I06-0074
D
D
1
GVJ 2006/06/06
2006/06/22
2006/06/22
1998/12/16
.000±.00X
.00±0.1
1998/12/16
GEORGE.V.JOSEPH
GEORGE.V.JOSEPH
K_V_SIVADAS
GEORGE.V.JOSEPH
0°±1°
6
C-DD-0046
DELTA-D
THE HOUSING WILL WITHSTAND EXPOSURE TO 260-265°C
2 MIN.MATTE TIN TOP OVER
1.27 MIN.NICKEL UNDER PLATE(ON TERMINATION ZONE)
OR PROTECTIVE METALLIC DEVICE
IF WE USE PROTECTIVE ADHESIVE (type Kapton or Teflon)
COPPER ALLOY
GOLD OVER NICKEL
TIN LEAD OVER NICKEL
1000V
300V
< 25m
< 5m
> 5000M
-55°C +125°C
5 N Max./ 0.3 N Min.
200 (FLASH Au); 500 (0.76µ Au)
OPERATING TEMPERATURE RANGE
MATING/UNMATING CYCLES (MIN)
MECHANICAL CHARACTERISTICS
INSERTION/EXTRACTION FORCE PER CONTACT :
:
ELECTRICAL DATA
MAX.CURRENT RATING
CONTACT RESISTANCE
INSULATION RESISTANCE
ENVIRONMENTAL CHARACTERISTICS.
SHELL RESISTANCE
TEST VOLTAGE
RATED VOLTAGE
:
:
:
:
:
:
5A
:
FOR LEAD FREE PLATING
PLATING
ACTIVE ZONE
TERMINATION ZONE
CONTACTS
:µ
:
:
:
µ
STEEL TIN/Zinc Cr 3 PLATED.
TECHNICAL SPECIFICATIONS
SELF EXTINGUISHING BLACK POLYESTER
MATERIAL
SHELL
INSULATORS :
:
UL CLASS 94V0
Packaging as per GS-14-920
"This LF product meets European Union Directives and other country
regulations as described in GS-22-008"
The housing will withstand exposure to 260°C peak temperature for 3.5 seconds
in a wave solder application with a 1.6mm minimum thick circuit board.
D
NO.OF CONTACTS
TYPE OF CONTACTS
33-ANGLED SPILL
PITCH 2.84 USA
TYPE OF TERMINATION
FOOT PRINT 8.08 USA
S-SOCKET
09,15,25 & 37
I
SERIES LEAD FREE
E-3.18 US STANDARD
HEIGHT OF TERMINATION
00->STANDARD
SPECIAL CODE
PLATING
6->0.76 Au+Sn/SnPb
4->FLASH Au+Sn/SnPb
MOUNTING OPTIONS
PA->STANDARD HOLE
µ
PCB DRILLING DETAILS
ORDERING INFORMATION
52 3S4E3AP 00 L F
PDM: Rev:D Released .STATUS: Printed: Jan 18, 2011