Rev. 3.0 September 2013 www.aosmd.com Page 1 of 9
AOZ8831
Ultra Low Capacitance One-line
Bi-directional TVS Diode
General Description
The AOZ8831 is an ultra low capacitance one-line
bi-directional transient voltage suppressor diode
designed to protect high speed data lines and voltage
sensitive electronics from high transient co nditions and
ESD.
This device incorporates one TVS
diode in an ultra-small
DFN 1.0 x 0.6 package.
It may be used to
meet the ESD
immunity requirements of IEC 61000-4-2, Level 4
(±15kV air, ±15kV contact discharge).
The AOZ8831 comes in an RoHS compliant DFN
package and is rated over a -40°C to +85°C ambient
temperature range.
The ultra-small 1 .0 x 0.6 x 0.5mm DFN p ackage makes it
ideal for applications where PCB space is a premium.
The small size and high ESD protection makes it ideal for
protecting voltage sensitive electronics from h igh tran-
sient conditions and ESD.
Features
ESD protection for high - spe e d da ta lines:
– Exceeds: IEC 61000-4-2 (ESD) ±15kV (air),
±15kV (contact)
– Human Body Model (HBM) ±15kV
Small package saves board space
Ultra low capacitance: 0.35pF
Low clamping voltage
Low operating voltage: 5.0V
Pb-free device
Applications
Portable handheld devices
Keypads, data lines, buttons
Notebook computers
Digital Cameras
Portable GPS
MP3 players
Typical Application Pin Configuration
Signal Line
1 2
Bidirection Protection of Single Line
AOZ8831
Rev. 3.0 September 2013 www.aosmd.com Page 2 of 9
Ordering Information
AOS Green Products use reduced levels of Halogens, and are also RoHS compliant.
Please visit www.aosmd.com/media/AOSGreenPolicy.pdf for additional information.
Absolute Maximum Ratings
Exceeding the Absolute Maximum ratings may damage th e device.
Notes:
1. IEC 61000-4-2 discharge with CDischarge = 150pF, RDischarge = 330Ω.
2. Human Body Discharge per MIL-STD-883, Method 3015 CDischarge = 100pF, RDischarge = 1.5kΩ.
Maximum Operating Ratings
Part Number Ambient Temperature Rang e Package Environmental
AOZ8831DI-05 -40°C to +85°C DFN 1.0 x 0.6 Green Product
Parameter Rating
VP – VN 5V
Peak Pulse Current (IPP), tP = 8/20µs 2A
Peak Pulse Power, tP = 8/20µs 40W
Storage Temperature (TS) -65°C to +150°C
ESD Rating per IEC61000-4-2, Contact(1) ±15kV
ESD Rating per IEC61000-4-2, Air(1) ±15kV
ESD Rating per Human Body Model(2) ±15kV
Parameter Rating
Junction Temperature (TJ) -40°C to +125°C
AOZ8831
Rev. 3.0 September 2013 www.aosmd.com Page 3 of 9
Electrical Characteristics
TA = 25°C unless otherwise specified.
Notes:
3. Measurements performed using a 100ns Transmission Line Pulse (TLP) system.
4. These specifications are guaranteed by design and characterization.
Symbol Parameter Diagram
IPP Maximum Reverse Peak Pulse Current(3,4)
VCL Clamping Voltage @ IPP(3,4)
VRWM Working Peak Reverse Voltage
IRMaximum Reverse Leakage Current
VBR Breakdown Voltage
PPK Peak Power Dissipation
CJCapacitance @ VR = 0 and f = 1MHz(3,4)
Device Device
Marking VRWM (V)
Max. VBR (V)
Min. IR (µA)
Max. VF (V)
Typ.
VCL Max. CJ (pF)
IPP = 1A IPP = 2A IPP = 5A Min. Typ. Max.
AOZ8831DI-05 A 5.0 6.0 0.1 1.0 15.00 17.00 23.00 0.2 0.35 0.5
I
IPP
IR
IT
IPP
VCLVBR VRWM
VRWM
VBR VCL
V
AOZ8831
Rev. 3.0 September 2013 www.aosmd.com Page 4 of 9
Typical Performance Characteristics
Clamping Voltage vs. Peak Pulse Current
(t
period
= 100ns, t
r
= 1ns)
Typical Variation of CIN vs. VR
(f = 1MHz, T = 25°C)
Peak Pulse Current, IPP (A)
Clamping Voltage, VCL (V)
Insertion Loss (S21) vs. Frequency
5
0
-5
-10
-15
-20
-25
Frequency (MHz)
Insertion Loss (dB)
1 10 100 1000 10000
Input Voltage (V)
Normalized Input Capacitance
1.20
1.00
0.80
0.60
0.40
0.20
0
0 1 2345
25
20
15
10
5
0
1234 5
AOZ8831
Rev. 3.0 September 2013 www.aosmd.com Page 5 of 9
Package Dimensions, DFN 1.0 x 0.6(1)
Note 1. The package outline shown above will change as of Q4 2013 and will be replaced with the new one shown in page 6.
1.00
UNIT: mm
A1
Ab (2x)
D
R
L1
L (2x)
e
e/2
E
Pin #ID
Seating Plane
Notes:
1. All dimensions are in milliteters, angles are in degrees.
2. Coplanarity applies to the exposed heat sink slug as well as the terminals.
Symbols
A
A1
b
D
E
e
L
L1
R
aaa
bbb
ccc
Min.
0.47
0.00
0.45
0.95
0.55
---
0.20
0.05
Dimensions in millimeters
RECOMMENDED LAND PATTERN
SIDE VIEW
BOTTOM VIEW
Nom.
0.50
0.03
0.50
1.00
0.60
0.40
0.25
0.05±0.03 REF.
0.10
0.15
0.05
0.05
Max.
0.55
0.05
0.55
1.075
0.675
---
0.30
0.15
Dimensions in inches
ccc C
C
0.082X
C2X C
aaa
B
2X
C
aaa
bbb CAB
A
0.30
0.55
0.40
0.30
R 0.10 REF.
Symbols
A
A1
b
D
E
e
L
L1
R
aaa
bbb
ccc
Min.
0.019
0.000
0.018
0.037
0.022
---
0.008
0.002
Nom.
0.020
0.001
0.020
0.039
0.024
0.016
0.010
0.002±0.001 REF.
0.004
0.006
0.002
0.002
Max.
0.022
0.002
0.022
0.042
0.027
---
0.012
0.006
AOZ8831
Rev. 3.0 September 2013 www.aosmd.com Page 6 of 9
Package Dimensions, DFN 1.0 x 0.6(2)
Note 2. The package outline shown above will replace the one in page 5 as of Q4 2013.
1.00
UNIT: mm
A1
A
Seating Plane
Notes:
1. Dimensions and tolerancing conform to ASME Y14.5-2009.
2. All dimensions are in milliteters.
3. “e” represents the terminal grid pitch.
4. N isthe total number of terminals.
5. A visual index feature must be located within the hatched area. Typical index feature (chamfer) must be located on the edge
of the Pin#1 feature.
6. This dimension includes stand-off height “A1” and packaged body thickness, but does not include attached feature e.g. external
heatsink or chip capacitors, an internal heatslug is not considered as attached feature.
7. Dimension “A1” is primarily terminal plating, and does not include small metal protrusions.
Symbols
A
A1
b
D
E
e
L
aaa
ccc
ddd
Min.
0.47
0.00
0.45
0.20
Dimensions in millimeters
RECOMMENDED LAND PATTERN
SIDE VIEW
BOTTOM VIEW
Nom.
0.51
0.02
0.50
0.60 BSC
1.00 BSC
0.65 BSC
0.25
0.05
0.03
0.10
Max.
0.55
0.05
0.55
0.30
Dimensions in inches
C
ccc
2x
C
Pin#1 ID
0.125x45°
B
E
D2x b
A
ddd CAB
e
0.30
0.55
0.40
0.30
0.125 x 45°
Symbols
A
A1
b
D
E
e
L
aaa
ccc
ddd
Min.
0.019
0.000
0.018
0.008
Nom.
0.020
0.001
0.020
0.024
0.039
0.026
0.010
0.002
0.001
0.004
Max.
0.022
0.002
0.022
0.012
L2 ddd CAB
TOP VIEW
C
aaa
2x
C
aaa 2x
5Index Area
(E/4xD)
7
6
3
AOZ8831
Rev. 3.0 September 2013 www.aosmd.com Page 7 of 9
Tape and Reel Dimensions, DFN 1.0 x 0.6(3)
Note 3. The carrier tape shown above will change as of Q4 2013 and will be replaced with the new one shown in page 8.
Carrier Tape
Reel
Leader / Trailer & Orientation
Tape Size
8mm
Reel Size
ø178
M
ø178
±0.5
Package
DFN 1.0x0.6
(8 mm)
T
0.254
±0.02
B0
1.21
±0.05
A0
0.76
±0.05
K0
0.53
±0.05
D0
ø0.50
±0.05
D1
ø1.50
±0.10
E1
1.75
±0.1
E
8.00
+0.30/-0.10
E2
3.50
±0.05
P0
4.00
±0.10
P1
4.00
±0.10
P2
2.00
±0.05
N
ø55
±1
Trailer Tape
300mm Min. or
75 Empty Pockets
Components Tape
Orientation in Pocket
Leader Tape
500mm Min. or
125 Empty Pockets
T
B0
D1
P1
UNIT: mm
UNIT: mm
Feeding Direction
W
8.4
+1.5/-0
H
ø13.0
±0.5
W1
14.4.
Max.
K
10.0
±0.5
S
2.0
±0.5
G
N/A
R
N/A
V
N/A
K0
P2
P0
D0
A0
E2
E1
E
R
G
V
W1
M
W
N
H
S
K
AOZ8831
Rev. 3.0 September 2013 www.aosmd.com Page 8 of 9
Tape and Reel Dimensions, DFN 1.0 x 0.6(4)
Note 4. The carrier tape shown above will replace the one in page 7 as of Q4 2013.
Carrier Tape
Reel
Leader / Trailer & Orientation
Tape Size
8mm
Reel Size
ø178
M
ø178
±0.5
N
ø55
±1
Trailer Tape
300mm Min. or
75 Empty Pockets
Components Tape
Orientation in Pocket
Leader Tape
500mm Min. or
125 Empty Pockets
UNIT: mm
W
8.4
+1.5/-0
H
ø13.0
±0.5
W1
14.4.
Max.
K
10.0
±0.5
S
2.0
±0.5
G
N/A
R
N/A
V
N/A
R
G
V
W1
M
W
N
H
S
K
Package
DFN 1.0x0.6
(8 mm)
W
8.00
+0.3/-0.1
T
0.20
±0.05
B0
1.05
±0.04
A0
0.65
±0.04
K0
0.61
±0.04
D0
ø1.50
+0.1/-0.0
D1
ø0.40
±0.05
E1
1.75
±0.10
P0
4.00
±0.10
P1
2.00
±0.10
P2
2.00
±0.05
UNIT: mm
T
B0
K0
SECTION Y-Y
C
L
REF 5°
D0
D1
P2 P0
E1
W
F
A0
P1
F
3.50
±0.05
AOZ8831
Rev. 3.0 September 2013 www.aosmd.com Page 9 of 9
Part Marking
Product Number Code Date Code
A X
As used herein:
1. Life support de vice s or systems are devices or
systems which, (a) are intended for surgical implant into
the body or (b) support or sustain life, and (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labelin g, can be
reasonably ex pe cte d to res ult in a signific an t inju ry of
the user.
2. A critical component in any component of a li fe
support, device, or syste m whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
LEGAL DISCLAIMER
Alpha and Omega Semiconductor makes no representations or warranties with respect to the accuracy or
completeness of the information provided herein and takes no liabilities for the consequences of use of such
information or any product described he rein. Alpha and Omega Semico nductor rese rves the right to make changes
to such information at any time without further notice. This document does not constitute the grant of any inte llectual
property rights or representation of non-infringement of any third party’s intellectual property rights.
LIFE SUPPORT POLICY
ALPHA AND OMEGA SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS.
