enabled
6 –5 TCR
1 1 = +85°C (default)
0 0 = +70°C
0 1 = +45°C
1 0 = +15°C
4 Sleep 0 = DPD enabled
1 = PAR enabled (default)
3 Reserved Must be set to “0”
2 –0 PAR1000 = Full array (default)
100 = None of array
Table 3. Configuration Register
Notes :
1. Use of other setting will result in full-array refresh coverage.
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Partial-Array Refresh (CR[2:0]) Default = Full-Array Refresh
The PAR bits restrict REFRESH operation to a portion of the total memory array. The
refresh options are “full array” and “ none of the array.”
Sleep Mode (CR[4]) Default = PAR Enabled, DPD Disabled
The sleep mode bit defines the low-power mode to be entered when ZZ# is driven LOW.
If CR[4] = 1, PAR operation is enabled. If CR[4] = 0, DPD operation is enabled. PAR can
also be enabled directly by writing to the CR using the software-access sequence. Note
that this disables ZZ# initiation of PAR. DPD cannot properly be enabled or disabled
using the software-access sequence; DPD should only be enabled or disabled using ZZ#
to access the CR.
DPD operation disables all refresh-related activity. This mode is used when the system
does not require the storage provided by the PSRAM device. When DPD is enabled, any
stored data will become corrupted. When refresh activity has been re-enabled. The
PSRAM device will require 150us to perform an initialization procedure before normal
operation can resume. DPD should not be enabled using CR software access.
Temperature Compensated Refresh (CR[6:5]) Default = +85oC Operation
Temperature compensated refresh register bits can be programmed using the CR [5, 6]
configuration registers and has four different temperature levels: +15°C, +45°C, +70°C, and
+85°C. The temperature selected must be equal to or higher than the case temperature of
the device. Setting a lower temperature level would cause data to be corrupted due to
insufficient refresh rate.
Page Mode READ Operation (CR[7]) Default = Disabled
The page mode operation bit determines whether page mode READ operations are enabled
In the power-up default state, page mode is disabled.
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Electrical Characteristics (ALL)
Parameter Rating
Voltage to Any Ball Except VDD, VDDQ Relative to VSS -0.5V to (4.0V or VDDQ + 0.3V, whichever is less)
Voltage on VDD Supply Relative to VSS -0.2V to + 2.45V
Voltage on VDDQ Supply Relative to VSS -0.2V to + 2.45V
Storage Temperature (plastic) -55°Cto + 150°C
Operating Temperature -40°C to + 85°C
Soldering Temperature and Time
10s (solder ball only) + 260°C
Table 4. Absolute Maximum Ratings
Notes:
Stresses greater than those listed may cause permanent damage to the device. This is a
stress rating only, and functional operation of the device at these or any other
conditions above those indicated in this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect reliability.
Description Conditions Symbol MIN MAX Unit Note
Supply Voltage VDD 1.7 1.95 V
I/O Supply Voltage VDDQ 1.7 1.95 V
Input High Voltage VIH VDDQ-0.4 VDDQ+0.2 V 1
Input Low Voltage VIL -0.2 0.4 V 2
Output High Voltage IOH = -0.2mA VOH 0.8 VDDQ V
Output Low Voltage IOL = +0.2mA VOL 0.2 VDDQ V
Input Leakage Current VIN = 0 to VDDQ ILI 1 uA
Output Leakage Current OE#=VIH or
Chip Disabled ILO 1 uA
Operating Current Conditions Symbol Typ MAX Unit Note
Asynchronous Random
READ/WRITE VIN = VDDQ or 0V
Chip enabled,
IOUT = 0
IDD1 -70 25 mA 3
Asynchronous
PAGE READ IDD1P -70 20 mA 3
Standby Current VIN=VDDQ or 0V
CE# = VDDQ ISB 150 uA 4
Table 5. Electrical Characteristics and Operating Conditions
Operating Temperature (–40ºC < TC < +85ºC)
Notes:
1. Input signals may overshoot to VDDQ + 1.0V for periods less than 2ns during transitions.
2. Input signals may undershoot to VSS –1.0V for periods less than 2ns during transitions.
3. This parameter is specified with the outputs disabled to avoid external loading effects.
User must add required current to drive output capacitance expected in the actual system.
4. ISB (MAX) values measured with PAR set to FULL ARRAY at +85°C. In order to achieve low
standby current, all inputs must be driven to either VDDQ or VSS. ISB might be set slightly
higher for up to 500ms after power-up, or when entering standby mode.
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Electrical Characteristics (BLL)
Parameter Rating
Voltage to Any Ball Except VDD, VDDQ Relative to VSS -0.5V to (4.0V or VDDQ + 0.3V, whichever is less)
Voltage on VDD Supply Relative to VSS -0.2V to + 4.0V
Voltage on VDDQ Supply Relative to VSS -0.2V to + 4.0V
Storage Temperature (plastic) -55°Cto + 150°C
Operating Temperature -40°C to + 105°C
Soldering Temperature and Time
10s (solder ball only) + 260°C
Table 6. Absolute Maximum Ratings
Notes:
Stresses greater than those listed may cause permanent damage to the device. This is a
stress rating only, and functional operation of the device at these or any other
conditions above those indicated in this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect reliability.
Description Conditions Symbol MIN MAX Unit Note
Supply Voltage VDD 2.7 3.6 V
I/O Supply Voltage VDDQ 2.7 3.6 V
Input High Voltage VIH VDDQ-0.4 VDDQ+0.2 V 1
Input Low Voltage VIL -0.2 0.4 V 2
Output High Voltage IOH = -0.2mA VOH 0.8 VDDQ V
Output Low Voltage IOL = +0.2mA VOL 0.2 VDDQ V
Input Leakage Current VIN = 0 to VDDQ ILI 1 uA
Output Leakage Current OE#=VIH or
Chip Disabled ILO 1 uA
Operating Current Conditions Symbol Typ MAX Unit Note
Asynchronous Random
READ/WRITE VIN = VDDQ or 0V
Chip enabled,
IOUT = 0
IDD1 -70 30 mA 3
Asynchronous
PAGE READ IDD1P -70 23 mA 3
Standby Current VIN=VDDQ or 0V
CE# = VDDQ ISB Industrial 200 uA 4
Auto A2 300 uA
Table 7. Electrical Characteristics and Operating Conditions
Operating Temperature (–40ºC < TC < +105ºC)
Notes:
1. Input signals may overshoot to VDDQ + 1.0V for periods less than 2ns during transitions.
2. Input signals may undershoot to VSS –1.0V for periods less than 2ns during transitions.
3. This parameter is specified with the outputs disabled to avoid external loading effects.
User must add required current to drive output capacitance expected in the actual system.
4. ISB (MAX) values measured with PAR set to FULL ARRAY at +85°C. In order to achieve low
standby current, all inputs must be driven to either VDDQ or VSS. ISB might be set slightly
higher for up to 500ms after power-up, or when entering standby mode.
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Electrical Characteristics (CLL)
Parameter Rating
Voltage to Any Ball Except VDD, VDDQ Relative to VSS -0.5V to (4.0V or VDDQ + 0.3V, whichever is less)
Voltage on VDD Supply Relative to VSS -0.2V to + 2.45V
Voltage on VDDQ Supply Relative to VSS -0.2V to + 4.0V
Storage Temperature (plastic) -55°Cto + 150°C
Operating Temperature -40°C to + 85°C
Soldering Temperature and Time
10s (solder ball only) + 260°C
Table 8. Absolute Maximum Ratings
Notes:
Stresses greater than those listed may cause permanent damage to the device. This is a
stress rating only, and functional operation of the device at these or any other
conditions above those indicated in this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect reliability.
Description Conditions Symbol MIN MAX Unit Note
Supply Voltage VDD 1.7 1.95 V
I/O Supply Voltage VDDQ 2.7 3.6 V
Input High Voltage VIH VDDQ-0.4 VDDQ+0.2 V 1
Input Low Voltage VIL -0.2 0.4 V 2
Output High Voltage IOH = -0.2mA VOH 0.8 VDDQ V
Output Low Voltage IOL = +0.2mA VOL 0.2 VDDQ V
Input Leakage Current VIN = 0 to VDDQ ILI 1 uA
Output Leakage Current OE#=VIH or
Chip Disabled ILO 1 uA
Operating Current Conditions Symbol Typ MAX Unit Note
Asynchronous Random
READ/WRITE VIN = VDDQ or 0V
Chip enabled,
IOUT = 0
IDD1 -70 25 mA 3
Asynchronous
PAGE READ IDD1P -70 20 mA 3
Standby Current VIN=VDDQ or 0V
CE# = VDDQ ISB 150 uA 4
Table 9. Electrical Characteristics and Operating Conditions
Operating Temperature (–40ºC < TC < +85ºC)
Notes:
1. Input signals may overshoot to VDDQ + 1.0V for periods less than 2ns during transitions.
2. Input signals may undershoot to VSS –1.0V for periods less than 2ns during transitions.
3. This parameter is specified with the outputs disabled to avoid external loading effects.
User must add required current to drive output capacitance expected in the actual system.
4. ISB (MAX) values measured with PAR set to FULL ARRAY at +85°C. In order to achieve low
standby current, all inputs must be driven to either VDDQ or VSS. ISB might be set slightly
higher for up to 500ms after power-up, or when entering standby mode.
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IS66/67WVE4M16EALL/BLL/CLL
IS66/67WVE4M16TALL/BLL/CLL
Rev. D2 | August 2018 www.issi.com - SRAM@issi.com
Description Conditions Symbol TYP MAX Unit
Deep Power-Down
(ALL/CLL)
VIN=VDDQ or 0V; +25°C
ZZ# = 0V, CR[4] = 0 Izz 3 10 uA
Deep Power-Down
(BLL)
VIN=VDDQ or 0V; +25°C
ZZ# = 0V, CR[4] = 0 Izz 10 20 uA
Table 10. Deep Power-Down Specifications
Description Conditions Symbol MIN MAX Unit Note
Input Capacitance TC=+25°C;
f=1Mhz;
VIN=0V
CIN 2.0 6.5 pF 1
Input/Output Capacitance (DQ) CIO 3.5 6.5 pF 1
Table 11. Capacitance
Notes:
1. These parameters are verified in device characterization and are not 100% tested.
VDDQ/23Output
Figure 8. AC Input/Output Reference Waveform
Test Points
∫∫
∫∫
VDDQ/22Input1
VDDQ
VSS
Notes:
1. AC test inputs are driven at VDDQ for a logic 1 and VSS for a logic 0. Input rise and fall times
(10% to 90%) < 1.6ns.
2. Input timing begins at VDDQ/2.
3. Output timing ends at VDDQ/2.
DUT
30pF
50Ω
VDDQ/2
Test Point
Figure 9. Output Load Circuit
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IS66/67WVE4M16EALL/BLL/CLL
IS66/67WVE4M16TALL/BLL/CLL
Rev. D2 | August 2018 www.issi.com - SRAM@issi.com
Table 12. Asynchronous READ Cycle Timing Requirements
Symbol Parameter -55 -70 Unit Notes
Min Max Min Max
tAA Address Acess Time 60 70 ns
tAPA Page access Time 25 25 ns
tBA LB# /UB# access Time 60 70 ns
tBHZ
LB#/UB# disable to High-Z
output 8 8 ns 1
tBLZ
LB#/UB# enable to Low-Z
output 10 10 ns 2
tCEM
Maximum CE#
pulse width
Industrial 8 8
us 4
Auto A2 4 4
tCO Chip select access time 60 70 ns
tHZ Chip disable to High-Z output 8 8 ns 1
tLZ Chip enable to Low-Z output 10 10 ns 2
tOE Output enable to valid output 20 20 ns
tOH
Output hold from address
change 5 5 ns
tOHZ
Output disable to High-Z
output 8 8 ns 1
tOLZ
Output enable to Low-Z
output 3 3 ns 2
tPC Page cycle time 20 20 ns
tRC Read cycle time 60 70 ns 3
tCPH CE# HIGH time Read 5 5 ns
AC Characteristics
Notes:
1. Low-Z to High-Z timings are tested with the circuit shown in Figure 9. The High-Z timings
measure a 100mV transition from either VOH or VOL toward VDDQ/2.
2. High-Z to Low-Z timings are tested with the circuit shown in Figure 9. The Low-Z timings
measure a 100mV transition away from the High-Z (VDDQ/2) level toward either VOH or VOL.
3. Address is valid prior to or coincident with CE# LOW transition and is valid prior to or coincident with CE#
HIGH transition.
4. tCEM during Asynchronous Read Operation does not apply to IS66/67WVE4M16TALL/BLL/CLL
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IS66/67WVE4M16EALL/BLL/CLL
IS66/67WVE4M16TALL/BLL/CLL
Rev. D2 | August 2018 www.issi.com - SRAM@issi.com
Table 13 . Asynchronous WRITE Cycle Timing Requirements
Symbol Parameter -55 -70 Unit Notes
Min Max Min Max
tAS Address setup Time 0 0 ns
tAW Address valid to end of write 55 70 ns
tBW Byte select to end of write 55 70 ns
tCPH CE# HIGH time during write 5 5 ns
tCW Chip enable to end of Write 55 70 ns
tDH Data hold from write time 0 0 ns
tDW Data write setup time 23 23 ns
tLZ Chip enable to Low-Z output 10 10 ns 1
tOW End write to Low-Z output 5 5 ns 1
tWC Write cycle time 55 70 ns
tWHZ Write to High-Z output 8 8 ns 2
tWP Write pulse width 46 46 ns 4
tWPH Write pulse width HIGH 10 10 ns
tWR Write recovery time 0 0 ns 3
Notes:
1. Low-Z to High-Z timings are tested with the circuit shown in Figure 9. The
High-Z timings measure a 100mV transition from either VOH or VOL toward VDDQ/2.
2. High-Z to Low-Z timings are tested with the circuit shown in Figure 9. The
Low-Z timings measure a 100mV transition away from the High-Z (VDDQ/2) level toward
either VOH or VOL.
3. Write address is valid prior to or coincident with CE# LOW transition and is valid prior to or coincident with
CE# HIGH transition.
4. WE# LOW time must be limited to tCEM during write operation.
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IS66/67WVE4M16EALL/BLL/CLL
IS66/67WVE4M16TALL/BLL/CLL
Rev. D2 | August 2018 www.issi.com - SRAM@issi.com
Table14 . Load Configuration Register Timing Requirements
Symbol Parameter -55 -70 Unit Note
Min Max Min Max
tAS Address setup time 0 0 ns
tAW Address valid to end of write 55 70 ns
tCDZZ Chip deselect to ZZ# LOW 5 5 ns
tCPH CE# HIGH time during write 5 5 ns
tCW Chip enable to end of write 55 70 ns
tWC Write cycle time 55 70 ns
tWP Write pulse width 46 46 ns 2
tWR Write recovery time 0 0 ns 1
tZZWE ZZ# LOW to WE# LOW 10 500 10 500 ns
Symbol Parameter
-55 -70
Unit Notes
Min Max Min Max
tCDZZ Chip deselect to ZZ# LOW 5 5 ns
tRDeep Power-down recovery 150 150 us
tZZ(MIN) Minimum ZZ# pulse width 10 10 us
Table15 . DPD Timing Requirements
Symbol Parameter -55 -70 Unit Notes
Min Max Min Max
tPU
Initialization Period (required
before normal operations) 150 150 us
Table16 . Initialization Timing Requirements
Notes:
1. Write address is valid prior to or coincident with CE# LOW transition and is valid prior to or coincident with
CE# HIGH transition.
2. WE# LOW time must be limited to tCEM during configuration register load operation .
25
IS66/67WVE4M16EALL/BLL/CLL
IS66/67WVE4M16TALL/BLL/CLL
Rev. D2 | August 2018 www.issi.com - SRAM@issi.com
Timing Diagrams
Figure 10: Power-Up Initialization Timing
VDD, VDDQ
Device Initialization
tPU > 150us Device ready for
normal operation
VDD(MIN)
ZZ#
tZZ (MIN)
tR
Device ready for
normal operation
Figure 12: DPD Entry and Exit Timing
CE#
tCDZZ
Figure 11: Load Configuration Register
Address
CE#
OPCODE
tCW
tWR
tWP
tAW
tZZWE
tWC
UB#/LB#
tAS
tCDZZ
ZZ#
WE#
OE#
26
IS66/67WVE4M16EALL/BLL/CLL
IS66/67WVE4M16TALL/BLL/CLL
Rev. D2 | August 2018 www.issi.com - SRAM@issi.com
Figure 13: Single Read Operation
Address
DQ0-
DQ15
CE#
UB#/LB#
OE#
WE#
VALID
ADDRESS
VALID
OUTPUT
tCO
tOE
tHZ
tOLZ
tBA
tLZ (tBLZ)
tAA
tBHZ
tOHZ
tRC
Figure 14: PAGE MODE READ
A4-A20
DQ0-
DQ15
CE#
UB#/LB#
OE#
WE#
VALID
ADDRESS
VALID
OUTPUT
tCO
tOE
tHZ
tOLZ
tBA
tLZ
tAA
tBHZ
tOHZ
tRC
A0-A3 VALID
ADDRESS
VALID
OUTPUT
VALID
OUTPUT
VALID
OUTPUT
VALID
ADDRESS
VALID
ADDRESS
VALID
ADDRESS
tPC
tAPA
tOH
tCEM
27
IS66/67WVE4M16EALL/BLL/CLL
IS66/67WVE4M16TALL/BLL/CLL
Rev. D2 | August 2018 www.issi.com - SRAM@issi.com
Figure 15: CE#-Controlled Asynchronous WRITE
Address
DQ0-
DQ15
CE#
UB#/LB#
OE#
WE#
VALID
ADDRESS
VALID
INPUT
tCW tCPH
tBW
tAW
tWC
tWR
tAS
tWP
tDW tDH
tLZ
tWHZ
VALID or INVALID
OUTPUT
tOW 1
Note:
1. tDH shouldn’t be longer than tOW when End of Write changes operating mode into READ.
28
IS66/67WVE4M16EALL/BLL/CLL
IS66/67WVE4M16TALL/BLL/CLL
Rev. D2 | August 2018 www.issi.com - SRAM@issi.com
Figure 16: LB#/UB#-Controlled Asynchronous WRITE
Address
DQ0-
DQ15
CE#
UB#/LB#
OE#
WE#
VALID
ADDRESS
VALID
INPUT
tCW tHZ
tBW
tAW
tWC
tWR
tAS
tWP
tDW tDH
tLZ
tWHZ
VALID or INVALID
OUTPUT
tOW 1
Note:
1. tDH shouldn’t be longer than tOW when End of Write changes operating mode into READ.
tAS
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IS66/67WVE4M16EALL/BLL/CLL
IS66/67WVE4M16TALL/BLL/CLL
Rev. D2 | August 2018 www.issi.com - SRAM@issi.com
Figure 17: WE#-Controlled Asynchronous WRITE
Address
DQ0-
DQ15
CE#
UB#/LB#
OE#
WE#
VALID
ADDRESS
VALID
INPUT
tCW tHZ
tBW
tAW
tWC
tWR
tAS
tWPH tWP
tDW tDH
tLZ
tWHZ
tAS
VALID or INVALID
OUTPUT
Note:
1. tDH shouldn’t be longer than tOW when End of Write changes operating mode into READ.
tOW 1
30
IS66/67WVE4M16EALL/BLL/CLL
IS66/67WVE4M16TALL/BLL/CLL
Rev. D2 | August 2018 www.issi.com - SRAM@issi.com
Industrial Temperature Range: (-40oC to +85oC)
Config. Speed
(ns)
Order Part No. Package
4Mx16 55 IS66WVE4M16EBLL-55BLI 48-ball TFBGA, Lead-free
70 IS66WVE4M16EBLL-70BLI 48-ball TFBGA, Lead-free
Notes:
1. The 48-pin TSOP-I package option is not yet available. Please contact SRAM Marketing at sram@issi.com
for additional information.
BLL: VDD 2.7V~3.6V, VDDQ 2.7V~3.6V
Industrial Temperature Range: (-40oC to +85oC)
Config. Speed
(ns)
Order Part No. Package
4Mx16 70 IS66WVE4M16EALL-70BLI 48-ball TFBGA, Lead-free
Ordering Information for IS66/67WVE4M16EALL/BLL/CLL
ALL: VDD 1.7V~1.95V, VDDQ 1.7V~1.95V
Industrial Temperature Range: (-40oC to +85oC)
Config. Speed
(ns)
Order Part No. Package
4Mx16 70 IS66WVE4M16ECLL-70BLI 48-ball TFBGA, Lead-free
CLL: VDD 1.7V~1.95V, VDDQ 2.7V~3.6V
31
IS66/67WVE4M16EALL/BLL/CLL
IS66/67WVE4M16TALL/BLL/CLL
Rev. D2 | August 2018 www.issi.com - SRAM@issi.com
Automotive Temperature Range (A1): (-40oC to +85oC)
Config. Speed
(ns)
Order Part No. Package
4Mx16 70 IS67WVE4M16EBLL-70BLA1 48-ball TFBGA, Lead-free
Notes:
1. The 48-pin TSOP-I package option is not yet available. Please contact SRAM Marketing at sram@issi.com
for additional information.
2. A1 and A2 meet AEC-Q100 requirements.
BLL: VDD 2.7V~3.6V, VDDQ 2.7V~3.6V
Automotive Temperature Range (A1): (-40oC to +85oC)
Config. Speed
(ns)
Order Part No. Package
4Mx16 70 IS67WVE4M16EALL-70BLA1 48-ball TFBGA, Lead-free
Ordering Information for IS66/67WVE4M16EALL/BLL/CLL
ALL: VDD 1.7V~1.95V, VDDQ 1.7V~1.95V
Automotive Temperature Range (A1): (-40oC to +85oC)
Config. Speed
(ns)
Order Part No. Package
4Mx16 70 IS67WVE4M16ECLL-70BLA1 48-ball TFBGA, Lead-free
CLL: VDD 1.7V~1.95V, VDDQ 2.7V~3.6V
Automotive Temperature Range (A2): (-40oC to +105oC)
Config. Speed
(ns)
Order Part No. Package
4Mx16 70 IS67WVE4M16EBLL-70BLA2 48-ball TFBGA, Lead-free
32
IS66/67WVE4M16EALL/BLL/CLL
IS66/67WVE4M16TALL/BLL/CLL
Rev. D2 | August 2018 www.issi.com - SRAM@issi.com
Ordering Information for IS66/67WVE4M16TALL/BLL/CLL
ALL: VDD 1.7V~1.95V, VDDQ 1.7V~1.95V
Industrial Temperature Range: (-40oC to +85oC)
Config. Speed
(ns)
Order Part No. Package
4Mx16 55 IS66WVE4M16TBLL-55BLI 48-ball TFBGA, Lead-free
70 IS66WVE4M16TBLL-70BLI 48-ball TFBGA, Lead-free
BLL: VDD 2.7V~3.6V, VDDQ 2.7V~3.6V
Industrial Temperature Range: (-40oC to +85oC)
Config. Speed
(ns)
Order Part No. Package
4Mx16 70 IS66WVE4M16TALL-70BLI 48-ball TFBGA, Lead-free
Industrial Temperature Range: (-40oC to +85oC)
Config. Speed
(ns)
Order Part No. Package
4Mx16 70 IS66WVE4M16TCLL-70BLI 48-ball TFBGA, Lead-free
CLL: VDD 1.7V~1.95V, VDDQ 2.7V~3.6V
33
IS66/67WVE4M16EALL/BLL/CLL
IS66/67WVE4M16TALL/BLL/CLL
Rev. D2 | August 2018 www.issi.com - SRAM@issi.com
Automotive Temperature Range (A1): (-40oC to +85oC)
Config. Speed
(ns)
Order Part No. Package
4Mx16 70 IS67WVE4M16TBLL-70BLA1 48-ball TFBGA, Lead-free
Notes:
1. The 48-pin TSOP-I package option is not yet available. Please contact SRAM Marketing at sram@issi.com
for additional information.
2. A1 and A2 meet AEC-Q100 requirements
BLL: VDD 2.7V~3.6V, VDDQ 2.7V~3.6V
Automotive Temperature Range (A1): (-40oC to +85oC)
Config. Speed
(ns)
Order Part No. Package
4Mx16 70 IS67WVE4M16TALL-70BLA1 48-ball TFBGA, Lead-free
Ordering Information for IS66/67WVE4M16TALL/BLL/CLL
ALL: VDD 1.7V~1.95V, VDDQ 1.7V~1.95V
Automotive Temperature Range (A1): (-40oC to +85oC)
Config. Speed
(ns)
Order Part No. Package
4Mx16 70 IS67WVE4M16TCLL-70BLA1 48-ball TFBGA, Lead-free
CLL: VDD 1.7V~1.95V, VDDQ 2.7V~3.6V
Automotive Temperature Range (A2): (-40oC to +105oC)
Config. Speed
(ns)
Order Part No. Package
4Mx16 70 IS67WVE4M16TBLL-70BLA2 48-ball TFBGA, Lead-free
