ROK 101 008
Bluetooth Module
Description
ROK 101 008 is a short-range module for implementing
Bluetooth functionality into various electronic devices. The mod-
ule consists of three major parts; a baseband controller, a flash
memory, and a radio that operates in the globally available 2.4–
2.5 GHz free ISM band.
Both data and voice transmission is supported by the module.
Communication between the module and the host controller is
carried out via UART and PCM interface.
ROK 101 008, which is compliant with Bluetooth version 1.0B
and critical errata, is a Class 2 Bluetooth Module (0 dBm) and is
type-approved.
Key Features
Qualified to Bluetooth 1.0B
RF output power class 2
FCC and ETSI approved
460 kb/s max data rate over UART
UART and PCM interface
•I
2C interface
Internal crystal oscillator
HCI firmware included
Point to Point connection
Built-in shielding
Supported Bluetooth Profiles
Generic Access Profile
Service Discovery Application Profile
Serial Port Profiles
- Dial-up networking
- Fax
- Headset
Generic Object Exchange Profiles
- File transfer
- Object Push
- Synchronisation
Suggested Applications
Computers and peripherals
Handheld devices and accessories
Access points
ROK 101 008
2
ROK 101 008
Figure 1. Block Diagram
Figure 2. Actual size of the Bluetooth Module and also showing the HW and FW stack.
0 1 2 3 cm
Radio
Baseband
Audio
Link Manager
HCI
RX-
Balun
Radio
ASIC
ANT
T2
TX-
Balun
Switch Antenna
Filter
Loop
Filter
VCO
Tank
FLASH
Memory
13MHz
Crystal
Voltage
Regulation
GND
B3
R1
R2
T1
C6 VCC
C4 VCC_IO
C2 ON
RESET#
POR
NC
NC
NC
NC
NC
R4
R5
R6
T4
T5
T6
C3
Radio Module
ADDR
DATA
CTRL
R3
C5 NC
PBA 313 01/2
Baseband
TXD
RTS
RXD
CTS
A5
A6
B5
B6
UART
PCM_OUT
PCM_CLK
PCM_IN
PCM_SYNC
A1
A2
A3
A4
PCM T3
GND
GND
GND
GND
I2C_DATA
I2C_CLK
NC
NC
NC
NC
R5
R6
T4
T5
3
ROK 101 008
Absolute Maximum Ratings
Parameter Symbol Min Max Unit
Temperature
Storage temperature TStg -30 +85 °C
Operating temperature TAmb 0 +75 °C
Power Supply
VCC VCC -0.3 +5.25 V
VCC_IO VCC_IO -0.8 +3.6 V
Digital Inputs
Input low voltage VIL -0.5 V
Input high voltage VIH VCC_IO + 0.3 V
Antenna Port
Input RF power In-band 15 dBm
Out of band 15 dBm
Recommended Operating Conditions
Parameter Symbol Min Typ Max Unit
Temperature
Ambient temperature, Test TAmb +23 °C
Power Supply
Positive Supply Voltage VCC +3.3 V
I/O Ports Supply Voltage VCC_IO +3.3 V
DC Specifications
Unless otherwise noted, the specification applies for Tamb = 0 to +75°C
Parameter Condition Symbol Min Typ Max Unit
Power Supply
Supply Voltage VCC 3.175 3.3 5.25 V
I/O Ports Supply Voltage VCC_IO 2.7 3.3 3.6 V
Digital Inputs
Logical Input High Except ON signal VIH1 0.7xVCC_IO VCC_IO V
Logical Input Low Except ON signal VIL2 0 0.3xVCC_IO V
Logical Input High ON signal only VIH2 2.0 VCC V
Logical Input Low ON signal only VIL2 0 0.4 V
RESET# Input Low RESET# signal only VRESET 0 0.4 V
Digital Outputs
Logical Output High VOH 0.9xVCC_IO VCC_IO V
Logical Output Low VOL 0 0.1xVCC_IO V
4
ROK 101 008
Current Consumption
Parameter Condition Symbol Min Typ Max Unit
Average Current Consumption ICC + ICC_IO
HW Shutdown state See note 1 ISHW A
SW Standby Mode Can only be woken up via UART ISTA1 250 µA
see note 3
Can be woken up via ISTA2a 1.5 mA
UART and via RF
see notes 2 & 3
Idle state After HCI - reset IIDL1 15 mA
After a H/W reset IIDL2 23 mA
Connection Mode Master Mode ICS_M 35 mA
Slave Mode ICS_S 25 mA
VCC_IO supply ICC_IO 2mA
Notes
1. Current consumption is based upon when the pin 'ON ' is
low and 'VCC_IO ' is grounded.
2. HCI basic settings have not been sent to UUT.
3. Implemented by using the Ericsson_HCI_Save_Power
command. ISTA1 is entered by sending the following
command '0123 FC01 03'. ISTA2 is entered by the
command '0123 FC01 02'.
Timing Performance
Parameter Condition Symbol Min Typ Max Unit
System start-up time 1250 ms
from power on
RESET# signal duration Sink current > 1mA 1 ms
Firmware timer resolution 6.55 ms
PCM
Parameter Condition Symbol Min Typ Max Unit
PCM clock frequency See fig 3 & 4 Master mode fPCM_CLK 2000 kHz
Slave mode fPCM_CLK 128 2048 kHz
PCM sample rate sync. frequency fPCM_SYNC 8 kHz
See fig 3 & 4
PCM clock high period tCCH 200 ns
PCM clock low period tCCL 200 ns
PCM_SYNC (setup) to PCM CLK (fall) See fig 5 tPSS 100 1000 ns
PCM_SYNC pulse length See fig 5 tPSH 200 460 ns
PCM_X in (setup) to PCM_CLK (fall) tDSL 100 ns
PCM_X in (hold) from PCM_CLK (fall) tDSH 100 ns
PCM_X out valid from PCM_CLK (rise) tPDLP 150 ns
Figure 3. Figure 4. Figure 5.
5
ROK 101 008
RF Specifications
General
Parameter Condition Symbol Min Typ Max Unit
Frequency range 2.402 2.480 GHz
Antenna load 50 W
VSWR RX mode 2:1
VSWR TX mode, see note 4 2:1
Notes
4. During the TX mode, the VSWR specification states the limits that are acceptable before any other RF parameters are strongly
effected. i.e. frequency deviation and initial frequency error.
Receiver Performance (0.1% BER)
Parameter Condition Symbol Min Typ Max Unit
Sensitivity level -75 -70 dBm
Max input level -20 dBm
Spurious Emissions 30MHz to 1GHz -74 -57 dBm
Spurious Emissions 1GHz to 12.75GHz -60 -47 dBm
Transmitter Performance
Parameter Condition Symbol Min Typ Max Unit
Frequency deviation fMOD 140 155 170 kHz
TX power -6 +2 +4 dBm
TX carrier drift 1 slot FDRIFT(1) -25 +5 +25 kHz
3 slots FDRIFT(3) -40 +10 +40 kHz
5 slots FDRIFT(5) -40 +15 +40 kHz
20dB bandwidth Peak detector 750 1000 kHz
Spurious Emissions 30MHz - 1GHz -36 dBm
1GHz - 12.75GHz -30 dBm
1.8GHz - 1.9GHz -47 dBm
5.15GHz - 5.3GHz -47 dBm
6
ROK 101 008
Pin Description
Pin Pin Name Type Direction Description
A1 PCM_IN CMOS In PCM data, see notes 5,6
A2 PCM_OUT CMOS Out PCM data, see notes 5,6
A3 PCM_SYNC CMOS In/Out Sets the PCM data sampling rate, see notes 5,6
A4 PCM_CLK CMOS In/Out PCM clock that sets the PCM data rate, see notes 5,6
A5 RXD CMOS Input RX data to the UART, see note 6
A6 RTS CMOS Input Flow control signal, Request To Send data from UART, see notes 5,6
B1 NC - - Do not connect
B2 NC - - Do not connect
B3 GND Power Power Signal ground
B4 NC - - Do not connect
B5 TXD CMOS Output TX data from the UART, see note 6
B6 CTS CMOS Output Flow control signal, Clear To Send data from UART, see note 6
C1 NC - - Do not connect
C2 ON Power Input When tied to VCC, the module is enabled.
C3 I2C_CLK CMOS Output I2C clock signal, see note 6
C4 VCC_IO Power Power External supply rail to the Input / Output ports
C5 NC - - Do not connect
C6 VCC Power Power Supply Voltage
R1 GND Power Power Signal ground
R2 GND Power Power Signal ground
R3 RESET# CMOS Input Active low reset, see note 7
R4 NC - - Do not connect
R5 NC - - Do not connect
R6 NC - - Do not connect
T1 GND Power Power Signal Ground
T2 ANT RF In/Out 50W Antenna connection
T3 GND Power Power Signal Ground
T4 NC Power Power Test point, internal voltage regulator - Do not connect
T5 NC - - Do not connect
T6 I2C_DATA CMOS In/Out I2C data signal, see note 6
Notes
5. 100kW pull-up resistors to VCC_IO are incorporated on the
module. PCM signals direction is programmable.
6. CMOS buffers are low voltage TTL compatible signals.
7. RESET# signal must be fed from an open drain output.
7
ROK 101 008
Figure 6. Mechanical dimensions
Mechanical Specification
2.95 max
without solder balls
Pad size: 35 mil = 0.889 mm
Tolerance on placement: 0.02 mm
approx 0.2 mm
Detail A
Detail A
16.8 0.2
0.54 0.2
Co-planarity 0.1 mm
9.47
32.8 0.2
14.1 0.2
7.85 0.2
1.6 0.2
15.7 0.2
14.1 0.2
7.85 0.2
5.05 0.2
TRCBA
6
1
2
3
4
5
5.72
6.98
22.22
23.5
24.76
1.6 0.2
3.12
4.39
5.66
6.93
8.2
8
ROK 101 008
Figure 7. Simplified Block Diagram
RX-
Balun
Radio
ASIC ANT
TX-
Balun
Switch Antenna
Filter
Loop
Filter
VCO
Tank
Base-
band
FLASH
Memory
13MHz
Crystal
Voltage
Regulation
I2C Interface (2)
UART Interface (4)
PCM Voice
Interface (4)
POWER (3)
RESET
ADDR
DATA
CTRL
Radio Module
PBA 313 01/2
1
2
3
4
5
Radio
Baseband
Audio
Link Manager
HCI
Figure 8. HW/FW parts included in the Ericsson
Buetooth module.
Functional Description
The ROK 101 008 is a complete Bluetooth module that
has been specified and designed according to the
Bluetooth System v1.0B . Its implementation is based on
a high-performance integrated radio transceiver (PBA 313
01/2) working with a baseband controller, a flash memory
and surrounding secondary components.
Block Diagram
ROK 101 008 has five major operational blocks. Figure 7
illustrates the interaction of the various blocks. The
functionality of each block is as follows:
1. Radio functionality is achieved by using the
Bluetooth Radio, PBA 313 01/ 2. Six operational
blocks are shown for the radio section and their
operation is as follows:
1a) VCO-tank is a part of the phase locked loop. The
modulation is performed directly on the VCO. To
ensure high performance the VCO-tank is laser
trimmed.
1b) Loop filter, filters the tuning voltage of the VCO-tank.
1c) RX-balun handles transformation from unbalanced to
balanced transmission.
1d) TX-balun handles biasing of the output amplifier
stage and transformation from balanced to unbal-
anced transmission.
1e) Antenna switch directs the power either from the
antenna filter to the receive ports or from the ASIC
output ports to the antenna filter.
1f) Antenna filter band-pass filters the radio signal.
2. The baseband controller is an ARM7-Thumb based
chip that controls the operation of the radio trans-
ceiver via the UART interface. Additionally, the
baseband controller has a PCM Voice and I2C
interface. The baseband controller ROP 101 1112/C
is used.
3. A Flash memory is used together with the baseband
controller. Please, refer also to the Firmware section.
4. The voltage regulation block regulates and filters the
supply voltage. VCC is typically 3.3V and two regu-
lated voltages are produced.
5. An internal clock is mounted on the module. The
clock frequency is 13MHz and is generated from a
crystal oscillator that guarantees a timing accuracy
within ± 20ppm.
Bluetooth Module stack
The Host Controller Interface (HCI) handles the commu-
nication by the transport layer through the UART inter-
face with the host, see figure 8. The Baseband and radio
provides a secure and reliable radio link for higher layers.
The following sections describe the Bluetooth module
stack in more detail. It is implemented in accordance with
and complies with the Specification of the Bluetooth
System v1.0B .
Bluetooth Radio Interface
The Bluetooth module is a class 2 device with 4dBm
maximum output power with no power control needed.
Nominal range of the module with a typical antenna is up
to a range of 10 m (at 0 dBm). It is compliant with FCC
and ETSI regulations in the ISM band.
9
ROK 101 008
User Payload Symetric Asymetric
Type (bytes) FEC CRC Max. rate Max.rate
ID na na na na na
NULL na na na na na
POLL na na na na na
FHS 18 2/3 yes na na
Link control packets
Asymetric
Payload User Symetric Max rate (kb/s)
Header Payload Max. rate
Type (bytes) (bytes) FEC CRC (kb/s) Forward Reverse
DM1 1 0-17 2/3 yes 108.8 108.8 108.8
DH1 1 0-27 no yes 172.8 172.8 172.8
DM3 2 0-121 2/3 yes 258.1 387.2 54.4
DH3 2 0-183 no yes 390.4 585.6 86.4
DM5 2 0-224 2/3 yes 286.7 477.8 36.3
DH5 2 0-339 no yes 433.9 723.2 57.6
ACL packets
Symetric
Payload header User Payload Max. rate
Type (bytes) (bytes) FEC CRC (kb/s)
HV1 na 10 1/3 no 64.0
HV3 na 30 no no 64.0
DV 1D 10+(0-9) D 2/3 D Yes D 64.0+57.6 D
SCO packets
LM
LM
LC
RF
LC
RF
LMP
Physical layer
Table 1: Link Control Packets Table, ACL Packets Table,
SCO packets
Figure 9. Link manager
Baseband
By default the first unit setting up a connection is the
master of the point to point link. The master transmits in
the even timeslots and the slave transmits in the odd
timeslots.
For full duplex transmission, a Time-Division Duplex
(TDD) scheme is used. Packets are sent over the air in
timeslots, with a nominal length of 625 µs. A packet can
be extended to a maximum of 5 timeslots (DM5 and DH5
packets) and is then sent by using the same RF channel
for the entire packet.
Two types of connections are provided - Asynchronous
Connectionless Link (ACL) for data and the Synchronous
Connection Oriented Link (SCO) for voice. Only two
64kb/s voice channel are supported, HV1 and HV3.
Furthermore, there are also packages used for link control
purposes.
A variety of different packet types with error correction
schemes and data rates can be used over the air interface.
Also asymmetric communication is available for high
speed communication in one direction.
The Baseband provides the link-setup and control
routines for the layers above. Furthermore, the Baseband
also provides Bluetooth security like encryption, authen-
tication and key management.
Please refer to the Specification of the Bluetooth System
v1.0B part B for in-depth information regarding the
Baseband.
Firmware (FW)
The module includes firmware for the host controller
interface, HCI, and the link manager, LM.
The FW resides in the Flash and is available in object
code format.
Link Manager (LM)
The Link Manager in each Bluetooth module can commu-
nicate with another Link Manager by using the Link
Manager Protocol (LMP) which is a peer to peer protocol.
The LMP messages have the highest priority and are used
for link-setup, security, control and power saving modes.
The receiving Link Manager filter-out the message and
does not need to acknowledge the message to the
transmitting LM due to the reliable link provided by the
Baseband and radio.
LM to LM communication can take place without actions
taken by the host. Discovery of features at other
Bluetooth enabled devices nearby can be found and
saved for later use by the host.
Please refer to the Specification of the Bluetooth System
v1.0B part C for in-depth information regarding the LMP.
Host Control Interface (HCI)
The HCI provides a uniform command I/F to the
Baseband and Link Manager and also to HW status
registers.
There are three different types of HCI packets:
HCI command packets – from host to Bluetooth
module HCI.
HCI event packets – from Bluetooth module HCI to
host.
HCI data packets – going both ways.
It is not necessary to make use of all different commands
and events for an application. If the application is aimed
10
ROK 101 008
at a pre-specified profile, the capabilities of such a profile
is necessary to adjust to – see Specification of the
Bluetooth System v1.0B Profiles.
The interface for communicating with the Bluetooth
module is achieved with the HCI UART Transport Layer
on top of HCI, the module will communicate with a host
through the UART I/F. The PCM I/F is also available for
communicating voice.
Please refer to the Specification of the Bluetooth System
v1.0B part H:1-4 for in-depth information regarding the
HCI and different transport layers
Module HW Interfaces
UART Interface
The UART implemented on the module is an industry
standard 16C450 and supports the following baud rates:
300, 600, 900, 1200, 1800, 2400, 4800, 9600, 19200,
38400, 57600, 115200, 230400 and 460800 bits/s. 128
byte FIFOs are associated with the UART.
Four signals will be provided for the UART interface. TxD
& RxD are used for data flow, and RTS & CTS is used for
flow control.
Please refer to the Specification of the Bluetooth System
v1.0B part H:4 regarding the HCI and UART transport
layers.
PCM Voice Interface
The standard PCM interface has a sample rate of 8 kHz
(PCM_SYNC). The PCM clock is variable between 128
kHz and 2.0 MHz in the PCM slave mode. The PCM data
can be linear PCM (13-16bit), µ-Law (8bit) or A-Law
(8bit).
The PCM I/F can be either master or slave – providing or
receiving the PCM_SYNC. Redirection of PCM_OUT and
PCM_IN can be accomplished as well.
Over the air the encoding is programmable to be, CVSD
and A-Law or µ-Law.
I2C Interface
A master I2C I/F is available on the module. The control of
the I2C pins are performed by Ericsson specific HCI
commands available in the FW implementation – see
Appendix C.
Antenna
The ANT pin should be connected to a 50W-antenna
interface, thereby supporting the best signal strength
performance. Ericsson Microelectronics can recommend
application specific antennas – see Appendix C.
RESET#
The assignment of the RESET# input is to generate a
reset signal to the complete Bluetooth module. During
power-up the reset signal is set ‘low’ automatically so
that power supply glitches are avoided. Therefore no
reset input should be required after power-up.
Power-up Sequence
There is no need for a power up sequence if VCC, ON and
VCC_IO are tied together.
A power up sequence, if used, shall be applied accord-
ingly: Connection of the supply rails, GND and then VCC;
then the ON signal should be applied in order to initiate
the internal regulators; and finally, the VCC_IO supply rail
can be activated.
The power-down sequence is similar to the power-up
procedure but in the reverse format. Therefore, the
disconnection of the signals shall be as follows: VCC_IO,
ON,VCC and finally GND.
Power
There are three inputs to the Voltage Management section
(VCC, VCC_IO, ON). VCC is the supply voltage that is typically
3.3V.
4
4
RS 232
transceiver
Codec PCM
UART
VCC_IO
VCC
RS232
GND
Bluetooth
Module
GND
VCC_IO ON VCC
ON
Figure 10. Application block schematics. A typical UART or PCM configuration.
11
ROK 101 008
A separate power supply rail (VCC_IO) is provided for the I/
O ports, UART and PCM. VCC_IO can either be connected
to VCC or to a dedicated supply rail, which is the same as
the logical interface of the host.
Shielding / EMC Requirements
The module has its own RF shielding and is approved
according to the standards by FCC and ETSI.
If the approval number is not visible on the outside when
the module is utilized in the final product, an exterior
label must state that there is a transmitter module inside
the product.
Ground
Ground should be distributed with very low impedance as
a ground plane. Connect all GND pins to the ground
plane.
Assembly Guidelines
Solder Paste
The ROK 101 008 module is made for surface mounting
and the SSP connection pads have been formed after
printing eutectic Tin/Lead solder paste. The solder paste
to use is not critical as long as this is a normal eutectic
solder paste. A preferred solder paste height is 150µm.
Soldering Profile
It must be noted that the module should not be allowed
to be hanging upside down in the re-flow operation. This
means that the module has to be assembled on the side
of the PCB that is soldered last.
The re-flow process should be a regular surface mount
soldering profile (full convection strongly preferred); the
ramp-up should not be higher than 2oC/s and with a peak
temperature of 210-235oC during 20-60 seconds.
Pad Size
It is recommended that the pads on the PCB should have
a diameter of 0.7-0.9 mm. The surface finish on the PCB
pads should be Nickel/Gold or a flat Tin/Lead surface or
OSP (Organic Surface Protection).
Placement
The placement machine should be able to recognize odd
BGA combinations (all ball recognition preferred) and be
able to pick the component asymmetrical. The module
contains a flat pick-area of 10mm diameter minimum. The
weight of the module is typically 2.8gr.
Storage
Keep the component in its dry pack when not yet using
the reel. After removal from the dry pack ensure that the
modules are soldered onto the PCB within 48 hours.
Marking
Every module is marked with the following information on
the:
a) Component designation: “ROK 101 008”.
b) Ericsson’s name and logotype.
c) Manufacturing code (place, year, week) and batch
number.
d) CE logotype
e) Type approval RTA no. See manual
Ordering Information
Part No.
ROK 101 008/2
Packaging
All devices will be delivered in a package protecting them
from electrostatic discharges and mechanical shock. The
package will be marked with the following information:
a) Delivery address.
b) Purchase order-number
c) Type of goods and component designation.
d) Ericsson’s name and logotype.
e) Date of manufacture and batch number.
f) Number of components in the package.
Abbreviations
ASIC - Application Specific Integrated Circuit
BER - Bit Error Rate
CMOS - Complementary Metal Oxide
Semiconductor
C/I - Carrier to Interference Ratio
DCE - Data Circuit terminating
Equipment
GP - Gold Print
HCI - Host Controller Interface
ISM - Industrial Scientific and
Medical
PCB - Printed Circuit Board
PCM - Pulse Code Modulation
PDA - Personal Digital Assistant
PtP - Point to Point
Rx - Receive
SIG - Special Interest Group
SSP - Screen Solder Print
Tx - Transmit
UART - Universal Asynchronous
Receiver Transmitter
VCO - Voltage Controlled Oscillator
12
ROK 101 008
V+
MAX3232E
V-
+
-
RS-232
+
-
CX
CX
10
11
9
12
100nF
100nF
1
3
4
5
2
6
100nF
100nF
V
CC
7
14
8
13
9-pin D-sub
2 RXD
8 CTS
3 TXD
7 RTS
BLUETOOTH
MODULE
ROK 101 008
B5
B6
A5
A6
TXD
CTS
RXD
RTS
16
V
CC
15
GND
100nF
The capacitor values are
chosen for a VCC from
3.2 to 3.6 V
V
CC
VCC VCC_IO ON
Figure A1. Bluetooth module connected as a DCE
through level shifter
APPENDIX A
Getting Started
The ROK 101 008 Bluetooth module is easy to use when
designing a Bluetooth application. However, there is a
need for know-how in the Bluetooth System specification
v1.0B as well as the Profile specification v1.0B when
designing and end-customer product. The list below
show some parts that would make designing convenient.
Bluetooth module
Know-how in Bluetooth specification regarding HCI
commands
Test board with UART/PCM or USB I/F
Visual C++ for PC SW design
Preferably HCIdriver, L2CAP, RFCOMM and SDP from
Ericsson
All information needed, regarding how to drive the HCI
over UART is specified in part H4 of the Bluetooth
System v1.1 further more part H1 and also Appendix IX
with message charts is relevant.
Below follow an example of how to set up an ACL link
between to Bluetooth modules by using the UART I/F
and also a schematic of how to interface the module and
control it by a host, normally a PC or microcontroller.
Principle schematic for UART inter-
connect
The inter-connection to the level-shifter when designing
a test-board could be according to the schematic below.
(Figure A1.)
The Bluetooth module can be connected as a DCE/DTE
and a modem/nullmodem cable could therefor be used
in-between the test-board and the PC.
Setting up a Bluetooth point-to-point
connection
The Host Controller Interface (HCI) in the module is a
command I/F. The host presents commands to the HCI
and receives events back from the HCI of the module. The
module Link Manager provides link set up capability to
the HCI.
Host_B Bluetooth module is set in paging scan mode
– listening for a Bluetooth device asking for a new
connection
Host_A Bluetooth module is set in paging mode
asking for a connection to Host_B
This is accomplished by first setting up the connection
between the Host and the module and thereafter creating
the connection between the modules using HCI com-
mands.
Host set-up via UART:
There are 4 different types of HCI-packets accepted on
the UART I/F.
The HCI packet indicator shall be sent immediately before
the HCI packet. When the entire HCI packet has been
received a new indicator should be expected.
The default speed setting is 57.6 kb/s and can be
changed by sending a specified bit stream to the I/F - see
Appendix C on how to change the speed setting of the
UART.
When the speed set-up for the UART is made for both
Host_ A & B, the Command Packets can be sent and
Event Packets received by the hosts. See HCI over UART
in part H:4 of the Bluetooth System v1.0B for detailed
information regarding parameters and protocol.
Soft Reset
First HCI command packet to send should be the RESET
packet.
A Command_Complete_Event with a status parameter
should be returned to the host.
HCI packet type HCI packet indicator
HCI command packet 0x01
HCI ACL data packet 0x02
HCI SCO data packet 0x03
HCI event packet 0x04
Table A1. HCI packets
13
ROK 101 008
Buffer information
Buffer information should be exchanged between the
module and respective host by using HCI commands.
Read_Buffer_Size: Providing the host with information
on buffer size for ACL and SCO data packets for the
module returned with a Command_Complete_Event
packet. The host shall use this information for control-
ling the transmission
Host_Buffer_Size: Providing the module with informa-
tion on buffer size for ACL and SCO packets to the
host.
It is the host that manages the data buffers of the Host
Controller on the module.
Timers
It could be necessary to set important timers used by the
module for time out handling. The timers are all set by
writing to registers using HCI commands.
The default values can be checked in Specification of the
Bluetooth System v1.0B part H:1 or by using
Read_xxx_xxx commands.
Bluetooth Address
The hosts, using the HCI command Read_BD_ADDR will
find the Bluetooth address of the module by the
Command_Complete_Event with the BD_ADDR as a
parameter.
By Remote_Name_Request, the BD_ADDR of the remote
module can also be found.
Inquiry
The HCI command Inquiry with the parameters LAP,
Inquiry_Length, and Num_Responses can also be used
for collecting BD_ADDR of remote Bluetooth units.
Creating a Point-to-point connection
Page Scan mode
To set a Bluetooth module in the mode for being able to
connect to (Host_B), page scan mode, there are some
settings that should be performed.
Command Return
Command OCF parameters parameters
HCI_Write_Scan_Enable 0x001A Scan_Enable Status
Table A2. HCI Write Scan Enable OCF code
Furthermore the setting of authentication and encryption
should be disabled (default) by using the:
Write_Authentication_Enable
Write_Encryption_Mode
The basic settings for getting into scan mode could be
according to the below suggested script list.
Read Buffer Size
Set Event Filter
Write Scan Enable: (Scan Enable: 0x03)
Write Voice Setting: (Voice Channel Setting: 0x0060)
Write Authentication Enable: (Authentication Enable:
0x00)
Set Event Filter: (Connection Setup Filter: Connec-
tions from All Devices, Auto Accept: 0x02)
Write Connection Accept Timeout: (Connection
Accept Timeout: 0x2000)
Write Page Timeout: (Page Timeout: 0x3000)
Page mode
The Create_Connection command is used to set-up a link
to another Bluetooth device.
Return
Command OCF Command parameters parameters
HCI_Create_Connection 0x0005 BD_ADDR
Packet_Type
Packet_Scan_Repetition_Mode
Packet_Scan_Mode
Clock_Offset
Allow_Role_Switch
Table A3. HCI Create Connection OCF code
Create_Connection:
BD_ADDR: 0xYYYYYYYYYYYY,
Packet Type: 0x0008,
Page Scan Repetition Mode: 0x01,
Page Scan Mode: 0x00,
Clock Offset: 0x0000
Allow_Role_Switch: 0x00
This command will cause the Link Manager to try to
create a connection to the Bluetooth module with the
appropriate BD_ADDR. The local Bluetooth module
(Host_A) starts the paging process to set up a link to the
page-scanning remote device (Host_B).
By LMP the negotiation between the two Bluetooth
modules Link Managers (LM) the link set-up can be
completed.
14
ROK 101 008
0481216202432
Connection handle PB BC Data total length
Flag Flag
Data
Table A4. ACL data packet
ACL link up and running
Host_A is the master of the point-to-point piconet and
Host_B is slave. The unit starting the paging process is
by definition the master. The link set-up is completed
when the event
Connection_Complete_Event is returned to both Host_A
and Host_B with the connection handle as one of the
parameters and the status parameter 0x00 (success).
When Bluetooth link is up and running the HCI data
packets can be sent from host to host.
The host must take care of generating the packages
going from Host to Host Controller in the module over
the UART I/F, in the same way the Host must arrange the
packages received from the Host Controller.
Both sides need information on what kind of data is
received, to be able to interpret the bit flow correctly.
For extensive information on setting up a Bluetooth link
please refer to Bluetooth System v1.0B Appendix IX
Message Sequence Charts
Adding an SCO link
When creating a voice connection using the PCM I/F, an
ACL link must be up and running between the two
devices, an SCO link can thereafter be added.
The control of the PCM I/F (FS, PCM_IN/OUT and
PCM_CLK) is handled by Ericsson specific HCI command
– see Appendix C.
Driving SW
HCI- API
The Bluetooth module includes all HCI command
capabilities according to Bluetooth System v1.0B.
Furthermore, there is some Ericsson specific commands
available for accessing HW registers and HW control –
see Appendix C. SW for driving the module should be
developed for the HCI interface.
There is source code SW available with Ericsson
Bluetooth Developers Kit (EBDK), see Appendix B, which
can be used for driving the module. This SW comes with
the EBDK and has an HCI-API for application develop-
ment on the HCI I/F.
Higher layer-API
Software (HCIdriver, L2CAP, RFCOMM and SDP) are
available in a generic, source code format, i.e. to be
adapted to various operating systems.
HCIdriver – implements the HCI command driver used
by the host
L2CAP – handles protocol multiplexing, segmentation
and re-assembly of packets
RFCOMM – provides a serial port emulation over the
L2CAP protocol
SDP – Service Discovery Protocol provides informa-
tion on the services available on a Bluetooth device
Additional SW for the application shall be developed for
the actual application on top of the RFCOMM API. If the
application is according to a SIG predefined profile, it
should be implemented accordingly. New applications
can be the driver of the specification of new profiles
decided by the SIG – see Specification of the Bluetooth
System v1.0B Profiles.
15
ROK 101 008
B ase Band Board
Application Board
Radio Board
JTAG
I2C
Audio
USB
Monitoring pins
RS-232 RS-232 RS-232
Ericsson BaseBand
Ericsson Radio
Module
Address / Data / Control
USB9602 MS7540
Radio Board (0dBm)
Er icsson Radio
Module
GLUE LOGIC (XLINX)
LEDS
Memor y
Memory
EBDK
A
udioRS-232 USB
Ericsson Bluetooth
Module ROK 101 008
Codec
Power
DC/DC
Level-
shift
EBSK
Figure B1. Bluetooth Development Kit (EBDK)
Figure B2. Bluetooth Starter Kit (EBSK)
APPENDIX B
Development tools
Bluetooth Development Kit (EBDK)
The easiest way of getting started is to use the
Bluetooth Developers Kit. It provides all parts
necessary for developing applications for the
Bluetooth module.
Available are:
PC plug&play
Demos using radio/baseband
Macro capability
C++ v5.0 Source code for use in applica-
tions
HCIdriver, L2CAP, SDP and RFCOMM for
applications using UART communication
Pins for electrical measurements
Antennas
Development can easily take place on the EBDK
platform and thereafter the implementation of
the full Bluetooth capability can be setup by
developed SW/HW and the Bluetooth module.
Software (HCIdriver, L2CAP, RFCOMM and
SDP) will be available in source code for PC.
HCIdriver – implements the HCI command
driver used by the host
L2CAP – handles protocol multiplexing,
segmentation and re-assembly of packets
RFCOMM – provides a serial port emulation
over the L2CAP protocol
SDP – Service Discovery Protocol provides
information on the services available on a
Bluetooth device
Technical support is available from the EBDK
distributor. Please contact Ericsson Microelec-
tronics for ordering and information regarding
the EBDK and regarding extra daughter board
with ROK 101 008 as add-on to the EBDK.
Bluetooth Starter Kit (EBSK)
A very small convenient kit, which preferably is
used in point-to-multipoint configuration
designs, based on the Bluetooth module ROK
101 008.
Please contact Ericsson Microelectronics for
ordering and information regarding the
Ericsson Bluetooth Starter Kit.
16
ROK 101 008
APPENDIX C
Bluetooth Information
This part will be updated and new information will be
added continuously.
Radio
Fast Frequency hopping (1600channel hop/s) with 79(23)
channels available (2.402 to 2.480 GHz) and a symbol
rate of 1Ms/s over the air exploits the maximum channel
bandwidth in the unlicensed ISM band.
To sustain a high transfer rate in busy radio environment,
the frequency hopping together with advanced coding
techniques maximizes the throughput.
During Page and Inquiry the hopping frequency is risen
to 3200 hops/s to enhance the time needed for connec-
tion set-up.
Modulation technique is a binary Gaussian Frequency
Shift Keying GFSK, with a BT product of 0.5. The channel
bandwidth is 1 MHz and the frequency deviation from the
carrier frequency of the RF channel is between +/-140 to
+/-175 kHz for representing a ‘1’/’0’.
A rapid process is ongoing to harmonise Spanish, French
and Japanese frequency ranges with the rest of the world.
Data and parameter formats
There are exceptions in the Bluetooth system for data and
parameter formats – general rules below.
All values are in Binary and Hexadecimal little Endian
formats
Negative values must use 2’s complement format
Array parameter notation is parameterA[i],
parameterB[i],…
All parameter values are sent/received in little Endian
format. The least significant byte is sent first – unless
noted otherwise.
HCI_Inquiry_Cancel (Example):
OGF: 0x01
bin: 0000 0001 OCF: 0x0002
bin: 0000 0000 0000 0010
Real code bin: 0000 01
|
00 0000 0010
LINK CONTROL COMMAND
0 x 0 4 0 2
Sent to module in hex: 02 04 00
Reverse byte order
Zero parameters
lsb lsbmsbmsb
msb lsb
OpCode
OCF OGF
Parameter
Total length
OpCode Command
Field
10 bits
OpCode Group
Field
6 bits
Little Endian
OGFRange (6 bits): 0x00-0x3F 0x3E: Bluetooth logo testing
0x3F: Vendor specific debug commands
OCFRange (10 bits): 0x0000-0x03FF
Amount of parameters in bytes
msb msblsblsb
0 4 8 12 16 20 24 28 31
Figure C1. Byte order sent to module
17
ROK 101 008
Country Frequency range RF channels
Europe & USA 2400-2483.5 MHz f = 2402 + k MHz k = 0....78
Japan 2471-2497 MHz f = 2473 + k MHz k = 0....22
Spain 2445-2475 MHz f = 2449 + k MHz k = 0....22
France 2446.5-2483.5 MHz f = 2454 + k MHz k = 0....22
Table C1. Frequency ranges used.
HCI Opcodes
The Opcodes have been changed during the ongoing
standardisation work. Below is the description on how to
send opcodes to the module.
Below is the general HCI command packet format
depicted as well as a byte order description.
UART speed setting
The baud rate is changed with an Ericsson specific HCI
command.
HCI_Ericsson_Set_Uart_Baud_Rate
The command has one parameter, baud rate - one byte
long according to the table below . The op-code for the
command is 0xfc09 - the last figure is due to a possible
change.
Sending the command should be performed accordingly:
09 fc 01 yz , where yz is the chosen baud rate from the
table.
The op-code is sent in reverse byte order. 01 is the
parameter length, in this case one byte. Remember to add
the HCI packet indicator.
Observe - When changing the baud rate for the module
the host also has to change the baud rate.
Observe - Removing power to the module the baud rate
will be reset to 57.6 kbps.
Observe -Two zeros are not printed in the beginning of
the binary parameters below. The length of the parameter
is 1 byte.
Ericsson specific HCI commands
By using the Ericsson specific HCI command there are a
number of features available for the application design.
Contact Ericsson Microelectronics for a command
reference list.
Antennas
Antenna design is not specified and standardised in the
Bluetooth System v1.0B.
Many different types of antennas can and will be used.
Application specific antennas suitable for production are
expected to be a new market for antenna designs.
Ericsson Microelectronics have antennas for the EBDK
and other development kits. Contact Ericsson Microelec-
tronics for information on antennas.
Contacting Ericsson Microelectronics
For further information regarding Bluetooth technology,
components and development tools, please contact
Ericsson Microelectronics:
UART speed
460.8 kbps
230.4 kbps
115.2 kbps
57.6 kbps
28.8 kbps
14.4 kbps
7200 bps
3600 bps
1800 bps
900 bps
153.6 kbps
76.8 kbps
38.4 kbps
19.2 kbps
9600 bps
4800 bps
2400 bps
1200 bps
600 bps
300 bps
Parameter to send
00000
00001
00010
00011
00100
00101
00110
00111
01000
01001
10000
10001
10010
10011
10100
10101
10110
10111
11000
11001
Table C2. UART speed setting parameter
Ericsson Microelectronics
SE-164 81 Kista, Sweden
+46 8 757 50 00
www.ericsson.com/microelectronics
For local sales contacts, please refer to our website
or call: Int + 46 8 757 47 00, Fax: +46 8 757 47 76
Data Sheet
EN/LZT 146 106 R1A
© Ericsson Microelectronics AB, September 2001