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H8/36912 Group,
H8/36902 Group
Hardware Manual
16
User’s Manual
Rev.3.00 2006.09
Renesas 16-Bit Single-Chip Microcomputer
H8 Family/H8/300H Tiny Series
H8/36912F HD64F36912G
H8/36902F HD64F36902G
H8/36912 HD64336912G
H8/36911 HD64336911G
H8/36902 HD64336902G
H8/36901 HD64336901G
H8/36900 HD64336900G
Rev. 3.00 Sep. 14, 2006 Page ii of xxviii
Rev. 3.00 Sep. 14, 2006 Page iii of xxviii
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
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a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-
party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corp. without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or
an authorized Renesas Technology Corp. product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising
from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means,
including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data,
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8. Please contact Renesas Technology Corp. for further details on these materials or the products
contained therein.
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and
more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Keep safety first in your circuit designs!
Notes regarding these materials
Rev. 3.00 Sep. 14, 2006 Page iv of xxviii
General Precautions on Handling of Product
1. Treatment of NC Pins
Note: Do not connect anything to the NC pins.
The NC (not connected) pins are either not connected to any of the internal circuitry or are
used as test pins or to reduce noise. If something is connected to the NC pins, the
operation of the LSI is not guaranteed.
2. Treatment of Unused Input Pins
Note: Fix all unused input pins to high or low level.
Generally, the input pins of CMOS products are high-impedance input pins. If unused pins
are in their open states, intermediate levels are induced by noise in the vicinity, a pass-
through current flows internally, and a malfunction may occur.
3. Processing before Initialization
Note: When power is first supplied, the product's state is undefined.
The states of internal circuits are undefined until full power is supplied throughout the
chip and a low level is input on the reset pin. During the period where the states are
undefined, the register settings and the output state of each pin are also undefined. Design
your system so that it does not malfunction because of processing while it is in this
undefined state. For those products which have a reset function, reset the LSI immediately
after the power supply has been turned on.
4. Prohibition of Access to Undefined or Reserved Addresses
Note: Access to undefined or reserved addresses is prohibited.
The undefined or reserved addresses may be used to expand functions, or test registers
may have been be allocated to these addresses. Do not access these registers; the system's
operation is not guaranteed if they are accessed.
Rev. 3.00 Sep. 14, 2006 Page v of xxviii
Configuration of This Manual
This manual comprises the following items:
1. General Precautions on Handling of Product
2. Configuration of This Manual
3. Preface
4. Contents
5. Overview
6. Description of Functional Modules
• CPU and System-Control Modules
• On-Chip Peripheral Modules
The configuration of the functional description of each module differs according to the
module. However, the generic style includes the following items:
i) Feature
ii) Input/Output Pin
iii) Register Description
iv) Operation
v) Usage Note
When designing an application system that includes this LSI, take notes into account. Each section
includes notes in relation to the descriptions given, and usage notes are given, as required, as the
final part of each section.
7. List of Registers
8. Electrical Characteristics
9. Appendix
10. Main Revisions and Additions in this Edition (only for revised versions)
The list of revisions is a summary of points that have been revised or added to earlier versions.
This does not include all of the revised contents. For details, see the actual locations in this
manual.
11. Index
Rev. 3.00 Sep. 14, 2006 Page vi of xxviii
Preface
The H8/36912 Group and H8/36902 Group are single-chip microcomputers made up of the high-
speed H8/300H CPU employing Renesas Technology original architecture as their cores, and the
peripheral functions required to configure a system. The H8/300H CPU has an instruction set that
is compatible with the H8/300 CPU.
Target Users: This manual was written for users who will be using the H8/36912 Group and
H8/36902 Group in the design of application systems. Target users are expected to
understand the fundamentals of electrical circuits, logical circuits, and
microcomputers.
Objective: This manual was written to explain the hardware functions and electrical
characteristics of the H8/36912 Group and H8/36902 Group to the target users.
Refer to the H8/300H Series Software Manual for a detailed description of the
instruction set.
Notes on reading this manual:
• In order to understand the overall functions of the chip
Read the manual according to the contents. This manual can be roughly categorized into parts
on the CPU, system control functions, peripheral functions and electrical characteristics.
• In order to understand the details of the CPU's functions
Read the H8/300H Series Software Manual.
• In order to understand the details of a register when its name is known
Read the index that is the final part of the manual to find the page number of the entry on the
register. The addresses, bits, and initial values of the registers are summarized in section 19,
List of Registers.
Example: Register name: The following notation is used for cases when the same or a
similar function, e.g. serial communication interface, is
implemented on more than one channel:
XXX_N (XXX is the register name and N is the channel
number)
Bit order: The MSB is on the left and the LSB is on the right.
Rev. 3.00 Sep. 14, 2006 Page vii of xxviii
Notes:
When using an on-chip emulator (E7, E8) for H8/36912, H8/36902 program development and
debugging, the following restrictions must be noted.
1. The NMI pin is reserved for the E7 or E8, and cannot be used.
2. Area H'2000 to H'2FFF is used by the E7 or E8, and is not available to the user.
3. Area H'F980 to H'FD7F must on no account be accessed.
4. When the E7 or E8 is used, address breaks can be set as either available to the user or for use
by the E7 or E8. If address breaks are set as being used by the E7 or E8, the address break
control registers must not be accessed.
5. When the E7 or E8 is used, NMI is an input/output pin (open-drain in output mode).
Related Manuals: The latest versions of all related manuals are available from our web site.
Please ensure you have the latest versions of all documents you require.
http://www.renesas.com/
H8/36912 Group and H8/36902 Group manuals:
Document Title Document No.
H8/36912 Group, H8/36902 Group Hardware Manual This manual
H8/300H Series Software Manual REJ09B0213
User's manuals for development tools:
Document Title Document No.
H8S, H8/300 Series C/C++ Compiler, Assembler, Optimizing Linkage Editor
User's Manual
REJ10B0058
H8S, H8/300 Series Simulator/Debugger User's Manual REJ10B0211
H8S, H8/300 Series High-Performance Embedded Workshop 3 Tutorial REJ10B0024
H8S, H8/300 Series High-Performance Embedded Workshop 3 User's Manual REJ10B0026
Application notes:
Document Title Document No.
H8S, H8/300 Series C/C++ Compiler Package Application Note REJ05B0464
Single Power Supply F-ZTATTM On-Board Programming REJ05B0520
Rev. 3.00 Sep. 14, 2006 Page viii of xxviii
Rev. 3.00 Sep. 14, 2006 Page ix of xxviii
Contents
Section 1 Overview................................................................................................1
1.1 Features................................................................................................................................. 1
1.2 Internal Block Diagram......................................................................................................... 3
1.3 Pin Arrangement................................................................................................................... 5
1.4 Pin Functions ........................................................................................................................ 9
Section 2 CPU......................................................................................................11
2.1 Address Space and Memory Map ....................................................................................... 12
2.2 Register Configuration........................................................................................................ 14
2.2.1 General Registers................................................................................................ 15
2.2.2 Program Counter (PC) ........................................................................................ 16
2.2.3 Condition-Code Register (CCR)......................................................................... 16
2.3 Data Formats....................................................................................................................... 18
2.3.1 General Register Data Formats........................................................................... 18
2.3.2 Memory Data Formats ........................................................................................ 20
2.4 Instruction Set..................................................................................................................... 21
2.4.1 Table of Instructions Classified by Function ...................................................... 21
2.4.2 Basic Instruction Formats ................................................................................... 30
2.5 Addressing Modes and Effective Address Calculation....................................................... 32
2.5.1 Addressing Modes .............................................................................................. 32
2.5.2 Effective Address Calculation ............................................................................ 35
2.6 Basic Bus Cycle .................................................................................................................. 37
2.6.1 Access to On-Chip Memory (RAM, ROM)........................................................ 37
2.6.2 On-Chip Peripheral Modules .............................................................................. 38
2.7 CPU States.......................................................................................................................... 39
2.8 Usage Notes........................................................................................................................ 40
2.8.1 Notes on Data Access to Empty Areas ............................................................... 40
2.8.2 EEPMOV Instruction.......................................................................................... 40
2.8.3 Bit Manipulation Instruction............................................................................... 40
Section 3 Exception Handling .............................................................................47
3.1 Exception Sources and Vector Address .............................................................................. 47
3.2 Register Descriptions.......................................................................................................... 49
3.2.1 Interrupt Edge Select Register 1 (IEGR1) .......................................................... 49
3.2.2 Interrupt Edge Select Register 2 (IEGR2) .......................................................... 50
3.2.3 Interrupt Enable Register 1 (IENR1) .................................................................. 50
Rev. 3.00 Sep. 14, 2006 Page x of xxviii
3.2.4 Interrupt Enable Register 2 (IENR2) .................................................................. 51
3.2.5 Interrupt Flag Register 1 (IRR1)......................................................................... 52
3.2.6 Interrupt Flag Register 2 (IRR2)......................................................................... 53
3.2.7 Wakeup Interrupt Flag Register (IWPR) ............................................................ 53
3.3 Reset Exception Handling .................................................................................................. 54
3.4 Interrupt Exception Handling ............................................................................................. 55
3.4.1 External Interrupts .............................................................................................. 55
3.4.2 Internal Interrupts ............................................................................................... 56
3.4.3 Interrupt Handling Sequence .............................................................................. 57
3.4.4 Interrupt Response Time..................................................................................... 59
3.5 Usage Notes........................................................................................................................ 61
3.5.1 Interrupts after Reset........................................................................................... 61
3.5.2 Notes on Stack Area Use .................................................................................... 61
3.5.3 Notes on Rewriting Port Mode Registers ........................................................... 61
Section 4 Address Break .....................................................................................63
4.1 Register Descriptions.......................................................................................................... 64
4.1.1 Address Break Control Register (ABRKCR) ..................................................... 64
4.1.2 Address Break Status Register (ABRKSR) ........................................................ 66
4.1.3 Break Address Registers (BARH, BARL).......................................................... 66
4.1.4 Break Data Registers (BDRH, BDRL) ............................................................... 66
4.2 Operation ............................................................................................................................ 67
Section 5 Clock Pulse Generators .......................................................................69
5.1 Features............................................................................................................................... 70
5.2 Register Descriptions.......................................................................................................... 71
5.2.1 RC Control Register (RCCR) ............................................................................. 71
5.2.2 RC Trimming Data Protect Register (RCTRMDPR).......................................... 72
5.2.3 RC Trimming Data Register (RCTRMDR) ........................................................ 73
5.2.4 Clock Control/Status Register (CKCSR)............................................................ 74
5.3 System Clock Select Operation .......................................................................................... 75
5.3.1 Clock Control Operation..................................................................................... 76
5.3.2 Clock Change Timing......................................................................................... 78
5.4 Trimming of On-chip Oscillator Frequency ....................................................................... 80
5.5 External Oscillators ............................................................................................................82
5.5.1 Connecting Crystal Resonator ............................................................................ 82
5.5.2 Connecting Ceramic Resonator .......................................................................... 83
5.5.3 External Clock Input Method.............................................................................. 83
5.6 Prescaler.............................................................................................................................. 83
5.6.1 Prescaler S .......................................................................................................... 83
Rev. 3.00 Sep. 14, 2006 Page xi of xxviii
5.7 Usage Notes........................................................................................................................ 84
5.7.1 Note on Resonators............................................................................................. 84
5.7.2 Notes on Board Design ....................................................................................... 84
Section 6 Power-Down Modes ............................................................................85
6.1 Register Descriptions.......................................................................................................... 85
6.1.1 System Control Register 1 (SYSCR1) ................................................................ 86
6.1.2 System Control Register 2 (SYSCR2) ................................................................ 88
6.1.3 Module Standby Control Register 1 (MSTCR1) ................................................ 89
6.1.4 Module Standby Control Register 2 (MSTCR2) ................................................ 90
6.2 Mode Transitions and States of LSI.................................................................................... 91
6.2.1 Sleep Mode ......................................................................................................... 93
6.2.2 Standby Mode..................................................................................................... 93
6.2.3 Subsleep Mode.................................................................................................... 94
6.3 Operating Frequency in Active Mode................................................................................. 94
6.4 Direct Transition................................................................................................................. 94
6.5 Module Standby Function................................................................................................... 95
Section 7 ROM ....................................................................................................97
7.1 Block Configuration ........................................................................................................... 97
7.2 Register Descriptions.......................................................................................................... 99
7.2.1 Flash Memory Control Register 1 (FLMCR1).................................................... 99
7.2.2 Flash Memory Control Register 2 (FLMCR2).................................................. 100
7.2.3 Erase Block Register 1 (EBR1) ........................................................................ 101
7.2.4 Flash Memory Enable Register (FENR) ........................................................... 101
7.3 On-Board Programming Modes........................................................................................ 102
7.3.1 Boot Mode ........................................................................................................ 102
7.3.2 Programming/Erasing in User Program Mode.................................................. 106
7.4 Flash Memory Programming/Erasing ............................................................................... 107
7.4.1 Program/Program-Verify .................................................................................. 107
7.4.2 Erase/Erase-Verify............................................................................................ 109
7.4.3 Interrupt Handling when Programming/Erasing Flash Memory....................... 110
7.5 Program/Erase Protection ................................................................................................. 112
7.5.1 Hardware Protection ......................................................................................... 112
7.5.2 Software Protection........................................................................................... 112
7.5.3 Error Protection................................................................................................. 112
Section 8 RAM ..................................................................................................115
Rev. 3.00 Sep. 14, 2006 Page xii of xxviii
Section 9 I/O Ports.............................................................................................117
9.1 Port 1................................................................................................................................. 117
9.1.1 Port Mode Register 1 (PMR1) .......................................................................... 118
9.1.2 Port Control Register 1 (PCR1) ........................................................................ 119
9.1.3 Port Data Register 1 (PDR1) ............................................................................ 119
9.1.4 Port Pull-Up Control Register 1 (PUCR1)........................................................ 120
9.1.5 Pin Functions .................................................................................................... 120
9.2 Port 2................................................................................................................................. 121
9.2.1 Port Control Register 2 (PCR2) ........................................................................ 122
9.2.2 Port Data Register 2 (PDR2) ............................................................................ 122
9.2.3 Pin Functions .................................................................................................... 123
9.3 Port 5................................................................................................................................. 124
9.3.1 Port Mode Register 5 (PMR5) .......................................................................... 125
9.3.2 Port Control Register 5 (PCR5) ........................................................................ 125
9.3.3 Port Data Register 5 (PDR5) ............................................................................ 126
9.3.4 Port Pull-Up Control Register 5 (PUCR5)........................................................ 126
9.3.5 Pin Functions .................................................................................................... 127
9.4 Port 7................................................................................................................................. 128
9.4.1 Port Control Register 7 (PCR7) ........................................................................ 128
9.4.2 Port Data Register 7 (PDR7) ............................................................................ 129
9.4.3 Pin Functions .................................................................................................... 129
9.5 Port 8................................................................................................................................. 130
9.5.1 Port Control Register 8 (PCR8) ........................................................................ 131
9.5.2 Port Data Register 8 (PDR8) ............................................................................ 131
9.5.3 Pin Functions .................................................................................................... 132
9.6 Port B................................................................................................................................ 134
9.6.1 Port Data Register B (PDRB) ........................................................................... 134
9.6.2 Pin Functions .................................................................................................... 135
9.7 Port C................................................................................................................................ 136
9.7.1 Port Control Register C (PCRC)....................................................................... 137
9.7.2 Port Data Register C (PDRC) ........................................................................... 137
9.7.3 Pin Functions .................................................................................................... 138
Section 10 Timer B1..........................................................................................139
10.1 Features............................................................................................................................. 139
10.2 Register Descriptions........................................................................................................ 140
10.2.1 Timer Mode Register B1 (TMB1) .................................................................... 140
10.2.2 Timer Counter B1 (TCB1)................................................................................ 141
10.2.3 Timer Load Register B1 (TLB1) ...................................................................... 141
Rev. 3.00 Sep. 14, 2006 Page xiii of xxviii
10.3 Operation .......................................................................................................................... 142
10.3.1 Interval Timer Operation .................................................................................. 142
10.3.2 Auto-Reload Timer Operation .......................................................................... 142
10.4 Timer B1 Operating Modes .............................................................................................. 143
Section 11 Timer V............................................................................................145
11.1 Features............................................................................................................................. 145
11.2 Input/Output Pins.............................................................................................................. 147
11.3 Register Descriptions........................................................................................................ 147
11.3.1 Timer Counter V (TCNTV) .............................................................................. 147
11.3.2 Time Constant Registers A and B (TCORA, TCORB) .................................... 148
11.3.3 Timer Control Register V0 (TCRV0) ............................................................... 148
11.3.4 Timer Control/Status Register V (TCSRV) ...................................................... 150
11.3.5 Timer Control Register V1 (TCRV1) ............................................................... 151
11.4 Operation .......................................................................................................................... 152
11.4.1 Timer V Operation............................................................................................ 152
11.5 Timer V Application Examples ........................................................................................ 155
11.5.1 Pulse Output with Arbitrary Duty Cycle........................................................... 155
11.5.2 Pulse Output with Arbitrary Pulse Width and Delay from TRGV Input .......... 156
11.6 Usage Notes...................................................................................................................... 157
Section 12 Timer W...........................................................................................159
12.1 Features............................................................................................................................. 159
12.2 Input/Output Pins.............................................................................................................. 162
12.3 Register Descriptions........................................................................................................ 162
12.3.1 Timer Mode Register W (TMRW) ................................................................... 163
12.3.2 Timer Control Register W (TCRW) ................................................................. 164
12.3.3 Timer Interrupt Enable Register W (TIERW) .................................................. 165
12.3.4 Timer Status Register W (TSRW) .................................................................... 166
12.3.5 Timer I/O Control Register 0 (TIOR0) ............................................................. 168
12.3.6 Timer I/O Control Register 1 (TIOR1) ............................................................. 169
12.3.7 Timer Counter (TCNT)..................................................................................... 171
12.3.8 General Registers A to D (GRA to GRD)......................................................... 171
12.4 Operation .......................................................................................................................... 172
12.4.1 Normal Operation ............................................................................................. 172
12.4.2 PWM Operation................................................................................................ 176
12.5 Operation Timing.............................................................................................................. 181
12.5.1 TCNT Count Timing ........................................................................................ 181
12.5.2 Output Compare Output Timing ....................................................................... 182
12.5.3 Input Capture Timing........................................................................................ 183
Rev. 3.00 Sep. 14, 2006 Page xiv of xxviii
12.5.4 Timing of Counter Clearing by Compare Match .............................................. 183
12.5.5 Buffer Operation Timing .................................................................................. 184
12.5.6 Timing of IMFA to IMFD Flag Setting at Compare Match ............................. 185
12.5.7 Timing of IMFA to IMFD Setting at Input Capture ......................................... 186
12.5.8 Timing of Status Flag Clearing......................................................................... 186
12.6 Usage Notes...................................................................................................................... 187
Section 13 Watchdog Timer..............................................................................191
13.1 Features............................................................................................................................. 191
13.2 Register Descriptions........................................................................................................ 192
13.2.1 Timer Control/Status Register WD (TCSRWD) .............................................. 192
13.2.2 Timer Counter WD (TCWD)............................................................................ 194
13.2.3 Timer Mode Register WD (TMWD) ................................................................ 194
13.3 Operation .......................................................................................................................... 195
Section 14 Serial Communication Interface 3 (SCI3).......................................197
14.1 Features............................................................................................................................. 197
14.2 Input/Output Pins.............................................................................................................. 199
14.3 Register Descriptions........................................................................................................ 199
14.3.1 Receive Shift Register (RSR) ........................................................................... 200
14.3.2 Receive Data Register (RDR)........................................................................... 200
14.3.3 Transmit Shift Register (TSR).......................................................................... 200
14.3.4 Transmit Data Register (TDR).......................................................................... 200
14.3.5 Serial Mode Register (SMR) ............................................................................ 201
14.3.6 Serial Control Register 3 (SCR3) ..................................................................... 202
14.3.7 Serial Status Register (SSR) ............................................................................. 204
14.3.8 Bit Rate Register (BRR) ................................................................................... 206
14.3.9 Sampling Mode Register (SPMR) .................................................................... 211
14.4 Operation in Asynchronous Mode.................................................................................... 212
14.4.1 Clock................................................................................................................. 212
14.4.2 SCI3 Initialization............................................................................................. 213
14.4.3 Data Transmission ............................................................................................ 214
14.4.4 Serial Data Reception ....................................................................................... 216
14.5 Operation in Clocked Synchronous Mode........................................................................ 219
14.5.1 Clock................................................................................................................. 219
14.5.2 SCI3 Initialization............................................................................................. 220
14.5.3 Serial Data Transmission .................................................................................. 220
14.5.4 Serial Data Reception (Clocked Synchronous Mode) ...................................... 223
14.5.5 Simultaneous Serial Data Transmission and Reception.................................... 225
14.6 Multiprocessor Communication Function ........................................................................ 227
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14.6.1 Multiprocessor Serial Data Transmission ......................................................... 229
14.6.2 Multiprocessor Serial Data Reception .............................................................. 231
14.7 Interrupts........................................................................................................................... 235
14.8 Usage Notes...................................................................................................................... 236
14.8.1 Break Detection and Processing ....................................................................... 236
14.8.2 Mark State and Break Sending.......................................................................... 236
14.8.3 Receive Error Flags and Transmit Operations
(Clocked Synchronous Mode Only).................................................................. 236
14.8.4 Receive Data Sampling Timing and Reception Margin in Asynchronous
Mode ................................................................................................................. 237
Section 15 I2C Bus Interface 2 (IIC2) ................................................................239
15.1 Features............................................................................................................................. 239
15.2 Input/Output Pins.............................................................................................................. 241
15.3 Register Descriptions........................................................................................................ 242
15.3.1 I2C Bus Control Register 1 (ICCR1)................................................................. 242
15.3.2 I2C Bus Control Register 2 (ICCR2)................................................................. 245
15.3.3 I2C Bus Mode Register (ICMR)........................................................................ 246
15.3.4 I2C Bus Interrupt Enable Register (ICIER) ....................................................... 248
15.3.5 I2C Bus Status Register (ICSR)......................................................................... 250
15.3.6 Slave Address Register (SAR).......................................................................... 252
15.3.7 I2C Bus Transmit Data Register (ICDRT)......................................................... 253
15.3.8 I2C Bus Receive Data Register (ICDRR).......................................................... 253
15.3.9 I2C Bus Shift Register (ICDRS)........................................................................ 253
15.4 Operation .......................................................................................................................... 254
15.4.1 I2C Bus Format.................................................................................................. 254
15.4.2 Master Transmit Operation ............................................................................... 255
15.4.3 Master Receive Operation................................................................................. 257
15.4.4 Slave Transmit Operation ................................................................................. 259
15.4.5 Slave Receive Operation................................................................................... 261
15.4.6 Clocked Synchronous Serial Format................................................................. 263
15.4.7 Noise Canceler.................................................................................................. 265
15.4.8 Example of Use................................................................................................. 266
15.5 Interrupts........................................................................................................................... 270
15.6 Bit Synchronous Circuit.................................................................................................... 271
15.7 Usage Notes...................................................................................................................... 272
15.7.1 Issue (Retransmission) of Start/Stop Conditions .............................................. 272
15.7.2 WAIT Setting in I2C Bus Mode Register (ICMR) ............................................ 272
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Section 16 A/D Converter .................................................................................273
16.1 Features............................................................................................................................. 273
16.2 Input/Output Pins.............................................................................................................. 275
16.3 Register Description ......................................................................................................... 275
16.3.1 A/D Data Registers A to D (ADDRA to ADDRD) .......................................... 275
16.3.2 A/D Control/Status Register (ADCSR) ............................................................ 276
16.3.3 A/D Control Register (ADCR) ......................................................................... 278
16.4 Operation .......................................................................................................................... 279
16.4.1 Single Mode...................................................................................................... 279
16.4.2 Scan Mode ........................................................................................................ 279
16.4.3 Input Sampling and A/D Conversion Time ...................................................... 280
16.4.4 External Trigger Input Timing.......................................................................... 281
16.5 A/D Conversion Accuracy Definitions............................................................................. 282
16.6 Usage Notes...................................................................................................................... 284
16.6.1 Permissible Signal Source Impedance .............................................................. 284
16.6.2 Influences on Absolute Accuracy ..................................................................... 284
Section 17 Band-Gap Circuit, Power-On Reset, and Low-Voltage
Detection Circuits............................................................................ 285
17.1 Features............................................................................................................................. 286
17.2 Register Descriptions........................................................................................................ 288
17.2.1 Low-Voltage-Detection Control Register (LVDCR)........................................ 288
17.2.2 Low-Voltage-Detection Status Register (LVDSR)........................................... 290
17.3 Operations......................................................................................................................... 291
17.3.1 Power-On Reset Circuit .................................................................................... 291
17.3.2 Low-Voltage Detection Circuit......................................................................... 292
Section 18 Power Supply Circuit ...................................................................... 299
18.1 When Using Internal Power Supply Step-Down Circuit .................................................. 299
18.2 When Not Using Internal Power Supply Step-Down Circuit ........................................... 300
Section 19 List of Registers...............................................................................301
19.1 Register Addresses (Address Order)................................................................................. 302
19.2 Register Bits ..................................................................................................................... 306
19.3 Register States in Each Operating Mode .......................................................................... 309
Section 20 Electrical Characteristics .................................................................313
20.1 Absolute Maximum Ratings ............................................................................................. 313
20.2 Electrical Characteristics (F-ZTATTM Version)................................................................. 314
Rev. 3.00 Sep. 14, 2006 Page xvii of xxviii
20.2.1 Power Supply Voltage and Operating Ranges .................................................. 314
20.2.2 DC Characteristics ............................................................................................ 316
20.2.3 AC Characteristics ............................................................................................ 321
20.2.4 A/D Converter Characteristics.......................................................................... 325
20.2.5 Watchdog Timer Characteristics....................................................................... 326
20.2.6 Power-Supply-Voltage Detection Circuit Characteristics................................. 327
20.2.7 LVDI External Voltage Detection Circuit Characteristics................................ 327
20.2.8 Power-On Reset Characteristics........................................................................ 328
20.2.9 Flash Memory Characteristics .......................................................................... 329
20.3 Electrical Characteristics (Masked ROM Version)........................................................... 331
20.3.1 Power Supply Voltage and Operating Ranges .................................................. 331
20.3.2 DC Characteristics ............................................................................................ 333
20.3.3 AC Characteristics ............................................................................................ 338
20.3.4 A/D Converter Characteristics.......................................................................... 342
20.3.5 Watchdog Timer Characteristics....................................................................... 343
20.3.6 Power-Supply-Voltage Detection Circuit Characteristics................................. 344
20.3.7 LVDI External Voltage Detection Circuit Characteristics................................ 344
20.3.8 Power-On Reset Characteristics........................................................................ 345
20.4 Operation Timing.............................................................................................................. 346
20.5 Output Load Condition ..................................................................................................... 348
Appendix A Instruction Set ...............................................................................349
A.1 Instruction List.................................................................................................................. 349
A.2 Operation Code Map......................................................................................................... 364
A.3 Number of Execution States ............................................................................................. 367
A.4 Combinations of Instructions and Addressing Modes ...................................................... 378
Appendix B I/O Port Block Diagrams...............................................................379
B.1 I/O Port Block Diagrams .................................................................................................. 379
B.2 Port States in Each Operating State .................................................................................. 394
Appendix C Product Code Lineup.....................................................................395
Appendix D Package Dimensions .....................................................................396
Main Revisions and Additions in this Edition .....................................................399
Index ....................................................................................................................405
Rev. 3.00 Sep. 14, 2006 Page xviii of xxviii
Rev. 3.00 Sep. 14, 2006 Page xix of xxviii
Figures
Section 1 Overview
Figure 1.1 Internal Block Diagram of H8/36912 Group.................................................................3
Figure 1.2 Internal Block Diagram of H8/36902 Group.................................................................4
Figure 1.3 Pin Arrangement of H8/36912 Group (FP-32A)...........................................................5
Figure 1.4 Pin Arrangement of H8/36902 Group (FP-32A)...........................................................6
Figure 1.5 Pin Arrangement of H8/36912 Group (FP-32D, 32P4B) .............................................. 7
Figure 1.6 Pin Arrangement of H8/36902 Group (FP-32D, 32P4B) .............................................. 8
Section 2 CPU
Figure 2.1 Memory Map (1) .........................................................................................................12
Figure 2.1 Memory Map (2) .........................................................................................................13
Figure 2.2 CPU Registers .............................................................................................................14
Figure 2.3 Usage of General Registers .........................................................................................15
Figure 2.4 Relationship between Stack Pointer and Stack Area................................................... 16
Figure 2.5 General Register Data Formats (1)..............................................................................18
Figure 2.5 General Register Data Formats (2)..............................................................................19
Figure 2.6 Memory Data Formats.................................................................................................20
Figure 2.7 Instruction Formats......................................................................................................31
Figure 2.8 Branch Address Specification in Memory Indirect Mode ........................................... 35
Figure 2.9 On-Chip Memory Access Cycle.................................................................................. 37
Figure 2.10 On-Chip Peripheral Module Access Cycle (3-State Access)..................................... 38
Figure 2.11 CPU Operation States................................................................................................ 39
Figure 2.12 State Transitions........................................................................................................40
Figure 2.13 Example of Timer Configuration with Two Registers Allocated to Same
Address...................................................................................................................... 41
Section 3 Exception Handling
Figure 3.1 Reset Sequence............................................................................................................ 56
Figure 3.2 Stack Status after Exception Handling ........................................................................ 58
Figure 3.3 Interrupt Sequence.......................................................................................................60
Figure 3.4 Port Mode Register Setting and Interrupt Request Flag Clearing Procedure .............. 61
Section 4 Address Break
Figure 4.1 Block Diagram of Address Break................................................................................ 63
Figure 4.2 Address Break Interrupt Operation Example (1).........................................................67
Figure 4.2 Address Break Interrupt Operation Example (2).........................................................68
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Section 5 Clock Pulse Generators
Figure 5.1 Block Diagram of Clock Pulse Generators.................................................................. 69
Figure 5.2 State Transition of System Clock................................................................................ 75
Figure 5.3 Flowchart of Clock Switching On-chip Oscillator Clock to External Clock (1)........ 76
Figure 5.4 Flowchart of Clock Switching External Clock to On-chip Oscillator Clock (2) ......... 77
Figure 5.5 Timing Chart of Switching On-chip Oscillator Clock to External Clock.................... 78
Figure 5.6 Timing Chart to Switch External Clock to On-chip Oscillator Clock......................... 79
Figure 5.7 Example of Trimming Flow for On-chip Oscillator Frequency.................................. 80
Figure 5.8 Timing Chart of Trimming of On-chip Oscillator Frequency..................................... 81
Figure 5.9 Example of Connection to Crystal Resonator ............................................................. 82
Figure 5.10 Equivalent Circuit of Crystal Resonator.................................................................... 82
Figure 5.11 Example of Connection to Ceramic Resonator ......................................................... 83
Figure 5.12 Example of External Clock Input.............................................................................. 83
Figure 5.13 Example of Incorrect Board Design.......................................................................... 84
Section 6 Power-Down Modes
Figure 6.1 Mode Transition Diagram ........................................................................................... 91
Section 7 ROM
Figure 7.1 Flash Memory Block Configuration............................................................................ 98
Figure 7.2 Programming/Erasing Flowchart Example in User Program Mode.......................... 106
Figure 7.3 Program/Program-Verify Flowchart ......................................................................... 108
Figure 7.4 Erase/Erase-Verify Flowchart ................................................................................... 111
Section 9 I/O Ports
Figure 9.1 Port 1 Pin Configuration............................................................................................ 117
Figure 9.2 Port 2 Pin Configuration............................................................................................ 121
Figure 9.3 Port 5 Pin Configuration............................................................................................ 124
Figure 9.4 Port 7 Pin Configuration............................................................................................ 128
Figure 9.5 Port 8 Pin Configuration............................................................................................ 130
Figure 9.6 Port B Pin Configuration...........................................................................................134
Figure 9.7 Port C Pin Configuration...........................................................................................136
Section 10 Timer B1
Figure 10.1 Block Diagram of Timer B1.................................................................................... 139
Section 11 Timer V
Figure 11.1 Block Diagram of Timer V ..................................................................................... 146
Figure 11.2 Increment Timing with Internal Clock.................................................................... 153
Figure 11.3 Increment Timing with External Clock................................................................... 153
Figure 11.4 OVF Set Timing...................................................................................................... 153
Figure 11.5 CMFA and CMFB Set Timing ................................................................................ 154
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Figure 11.6 TMOV Output Timing ............................................................................................ 154
Figure 11.7 Clear Timing by Compare Match............................................................................ 154
Figure 11.8 Clear Timing by TMRIV Input ............................................................................... 155
Figure 11.9 Pulse Output Example ............................................................................................. 155
Figure 11.10 Example of Pulse Output Synchronized to TRGV Input....................................... 156
Figure 11.11 Contention between TCNTV Write and Clear ...................................................... 157
Figure 11.12 Contention between TCORA Write and Compare Match ..................................... 158
Figure 11.13 Internal Clock Switching and TCNTV Operation................................................. 158
Section 12 Timer W
Figure 12.1 Timer W Block Diagram......................................................................................... 161
Figure 12.2 Free-Running Counter Operation ............................................................................ 172
Figure 12.3 Periodic Counter Operation..................................................................................... 173
Figure 12.4 0 and 1 Output Example (TOA = 0, TOB = 1)........................................................ 173
Figure 12.5 Toggle Output Example (TOA = 0, TOB = 1) ........................................................ 174
Figure 12.6 Toggle Output Example (TOA = 0, TOB = 1) ........................................................ 174
Figure 12.7 Input Capture Operating Example ........................................................................... 175
Figure 12.8 Buffer Operation Example (Input Capture)............................................................. 176
Figure 12.9 PWM Mode Example (1) ........................................................................................ 177
Figure 12.10 PWM Mode Example (2) ...................................................................................... 177
Figure 12.11 Buffer Operation Example (Output Compare) ...................................................... 178
Figure 12.12 PWM Mode Example
(TOB, TOC, and TOD = 0: Initial Output Values are Set to 0)............................. 179
Figure 12.13 PWM Mode Example
(TOB, TOC, and TOD = 1: Initial Output Values are Set to 1)............................. 180
Figure 12.14 Count Timing for Internal Clock Source............................................................... 181
Figure 12.15 Count Timing for External Clock Source.............................................................. 181
Figure 12.16 Output Compare Output Timing ........................................................................... 182
Figure 12.17 Input Capture Input Signal Timing........................................................................ 183
Figure 12.18 Timing of Counter Clearing by Compare Match................................................... 183
Figure 12.19 Buffer Operation Timing (Compare Match)..........................................................184
Figure 12.20 Buffer Operation Timing (Input Capture) ............................................................. 184
Figure 12.21 Timing of IMFA to IMFD Flag Setting at Compare Match .................................. 185
Figure 12.22 Timing of IMFA to IMFD Flag Setting at Input Capture...................................... 186
Figure 12.23 Timing of Status Flag Clearing by CPU................................................................ 186
Figure 12.24 Contention between TCNT Write and Clear ......................................................... 188
Figure 12.25 Internal Clock Switching and TCNT Operation .................................................... 188
Figure 12.26 When Compare Match and Bit Manipulation Instruction to TCRW Occur at the
Same Timing ......................................................................................................... 189
Rev. 3.00 Sep. 14, 2006 Page xxii of xxviii
Section 13 Watchdog Timer
Figure 13.1 Block Diagram of Watchdog Timer........................................................................ 191
Figure 13.2 Watchdog Timer Operation Example...................................................................... 195
Section 14 Serial Communication Interface 3 (SCI3)
Figure 14.1 Block Diagram of SCI3........................................................................................... 198
Figure 14.2 Block Diagram of Noise Filter Circuit .................................................................... 211
Figure 14.3 Data Format in Asynchronous Communication ...................................................... 212
Figure 14.4 Relationship between Output Clock and Transfer Data Phase
(Asynchronous Mode) (Example with 8-Bit Data, Parity, Two Stop Bits) ............. 212
Figure 14.5 Sample SCI3 Initialization Flowchart ..................................................................... 213
Figure 14.6 Example of SCI3 Transmission in Asynchronous Mode
(8-Bit Data, Parity, One Stop Bit) ........................................................................... 214
Figure 14.7 Sample Serial Transmission Data Flowchart (Asynchronous Mode)...................... 215
Figure 14.8 Example of SCI3 Reception in Asynchronous Mode
(8-Bit Data, Parity, One Stop Bit) ........................................................................... 216
Figure 14.9 Sample Serial Reception Data Flowchart (Asynchronous Mode) ........................... 218
Figure 14.10 Data Format in Clocked Synchronous Communication ........................................ 219
Figure 14.11 Example of SCI3 Transmission in Clocked Synchronous Mode .......................... 221
Figure 14.12 Sample Serial Transmission Flowchart (Clocked Synchronous Mode) ................ 222
Figure 14.13 Example of SCI3 Reception in Clocked Synchronous Mode................................ 223
Figure 14.14 Sample Serial Reception Flowchart (Clocked Synchronous Mode)...................... 224
Figure 14.15 Sample Flowchart of Simultaneous Serial Transmit and Receive Operations
(Clocked Synchronous Mode)............................................................................... 226
Figure 14.16 Example of Inter-Processor Communication Using Multiprocessor Format
(Transmission of Data H'AA to Receiving Station A) .......................................... 228
Figure 14.17 Sample Multiprocessor Serial Transmission Flowchart ........................................ 230
Figure 14.18 Sample Multiprocessor Serial Reception Flowchart (1)........................................ 232
Figure 14.18 Sample Multiprocessor Serial Reception Flowchart (2)........................................ 233
Figure 14.19 Example of SCI3 Reception Using Multiprocessor Format
(Example with 8-Bit Data, Multiprocessor Bit, One Stop Bit).............................. 234
Figure 14.20 Receive Data Sampling Timing in Asynchronous Mode ...................................... 237
Section 15 I2C Bus Interface 2 (IIC2)
Figure 15.1 Block Diagram of I2C Bus Interface 2..................................................................... 240
Figure 15.2 External Circuit Connections of I/O Pins................................................................ 241
Figure 15.3 I2C Bus Formats ...................................................................................................... 254
Figure 15.4 I2C Bus Timing........................................................................................................ 254
Figure 15.5 Master Transmit Mode Operation Timing (1)......................................................... 256
Figure 15.6 Master Transmit Mode Operation Timing (2)......................................................... 256
Figure 15.7 Master Receive Mode Operation Timing (1) .......................................................... 258
Rev. 3.00 Sep. 14, 2006 Page xxiii of xxviii
Figure 15.8 Master Receive Mode Operation Timing (2)........................................................... 259
Figure 15.9 Slave Transmit Mode Operation Timing (1) ........................................................... 260
Figure 15.10 Slave Transmit Mode Operation Timing (2) ......................................................... 261
Figure 15.11 Slave Receive Mode Operation Timing (1)........................................................... 262
Figure 15.12 Slave Receive Mode Operation Timing (2)........................................................... 262
Figure 15.13 Clocked Synchronous Serial Transfer Format....................................................... 263
Figure 15.14 Transmit Mode Operation Timing......................................................................... 264
Figure 15.15 Receive Mode Operation Timing .......................................................................... 265
Figure 15.16 Block Diagram of Noise Canceler......................................................................... 265
Figure 15.17 Sample Flowchart for Master Transmit Mode.......................................................266
Figure 15.18 Sample Flowchart for Master Receive Mode ........................................................ 267
Figure 15.19 Sample Flowchart for Slave Transmit Mode.........................................................268
Figure 15.20 Sample Flowchart for Slave Receive Mode .......................................................... 269
Figure 15.21 Timing of Bit Synchronous Circuit ....................................................................... 271
Section 16 A/D Converter
Figure 16.1 Block Diagram of A/D Converter ........................................................................... 274
Figure 16.2 A/D Conversion Timing..........................................................................................280
Figure 16.3 External Trigger Input Timing ................................................................................ 281
Figure 16.4 A/D Conversion Accuracy Definitions (1).............................................................. 283
Figure 16.5 A/D Conversion Accuracy Definitions (2).............................................................. 283
Figure 16.6 Analog Input Circuit Example................................................................................. 284
Section 17 Band-Gap Circuit, Power-On Reset, and Low-Voltage Detection Circuits
Figure 17.1 Block Diagram around BGR ................................................................................... 286
Figure 17.2 Block Diagram of Power-On Reset Circuit and Low-Voltage Detection Circuit.... 287
Figure 17.3 Operational Timing of Power-On Reset Circuit......................................................292
Figure 17.4 Operating Timing of LVDR Circuit ........................................................................ 293
Figure 17.5 Operational Timing of LVDI Circuit....................................................................... 294
Figure 17.6 Operational Timing of LVDI Circuit
(When Compared Voltage is Input through ExtU and ExtD Pins).......................... 296
Figure 17.7 Timing for Enabling/Disabling of Low-Voltage Detection Circuit......................... 297
Section 18 Power Supply Circuit
Figure 18.1 Power Supply Connection when Internal Step-Down Circuit is Used .................... 299
Figure 18.2 Power Supply Connection when Internal Step-Down Circuit is Not Used ............. 300
Section 20 Electrical Characteristics
Figure 20.1 System Clock Input Timing..................................................................................... 346
Figure 20.2 RES Low Width Timing.......................................................................................... 346
Figure 20.3 Input Timing............................................................................................................ 346
Figure 20.4 I2C Bus Interface Input/Output Timing ................................................................... 347
Rev. 3.00 Sep. 14, 2006 Page xxiv of xxviii
Figure 20.5 SCK3 Input Clock Timing ...................................................................................... 347
Figure 20.6 SCI3 Input/Output Timing in Clocked Synchronous Mode .................................... 348
Figure 20.7 Output Load Circuit ................................................................................................ 348
Appendix
Figure B.1 Port 1 Block Diagram (P17) ..................................................................................... 379
Figure B.2 Port 1 Block Diagram (P14) ..................................................................................... 380
Figure B.3 Port 2 Block Diagram (P22) ..................................................................................... 381
Figure B.4 Port 2 Block Diagram (P21) ..................................................................................... 382
Figure B.5 Port 2 Block Diagram (P20) ..................................................................................... 383
Figure B.6 (1) Port 5 Block Diagram (P57, P56) (for H8/36912 Group) ................................... 384
Figure B.6 (2) Port 5 Block Diagram (P57, P56) (for H8/36902 Group) ................................... 385
Figure B.7 Port 5 Block Diagram (P55) ..................................................................................... 386
Figure B.8 Port 5 Block Diagram (P76) ..................................................................................... 387
Figure B.9 Port 7 Block Diagram (P75) ..................................................................................... 388
Figure B.10 Port 7 Block Diagram (P74) ................................................................................... 389
Figure B.11 Port 8 Block Diagram (P84 to P81)........................................................................ 390
Figure B.12 Port 8 Block Diagram (P80) ................................................................................... 391
Figure B.13 Port B Block Diagram (PB3, PB2) ......................................................................... 392
Figure B.14 Port B Block Diagram (PB1, PB0) ......................................................................... 392
Figure B.15 Port C Block Diagram (PC1).................................................................................. 393
Figure B.16 Port C Block Diagram (PC0).................................................................................. 394
Figure D.1 FP-32D Package Dimensions................................................................................... 396
Figure D.2 FP-32A Package Dimension..................................................................................... 397
Figure D.3 32P4B Package Dimension ...................................................................................... 398
Rev. 3.00 Sep. 14, 2006 Page xxv of xxviii
Tables
Section 1 Overview
Table 1.1 Pin Functions ............................................................................................................ 9
Section 2 CPU
Table 2.1 Operation Notation ................................................................................................. 21
Table 2.2 Data Transfer Instructions.......................................................................................22
Table 2.3 Arithmetic Operations Instructions (1) ................................................................... 23
Table 2.3 Arithmetic Operations Instructions (2) ................................................................... 24
Table 2.4 Logic Operations Instructions................................................................................. 25
Table 2.5 Shift Instructions..................................................................................................... 25
Table 2.6 Bit Manipulation Instructions (1)............................................................................ 26
Table 2.6 Bit Manipulation Instructions (2)............................................................................ 27
Table 2.7 Branch Instructions ................................................................................................. 28
Table 2.8 System Control Instructions.................................................................................... 29
Table 2.9 Block Data Transfer Instructions ............................................................................ 30
Table 2.10 Addressing Modes .................................................................................................. 32
Table 2.11 Absolute Address Access Ranges...........................................................................34
Table 2.12 Effective Address Calculation (1)........................................................................... 35
Table 2.12 Effective Address Calculation (2)........................................................................... 36
Section 3 Exception Handling
Table 3.1 Exception Sources and Vector Address..................................................................47
Table 3.2 Interrupt Wait States ............................................................................................... 59
Section 4 Address Break
Table 4.1 Access and Data Bus Used .....................................................................................65
Section 5 Clock Pulse Generators
Table 5.1 Crystal Resonator Parameters ................................................................................. 82
Section 6 Power-Down Modes
Table 6.1 Operating Frequency and Wait Time......................................................................87
Table 6.2 Transition Mode after SLEEP Instruction Execution and Interrupt Handling ........ 92
Table 6.3 Internal State in Each Operating Mode...................................................................92
Section 7 ROM
Table 7.1 Setting Programming Modes ................................................................................ 102
Table 7.2 Boot Mode Operation ........................................................................................... 104
Table 7.3 System Clock Frequencies for which Automatic Adjustment of LSI Bit Rate is
Possible ................................................................................................................. 105
Rev. 3.00 Sep. 14, 2006 Page xxvi of xxviii
Table 7.4 Reprogram Data Computation Table .................................................................... 109
Table 7.5 Additional-Program Data Computation Table...................................................... 109
Table 7.6 Programming Time............................................................................................... 109
Section 10 Timer B1
Table 10.1 Timer B1 Operating Modes .................................................................................. 143
Section 11 Timer V
Table 11.1 Pin Configuration.................................................................................................. 147
Table 11.2 Clock Signals to Input to TCNTV and Counting Conditions ............................... 149
Section 12 Timer W
Table 12.1 Timer W Functions ............................................................................................... 160
Table 12.2 Pin Configuration.................................................................................................. 162
Section 14 Serial Communication Interface 3 (SCI3)
Table 14.1 Pin Configuration.................................................................................................. 199
Table 14.2 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode)............ 207
Table 14.3 Maximum Bit Rate for Each Frequency (Asynchronous Mode) .......................... 209
Table 14.4 Examples of BRR Settings for Various Bit Rates
(Clocked Synchronous Mode) .............................................................................. 210
Table 14.5 SSR Status Flags and Receive Data Handling ...................................................... 217
Table 14.6 SCI3 Interrupt Requests........................................................................................ 235
Section 15 I2C Bus Interface 2 (IIC2)
Table 15.1 Pin Configuration.................................................................................................. 241
Table 15.2 Transfer Rate ........................................................................................................ 244
Table 15.3 Interrupt Requests................................................................................................. 270
Table 15.4 Time for Monitoring SCL..................................................................................... 271
Section 16 A/D Converter
Table 16.1 Pin Configuration.................................................................................................. 275
Table 16.2 Analog Input Channels and Corresponding ADDR Registers.............................. 276
Table 16.3 A/D Conversion Time (Single Mode)................................................................... 281
Section 17 Band-Gap Circuit, Power-On Reset, and Low-Voltage Detection Circuits
Table 17.1 LVDCR Settings and Select Functions................................................................. 289
Section 20 Electrical Characteristics
Table 20.1 Absolute Maximum Ratings ................................................................................. 313
Table 20.2 DC Characteristics (1) .......................................................................................... 316
Table 20.2 DC Characteristics (2) .......................................................................................... 320
Table 20.3 AC Characteristics ................................................................................................ 321
Table 20.4 I2C Bus Interface Timing...................................................................................... 323
Rev. 3.00 Sep. 14, 2006 Page xxvii of xxviii
Table 20.5 Serial Interface (SCI3) Timing ............................................................................. 324
Table 20.6 A/D Converter Characteristics .............................................................................. 325
Table 20.7 Watchdog Timer Characteristics........................................................................... 326
Table 20.8 Power-Supply-Voltage Detection Circuit Characteristics..................................... 327
Table 20.9 LVDI External Voltage Detection Circuit Characteristics.................................... 327
Table 20.10 Power-On Reset Circuit Characteristics............................................................ 328
Table 20.11 Flash Memory Characteristics .......................................................................... 329
Table 20.12 DC Characteristics (1).......................................................................................333
Table 20.12 DC Characteristics (2).......................................................................................337
Table 20.13 AC Characteristics ............................................................................................ 338
Table 20.14 I2C Bus Interface Timing .................................................................................. 340
Table 20.15 Serial Interface (SCI3) Timing ......................................................................... 341
Table 20.16 A/D Converter Characteristics .......................................................................... 342
Table 20.17 Watchdog Timer Characteristics....................................................................... 343
Table 20.18 Power-Supply-Voltage Detection Circuit Characteristics................................. 344
Table 20.19 LVDI External Voltage Detection Circuit Characteristics................................ 344
Table 20.20 Power-On Reset Circuit Characteristics............................................................ 345
Appendix
Table A.1 Instruction Set....................................................................................................... 351
Table A.2 Operation Code Map (1) ....................................................................................... 364
Table A.2 Operation Code Map (2) ....................................................................................... 365
Table A.2 Operation Code Map (3) ....................................................................................... 366
Table A.3 Number of Cycles in Each Instruction.................................................................. 368
Table A.4 Number of Cycles in Each Instruction.................................................................. 369
Table A.5 Combinations of Instructions and Addressing Modes .......................................... 378
Rev. 3.00 Sep. 14, 2006 Page xxviii of xxviii
Section 1 Overview
Rev. 3.00 Sep. 14, 2006 Page 1 of 408
REJ09B0105-0300
Section 1 Overview
1.1 Features
• High-speed H8/300H central processing unit with an internal 16-bit architecture
Upward-compatible with H8/300 CPU on an object level
Sixteen 16-bit general registers
62 basic instructions
• Various peripheral functions
Timer B1* (8-bit timer)
Timer V (8-bit timer)
Timer W (16-bit timer)
Watchdog timer
SCI3 (Asynchronous or clocked synchronous serial communication interface)
10-bit A/D converter
I2C bus interface* (conforms to the Philips I2C bus interface functions)
POR/LVD (Power-on reset and low-voltage detection circuits)
Address break
Note: * Available for the H8/36912 Group only.
• On-chip memory
Product Classification Type ROM RAM Remarks
H8/36912F HD64F36912G 8 kbytes 1,536 bytes Flash memory
version
(F-ZTATTM
version)
H8/36902F HD64F36902G 8 kbytes 1,536 bytes
H8/36912 HD64336912G 8 kbytes 512 bytes
H8/36911 HD64336911G 4 kbytes 256 bytes
H8/36902 HD64336902G 8 kbytes 512 bytes
H8/36901 HD64336901G 4 kbytes 256 bytes
Masked ROM
version
H8/36900 HD64336900G 2 kbytes 256 bytes
Note: F-ZTATTM is a trademark of Renesas Technology Corp.
Section 1 Overview
Rev. 3.00 Sep. 14, 2006 Page 2 of 408
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• General I/O ports
Eighteen I/O pins, including five large-current ports (IOL = 20 mA, @VOL = 1.5 V,
−IOH = 4 mA, @VOH = Vcc − 1.0 V)
Four input only pins (also used for analog input)
• On-chip oscillator
Frequency accuracy: 8MHz ±1% (Typ.) Vcc = 5.0 V, Ta = 25°C
(Flash memory version): 8MHz ±3% Vcc = 4.0 to 5.0 V, Ta = −20 to 75°C
10MHz ±4% (Typ.) Vcc = 4.0 to 5.0 V, Ta = −20 to 75°C
• Supports various power-down modes
• Compact package
Package Code Body Size Pin Pitch Remarks
LQFP-32 FP-32A 7.0
× 7.0 mm 0.8 mm
SOP-32 FP-32D 11.3 × 20.45 mm 1.27 mm
SDIP-32* 32P4B 400 mil 1.78 mm
Note: * Flash memory version only
Section 1 Overview
Rev. 3.00 Sep. 14, 2006 Page 3 of 408
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1.2 Internal Block Diagram
P17/IRQ3/TRGV
P14/IRQ0
P57/SCL
P56/SDA
P55/WKP5/ADTRG
PC0/OSC1
PC1/OSC2/CLKOUT
V
CL
V
SS
V
CC
RES
TEST
NMI
AV
CC
P22/TXD
P21/RXD
P20/SCK3
P84/FTIOD
P83/FTIOC
P82/FTIOB
P81/FTIOA
P80/FTCI
P76/TMOV
P75/TMCIV
P74/TMRIV
E10T_0*
E10T_1*
E10T_2*
Port 7Port 8
Port 2 Port 1Port 5
Data bus (upper)
CPU
H8/300H
Data bus (lower)
Port C
PB3/AN3/ExtU
PB2/AN2/ExtD
PB1/AN1
PB0/AN0
Port B
On-chip
oscillator
(OSC1)
(OSC2)
System
clock
generator
RAM
Timer W SCI3
IIC2
Watchdog
timer
Timer V
Timer B1
A/D
converter POR & LVD
ROM
Address bus
Note: * Can also be used for the E7 or E8 emulator.
Figure 1.1 Internal Block Diagram of H8/36912 Group
Section 1 Overview
Rev. 3.00 Sep. 14, 2006 Page 4 of 408
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Note: * Can also be used for the E7 or E8 emulator.
P17/IRQ3/TRGV
P14/IRQ0
P57
P56
P55/WKP5/ADTRG
PC0/OSC1
PC1/OSC2/CLKOUT
V
CL
V
SS
V
CC
RES
TEST
NMI
AV
CC
P22/TXD
P21/RXD
P20/SCK3
P84/FTIOD
P83/FTIOC
P82/FTIOB
P81/FTIOA
P80/FTCI
P76/TMOV
P75/TMCIV
P74/TMRIV
E10T_0*
E10T_1*
E10T_2*
Data bus (upper)
CPU
H8/300H
Data bus (lower)
PB3/AN3/ExtU
PB2/AN2/ExtD
PB1/AN1
PB0/AN0
On-chip
oscillator
(OSC1)
(OSC2)
System
clock
generator
Address bus
RAM
Timer W SCI3
Watchdog
timer
Timer V
A/D
converter POR & LVD
ROM
Port 7Port 8
Port 2 Port 1Port 5
Port C Port B
Figure 1.2 Internal Block Diagram of H8/36902 Group
Section 1 Overview
Rev. 3.00 Sep. 14, 2006 Page 5 of 408
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1.3 Pin Arrangement
25
26
27
28
29
30
31
32
P84/FTIOD
P74/TMRIV
P75/TMCIV
P76/TMOV
PB3/AN3/ExtU
PB2/AN2/ExtD
PB1/AN1
PB0/AN0
P14/IRQ0
P56/SDA
P57/SCL
E10T_2*
E10T_1*
E10T_0*
P17/IRQ3/TRGV
NMI
16
15
14
13
12
11
10
9
P55/WKP5/ADTR
G
P82/FTIOB
P83/FTIOC
24
23
22
21
20
19
18
17
P20/SCK3
P21/RXD
P22/TXD
P80/FTCI
P81/FTIOA
H8/36912 Group
(Top view)
V
CL
PC0/OSC1
PC1/OSC2/CLKOUT
Vss
TEST
RES
Vcc
AVcc 1
2
3
4
5
6
7
8
Note: * Can also be used for the E7 or E8 emulator.
Figure 1.3 Pin Arrangement of H8/36912 Group (FP-32A)
Section 1 Overview
Rev. 3.00 Sep. 14, 2006 Page 6 of 408
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25
26
27
28
29
30
31
32
P84/FTIOD
P74/TMRIV
P75/TMCIV
P76/TMOV
PB3/AN3/ExtU
PB2/AN2/ExtD
PB1/AN1
PB0/AN0
P14/IRQ0
P56
P57
E10T_2*
E10T_1*
E10T_0*
P17/IRQ3/TRGV
NMI
16
15
14
13
12
11
10
9
P55/WKP5/ADTR
G
P82/FTIOB
P83/FTIOC
24
23
22
21
20
19
18
17
P20/SCK3
P21/RXD
P22/TXD
P80/FTCI
P81/FTIOA
H8/36902 Group
(Top view)
V
CL
PC0/OSC1
PC1/OSC2/CLKOUT
Vss
TEST
RES
Vcc
AVcc 1
2
3
4
5
6
7
8
Note: * Can also be used for the E7 or E8 emulator.
Figure 1.4 Pin Arrangement of H8/36902 Group (FP-32A)
Section 1 Overview
Rev. 3.00 Sep. 14, 2006 Page 7 of 408
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PB3/AN3/ExtU P76/TMOV
P75/TMCIV
P74/TMRIV
P84/FTIOD
P83/FTIOC
P82/FTIOB
P81/FTIOA
P80/FTCI
P22/TXD
P21/RXD
P20/SCK3
P55/WKP5/ADTR
G
P14/IRQ0
P56/SDA
P57/SCL
E10T_2*
PB2/AN2/ExtD
PB1/AN1
PB0/AN0
AVcc
Vcc
RES
TEST
Vss
PC1/OSC2/CLKOUT
PC0/OSC1
VCL
NMI
P17/IRQ3/TRGV
E10T_0*
E10T_1*
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
H8/36912 Group
(Top view)
Note: * Can also be used for the E7 or E8 emulator.
Figure 1.5 Pin Arrangement of H8/36912 Group (FP-32D, 32P4B)
Section 1 Overview
Rev. 3.00 Sep. 14, 2006 Page 8 of 408
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Note: * Can also be used for the E7 or E8 emulator.
PB3/AN3/ExtU P76/TMOV
P75/TMCIV
P74/TMRIV
P84/FTIOD
P83/FTIOC
P82/FTIOB
P81/FTIOA
P80/FTCI
P22/TXD
P21/RXD
P20/SCK3
P55/WKP5/ADTR
G
P14/IRQ0
P56
P57
E10T_2*
PB2/AN2/ExtD
PB1/AN1
PB0/AN0
AVcc
Vcc
RES
TEST
Vss
PC1/OSC2/CLKOUT
PC0/OSC1
VCL
NMI
P17/IRQ3/TRGV
E10T_0*
E10T_1*
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
H8/36902 Group
(Top view)
Figure 1.6 Pin Arrangement of H8/36902 Group (FP-32D, 32P4B)
Section 1 Overview
Rev. 3.00 Sep. 14, 2006 Page 9 of 408
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1.4 Pin Functions
Table 1.1 Pin Functions
Pin No.
Type Symbol
FP-32D,
32P4B FP-32A I/O Functions
VCC 6 2 Input Power supply pin. Connect this pin
to the system power supply.
VSS 9 5 Input Ground pin. Connect this pin to the
system power supply (0 V).
AVCC 5 1 Input Analog power supply pin for the
A/D converter. When the A/D
converter is not used, connect this
pin to the system power supply.
Power
source
VCL 12 8 Input Internal step-down power supply
pin. Connect a capacitor of around
0.1 µF between this pin and the Vss
pin for stabilization.
OSC1 11 7 Input Clock
OSC2/
CLKOUT
10 6 Output
These pins are connected to a
crystal or ceramic resonator for
system clocks, or can be used to
input an external clock. When an
on-chip oscillator is used, system
clocks can be output to OSC2. See
section 5, Clock Pulse Generators,
for a typical connection.
RES 7 3 Input Reset pin. The pull-up resistor (typ.
150 kΩ) is incorporated. When
driven low, the chip is reset.
System
control
TEST 8 4 Input Test pin. Connect this pin to Vss.
NMI 13 9 Input Non-maskable interrupt request
input pin. Be sure to pull-up by a
pull-up resistor.
IRQ0,
IRQ3
20, 14 16, 10 Input External interrupt request input
pins. Can select the rising or falling
edge.
External
interrupt
WKP5 21 17 Input External interrupt request input pin.
Can select the rising or falling edge.
Section 1 Overview
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Pin No.
Type Symbol
FP-32D,
32P4B FP-32A I/O Functions
TMOV 32 28 Output TMOV is an output pin for
waveforms generated by the output
compare function.
TMCIV 31 27 Input External event input pin
TMRIV 30 26 Input Counter reset input pin
Timer V
TRGV 14 10 Input Counter start trigger input pin
FTCI 25 21 Input External event input pin Timer W
FTIOA to
FTIOD
26 to 29 22 to 25 I/O Output compare output/ input
capture input/ PWM output common
pins
SDA 19 15 I/O I2C data I/O pin. NMOS open drain
output can directly drive the bus.
I2C bus
interface 2*
SCL 18 14 I/O I2C clock I/O pin. NMOS open drain
output can directly drive the bus.
TXD 24 20 Output Transmit data output pin
RXD 23 19 Input Receive data input pin
Serial
communi-
cation
interface SCK3 22 18 I/O Clock I/O pin
AN3 to AN0 1 to 4 29 to 32 Input Analog input pin A/D
converter ADTRG 21 17 Input A/D converter trigger input pin
P17, P14 14, 20 10, 16 I/O 2-bit I/O port
P22 to P20 24 to 22 20 to 18 I/O 3-bit I/O port
P57 to P55 18, 19, 21 14, 15, 17 I/O 3-bit I/O port
P76 to P74 32 to 30 28 to 26 I/O 3-bit I/O port
P84 to P80 29 to 25 25 to 21 I/O 5-bit I/O port
PB3 to PB0 1 to 4 29 to 32 Input 4-bit input port
I/O ports
PC1, PC0 10, 11 6, 7 I/O 2-bit I/O port
Low voltage
detection
circuit
ExtU, ExtD 1, 2 29, 30 Input External input pins for the detection
voltage used in the low-voltage
detection circuit
E7, E8 E10T_0,
E10T_1,
E10T_2
15, 16, 17 11, 12, 13 Interface pins for the E7 or E8
emulator
Note: * Available for the H8/36912 Group only.
Section 2 CPU
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Section 2 CPU
This LSI has an H8/300H CPU with an internal 32-bit architecture that is upward-compatible with
the H8/300 CPU, and supports only normal mode, which has a 64-kbyte address space.
• Upward-compatible with H8/300 CPUs
Can execute H8/300 CPUs object programs
Additional eight 16-bit extended registers
32-bit transfer and arithmetic and logic instructions are added
Signed multiply and divide instructions are added.
• General-register architecture
Sixteen 16-bit general registers also usable as sixteen 8-bit registers or eight 32-bit registers
• Sixty-two basic instructions
8/16/32-bit data transfer and arithmetic and logic instructions
Multiply and divide instructions
Powerful bit-manipulation instructions
• Eight addressing modes
Register direct [Rn]
Register indirect [@ERn]
Register indirect with displacement [@(d:16,ERn) or @(d:24,ERn)]
Register indirect with post-increment or pre-decrement [@ERn+ or @–ERn]
Absolute address [@aa:8, @aa:16, @aa:24]
Immediate [#xx:8, #xx:16, or #xx:32]
Program-counter relative [@(d:8,PC) or @(d:16,PC)]
Memory indirect [@@aa:8]
• 64-kbyte address space
• High-speed operation
All frequently-used instructions execute in two or four states
8/16/32-bit register-register add/subtract : 2 state
8 × 8-bit register-register multiply : 14 states
16 ÷ 8-bit register-register divide : 14 states
16 × 16-bit register-register multiply : 22 states
32 ÷ 16-bit register-register divide : 22 states
• Power-down state
Transition to power-down state by SLEEP instruction
Section 2 CPU
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2.1 Address Space and Memory Map
The address space of this LSI is 64 kbytes, which includes the program area and the data area. The
following two figures show the memory map, respectively.
H8/36912F
H8/36902F
(Flash memory version)
H8/36912
H8/36902
(Masked ROM version)
Interrupt vector
On-chip ROM
(8 kbytes)
Not used
Not used
On-chip RAM
user area
(512 bytes)
Internal I/O register
H'0000
H'0045
H'0046
H'1FFF
H'FD80
H'FF7F
H'FF80
H'FFFF
Interrupt vector
On-chip ROM
(8 kbytes)
(E7 or E8 work area,
for flash memory
programming:
1 kbyte)
Not used
Not used
On-chip RAM
user area
(512 bytes)
On-chip RAM
(1.5 kbytes)
Internal I/O register
H'0000
H'0045
H'0046
H'1FFF
H'FD80
H'FD7F
H'FF7F
H'FF80
H'FFFF
H'F600
H'F77F Internal I/O register
H'F600
H'F77F
H'F980
Internal I/O register
H'2000
H'2FFF
E7 or E8 control
program area
(4 kbytes)
Figure 2.1 Memory Map (1 )
Section 2 CPU
Rev. 3.00 Sep. 14, 2006 Page 13 of 408
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H8/36911
H8/36901
(Masked ROM version) H8/36900
(Masked ROM version)
Interrupt vector
On-chip ROM
(2 kbytes)
Not used
Not used
Not used
On-chip RAM
user area
(256 bytes)
Internal I/O register
H'0000
H'0045
H'0046
H'07FF
H'FE80
H'FF7F
H'FF80
H'FFFF
Interrupt vector
On-chip ROM
(4 kbytes)
Not used
On-chip RAM
user area
(256 bytes)
Internal I/O register
H'0000
H'0045
H'0046
H'0FFF
H'FE80
H'FF7F
H'FF80
H'FFFF
H'F600
H'F77F Internal I/O register
H'F600
H'F77F Internal I/O register
Figure 2.1 Memory Map (2 )
Section 2 CPU
Rev. 3.00 Sep. 14, 2006 Page 14 of 408
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2.2 Register Configuration
The H8/300H CPU has the internal registers shown in figure 2.2. There are two types of registers;
general registers and control registers. The control registers are a 24-bit program counter (PC), and
an 8-bit condition code register (CCR).
PC
23 0
15 0 7 0 7 0
E0
E1
E2
E3
E4
E5
E6
E7
R0H
R1H
R2H
R3H
R4H
R5H
R6H
R7H
R0L
R1L
R2L
R3L
R4L
R5L
R6L
R7L
SP:
PC:
CCR:
I:
UI:
Stack pointer
Program counter
Condition-code register
Interrupt mask bit
User bit
Half-carry flag
User bit
Negative flag
Zero flag
Overflow flag
Carry flag
ER0
ER1
ER2
ER3
ER4
ER5
ER6
ER7 (SP)
IUIHUNZVC
CCR
76543210
H:
U:
N:
Z:
V:
C:
General registers (ERn)
Control registers (CR)
[Legend]
Figure 2.2 CPU Registers
Section 2 CPU
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2.2.1 General Registers
The H8/300H CPU has eight 32-bit general registers. These general registers are all functionally
identical and can be used as both address registers and data registers. When a general register is
used as a data register, it can be accessed as a 32-bit, 16-bit, or 8-bit register. Figure 2.3 illustrates
the usage of the general registers. When the general registers are used as 32-bit registers or address
registers, they are designated by the letters ER (ER0 to ER7).
The ER registers divide into 16-bit general registers designated by the letters E (E0 to E7) and R
(R0 to R7). These registers are functionally equivalent, providing a maximum of sixteen 16-bit
registers. The E registers (E0 to E7) are also referred to as extended registers.
The R registers divide into 8-bit registers designated by the letters RH (R0H to R7H) and RL (R0L
to R7L). These registers are functionally equivalent, providing a maximum of sixteen 8-bit
registers.
The usage of each register can be selected independently.
• Address registers
• 32-bit registers
• 16-bit registers • 8-bit registers
ER registers
(ER0 to ER7)
E registers (extended registers)
(E0 to E7)
R registers
(R0 to R7)
RH registers
(R0H to R7H)
RL registers
(R0L to R7L)
Figure 2.3 Usage of General Regi ster s
Section 2 CPU
Rev. 3.00 Sep. 14, 2006 Page 16 of 408
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General register ER7 has the function of stack pointer (SP) in addition to its general-register
function, and is used implicitly in exception handling and subroutine calls. Figure 2.4 shows the
stack.
SP (ER7)
Free area
Stack area
Figure 2.4 Relationship between Stack Pointer and Stack Area
2.2.2 Program Counter (PC)
This 24-bit counter indicates the address of the next instruction the CPU will execute. The length
of all CPU instructions is 2 bytes (one word), so the least significant PC bit is ignored. (When an
instruction is fetched, the least significant PC bit is regarded as 0). The PC is initialized when the
start address is loaded by the vector address generated during reset exception-handling sequence.
2.2.3 Condition-Code Register (CCR)
This 8-bit register contains internal CPU status information, including an interrupt mask bit (I) and
half-carry (H), negative (N), zero (Z), overflow (V), and carry (C) flags. The I bit is initialized to 1
by reset exception-handling sequence, but other bits are not initialized.
Some instructions leave flag bits unchanged. Operations can be performed on the CCR bits by the
LDC, STC, ANDC, ORC, and XORC instructions. The N, Z, V, and C flags are used as branching
conditions for conditional branch (Bcc) instructions.
For the action of each instruction on the flag bits, see appendix A.1, Instruction List.
Section 2 CPU
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Bit Bit Name
Initial
Value R/W Description
7 I 1 R/W Interrupt Mask Bit
Masks interrupts other than NMI when set to 1. NMI is
accepted regardless of the I bit setting. The I bit is set to
1 at the start of an exception-handling sequence.
6 UI Undefined R/W User Bit
Can be written and read by software using the LDC, STC,
ANDC, ORC, and XORC instructions.
5 H Undefined R/W Half-Carry Flag
When the ADD.B, ADDX.B, SUB.B, SUBX.B, CMP.B, or
NEG.B instruction is executed, this flag is set to 1 if there
is a carry or borrow at bit 3, and cleared to 0 otherwise.
When the ADD.W, SUB.W, CMP.W, or NEG.W
instruction is executed, the H flag is set to 1 if there is a
carry or borrow at bit 11, and cleared to 0 otherwise.
When the ADD.L, SUB.L, CMP.L, or NEG.L instruction is
executed, the H flag is set to 1 if there is a carry or
borrow at bit 27, and cleared to 0 otherwise.
4 U Undefined R/W User Bit
Can be written and read by software using the LDC, STC,
ANDC, ORC, and XORC instructions.
3 N Undefined R/W Negative Flag
Stores the value of the most significant bit of data as a
sign bit.
2 Z Undefined R/W Zero Flag
Set to 1 to indicate zero data, and cleared to 0 to indicate
non-zero data.
1 V Undefined R/W Overflow Flag
Set to 1 when an arithmetic overflow occurs, and cleared
to 0 at other times.
0 C Undefined R/W Carry Flag
Set to 1 when a carry occurs, and cleared to 0 otherwise.
Used by:
• Add instructions, to indicate a carry
• Subtract instructions, to indicate a borrow
• Shift and rotate instructions, to indicate a carry
The carry flag is also used as a bit accumulator by bit
manipulation instructions.
Section 2 CPU
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2.3 Data Formats
The H8/300H CPU can process 1-bit, 4-bit (BCD), 8-bit (byte), 16-bit (word), and 32-bit
(longword) data. Bit-manipulation instructions operate on 1-bit data by accessing bit n (n = 0, 1, 2,
…, 7) of byte operand data. The DAA and DAS decimal-adjust instructions treat byte data as two
digits of 4-bit BCD data.
2.3.1 General Register Data F or m at s
Figure 2.5 shows the data formats in general registers.
7 0
70
MSB LSB
MSB LSB
704 3
Don't care
Don't care
Don't care
7 04 3
70
Don't care
6543271
0
70
Don't care 65432710
Don't care
RnH
RnL
RnH
RnL
RnH
RnL
Data Type General Register Data Format
Byte data
Byte data
4-bit BCD data
4-bit BCD data
1-bit data
1-bit data
Upper Lower
Upper Lower
Figure 2.5 General Register Data Formats (1)
Section 2 CPU
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15 0
MSB LSB
15 0
MSB LSB
31 16
MSB
15 0
LSB
ERn:
En:
Rn:
RnH:
RnL:
MSB:
LSB:
General register ER
General register E
General register R
General register RH
General register RL
Most significant bit
Least significant bit
Data Type Data FormatGeneral
Register
Word data
Word data
Rn
En
Longword
data
[Legend]
ERn
Figure 2.5 General Register Data Formats (2)
Section 2 CPU
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2.3.2 Memory Data Formats
Figure 2.6 shows the data formats in memory. The H8/300H CPU can access word data and
longword data in memory, however word or longword data must begin at an even address. If an
attempt is made to access word or longword data at an odd address, an address error does not
occur, however the least significant bit of the address is regarded as 0, so access begins the
preceding address. This also applies to instruction fetches.
When ER7 (SP) is used as an address register to access the stack, the operand size should be word
or longword.
70
76 543210
MSB LSB
MSB
MSB
LSB
LSB
Data Type Address
1-bit data
Byte data
Word data
Address L
Address L
Address 2M
Address 2M+1
Longword data Address 2N
Address 2N+1
Address 2N+2
Address 2N+3
Data Format
Figure 2.6 Memory Data Formats
Section 2 CPU
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2.4 Instruction Set
2.4.1 Table of Instructio ns Classified by Function
The H8/300H CPU has 62 instructions. Tables 2.2 to 2.9 summarize the instructions in each
functional category. The notation used in tables 2.2 to 2.9 is defined below.
Table 2.1 Operation Notation
Symbol Description
Rd General register (destination)*
Rs General register (source)*
Rn General register*
ERn General register (32-bit register or address register)
(EAd) Destination operand
(EAs) Source operand
CCR Condition-code register
N N (negative) flag in CCR
Z Z (zero) flag in CCR
V V (overflow) flag in CCR
C C (carry) flag in CCR
PC Program counter
SP Stack pointer
#IMM Immediate data
disp Displacement
+ Addition
– Subtraction
× Multiplication
÷ Division
∧ Logical AND
∨ Logical OR
⊕ Logical XOR
→ Move
¬ NOT (logical complement)
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Symbol Description
:3/:8/:16/:24 3-, 8-, 16-, or 24-bit length
Note: * General registers include 8-bit registers (R0H to R7H, R0L to R7L), 16-bit registers (R0
to R7, E0 to E7), and 32-bit registers/address registers (ER0 to ER7).
Table 2.2 Data Transfer Instructions
Instruction Size* Function
MOV B/W/L (EAs) → Rd, Rs → (EAd)
Moves data between two general registers or between a general register
and memory, or moves immediate data to a general register.
MOVFPE B (EAs) → Rd, Cannot be used in this LSI.
MOVTPE B Rs → (EAs) Cannot be used in this LSI.
POP W/L @SP+ → Rn
Pops a general register from the stack. POP.W Rn is identical to MOV.W
@SP+, Rn. POP.L ERn is identical to MOV.L @SP+, ERn.
PUSH W/L Rn → @–SP
Pushes a general register onto the stack. PUSH.W Rn is identical to
MOV.W Rn, @–SP. PUSH.L ERn is identical to MOV.L ERn, @–SP.
Note: * Refers to the operand size.
B: Byte
W: Word
L: Longword
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Table 2.3 Arithmetic Operations Instructions (1)
Instruction Size* Function
ADD
SUB
B/W/L Rd ± Rs → Rd, Rd ± #IMM → Rd
Performs addition or subtraction on data in two general registers, or on
immediate data and data in a general register (immediate byte data
cannot be subtracted from byte data in a general register. Use the SUBX
or ADD instruction.)
ADDX
SUBX
B Rd ± Rs ± C → Rd, Rd ± #IMM ± C → Rd
Performs addition or subtraction with carry on byte data in two general
registers, or on immediate data and data in a general register.
INC
DEC
B/W/L Rd ± 1 → Rd, Rd ± 2 → Rd
Increments or decrements a general register by 1 or 2. (Byte operands
can be incremented or decremented by 1 only.)
ADDS
SUBS
L Rd ± 1 → Rd, Rd ± 2 → Rd, Rd ± 4 → Rd
Adds or subtracts the value 1, 2, or 4 to or from data in a 32-bit register.
DAA
DAS
B Rd decimal adjust → Rd
Decimal-adjusts an addition or subtraction result in a general register by
referring to the CCR to produce 4-bit BCD data.
MULXU B/W Rd × Rs → Rd
Performs unsigned multiplication on data in two general registers: either
8 bits × 8 bits → 16 bits or 16 bits × 16 bits → 32 bits.
MULXS B/W Rd × Rs → Rd
Performs signed multiplication on data in two general registers: either 8
bits × 8 bits → 16 bits or 16 bits × 16 bits → 32 bits.
DIVXU B/W Rd ÷ Rs → Rd
Performs unsigned division on data in two general registers: either 16
bits ÷ 8 bits → 8-bit quotient and 8-bit remainder or 32 bits ÷ 16 bits →
16-bit quotient and 16-bit remainder.
Note: * Refers to the operand size.
B: Byte
W: Word
L: Longword
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Table 2.3 Arithmetic Operations Instructions (2)
Instruction Size* Function
DIVXS B/W Rd ÷ Rs → Rd
Performs signed division on data in two general registers: either 16 bits ÷
8 bits → 8-bit quotient and 8-bit remainder or 32 bits ÷ 16 bits → 16-bit
quotient and 16-bit remainder.
CMP B/W/L Rd – Rs, Rd – #IMM
Compares data in a general register with data in another general register
or with immediate data, and sets CCR bits according to the result.
NEG B/W/L 0 – Rd → Rd
Takes the two's complement (arithmetic complement) of data in a
general register.
EXTU W/L Rd (zero extension) → Rd
Extends the lower 8 bits of a 16-bit register to word size, or the lower 16
bits of a 32-bit register to longword size, by padding with zeros on the
left.
EXTS W/L Rd (sign extension) → Rd
Extends the lower 8 bits of a 16-bit register to word size, or the lower 16
bits of a 32-bit register to longword size, by extending the sign bit.
Note: * Refers to the operand size.
B: Byte
W: Word
L: Longword
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Table 2.4 Logic Operations Instructions
Instruction Size* Function
AND B/W/L Rd ∧ Rs → Rd, Rd ∧ #IMM → Rd
Performs a logical AND operation on a general register and another
general register or immediate data.
OR B/W/L Rd ∨ Rs → Rd, Rd ∨ #IMM → Rd
Performs a logical OR operation on a general register and another
general register or immediate data.
XOR B/W/L Rd ⊕ Rs → Rd, Rd ⊕ #IMM → Rd
Performs a logical exclusive OR operation on a general register and
another general register or immediate data.
NOT B/W/L ¬ (Rd) → (Rd)
Takes the one's complement of general register contents.
Note: * Refers to the operand size.
B: Byte
W: Word
L: Longword
Table 2.5 Shift Instructions
Instruction Size* Function
SHAL
SHAR
B/W/L Rd (shift) → Rd
Performs an arithmetic shift on general register contents.
SHLL
SHLR
B/W/L Rd (shift) → Rd
Performs a logical shift on general register contents.
ROTL
ROTR
B/W/L Rd (rotate) → Rd
Rotates general register contents.
ROTXL
ROTXR
B/W/L Rd (rotate) → Rd
Rotates general register contents through the carry flag.
Note: * Refers to the operand size.
B: Byte
W: Word
L: Longword
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Table 2.6 Bit Manipulation Instructions (1)
Instruction Size* Function
BSET B 1 → (<bit-No.> of <EAd>)
Sets a specified bit in a general register or memory operand to 1. The bit
number is specified by 3-bit immediate data or the lower three bits of a
general register.
BCLR B 0 → (<bit-No.> of <EAd>)
Clears a specified bit in a general register or memory operand to 0. The
bit number is specified by 3-bit immediate data or the lower three bits of
a general register.
BNOT B ¬ (<bit-No.> of <EAd>) → (<bit-No.> of <EAd>)
Inverts a specified bit in a general register or memory operand. The bit
number is specified by 3-bit immediate data or the lower three bits of a
general register.
BTST B ¬ (<bit-No.> of <EAd>) → Z
Tests a specified bit in a general register or memory operand and sets or
clears the Z flag accordingly. The bit number is specified by 3-bit
immediate data or the lower three bits of a general register.
BAND
BIAND
B
B
C ∧ (<bit-No.> of <EAd>) → C
ANDs the carry flag with a specified bit in a general register or memory
operand and stores the result in the carry flag.
C ∧ ¬ (<bit-No.> of <EAd>) → C
ANDs the carry flag with the inverse of a specified bit in a general
register or memory operand and stores the result in the carry flag.
The bit number is specified by 3-bit immediate data.
BOR
BIOR
B
B
C ∨ (<bit-No.> of <EAd>) → C
ORs the carry flag with a specified bit in a general register or memory
operand and stores the result in the carry flag.
C ∨ ¬ (<bit-No.> of <EAd>) → C
ORs the carry flag with the inverse of a specified bit in a general register
or memory operand and stores the result in the carry flag.
The bit number is specified by 3-bit immediate data.
Note: * Refers to the operand size.
B: Byte
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Table 2.6 Bit Manipulation Instructions (2)
Instruction Size* Function
BXOR
BIXOR
B
B
C ⊕ (<bit-No.> of <EAd>) → C
XORs the carry flag with a specified bit in a general register or memory
operand and stores the result in the carry flag.
C ⊕ ¬ (<bit-No.> of <EAd>) → C
XORs the carry flag with the inverse of a specified bit in a general
register or memory operand and stores the result in the carry flag.
The bit number is specified by 3-bit immediate data.
BLD
BILD
B
B
(<bit-No.> of <EAd>) → C
Transfers a specified bit in a general register or memory operand to the
carry flag.
¬ (<bit-No.> of <EAd>) → C
Transfers the inverse of a specified bit in a general register or memory
operand to the carry flag.
The bit number is specified by 3-bit immediate data.
BST
BIST
B
B
C → (<bit-No.> of <EAd>)
Transfers the carry flag value to a specified bit in a general register or
memory operand.
¬ C → (<bit-No.> of <EAd>)
Transfers the inverse of the carry flag value to a specified bit in a general
register or memory operand.
The bit number is specified by 3-bit immediate data.
Note: * Refers to the operand size.
B: Byte
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Table 2.7 Branch Instructions
Instruction Size Function
Bcc* — Branches to a specified address if a specified condition is true. The
branching conditions are listed below.
Mnemonic Description Condition
BRA(BT) Always (true) Always
BRN(BF) Never (false) Never
BHI High C ∨ Z = 0
BLS Low or same C ∨ Z = 1
BCC(BHS) Carry clear
(high or same)
C = 0
BCS(BLO) Carry set (low) C = 1
BNE Not equal Z = 0
BEQ Equal Z = 1
BVC Overflow clear V = 0
BVS Overflow set V = 1
BPL Plus N = 0
BMI Minus N = 1
BGE Greater or equal N ⊕ V = 0
BLT Less than N ⊕ V = 1
BGT Greater than Z∨(N ⊕ V) = 0
BLE Less or equal Z∨(N ⊕ V) = 1
JMP — Branches unconditionally to a specified address.
BSR — Branches to a subroutine at a specified address.
JSR — Branches to a subroutine at a specified address.
RTS — Returns from a subroutine
Note: * Bcc is the general name for conditional branch instructions.
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Table 2.8 System Control Instructions
Instruction Size* Function
TRAPA — Starts trap-instruction exception handling.
RTE — Returns from an exception-handling routine.
SLEEP — Causes a transition to a power-down state.
LDC B/W (EAs) → CCR
Moves the source operand contents to the CCR. The CCR size is one
byte, but in transfer from memory, data is read by word access.
STC B/W CCR → (EAd), EXR → (EAd)
Transfers the CCR contents to a destination location. The condition code
register size is one byte, but in transfer to memory, data is written by
word access.
ANDC B CCR ∧ #IMM → CCR, EXR ∧ #IMM → EXR
Logically ANDs the CCR with immediate data.
ORC B CCR ∨ #IMM → CCR, EXR ∨ #IMM → EXR
Logically ORs the CCR with immediate data.
XORC B CCR ⊕ #IMM → CCR, EXR ⊕ #IMM → EXR
Logically XORs the CCR with immediate data.
NOP — PC + 2 → PC
Only increments the program counter.
Note: * Refers to the operand size.
B: Byte
W: Word
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Table 2.9 Block Data Transfer Instructions
Instruction Size Function
EEPMOV.B
—
if R4L ≠ 0 then
Repeat @ER5+ → @ER6+,
R4L–1 → R4L
Until R4L = 0
else next;
EEPMOV.W — if R4 ≠ 0 then
Repeat @ER5+ → @ER6+,
R4–1 → R4
Until R4 = 0
else next;
Transfers a data block. Starting from the address set in ER5, transfers
data for the number of bytes set in R4L or R4 to the address location set
in ER6.
Execution of the next instruction begins as soon as the transfer is
completed.
2.4.2 Basic Instruction Formats
H8/300H CPU instructions consist of 2-byte (1-word) units. An instruction consists of an
operation field (op field), a register field (r field), an effective address extension (EA field), and a
condition field (cc).
Figure 2.7 shows examples of instruction formats.
(1) Operation Field
Indicates the function of the instruction, the addressing mode, and the operation to be carried out
on the operand. The operation field always includes the first four bits of the instruction. Some
instructions have two operation fields.
(2) Register Field
Specifies a general register. Address registers are specified by 3 bits, and data registers by 3 bits or
4 bits. Some instructions have two register fields. Some have no register field.
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(3) Effective Address Extension
8, 16, or 32 bits specifying immediate data, an absolute address, or a displacement. A24-bit
address or displacement is treated as a 32-bit data in which the first 8 bits are 0 (H'00).
(4) Condition Field
Specifies the branching condition of Bcc instructions.
op
op rn rm
NOP, RTS, etc.
ADD.B Rn, Rm, etc.
MOV.B @(d:16, Rn), Rm
rn rm
op
EA(disp)
op cc EA(disp) BRA d:8
(1) Operation field only
(2) Operation field and register fields
(3) Operation field, register fields, and effective address extension
(4) Operation field, effective address extension, and condition field
Figure 2.7 Instruction Formats
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2.5 Addressing Modes and Effective Address Calculation
The following describes the H8/300H CPU. In this LSI, the upper eight bits are ignored in the
generated 24-bit address, so the effective address is 16 bits.
2.5.1 Addressing Modes
The H8/300H CPU supports the eight addressing modes listed in table 2.10. Each instruction uses
a subset of these addressing modes. Addressing modes that can be used differ depending on the
instruction. For details, refer to appendix A.4, Combinations of Instructions and Addressing
Modes.
Arithmetic and logic instructions can use the register direct and immediate modes. Data transfer
instructions can use all addressing modes except program-counter relative and memory indirect.
Bit manipulation instructions use register direct, register indirect, or the absolute addressing mode
to specify an operand, and register direct (BSET, BCLR, BNOT, and BTST instructions) or
immediate (3-bit) addressing mode to specify a bit number in the operand.
Table 2.10 Addressing Modes
No. Addressing Mode Symbol
1 Register direct Rn
2 Register indirect @ERn
3 Register indirect with displacement @(d:16,ERn)/@(d:24,ERn)
4 Register indirect with post-increment
Register indirect with pre-decrement
@ERn+
@–ERn
5 Absolute address @aa:8/@aa:16/@aa:24
6 Immediate #xx:8/#xx:16/#xx:32
7 Program-counter relative @(d:8,PC)/@(d:16,PC)
8 Memory indirect @@aa:8
(1) Register Direct—Rn
The register field of the instruction specifies an 8-, 16-, or 32-bit general register containing the
operand. R0H to R7H and R0L to R7L can be specified as 8-bit registers. R0 to R7 and E0 to E7
can be specified as 16-bit registers. ER0 to ER7 can be specified as 32-bit registers.
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(2) Register Indirect—@ERn
The register field of the instruction code specifies an address register (ERn), the lower 24 bits of
which contain the address of the operand on memory.
(3) Register Indirect with Displacement—@(d:16, ERn) or @(d:24, ERn)
A 16-bit or 24-bit displacement contained in the instruction is added to an address register (ERn)
specified by the register field of the instruction, and the lower 24 bits of the sum the address of a
memory operand. A 16-bit displacement is sign-extended when added.
(4) Register Indirect with Post-Increment or Pre-Decrement—@ERn+ or @-ERn
• Register indirect with post-increment—@ERn+
The register field of the instruction code specifies an address register (ERn) the lower 24 bits
of which contains the address of a memory operand. After the operand is accessed, 1, 2, or 4 is
added to the address register contents (32 bits) and the sum is stored in the address register.
The value added is 1 for byte access, 2 for word access, or 4 for longword access. For the word
or longword access, the register value should be even.
• Register indirect with pre-decrement—@-ERn
The value 1, 2, or 4 is subtracted from an address register (ERn) specified by the register field
in the instruction code, and the lower 24 bits of the result is the address of a memory operand.
The result is also stored in the address register. The value subtracted is 1 for byte access, 2 for
word access, or 4 for longword access. For the word or longword access, the register value
should be even.
(5) A bsolute Address—@aa:8, @aa:16, @aa:24
The instruction code contains the absolute address of a memory operand. The absolute address
may be 8 bits long (@aa:8), 16 bits long (@aa:16), 24 bits long (@aa:24)
For an 8-bit absolute address, the upper 16 bits are all assumed to be 1 (H'FFFF). For a 16-bit
absolute address the upper 8 bits are a sign extension. A 24-bit absolute address can access the
entire address space.
The access ranges of absolute addresses for the group of this LSI are those shown in table 2.11,
because the upper 8 bits are ignored.
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Table 2.11 Absolute Address Access Ranges
Absolute Address Access Range
8 bits (@aa:8) H'FF00 to H'FFFF
16 bits (@aa:16) H'0000 to H'FFFF
24 bits (@aa:24) H'0000 to H'FFFF
(6) Immediate—#xx:8, #xx:16, or #xx:32
The instruction contains 8-bit (#xx:8), 16-bit (#xx:16), or 32-bit (#xx:32) immediate data as an
operand.
The ADDS, SUBS, INC, and DEC instructions contain immediate data implicitly. Some bit
manipulation instructions contain 3-bit immediate data in the instruction code, specifying a bit
number. The TRAPA instruction contains 2-bit immediate data in its instruction code, specifying a
vector address.
(7) Program-Counter Relative—@(d :8 , PC) or @ (d:1 6, P C)
This mode is used in the BSR instruction. An 8-bit or 16-bit displacement contained in the
instruction is sign-extended and added to the 24-bit PC contents to generate a branch address. The
PC value to which the displacement is added is the address of the first byte of the next instruction,
so the possible branching range is –126 to +128 bytes (–63 to +64 words) or –32766 to +32768
bytes (–16383 to +16384 words) from the branch instruction. The resulting value should be an
even number.
(8) Memory Indirect—@@aa:8
This mode can be used by the JMP and JSR instructions. The instruction code contains an 8-bit
absolute address specifying a memory operand. This memory operand contains a branch address.
The memory operand is accessed by longword access. The first byte of the memory operand is
ignored, generating a 24-bit branch address. Figure 2.8 shows how to specify branch address for in
memory indirect mode. The upper bits of the absolute address are all assumed to be 0, so the
address range is 0 to 255 (H'0000 to H'00FF).
Note that the first part of the address range is also the exception vector area.
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Specified
by @aa:8
Branch address
Dummy
Figure 2.8 Branch Address Specification in Memory Indirect Mode
2.5.2 Effective Address Calculation
Table 2.12 indicates how effective addresses are calculated in each addressing mode. In this LSI,
the upper 8 bits of the effective address are ignored in order to generate a 16-bit effective address.
Table 2.12 Effective Address Calculation (1)
No
1
r
op
31 0
23
2
3Register indirect with displacement
@(d:16,ERn) or @(d:24,ERn)
4
r
opdisp
r
op
rm
op rn
310
0
r
op
230
31 0
disp
31 0
31 0
23 0
23 0
Addressing Mode and Instruction Format Effective Address Calculation Effective Address (EA)
Register direct(Rn)
General register contents
General register contents
General register contents
General register contents
Sign extension
Register indirect(@ERn)
Register indirect with post-increment or
pre-decrement
•Register indirect with post-increment @ERn+
•Register indirect with pre-decrement @-ERn
1, 2, or 4
1, 2, or 4
Operand is general register contents.
The value to be added or subtracted is 1 when the
operand is byte size, 2 for word size, and 4 for
longword size.
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Table 2.12 Effective Address Calculation (2)
No
5
op
23 0
abs
@aa:8 7
H'FFFF
op
23 0
@aa:16
@aa:24
abs
15
16
23 0
op
abs
6
op IMM
#xx:8/#xx:16/#xx:32
8
Addressing Mode and Instruction Format
Absolute address
Immediate
Effective Address Calculation Effective Address (EA)
Sign extension
Operand is immediate data.
7
Program-counter relative
@(d:8,PC) @(d:16,PC)
Memory indirect @@aa:8
23 0
disp
0
23 0
disp
op
23
op
8
abs 23 0
abs
H'0000
7
8
0
15 23 0
15
H'00
16
[Legend]
r, rm,rn :
op :
disp :
IMM :
abs :
Register field
Operation field
Displacement
Immediate data
Absolute address
PC contents
Sign
extension
Memory contents
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2.6 Basic Bus Cycle
CPU operation is synchronized by a system clock (φ). The period from a rising edge of φ to the
next rising edge is called one state. A bus cycle consists of two states or three states. The cycle
differs depending on whether access is to on-chip memory or to on-chip peripheral modules.
2.6.1 Access to On-Chip Memory (RAM, ROM)
Access to on-chip memory takes place in two states. The data bus width is 16 bits, allowing access
in byte or word size. Figure 2.9 shows the on-chip memory access cycle.
T1 state
Bus cycle
T2 state
Internal address bus
Internal read signal
Internal data bus
(read access)
Internal write signal
Read data
Address
Write data
Internal data bus
(write access)
φ
Figure 2.9 On-Chip Memory Access Cycle
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2.6.2 On-Chip Peripheral Modules
On-chip peripheral modules are accessed in two states or three states. The data bus width is 8 bits
or 16 bits depending on the register. For description on the data bus width and number of
accessing states of each register, refer to section 19.1, Register Addresses (Address Order).
Registers with 16-bit data bus width can be accessed by word size only. Registers with 8-bit data
bus width can be accessed by byte or word size. When a register with 8-bit data bus width is
accessed by word size, a bus cycle occurs twice. In two-state access, the operation timing is the
same as that for on-chip memory.
Figure 2.10 shows the operation timing in the case of three-state access to an on-chip peripheral
module.
T
1
state
Bus cycle
Internal
address bus
Internal
read signal
Internal
data bus
(read access)
Internal
write signal
Read data
Address
Internal
data bus
(write access)
T
2
state T
3
state
Write data
φ
Figure 2.10 On-Chip Peripheral Module Access Cycle (3-State Access)
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2.7 CPU States
There are four CPU states: the reset state, program execution state, program halt state, and
exception-handling state. The program execution state includes active mode. In the program halt
state there are a sleep mode, and standby mode. These states are shown in figure 2.11. Figure 2.12
shows the state transitions. For details on program execution state and program halt state, refer to
section 6, Power-Down Modes. For details on exception processing, refer to section 3, Exception
Handling.
CPU state Reset state
Program
execution state
Program halt state
Exception-
handling state
Active
(high speed) mode
Sleep mode
Power-down
modes
The CPU executes successive program
instructions at high speed,
synchronized by the system clock
A state in which some
or all of the chip
functions are stopped
to conserve power
A transient state in which the CPU changes
the processing flow due to a reset or an interrupt
The CPU is initialized
Standby mode
Figure 2.11 CPU Operation States
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Reset state
Program halt state
Exception-handling state
Program execution state
Reset cleared
SLEEP instruction executed
Reset
occurs
Interrupt
source
Reset
occurs
Interrupt
source
Exception-
handling
complete
Reset occurs
Figure 2.12 State Transitions
2.8 Usage Notes
2.8.1 Notes on Data Access to Empty Areas
The address space of this LSI includes empty areas in addition to the ROM, RAM, and on-chip
I/O registers areas available to the user. When data is transferred from CPU to empty areas, the
transferred data will be lost. This action may also cause the CPU to malfunction. When data is
transferred from an empty area to CPU, the contents of the data cannot be guaranteed.
2.8.2 EEPMOV Instruction
EEPMOV is a block-transfer instruction and transfers the byte size of data indicated by R4L,
which starts from the address indicated by R5, to the address indicated by R6. Set R4L and R6 so
that the end address of the destination address (value of R6 + R4L) does not exceed H'FFFF (the
value of R6 must not change from H'FFFF to H'0000 during execution).
2.8.3 Bit Manipulation Instruction
The BSET, BCLR, BNOT, BST, and BIST instructions read data from the specified address in
byte units, manipulate the data of the target bit, and write data to the same address again in byte
units. Special care is required when using these instructions in cases where two registers are
assigned to the same address or when a bit is directly manipulated for a port, because this may
rewrite data of a bit other than the bit to be manipulated.
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(1) Bit Manipulation for Two Registers Assigned to the Same Address
Example 1: Bit manipulation for the timer load register and timer counter
(Applicable to timer B1, not available for the H8/36902 Group.)
Figure 2.13 shows an example of a timer in which two timer registers are assigned to the same
address. When a bit manipulation instruction accesses the timer load register and timer counter of
a reloadable timer, since these two registers share the same address, the following operations takes
place.
1. Data is read in byte units.
2. The CPU sets or resets the bit to be manipulated with the bit manipulation instruction.
3. The written data is written again in byte units to the timer load register.
The timer is counting, so the value read is not necessarily the same as the value in the timer load
register. As a result, bits other than the intended bit in the timer counter may be modified and the
modified value may be written to the timer load register.
Read
Write
Count clock Timer counter
Timer load register
Reload
Internal bus
Figure 2.13 Example of Timer Con fi gur ation with Two Registers Allocated to
Same Address
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Example 2: The BSET instruction is executed for port 5.
P57 and P56 are input pins, with a low-level signal input at P57 and a high-level signal input at
P56. P55 to P50 are output pins and output low-level signals. An example to output a high-level
signal at P50 with a BSET instruction is shown below.
[Prior to executing BSET]
P57 P56 P55 P54 P53 P52 P51 P50
Input/output Input Input Output Output Output Output Output Output
Pin state Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
Low
level
PCR5 0 0 1 1 1 1 1 1
PDR5 1 0 0 0 0 0 0 0
[BSET instruction executed]
BSET #0, @PDR5 The BSET instruction is executed for port 5.
[After executing BSET]
P57 P56 P55 P54 P53 P52 P51 P50
Input/output Input Input Output Output Output Output Output Output
Pin state Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
High
level
PCR5 0 0 1 1 1 1 1 1
PDR5 0 1 0 0 0 0 0 1
[Description on operation]
1. When the BSET instruction is executed, first the CPU reads port 5. Since P57 and P56 are
input pins, the CPU reads the pin states (low-level and high-level input).
P55 to P50 are output pins, so the CPU reads the value in PDR5. In this example PDR5 has a
value of H'80, but the value read by the CPU is H'40.
2. Next, the CPU sets bit 0 of the read data to 1, changing the PDR5 data to H'41.
3. Finally, the CPU writes H'41 to PDR5, completing execution of BSET.
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As a result of the BSET instruction, bit 0 in PDR5 becomes 1, and P50 outputs a high-level signal.
However, bits 7 and 6 of PDR5 end up with different values. To prevent this problem, store a copy
of the PDR5 data in a work area in memory. Perform the bit manipulation on the data in the work
area, then write this data to PDR5.
[Prior to executing BSET]
MOV.B #80, R0L
MOV.B R0L, @RAM0
MOV.B R0L, @PDR5
The PDR5 value (H'80) is written to a work area in
memory (RAM0) as well as to PDR5.
P57 P56 P55 P54 P53 P52 P51 P50
Input/output Input Input Output Output Output Output Output Output
Pin state Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
Low
level
PCR5 0 0 1 1 1 1 1 1
PDR5 1 0 0 0 0 0 0 0
RAM0 1 0 0 0 0 0 0 0
[BSET instruction executed]
BSET #0, @RAM0 The BSET instruction is executed designating the PDR5
work area (RAM0).
[After executing BSET]
MOV.B @RAM0, R0L
MOV.B R0L, @PDR5
The work area (RAM0) value is written to PDR5.
P57 P56 P55 P54 P53 P52 P51 P50
Input/output Input Input Output Output Output Output Output Output
Pin state Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
High
level
PCR5 0 0 1 1 1 1 1 1
PDR5 1 0 0 0 0 0 0 1
RAM0 1 0 0 0 0 0 0 1
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(2) Bit Manipulation in a Register Containing a Write-Only Bit
Example 3: BCLR instruction executed designating port 5 control register PCR5
P57 and P56 are input pins, with a low-level signal input at P57 and a high-level signal input at
P56. P55 to P50 are output pins that output low-level signals. An example of setting the P50 pin as
an input pin by the BCLR instruction is shown below. It is assumed that a high-level signal will be
input to this input pin.
[Prior to executing BCLR]
P57 P56 P55 P54 P53 P52 P51 P50
Input/output Input Input Output Output Output Output Output Output
Pin state Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
Low
level
PCR5 0 0 1 1 1 1 1 1
PDR5 1 0 0 0 0 0 0 0
[BCLR instruction executed]
BCLR #0, @PCR5 The BCLR instruction is executed for PCR5.
[After executing BCLR]
P57 P56 P55 P54 P53 P52 P51 P50
Input/output Output Output Output Output Output Output Output Input
Pin state Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
High
level
PCR5 1 1 1 1 1 1 1 0
PDR5 1 0 0 0 0 0 0 0
[Description on operation]
1. When the BCLR instruction is executed, first the CPU reads PCR5. Since PCR5 is a write-only
register, the CPU reads a value of H'FF, even though the PCR5 value is actually H'3F.
2. Next, the CPU clears bit 0 in the read data to 0, changing the data to H'FE.
3. Finally, H'FE is written to PCR5 and BCLR instruction execution ends.
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As a result of this operation, bit 0 in PCR5 becomes 0, making P50 an input port. However, bits 7
and 6 in PCR5 change to 1, so that P57 and P56 change from input pins to output pins. To prevent
this problem, store a copy of the PCR5 data in a work area in memory and manipulate data of the
bit in the work area, then write this data to PCR5.
[Prior to executing BCLR]
MOV.B #3F, R0L
MOV.B R0L, @RAM0
MOV.B R0L, @PCR5
The PCR5 value (H'3F) is written to a work area in
memory (RAM0) as well as to PCR5.
P57 P56 P55 P54 P53 P52 P51 P50
Input/output Input Input Output Output Output Output Output Output
Pin state Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
Low
level
PCR5 0 0 1 1 1 1 1 1
PDR5 1 0 0 0 0 0 0 0
RAM0 0 0 1 1 1 1 1 1
[BCLR instruction executed]
BCLR #0, @RAM0 The BCLR instructions executed for the PCR5 work area
(RAM0).
[After executing BCLR]
MOV.B @RAM0, R0L
MOV.B R0L, @PCR5
The work area (RAM0) value is written to PCR5.
P57 P56 P55 P54 P53 P52 P51 P50
Input/output Input Input Output Output Output Output Output Output
Pin state Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
High
level
PCR5 0 0 1 1 1 1 1 0
PDR5 1 0 0 0 0 0 0 0
RAM0 0 0 1 1 1 1 1 0
Section 2 CPU
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Section 3 Exception Handling
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Section 3 Exception Handling
Exception handling may be caused by a reset, a trap instruction (TRAPA), or interrupts.
• Reset
A reset has the highest exception priority. Exception handling starts as soon as the reset is
cleared by the RES pin. The chip is also reset when the watchdog timer overflows, and
exception handling starts. Exception handling is the same as exception handling by the RES
pin.
• Trap Instruction
Exception handling starts when a trap instruction (TRAPA) is executed. The TRAPA
instruction generates a vector address corresponding to a vector number from 0 to 3, as
specified in the instruction code. Exception handling can be executed at all times in the
program execution state.
• Interrupts
External interrupts other than NMI and internal interrupts other than address break are masked
by the I bit in CCR, and kept masked while the I bit is set to 1. Exception handling starts when
the current instruction or exception handling ends, if an interrupt request has been issued.
3.1 Exception Sources and Vector Address
Table 3.1 shows the vector addresses and priority of each exception handling. When more than
one interrupt is requested, handling is performed from the interrupt with the highest priority.
Table 3.1 Exception Sources and Vector Address
Relative Module Exception Sources Vector
Number Vector Address Priority
RES pin
Watchdog timer
Reset 0 H'0000 to H'0001 High
Reserved for system use 1 to 6 H'0002 to H'000D
External interrupt
pin
NMI 7 H'000E to H'000F
Trap instruction #0 8 H'0010 to H'0011
Trap instruction #1 9 H'0012 to H'0013
Trap instruction #2 10 H'0014 to H'0015
CPU
Trap instruction #3 11 H'0016 to H'0017 Low
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Relative Module Exception Sources Vector
Number Vector Address Priority
Address break Break conditions satisfied 12 H'0018 to H'0019 High
CPU Direct transition by executing
the SLEEP instruction
13 H'001A to H'001B
External interrupt
pin
IRQ0, low-voltage detection
interrupt
14 H'001C to H'001D
Reserved for system use 15, 16 H'001E to H'0021
IRQ3 17 H'0022 to H'0023 External interrupt
pin WKP 18 H'0024 to H'0025
Reserved for system use 19, 20 H'0026 to H'0029
Timer W Timer W input capture A/
compare match A
Timer W input capture B/
compare match B
Timer W input capture C/
compare match C
Timer W input capture D/
compare match D
Timer W overflow
21 H'002A to H'002B
Timer V Timer V compare match A
Timer V compare match B
Timer V overflow
22 H'002C to H'002D
SCI3 SCI3 receive data full
SCI3 transmit data empty
SCI3 transmit end
SCI3 receive error
23 H'002E to H'002F
IIC2* IIC_2 transmit data empty
IIC_2 transmit end
IIC_2 receive error
24 H'0030 to H'0031
A/D converter A/D conversion end 25 H'0032 to H'0033
Reserved for system use 26 to 28 H'0034 to H'0039
Timer B1* Timer B1 overflow 29 H'003A to H'003B
Reserved for system use 30 to 33 H'003C to H'0043
Clock switch Clock switch (external clock to
on-chip oscillator clock)
34 H'0044 to H'0045 Low
Note: * Available for the H8/36912 Group only.
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3.2 Register Descriptions
Interrupts are controlled by the following registers.
• Interrupt edge select register 1 (IEGR1)
• Interrupt edge select register 2 (IEGR2)
• Interrupt enable register 1 (IENR1)
• Interrupt enable register 2 (IENR2)
• Interrupt flag register 1 (IRR1)
• Interrupt flag register 2 (IRR2)
• Wakeup interrupt flag register (IWPR)
3.2.1 Interrupt Edge Select Register 1 (IEGR1)
IEGR1 selects the direction of an edge that generates interrupt requests of the IRQ3 and IRQ0
pins.
Bit Bit Name
Initial
Value R/W Description
7 0 − Reserved
This bit is always read as 0.
6 to 4 All 1 Reserved
These bits are always read as 1.
3 IEG3 0 R/W IRQ3 Edge Select
0: Falling edge of IRQ3 pin input is detected
1: Rising edge of IRQ3 pin input is detected
2, 1 All 0 Reserved
These bits are always read as 0.
0 IEG0 0 R/W IRQ0 Edge Select
0: Falling edge of IRQ0 pin input is detected
1: Rising edge of IRQ0 pin input is detected
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3.2.2 Interrupt Edge Select Register 2 (IEGR2)
IEGR2 selects the direction of an edge that generates interrupt requests of the ADTRG and WKP5
pins.
Bit Bit Name
Initial
Value R/W Description
7, 6 All 1 Reserved
These bits are always read as 1.
5 WPEG5 0 R/W WKP5 Edge Select
0: Falling edge of WKP5 (ADTRG) pin input is detected
1: Rising edge of WKP5 (ADTRG) pin input is detected
4 to 0 All 0 Reserved
These bits are always read as 0.
3.2.3 Interrupt Enable Register 1 (IENR1)
IENR1 enables direct transition interrupts and external pin interrupts.
Bit Bit Name
Initial
Value R/W Description
7 IENDT 0 R/W Direct Transfer Interrupt Enable
When this bit is set to 1, direct transition interrupt
requests are enabled.
6 0 Reserved
This bit is always read as 0.
5 IENWP 0 R/W Wakeup Interrupt Enable
This bit is an enable bit of the WKP5 pin. When this bit is
set to 1, interrupt requests are enabled.
4 1 Reserved
This bit is always read as 1.
3 IEN3 0 R/W IRQ3 Interrupt Enable
When this bit is set to 1, interrupt requests of the IRQ3
pin are enabled.
2, 1 All 0 Reserved
These bits are always read as 0.
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Bit Bit Name
Initial
Value R/W Description
0 IEN0 0 R/W IRQ0 Interrupt Enable
When this bit is set to 1, interrupt requests of the IRQ0
pin are enabled.
3.2.4 Interrupt Enable Register 2 (IENR2)
IENR2 enables timer B1 interrupts.
Bit Bit Name
Initial
Value R/W Description
7 0 Reserved
This bit is always read as 0.
6 0 R/W Reserved
Although this bit is readable/writable, it should not be set
to 1.
5 IENTB1 0 R/W Timer B1 Interrupt Enable
When this bit is set to 1, overflow interrupt requests of
timer B1 are enabled.
4 to 0 All 1 Reserved
These bits are always read as 1.
When disabling interrupts by clearing bits in an interrupt enable register, or when clearing bits in
an interrupt flag register, always do so while interrupts are masked (I = 1). If the above clear
operations are performed while I = 0, and as a result a conflict arises between the clear instruction
and an interrupt request, exception handling for the interrupt will be executed after the clear
instruction has been executed.
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3.2.5 Interrupt Flag Register 1 (IRR1)
IRR1 is a status flag register for direct transition interrupts, and IRQ3 and IRQ0 interrupt requests.
Bit Bit Name
Initial
Value R/W Description
7 IRRDT 0 R/W Direct Transfer Interrupt Request Flag
[Setting condition]
• When a direct transfer is made by executing a SLEEP
instruction while DTON in SYSCR2 is set to 1.
[Clearing condition]
• When IRRDT is cleared by writing 0
6 0 Reserved
This bit is always read as 0.
5, 4 All 1 Reserved
These bits are always read as 1.
3 IRRI3 0 R/W IRQ3 Interrupt Request Flag
[Setting condition]
• When IRQ3 pin is designated for interrupt input and
the designated signal edge is detected
[Clearing condition]
• When IRRI3 is cleared by writing 0
2, 1 All 0 Reserved
These bits are always read as 0.
0 IRRl0 0 R/W IRQ0 Interrupt Request Flag
[Setting condition]
• When IRQ0 pin is designated for interrupt input and
the designated signal edge is detected
[Clearing condition]
• When IRRI0 is cleared by writing 0
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3.2.6 Interrupt Flag Register 2 (IRR2)
IRR2 is a status flag register for timer B1 interrupt requests.
Bit Bit Name
Initial
Value R/W Description
7 0 Reserved
This bit is always read as 0.
6 Reserved
5 IRRTB1 0 R/W Timer B1 Interrupt Request Flag
[Setting condition]
• When timer B1 overflows
[Clearing condition]
• When IRRTB1 is cleared by writing 0
4 to 0 All 1 Reserved
These bits are always read as 1.
3.2.7 Wakeup Interrupt Flag Register (IWPR)
IWPR is a status flag register for WKP5 interrupt requests.
Bit Bit Name
Initial
Value R/W Description
7, 6 All 1 Reserved
These bits are always read as 1.
5 IWPF5 0 R/W WKP5 Interrupt Request Flag
[Setting condition]
• When WKP5 pin is designated for interrupt input and
the designated signal edge is detected.
[Clearing condition]
• When IWPF5 is cleared by writing 0
4 to 0 All 0 Reserved
These bits are always read as 0.
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3.3 Reset Exception Handling
When the RES pin goes low, all processing halts and this LSI enters the reset. The internal state of
the CPU and the registers of the on-chip peripheral modules are initialized by the reset. To ensure
that this LSI is reset at power-up, hold the RES pin low for the specified period. To reset the chip
during operation, hold the RES pin low for the specified period. For details, refer to section 17,
Band-Gap Circuit, Power-On Reset, and Low-Voltage Detection Circuits. When the RES pin goes
high after being held low for a certain period, this LSI starts reset exception handling. The reset
exception handling sequence is shown in figure 3.1.
The reset exception handling sequence is as follows.
1. Set the I bit in the condition code register (CCR) to 1.
2. The CPU generates a reset exception handling vector address (from H'0000 to H'0001), the
data in that address is sent to the program counter (PC) as the start address, and program
execution starts from that address.
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3.4 Interrupt Exception Handling
3.4.1 External Interrupts
As external interrupts, there are NMI, IRQ3, IRQ0, and WKP5 interrupts.
(1) NMI Interrupt
NMI interrupt is requested by input falling edge to the NMI pin. NMI is the highest interrupt, and
can always be accepted without depending on the I bit value in CCR.
(2) IRQ3 and IRQ0 Interrupts
IRQ3 and IRQ0 interrupts are requested by input signals to the IRQ3 and IRQ0 pins. These
interrupts are given different vector addresses, and are detected individually by either rising edge
sensing or falling edge sensing, depending on the settings of the IEG3 and IEG0 bits in IEGR1.
When the IRQ3 and IRQ0 pins are designated for interrupt input in PMR1 and the designated
signal edge is input, the corresponding bit in IRR1 is set to 1, requesting the CPU of an interrupt.
These interrupts can be masked by setting the IEN3 and IEN0 bits in IENR1.
(3) WKP Interrupt
WKP interrupt is requested by an input signal to the WKP5 pin. This interrupt is detected by either
rising edge sensing or falling edge sensing, depending on the setting of the WPEG5 bit in IEGR2.
When the WKP5 pin is designated for interrupt input in PMR5 and the designated signal edge is
input, the corresponding bit in IWPR is set to 1, requesting the CPU of an interrupt. This interrupt
can be masked by setting the IENWP bit in IENR1.
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Vector fetch
φ
Internal
address bus
Internal read
signal
Internal write
signal
Internal data
bus (16 bits)
RES
Internal
processing
Initial program
instruction prefetch
(1) Reset exception handling vector address (H'0000)
(2) Program start address
(3) Initial program instruction
(2) (3)
(2)(1)
Reset cleared
~
~
~
~
~
~
~
~
~
~
~
~
Figure 3.1 Reset Sequence
3.4.2 Internal Interrupts
Each on-chip peripheral module has a flag to show the interrupt request status and the enable bit to
enable or disable the interrupt. For direct transfer interrupt requests generated by execution of a
SLEEP instruction, this function is included in IRR1 and IENR1.
When an on-chip peripheral module requests an interrupt, the corresponding interrupt request
status flag is set to 1, requesting the CPU of an interrupt. When this interrupt is accepted, the I bit
is set to 1 in CCR. These interrupts can be masked by writing 0 to clear the corresponding enable
bit.
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3.4.3 Interrupt Handling Sequence
Interrupts are controlled by an interrupt controller.
Interrupt operation is described as follows.
1. If an interrupt occurs while the NMI or interrupt enable bit is set to 1, an interrupt request
signal is sent to the interrupt controller.
2. When multiple interrupt requests are generated, the interrupt controller requests to the CPU for
the interrupt handling with the highest priority at that time according to table 3.1. Other
interrupt requests are held pending.
3. The CPU accepts the NMI or address break without depending on the I bit value. Other
interrupt requests are accepted, if the I bit is cleared to 0 in CCR; if the I bit is set to 1, the
interrupt request is held pending.
4. If the CPU accepts the interrupt after processing of the current instruction is completed,
interrupt exception handling will begin. First, both PC and CCR are pushed onto the stack. The
state of the stack at this time is shown in figure 3.2. The PC value pushed onto the stack is the
address of the first instruction to be executed upon return from interrupt handling.
5. Then, the I bit of CCR is set to 1, masking further interrupts excluding the NMI and address
break. Upon return from interrupt handling, the values of I bit and other bits in CCR will be
restored and returned to the values prior to the start of interrupt exception handling.
6. Next, the CPU generates the vector address corresponding to the accepted interrupt, and
transfers the address to PC as a start address of the interrupt handling-routine. Then a program
starts executing from the address indicated in PC.
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Figure 3.3 shows a typical interrupt sequence where the program area is in the on-chip ROM and
the stack area is in the on-chip RAM.
Vector fetch
φ
Internal
address bus
Internal read
signal
Internal write
signal
Internal data
bus (16 bits)
RES
Internal
processing
Initial program
instruction prefetch
(1) Reset exception handling vector address (H'0000)
(2) Program start address
(3) Initial program instruction
(2) (3)
(2)(1)
Reset cleared
~
~
~
~
~
~
~
~
~
~
~
~
Figure 3.2 Stack Status aft er Excep ti on Han dl i ng
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3.4.4 Interrupt Response Time
Table 3.2 shows the number of wait states after an interrupt request flag is set until the first
instruction of the interrupt handling-routine is executed.
Table 3.2 Interrupt Wait States
Item States Total
Waiting time for completion of executing instruction* 1 to 23
Saving of PC and CCR to stack 4
Vector fetch 2
Instruction fetch 4
Internal processing 4
15 to 37
Note: * EEPMOV instruction is not included.
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Vector fetch
φ
Internal
address bus
Internal read
signal
Internal write
signal
(2)
Internal data bus
(16 bits)
Interrupt
request signal
(9)
(1)
Internal
processing
Prefetch instruction of
interrupt-handling routine
(1) Instruction prefetch address (Instruction is not executed. Address is saved as PC contents, becoming return address.)
(2)(4) Instruction code (not executed)
(3) Instruction prefetch address (Instruction is not executed.)
(5) SP – 2
(6) SP – 4
(7) CCR
(8) Vector address
(9) Starting address of interrupt-handling routine (contents of vector)
(10) First instruction of interrupt-handling routine
(3) (9)(8)(6)(5)
(4) (1) (7) (10)
Stack access
Internal
processing
Instruction
prefetch
Interrupt level
decision and wait for
end of instruction
Interrupt is
accepted
Figure 3.3 Interrupt Sequence
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3.5 Usage Notes
3.5.1 Interrupts after Reset
If an interrupt is accepted after a reset and before the stack pointer (SP) is initialized, the PC and
CCR will not be saved correctly, leading to a program crash. To prevent this, all interrupt requests,
including NMI, are disabled immediately after a reset. Since the first instruction of a program is
always executed immediately after the reset state ends, make sure that this instruction initializes
the stack pointer (example: MOV.W #xx: 16, SP).
3.5.2 Notes on Stack Area Use
When word data is accessed, the least significant bit of the address is regarded as 0. Access to the
stack always takes place in word size, so the stack pointer (SP: R7) should never indicate an odd
address. Use PUSH Rn (MOV.W Rn, @–SP) or POP Rn (MOV.W @SP+, Rn) to save or restore
register values.
3.5.3 Notes on Rewriti ng Port Mode Registers
When a port mode register is rewritten to switch the functions of external interrupt pins, IRQ3,
IRQ0, and WKP5, the interrupt request flag may be set to 1.
When switching a pin function, mask the interrupt before setting the bit in the port mode register.
After accessing the port mode register, execute at least one instruction (e.g., NOP), then clear the
interrupt request flag from 1 to 0.
Figure 3.4 shows a port mode register setting and interrupt request flag clearing procedure.
CCR I bit 1
Set port mode register bit
Execute NOP instruction
Interrupts masked. (Another possibility
is to disable the relevant interrupt in
interrupt enable register 1.)
After setting the port mode register bit,
first execute at least one instruction
(e.g., NOP), then clear the interrupt
request flag to 0
Interrupt mask cleared
Clear interrupt request flag to 0
←
CCR I bit 0
←
Figure 3.4 Port Mode Register Setting and Interrupt Reque st Flag Clearing Procedure
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Section 4 Address Break
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Section 4 Address Break
The address break simplifies on-board program debugging. It requests an address break interrupt
when the set break condition is satisfied. The interrupt request is not affected by the I bit of CCR.
Break conditions that can be set include instruction execution at a specific address and a
combination of access and data at a specific address. With the address break function, the
execution start point of a program containing a bug is detected and execution is branched to the
correcting program. Figure 4.1 shows a block diagram of the address break.
BARH BARL
BDRH BDRL
ABRKCR
ABRKSR
Internal address bus
Comparator
Interrupt
generation
control circuit
Internal data bus
Comparator
Interrupt
[Legend]
BARH, BARL: Break address register
BDRH, BDRL: Break data register
ABRKCR: Address break control register
ABRKSR: Address break status register
Figure 4.1 Block Diagram of Address Break
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4.1 Register Descriptions
Address break has the following registers.
• Address break control register (ABRKCR)
• Address break status register (ABRKSR)
• Break address register (BARH, BARL)
• Break data register (BDRH, BDRL)
4.1.1 Address Break Control Register (ABRKCR)
ABRKCR sets address break conditions.
Bit Bit Name
Initial
Value R/W Description
7 RTINTE 1 R/W RTE Interrupt Enable
When this bit is 0, the interrupt immediately after
executing RTE is masked and then one instruction must
be executed. When this bit is 1, the interrupt is not
masked.
6
5
CSEL1
CSEL0
0
0
R/W
R/W
Condition Select 1 and 0
These bits set address break conditions.
00: Instruction execution cycle
01: CPU data read cycle
10: CPU data write cycle
11: CPU data read/write cycle
4
3
2
ACMP2
ACMP1
ACMP0
0
0
0
R/W
R/W
R/W
Address Compare Condition Select 2 to 0
These bits comparison condition between the address set
in BAR and the internal address bus.
000: Compares 16-bit addresses
001: Compares upper 12-bit addresses
010: Compares upper 8-bit addresses
011: Compares upper 4-bit addresses
1XX: Reserved (setting prohibited)
Section 4 Address Break
Rev. 3.00 Sep. 14, 2006 Page 65 of 408
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Bit Bit Name
Initial
Value R/W Description
1
0
DCMP1
DCMP0
0
0
R/W
R/W
Data Compare Condition Select 1 and 0
These bits set the comparison condition between the data
set in BDR and the internal data bus.
00: No data comparison
01: Compares lower 8-bit data between BDRL and data
bus
10: Compares upper 8-bit data between BDRH and data
bus
11: Compares 16-bit data between BDR and data bus
[Legend]
X: Don't care
When an address break is set in the data read cycle or data write cycle, the data bus used will
depend on the combination of the byte/word access and address. Table 4.1 shows the access and
data bus used. When an I/O register space with an 8-bit data bus width is accessed in word size, a
byte access is generated twice. For details on data widths of each register, see section 19.1,
Register Addresses (Address Order).
Table 4.1 Access and Data Bus Used
Word Access Byte Access
Even Address Odd Address Even Address Odd Address
ROM space Upper 8 bits Lower 8 bits Upper 8 bits Upper 8 bits
RAM space Upper 8 bits Lower 8 bits Upper 8 bits Upper 8 bits
I/O register with 8-bit data bus
width
Upper 8 bits Upper 8 bits Upper 8 bits Upper 8 bits
I/O register with 16-bit data
bus width
Upper 8 bits Lower 8 bits — —
Section 4 Address Break
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4.1.2 Address Break Status Register (ABRKSR)
ABRKSR consists of the address break interrupt flag and the address break interrupt enable bit.
Bit Bit Name
Initial
Value R/W Description
7 ABIF 0 R/W Address Break Interrupt Flag
[Setting condition]
• When the condition set in ABRKCR is satisfied
[Clearing condition]
• When 0 is written after ABIF=1 is read
6 ABIE 0 R/W Address Break Interrupt Enable
When this bit is 1, an address break interrupt request is
enabled.
5 to 0 — All 1 — Reserved
These bits are always read as 1.
4.1.3 Break Address Registers (BARH, BARL)
BARH and BARL are 16-bit read/write registers that set the address for generating an address
break interrupt. When setting the address break condition to the instruction execution cycle, set the
first byte address of the instruction. The initial value of this register is H'FFFF.
4.1.4 Break Data Registers (B DR H, B DRL)
BDRH and BDRL are 16-bit read/write registers that set the data for generating an address break
interrupt. BDRH is compared with the upper 8-bit data bus. BDRL is compared with the lower 8-
bit data bus. When memory or registers are accessed by byte, the upper 8-bit data bus is used for
even and odd addresses in the data transmission. Therefore, comparison data must be set in BDRH
for byte access. For word access, the data bus used depends on the address. See section 4.1.1,
Address Break Control Register (ABRKCR), for details. The initial value of this register is
undefined.
Section 4 Address Break
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4.2 Operation
When the ABIF and ABIE bits in ABRKSR are set to 1, the address break function generates an
interrupt request to the CPU. The ABIF bit in ABRKSR is set to 1 by the combination of the
address set in BAR, the data set in BDR, and the conditions set in ABRKCR. When the interrupt
request is accepted, interrupt exception handling starts after the instruction being executed ends.
The address break interrupt is not masked because of the I bit in CCR of the CPU.
The following figures show the operation examples of the address break interrupt setting.
NOP
instruc-
tion
prefetch
Register setting
• ABRKCR = H'80
• BAR = H'025A
Program
0258
025A
025C
0260
0262
:
*
NOP
NOP
MOV.W @H'025A,R0
NOP
NOP
:
0258
Address
bus
φ
Interrupt
request
025A 025C 025E SP-2 SP-4
NOP
instruc-
tion
prefetch
MOV
instruc-
tion 1
prefetch
MOV
instruc-
tion 2
prefetch
Internal
processing Stack save
Interrupt acceptance
Underline indicates the address
to be stacked.
When the address break is specified in instruction execution cycle
Figure 4.2 Address Break Interrupt Operation Example (1)
Section 4 Address Break
Rev. 3.00 Sep. 14, 2006 Page 68 of 408
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MOV
instruc-
tion 1
prefetch
Register setting
• ABRKCR = H'A0
• BAR = H'025A
Program
0258
025A
025C
0260
0262
:
*
NOP
NOP
MOV.W @H'025A,R0
NOP
NOP
:
025C
Address
bus
Interrupt
request
025E 0260 025A 0262 0264 SP-2
MOV
instruc-
tion 2
prefetch
NOP
instruc-
tion
prefetch
MOV
instruc-
tion
execution
Next
instruc-
tion
prefetch
Internal
processing
Stack
save
NOP
instruc-
tion
prefetch
Interrupt acceptance
Underline indicates the address
to be stacked.
When the address break is specified in the data read cycle
φ
Figure 4.2 Address Break Interrupt Operation Example (2)
Section 5 Clock Pulse Generators
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Section 5 Clock Pulse Generators
Clock oscillator circuitry (CPG: clock pulse generator) consists of an external oscillator, an on-
chip oscillator, a duty correction circuit, a clock select circuit, and system clock dividers.
Figure 5.1 shows a block diagram of the clock pulse generator.
System
clock
oscillator
Duty
correction
circuit
System
clock
divider
Prescaler S
(13 bits)
OSC1
OSC2
φ
OSC
φ
OSC
φ/2
to
φ/8192
φ
φ/8
φ
φ/16
φ/32
φ/64
On-chip
oscillator
Clock
select
circuit
Clock
divider
R
OSC
R
OSC
φ
φ
RC
R
OSC/2
R
OSC/4
Figure 5.1 Block Diagram of Clock Pulse Generators
The system clock (φ) is a basic clock on which the CPU and on-chip peripheral modules operate.
The system clock is divided into φ/2 to φ/8192 by prescaler S and the divided clocks are supplied
to respective peripheral modules.
Section 5 Clock Pulse Generators
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5.1 Features
• Choice of two clock sources
On-chip oscillator clock
External oscillator clock
• Choice of two types of on-chip oscillation frequency by the user software
8MHz
10MHz
• Frequency trimming
Users can adjust the on-chip oscillation frequency by rewriting the trimming registers.
• Interrupt can be requested to the CPU when the system clock is changed from the external
clock to the on-chip oscillator clock.
Section 5 Clock Pulse Generators
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5.2 Register Descriptions
Clock oscillators are controlled by the following registers.
• RC control register (RCCR)
• RC trimming data protect register (RCTRMDPR)
• RC trimming data register (RCTRMDR)
• Clock control/status register (CKCSR)
5.2.1 RC Control Regist er (RCCR)
RCCR controls the on-chip oscillator.
Bit Bit Name
Initial
Value R/W Description
7 RCSTP 0 R/W On-chip Oscillator Standby
The internal on-chip oscillator standby state is entered by
setting this bit to 1.
6 FSEL 0 R/W Frequency Select for On-chip Oscillator
0: 8MHz
1: 10MHz
5 VCLSEL 0 R/W Power Supply Select for On-chip Oscillator
0: Selects VBGR
1: Selects VCL
When VCL is selected, the accuracy of the on-chip
oscillator frequency cannot be guaranteed.
4 to 2 All 0 Reserved
These bits are always read as 0.
1
0
RCPSC1
RCPSC0
0
0
R/W
R/W
Division Ratio Select for On-chip Oscillator
The division ratio of ROSC changes right after rewriting this
bit.
These bits can be written to only when the CKSTA bit in
CKCSR is 0.
0X: ROSC (not divided)
10: ROSC/2
11: ROSC/4
Section 5 Clock Pulse Generators
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5.2.2 RC Trimming Data Protect Register (RCTRMDPR)
RCTRMDPR controls RCTRMDPR itself and writing to RCTRMDR. Use the MOV instruction to
rewrite this register. Bit manipulation instruction cannot change the settings.
Bit Bit Name
Initial
Value R/W Description
7 WRI 1 W Write Inhibit
Only when writing 0 to this bit, this register can be written
to. This bit is always read as 1.
6 PRWE 0 R/W Protect Information Write Enable
Bits 5 and 4 can be written to when this bit is set to 1.
[Setting condition]
• When writing 0 to the WRI bit and writing 1 to the
PRWE bit
[Clearing conditions]
• Reset
• When writing 0 to the WRI bit and writing 0 to the
PRWE bit
5 LOCKDW 0 R/W Trimming Data Register Lock Down
The RC trimming data register (RCTRMDR) cannot be
written to when this bit is set to 1. Once this bit is set to 1,
this register cannot be written to until a reset is input even
if 0 is written to this bit.
[Setting condition]
• When writing 0 to the WRI bit and writing 1 to the
LOCKDW bit while the PRWE bit is 1
[Clearing condition]
• Reset
Section 5 Clock Pulse Generators
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Bit Bit Name
Initial
Value R/W Description
4 TRMDRWE 0 R/W Trimming Date Register Write Enable
This register can be written to when the LOCKDW bit is 0
and this bit is 1.
[Setting condition]
• When writing 0 to the WRI bit while writing 1 to the
TRMDRWE bit while the PRWE bit is 1
[Clearing conditions]
• Reset
• When writing 0 to the WRI bit and writing 0 to the
TRMDRWE bit while the PRWE bit is 1
3 to 0 All 1 Reserved
These bits are always read as 1
5.2.3 RC Trimming Data Register (RCTRMDR)
RCTRMDR stores the trimming data of the on-chip oscillator frequency.
Bit Bit Name
Initial
Value R/W Description
7 TRMD7 (0)* R/W
6 TRMD6 (0)* R/W
5 TRMD5 (0)* R/W
4 TRMD4 (0)* R/W
3 TRMD3 (0)* R/W
2 TRMD2 (0)* R/W
1 TRMD1 0 R
0 TRMD0 0 R
Trimming Data
In the flash memory version, the trimming data is loaded
from the flash memory to this register right after a reset.
These bits are always read as undefined value.
As for the masked ROM version, the on-chip oscillator
frequency can be trimmed by rewriting these bits. The
frequency generated in the on-chip oscillator changes
right after rewriting these bits. These bits are initialized to
H'00.
Frequency variation is expressed as follows (the TRMD7
bit is a sign bit):
(Min.) H'80 ← H'FC ← H'00 →H'04 → H'7C (Max.)
Note: * The initial value differs from product to product in the flash memory version.
Section 5 Clock Pulse Generators
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5.2.4 Clock Control/Status Register (CKCSR)
CKCSR selects the port C function, controls switching the system clocks, and indicates the system
clock state.
Bit Bit Name
Initial
Value R/W Description
7
6
PMRC1
PMRC0
0
0
R/W
R/W
Port C Function Select 1 and 0
PMRC1 PMRC0 PC1 PC0
0 0 I/O I/O
1 0 CLKOUT I/O
0 1 I/O OSC1 (external clock input)
1 1 OSC2 OSC1
5 0 R/W Reserved
Although this bit is readable/writable, it should not be set
to 1.
4 OSCSEL 0 R/W LSI Operation Clock Select
This bit forcibly selects the system clock of this LSI.
0: Selects the on-chip oscillator clock as the system clock.
1: Selects the external clock as the system clock.
3 CKSWIE 0 R/W Clock Switch Interrupt Enable
Setting this bit to 1 enables the clock switch interrupt
request.
2 CKSWIF 0 R/W Clock Switch Interrupt Request Flag
[Setting condition]
• When the external clock is switched to the on-chip
oscillator clock
[Clearing condition]
• When writing 0 after reading 1
1 1 R Reserved
This bit is always read as 1.
0 CKSTA 0 R LSI Operating Clock Status
0: This LSI operates on on-chip oscillator clock.
1: This LSI operates on external clock.
Section 5 Clock Pulse Generators
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5.3 System Clock Select Operation
Figure 5.2 shows the state transition of the system clock.
Reset state
LSI operates on on-chip oscillator clock
On-chip oscillator: Operated
External oscillator: Halted
Switching to
external clock
On-chip oscillator: Halted
External oscillator: Operated
On-chip oscillator: Operated
External oscillator: Operated
On-chip oscillator halted
On-chip oscillator operated
LSI operates on external oscillator
Reset release
Switching to
on-chip oscillator
Figure 5.2 State Transition of System Clock
Section 5 Clock Pulse Generators
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5.3.1 Clock Control Operation
The LSI system clock is generated by the on-chip oscillator clock after a reset. The on-chip
oscillator clock is switched to the external clock by the user software.
Yes
No
[1]
[1] External oscillation starts when pins PC1 and PC0
are selected as external oscillation pins. Write 0 to
bit PMRC1 to input the external clock.
[2] After writing 1 to the OSCSEL bit, this LSI waits
until the oscillation of the external oscillator
settles. The correspondence between Nwait,
which is the number of wait cycles for oscillation
settling, and Nstby, which is the number of wait
cycles for oscillation settling when returning from
standby mode, is as follows:
Nstby ≤ Nwait ≤ 2 × Nstby
Nstby is set by bits STS 2 to 0 in SYSCR1.
For details, see section 6.1.1, System Control
Register 1 (SYSCR1).
[3] While the system is waiting for the external
oscillation settling, this LSI is not halted but
continues to operate on the on-chip oscillator clock.
Read the value of the CKSTA bit in CKCSR to
ensure that the system clocks are switched.
LSI operates on on-chip oscillator RC clock
Start (reset)
Write 1 to PMRC0 in CKCSR
Write 1 to PMRC1 in CKCSR
Write 0 to CKSWIE in CKCSR
Write 1 to OSCSEL in CKCSR
Switched to
external clock? (CKSTA in
CKCSR is 1)
LSI operates on external oscillator
[2]
[3]
Figure 5.3 Flowchart of Clock Switchin g On-chi p Osci l lator
Clock to External Clock (1)
Section 5 Clock Pulse Generators
Rev. 3.00 Sep. 14, 2006 Page 77 of 408
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[1]
[2]
Exception handling
for clock switching
[1] When 0 is written to the OSCSEL bit, this LSI
switches the external clock to the on-chip oscillator
clock after the φ stop duration. Seven rising edges
of the φ
RC
clock after the OSCSEL bit becomes 0
are included in the φ stop duration.
[2] Writing 0 to PMRC0 stops the external oscillation.
LSI operates on
external clock
Start
(LSI operates on external clock)
Write 0 to OSCSEL in CKCSR
Write 0 to RCSTP in RCCR
Write 1 to CKSWIE in CKCSR
if necessary
Write 0 to PMRC0 in CKCSR
if necessary
LSI operates on
on-chip oscillator clock
When CKSWIE = 1
LSI operates on on-chip
oscillator
Figure 5.4 Flowchar t of Cl ock Switching Exter nal
Clock to On-chip Oscillator Clock (2 )
Section 5 Clock Pulse Generators
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5.3.2 Clock Change Timing
The timing for changing clocks are shown in figures 5.5 and 5.6.
[Legend]
φOSC: External clock
φRC: On-chip oscillator clock
φ: System clock
OSCSEL: Bit 4 in CKCSR
PHISTOP: System clock stop control signal
CKSTA: Bit 0 in CKCSR
Wait for external
oscillation settling
φ halt*External clock operation
Note: * The φ halt duration is the duration from the timing when the φ clock stops to the first
rising edge of the φ
OSC
clock after six clock cycles of the φ
RC
clock have elapsed.
φOSC
Nwait
φRC
PHISTOP
(Internal signal)
φ
OSCSEL
CKSTA
On-chip oscillator clock operation
Figure 5.5 Timing Chart of Switching On-chip Oscillator Clock to External Clock
Section 5 Clock Pulse Generators
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[Legend]
φOSC: External clock
φRC: On-chip oscillator clock
φ: System clock
OSCSEL: Bit 4 in CKCSR
PHISTOP: System clock stop control signal
CKSTA: Bit 0 in CKCSR
CKSWIF: Bit 2 in CKCSR
Wait for external
oscillation settling
φ halt*On-chip oscillator
clock operation
Note: * The φ halt duration is the duration from the timing when the φ clock stops to the
seventh rising edge of the φ
RC
clock.
φOSC
φRC
PHISTOP
(Internal signal)
φ
OSCSEL
CKSTA
External clock operation
Nwait
CKSWIF
Figure 5.6 Timing Chart to Switch External Clock to On-chip Oscillator Clock
Section 5 Clock Pulse Generators
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5.4 Trimming of On-chip Oscillator Frequency
Users can trim the on-chip oscillator frequency, supplying the external reference pulses with the
input capture function in internal timer W. An example of trimming flow and a timing chart are
shown in figures 5.7 and 5.8, respectively. Because RCTRMDR is initialized by a reset, when
users have trimmed the oscillators, some operations after a reset are necessary, such as trimming it
again or saving the trimming value in an external device for later reloading.
Yes
No
Note: * Comparing the difference between the measured frequency and the desired frequency,
individual bits of RCTRMDR are decided from the MSB bit by bit.
Start
Setting timer W
GRA: Input capture
GRC: Buffer of GRA
Set RCTRMD to H'00
Input reference pulses to
pin P81/FTIOA
Capture 1
Capture 2
Frequency calculation
Within
desired frequency
range?
End
Modify RCTRMDR*
Figure 5.7 Example of Trimming Flow for On-chip Oscillator Frequency
Section 5 Clock Pulse Generators
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M
NM
N M
M + 1
M + α
tA (µs)
M - 1
φRC
FTIOA input
capture input
Timer W
TCNT
GRA
GRC
Capture 1 Capture 2
M + α
Figure 5.8 Timing Chart of Trimming of On-chip Oscillator Frequency
The on-chip oscillator frequency is gained by the expression below. Since the input-capture input
is sampled by the φRC clock, the calculated result may include a sampling error of ±1 cycle of the
φRC clock.
φRC = (M + α) - M (MHz)
tA
φRC: Frequency of on-chip oscillator (MHz)
t
A
: Period of reference clock (µs)
M: Timer W counter value
Section 5 Clock Pulse Generators
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5.5 External Oscillators
This LSI has two methods to supply external clock pulses into it: connecting a crystal or ceramic
resonator, and an external clock. Oscillation pins OSC1 and OSC2 are common with general ports
PC0 and PC1, respectively. To set pins PC0 and PC1 as crystal resonator or external clock input
ports, refer to section 5.3, System Clock Select Operation.
5.5.1 Connecting Crystal Resonator
Figure 5.9 shows an example of connecting a crystal resonator. An AT-cut parallel-resonance
crystal resonator should be used. Figure 5.12 shows the equivalent circuit of a crystal resonator. A
resonator having the characteristics given in table 5.1 should be used.
C
1
C
2
PC0/OSC1
PC1/OSC2/CLKOUT C = C = 10 to 22 pF
1 2
Figure 5.9 Example of Connection to Crystal Resonat or
CS
C0
RS
LS
PC0/OSC1 PC1/OSC2/CLKOUT
Figure 5.10 Equivalent Circuit of Crystal Reso na tor
Table 5.1 Crystal Resonator Parameters
Frequency (MHz) 2 4 8 10 12
RS (Max.) 500 Ω 120 Ω 80 Ω 60 Ω 50 Ω
C0 (Max.) 70 pF
Section 5 Clock Pulse Generators
Rev. 3.00 Sep. 14, 2006 Page 83 of 408
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5.5.2 Connecting Ceramic Resonator
Figure 5.11 shows an example of connecting a ceramic resonator.
C1
C2
PC0/OSC1
PC1/OSC2/CLKOUT C = C = 5 to 30 pF
1 2
Figure 5.11 Example of Connection to Ceramic Resonator
5.5.3 External Clock Input Method
To use the external clock, input the external clock on pin OSC1. Figure 5.12 shows an example of
connection. The duty cycle of the external clock signal must be 45 to 55%.
PC0/OSC1
PC1/OSC2/CLKOUT
External clock input
General port
Figure 5.12 Example of External Clock Inpu t
5.6 Prescaler
5.6.1 Prescaler S
Prescaler S is a 13-bit counter using the system clock (φ) as its input clock. The outputs, which are
divided clocks, are used as internal clocks by the on-chip peripheral modules. Prescaler S is
initialized to H'0000 by a reset, and starts counting on exit from the reset state. In standby mode
and subsleep mode, the system clock pulse generator stops. Prescaler S also stops and is initialized
to H'0000. It cannot be read from or written to by the CPU.
The outputs from prescaler S is shared by the on-chip peripheral modules. The division ratio can
be set separately for each on-chip peripheral module. In active mode and sleep mode, the clock
input to prescaler S is a system clock with the division ratio specified by bits MA2 to MA0 in
SYSCR2.
Section 5 Clock Pulse Generators
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5.7 Usage Notes
5.7.1 Note on Resonators
Resonator characteristics are closely related to board design and should be carefully evaluated by
the user, referring to the examples shown in this section. Resonator circuit parameters will differ
depending on the resonator element, stray capacitance of the PCB, and other factors. Suitable
values should be determined in consultation with the resonator element manufacturer. Design the
circuit so that the resonator element never receives voltages exceeding its maximum rating.
5.7.2 Notes on Board Design
When using a crystal resonator (ceramic resonator), place the resonator and its load capacitors as
close as possible to pins OSC1 and OSC2. Other signal lines should be routed away from the
oscillator circuit to prevent induction from interfering with correct oscillation (see figure 5.13).
C
1
C
2
Signal A Signal BProhibited
PC0/OSC1
PC1/OSC2/CLKOUT
Figure 5.13 Example of Incorrect Board Design
Section 6 Power-Down Modes
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Section 6 Power-Down Modes
For operating modes after a reset, this LSI has not only a normal active mode but also three
power-down modes in which power consumption is significantly reduced. In addition, there is also
a module standby function which reduces power consumption by individually stopping on-chip
peripheral modules.
• Active mode
The CPU and all on-chip peripheral modules are operable on the system clock. The system
clock frequency can be selected from φosc, φosc/8, φosc/16, φosc/32, and φosc/64.
• Sleep mode
The CPU halts. On-chip peripheral modules are operable on the system clock.
• Standby mode
The CPU and all on-chip peripheral modules halt.
• Subsleep mode
The CPU and all on-chip peripheral modules halt. I/O ports keep the same states as before the
transition.
• Module standby function
Independent of the above modes, power consumption can be reduced by halting on-chip
peripheral modules that are not used in module units.
6.1 Register Descriptions
The registers related to power-down modes are listed below.
• System control register 1 (SYSCR1)
• System control register 2 (SYSCR2)
• Module standby control register 1 (MSTCR1)
• Module standby control register 2 (MSTCR2)
Section 6 Power-Down Modes
Rev. 3.00 Sep. 14, 2006 Page 86 of 408
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6.1.1 System Control Register 1 (SYSCR1)
SYSCR1 controls the power-down modes, as well as SYSCR2.
Bit Bit Name
Initial
Value R/W Description
7 SSBY 0 R/W Software Standby
Specifies the operating mode to be entered after
executing the SLEEP instruction.
0: Shifts to sleep mode.
1: Shifts to standby mode.
For details, see table 6.2.
6
5
4
STS2
STS1
STS0
0
0
0
R/W
R/W
R/W
Standby Timer Select 2 to 0
These bits set the wait time from when the system clock
oscillator starts functioning until the clock is supplied, in
shifting from standby mode, to active mode or sleep
mode. During the wait time, this LSI automatically selects
the on-chip oscillator clock as its system clock and counts
the number of wait states. Select a wait time of 6.5 ms
(oscillation stabilization time) or longer, depending on the
operating frequency. Table 6.1 shows the relationship
between the STS2 to STS0 values and the wait time.
When using an external clock, set the wait time to be
100 µs or longer in the F-ZTAT version. In the masked
ROM version, the minimum value (STS2 = STS1 = STS0
= 1) is recommended.
These bits also set the wait states for external oscillation
stabilization when system clock is switched from the on-
chip oscillator clock to the external clock by user
software.
The relationship between Nwait (number of wait states for
oscillation stabilization) and Nstby (number of wait states
for recovering to the standby mode) is as follows.
Nstby ≤ Nwait ≤ 2 × Nstby
3 to 0 All 0 Reserved
These bits are always read as 0.
Section 6 Power-Down Modes
Rev. 3.00 Sep. 14, 2006 Page 87 of 408
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Table 6.1 Operating Frequency and Wait Time
Bit Name Operating Frequency
STS2 STS1 STS0 Wait Time 10 MHz 8 MHz 5 MHz 4 MHz 2.5 MHz 2 MHz
0 0 0 8,192 states 0.8 1.0 1.6 2.0 3.3 4.1
0 0 1 16,384 states 1.6 2.0 3.3 4.1 6.6 8.2
0 1 0 32,768 states 3.3 4.1 6.6 8.2 13.1 16.4
0 1 1 65,536 states 6.6 8.2 13.1 16.4 26.2 32.8
1 0 0 131,072 states 13.1 16.4 26.2 32.8 52.4 65.5
1 0 1 1,024 states 0.10 0.13 0.21 0.26 0.42 0.51
1 1 0 128 states 0.01 0.02 0.03 0.03 0.05 0.06
1 1 1 16 states 0.00 0.00 0.00 0.00 0.00 0.01
Notes: 1. Time unit is ms.
2. The on-chip oscillator clock counts the wait states, even when the external clock is used
as system clock.
Section 6 Power-Down Modes
Rev. 3.00 Sep. 14, 2006 Page 88 of 408
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6.1.2 System Control Register 2 (SYSCR2)
SYSCR2 controls the power-down modes, as well as SYSCR1.
Bit Bit Name
Initial
Value R/W Description
7 SMSEL 0 R/W Sleep Mode Selection
This bit specifies the mode to be entered after executing
the SLEEP instruction, as well as the SSBY bit in
SYSCR1. For details, see table 6.2.
6 0 Reserved
This bit is always read as 0.
5 DTON 0 R/W Direct Transfer on Flag
This bit specifies the mode to be entered after executing
the SLEEP instruction, as well as the SSBY bit in
SYSCR1. For details, see table 6.2.
4
3
2
MA2
MA1
MA0
0
0
0
R/W
R/W
R/W
Active Mode Clock Select 2 to 0
These bits select the operating clock frequency in active
and sleep modes. The operating clock frequency
changes to the set frequency after the SLEEP instruction
is executed.
0XX: φ
100: φ /8
101: φ/16
110: φ/32
111: φ/64
1, 0 All 0 Reserved
These bits are always read as 0.
[Legend]
X: Don't care
Section 6 Power-Down Modes
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6.1.3 Module Standby Control Register 1 (MSTCR1)
MSTCR1 allows the on-chip peripheral modules to enter a standby state in module units.
Bit Bit Name
Initial
Value R/W Description
7 0 Reserved
This bit is always read as 0.
6 MSTIIC 0 R/W IIC2 Module Standby
IIC2 enters standby mode when this bit is set to 1.
5 MSTS3 0 R/W SCI3 Module Standby
SCI3 enters standby mode when this bit is set to 1.
4 MSTAD 0 R/W A/D Converter Module Standby
A/D converter enters standby mode when this bit is set
to 1.
3 MSTWD 0 R/W Watchdog Timer Module Standby
Watchdog timer enters standby mode when this bit is set
to 1. (When the internal oscillator is selected for the
watchdog timer clock, the watchdog timer operates
regardless of the setting of this bit.)
2 MSTTW 0 R/W Timer W Module Standby
Timer W enters standby mode when this bit is set to 1.
1 MSTTV 0 R/W Timer V Module Standby
Timer V enters standby mode when this bit is set to 1.
0 0 Reserved
This bit is always read as 0.
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6.1.4 Module Standby Control Register 2 (MSTCR2)
MSTCR2 allows the on-chip peripheral modules to enter a standby state in module units.
Bit Bit Name
Initial
Value R/W Description
7 to 5 All 0 Reserved
These bits are always read as 0.
4 MSTTB1 0 R/W Timer B1 Module Standby
Timer B1 enters standby mode when this bit is set to 1.
3 to 0 All 0 Reserved
These bits are always read as 0.
Section 6 Power-Down Modes
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6.2 Mode Transitions and States of LSI
Figure 6.1 shows the possible transitions among these operating modes. A transition is made from
the program execution state to the program halt state of the program by executing a SLEEP
instruction. Interrupts allow for returning from the program halt state to the program execution
state of the program. A direct transition from active mode to active mode changes the operating
frequency. RES input enables transitions from a mode to the reset state. Table 6.2 shows the
transition conditions of each mode after the SLEEP instruction is executed and a mode to return
by an interrupt. Table 6.3 shows the internal states of the LSI in each mode.
Reset state
Standby mode Active mode Sleep mode
Subsleep mode
Program halt state Program execution state Program halt state
SLEEP
instruction
SLEEP
instruction
Interrupt
Direct transition
interrupt
Notes: 1. To make a transition to another mode by an interrupt, make sure interrupt handling is after the interrupt
is accepted.
2. Details on the mode transition conditions are given in table 6.2.
Interrupt
SLEEP
instruction
Interrupt
Figure 6.1 Mode Transiti o n Di agram
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Table 6.2 Transition Mode after SLEEP Instruction Execution and Interrupt Handling
DTON SSBY SMSEL
Transition Mode after SLEEP
Instruction Execution
Transition Mode due to
Interrupt
0 0 Sleep mode Active mode
0 1 Subsleep mode Active mode
0
1 X Standby mode Active mode
1 X 0* Active mode (direct transition) —
[Legend]
X: Don’t care
Note: * When a state transition is performed while SMSEL is 1, timer V, SCI3, and the A/D
converter are reset, and all registers are set to their initial values. To use these
functions after entering active mode, reset the registers.
Table 6.3 Internal State in Each Operating Mode
Function Active Mode Sleep Mode Subsleep Mode Standby Mode
System clock oscillator Functioning Functioning Halted Halted
Instructions Functioning Halted Halted Halted CPU
operations Registers Functioning Retained Retained Retained
RAM Functioning Retained Retained Retained
IO ports Functioning Retained Retained Register contents are
retained, but output is the
high-impedance state.
IRQ3, IRQ0 Functioning Functioning Functioning Functioning External
interrupts WKP5 Functioning Functioning Functioning Functioning
Timer B1 Functioning Functioning Retained Retained
Timer V Functioning Functioning Reset Reset
Timer W Functioning Functioning Retained Retained
Watchdog
timer
Functioning Functioning Retained
(Functioning if the internal oscillator is selected
as a count clock.)
SCI3 Functioning Functioning Reset Reset
IIC2 Functioning Functioning Retained Retained
A/D converter Functioning Functioning Reset Reset
Peripheral
modules
LVD Functioning Functioning Functioning Functioning
Section 6 Power-Down Modes
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6.2.1 Sleep Mode
In sleep mode, CPU operation is halted but the on-chip peripheral modules function at the clock
frequency set by the MA2 to MA0 bits in SYSCR2. CPU register contents are retained. When an
interrupt is requested, sleep mode is cleared and the CPU starts interrupt exception handling. Sleep
mode is not cleared if the I bit in the condition code register (CCR) is set to 1 or the requested
interrupt is disabled by the interrupt enable bit. When the RES pin is driven low in sleep mode, the
CPU goes into the reset state and sleep mode is cleared.
6.2.2 Standby Mode
In standby mode, the system clock oscillator is halted, and operation of the CPU and on-chip
peripheral modules is halted. However, as long as the rated voltage is supplied, the contents of
CPU registers, on-chip RAM, and some on-chip peripheral module registers are retained. On-chip
RAM contents will be retained as long as the voltage set by the RAM data retention voltage is
provided. The I/O ports go to the high-impedance state.
Standby mode is cleared by an interrupt. When an interrupt is requested, the on-chip oscillator
starts functioning. The external oscillator also starts functioning when used. After the time set by
the STS2 to STS0 bits in SYSCR1 has elapsed, standby mode is cleared and the CPU starts
interrupt exception handling. Standby mode is not cleared if the I bit in the condition code register
(CCR) is set to 1 or the requested interrupt is disabled by the interrupt enable bit.
When the RES pin is driven low in standby mode, the on-chip oscillator starts functioning. The
system clock is supplied to the entire chip as soon as the on-chip oscillator starts functioning. The
RES pin must be kept low for the rated period. On driving the RES pin high, after the oscillation
stabilization time set by the power-on reset circuit has elapsed, the internal reset signal is cleared
and the CPU starts reset exception handling.
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6.2.3 Subsleep Mode
In subsleep mode, the system clock oscillator is halted, and operation of the CPU and on-chip
peripheral modules is halted. However, as long as the rated voltage is supplied, the contents of
CPU registers, the on-chip RAM, and some on-chip peripheral module registers are retained. The
I/O ports keep the same states as before the transition.
Subsleep mode is cleared by an interrupt. When an interrupt is requested, the on-chip oscillator
starts functioning. The external oscillator also starts functioning when used. After the time set by
the STS2 to STS0 bits in SYSCR1 has elapsed, subsleep mode is cleared and the CPU starts
interrupt exception handling. Subsleep mode is not cleared if the I bit in the condition code
register (CCR) is set to 1 or the requested interrupt is disabled by the interrupt enable bit.
When the RES pin is driven low in subsleep mode, the on-chip oscillator starts functioning. The
system clock is supplied to the entire chip as soon as the on-chip oscillator starts functioning. The
RES pin must be kept low for the rated period. On driving the RES pin high, after the oscillation
stabilization time set by the power-on reset circuit has elapsed, the internal reset signal is cleared
and the CPU starts reset exception handling.
6.3 Operating Frequency in Active Mode
Operation in active mode is clocked at the frequency designated by the MA2 to MA0 bits in
SYSCR2. The operating frequency changes to the set frequency after SLEEP instruction
execution.
6.4 Direct Transition
The CPU can execute programs in active mode. The operating frequency can be changed by
making a transition directly from active mode to active mode. A direct transition can be made by
executing a SLEEP instruction while the DTON bit in SYSCR2 is set to 1. If the direct transition
interrupt is disabled by the interrupt enable register 1, a transition is made instead to sleep mode or
subsleep mode. Note that if a direct transition is attempted while the I bit in condition code
register (CCR) is set to 1, sleep mode or subsleep mode will be entered though that mode cannot
be cleared by means of an interrupt.
Section 6 Power-Down Modes
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6.5 Module Standby Function
The module standby function can be set to any peripheral module. In module standby mode, the
clock supply to the specified module stops and the module enters the power-down mode. Module
standby mode enables each on-chip peripheral module to enter the standby state by setting a bit
that corresponds to each module in MSTCR1 and MSTCR2 to 1 and cancels the mode by clearing
the bit to 0.
Section 6 Power-Down Modes
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Section 7 ROM
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Section 7 ROM
The features of the 12-kbyte (including 4 kbytes as the E7 or E8 control program area) flash
memory built into the HD64F36912G and HD64F36902G are summarized below.
• Programming/erase methods
The flash memory is programmed in 64-byte units at a time. Erase is performed in single-
block units. The flash memory is configured as follows: 1 kbyte × 4 blocks and 4 kbytes ×
2 blocks. To erase the entire flash memory, each block must be erased in turn.
• Reprogramming capability
The flash memory can be reprogrammed up to 1,000 times.
• On-board programming
On-board programming/erasing can be done in boot mode, in which the boot program built
into the chip is started to erase or program of the entire flash memory. In normal user
program mode, individual blocks can be erased or programmed.
• Automatic bit rate adjustment
For data transfer in boot mode, this LSI's bit rate can be automatically adjusted to match
the transfer bit rate of the host.
• Programming/erasing protection
Sets software protection against flash memory programming/erasing.
7.1 Block Configuration
Figure 7.1 shows the block configuration of 12-kbyte flash memory. The thick lines indicate
erasing units, the narrow lines indicate programming units, and the values are addresses. The flash
memory is divided into 1 kbyte × 4 blocks and 4 kbytes × 2 blocks. Erasing is performed in these
units. Programming is performed in 64-byte units starting from an address with lower eight bits
H'00, H'40, H'80, or H'C0.
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Programming unit: 64 bytes
Programming unit: 64 bytes
Programming unit: 64 bytes
Programming unit: 64 bytes
Programming unit: 64 bytes
H'0000 H'0001 H'0002
H'0040 H'0041 H'0042
H'03C0 H'03C1 H'03C2
H'0400 H'0401 H'0402
H'0440 H'0441 H'0442
H'07C0 H'07C1 H'07C2
H'0800 H'0801 H'0802
H'0840 H'0841 H'0842
H'0BC0 H'0BC1 H'0BC2
H'0C00 H'0C01 H'0C02
H'0C40 H'0C41 H'0C42
H'0FC0 H'0FC1 H'0FC2
H'1000 H'1001 H'1002
H'1040 H'1041 H'1042
H'003F
H'007F
H'03FF
H'043F
H'047F
H'07FF
H'083F
H'087F
H'0BFF
H'0C3F
H'0C7F
H'0FFF
H'103F
H'107F
H'1FC0 H'1FC1 H'1FC2 H'1FFF
H'2FC0 H'2FC1 H'2FC2 H'2FFF
Programming unit: 64 bytes
H'2000 H'2001 H'2002
H'2040 H'2041 H'2042
H'203F
H'207F
Erase unit
1 kbyte
Erase unit
1 kbyte
Erase unit
1 kbyte
Erase unit
1 kbyte
Erase unit
4 kbytes
Erase unit
4 kbytes
Figure 7.1 Flash Memory Bl ock Co nfi g u r ation
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7.2 Register Descriptions
The flash memory has the following registers.
• Flash memory control register 1 (FLMCR1)
• Flash memory control register 2 (FLMCR2)
• Erase block register 1 (EBR1)
• Flash memory enable register (FENR)
7.2.1 Flash Memory Control Register 1 (FLMCR1)
FLMCR1 is a register that makes the flash memory change to program mode, program-verify
mode, erase mode, or erase-verify mode. For details on register setting, refer to section 7.4, Flash
Memory Programming/Erasing.
Bit Bit Name
Initial
Value R/W Description
7 — 0 — Reserved
This bit is always read as 0.
6 SWE 0 R/W Software Write Enable
When this bit is set to 1, flash memory
programming/erasing is enabled. When this bit is cleared
to 0, other FLMCR1 register bits and all EBR1 bits cannot
be set.
5 ESU 0 R/W Erase Setup
When this bit is set to 1, the flash memory changes to the
erase setup state. When it is cleared to 0, the erase setup
state is cancelled. Set this bit to 1 before setting the E bit
to 1 in FLMCR1.
4 PSU 0 R/W Program Setup
When this bit is set to 1, the flash memory changes to the
program setup state. When it is cleared to 0, the program
setup state is cancelled. Set this bit to 1 before setting the
P bit in FLMCR1.
3 EV 0 R/W Erase-Verify
When this bit is set to 1, the flash memory changes to
erase-verify mode. When it is cleared to 0, erase-verify
mode is cancelled.
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Bit Bit Name
Initial
Value R/W Description
2 PV 0 R/W Program-Verify
When this bit is set to 1, the flash memory changes to
program-verify mode. When it is cleared to 0, program-
verify mode is cancelled.
1 E 0 R/W Erase
When this bit is set to 1 while SWE = 1 and ESU = 1, the
flash memory changes to erase mode. When it is cleared
to 0, erase mode is cancelled.
0 P 0 R/W Program
When this bit is set to 1 while SWE = 1 and PSU = 1, the
flash memory changes to program mode. When it is
cleared to 0, program mode is cancelled.
7.2.2 Flash Memory Control Register 2 (FLMCR2)
FLMCR2 is a register that displays the state of flash memory programming/erasing. FLMCR2 is a
read-only register, and should not be written to.
Bit Bit Name
Initial
Value R/W Description
7 FLER 0 R Flash Memory Error
Indicates that an error has occurred during an operation
on flash memory (programming or erasing). When FLER
is set to 1, flash memory goes to the error-protection
state.
See section 7.5.3, Error Protection, for details.
6 to 0 — All 0 — Reserved
These bits are always read as 0.
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7.2.3 Erase Block Register 1 (E BR1)
EBR1 specifies the flash memory erase area block. EBR1 is initialized to H'00 when the SWE bit
in FLMCR1 is 0. Do not set more than one bit at a time, as this will cause all the bits in EBR1 to
be automatically cleared to 0.
Bit Bit Name
Initial
Value R/W Description
7, 6 — All 0 — Reserved
These bits are always read as 0.
5 EB5 0 R/W When this bit is set to 1, 4 kbytes of H'2000 to H'2FFF will
be erased.
4 EB4 0 R/W When this bit is set to 1, 4 kbytes of H'1000 to H'1FFF will
be erased.
3 EB3 0 R/W When this bit is set to 1, 1 kbyte of H'0C00 to H'0FFF will
be erased.
2 EB2 0 R/W When this bit is set to 1, 1 kbyte of H'0800 to H'0BFF will
be erased.
1 EB1 0 R/W When this bit is set to 1, 1 kbyte of H'0400 to H'07FF will
be erased.
0 EB0 0 R/W When this bit is set to 1, 1 kbyte of H'0000 to H'03FF will
be erased.
7.2.4 Flash Memory Enable Register (FENR)
Bit 7 (FLSHE) in FENR enables or disables the CPU access to the flash memory control registers,
FLMCR1, FLMCR2, and EBR1.
Bit Bit Name
Initial
Value R/W Description
7 FLSHE 0 R/W Flash Memory Control Register Enable
Flash memory control registers can be accessed when
this bit is set to 1. Flash memory control registers cannot
be accessed when this bit is set to 0.
6 to 0 — All 0 — Reserved
These bits are always read as 0.
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7.3 On-Board Programming Modes
There is a mode for programming/erasing of the flash memory; boot mode, which enables on-
board programming/erasing. On-board programming/erasing can also be performed in user
program mode. At reset-start in reset mode, this LSI changes to a mode depending on the TEST
pin settings, NMI pin settings, and input level of each port, as shown in table 7.1. The input level
of each pin must be defined four states before the reset ends.
When changing to boot mode, the boot program built into this LSI is initiated. The boot program
transfers the programming control program from the externally-connected host to on-chip RAM
via SCI3. After erasing the entire flash memory, the programming control program is executed.
This can be used for programming initial values in the on-board state or for a forcible return when
programming/erasing can no longer be done in user program mode. In user program mode,
individual blocks can be erased and programmed by branching to the user program/erase control
program prepared by the user.
Table 7.1 Setting Programming Modes
TEST NMI E10T_0 LSI State after Reset End
0 1 X User mode
0 0 1 Boot mode
[Legend]
X: Don’t care
7.3.1 Boot Mode
Table 7.2 shows the boot mode operations between reset end and branching to the programming
control program.
1. When boot mode is used, the flash memory programming control program must be prepared in
the host beforehand. Prepare a programming control program in accordance with the
description in section 7.4, Flash Memory Programming/Erasing.
2. SCI3 should be set to asynchronous mode, and the transfer format as follows: 8-bit data, 1 stop
bit, and no parity.
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3. When the boot program is initiated, the chip measures the low-level period of asynchronous
SCI communication data (H'00) transmitted continuously from the host. The chip then
calculates the bit rate of transmission from the host, and adjusts the SCI3 bit rate to match that
of the host. The reset should end with the RxD pin high. The RxD and TxD pins should be
pulled up on the board if necessary. After the reset is complete, it takes approximately 100
states before the chip is ready to measure the low-level period.
4. After matching the bit rates, the chip transmits one H'00 byte to the host to indicate the
completion of bit rate adjustment. The host should confirm that this adjustment end indication
(H'00) has been received normally, and transmit one H'55 byte to the chip. If reception could
not be performed normally, initiate boot mode again by a reset. Depending on the host's
transfer bit rate and system clock frequency of this LSI, there will be a discrepancy between
the bit rates of the host and the chip. To operate the SCI properly, set the host's transfer bit rate
and system clock frequency of this LSI within the ranges listed in table 7.3.
5. In boot mode, a part of the on-chip RAM area is used by the boot program. The area H'F980 to
H'FEEF is the area to which the programming control program is transferred from the host.
The boot program area cannot be used until the execution state in boot mode switches to the
programming control program.
6. Before branching to the programming control program, the chip terminates transfer operations
by SCI3 (by clearing the RE and TE bits in SCR3 to 0), however the adjusted bit rate value
remains set in BRR. Therefore, the programming control program can still use it for transfer of
write data or verify data with the host. The TxD pin is high (PCR22 = 1, P22 = 1). The
contents of the CPU general registers are undefined immediately after branching to the
programming control program. These registers must be initialized at the beginning of the
programming control program, as the stack pointer (SP), in particular, is used implicitly in
subroutine calls, etc.
7. Boot mode can be cleared by a reset. End the reset after driving the reset pin low, waiting at
least 20 states, and then setting the TEST pin and NMI pin. Boot mode is also cleared when a
WDT overflow occurs.
8. Do not change the TEST pin and NMI pin input levels in boot mode.
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Table 7.2 Boot Mode Operation
Communication Contents
Processing Contents
Host Operation LSI Operation
Processing Contents
Continuously transmits data H'00
at specified bit rate.
Branches to boot program at reset-start.
Boot program initiation
H'00, H'00 . . . H'00
H'00
H'55
Transmits data H'55 when data H'00
is received error-free.
H'XX
Transmits number of bytes (N) of
programming control program to be
transferred as 2-byte data
(low-order byte following high-order
byte)
Transmits 1-byte of programming
control program (repeated for N times)
H'AA reception
H'AA reception
Upper bytes, lower bytes
Echoback
Echoback
H'AA
H'AA
Branches to programming control program
transferred to on-chip RAM and starts
execution.
Transmits data H'AA to host.
Checks flash memory data, erases all flash
memory blocks in case of written data
existing, and transmits data H'AA to host.
(If erase could not be done, transmits data
H'FF to host and aborts operation.)
H'FF
Boot program
erase error
Item
Boot mode initiation
• Measures low-level period of receive data
H'00.
• Calculates bit rate and sets BRR in SCI3.
• Transmits data H'00 to host as adjustment
end indication.
H'55 reception.
Bit rate adjustment
Echobacks the 2-byte data
received to host.
Echobacks received data to host and also
transfers it to RAM.
(repeated for N times)
Transfer of number of bytes of
programming control program Flash memory erase
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Table 7.3 System Clock Frequencies for which Automatic Adjustment of LSI Bit Rate is
Possible
Host Bit Rate System Clock Frequency Range of LSI
9,600 bps 8 MHz (on-chip oscillator clock)
4,800 bps 8 MHz (on-chip oscillator clock)
2,400 bps 8 MHz (on-chip oscillator clock)
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7.3.2 Programming/Erasing in User Program Mode
On-board programming/erasing of an individual flash memory block can also be performed in user
program mode by branching to a user program/erase control program. The user must set branching
conditions and provide on-board means of supplying programming data. The flash memory must
contain the user program/erase control program or a program that provides the user program/erase
control program from external memory. As the flash memory itself cannot be read during
programming/erasing, transfer the user program/erase control program to on-chip RAM, as in boot
mode. Figure 7.2 shows a sample procedure for programming/erasing in user program mode.
Prepare a user program/erase control program in accordance with the description in section 7.4,
Flash Memory Programming/Erasing.
Ye s
No
Program/erase?
Transfer user program/erase control
program to RAM
Reset-start
Branch to user program/erase control
program in RAM
Execute user program/erase control
program (flash memory rewrite)
Branch to flash memory application
program
Branch to flash memory application
program
Figure 7.2 Programming/Erasing Flowchart Example in User Program Mode
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7.4 Flash Memory Programming/Erasing
A software method using the CPU is employed to program and erase flash memory in the on-
board programming modes. Depending on the FLMCR1 setting, the flash memory operates in one
of the following four modes: Program mode, program-verify mode, erase mode, and erase-verify
mode. The programming control program in boot mode and the user program/erase control
program in user program mode use these operating modes in combination to perform
programming/erasing. Flash memory programming and erasing should be performed in
accordance with the descriptions in section 7.4.1, Program/Program-Verify and section 7.4.2,
Erase/Erase-Verify, respectively.
7.4.1 Program/Program-Verify
When writing data or programs to the flash memory, the program/program-verify flowchart shown
in figure 7.3 should be followed. Performing programming operations according to this flowchart
will enable data or programs to be written to the flash memory without subjecting the chip to
voltage stress or sacrificing program data reliability.
1. Programming must be done to an empty address. Do not reprogram an address to which
programming has already been performed.
2. Programming should be carried out 64 bytes at a time. A 64-byte data transfer must be
performed even if writing fewer than 64 bytes. In this case, H'FF data must be written to the
extra addresses.
3. Prepare the following data storage areas in RAM: A 64-byte programming data area, a 64-byte
reprogramming data area, and a 64-byte additional-programming data area. Perform
reprogramming data computation according to table 7.4, and additional programming data
computation according to table 7.5.
4. Consecutively transfer 64 bytes of data in byte units from the reprogramming data area or
additional-programming data area to the flash memory. The program address and 64-byte data
are latched in the flash memory. The lower 8 bits of the start address in the flash memory
destination area must be H'00, H'40, H'80, or H'C0.
5. The time during which the P bit is set to 1 is the programming time. Table 7.6 shows the
allowable programming times.
6. The watchdog timer (WDT) is set to prevent overprogramming due to program runaway, etc.
An overflow cycle of approximately 6.6 ms is allowed.
7. For a dummy write to a verify address, write 1-byte data H'FF to an even address. Verify data
can be read in words from the address to which a dummy write was performed.
8. The maximum number of repetitions of the program/program-verify sequence of the same bit
is 1,000.
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START
End of programming
Notes: 1. The RTS instruction must not be used during the following (1) and (2) periods.
(1) A period between 64-byte data programming to flash memory and the P bit clearing
(2) A period between dummy writing of H'FF to a verify address and verify data reading
2. When WDT is in use, disable it once.
Set SWE bit in FLMCR1
Write pulse application subroutine
Wait 1 µs
Apply Write Pulse
*
1
End Sub
Set PSU bit in FLMCR1
WDT enable
Disable WDT
Wait 50 µs
Set P bit in FLMCR1
Wait (Wait time = Programming time)
Clear P bit in FLMCR1
Wait 5 µs
Clear PSU bit in FLMCR1
Wait 5 µs
n = 1
m= 0
No
No
No Yes
Yes
Yes
Yes
Wait 4 µs
Wait 2 µs
Wait 2 µs
Apply
Write pulse
Set PV bit in FLMCR1
Set block start address as
verify address
H'FF dummy write to verify address
Read verify data
Verify data =
Write data?
Reprogram data computation
Additional-programming data computation
Clear PV bit in FLMCR1
Clear SWE bit in FLMCR1
m = 1
m = 0 ?
Increment address
Programming failure
No
Clear SWE bit in FLMCR1
Wait 100 µs
No
Yes
n
≤
6?
No
Yes
n
≤
6 ?
Wait 100 µs
n ≤ 1000 ?
n ← n + 1
Write 64-byte data in RAM reprogram
data area consecutively to flash memory
Store 64-byte program data in program
data area and reprogram data area
Apply Write Pulse
Sub-Routine-Call
64-byte
data verification completed?
Successively write 64-byte data from additional-
programming data area in RAM to flash memory
*
1
Disable WDT
*
2
Figure 7.3 Program/Program-Verify Flowchart
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Table 7.4 Reprogr am Data Computati on T able
Program Data Verify Data Reprogram Data Comments
0 0 1 Programming completed
0 1 0 Reprogram bit
1 0 1 —
1 1 1 Remains in erased state
Table 7.5 Additi on al -Program Data Computation Table
Reprogram Data Verify Data Additional-Program
Data Comments
0 0 0 Additional-program bit
0 1 1 No additional programming
1 0 1 No additional programming
1 1 1 No additional programming
Table 7.6 Programming Time
n
(Number of Writes) Programming
Time In Addition al
Programming Comments
1 to 6 30 10
7 to 1,000 200 —
Note: Time shown in µs.
7.4.2 Erase/Erase-Verify
When erasing flash memory, the erase/erase-verify flowchart shown in figure 7.4 should be
followed.
1. Prewriting (setting erase block data to all 0s) is not necessary.
2. Erasing is performed in block units. Make only a single-bit specification in the erase block
register (EBR1). To erase multiple blocks, each block must be erased in turn.
3. The time during which the E bit is set to 1 is the flash memory erase time.
4. The watchdog timer (WDT) is set to prevent overerasing due to program runaway, etc. An
overflow cycle of approximately 19.8 ms is allowed.
5. For a dummy write to a verify address, write 1-byte data H'FF to an even address. Verify data
can be read in words from the address to which a dummy write was performed.
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6. If the read data is not erased successfully, set erase mode again, and repeat the erase/erase-
verify sequence as before. The maximum number of repetitions of the erase/erase-verify
sequence is 100.
7.4.3 Interrupt Handling when Programming/Erasing Flash Memory
All interrupts, including the NMI interrupt, are disabled while flash memory is being programmed
or erased, or while the boot program is executing, for the following three reasons:
1. Interrupt during programming/erasing may cause a violation of the programming or erasing
algorithm, with the result that normal operation cannot be assured.
2. If interrupt exception handling starts before the vector address is written or during
programming/erasing, a correct vector cannot be fetched and the CPU malfunctions.
3. If an interrupt occurs during boot program execution, normal boot mode sequence cannot be
carried out.
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Erase start
Set EBR1
Enable WDT
Wait 1 µs
Wait 100 µs
SWE bit ← 1
n ← 1
ESU bit ← 1
E bit ← 1
Wait 10 ms
E bit ← 0
Wait 10 µs
ESU bit ← 10
Wait 10 µs
Disable WDT
Read verify data
Increment address Verify data = all 1s ?
Last address of block ?
All erase block erased ?
Set block start address as verify address
H'FF dummy write to verify address
Wait 20 µs
Wait 2 µs
EV bit ← 1
Wait 100 µs
End of erasing
Notes: 1. The RTS instruction must not be used during a period between dummy writing of H'FF to a verify address and verify data reading.
2. When WDT is in use, disable it once.
SWE bit ← 0
Wait 4 µs
EV bit ← 0
n ≤100 ?
Wait 100 µs
Erase failure
SWE bit ← 0
Wait 4µs
EV bit ← 0
n ← n + 1
Ye s
No
Ye s
Ye s
Ye s
Ye s
No
No
No
*1
*2
Disable WDT
Figure 7.4 Erase/Erase-Verify Flowchart
Section 7 ROM
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7.5 Program/Erase Protection
There are three kinds of flash memory program/erase protection; hardware protection, software
protection, and error protection.
7.5.1 Hardware Protection
Hardware protection refers to a state in which programming/erasing of flash memory is forcibly
disabled or aborted because of a transition to reset, subsleep mode or standby mode. Flash
memory control register 1 (FLMCR1), flash memory control register 2 (FLMCR2), and erase
block register 1 (EBR1) are initialized. In a reset via the RES pin, the reset state is not entered
unless the RES pin is held low until oscillation stabilizes after powering on. In the case of a reset
during operation, hold the RES pin low for the RES pulse width specified in the AC
Characteristics section.
7.5.2 Software Protection
Software protection can be implemented against programming/erasing of all flash memory blocks
by clearing the SWE bit in FLMCR1. When software protection is in effect, setting the P or E bit
in FLMCR1 does not cause a transition to program mode or erase mode. By setting the erase block
register 1 (EBR1), erase protection can be set for individual blocks. When EBR1 is set to H'00,
erase protection is set for all blocks.
7.5.3 Error Protection
In error protection, an error is detected when CPU runaway occurs during flash memory
programming/erasing, or operation is not performed in accordance with the program/erase
algorithm, and the program/erase operation is aborted. Aborting the program/erase operation
prevents damage to the flash memory due to overprogramming or overerasing.
When the following errors are detected during programming/erasing of flash memory, the FLER
bit in FLMCR2 is set to 1, and the error protection state is entered.
• When the flash memory of the relevant address area is read during programming/erasing
(including vector read and instruction fetch)
• Immediately after exception handling excluding a reset during programming/erasing
• When a SLEEP instruction is executed during programming/erasing
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The FLMCR1, FLMCR2, and EBR1 settings are retained, however program mode or erase mode
is aborted at the point at which the error occurred. Program mode or erase mode cannot be re-
entered by re-setting the P or E bit. However, PV and EV bit setting is enabled, and a transition
can be made to verify mode. Error protection can be cleared only by a reset.
Section 7 ROM
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Section 8 RAM
RAM0400A_000020020200 Rev. 3.00 Sep. 14, 2006 Page 115 of 408
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Section 8 RAM
The H8/36912F and H8/36902F have 1536 bytes, the H8/36912 and H8/36902 have 512 bytes,
and the H8/36911, H8/36901, and H8/36900 have 256 bytes of on-chip high-speed static RAM,
respectively. The RAM is connected to the CPU by a 16-bit data bus, enabling two-state access by
the CPU to both byte data and word data.
Product Classification RAM Size RAM Address
H8/36912F 1536 bytes H'F980 to H'FF7F*
Flash memory version
H8/36902F 1536 bytes H'F980 to H'FF7F*
H8/36912, H8/36902 512 bytes H'FD80 to H'FF7F
H8/36911, H8/36901 256 bytes H'FE80 to H'FF7F
Masked ROM version
H8/36900 256 bytes H'FE80 to H'FF7F
Note: * When the E7 or E8 is used, area H'F980 to H'FD7F must not be accessed.
Section 8 RAM
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Section 9 I/O Ports
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Section 9 I/O Ports
The LSI of the H8/36912 Group and H8/36902 Group has 18 general I/O ports. Port 8 (P84 to
P80) is a large current port, which can drive 20 mA (@VOL = 1.5 V) when a low level signal is
output. Any of these ports can become an input port immediately after a reset. They can also be
used as I/O pins of the on-chip peripheral modules or external interrupt input pins, and these
functions can be switched depending on the register settings. The registers for selecting these
functions can be divided into two types: those included in I/O ports and those included in each on-
chip peripheral module. General I/O ports are comprised of the port control register for controlling
inputs/outputs and the port data register for storing output data and can select inputs/outputs in bit
units. For functions in each port, see appendix B.1, I/O Port Block Diagrams. For the execution of
bit manipulation instructions to the port control register and port data register, see section 2.8.3,
Bit Manipulation Instruction.
9.1 Port 1
Port 1 is a general I/O port also functioning as an IRQ interrupt input pin and timer V input pin.
Figure 9.1 shows its pin configuration.
P17/IRQ3/TRGV
P14/IRQ0
Port 1
Figure 9.1 Port 1 Pin Configuration
Port 1 has the following registers.
• Port mode register 1 (PMR1)
• Port control register 1 (PCR1)
• Port data register 1 (PDR1)
• Port pull-up control register 1 (PUCR1)
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9.1.1 Port Mode Register 1 (PMR1)
PMR1 switches the functions of pins in port 1 and port 2.
Bit Bit Name
Initial
Value R/W Description
7 IRQ3 0 R/W P17/IRQ3/TRGV Pin Function Switch
Selects whether pin P17/IRQ3/TRGV is used as P17 or
as IRQ3/TRGV.
0: General I/O port
1: IRQ3/TRGV input pin
6, 5 All 0 Reserved
These bits are always read as 0.
4 IRQ0 0 R/W P14/IRQ0 Pin Function Switch
Selects whether pin P14/IRQ0 is used as P14 or as
IRQ0.
0: General I/O port
1: IRQ0 input pin
3, 2 All 0 Reserved
These bits are always read as 0.
1 TXD 0 R/W P22/TXD Pin Function Switch
Selects whether pin P22/TXD is used as P22 or as TXD.
0: General I/O port
1: TXD output pin
0 0 Reserved
This bit is always read as 0.
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9.1.2 Port Control Regis ter 1 (PCR1)
PCR1 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 1.
Bit Bit Name
Initial
Value R/W Description
7
6
5
4
3
2
1
0
PCR17
PCR14
0
0
W
W
When the corresponding pin is designated in PMR1 as a
general I/O pin, setting a PCR1 bit to 1 makes the
corresponding pin an output port, while clearing the bit to
0 makes the pin an input port.
Bits 6, 5, and 3 to 0 are reserved.
9.1.3 Port Data Register 1 (PDR1)
PDR1 is a general I/O port data register of port 1.
Bit Bit Name
Initial
Value R/W Description
7
6
5
4
3
2
1
0
P17
P14
0
1
1
0
1
1
1
1
R/W
R/W
These bits store output data for port 1 pins.
If PDR1 is read while PCR1 bits are set to 1, the value
stored in PDR1 are read. If PDR1 is read while PCR1 bits
are cleared to 0, the pin states are read regardless of the
value stored in PDR1.
Bits 6, 5, and 3 to 0 are reserved. These bits are always
read as 1.
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9.1.4 Port Pull-Up Control Regi ster 1 (PUCR1)
PUCR1 controls the pull-up MOS in bit units of the pins set as the input ports.
Bit Bit Name
Initial
Value R/W Description
7
6
5
4
3
2
1
0
PUCR17
PUCR14
0
1
1
0
1
1
1
1
R/W
R/W
Only bits for which PCR1 is cleared are valid.
The pull-up MOS of the P17 and P14 pins enter the on-
state when these bits are set to 1, while they enter the
off-state when these bits are cleared to 0.
Bits 6, 5, and 3 to 0 are reserved. These bits are always
read as 1.
9.1.5 Pin Functions
The correspondence between the register specification and the port functions is shown below.
• P17/IRQ3/TRGV pin
Register PMR1 PCR1
Bit Name IRQ3 PCR17 Pin Function
Setting value 0 0 P17 input pin
1 P17 output pin
1 X IRQ3 input/TRGV input pin
[Legend]
X: Don't care
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• P14/IRQ0 pin
Register PMR1 PCR1
Bit Name IRQ0 PCR14 Pin Function
Setting value 0 0 P14 input pin
1 P14 output pin
1 X IRQ0 input pin
[Legend]
X: Don't care
9.2 Port 2
Port 2 is a general I/O port also functioning as a SCI3 I/O pin. Each pin of the port 2 is shown in
figure 9.2. The register settings of PMR1 and SCI3 have priority for functions of the pins for both
uses.
P22/TXD
P21/RXD
P20/SCK3
Port 2
Figure 9.2 Port 2 Pin Configuration
Port 2 has the following registers.
• Port control register 2 (PCR2)
• Port data register 2 (PDR2)
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9.2.1 Port Control Regis ter 2 (PCR2)
PCR2 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 2.
Bit Bit Name
Initial
Value R/W Description
7 to 3 Reserved
2
1
0
PCR22
PCR21
PCR20
0
0
0
W
W
W
When each of the port 2 pins, P22 to P20, functions as an
general I/O port, setting a PCR2 bit to 1 makes the
corresponding pin an output port, while clearing the bit to
0 makes the pin an input port.
9.2.2 Port Data Register 2 (PDR2)
PDR2 is a general I/O port data register of port 2.
Bit Bit Name
Initial
Value R/W Description
7 to 3 All 1 Reserved
These bits are always read as 1.
2
1
0
P22
P21
P20
0
0
0
R/W
R/W
R/W
These bits store output data for port 2 pins.
If PDR2 is read while PCR2 bits are set to 1, the value
stored in PDR2 is read. If PDR2 is read while PCR2 bits
are cleared to 0, the pin states are read regardless of the
value stored in PDR2.
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9.2.3 Pin Functions
The correspondence between the register specification and the port functions is shown below.
• P22/TXD pin
Register PMR1 PCR2
Bit Name TXD PCR22 Pin Function
Setting
value
0 0 P22 input pin
1 P22 output pin
1 X TXD output pin
[Legend]
X: Don't care
• P21/RXD pin
Register SCR3 PCR2
Bit Name RE PCR21 Pin Function
Setting
value
0 0 P21 input pin
1 P21 output pin
1 X RXD input pin
[Legend]
X: Don't care
• P20/SCK3 pin
Register SCR3 SMR PCR2
Bit Name CKE1 CKE0 COM PCR20 Pin Function
Setting value 0 0 0 0 P20 input pin
1 P20 output pin
0 0 1 X SCK3 output pin
0 1 X X SCK3 output pin
1 X X X SCK3 input pin
[Legend]
X: Don't care
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9.3 Port 5
Port 5 is a general I/O port also functioning as an I2C bus interface I/O pin*, A/D trigger input pin,
and wakeup interrupt input pin. Each pin of the port 5 is shown in figure 9.3. The register setting
of the I2C bus interface has priority for functions of the P57/SCL and P56/SDA pins.
Note: * Supported only by the H8/36912 Group.
P57/SCL
P56/SDA
P55/WKP5/ADTR
G
Port 5
Figure 9.3 Port 5 Pin Configuration
Port 5 has the following registers.
• Port mode register 5 (PMR5)
• Port control register 5 (PCR5)
• Port data register 5 (PDR5)
• Port pull-up control register 5 (PUCR5)
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9.3.1 Port Mode Register 5 (PMR5)
PMR5 switches the functions of pins in port 5.
Bit Bit Name
Initial
Value R/W Description
7, 6 All 0 Reserved
These bits are always read as 0.
5 WKP5 0 R/W P55/WKP5/ADTRG Pin Function Switch
Selects whether pin P55/WKP5/ADTRG is used as P55
or as WKP5/ADTRG.
0: General I/O port
1: WKP5/ADTRG input pin
4 to 0 All 0 Reserved
These bits are always read as 0.
9.3.2 Port Control Regis ter 5 (PCR5)
PCR5 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 5.
Bit Bit Name
Initial
Value R/W Description
7
6
5
PCR57
PCR56
PCR55
0
0
0
W
W
W
When each of the port 5 pins, P57 to P55, functions as an
general I/O port, setting a PCR5 bit to 1 makes the
corresponding pin an output port, while clearing the bit to
0 makes the pin an input port.
4 to 0 Reserved
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9.3.3 Port Data Register 5 (PDR5)
PDR5 is a general I/O port data register of port 5.
Bit Bit Name
Initial
Value R/W Description
7
6
5
P57
P56
P55
0
0
0
R/W
R/W
R/W
These bits store output data for port 5 pins.
If PDR5 is read while PCR5 bits are set to 1, the value
stored in PDR5 are read. If PDR5 is read while PCR5 bits
are cleared to 0, the pin states are read regardless of the
value stored in PDR5.
4 to 0 All 1 Reserved
These bits are always read as 1.
9.3.4 Port Pull-Up Control Regi ster 5 (PUCR5)
PUCR5 controls the pull-up MOS in bit units of the pins set as the input ports.
Bit Bit Name
Initial
Value R/W Description
7, 6 All 0 Reserved
These bits are always read as 0.
5 PUCR55 0 R/W Only bits for which PCR5 is cleared are valid.
The pull-up MOS of the corresponding pins enter the on-
state when this bit is set to 1, while they enter the off-
state when this bit is cleared to 0.
4 to 0 All 0 Reserved
These bits are always read as 0.
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9.3.5 Pin Functions
The correspondence between the register specification and the port functions is shown below.
• P57/SCL pin
Register ICCR PCR5
Bit Name ICE PCR57 Pin Function
Setting value 0 P57 input pin
0
1 P57 output pin
1 X SCL I/O pin*
[Legend]
X: Don't care
Note: As the SCL output form is NMOS open-drain, direct bus drive is enabled.
* Supported only by the H8/36912 Group.
• P56/SDA pin
Register ICCR PCR5
Bit Name ICE PCR56 Pin Function
Setting value 0 P56 input pin
0
1 P56 output pin
1 X SDA I/O pin*
[Legend]
X: Don't care
Note: As the SDA output form is NMOS open-drain, direct bus drive is enabled.
* Supported only by the H8/36912 Group.
• P55/WKP5/ADTRG pin
Register PMR5 PCR5
Bit Name WKP5 PCR55 Pin Function
Setting value 0 0 P55 input pin
1 P55 output pin
1 X WKP5/ADTRG input pin
[Legend]
X: Don't care
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9.4 Port 7
Port 7 is a general I/O port also functioning as a timer V I/O pin. Each pin of the port 7 is shown
in figure 9.4. The register setting of TCSRV in timer V has priority for functions of the
P76/TMOV pin. The pins, P75/TMCIV and P74/TMRIV, are also functioning as timer V input
ports that are connected to the timer V regardless of the register setting of port 7.
P76/TMOV
P75/TMCIV
P74/TMRIV
Port 7
Figure 9.4 Port 7 Pin Configuration
Port 7 has the following registers.
• Port control register 7 (PCR7)
• Port data register 7 (PDR7)
9.4.1 Port Control Regis ter 7 (PCR7)
PCR7 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 7.
Bit Bit Name
Initial
Value R/W Description
7 Reserved
6
5
4
PCR76
PCR75
PCR74
0
0
0
W
W
W
Setting a PCR7 bit to 1 makes the corresponding pin an
output port, while clearing the bit to 0 makes the pin an
input port. Note that the TCSRV setting of the timer V has
priority for deciding input/output direction of the
P76/TMOV pin.
3 to 0 Reserved
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9.4.2 Port Data Register 7 (PDR7)
PDR7 is a general I/O port data register of port 7.
Bit Bit Name
Initial
Value R/W Description
7 1 Reserved
This bit is always read as 1.
6
5
4
P76
P75
P74
0
0
0
R/W
R/W
R/W
These bits store output data for port 7 pins.
If PDR7 is read while PCR7 bits are set to 1, the value
stored in PDR7 is read. If PDR7 is read while PCR7 bits
are cleared to 0, the pin states are read regardless of the
value stored in PDR7.
3 to 0 All 1 Reserved
These bits are always read as 1.
9.4.3 Pin Functions
The correspondence between the register specification and the port functions is shown below.
• P76/TMOV pin
Register TCSRV PCR7
Bit Name OS3 to OS0 PCR76 Pin Function
Setting value 0000 0 P76 input pin
1 P76 output pin
Other than
the above
values
X TMOV output pin
[Legend]
X: Don't care
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• P75/TMCIV pin
Register PCR7
Bit Name PCR75 Pin Function
Setting value 0 P75 input/TMCIV input pin
1 P75 output/TMCIV input pin
• P74/TMRIV pin
Register PCR7
Bit Name PCR74 Pin Function
Setting value 0 P74 input/TMRIV input pin
1 P74 output/TMRIV input pin
9.5 Port 8
Port 8 is a general I/O port also functioning as a timer W I/O pin. Each pin of the port 8 is shown
in figure 9.5. The register setting of the timer W has priority for functions of the P84/FTIOD,
P83/FTIOC, P82/FTIOB, and P81/FTIOA pins. The P80/FTCI pin also functions as a timer W
input port that is connected to the timer W regardless of the register setting of port 8.
P84/FTIOD
P83/FTIOC
P82/FTIOB
P81/FTIOA
P80/FTCI
Port 8
Figure 9.5 Port 8 Pin Configuration
Port 8 has the following registers.
• Port control register 8 (PCR8)
• Port data register 8 (PDR8)
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9.5.1 Port Control Regis ter 8 (PCR8)
PCR8 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 8.
Bit Bit Name
Initial
Value R/W Description
7 to 5 Reserved
4
3
2
1
0
PCR84
PCR83
PCR82
PCR81
PCR80
0
0
0
0
0
W
W
W
W
W
When each of the port 8 pins, P84 to P80, functions as an
general I/O port, setting a PCR8 bit to 1 makes the
corresponding pin an output port, while clearing the bit to
0 makes the pin an input port.
9.5.2 Port Data Register 8 (PDR8)
PDR8 is a general I/O port data register of port 8.
Bit Bit Name
Initial
Value R/W Description
7 to 5 All 0 Reserved
4
3
2
1
0
P84
P83
P82
P81
P80
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
These bits store output data for port 8 pins.
If PDR8 is read while PCR8 bits are set to 1, the value
stored in PDR8 is read. If PDR8 is read while PCR8 bits
are cleared to 0, the pin states are read regardless of the
value stored in PDR8.
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9.5.3 Pin Functions
The correspondence between the register specification and the port functions is shown below.
• P84/FTIOD pin
Register TMRW TIOR1 PCR8
Bit Name PWMD IOD2 IOD1 IOD0 PCR84 Pin Function
Setting
value
0 0 0 0 P84 input/FTIOD input pin
1 P84 output/FTIOD input pin
0 0 1 X FTIOD output pin
0 1 X X FTIOD output pin
1 X X 0 P84 input/FTIOD input pin
0
1 P84 output/FTIOD input pin
1 X X X X PWM output pin
[Legend]
X: Don't care
• P83/FTIOC pin
Register TMRW TIOR1 PCR8
Bit Name PWMC IOC2 IOC1 IOC0 PCR83 Pin Function
Setting
value
0 0 0 0 P83 input/FTIOC input pin
1 P83 output/FTIOC input pin
0 0 1 X FTIOC output pin
0 1 X X FTIOC output pin
1 X X 0 P83 input/FTIOC input pin
0
1 P83 output/FTIOC input pin
1 X X X X PWM output pin
[Legend]
X: Don't care
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• P82/FTIOB pin
Register TMRW TIOR0 PCR8
Bit Name PWMB IOB2 IOB1 IOB0 PCR82 Pin Function
Setting
value
0 0 0 0 P82 input/FTIOB input pin
1 P82 output/FTIOB input pin
0 0 1 X FTIOB output pin
0 1 X X FTIOB output pin
1 X X 0 P82 input/FTIOB input pin
0
1 P82 output/FTIOB input pin
1 X X X X PWM output pin
[Legend]
X: Don't care
• P81/FTIOA pin
Register TIOR0 PCR8
Bit Name IOA2 IOA1 IOA0 PCR81 Pin Function
Setting value 0 0 0 0 P81 input/FTIOA input pin
1 P81 output/FTIOA input pin
0 0 1 X FTIOA output pin
0 1 X X FTIOA output pin
1 X X 0 P81 input/FTIOA input pin
1 P81 output/FTIOA input pin
[Legend]
X: Don't care
• P80/FTCI pin
Register PCR8
Bit Name PCR80 Pin Function
Setting value 0 P80 input/FTCI input pin
1 P80 output/FTCI input pin
Section 9 I/O Ports
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9.6 Port B
Port B is an input port also functioning as an A/D converter analog input pin and LVD external
comparison voltage input pin. Each pin of the port B is shown in figure 9.6.
PB3/AN3/ExtU
PB2/AN2/ExtD
PB1/AN1
PB0/AN0
Port B
Figure 9.6 Port B Pin Configuration
Port B has the following register.
• Port data register B (PDRB)
9.6.1 Port Data Register B (PDRB)
PDRB is a general input-only port data register of port B.
Bit Bit Name
Initial
Value R/W Description
7 to 4 Reserved
3
2
1
0
PB3
PB2
PB1
PB0
R
R
R
R
The input value of each pin is read by reading this
register.
However, if a port B pin is designated as an analog input
channel by ADCSR in A/D converter or external
comparison voltage input pin by LVDCR in low-voltage
detection circuit, 0 is read.
Section 9 I/O Ports
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9.6.2 Pin Functions
The correspondence between the register specification and the port functions is shown below.
• PB3/AN3/ExtU pin
Register ADCSR LVDCR
Bit Name CH2 CH1 CH0 VDDII Pin Function
1 AN3 input pin 0 1 1
0 AN3 input/ExtU input pin
1 PB3 input pin
Setting value
Other than the above values
0 PB3 input/ExtU input pin
• PB2/AN2/ExtD pin
Register ADCSR LVDCR
Bit Name CH2 SCAN CH1 CH0 VDDII Pin Function
0 0 1 0 1 AN2 input pin
0 1 1 X 0 AN2 input/ExtD input pin
1 PB2 input pin
Setting value
Other than the above values
0 PB2 input/ExtD input pin
[Legend]
X: Don't care
• PB1/AN1 pin
Register ADCSR
Bit Name CH2 SCAN CH1 CH0 Pin Function
0 X 0 1
0 1 1 X
AN1 input pin
Setting value
Other than the above values PB1 input pin
[Legend]
X: Don't care
Section 9 I/O Ports
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• PB0/AN0 pin
Register ADCSR
Bit Name CH2 SCAN CH1 CH0 Pin Function
0 0 0 0
0 1 X X
AN0 input pin Setting
value
Other than the above values PB0 input pin
[Legend]
X: Don't care
9.7 Port C
Port C is a general I/O port also functioning as an external oscillation pin and clock output pin.
Each pin of the port C is shown in figure 9.7. The register setting of CKCSR has priority for
functions of the pins for both uses.
PC1/OSC2/CLKOUT
PC0/OSC1
Port C
Figure 9.7 Port C Pin Configuration
Port C has the following registers.
• Port control register C (PCRC)
• Port data register C (PDRC)
Section 9 I/O Ports
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9.7.1 Port Control Regis ter C (P CR C)
PCRC selects inputs/outputs in bit units for pins to be used as general I/O ports of port C.
Bit Bit Name
Initial
Value R/W Description
7 to 2 Reserved
1
0
PCRC1
PCRC0
0
0
W
W
When each of the port C pins, PC1 and PC0, functions as
an general I/O port, setting a PCRC bit to 1 makes the
corresponding pin an output port, while clearing the bit to
0 makes the pin an input port.
9.7.2 Port Data Register C (PDRC)
PDRC is a general I/O port data register of port C.
Bit Bit Name
Initial
Value R/W Description
7 to 2 Reserved
1
0
PC1
PC0
0
0
R/W
R/W
These bits store output data for port C pins.
If PDRC is read while PCRC bits are set to 1, the value
stored in PDRC is read. If PDRC is read while PCRC bits
are cleared to 0, the pin states are read regardless of the
value stored in PDRC.
Section 9 I/O Ports
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9.7.3 Pin Functions
The correspondence between the register specification and the port functions is shown below.
• PC1/OSC2/CLKOUT pin
Register CKCSR PCRC
Bit Name PMRC1 PMRC0 PCRC1 Pin Function
0 PC1 input pin 0 X
1 PC1 output pin
0 X CLKOUT output pin
Setting value
1
1 X OSC2 oscillation pin
[Legend]
X: Don't care
• PC0/OSC1 pin
Register CKCSR PCRC
Bit Name PMRC0 PCRC0 Pin Function
0 PC0 input pin 0
1 PC0 output pin
Setting value
1 X OSC1 oscillation pin
[Legend]
X: Don't care
Section 10 Timer B1
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Section 10 Timer B1
Timer B1 is an 8-bit timer that increments each time a clock pulse is input. This timer has two
operating modes, interval and auto reload. Figure 10.1 shows a block diagram of timer B1.
10.1 Features
• Selection of seven internal clock sources (φ/8192, φ/2048, φ/512, φ/256, φ/64, φ/16, and φ/4)
• An interrupt is generated when the counter overflows.
[Legend]
TMB1:
φ
TCB1:
Timer mode register B1
Timer counter B1
TLB1:
IRRTB1:
Timer load register B1
Timer B1 interrupt request flag
PSS: Prescaler S
Internal data bus
TCB1
TMB1
PSS
TLB1
IRRTB1
Figure 10.1 Block Diagram of Timer B1
Section 10 Timer B1
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10.2 Register Descriptions
The timer B1 has the following registers.
• Timer mode register B1 (TMB1)
• Timer counter B1 (TCB1)
• Timer load register B1 (TLB1)
10.2.1 Timer Mode Register B1 (TMB1)
TMB1 selects the auto-reload function and input clock.
Bit Bit Name
Initial
Value R/W Description
7 TMB17 0 R/W Auto-Reload Function Select
0: Interval timer function selected
1: Auto-reload function selected
6 1 R/W Reserved
Although this bit is readable/writable, it should not be set
to 0.
5 to 3 All 1 Reserved
These bits are always read as 1.
2
1
0
TMB12
TMB11
TMB10
0
0
0
R/W
R/W
R/W
Clock Select
000: Internal clock: φ/8192
001: Internal clock: φ/2048
010: Internal clock: φ/512
011: Internal clock: φ/256
100: Internal clock: φ/64
101: Internal clock: φ/16
110: Internal clock: φ/4
111: Reserved (setting prohibited)
Section 10 Timer B1
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10.2.2 Timer Counter B1 (TCB1)
TCB1 is an 8-bit read-only up-counter, which is incremented by internal clock input. The clock
source for input to this counter is selected by bits TMB12 to TMB10 in TMB1. TCB1 values can
be read by the CPU at any time. When TCB1 overflows from H'FF to H'00 or to the value set in
TLB1, the IRRTB1 flag in IRR2 is set to 1. TCB1 is allocated to the same address as TLB1.
10.2.3 Timer Load Register B1 (TLB1)
TLB1 is an 8-bit write-only register for setting the reload value of TCB1. When a reload value is
set in TLB1, the same value is loaded into TCB1 as well, and TCB1 starts counting up from that
value. When TCB1 overflows during operation in auto-reload mode, the TLB1 value is loaded
into TCB1. Accordingly, overflow periods can be set within the range of 1 to 256 input clocks.
TLB1 is allocated to the same address as TCB1.
Section 10 Timer B1
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10.3 Operation
10.3.1 Interval Timer Operation
When bit TMB17 in TMB1 is cleared to 0, timer B1 functions as an 8-bit interval timer. Upon
reset, TCB1 is cleared to H'00 and bit TMB17 is cleared to 0, so up-counting and interval timing
resume immediately. The operating clock of timer B1 is selected from seven internal clock signals
output by prescaler S. The selection is made by the TMB12 to TMB10 bits in TMB1.
After the count value in TMB1 reaches H'FF, the next clock signal input causes timer B1 to
overflow, setting flag IRRTB1 in IRR2 to 1. If IENTB1 in IENR2 is 1, an interrupt is requested to
the CPU.
At overflow, TCB1 returns to H'00 and starts counting up again. During interval timer operation
(TMB17 = 0), when a value is set in TLB1, the same value is set in TCB1.
10.3.2 Auto-Reload Timer Operation
Setting bit TMB17 in TMB1 to 1 causes timer B1 to function as an 8-bit auto-reload timer. When
a reload value is set in TLB1, the same value is loaded into TCB1, becoming the value from which
TCB1 starts its count. After the count value in TCB1 reaches H'FF, the next clock signal input
causes timer B1 to overflow. The TLB1 value is then loaded into TCB1, and the count continues
from that value. The overflow period can be set within a range from 1 to 256 input clocks,
depending on the TLB1 value.
The clock sources and interrupts in auto-reload mode are the same as in interval mode. In auto-
reload mode (TMB17 = 1), when a new value is set in TLB1, the TLB1 value is also loaded into
TCB1.
Section 10 Timer B1
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10.4 Timer B1 Operating Modes
Table 10.1 shows the timer B1 operating modes.
Table 10.1 Timer B1 Opera ting Modes
Operating Mode Reset Active Sleep Subsleep Standby
Interval Reset Functions Functions Halted Halted TCB1
Auto-reload Reset Functions Functions Halted Halted
TMB1 Reset Functions Retained Retained Retained
Section 10 Timer B1
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Section 11 Timer V
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Section 11 Timer V
Timer V is an 8-bit timer based on an 8-bit counter. Timer V counts external events. Compare-
match signals with two registers can also be used to reset the counter, request an interrupt, or
output a pulse signal with an arbitrary duty cycle. Counting can be initiated by a trigger input at
the TRGV pin, enabling pulse output control to be synchronized to the trigger, with an arbitrary
delay from the trigger input. Figure 11.1 shows a block diagram of timer V.
11.1 Features
• Choice of seven clock signals is available.
Choice of six internal clock sources (φ/128, φ/64, φ/32, φ/16, φ/8, φ/4) or an external clock.
• Counter can be cleared by compare match A or B, or by an external reset signal. If the count
stop function is selected, the counter can be halted when cleared.
• Timer output is controlled by two independent compare match signals, enabling pulse output
with an arbitrary duty cycle, PWM output, and other applications.
• Three interrupt sources: compare match A, compare match B, timer overflow
• Counting can be initiated by trigger input at the TRGV pin. The rising edge, falling edge, or
both edges of the TRGV input can be selected.
Section 11 Timer V
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TRGV
TMCIV
TMRIV
TMOV
φ
Trigger
control
Clock select
Clear
control
Output
control
PSS
TCRV1
TCORB
Comparator
TCNTV
Comparator
TCORA
TCRV0
Interrupt
request
control
TCSRV
CMIA
CMIB
OVI
Internal data bus
[Legend]
TCORA: Time constant register A
TCORB: Time constant register B
TCNTV: Timer counter V
TCSRV: Timer control/status register V
TCRV0: Timer control register V0
TCRV1: Timer control register V1
PSS: Prescaler S
CMIA: Compare-match interrupt A
CMIB: Compare-match interrupt B
OVI: Overflow interrupt
Figure 11.1 Block Diagram of Timer V
Section 11 Timer V
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11.2 Input/Output Pins
Table 11.1 shows the timer V pin configuration.
Table 11.1 Pin Configuration
Name Abbreviation I/O Function
Timer V output TMOV Output Timer V waveform output
Timer V clock input TMCIV Input Clock input to TCNTV
Timer V reset input TMRIV Input External input to reset TCNTV
Trigger input TRGV Input Trigger input to initiate counting
11.3 Register Descriptions
Time V has the following registers.
• Timer counter V (TCNTV)
• Timer constant register A (TCORA)
• Timer constant register B (TCORB)
• Timer control register V0 (TCRV0)
• Timer control/status register V (TCSRV)
• Timer control register V1 (TCRV1)
11.3.1 Timer Counter V (TCNTV)
TCNTV is an 8-bit up-counter. The clock source is selected by bits CKS2 to CKS0 in timer
control register V0 (TCRV0). The TCNTV value can be read and written by the CPU at any time.
TCNTV can be cleared by an external reset input signal, or by compare match A or B. The
clearing signal is selected by bits CCLR1 and CCLR0 in TCRV0.
When TCNTV overflows, OVF is set to 1 in timer control/status register V (TCSRV).
TCNTV is initialized to H'00.
Section 11 Timer V
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11.3.2 Time Constant Registers A and B (TCORA, TCORB)
TCORA and TCORB have the same function.
TCORA and TCORB are 8-bit read/write registers.
TCORA and TCNTV are compared at all times. When the TCORA and TCNTV contents match,
CMFA is set to 1 in TCSRV. If CMIEA is also set to 1 in TCRV0, a CPU interrupt is requested.
Note that they must not be compared during the T3 state of a TCORA write cycle.
Timer output from the TMOV pin can be controlled by the identifying signal (compare match A)
and the settings of bits OS3 to OS0 in TCSRV.
TCORA and TCORB are initialized to H'FF.
11.3.3 Timer Control Register V0 (TCRV0)
TCRV0 selects the input clock signals of TCNTV, specifies the clearing conditions of TCNTV,
and controls each interrupt request.
Bit Bit Name
Initial
Value R/W Description
7 CMIEB 0 R/W Compare Match Interrupt Enable B
When this bit is set to 1, interrupt request from the CMFB
bit in TCSRV is enabled.
6 CMIEA 0 R/W Compare Match Interrupt Enable A
When this bit is set to 1, interrupt request from the CMFA
bit in TCSRV is enabled.
5 OVIE 0 R/W Timer Overflow Interrupt Enable
When this bit is set to 1, interrupt request from the OVF
bit in TCSRV is enabled.
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Bit Bit Name
Initial
Value R/W Description
4
3
CCLR1
CCLR0
0
0
R/W
R/W
Counter Clear 1 and 0
These bits specify the clearing conditions of TCNTV.
00: Clearing is disabled
01: Cleared by compare match A
10: Cleared by compare match B
11: Cleared on the rising edge of the TMRIV pin.
The operation of TCNTV after clearing depends on TRGE
in TCRV1.
2
1
0
CKS2
CKS1
CKS0
0
0
0
R/W
R/W
R/W
Clock Select 2 to 0
These bits select clock signals to input to TCNTV and the
counting condition in combination with ICKS0 in TCRV1.
Refer to table 11.2.
Table 11.2 Clock Signals to Input to TCNTV and Counting Conditions
TCRV0 TCRV1
Bit 2 Bit 1 Bit 0 Bit 0
CKS2 CKS1 CKS0 ICKS0 Description
0 Clock input prohibited
0 Internal clock: counts on φ/4, falling edge
0
1
1 Internal clock: counts on φ/8, falling edge
0 Internal clock: counts on φ/16, falling edge 0
1 Internal clock: counts on φ/32, falling edge
0 Internal clock: counts on φ/64, falling edge
0
1
1
1 Internal clock: counts on φ/128, falling edge
0 Clock input prohibited 0
1 External clock: counts on rising edge
0 External clock: counts on falling edge
1
1
1 External clock: counts on rising and falling
edge
Section 11 Timer V
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11.3.4 Timer Control/Status Register V (TCSRV)
TCSRV indicates the status flag and controls outputs by using a compare match.
Bit Bit Name
Initial
Value R/W Description
7 CMFB 0 R/W Compare Match Flag B
[Setting condition]
• When the TCNTV value matches the TCORB value
[Clearing condition]
• After reading CMFB = 1, cleared by writing 0 to CMFB
6 CMFA 0 R/W Compare Match Flag A
[Setting condition]
• When the TCNTV value matches the TCORA value
[Clearing condition]
• After reading CMFA = 1, cleared by writing 0 to CMFA
5 OVF 0 R/W Timer Overflow Flag
[Setting condition]
• When TCNTV overflows from H'FF to H'00
[Clearing condition]
• After reading OVF = 1, cleared by writing 0 to OVF
4 1 Reserved
This bit is always read as 1.
3
2
OS3
OS2
0
0
R/W
R/W
Output Select 3 and 2
These bits select an output method for the TMOV pin by
the compare match of TCORB and TCNTV.
00: No change
01: 0 output
10: 1 output
11: Output toggles
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Bit Bit Name
Initial
Value R/W Description
1
0
OS1
OS0
0
0
R/W
R/W
Output Select 1 and 0
These bits select an output method for the TMOV pin by
the compare match of TCORA and TCNTV.
00: No change
01: 0 output
10: 1 output
11: Output toggles
OS3 and OS2 select the output level for compare match B. OS1 and OS0 select the output level
for compare match A. The two output levels can be controlled independently. After a reset, the
timer output is 0 until the first compare match.
11.3.5 Timer Control Register V1 (TCRV1)
TCRV1 selects the edge at the TRGV pin, enables TRGV input, and selects the clock input to
TCNTV.
Bit Bit Name
Initial
Value R/W Description
7 to 5 All 1 Reserved
These bits are always read as 1.
4
3
TVEG1
TVEG0
0
0
R/W
R/W
TRGV Input Edge Select
These bits select the TRGV input edge.
00: TRGV trigger input is prohibited
01: Rising edge is selected
10: Falling edge is selected
11: Rising and falling edges are both selected
2 TRGE 0 R/W TCNT starts counting up by the input of the edge which is
selected by TVEG1 and TVEG0.
0: Disables starting counting-up TCNTV by the input of
the TRGV pin and halting counting-up TCNTV when
TCNTV is cleared by a compare match.
1: Enables starting counting-up TCNTV by the input of
the TRGV pin and halting counting-up TCNTV when
TCNTV is cleared by a compare match.
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Bit Bit Name
Initial
Value R/W Description
1 1 Reserved
This bit is always read as 1.
0 ICKS0 0 R/W Internal Clock Select 0
This bit selects clock signals to input to TCNTV in
combination with CKS2 to CKS0 in TCRV0.
Refer to table 11.2.
11.4 Operation
11.4.1 Timer V Operation
1. According to table 11.2, six internal/external clock signals output by prescaler S can be
selected as the timer V operating clock signals. When the operating clock signal is selected,
TCNTV starts counting-up. Figure 11.2 shows the count timing with an internal clock signal
selected, and figure 11.3 shows the count timing with both edges of an external clock signal
selected.
2. When TCNTV overflows (changes from H'FF to H'00), the overflow flag (OVF) in TCRV0
will be set. The timing at this time is shown in figure 11.4. An interrupt request is sent to the
CPU when OVIE in TCRV0 is 1.
3. TCNTV is constantly compared with TCORA and TCORB. Compare match flag A or B
(CMFA or CMFB) is set to 1 when TCNTV matches TCORA or TCORB, respectively. The
compare-match signal is generated in the last state in which the values match. Figure 11.5
shows the timing. An interrupt request is generated for the CPU when CMIEA or CMIEB in
TCRV0 is 1.
4. When a compare match A or B is generated, the TMOV responds with the output value
selected by bits OS3 to OS0 in TCSRV. Figure 11.6 shows the timing when the output is
toggled by compare match A.
5. When CCLR1 or CCLR0 in TCRV0 is 01 or 10, TCNTV can be cleared by the corresponding
compare match. Figure 11.7 shows the timing.
6. When CCLR1 or CCLR0 in TCRV0 is 11, TCNTV can be cleared by the rising edge of the
input of TMRIV pin. A TMRIV input pulse-width of at least 1.5 system clocks is necessary.
Figure 11.8 shows the timing.
7. When a counter-clearing source is generated with TRGE in TCRV1 set to 1, the counting-up is
halted as soon as TCNTV is cleared. TCNTV resumes counting-up when the edge selected by
TVEG1 or TVEG0 in TCRV1 is input from the TGRV pin.
Section 11 Timer V
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N – 1 N + 1N
φ
Internal clock
TCNTV input
clock
TCNTV
Figure 11.2 Increment Timing with Internal Clock
N – 1 N + 1N
φ
TMCIV
(External clock
input pin)
TCNTV input
clock
TCNTV
Figure 11.3 Increment Timing with External Clock
H'FF H'00
φ
TCNTV
Overflow signal
OVF
Figure 11.4 OVF Set Timing
Section 11 Timer V
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N
N
N+1
φ
TCNTV
TCORA or
TCORB
Compare match
signal
CMFA or
CMFB
Figure 11.5 CMFA and CMFB Set Timing
φ
Compare match
A signal
Timer V output
pin
Figure 11.6 TMOV Output Timing
N H'00
φ
Compare match
A signal
TCNTV
Figure 11.7 Clear Timing by Compare Match
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N – 1 N H'00
φ
TMRIV
(External counter
reset input pin)
TCNTV reset signal
TCNTV
Figure 11.8 Clear Timing by TMRIV Input
11.5 Timer V Application Examples
11.5.1 Pulse Output with Arbitrary Duty Cycle
Figure 11.9 shows an example of output of pulses with an arbitrary duty cycle.
1. Set bits CCLR1 and CCLR0 in TCRV0 so that TCNTV will be cleared by compare match with
TCORA.
2. Set bits OS3 to OS0 in TCSRV so that the output will go to 1 at compare match with TCORA
and to 0 at compare match with TCORB.
3. Set bits CKS2 to CKS0 in TCRV0 and bit ICKS0 in TCRV1 to select the desired clock source.
4. With these settings, a waveform is output without further software intervention, with a period
determined by TCORA and a pulse width determined by TCORB.
Counter cleared
Time
TCNTV value
H'FF
TCORA
TCORB
H'00
TMOV
Figure 11.9 Pulse Output Example
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11.5.2 Pulse Output with Arbitrary Pulse Width and Delay from TRGV Input
The trigger function can be used to output a pulse with an arbitrary pulse width at an arbitrary
delay from the TRGV input, as shown in figure 11.10. To set up this output:
1. Set bits CCLR1 and CCLR0 in TCRV0 so that TCNTV will be cleared by compare match with
TCORB.
2. Set bits OS3 to OS0 in TCSRV so that the output will go to 1 at compare match with TCORA
and to 0 at compare match with TCORB.
3. Set bits TVEG1 and TVEG0 in TCRV1 and set TRGE to select the falling edge of the TRGV
input.
4. Set bits CKS2 to CKS0 in TCRV0 and bit ICKS0 in TCRV1 to select the desired clock source.
5. After these settings, a pulse waveform will be output without further software intervention,
with a delay determined by TCORA from the TRGV input, and a pulse width determined by
(TCORB to TCORA).
Counter cleared
H'FF
TCORA
TCORB
H'00
TRGV
TMOV
Compare match A
Compare match B
clears TCNTV and
halts count-up
Compare match B
clears TCNTV and
halts count-up
Compare match A
TCNTV value
Time
Figure 11.10 Example of Pulse Output Synchronized to TRGV Input
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11.6 Usage Notes
The following types of contention or operation can occur in timer V operation.
1. Writing to registers is performed in the T3 state of a TCNTV write cycle. If a TCNTV clear
signal is generated in the T3 state of a TCNTV write cycle, as shown in figure 11.11, clearing
takes precedence and the write to the counter is not carried out. If counting-up is generated in
the T3 state of a TCNTV write cycle, writing takes precedence.
2. If a compare match is generated in the T3 state of a TCORA or TCORB write cycle, the write
to TCORA or TCORB takes precedence and the compare match signal is inhibited. Figure
11.12 shows the timing.
3. If compare matches A and B occur simultaneously, any conflict between the output selections
for compare match A and compare match B is resolved by the following priority: toggle
output > output 1 > output 0.
4. Depending on the timing, TCNTV may be incremented by a switch between different internal
clock sources. When TCNTV is internally clocked, an increment pulse is generated from the
falling edge of an internal clock signal, that is divided system clock (φ). Therefore, as shown
in figure 11.13 the switch is from a high clock signal to a low clock signal, the switchover is
seen as a falling edge, causing TCNTV to increment. TCNTV can also be incremented by a
switch between internal and external clocks.
φ
Address TCNTV address
TCNTV write cycle by CPU
Internal write signal
Counter clear signal
TCNTV N H'00
T
1
T
2
T
3
Figure 11.11 Contention between TCNTV Write and Clear
Section 11 Timer V
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φ
Address TCORA address
Internal write signal
TCNTV
TCORA
N
N
N+1
M
TCORA write data
Inhibited
T1T2T3
TCORA write cycle by CPU
Compare match signal
Figure 11.12 Contention between TCORA Write and Compare Match
Clock before
switching
Clock after
switching
Count clock
TCNTV N N+1 N+2
Write to CKS1 and CKS0
Figure 11.13 Internal Clock Switching and TCNTV Operation
Section 12 Timer W
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Section 12 Timer W
The timer W has a 16-bit timer having output compare and input capture functions. The timer W
can count external events and output pulses with an arbitrary duty cycle by compare match
between the timer counter and four general registers. Thus, it can be applied to various systems.
12.1 Features
• Selection of five counter clock sources: four internal clocks (φ, φ/2, φ/4, and φ/8) and an
external clock (external events can be counted)
• Capability to process up to four pulse outputs or four pulse inputs
• Four general registers:
Independently assignable output compare or input capture functions
Usable as two pairs of registers; one register of each pair operates as a buffer for the output
compare or input capture register
• Four selectable operating modes:
Waveform output by compare match
Selections of 0 output, 1 output, or toggle output
Input capture function
Rising edge, falling edge, or both edges
Counter clearing function
Counters can be cleared by compare match
PWM mode
Up to three-phase PWM output can be provided with desired duty ratio.
• Any initial timer output value can be set
• Five interrupt sources
Four compare match/input capture interrupts and an overflow interrupt.
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Table 12.1 summarizes the timer W functions, and figure 12.1 shows a block diagram of the timer
W.
Table 12.1 Timer W Functions
Input/Output Pins
Item Counter FTIOA FTIOB FTIOC FTIOD
Count clock Internal clocks: φ, φ/2, φ/4, φ/8
External clock: FTCI
General registers
(output compare/input
capture registers)
Period
specified in
GRA
GRA GRB GRC (buffer
register for
GRA in
buffer mode)
GRD (buffer
register for
GRB in buffer
mode)
Counter clearing function GRA
compare
match
GRA
compare
match
— — —
Initial output value
setting function
— Yes Yes Yes Yes
Buffer function — Yes Yes — —
Compare 0 — Yes Yes Yes Yes
match output 1 — Yes Yes Yes Yes
Toggle — Yes Yes Yes Yes
Input capture function — Yes Yes Yes Yes
PWM mode — — Yes Yes
Yes
Interrupt sources Overflow Compare
match/input
capture
Compare
match/input
capture
Compare
match/input
capture
Compare
match/input
capture
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Internal clock:
External clock: FTCI
FTIOA
FTIOB
FTIOC
FTIOD
IRRTW
Control logic
Clock
selector
Comparator
TCNT
Internal
data bus
Bus interface
[Legend]
TMRW: Timer mode register W (8 bits)
TCRW: Timer control register W (8 bits)
TIERW: Timer interrupt enable register W (8 bits)
TSRW: Timer status register W (8 bits)
TIOR: Timer I/O control register (8 bits)
TCNT: Timer counter (16 bits)
GRA: General register A (input capture/output compare register: 16 bits)
GRB: General register B (input capture/output compare register: 16 bits)
GRC: General register C (input capture/output compare register: 16 bits)
GRD: General register D (input capture/output compare register: 16 bits)
IRRTW: Timer W interrupt request
GRA
GRB
GRC
GRD
TMRW
TCRW
TIERW
TSRW
TIOR
φ
φ/2
φ/4
φ/8
Figure 12.1 Timer W Block Diagram
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12.2 Input/Output Pins
Table 12.2 summarizes the timer W pins.
Table 12.2 Pin Configuration
Name Abbreviation Input/Output Function
External clock input FTCI Input External clock input pin
Input capture/output
compare A
FTIOA Input/output Output pin for GRA output compare or
input pin for GRA input capture
Input capture/output
compare B
FTIOB Input/output Output pin for GRB output compare,
input pin for GRB input capture, or
PWM output pin in PWM mode
Input capture/output
compare C
FTIOC Input/output Output pin for GRC output compare,
input pin for GRC input capture, or
PWM output pin in PWM mode
Input capture/output
compare D
FTIOD Input/output Output pin for GRD output compare,
input pin for GRD input capture, or
PWM output pin in PWM mode
12.3 Register Descriptions
The timer W has the following registers.
• Timer mode register W (TMRW)
• Timer control register W (TCRW)
• Timer interrupt enable register W (TIERW)
• Timer status register W (TSRW)
• Timer I/O control register 0 (TIOR0)
• Timer I/O control register 1 (TIOR1)
• Timer counter (TCNT)
• General register A (GRA)
• General register B (GRB)
• General register C (GRC)
• General register D (GRD)
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12.3.1 Timer Mode Register W (TMRW)
TMRW selects the general register functions and the timer output mode.
Bit Bit Name
Initial
Value R/W Description
7 CTS 0 R/W Counter Start
The counter operation is halted when this bit is 0, while it
can be performed when this bit is 1.
6 1 Reserved
This bit is always read as 1.
5 BUFEB 0 R/W Buffer Operation B
Selects the GRD function.
0: GRD operates as an input capture/output compare
register
1: GRD operates as the buffer register for GRB
4 BUFEA 0 R/W Buffer Operation A
Selects the GRC function.
0: GRC operates as an input capture/output compare
register
1: GRC operates as the buffer register for GRA
3 1 Reserved
This bit is always read as 1.
2 PWMD 0 R/W PWM Mode D
Selects the output mode of the FTIOD pin.
0: FTIOD operates normally (output compare output)
1: PWM output
1 PWMC 0 R/W PWM Mode C
Selects the output mode of the FTIOC pin.
0: FTIOC operates normally (output compare output)
1: PWM output
0 PWMB 0 R/W PWM Mode B
Selects the output mode of the FTIOB pin.
0: FTIOB operates normally (output compare output)
1: PWM output
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12.3.2 Timer Control Register W (TCRW)
TCRW selects the timer counter clock source, selects a clearing condition, and specifies the timer
output levels.
Bit Bit Name
Initial
Value R/W Description
7 CCLR 0 R/W Counter Clear
The TCNT value is cleared by compare match A when
this bit is 1. When it is 0, TCNT operates as a free-
running counter.
6
5
4
CKS2
CKS1
CKS0
0
0
0
R/W
R/W
R/W
Clock Select 2 to 0
Select the TCNT clock source.
000: Internal clock: counts on φ
001: Internal clock: counts on φ/2
010: Internal clock: counts on φ/4
011: Internal clock: counts on φ/8
1XX: Counts on rising edges of the external event (FTCI)
When the internal clock source (φ) is selected, subclock
sources are counted in subactive and subsleep modes.
3 TOD 0 R/W Timer Output Level Setting D
Sets the output value of the FTIOD pin until the first
compare match D is generated.
0: Output value is 0*
1: Output value is 1*
2 TOC 0 R/W Timer Output Level Setting C
Sets the output value of the FTIOC pin until the first
compare match C is generated.
0: Output value is 0*
1: Output value is 1*
1 TOB 0 R/W Timer Output Level Setting B
Sets the output value of the FTIOB pin until the first
compare match B is generated.
0: Output value is 0*
1: Output value is 1*
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Bit Bit Name
Initial
Value R/W Description
0 TOA 0 R/W Timer Output Level Setting A
Sets the output value of the FTIOA pin until the first
compare match A is generated.
0: Output value is 0*
1: Output value is 1*
[Legend]
X: Don't care
Note: * The change of the setting is immediately reflected in the output value.
12.3.3 Timer Interrupt Enable Register W (TIERW)
TIERW controls the timer W interrupt request.
Bit Bit Name
Initial
Value R/W Description
7 OVIE 0 R/W Timer Overflow Interrupt Enable
When this bit is set to 1, FOVI interrupt requested by OVF
flag in TSRW is enabled.
6 to 4 All 1 Reserved
These bits are always read as 1.
3 IMIED 0 R/W Input Capture/Compare Match Interrupt Enable D
When this bit is set to 1, IMID interrupt requested by
IMFD flag in TSRW is enabled.
2 IMIEC 0 R/W Input Capture/Compare Match Interrupt Enable C
When this bit is set to 1, IMIC interrupt requested by
IMFC flag in TSRW is enabled.
1 IMIEB 0 R/W Input Capture/Compare Match Interrupt Enable B
When this bit is set to 1, IMIB interrupt requested by
IMFB flag in TSRW is enabled.
0 IMIEA 0 R/W Input Capture/Compare Match Interrupt Enable A
When this bit is set to 1, IMIA interrupt requested by
IMFA flag in TSRW is enabled.
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12.3.4 Timer Status Register W (TSRW)
TSRW shows the status of interrupt requests.
Bit Bit Name
Initial
Value R/W Description
7 OVF 0 R/W Timer Overflow Flag
[Setting condition]
• When TCNT overflows from H'FFFF to H'0000
[Clearing condition]
• Read OVF when OVF = 1, then write 0 in OVF
6 to 4 All 1 Reserved
These bits are always read as 1.
3 IMFD 0 R/W Input Capture/Compare Match Flag D
[Setting conditions]
• TCNT = GRD when GRD functions as an output
compare register
• The TCNT value is transferred to GRD by an input
capture signal when GRD functions as an input
capture register
[Clearing condition]
• Read IMFD when IMFD = 1, then write 0 in IMFD
2 IMFC 0 R/W Input Capture/Compare Match Flag C
[Setting conditions]
• TCNT = GRC when GRC functions as an output
compare register
• The TCNT value is transferred to GRC by an input
capture signal when GRC functions as an input
capture register
[Clearing condition]
• Read IMFC when IMFC = 1, then write 0 in IMFC
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Bit Bit Name
Initial
Value R/W Description
1 IMFB 0 R/W Input Capture/Compare Match Flag B
[Setting conditions]
• TCNT = GRB when GRB functions as an output
compare register
• The TCNT value is transferred to GRB by an input
capture signal when GRB functions as an input
capture register
[Clearing condition]
• Read IMFB when IMFB = 1, then write 0 in IMFB
0 IMFA 0 R/W Input Capture/Compare Match Flag A
[Setting conditions]
• TCNT = GRA when GRA functions as an output
compare register
• The TCNT value is transferred to GRA by an input
capture signal when GRA functions as an input
capture register
[Clearing condition]
• Read IMFA when IMFA = 1, then write 0 in IMFA
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12.3.5 Timer I/O Control Register 0 (TIOR0)
TIOR0 selects the functions of GRA and GRB, and specifies the functions of the FTIOA and
FTIOB pins.
Bit Bit Name
Initial
Value R/W Description
7 1 Reserved
This bit is always read as 1.
6 IOB2 0 R/W I/O Control B2
Selects the GRB function.
0: GRB functions as an output compare register
1: GRB functions as an input capture register
5
4
IOB1
IOB0
0
0
R/W
R/W
I/O Control B1 and B0
When IOB2 = 0,
00: No output at compare match
01: 0 output to the FTIOB pin at GRB compare match
10: 1 output to the FTIOB pin at GRB compare match
11: Output toggles to the FTIOB pin at GRB compare
match
When IOB2 = 1,
00: Input capture at rising edge at the FTIOB pin
01: Input capture at falling edge at the FTIOB pin
1X: Input capture at rising and falling edges of the FTIOB
pin
3 1 Reserved
This bit is always read as 1.
2 IOA2 0 R/W I/O Control A2
Selects the GRA function.
0: GRA functions as an output compare register
1: GRA functions as an input capture register
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Bit Bit Name
Initial
Value R/W Description
1
0
IOA1
IOA0
0
0
R/W
R/W
I/O Control A1 and A0
When IOA2 = 0,
00: No output at compare match
01: 0 output to the FTIOA pin at GRA compare match
10: 1 output to the FTIOA pin at GRA compare match
11: Output toggles to the FTIOA pin at GRA compare
match
When IOA2 = 1,
00: Input capture at rising edge of the FTIOA pin
01: Input capture at falling edge of the FTIOA pin
1X: Input capture at rising and falling edges of the FTIOA
pin
[Legend]
X: Don't care
12.3.6 Timer I/O Control Register 1 (TIOR1)
TIOR1 selects the functions of GRC and GRD, and specifies the functions of the FTIOC and
FTIOD pins.
Bit Bit Name
Initial
Value R/W Description
7 1 Reserved
This bit is always read as 1.
6 IOD2 0 R/W I/O Control D2
Selects the GRD function.
0: GRD functions as an output compare register
1: GRD functions as an input capture register
When GRB buffer operation has been selected by
BUFEB in TMRW, select the same function as GRB.
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Bit Bit Name
Initial
Value R/W Description
5
4
IOD1
IOD0
0
0
R/W
R/W
I/O Control D1 and D0
When IOD2 = 0,
00: No output at compare match
01: 0 output to the FTIOD pin at GRD compare match
10: 1 output to the FTIOD pin at GRD compare match
11: Output toggles to the FTIOD pin at GRD compare
match
When IOD2 = 1,
00: Input capture at rising edge at the FTIOD pin
01: Input capture at falling edge at the FTIOD pin
1X: Input capture at rising and falling edges at the FTIOD
pin
3 1 Reserved
This bit is always read as 1.
2 IOC2 0 R/W I/O Control C2
Selects the GRC function.
0: GRC functions as an output compare register
1: GRC functions as an input capture register
When GRA buffer operation has been selected by
BUFEA in TMRW, select the same function as GRA.
1
0
IOC1
IOC0
0
0
R/W
R/W
I/O Control C1 and C0
When IOC2 = 0,
00: No output at compare match
01: 0 output to the FTIOC pin at GRC compare match
10: 1 output to the FTIOC pin at GRC compare match
11: Output toggles to the FTIOC pin at GRC compare
match
When IOC2 = 1,
00: Input capture to GRC at rising edge of the FTIOC pin
01: Input capture to GRC at falling edge of the FTIOC pin
1X: Input capture to GRC at rising and falling edges of
the FTIOC pin
[Legend]
X: Don't care
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12.3.7 Timer Counter (TCNT)
TCNT is a 16-bit readable/writable up-counter. The clock source is selected by bits CKS2 to
CKS0 in TCRW. TCNT can be cleared to H'0000 through a compare match with GRA by setting
the CCLR in TCRW to 1. When TCNT overflows (changes from H'FFFF to H'0000), the OVF
flag in TSRW is set to 1. If OVIE in TIERW is set to 1 at this time, an interrupt request is
generated. TCNT must always be read or written in 16-bit units; 8-bit access is not allowed.
TCNT is initialized to H'0000 by a reset.
12.3.8 General Registers A to D (GRA to GRD)
Each general register is a 16-bit readable/writable register that can function as either an output-
compare register or an input-capture register. The function is selected by settings in TIOR0 and
TIOR1.
When a general register is used as an input-compare register, its value is constantly compared with
the TCNT value. When the two values match (a compare match), the corresponding flag (IMFA,
IMFB, IMFC, or IMFD) in TSRW is set to 1. An interrupt request is generated at this time, when
IMIEA, IMIEB, IMIEC, or IMIED is set to 1. Compare match output can be selected in TIOR.
When a general register is used as an input-capture register, an external input-capture signal is
detected and the current TCNT value is stored in the general register. The corresponding flag
(IMFA, IMFB, IMFC, or IMFD) in TSRW is set to 1. If the corresponding interrupt-enable bit
(IMIEA, IMIEB, IMIEC, or IMIED) in TSRW is set to 1 at this time, an interrupt request is
generated. The edge of the input-capture signal is selected in TIOR.
GRC and GRD can be used as buffer registers of GRA and GRB, respectively, by setting BUFEA
and BUFEB in TMRW.
For example, when GRA is set as an output-compare register and GRC is set as the buffer register
for GRA, the value in the buffer register GRC is sent to GRA whenever compare match A is
generated.
When GRA is set as an input-capture register and GRC is set as the buffer register for GRA, the
value in TCNT is transferred to GRA and the value in the buffer register GRC is transferred to
GRA whenever an input capture is generated.
GRA to GRD must be written or read in 16-bit units; 8-bit access is not allowed. GRA to GRD are
initialized to H'FFFF by a reset.
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12.4 Operation
The timer W has the following operating modes.
• Normal Operation
• PWM Operation
12.4.1 Normal Operation
TCNT performs free-running or periodic counting operations. After a reset, TCNT is set as a free-
running counter. When the CTS bit in TMRW is set to 1, TCNT starts incrementing the count.
When the count overflows from H'FFFF to H'0000, the OVF flag in TSRW is set to 1. If the OVIE
in TIERW is set to 1, an interrupt request is generated. Figure 12.2 shows free-running counting.
TCNT value
H'FFFF
H'0000
CTS bit
OVF
Time
Flag cleared
by software
Figure 12.2 Free-Running Counter Operation
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Periodic counting operation can be performed when GRA is set as an output compare register and
bit CCLR in TCRW is set to 1. When the count matches GRA, TCNT is cleared to H'0000, the
IMFA flag in TSRW is set to 1. If the corresponding IMIEA bit in TIERW is set to 1, an interrupt
request is generated. TCNT continues counting from H'0000. Figure 12.3 shows periodic
counting.
TCNT value
GRA
H'0000
CTS bit
IMFA
Time
Flag cleared
by software
Figure 12.3 Periodic Counter Operation
By setting a general register as an output compare register, compare match A, B, C, or D can
cause the output at the FTIOA, FTIOB, FTIOC, or FTIOD pin to output 0, output 1, or toggle.
Figure 12.4 shows an example of 0 and 1 output when TCNT operates as a free-running counter, 1
output is selected for compare match A, and 0 output is selected for compare match B. When
signal is already at the selected output level, the signal level does not change at compare match.
TCNT value
H'FFFF
H'0000
FTIOA
FTIOB
Time
GRA
GRB
No change No change
No change No change
Figure 12.4 0 and 1 Output Example (TOA = 0, TOB = 1)
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Figure 12.5 shows an example of toggle output when TCNT operates as a free-running counter,
and toggle output is selected for both compare match A and B.
TCNT value
H'FFFF
H'0000
FTIOA
FTIOB
Time
GRA
GRB
Toggle output
Toggle output
Figure 12.5 Toggle Output Example (TOA = 0, TOB = 1)
Figure 12.6 shows another example of toggle output when TCNT operates as a periodic counter,
cleared by compare match A. Toggle output is selected for both compare match A and B.
TCNT value
H'FFFF
H'0000
FTIOA
FTIOB
Time
GRA
GRB
Toggle
output
Toggle
output
Counter cleared by compare match with GRA
Figure 12.6 Toggle Output Example (TOA = 0, TOB = 1)
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The TCNT value can be captured into a general register (GRA, GRB, GRC, or GRD) when a
signal level changes at an input-capture pin (FTIOA, FTIOB, FTIOC, or FTIOD). Capture can
take place on the rising edge, falling edge, or both edges. By using the input-capture function, the
pulse width and periods can be measured. Figure 12.7 shows an example of input capture when
both edges of FTIOA and the falling edge of FTIOB are selected as capture edges. TCNT operates
as a free-running counter.
TCNT value
H'FFFF
H'1000
H'0000
FTIOA
GRA
Time
H'AA55
H'55AA
H'F000
H'1000 H'F000 H'55AA
GRB H'AA55
FTIOB
Figure 12.7 Input Capture Operating Example
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Figure 12.8 shows an example of buffer operation when the GRA is set as an input-capture
register and GRC is set as the buffer register for GRA. TCNT operates as a free-running counter,
and FTIOA captures both rising and falling edge of the input signal. Due to the buffer operation,
the GRA value is transferred to GRC by input-capture A and the TCNT value is stored in GRA.
TCNT value
H'DA91
H'0245
H'0000
GRC
Time
H'0245
FTIOA
GRA H'5480H'0245
H'FFFF
H'5480
H'5480
H'DA91
Figure 12.8 Buffer Operation Example (Input Capture)
12.4.2 PWM Operation
In PWM mode, PWM waveforms are generated by using GRA as the period register and GRB,
GRC, and GRD as duty registers. PWM waveforms are output from the FTIOB, FTIOC, and
FTIOD pins. Up to three-phase PWM waveforms can be output. In PWM mode, a general register
functions as an output compare register automatically. The output level of each pin depends on the
corresponding timer output level set bit (TOB, TOC, and TOD) in TCRW. When TOB is 1, the
FTIOB output goes to 1 at compare match A and to 0 at compare match B. When TOB is 0, the
FTIOB output goes to 0 at compare match A and to 1 at compare match B. Thus the compare
match output level settings in TIOR0 and TIOR1 are ignored for the output pin set to PWM mode.
If the same value is set in the cycle register and the duty register, the output does not change when
a compare match occurs.
Figure 12.9 shows an example of operation in PWM mode. The output signals go to 1 and TCNT
is cleared at compare match A, and the output signals go to 0 at compare match B, C, and D
(TOB, TOC, and TOD = 1: initial output values are set to 1).
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TCNT value
GRA
GRB
GRC
H'0000
FTIOB
FTIOC
FTIOD
Time
GRD
Counter cleared by compare match A
Figure 12.9 PWM Mode Example (1)
Figure 12.10 shows another example of operation in PWM mode. The output signals go to 0 and
TCNT is cleared at compare match A, and the output signals go to 1 at compare match B, C, and
D (TOB, TOC, and TOD = 0: initial output values are set to 1).
TCNT value
GRA
GRB
GRC
H'0000
FTIOB
FTIOC
FTIOD
Time
GRD
Counter cleared by compare match A
Figure 12.10 PWM Mode Example (2)
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Figure 12.11 shows an example of buffer operation when the FTIOB pin is set to PWM mode and
GRD is set as the buffer register for GRB. TCNT is cleared by compare match A, and FTIOB
outputs 1 at compare match B and 0 at compare match A.
Due to the buffer operation, the FTIOB output level changes and the value of buffer register GRD
is transferred to GRB whenever compare match B occurs. This procedure is repeated every time
compare match B occurs.
TCNT value
GRA
H'0000
GRD
Time
GRB
H'0200 H'0520
FTIOB
H'0200
H'0450 H'0520
H'0450
GRB H'0450 H'0520
H'0200
Figure 12.11 Buffer Operation Example (Output Compare)
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Figures 12.12 and 12.13 show examples of the output of PWM waveforms with duty cycles of 0%
and 100%.
TCNT value
GRA
H'0000
FTIOB
Time
GRB
Duty 0%
Write to GRB
Write to GRB
TCNT value
GRA
H'0000
FTIOB
Time
GRB
Duty 100%
Write to GRB
Write to GRB
Output does not change when cycle register
and duty register compare matches occur
simultaneously.
TCNT value
GRA
H'0000
FTIOB
Time
GRB
Duty 100%
Write to GRB
Write to GRB
Write to GRB
Output does not change when cycle register
and duty register compare matches occur
simultaneously.
Duty 0%
Write to GRB
Figure 12.12 PWM Mode Example
(TOB, TOC, and TOD = 0: Initial Output Values are Set to 0)
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TCNT value
GRA
H'0000
FTIOB
Time
GRB
Duty 100%
Write to GRB
TCNT value
GRA
H'0000
FTIOB
Time
GRB
Duty 0%
Write to GRB
Write to GRB
Output does not change when cycle register
and duty register compare matches occur
simultaneously.
TCNT value
GRA
H'0000
FTIOB
Time
GRB
Duty 0%
Write to GRB
Write to GRB
Output does not change when cycle register
and duty register compare matches occur
simultaneously.
Duty 100%
Write to GRB
Write to GRB
Write to GRB
Figure 12.13 PWM Mode Example
(TOB, TOC, and TOD = 1: Initial Output Values are Set to 1)
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12.5 Operation Timing
12.5.1 TCNT Count Timing
Figure 12.14 shows the TCNT count timing when the internal clock source is selected. Figure
12.15 shows the timing when the external clock source is selected. The pulse width of the external
clock signal must be at least two system clock (φ) cycles; shorter pulses will not be counted
correctly.
TCNT
TCNT input
clock
Internal
clock
φ
NN+1 N+2
Rising edge
Figure 12.14 Count Timing for Internal Clock Source
TCNT
TCNT input
clock
External
clock
φ
NN+1N+2
Rising edge Rising edge
Figure 12.15 Count Timing for External Clock Source
Section 12 Timer W
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12.5.2 Output Compare Output Timing
The compare match signal is generated in the last state in which TCNT and GR match (when
TCNT changes from the matching value to the next value). When the compare match signal is
generated, the output value selected in TIOR is output at the compare match output pin (FTIOA,
FTIOB, FTIOC, or FTIOD).
When TCNT matches GR, the compare match signal is generated only after the next counter clock
pulse is input.
Figure 12.16 shows the output compare timing.
GRA to GRD
TCNT
TCNT input
clock
φ
N
NN+1
Compare
match signal
FTIOA to FTIOD
Figure 12.16 Output Compare Output Timing
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12.5.3 Input Capture Timing
Input capture on the rising edge, falling edge, or both edges can be selected through settings in
TIOR0 and TIOR1. Figure 12.17 shows the timing when the falling edge is selected. The pulse
width of the input capture signal must be at least two system clock (φ) cycles; shorter pulses will
not be detected correctly.
TCNT
Input capture
input
φ
N–1 N N+1 N+2
N
GRA to GRD
Input capture
signal
Figure 12.17 Input Capture Input Signal Timing
12.5.4 Timing of Counter Clearing by Compare Ma tch
Figure 12.18 shows the timing when the counter is cleared by compare match A. When the GRA
value is N, the counter counts from 0 to N, and its cycle is N + 1.
TCNT
Compare
match signal
φ
GRA N
N H'0000
Figure 12.18 Timing of Counter Clearing by Compare Match
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12.5.5 Buffer Operation Timing
Figures 12.19 and 12.20 show the buffer operation timing.
GRC, GRD
Compare
match signal
TCNT
φ
GRA, GRB
NN+1
M
M
Figure 12.19 Buffer Operation Timing (Compare Match)
GRA, GRB
TCNT
Input capture
signal
φ
GRC, GRD
N
M
MN+1
N
NN+1
Figure 12.20 Buffer Operation Timing (Input Capture)
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12.5.6 Timing of IMFA to IMFD Fl ag Setti n g a t Compare Match
If a general register (GRA, GRB, GRC, or GRD) is used as an output compare register, the
corresponding IMFA, IMFB, IMFC, or IMFD flag is set to 1 when TCNT matches the general
register.
The compare match signal is generated in the last state in which the values match (when TCNT is
updated from the matching count to the next count). Therefore, when TCNT matches a general
register, the compare match signal is generated only after the next TCNT clock pulse is input.
Figure 12.21 shows the timing of the IMFA to IMFD flag setting at compare match.
GRA to GRD
TCNT
TCNT input
clock
φ
N
NN+1
Compare
match signal
IMFA to IMFD
IRRTW
Figure 12.21 Timing of IMFA to IMFD Flag Setting at Compare Match
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12.5.7 Timing of IMFA to IMFD Setting at Input Capture
If a general register (GRA, GRB, GRC, or GRD) is used as an input capture register, the
corresponding IMFA, IMFB, IMFC, or IMFD flag is set to 1 when an input capture occurs. Figure
12.22 shows the timing of the IMFA to IMFD flag setting at input capture.
GRA to GRD
TCNT
Input capture
signal
φ
N
N
IMFA to IMFD
IRRTW
Figure 12.22 Timing of IMFA to IMFD Flag Setting at Input Capture
12.5.8 Timing of Status Flag Clearing
When the CPU reads a status flag while it is set to 1, then writes 0 in the status flag, the status flag
is cleared. Figure 12.23 shows the status flag clearing timing.
IMFA to IMFD
Write signal
Address
φ
TSRW address
IRRTW
TSRW write cycle
T1 T2
Figure 12.23 Timing of Status Flag Clearing by CPU
Section 12 Timer W
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12.6 Usage Notes
The following types of contention or operation can occur in timer W operation.
1. The pulse width of the input clock signal and the input capture signal must be at least two
system clock (φ) cycles; shorter pulses will not be detected correctly.
2. Writing to registers is performed in the T2 state of a TCNT write cycle.
If counter clear signal occurs in the T2 state of a TCNT write cycle, clearing of the counter
takes priority and the write is not performed, as shown in figure 12.24. If counting-up is
generated in the TCNT write cycle to contend with the TCNT counting-up, writing takes
precedence.
3. Depending on the timing, TCNT may be incremented by a switch between different internal
clock sources. When TCNT is internally clocked, an increment pulse is generated from the
rising edge of an internal clock signal, that is divided system clock (φ). Therefore, as shown in
figure 12.25 the switch is from a low clock signal to a high clock signal, the switchover is seen
as a rising edge, causing TCNT to increment.
4. If timer W enters module standby mode while an interrupt request is generated, the interrupt
request cannot be cleared. Before entering module standby mode, disable interrupt requests.
5. The TOA to TOD bits in TCRW decide the value of the FTIO pin, which is output until the
first compare match occurs. Once a compare match occurs and this compare match changes the
values of FTIOA to FTIOD output, the values of the FTIOA to FTIOD pin output and the
values read from the TOA to TOD bits may differ. Moreover, when the writing to TCRW and
the generation of the compare match A to D occur at the same timing, the writing to TCRW
has the priority. Thus, output change due to the compare match is not reflected to the FTIOA
to FTIOD pins. Therefore, when bit manipulation instruction is used to write to TCRW, the
values of the FTIOA to FTIOD pin output may result in an unexpected result. When TCRW is
to be written to while compare match is operating, stop the counter once before accessing to
TCRW, read the port 8 state to reflect the values of FTIOA to FTIOD output, to TOA to TOD,
and then restart the counter. Figure 12.26 shows an example when the compare match and the
bit manipulation instruction to TCRW occur at the same timing.
Section 12 Timer W
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Counter clear
signal
Write signal
Address
φ
TCNT address
TCNT
TCNT write cycle
T1 T2
NH'0000
Figure 12.24 Contention between TCNT Write and Clear
TCNT
Clock before switching
NN+1 N+2 N+3
Clock after switching
Count clock
The change in signal level at clock switching is
assumed to be a rising edge, and TCNT
increments the count.
Figure 12.25 Internal Clock Switching and TCNT Operation
Section 12 Timer W
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Compare match
signal B
φ
FTIOB pin
TCRW
write signal
Set value
Bit
TCRW
0
CCLR
0
CKS2
0
CKS1
0
CKS0
0
TOD
1
TOC
1
TOB
0
765 43210
TOA
Expected output
Remains high because the 1 writing to TOB has priority
TCRW has been set to H'06. Compare match B and compare match C are used. The FTIOB pin is in the 1 output state,
and is set to the toggle output or the 0 output by compare match B.
When BCLR#2, @TCRW is executed to clear the TOC bit (the FTIOC signal is low) and compare match B occurs
at the same timing as shown below, the H'02 writing to TCRW has priority and compare match B does not drive the FTIOB signal low;
the FTIOB signal remains high.
BCLR#2, @TCRW
(1) TCRW read operation: Read H'06
(2) Modify operation: Modify H'06 to H'02
(3) Write operation to TCRW: Write H'02
Figure 12.26 When Compare Match and Bit Manipulation Instruction to TCRW
Occur at the Same Timing
Section 12 Timer W
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Section 13 Watchdog Timer
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Section 13 Watchdog Timer
The watchdog timer is an 8-bit timer that can generate an internal reset signal for this LSI if a
system crash prevents the CPU from writing to the timer counter, thus allowing it to overflow.
The block diagram of the watchdog timer is shown in figure 13.1.
φ
Internal reset
signal
PSS TCWD
TMWD
TCSRWD
Internal data bus
[Legend]
TCSRWD: Timer control/status register WD
TCWD: Timer counter WD
PSS: Prescaler S
TMWD: Timer mode register WD
WDT dedicated
internal oscillator
CLK
Figure 13.1 Block Diagram of Watchdog Timer
13.1 Features
• Selectable from nine counter input clocks.
Eight clock sources (φ/64, φ/128, φ/256, φ/512, φ/1024, φ/2048, φ/4096, and φ/8192) or the
WDT dedicated internal oscillator can be selected as the timer-counter clock. When the WDT
dedicated internal oscillator is selected, it can operate as the watchdog timer in any operating
mode.
• Reset signal generated on counter overflow
An overflow period of 1 to 256 times the selected clock can be set.
• The watchdog timer is enabled in the initial state.
It starts operating after the reset state is canceled.
Section 13 Watchdog Timer
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13.2 Register Descriptions
The watchdog timer has the following registers.
• Timer control/status register WD (TCSRWD)
• Timer counter WD (TCWD)
• Timer mode register WD (TMWD)
13.2.1 Timer Control/Status Register WD (TCSRWD)
TCSRWD performs the TCSRWD and TCWD write control. TCSRWD also controls the
watchdog timer operation and indicates the operating state. TCSRWD must be rewritten by using
the MOV instruction. The bit manipulation instruction cannot be used to change the setting value.
Bit Bit Name
Initial
Value R/W Description
7 B6WI 1 R/W Bit 6 Write Inhibit
The TCWE bit can be written only when the write value of
the B6WI bit is 0.
This bit is always read as 1.
6 TCWE 0 R/W Timer Counter WD Write Enable
TCWD can be written when the TCWE bit is set to 1.
When writing data to this bit, the value for bit 7 must be 0.
5 B4WI 1 R/W Bit 4 Write Inhibit
The TCSRWE bit can be written only when the write
value of the B4WI bit is 0. This bit is always read as 1.
4 TCSRWE 0 R/W Timer Control/Status Register WD Write Enable
The WDON and WRST bits can be written when the
TCSRWE bit is set to 1.
When writing data to this bit, the value for bit 5 must be 0.
3 B2WI 1 R/W Bit 2 Write Inhibit
This bit can be written to the WDON bit only when the
write value of the B2WI bit is 0.
This bit is always read as 1.
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Bit Bit Name
Initial
Value R/W Description
2 WDON 1 R/W Watchdog Timer On
TCWD starts counting up when the WDON bit is set to 1
and halts when the WDON bit is cleared to 0. The
watchdog timer is enabled in the initial state. When the
watchdog timer is not used, clear the WDON bit to 0.
[Setting conditions]
• Reset
• When 1 is written to the WDON bit and 0 is written to
the B2WI bit while the TCSRWE bit = 1
[Clearing conditions]
• When 0 is written to the WDON bit and 0 is written to
the B2WI bit while the TCSRWE bit = 1
1 B0WI 1 R/W Bit 0 Write Inhibit
This bit can be written to the WRST bit only when the
write value of the B0WI bit is 0. This bit is always read as
1.
0 WRST* 0 R/W Watchdog Timer Reset
[Setting condition]
• When TCWD overflows and an internal reset signal is
generated
[Clearing conditions]
• Reset by the RES pin
• When 0 is written to the WRST bit and 0 is written to
the B0WI bit while the TCSRWE bit = 1
Note: * The WRST bit cannot be modified to 1.
Section 13 Watchdog Timer
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13.2.2 Timer Counter WD (TCWD)
TCWD is an 8-bit readable/writable up-counter. When TCWD overflows from H'FF to H'00, the
internal reset signal is generated and the WRST bit in TCSRWD is set to 1. TCWD is initialized to
H'00.
13.2.3 Timer Mode Register WD (TMWD)
TMWD selects the input clock.
Bit Bit Name
Initial
Value R/W Description
7 to 4 All 1 Reserved
These bits are always read as 1.
3
2
1
0
CKS3
CKS2
CKS1
CKS0
1
1
1
1
R/W
R/W
R/W
R/W
Clock Select 3 to 0
Select the clock to be input to TCWD.
1000: Internal clock: counts on φ/64
1001: Internal clock: counts on φ/128
1010: Internal clock: counts on φ/256
1011: Internal clock: counts on φ/512
1100: Internal clock: counts on φ/1024
1101: Internal clock: counts on φ/2048
1110: Internal clock: counts on φ/4096
1111: Internal clock: counts on φ8192
0XXX: WDT dedicated internal oscillator
For the overflow periods of the WDT dedicated internal
oscillator, see section 20, Electrical Characteristics.
[Legend]
X: Don't care
Section 13 Watchdog Timer
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13.3 Operation
The watchdog timer is provided with an 8-bit counter. After the reset state is released, TCWD
starts counting up. When the TCWD count value overflows H'FF, an internal reset signal is
generated. The internal reset signal is output for a period of 256 φRC clock cycles. As TCWD is a
writable counter, it starts counting from the value set in TCWD. An overflow period in the range
of 1 to 256 input clock cycles can therefore be set, according to the TCWD set value. When the
watchdog timer is not used, stop TCWD counting by writing 0 to B2WI and WDON
simultaneously while the TCSRWE bit in TCSRWD is set to 1. (To stop the watchdog timer, two
write accesses to TCSRWD are required.)
Figure 13.2 shows an example of watchdog timer operation.
Example: With 30ms overflow period when φ = 4 MHz
4 × 10
6
× 30 × 10
–3
= 14.6
8192
TCWD overflow
H'FF
H'00
Internal reset
signal
H'F1
TCWD
count value
H'F1 written
to TCWD
H'F1 written to TCWD Reset generated
256 φ
RC
clock cycles
Therefore, 256 – 15 = 241 (H'F1) is set in TCW.
Figure 13.2 Watchdog Timer Operation Example
Section 13 Watchdog Timer
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Section 14 Serial Communication Interface 3 (SCI3)
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Section 14 Serial Communication Interface 3 (SCI3)
This LSI includes serial communication interface 3 (SCI3). SCI3 can handle both asynchronous
and clocked synchronous serial communication. In asynchronous mode, serial data
communication can be carried out using standard asynchronous communication chips such as a
Universal Asynchronous Receiver/Transmitter (UART) or an Asynchronous Communication
Interface Adapter (ACIA). A function is also provided for serial communication between
processors (multiprocessor communication function).
Figure 14.1 is a block diagram of SCI3.
14.1 Features
• Choice of asynchronous or clocked synchronous serial communication mode
• Full-duplex communication capability
The transmitter and receiver are mutually independent, enabling transmission and reception to
be executed simultaneously.
Double-buffering is used in both the transmitter and the receiver, enabling continuous
transmission and continuous reception of serial data.
• On-chip baud rate generator allows any bit rate to be selected
• External clock or on-chip baud rate generator can be selected as a transfer clock source.
• Six interrupt sources
Transmit-end, transmit-data-empty, receive-data-full, overrun error, framing error, and parity
error.
• Internal noise filter circuit (available for asynchronous serial communication only)
Asynchronous mode
• Data length: 7 or 8 bits
• Stop bit length: 1 or 2 bits
• Parity: Even, odd, or none
• Receive error detection: Parity, overrun, and framing errors
• Break detection: Break can be detected by reading the RXD pin level directly in the case of a
framing error
Section 14 Serial Communication Interface 3 (SCI3)
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Clocked synchronous mode
• Data length: 8 bits
• Receive error detection: Overrun errors
External
clock Baud rate
generator
Transmit/receive
control circuit
BRC BRR
SMR
SCR3
SPMR
SSR
TDR
RDR
TSR
RSR
Internal clock (φ/64,φ/16, φ/4, φ)
Clock
SCK3
TXD
RXD
Interrupt request
(TEI, TXI, RXI, ERI)
Noise
filter circuit
Internal data bus
[Legend]
RSR:
RDR:
TSR:
TDR:
SMR:
SCR3:
SSR:
BRR:
BRC:
SPMR:
Receive shift register
Receive data register
Transmit shift register
Transmit data register
Serial mode register
Serial control register 3
Serial status register
Bit rate register
Bit rate counter
Sampling mode register
Figure 14.1 Block Diagram of SCI3
Section 14 Serial Communication Interface 3 (SCI3)
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14.2 Input/Output Pins
Table 14.1 shows the SCI3 pin configuration.
Table 14.1 Pin Configuration
Pin Name Abbreviation I/O Function
SCI3 clock SCK3 Input/output SCI3 clock input/output
SCI3 receive data input RXD Input SCI3 receive data input
SCI3 transmit data output TXD Output SCI3 transmit data output
14.3 Register Descriptions
SCI3 has the following registers for each channel.
• Receive shift register (RSR)
• Receive data register (RDR)
• Transmit shift register (TSR)
• Transmit data register (TDR)
• Serial mode register (SMR)
• Serial control register 3 (SCR3)
• Serial status register (SSR)
• Bit rate register (BRR)
• Sampling mode register (SPMR)
Section 14 Serial Communication Interface 3 (SCI3)
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14.3.1 Receive Shift Register (RSR)
RSR is a shift register that is used to receive serial data input from the RXD pin and convert it into
parallel data. When one frame of data has been received, it is transferred to RDR automatically.
RSR cannot be directly accessed by the CPU.
14.3.2 Receive Data Register (RDR)
RDR is an 8-bit register that stores received data. When SCI3 has received one frame of serial
data, it transfers the received serial data from RSR to RDR, where it is stored. After this, RSR is
receive-enabled. As RSR and RDR function as a double buffer in this way, continuous receive
operations are possible. After confirming that the RDRF bit in SSR is set to 1, read RDR only
once. RDR cannot be written to by the CPU. RDR is initialized to H'00.
14.3.3 Transmit Shift Register (TSR)
TSR is a shift register that transmits serial data. To perform serial data transmission, SCI3 first
transfers transmit data from TDR to TSR automatically, then sends the data that starts from the
LSB to the TXD pin. TSR cannot be directly accessed by the CPU.
14.3.4 Transmit Dat a Regi ster (TDR)
TDR is an 8-bit register that stores data for transmission. When SCI3 detects that TSR is empty, it
transfers the transmit data written in TDR to TSR and starts transmission. The double-buffered
structure of TDR and TSR enables continuous serial transmission. If the next transmit data has
already been written to TDR during transmission of one-frame data, SCI3 transfers the written
data to TSR to continue transmission. To achieve reliable serial transmission, write transmit data
to TDR only once after confirming that the TDRE bit in SSR is set to 1. TDR is initialized to
H'FF.
Section 14 Serial Communication Interface 3 (SCI3)
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14.3.5 Serial Mode Regis ter (SMR)
SMR is used to set the SCI3’s serial transfer format and select the baud rate generator clock
source.
Bit Bit Name
Initial
Value R/W Description
7 COM 0 R/W Communication Mode
0: Asynchronous mode
1: Clocked synchronous mode
6 CHR 0 R/W Character Length (enabled only in asynchronous mode)
0: Selects 8 bits as the data length.
1: Selects 7 bits as the data length.
5 PE 0 R/W Parity Enable (enabled only in asynchronous mode)
When this bit is set to 1, the parity bit is added to transmit
data before transmission, and the parity bit is checked in
reception.
4 PM 0 R/W Parity Mode (enabled only when the PE bit is 1 in
asynchronous mode)
0: Selects even parity.
1: Selects odd parity.
3 STOP 0 R/W Stop Bit Length (enabled only in asynchronous mode)
Selects the stop bit length in transmission.
0: 1 stop bit
1: 2 stop bits
For reception, only the first stop bit is checked, regardless
of the value in the bit. If the second stop bit is 0, it is
treated as the start bit of the next transmit character.
2 MP 0 R/W Multiprocessor Mode
When this bit is set to 1, the multiprocessor
communication function is enabled. The PE bit and PM
bit settings are invalid in multiprocessor mode. In clocked
synchronous mode, clear this bit to 0.
Section 14 Serial Communication Interface 3 (SCI3)
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Bit Bit Name
Initial
Value R/W Description
1
0
CKS1
CKS0
0
0
R/W
R/W
Clock Select 0 and 1
These bits select the clock source for the baud rate
generator.
00: φ clock (n = 0)
01: φ/4 clock (n = 1)
10: φ/16 clock (n = 2)
11: φ/64 clock (n = 3)
For the relationship between the bit rate register setting
and the baud rate, see section 14.3.8, Bit Rate Register
(BRR). n is the decimal representation of the value of n in
BRR (see section 14.3.8, Bit Rate Register (BRR)).
14.3.6 Serial Control Register 3 (SCR3)
SCR3 is a register that enables or disables SCI3 transfer operations and interrupt requests, and is
also used to select the transfer clock source. For details on interrupt requests, refer to section 14.7,
Interrupts.
Bit Bit Name
Initial
Value R/W Description
7 TIE 0 R/W Transmit Interrupt Enable
When this bit is set to 1, the TXI interrupt request is
enabled.
6 RIE 0 R/W Receive Interrupt Enable
When this bit is set to 1, RXI and ERI interrupt requests
are enabled.
5 TE 0 R/W Transmit Enable
When this bit s set to 1, transmission is enabled.
4 RE 0 R/W Receive Enable
When this bit is set to 1, reception is enabled.
Section 14 Serial Communication Interface 3 (SCI3)
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Bit Bit Name
Initial
Value R/W Description
3 MPIE 0 R/W Multiprocessor Interrupt Enable (enabled only when the
MP bit in SMR is 1 in asynchronous mode)
When this bit is set to 1, receive data in which the
multiprocessor bit is 0 is skipped, and setting of the
RDRF, FER, and OER status flags in SSR is disabled.
On receiving data in which the multiprocessor bit is 1, this
bit is automatically cleared and normal reception is
resumed. For details, refer to section 14.6, Multiprocessor
Communication Function.
2 TEIE 0 R/W Transmit End Interrupt Enable
When this bit is set to 1, TEI interrupt request is enabled.
1
0
CKE1
CKE0
0
0
R/W
R/W
Clock Enable 0 and 1
Selects the clock source.
• Asynchronous mode
00: On-chip baud rate generator
01: On-chip baud rate generator
Outputs a clock of the same frequency as the bit rate
from the SCK3 pin.
10: External clock
Inputs a clock with a frequency 16 times the bit rate
from the SCK3 pin.
11:Reserved
• Clocked synchronous mode
00: On-chip clock (SCK3 pin functions as clock output)
01:Reserved
10: External clock (SCK3 pin functions as clock input)
11:Reserved
Section 14 Serial Communication Interface 3 (SCI3)
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14.3.7 Serial Status Register (SSR)
SSR is a register containing status flags of SCI3 and multiprocessor bits for transfer. 1 cannot be
written to flags TDRE, RDRF, OER, PER, and FER; they can only be cleared.
Bit Bit Name
Initial
Value R/W Description
7 TDRE 1 R/W Transmit Data Register Empty
Indicates whether TDR contains transmit data.
[Setting conditions]
• When the TE bit in SCR3 is 0
• When data is transferred from TDR to TSR
[Clearing conditions]
• When 0 is written to TDRE after reading TDRE = 1
• When the transmit data is written to TDR
6 RDRF 0 R/W Receive Data Register Full
Indicates that the received data is stored in RDR.
[Setting condition]
• When serial reception ends normally and receive data
is transferred from RSR to RDR
[Clearing conditions]
• When 0 is written to RDRF after reading RDRF = 1
• When data is read from RDR
5 OER 0 R/W Overrun Error
[Setting condition]
• When an overrun error occurs in reception
[Clearing condition]
• When 0 is written to OER after reading OER = 1
4 FER 0 R/W Framing Error
[Setting condition]
• When a framing error occurs in reception
[Clearing condition]
• When 0 is written to FER after reading FER = 1
Section 14 Serial Communication Interface 3 (SCI3)
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Bit Bit Name
Initial
Value R/W Description
3 PER 0 R/W Parity Error
[Setting condition]
• When a parity error is detected during reception
[Clearing condition]
• When 0 is written to PER after reading PER = 1
2 TEND 1 R Transmit End
[Setting conditions]
• When the TE bit in SCR3 is 0
• When TDRE = 1 at transmission of the last bit of a 1-
frame serial transmit character
[Clearing conditions]
• When 0 is written to TDRE after reading TDRE = 1
• When the transmit data is written to TDR
1 MPBR 0 R Multiprocessor Bit Receive
MPBR stores the multiprocessor bit in the receive
character data. When the RE bit in SCR3 is cleared to 0,
its state is retained.
0 MPBT 0 R/W Multiprocessor Bit Transfer
MPBT stores the multiprocessor bit to be added to the
transmit character data.
Section 14 Serial Communication Interface 3 (SCI3)
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14.3.8 Bit Rate Register (BRR)
BRR is an 8-bit register that adjusts the bit rate. The initial value of BRR is H'FF. Table 14.2
shows the relationship between the N setting in BRR and the n setting in bits CKS1 and CKS0 of
SMR in asynchronous mode. Table 14.3 shows the maximum bit rate for each frequency in
asynchronous mode. The values shown in both tables 14.2 and 14.3 are values in active (high-
speed) mode. Table 14.4 shows the relationship between the N setting in BRR and the n setting in
bits CKS1 and CKS0 of SMR in clocked synchronous mode. The values shown in table 14.5 are
values in active (high-speed) mode. The N setting in BRR and error for other operating
frequencies and bit rates can be obtained by the following formulas:
[Asynchronous Mode]
N = φ
64 × 2
2n–1
× B × 10
6
– 1
Error (%) = – 1 × 100
φ × 106
(N + 1) × B × 64 × 22n–1
[Clocked Synchronous Mode]
N = φ
8 × 2
2n–1
× B × 10
6
– 1
Legend B: Bit rate (bit/s)
N: BRR setting for baud rate generator (0 ≤ N ≤ 255)
φ: Operating frequency (MHz)
n: CSK1 and CSK0 settings in SMR (0 ≤ n ≤ 3)
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 207 of 408
REJ09B0105-0300
Table 14.2 Examples of BRR Settin gs for Various Bit Rates (A sy n c hron ou s Mo de)
Operating Frequency φ (MHz)
2 2.097152 2.4576 3
Bit Rate
(bits/s)
n
N Error
(%)
n
N Error
(%)
n
N Error
(%)
n
N Error
(%)
110 1 141 0.03 1 148 –0.04 1 174 –0.26 1 212 0.03
150 1 103 0.16 1 108 0.21 1 127 0.00 1 155 0.16
300 0 207 0.16 0 217 0.21 0 255 0.00 1 77 0.16
600 0 103 0.16 0 108 0.21 0 127 0.00 0 155 0.16
1200 0 51 0.16 0 54 –0.70 0 63 0.00 0 77 0.16
2400 0 25 0.16 0 26 1.14 0 31 0.00 0 38 0.16
4800 0 12 0.16 0 13 –2.48 0 15 0.00 0 19 –2.34
9600 0 6 –6.99 0 6 –2.48 0 7 0.00 0 9 –2.34
19200 0 2 8.51 0 2 13.78 0 3 0.00 0 4 –2.34
31250 0 1 0.00 0 1 4.86 0 1 22.88 0 2 0.00
38400 0 1 –18.62 0 1 –14.67 0 1 0.00 — — —
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 208 of 408
REJ09B0105-0300
Operating Frequency φ (MHz)
3.6864 4 4.9152 5
Bit Rate
(bits/s)
n
N Error
(%)
n
N Error
(%)
n
N Error
(%)
n
N Error
(%)
110 2 64 0.70 2 70 0.03 2 86 0.31 2 88 –0.25
150 1 191 0.00 1 207 0.16 1 255 0.00 2 64 0.16
300 1 95 0.00 1 103 0.16 1 127 0.00 1 129 0.16
600 0 191 0.00 0 207 0.16 0 255 0.00 1 64 0.16
1200 0 95 0.00 0 103 0.16 0 127 0.00 0 129 0.16
2400 0 47 0.00 0 51 0.16 0 63 0.00 0 64 0.16
4800 0 23 0.00 0 25 0.16 0 31 0.00 0 32 –1.36
9600 0 11 0.00 0 12 0.16 0 15 0.00 0 15 1.73
19200 0 5 0.00 0 6 –6.99 0 7 0.00 0 7 1.73
31250 — — — 0 3 0.00 0 4 –1.70 0 4 0.00
38400 0 2 0.00 0 2 8.51 0 3 0.00 0 3 1.73
[Legend]
: A setting is available but error occurs
Operating Frequency φ (MHz)
6 6.144 7.3728
Bit Rate
(bit/s) n N Error
(%) n N Error
(%) n N Error
(%)
110 2 106 –0.44 2 108 0.08 2 130 –0.07
150 2 77 0.16 2 79 0.00 2 95 0.00
300 1 155 0.16 1 159 0.00 1 191 0.00
600 1 77 0.16 1 79 0.00 1 95 0.00
1200 0 155 0.16 0 159 0.00 0 191 0.00
2400 0 77 0.16 0 79 0.00 0 95 0.00
4800 0 38 0.16 0 39 0.00 0 47 0.00
9600 0 19 –2.34 0 19 0.00 0 23 0.00
19200 0 9 –2.34 0 9 0.00 0 11 0.00
31250 0 5 0.00 0 5 2.40 0 6 5.33
38400 0 4 –2.34 0 4 0.00 0 5 0.00
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 209 of 408
REJ09B0105-0300
Operating Frequency φ (MHz)
8 9.8304 10
Bit Rate
(bit/s) n N Error (%) n N Error (%) n N Error (%)
110 2 141 0.03 2 174 –0.26 2 177 –0.25
150 2 103 0.16 2 127 0.00 2 129 0.16
300 1 207 0.16 1 255 0.00 2 64 0.16
600 1 103 0.16 1 127 0.00 1 129 0.16
1200 0 207 0.16 0 255 0.00 1 64 0.16
2400 0 103 0.16 0 127 0.00 0 129 0.16
4800 0 51 0.16 0 63 0.00 0 64 0.16
9600 0 25 0.16 0 31 0.00 0 32 –1.36
19200 0 12 0.16 0 15 0.00 0 15 1.73
31250 0 7 0.00 0 9 –1.70 0 9 0.00
38400 0 6 -6.99 0 7 0.00 0 7 1.73
Table 14.3 Maximum Bit Rate for Ea ch Frequency (Asynchronous Mode)
φ (MHz) Maximum Bit
Rate (bit/s) n N φ (MHz) Maximum Bit
Rate (bit/s) n N
2 62500 0 0 5 156250 0 0
2.097152 65536 0 0 6 187500 0 0
2.4576 76800 0 0 6.144 192000 0 0
3 93750 0 0 7.3728 230400 0 0
3.6864 115200 0 0 8 250000 0 0
4 125000 0 0 9.8304 307200 0 0
4.9152 153600 0 0 10 312500 0 0
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 210 of 408
REJ09B0105-0300
Table 14.4 Examples of BRR Settin gs for Various Bit Rates (Clocked Synchronous Mode)
Operating Frequency φ (MHz)
2 4 8 10
Bit Rate
(bit/s) n N n N n N n N
110 3 70 — — — — — —
250 2 124 2 249 3 124 — —
500 1 249 2 124 2 249 — —
1k 1 124 1 249 2 124 — —
2.5k 0 199 1 99 1 199 1 249
5k 0 99 0 199 1 99 1 124
10k 0 49 0 99 0 199 0 249
25k 0 19 0 39 0 79 0 99
50k 0 9 0 19 0 39 0 49
100k 0 4 0 9 0 19 0 24
250k 0 1 0 3 0 7 0 9
500k 0 0* 0 1 0 3 0 4
1M 0 0* 0 1 — —
2M 0 0* — —
2.5M 0 0*
4M
[Legend]
Blank: No setting is available.
—: A setting is available but error occurs.
*: Continuous transfer is not possible.
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 211 of 408
REJ09B0105-0300
14.3.9 Sampling Mode Register (SPMR)
SPMR controls the serial communication function.
Bit Bit Name
Initial
Value R/W Description
7 to 3 All 1 Reserved
These bits are always read as 1.
2 STDSPM 1 R/W Noise Filter Function Select
Selects the noise filter function for the RXD pin in
asynchronous mode.
0: Noise filter circuit is enabled
1: Noise filter circuit is disabled
1, 0 All 1 Reserved
These bits are always read as 1.
• Noise Filter Circuit
The RXD input signal is latched through the noise filter circuit. The noise filter circuit
comprises a series of three latch circuits and a match detection circuit. The RXD input signal is
sampled by the basic clock with the 16 times the transfer clock frequency. If three latch
outputs match, its level is transferred to the next stage. If not, the circuit holds the previous
value.
That is, when the incoming signal holds the same level for three clock cycles, it is regarded as
the proper signal. If the levels of the signal is less than three clock cycles, the signal is
regarded as a noise.
C
Q
D
C
QD
C
QD
RXD input signal
Sampling clock
Latch Latch Latch
Match
detection
circuit
SPMR
(STDSPM)
Internal RXD
signal shown
in figure 14.1
Internal basic clock cycle
Sampling clock
Figure 14.2 Block Diagram of Noise Filter Circuit
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 212 of 408
REJ09B0105-0300
14.4 Operation in Asynchronous Mode
Figure 14.3 shows the general format for asynchronous serial communication. One character (or
frame) consists of a start bit (low level), followed by data (in LSB-first order), a parity bit (high or
low level), and finally stop bits (high level). Inside the SCI3, the transmitter and receiver are
independent units, enabling full-duplex. Both the transmitter and the receiver also have a double-
buffered structure, so data can be read or written during transmission or reception, enabling
continuous data transfer.
LSB
Start
bit
MSB
Mark state
Stop bit
Transmit/receive data
1
Serial
data
Parity
bit
1 bit 1 or
2 bits
7 or 8 bits 1 bit,
or none
One unit of transfer data (character or frame)
Figure 14.3 Data Format in Asynchronous Communication
14.4.1 Clock
Either an internal clock generated by the on-chip baud rate generator or an external clock input at
the SCK3 pin can be selected as the SCI3’s serial clock, according to the setting of the COM bit in
SMR and the CKE0 and CKE1 bits in SCR3. When an external clock is input at the SCK3 pin, the
clock frequency should be 16 times the bit rate used.
When SCI3 is operated on an internal clock, the clock can be output from the SCK3 pin. The
frequency of the clock output in this case is equal to the bit rate, and the phase is such that the
rising edge of the clock is in the middle of the transmit data, as shown in figure 14.4.
0
1 character (frame)
D0 D1 D2 D3 D4 D5 D6 D7 0/1 11
Clock
Serial data
Figure 14.4 Relationshi p bet ween Out p ut Cl ock and Transfer Data Phase
(Asynchronous Mode) (Example with 8-Bit Data, Parity, Two Stop Bits)
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 213 of 408
REJ09B0105-0300
14.4.2 SCI3 Initialization
Before transmitting and receiving data, you should first clear the TE and RE bits in SCR3 to 0,
then initialize SCI3 as described below. When the operating mode, or transfer format, is changed
for example, the TE and RE bits must be cleared to 0 before making the change using the
following procedure. When the TE bit is cleared to 0, the TDRE flag is set to 1. Note that clearing
the RE bit to 0 does not initialize the contents of the RDRF, PER, FER, and OER flags, or the
contents of RDR. When the external clock is used in asynchronous mode, the clock must be
supplied even during initialization.
Wait
<Initialization completion>
Start initialization
Set data transfer format in SMR
[1]
Set CKE1 and CKE0 bits in SCR3
No
Yes
Set value in BRR
Clear TE and RE bits in SCR3 to 0
[2]
[3]
Set TE and RE bits in
SCR3 to 1, and set RIE, TIE, TEIE,
and MPIE bits. For transmit (TE=1),
also set the TxD bit in PMR1.
[4]
1-bit interval elapsed?
[1] Set the clock selection in SCR3.
Be sure to clear bits RIE, TIE, TEIE, and
MPIE, and bits TE and RE, to 0.
When the clock output is selected in
asynchronous mode, clock is output
immediately after CKE1 and CKE0
settings are made. When the clock
output is selected at reception in clocked
synchronous mode, clock is output
immediately after CKE1, CKE0, and RE
are set to 1.
[2] Set the data transfer format in SMR.
[3] Write a value corresponding to the bit
rate to BRR. Not necessary if an
external clock is used.
[4] Wait at least one bit interval, then set the
TE bit or RE bit in SCR3 to 1. RE
settings enable the RXD pin to be used.
For transmission, set the TXD bit in
PMR1 to 1 to enable the TXD output pin
to be used. Also set the RIE, TIE, TEIE,
and MPIE bits, depending on whether
interrupts are required. In asynchronous
mode, the bits are marked at
transmission and idled at reception to
wait for the start bit.
For transmission, set the TE bit to 1 and
then output 1 for one frame to enable.
Figure 14.5 Sample SCI3 Initi ali zation Flowchart
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 214 of 408
REJ09B0105-0300
14.4.3 Data Transmission
Figure 14.6 shows an example of operation for transmission in asynchronous mode. In
transmission, SCI3 operates as described below.
1. SCI3 monitors the TDRE flag in SSR. If the flag is cleared to 0, SCI3 recognizes that data has
been written to TDR, and transfers the data from TDR to TSR.
2. After transferring data from TDR to TSR, SCI3 sets the TDRE flag to 1 and starts
transmission. If the TIE bit is set to 1 at this time, a TXI interrupt request is generated.
Continuous transmission is possible because the TXI interrupt routine writes next transmit data
to TDR before transmission of the current transmit data has been completed.
3. SCI3 checks the TDRE flag at the timing for sending the stop bit.
4. If the TDRE flag is 0, the data is transferred from TDR to TSR, the stop bit is sent, and then
serial transmission of the next frame is started.
5. If the TDRE flag is 1, the TEND flag in SSR is set to 1, the stop bit is sent, and then the “mark
state” is entered, in which 1 is output. If the TEIE bit in SCR3 is set to 1 at this time, a TEI
interrupt request is generated.
6. Figure 14.7 shows a sample flowchart for transmission in asynchronous mode.
1 frame
Start
bit
Start
bit
Transmit
data
Transmit
data
Parity
bit
Stop
bit
Parity
bit
Stop
bit
Mark
state
1 frame
01D0D1D70/11 110D0D1 D70/1
Serial
data
TDRE
TEND
LSI
operation
TXI interrupt
request
generated
TDRE flag
cleared to 0
User
processing
Data written
to TDR
TXI interrupt request generated TEI interrupt request
generated
Figure 14.6 Example of SCI3 Transmission in Asynchronous Mode
(8-Bit Data, Parity, One Stop Bit)
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 215 of 408
REJ09B0105-0300
No
<End>
Yes
Start transmission
Read TDRE flag in SSR[1]
Write transmit data to TDR
Yes
No
No
Yes
Read TEND flag in SSR
[2]
No
Yes
[3]
Clear PDR to 0 and
set PCR to 1
Clear TE bit in SCR3 to 0
TDRE = 1
All data transmitted?
TEND = 1
Break output?
[1] Read SSR and check that the
TDRE flag is set to 1, then write
transmit data to TDR. When data is
written to TDR, the TDRE flag is
automaticaly cleared to 0.
[2] To continue serial transmission,
read 1 from the TDRE flag to
confirm that writing is possible,
then write data to TDR. When data
is written to TDR, the TDRE flag is
automaticaly cleared to 0.
[3] To output a break in serial
transmission, after setting PCR to 1
and PDR to 0, clear TxD in PMR1
to 0, then clear the TE bit in SCR3
to 0.
Figure 14.7 Sample Serial Transmissi on Da t a Flowch a rt (As ync hro n ous Mode)
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 216 of 408
REJ09B0105-0300
14.4.4 Serial Data Reception
Figure 14.8 shows an example of operation for reception in asynchronous mode. In serial
reception, SCI3 operates as described below.
1. SCI3 monitors the communication line. If a start bit is detected, SCI3 performs internal
synchronization, receives receive data in RSR, and checks the parity bit and stop bit.
2. If an overrun error occurs (when reception of the next data is completed while the RDRF flag
is still set to 1), the OER bit in SSR is set to 1. If the RIE bit in SCR3 is set to 1 at this time, an
ERI interrupt request is generated. Receive data is not transferred to RDR.
3. If a parity error is detected, the PER bit in SSR is set to 1 and receive data is transferred to
RDR. If the RIE bit in SCR3 is set to 1 at this time, an ERI interrupt request is generated.
4. If a framing error is detected (when the stop bit is 0), the FER bit in SSR is set to 1 and receive
data is transferred to RDR. If the RIE bit in SCR3 is set to 1 at this time, an ERI interrupt
request is generated.
5. If reception is completed successfully, the RDRF bit in SSR is set to 1, and receive data is
transferred to RDR. If the RIE bit in SCR3 is set to 1 at this time, an RXI interrupt request is
generated. Continuous reception is possible because the RXI interrupt routine reads the receive
data transferred to RDR before reception of the next receive data has been completed.
1 frame
Start
bit
Start
bit
Receive
data
Receive
data
Parity
bit
Stop
bit
Parity
bit
Stop
bit
Mark state
(idle state)
1 frame
01D0D1D70/11 010D0D1 D70/1
Serial
data
RDRF
FER
LSI
operation
User
processing
RDRF
cleared to 0
RDR data read Framing error
processing
RXI request 0 stop bit
detected
ERI request in
response to
framing error
Figure 14.8 Example of SCI3 Reception in Asynchronous Mode
(8-Bit Data, Parity, One Stop Bit)
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 217 of 408
REJ09B0105-0300
Table 14.5 shows the states of the SSR status flags and receive data handling when a receive error
is detected. If a receive error is detected, the RDRF flag retains its state before receiving data.
Reception cannot be resumed while a receive error flag is set to 1. Accordingly, clear the OER,
FER, PER, and RDRF bits to 0 before resuming reception. Figure 14.9 shows a sample flow chart
for serial data reception.
Table 14.5 SSR Status Flags and Receive Data Handling
SSR Status Flag
RDRF* OER FER PER Receive Data Receive Error Type
1 1 0 0 Lost Overrun error
0 0 1 0 Transferred to RDR Framing error
0 0 0 1 Transferred to RDR Parity error
1 1 1 0 Lost Overrun error + framing error
1 1 0 1 Lost Overrun error + parity error
0 0 1 1 Transferred to RDR Framing error + parity error
1 1 1 1 Lost Overrun error + framing error +
parity error
Note: * The RDRF flag retains the state it had before data reception.
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 218 of 408
REJ09B0105-0300
Yes
<End>
No
Start reception
[1]
No
Yes
Read RDRF flag in SSR [2]
[3]
Clear RE bit in SCR3 to 0
Read OER, PER, and
FER flags in SSR
Error processing
(Continued on next page)
[4]
Read receive data in RDR
Yes
No
OER+PER+FER = 1
RDRF = 1
All data received?
[1] Read the OER, PER, and FER flags in
SSR to identify the error. If a receive
error occurs, performs the appropriate
error processing.
[2] Read SSR and check that RDRF = 1,
then read the receive data in RDR.
The RDRF flag is cleared automatically.
[3] To continue serial reception, before the
stop bit for the current frame is
received, read the RDRF flag and read
RDR.
The RDRF flag is cleared automatically.
[4] If a receive error occurs, read the OER,
PER, and FER flags in SSR to identify
the error. After performing the
appropriate error processing, ensure
that the OER, PER, and FER flags are
all cleared to 0. Reception cannot be
resumed if any of these flags are set to
1. In the case of a framing error, a
break can be detected by reading the
value of the input port corresponding to
the RxD pin.
(A)
Figure 14.9 Sample Serial Reception Data Flowchart (Asynchronous Mode)
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 219 of 408
REJ09B0105-0300
14.5 Operation in Clocked Synchronous Mode
Figure 14.10 shows the general format for clocked synchronous communication. In clocked
synchronous mode, data is transmitted or received synchronous with clock pulses. A single
character in the transmit data consists of the 8-bit data starting from the LSB. In clocked
synchronous serial communication, data on the transmission line is output from one falling edge of
the synchronization clock to the next. In clocked synchronous mode, SCI3 receives data in
synchronous with the rising edge of the synchronization clock. After 8-bit data is output, the
transmission line holds the MSB state. In clocked synchronous mode, no parity or multiprocessor
bit is added. Inside the SCI3, the transmitter and receiver are independent units, enabling full-
duplex communication through the use of a common clock. Both the transmitter and the receiver
also have a double-buffered structure, so data can be read or written during transmission or
reception, enabling continuous data transfer.
Don’t
care
Don’t
care
One unit of transfer data (character or frame)
8-bit
Bit 0
Serial data
Synchronization
clock
Bit 1 Bit 3 Bit 4 Bit 5
LSB MSB
Bit 2 Bit 6 Bit 7
*
*
Note: * High except in continuous transfer
Figure 14.10 Data Format in Clocked Synchronous Communication
14.5.1 Clock
Either an internal clock generated by the on-chip baud rate generator or an external
synchronization clock input at the SCK3 pin can be selected, according to the setting of the COM
bit in SMR and CKE0 and CKE1 bits in SCR3. When SCI3 is operated on an internal clock, the
synchronization clock is output from the SCK3 pin. Eight synchronization clock pulses are output
in the transfer of one character, and when no transfer is performed the clock is fixed high.
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 220 of 408
REJ09B0105-0300
14.5.2 SCI3 Initialization
Before transmitting and receiving data, SCI3 should be initialized as described in a sample
flowchart in figure 14.5.
14.5.3 Serial Data Transmission
Figure 14.11 shows an example of SCI3 operation for transmission in clocked synchronous mode.
In serial transmission, SCI3 operates as described below.
1. SCI3 monitors the TDRE flag in SSR, and if the flag is 0, SCI3 recognizes that data has been
written to TDR, and transfers the data from TDR to TSR.
2. SCI3 sets the TDRE flag to 1 and starts transmission. If the TIE bit in SCR3 is set to 1 at this
time, a transmit data empty interrupt (TXI) is generated.
3. 8-bit data is sent from the TXD pin synchronized with the output clock when output clock
mode has been specified, and synchronized with the input clock when use of an external clock
has been specified. Serial data is transmitted sequentially from the LSB (bit 0), from the TXD
pin.
4. SCI3 checks the TDRE flag at the timing for sending the MSB (bit 7).
5. If the TDRE flag is cleared to 0, data is transferred from TDR to TSR, and serial transmission
of the next frame is started.
6. If the TDRE flag is set to 1, the TEND flag in SSR is set to 1, and the TDRE flag maintains the
output state of the last bit. If the TEIE bit in SCR3 is set to 1 at this time, a TEI interrupt
request is generated.
7. The SCK3 pin is fixed high at the end of transmission.
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 221 of 408
REJ09B0105-0300
Figure 14.12 shows a sample flow chart for serial data transmission. Even if the TDRE flag is
cleared to 0, transmission will not start while a receive error flag (OER, FER, or PER) is set to 1.
Make sure that the receive error flags are cleared to 0 before starting transmission.
Serial
clock
Serial
data Bit 1Bit 0 Bit 7 Bit 0
1 frame 1 frame
Bit 1 Bit 6 Bit 7
TDRE
TEND
LSI
operation
User
processing
TXI interrupt request generated
Data written
to TDR
TDRE flag
cleared
to 0
TXI interrupt
request
generated
TEI interrupt request
generated
Figure 14.11 Example of SCI3 Transmission in Clocked Synchronous Mode
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 222 of 408
REJ09B0105-0300
No
<End>
Yes
Start transmission
Read TDRE flag in SSR[1]
Write transmit data to TDR
No
Yes
No
Yes
Read TEND flag in SSR
[2]
Clear TE bit in SCR3 to 0
TDRE = 1
All data transmitted?
TEND = 1
[1] Read SSR and check that the TDRE flag is
set to 1, then write transmit data to TDR.
When data is written to TDR, the TDRE flag
is automatically cleared to 0 and clocks are
output to start the data transmission.
[2] To continue serial transmission, be sure to
read 1 from the TDRE flag to confirm that
writing is possible, then write data to TDR.
When data is written to TDR, the TDRE flag
is automatically cleared to 0.
Figure 14.12 Sample Serial Transmission Flowchart (Clocked Synchronous Mode)
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 223 of 408
REJ09B0105-0300
14.5.4 Serial Data Reception (Clocked Synchronous Mode)
Figure 14.13 shows an example of SCI3 operation for reception in clocked synchronous mode. In
serial reception, SCI3 operates as described below.
1. SCI3 performs internal initialization synchronous with a synchronization clock input or
output, starts receiving data.
2. SCI3 stores the receive data in RSR.
3. If an overrun error occurs (when reception of the next data is completed while the RDRF flag
in SSR is still set to 1), the OER bit in SSR is set to 1. If the RIE bit in SCR3 is set to 1 at this
time, an ERI interrupt request is generated, receive data is not transferred to RDR, and the
RDRF flag remains to be set to 1.
4. If reception is completed successfully, the RDRF bit in SSR is set to 1, and receive data is
transferred to RDR. If the RIE bit in SCR3 is set to 1 at this time, an RXI interrupt request is
generated.
Serial
clock
Serial
data
1 frame 1 frame
Bit 0Bit 7 Bit 7 Bit 0 Bit 1 Bit 6 Bit 7
RDRF
OER
LSI
operation
User
processing
RXI interrupt request generated
RDR data read
RDRF flag
cleared
to 0
RXI interrupt
request
generated
ERI interrupt request
generated by
overrun error
Overrun error
processing
RDR data has
not been read
(RDRF = 1)
Figure 14.13 Example of SCI3 Reception in Clocked Synchronous Mode
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 224 of 408
REJ09B0105-0300
Reception cannot be resumed while a receive error flag is set to 1. Accordingly, clear the OER,
FER, PER, and RDRF bits to 0 before resuming reception. Figure 14.14 shows a sample flow
chart for serial data reception.
Yes
<End>
No
Start reception
[1]
[4]
No
Yes
Read RDRF flag in SSR [2]
[3]
Clear RE bit in SCR3 to 0
Error processing
(Continued below)
Read receive data in RDR
Yes
No
OER = 1
RDRF = 1
All data received?
Read OER flag in SSR
<End>
Error processing
Overrun error processing
Clear OER flag in SSR to 0
[4]
[1] Read the OER flag in SSR to determine if
there is an error. If an overrun error has
occurred, execute overrun error processing.
[2] Read SSR and check that the RDRF flag is
set to 1, then read the receive data in RDR.
When data is read from RDR, the RDRF
flag is automatically cleared to 0.
[3] To continue serial reception, before the
MSB (bit 7) of the current frame is received,
reading the RDRF flag and reading RDR
should be finished. When data is read from
RDR, the RDRF flag is automatically
cleared to 0.
[4] If an overrun error occurs, read the OER
flag in SSR, and after performing the
appropriate error processing, clear the OER
flag to 0. Reception cannot be resumed if
the OER flag is set to 1.
Figure 14.14 Sample Serial Reception Flowchart (Clocked Synchronous Mode)
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 225 of 408
REJ09B0105-0300
14.5.5 Simultaneous Serial Data Transmission and Reception
Figure 14.15 shows a sample flowchart for simultaneous serial transmit and receive operations.
The following procedure should be used for simultaneous serial data transmit and receive
operations. To switch from transmit mode to simultaneous transmit and receive mode, after
checking that SCI3 has finished transmission and the TDRE and TEND flags are set to 1, clear TE
to 0. Then simultaneously set TE and RE to 1 with a single instruction. To switch from receive
mode to simultaneous transmit and receive mode, after checking that SCI3 has finished reception,
clear RE to 0. Then after checking that the RDRF and receive error flags (OER, FER, and PER)
are cleared to 0, simultaneously set TE and RE to 1 with a single instruction.
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 226 of 408
REJ09B0105-0300
Yes
<End>
No
Start transmission/reception
[3]
[4]
Read receive data in RDR
Yes
No
OER = 1
All data received?
[1]
Read TDRE flag in SSR
No
Yes
TDRE = 1
Write transmit data to TDR
No
Yes
RDRF = 1
Read OER flag in SSR
[2]
Read RDRF flag in SSR
Clear TE and RE bits in SCR to 0
Overrun error
processing
[1] Read SSR and check that the TDRE
flag is set to 1, then write transmit
data to TDR.
When data is written to TDR, the
TDRE flag is automatically cleared to
0.
[2] Read SSR and check that the RDRF
flag is set to 1, then read the receive
data in RDR.
When data is read from RDR, the
RDRF flag is automatically cleared to
0.
[3] To continue serial transmission/
reception, before the MSB (bit 7) of
the current frame is received, finish
reading the RDRF flag, reading RDR.
Also, before the MSB (bit 7) of the
current frame is transmitted, read 1
from the TDRE flag to confirm that
writing is possible. Then write data to
TDR.
When data is written to TDR, the
TDRE flag is automatically cleared to
0. When data is read from RDR, the
RDRF flag is automatically cleared to
0.
[4] If an overrun error occurs, read the
OER flag in SSR, and after
performing the appropriate error
processing, clear the OER flag to 0.
Transmission/reception cannot be
resumed if the OER flag is set to 1.
For overrun error processing, see
figure 14.14.
Figure 14.15 Sample Flowchart of Simultaneous Serial Transmit and Receive Operations
(Clocked Synchronous Mode)
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 227 of 408
REJ09B0105-0300
14.6 Multiprocessor Communication Function
Use of the multiprocessor communication function enables data transfer between a number of
processors sharing communication lines by asynchronous serial communication using the
multiprocessor format, in which a multiprocessor bit is added to the transfer data. When
multiprocessor communication is performed, each receiving station is addressed by a unique ID
code. The serial communication cycle consists of two component cycles; an ID transmission cycle
that specifies the receiving station, and a data transmission cycle. The multiprocessor bit is used to
differentiate between the ID transmission cycle and the data transmission cycle. If the
multiprocessor bit is 1, the cycle is an ID transmission cycle; if the multiprocessor bit is 0, the
cycle is a data transmission cycle. Figure 14.16 shows an example of inter-processor
communication using the multiprocessor format. The transmitting station first sends the ID code
of the receiving station with which it wants to perform serial communication as data with a 1
multiprocessor bit added. It then sends transmit data as data with a 0 multiprocessor bit added.
When data with a 1 multiprocessor bit is received, the receiving station compares that data with its
own ID. The station whose ID matches then receives the data sent next. Stations whose IDs do not
match continue to skip data until data with a 1 multiprocessor bit is again received.
SCI3 uses the MPIE bit in SCR3 to implement this function. When the MPIE bit is set to 1,
transfer of receive data from RSR to RDR, error flag detection, and setting the SSR status flags,
RDRF, FER, and OER, to 1, are inhibited until data with a 1 multiprocessor bit is received. On
reception of a receive character with a 1 multiprocessor bit, the MPBR bit in SSR is set to 1 and
the MPIE bit is automatically cleared, thus normal reception is resumed. If the RIE bit in SCR3 is
set to 1 at this time, an RXI interrupt is generated.
When the multiprocessor format is selected, the parity bit setting is rendered invalid. All other bit
settings are the same as those in normal asynchronous mode. The clock used for multiprocessor
communication is the same as that in normal asynchronous mode.
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 228 of 408
REJ09B0105-0300
Transmitting
station
Receiving
station A
Receiving
station B
Receiving
station C
Receiving
station D
(ID = 01) (ID = 02) (ID = 03) (ID = 04)
Serial transmission line
Serial
data
ID transmission cycle =
receiving station
specification
Data transmission cycle =
Data transmission to
receiving station specified by ID
(MPB = 1) (MPB = 0)
H'01 H'AA
[Legend]
MPB: Multiprocessor bit
Figure 14.16 Example of Inter-Processor Communication Using Multiprocessor Format
(Transmission of Data H'AA to Receiving Station A)
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 229 of 408
REJ09B0105-0300
14.6.1 Multiprocessor Serial Data Transmission
Figure 14.17 shows a sample flowchart for multiprocessor serial data transmission. For an ID
transmission cycle, set the MPBT bit in SSR to 1 before transmission. For a data transmission
cycle, clear the MPBT bit in SSR to 0 before transmission. All other SCI3 operations are the same
as those in asynchronous mode.
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 230 of 408
REJ09B0105-0300
No
<End>
Yes
Start transmission
Read TDRE flag in SSR[1]
Set MPBT bit in SSR
Yes
No
No
Yes
Read TEND flag in SSR
[2]
No
Yes
[3]
Clear PDR to 0 and set PCR to 1
Clear TE bit in SCR3 to 0
TDRE = 1
All data transmitted?
TEND = 1
Break output?
Write transmit data to TDR
[1] Read SSR and check that the TDRE
flag is set to 1, set the MPBT bit in
SSR to 0 or 1, then write transmit
data to TDR. When data is written to
TDR, the TDRE flag is automatically
cleared to 0.
[2] To continue serial transmission, be
sure to read 1 from the TDRE flag to
confirm that writing is possible, then
write data to TDR. When data is
written to TDR, the TDRE flag is
automatically cleared to 0.
[3] To output a break in serial
transmission, set the port PCR to 1,
clear PDR to 0, then clear the TE bit
in SCR3 to 0.
Figure 14.17 Sample Multiprocessor Serial Transmission Flowchart
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 231 of 408
REJ09B0105-0300
14.6.2 Multiprocessor Serial Data Reception
Figure 14.18 shows a sample flowchart for multiprocessor serial data reception. If the MPIE bit in
SCR3 is set to 1, data is skipped until data with a 1 multiprocessor bit is sent. On receiving data
with a 1 multiprocessor bit, the receive data is transferred to RDR. An RXI interrupt request is
generated at this time. All other SCI3 operations are the same as those in asynchronous mode.
Figure 14.19 shows an example of SCI3 operation for multiprocessor format reception.
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 232 of 408
REJ09B0105-0300
Yes
<End>
No
Start reception
No
Yes
[4]
Clear RE bit in SCR3 to 0
Error processing
(Continued on
next page)
[5]
Yes
No
FER+OER = 1
RDRF = 1
All data received?
Set MPIE bit in SCR3 to 1 [1]
[2]
Read OER and FER flags in SSR
Read RDRF flag in SSR [3]
Read receive data in RDR
No
Yes
[A]
This station’s ID?
Read OER and FER flags in SSR
Yes
No
Read RDRF flag in SSR
No
Yes
FER+OER = 1
Read receive data in RDR
RDRF = 1
[1] Set the MPIE bit in SCR3 to 1.
[2] Read OER and FER in SSR to check for
errors. Receive error processing is performed
in cases where a receive error occurs.
[3] Read SSR and check that the RDRF flag is
set to 1, then read the receive data in RDR
and compare it with this station’s ID.
If the data is not this station’s ID, set the MPIE
bit to 1 again.
When data is read from RDR, the RDRF flag
is automatically cleared to 0.
[4] Read SSR and check that the RDRF flag is
set to 1, then read the data in RDR.
[5] If a receive error occurs, read the OER and
FER flags in SSR to identify the error. After
performing the appropriate error processing,
ensure that the OER and FER flags are all
cleared to 0.
Reception cannot be resumed if either of
these flags is set to 1.
In the case of a framing error, a break can be
detected by reading the RxD pin value.
Figure 14.18 Sample Multiprocessor Serial Reception Flowchart (1)
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 233 of 408
REJ09B0105-0300
<End>
Error processing
Yes
No
Clear OER, and
FER flags in SSR to 0
No
Yes
No
Yes
Framing error processing
Overrun error processing
OER = 1
FER = 1
Break?
[5]
[A]
Figure 14.18 Sample Multiprocessor Serial Reception Flowchart (2)
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 234 of 408
REJ09B0105-0300
1 frame
Start
bit
Start
bit
Receive
data (ID1)
Receive data
(Data1)
MPB MPB
Stop
bit
Stop
bit
Mark state
(idle state)
1 frame
01D0D1D711 110D0D1 D7
ID1
0
Serial
data
MPIE
RDRF
RDR
value
RDR
value
LSI
operation
RXI interrupt
request
MPIE cleared
to 0
User
processing
RDRF flag
cleared
to 0
RXI interrupt request
is not generated, and
RDR retains its state
RDR data read When data is not
this station's ID,
MPIE is set to 1
again
1 frame
Start
bit
Start
bit
Receive
data (ID2)
Receive data
(Data2)
MPB MPB
Stop
bit
Stop
bit
Mark state
(idle state)
1 frame
01D0D1D711 110
(a) When data does not match this receiver's ID
(b) When data matches this receiver's ID
D0 D1 D7
ID2 Data2ID1
0
Serial
data
MPIE
RDRF
LSI
operation
RXI interrupt
request
MPIE cleared
to 0
User
processing
RDRF flag
cleared
to 0
RXI interrupt
request
RDRF flag
cleared
to 0
RDR data read When data is
this station's
ID, reception
is continued
RDR data read
MPIE set to 1
again
Figure 14.19 Example of SCI3 Reception Using Multiprocessor Format
(Example with 8-Bit Data, Multiprocessor Bit, One Stop Bit)
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 235 of 408
REJ09B0105-0300
14.7 Interrupts
SCI3 creates the following six interrupt requests: transmission end, transmit data empty, receive
data full, and receive errors (overrun error, framing error, and parity error). Table 14.6 shows the
interrupt sources.
Table 14.6 SCI3 Interrupt Requests
Interrupt Requests Abbreviation Interrupt Sources
Receive Data Full RXI Setting RDRF in SSR
Transmit Data Empty TXI Setting TDRE in SSR
Transmission End TEI Setting TEND in SSR
Receive Error ERI Setting OER, FER, and PER in SSR
The initial value of the TDRE flag in SSR is 1. Thus, when the TIE bit in SCR3 is set to 1 before
transferring the transmit data to TDR, a TXI interrupt request is generated even if the transmit data
is not ready. The initial value of the TEND flag in SSR is 1. Thus, when the TEIE bit in SCR3 is
set to 1 before transferring the transmit data to TDR, a TEI interrupt request is generated even if
the transmit data has not been sent. It is possible to make use of the most of these interrupt
requests efficiently by transferring the transmit data to TDR in the interrupt routine. To prevent
the generation of these interrupt requests (TXI and TEI), set the enable bits (TIE and TEIE) that
correspond to these interrupt requests to 1, after transferring the transmit data to TDR.
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 236 of 408
REJ09B0105-0300
14.8 Usage Notes
14.8.1 Break Detection and Processing
When framing error detection is performed, a break can be detected by reading the RXD pin value
directly. In a break, the input from the RXD pin becomes all 0s, setting the FER flag, and possibly
the PER flag. Note that as SCI3 continues the receive operation after receiving a break, even if the
FER flag is cleared to 0, it will be set to 1 again.
14.8.2 Mark State and Break Sending
When the TXD bit in PMR1 is 1, the TxD pin is used as an I/O port whose direction (input or
output) and level are determined by PCR and PDR. This can be used to set the TxD pin to mark
state (high level) or send a break during serial data transmission. To maintain the communication
line at mark state until TE is set to 1, set PCR and PDR to 1 respectively, and also set the TXD bit
to 1. At this time, the TxD pin becomes an I/O port, and 1 is output from the TxD pin. To send a
break during serial data transmission, first set PCR to 1 and clear PDR to 0, and then set the TXD
bit to 1. Regardless of the current transmission state, the TxD pin becomes an I/O port, and 0 is
output from the TxD pin.
14.8.3 Receive Error Flags and Transmit Operations (Clocked Synchronous Mode Only)
Transmission cannot be started when a receive error flag (OER, PER, or FER) is set to 1, even if
the TDRE flag is cleared to 0. Be sure to clear the receive error flags to 0 before starting
transmission. Note also that receive error flags cannot be cleared to 0 even if the RE bit is cleared
to 0.
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 237 of 408
REJ09B0105-0300
14.8.4 Receive Data Sampling Timing and Reception Margin in Asynchronous Mode
In asynchronous mode, SCI3 operates on a basic clock with a frequency of 16 times the transfer
rate. In reception, SCI3 samples the falling edge of the start bit using the basic clock, and performs
internal synchronization. Receive data is latched internally at the rising edge of the 8th pulse of the
basic clock as shown in figure 14.20. Thus, the reception margin in asynchronous mode is given
by formula (1) below.
M = (0.5 – ) – – (L – 0.5) F × 100(%)
1
2N
D – 0.5
N
... Formula (1)
Legend N : Ratio of bit rate to clock (N = 16)
D : Clock duty (D = 0.5 to 1.0)
L : Frame length (L = 9 to 12)
F : Absolute value of clock rate deviation
Assuming values of F (absolute value of clock rate deviation) = 0 and D (clock duty) = 0.5 in
formula (1), the reception margin can be given by the formula.
M = {0.5 – 1/(2 × 16)} × 100 [%] = 46.875%
However, this is only the computed value, and a margin of 20% to 30% should be allowed for in
system design.
Internal basic
clock
16 clocks
8 clocks
Receive data
(RxD)
Synchronization
sampling timing
Start bit D0 D1
Data sampling
timing
15 0 7 15 00 7
Figure 14.20 Receive Data Sampling Timing in Asynchronous Mode
Section 14 Serial Communication Interface 3 (SCI3)
Rev. 3.00 Sep. 14, 2006 Page 238 of 408
REJ09B0105-0300
Section 15 I2C Bus Interface 2 (IIC2)
IFIIC10A_000020030300 Rev. 3.00 Sep. 14, 2006 Page 239 of 408
REJ09B0105-0300
Section 15 I2C Bus Interface 2 (IIC2)
The I2C bus interface 2 conforms to and provides a subset of the Philips I2C bus (inter-IC bus)
interface functions. The register configuration that controls the I2C bus differs partly from the
Philips configuration, however.
Figure 15.1 shows a block diagram of the I2C bus interface 2.
Figure 15.2 shows an example of I/O pin connections to external circuits.
15.1 Features
• Selection of I2C format or clocked synchronous serial format
• Continuous transmission/reception
Since the shift register, transmit data register, and receive data register are independent from
each other, the continuous transmission/reception can be performed.
I2C bus format:
• Start and stop conditions generated automatically in master mode
• Selection of acknowledge output levels when receiving
• Automatic loading of acknowledge bit when transmitting
• Bit synchronization/wait function
In master mode, the state of SCL is monitored per bit, and the timing is synchronized
automatically.
If transmission/reception is not yet possible, set the SCL to low until preparations are
completed.
• Six interrupt sources
Transmit data empty (including slave-address match), transmit end, receive data full (including
slave-address match), arbitration lost, NACK detection, and stop condition detection
• Direct bus drive
Two pins, SCL and SDA pins, function as NMOS open-drain outputs when the bus drive
function is selected.
Clocked synchronous format:
• Four interrupt sources
Transmit-data-empty, transmit-end, receive-data-full, and overrun error
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 240 of 408
REJ09B0105-0300
SCL
ICCR1
Transfer clock
generation
circuit
Address
comparator
Interrupt
generator Interrupt request
Bus state
decision circuit
Arbitration
decision circuit
Noise canceler
Noise canceler
Output
control
Output
control
Transmit/
receive
control circuit
ICCR2
ICMR
ICSR
ICIER
ICDRR
ICDRS
ICDRT
I2C bus control register 1
I2C bus control register 2
I2C bus mode register
I2C bus status register
I2C bus interrupt enable register
I2C bus transmit data register
I2C bus receive data register
I2C bus shift register
Slave address register
[Legend]
ICCR1:
ICCR2:
ICMR:
ICSR:
ICIER:
ICDRT:
ICDRR:
ICDRS:
SAR:
SAR
SDA
Internal data bus
Figure 15.1 Block Diagram of I2C Bus Interface 2
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 241 of 408
REJ09B0105-0300
Vcc Vcc
SCL in
SCL out
SCL
SDA in
SDA out
SDA
SCL
(Master)
(Slave 1) (Slave 2)
SDA
SCL in
SCL out
SCL
SDA in
SDA out
SDA
SCL in
SCL out
SCL
SDA in
SDA out
SDA
Figure 15.2 External Circuit Connections of I/O Pins
15.2 Input/Output Pins
Table 15.1 summarizes the input/output pins used by the I2C bus interface 2.
Table 15.1 Pin Configuration
Name Abbreviation I/O Function
Serial clock SCL I/O I2C serial clock input/output
Serial data SDA I/O I2C serial data input/output
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 242 of 408
REJ09B0105-0300
15.3 Register Descriptions
The I2C bus interface 2 has the following registers.
• I2C bus control register 1 (ICCR1)
• I2C bus control register 2 (ICCR2)
• I2C bus mode register (ICMR)
• I2C bus interrupt enable register (ICIER)
• I2C bus status register (ICSR)
• I2C bus slave address register (SAR)
• I2C bus transmit data register (ICDRT)
• I2C bus receive data register (ICDRR)
• I2C bus shift register (ICDRS)
15.3.1 I2C Bus Control Register 1 (ICCR1)
ICCR1 enables or disables the I2C bus interface 2, controls transmission or reception, and selects
master or slave mode, transmission or reception, and transfer clock frequency in master mode.
Bit Bit Name Initial Value R/W Description
7 ICE 0 R/W I2C Bus Interface Enable
0: This module is halted. (SCL and SDA pins are set to
port function.)
1: This bit is enabled for transfer operations. (SCL and
SDA pins are bus drive state.)
6 RCVD 0 R/W Reception Disable
This bit enables or disables the next operation when TRS
is 0 and ICDRR is read.
0: Enables next reception
1: Disables next reception
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 243 of 408
REJ09B0105-0300
Bit Bit Name Initial Value R/W Description
5
4
MST
TRS
0
0
R/W
R/W
Master/Slave Select
Transmit/Receive Select
In master mode with the I2C bus format, when arbitration is
lost, MST and TRS are both reset by hardware, causing a
transition to slave receive mode. Modification of the TRS
bit should be made between transfer frames.
After data receive has been started in slave receive mode,
when the first seven bits of the receive data agree with the
slave address that is set to SAR and the eighth bit is 1,
TRS is automatically set to 1. If an overrun error occurs in
master mode with the clock synchronous serial format,
MST is cleared to 0 and slave receive mode is entered.
Operating modes are described below according to MST
and TRS combination. When clocked synchronous serial
format is selected and MST is 1, clock is output.
00: Slave receive mode
01: Slave transmit mode
10: Master receive mode
11: Master transmit mode
3 to 0 CKS3 to
CKS0
All 0 R/W Transfer Clock Select 3 to 0
These bits should be set according to the necessary
transfer rate (see table 15.2) in master mode. In slave
mode, these bits are used reservation of the set up time in
transmit mode. The time is 10tcyc when CKS3 = 0, and
20tcyc when CKS3 = 1.
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 244 of 408
REJ09B0105-0300
Table 15.2 Transfer Rate
Bit 3 Bit 2 Bit 1 Bit 0 Transfer Rate
CKS3 CKS2 CKS1 CKS0
Clock φ = 5 MHz φ = 8 MHz φ = 10 MHz
0 φ/28 179 kHz 286 kHz 357 kHz 0
1 φ/40 125 kHz 200 kHz 250 kHz
0 φ/48 104 kHz 167 kHz 208 kHz
0
1
1 φ/64 78.1 kHz 125 kHz 156 kHz
0 φ/80 100 kHz 125 kHz 0
1 φ/100
62.5 kHz
50.0 kHz 80.0 kHz 100 kHz
0 φ/112 44.6 kHz 71.4 kHz 89.3 kHz
0
1
1
1 φ/128 39.1 kHz 62.5 kHz 78.1 kHz
0 φ/56 89.3 kHz 143 kHz 179 kHz 0
1 φ/80 62.5 kHz 100 kHz 125 kHz
0 φ/96 52.1 kHz 83.3 kHz 104 kHz
0
1
1 φ/128 39.1 kHz 62.5 kHz 78.1 kHz
0 φ/160 31.3 kHz 50.0 kHz 62.5 kHz 0
1 φ/200 25.0 kHz 40.0 kHz 50.0 kHz
0 φ/224 22.3 kHz 35.7 kHz 44.6 kHz
1
1
1
1 φ/256 19.5 kHz 31.3 kHz 39.1 kHz
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 245 of 408
REJ09B0105-0300
15.3.2 I2C Bus Control Register 2 (ICCR2)
ICCR2 issues start/stop conditions, manipulates the SDA pin, monitors the SCL pin, and controls
reset in the control part of the I2C bus interface 2.
Bit Bit Name Initial Value R/W Description
7 BBSY 0 R/W Bus Busy
This bit enables to confirm whether the I2C bus is occupied or
released and to issue start/stop conditions in master mode.
With the clocked synchronous serial format, this bit has no
meaning. With the I2C bus format, this bit is set to 1 when the
SDA level changes from high to low under the condition of
SCL = high, assuming that the start condition has been
issued. This bit is cleared to 0 when the SDA level changes
from low to high under the condition of SCL = high, assuming
that the stop condition has been issued. Write 1 to BBSY and
0 to SCP to issue a start condition. Follow this procedure
when also re-transmitting a start condition. Write 0 in BBSY
and 0 in SCP to issue a stop condition. To issue start/stop
conditions, use the MOV instruction.
6 SCP 1 R/W Start/Stop Issue Condition Disable
The SCP bit controls the issue of start/stop conditions in
master mode.
To issue a start condition, write 1 in BBSY and 0 in SCP. A
retransmit start condition is issued in the same way. To issue
a stop condition, write 0 in BBSY and 0 in SCP. This bit is
always read as 1. If 1 is written, the data is not stored.
5 SDAO 1 R/W SDA Output Value Control
This bit is used with SDAOP when modifying output level of
SDA. This bit should not be manipulated during transfer.
0: When reading, SDA pin outputs low.
When writing, SDA pin is changed to output low.
1: When reading, SDA pin outputs high.
When writing, SDA pin is changed to output Hi-Z (outputs
high by external pull-up resistance).
4 SDAOP 1 R/W SDAO Write Protect
This bit controls change of output level of the SDA pin by
modifying the SDAO bit. To change the output level, clear
SDAO and SDAOP to 0 or set SDAO to 1 and clear SDAOP
to 0 by the MOV instruction. This bit is always read as 1.
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 246 of 408
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Bit Bit Name Initial Value R/W Description
3 SCLO 1 R This bit monitors SCL output level. When SCLO is 1, SCL pin
outputs high. When SCLO is 0, SCL pin outputs low.
2 1 Reserved
This bit is always read as 1.
1 IICRST 0 R/W IIC Control Part Reset
This bit resets the control part except for I2C registers. If this
bit is set to 1 when hang-up occurs because of
communication failure during I2C operation, I2C control part
can be reset without setting ports and initializing registers.
0 1 Reserved
This bit is always read as 1.
15.3.3 I2C Bus Mode Register (ICMR)
ICMR selects whether the MSB or LSB is transferred first, performs master mode wait control,
and selects the transfer bit count.
Bit Bit Name Initial Value R/W Description
7 MLS 0 R/W MSB-First/LSB-First Select
0: MSB-first
1: LSB-first
Set this bit to 0 when the I2C bus format is used.
6 WAIT 0 R/W Wait Insertion Bit
In master mode with the I2C bus format, this bit selects
whether to insert a wait after data transfer except the
acknowledge bit. When WAIT is set to 1, after the fall of the
clock for the final data bit, low period is extended for two
transfer clocks. If WAIT is cleared to 0, data and
acknowledge bits are transferred consecutively with no wait
inserted.
The setting of this bit is invalid in slave mode with the I2C bus
format or with the clocked synchronous serial format.
5, 4 All 1 Reserved
These bits are always read as 1.
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 247 of 408
REJ09B0105-0300
Bit Bit Name Initial Value R/W Description
3 BCWP 1 R/W BC Write Protect
This bit controls the BC2 to BC0 modifications. When
modifying BC2 to BC0, this bit should be cleared to 0 and
use the MOV instruction. In clock synchronous serial mode,
BC should not be modified.
0: When writing, values of BC2 to BC0 are set.
1: When reading, 1 is always read.
When writing, settings of BC2 to BC0 are invalid.
2
1
0
BC2
BC1
BC0
0
0
0
R/W
R/W
R/W
Bit Counter 2 to 0
These bits specify the number of bits to be transferred next.
When read, the remaining number of transfer bits is
indicated. With the I2C bus format, the data is transferred with
one addition acknowledge bit. Bit BC2 to BC0 settings should
be made during an interval between transfer frames. If bits
BC2 to BC0 are set to a value other than 000, the setting
should be made while the SCL pin is low. The value returns
to 000 at the end of a data transfer, including the
acknowledge bit. With the clock synchronous serial format,
these bits should not be modified.
I2C Bus Format Clock Synchronous Serial Format
000: 9 bits 000: 8 bits
001: 2 bits 001: 1 bits
010: 3 bits 010: 2 bits
011: 4 bits 011: 3 bits
100: 5 bits 100: 4 bits
101: 6 bits 101: 5 bits
110: 7 bits 110: 6 bits
111: 8 bits 111: 7 bits
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 248 of 408
REJ09B0105-0300
15.3.4 I2C Bus Interrupt Enable Register (ICIER)
ICIER enables or disables interrupt sources and acknowledge bits, sets acknowledge bits to be
transferred, and confirms acknowledge bits to be received.
Bit Bit Name Initial Value R/W Description
7 TIE 0 R/W Transmit Interrupt Enable
When the TDRE bit in ICSR is set to 1, this bit enables or
disables the transmit data empty interrupt (TXI).
0: Transmit data empty interrupt request (TXI) is disabled.
1: Transmit data empty interrupt request (TXI) is enabled.
6 TEIE 0 R/W Transmit End Interrupt Enable
This bit enables or disables the transmit end interrupt (TEI) at
the rising of the ninth clock while the TDRE bit in ICSR is 1.
TEI can be canceled by clearing the TEND bit or the TEIE bit
to 0.
0: Transmit end interrupt request (TEI) is disabled.
1: Transmit end interrupt request (TEI) is enabled.
5 RIE 0 R/W Receive Interrupt Enable
This bit enables or disables the receive data full interrupt
request (RXI) and the overrun error interrupt request (ERI)
with the clocked synchronous format, when a receive data is
transferred from ICDRS to ICDRR and the RDRF bit in ICSR
is set to 1. RXI can be canceled by clearing the RDRF or RIE
bit to 0.
0: Receive data full interrupt request (RXI) and overrun error
interrupt request (ERI) with the clocked synchronous
format are disabled.
1: Receive data full interrupt request (RXI) and overrun error
interrupt request (ERI) with the clocked synchronous
format are enabled.
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 249 of 408
REJ09B0105-0300
Bit Bit Name Initial Value R/W Description
4 NAKIE 0 R/W NACK Receive Interrupt Enable
This bit enables or disables the NACK receive interrupt
request (NAKI) and the overrun error (setting of the OVE bit
in ICSR) interrupt request (ERI) with the clocked
synchronous format, when the NACKF and AL bits in ICSR
are set to 1. NAKI can be canceled by clearing the NACKF,
OVE, or NAKIE bit to 0.
0: NACK receive interrupt request (NAKI) is disabled.
1: NACK receive interrupt request (NAKI) is enabled.
3 STIE 0 R/W Stop Condition Detection Interrupt Enable
0: Stop condition detection interrupt request (STPI) is
disabled.
1: Stop condition detection interrupt request (STPI) is
enabled.
2 ACKE 0 R/W Acknowledge Bit Judgement Select
0: The value of the receive acknowledge bit is ignored, and
continuous transfer is performed.
1: If the receive acknowledge bit is 1, continuous transfer is
halted.
1 ACKBR 0 R Receive Acknowledge
In transmit mode, this bit stores the acknowledge data that
are returned by the receive device. This bit cannot be
modified.
0: Receive acknowledge = 0
1: Receive acknowledge = 1
0 ACKBT 0 R/W Transmit Acknowledge
In receive mode, this bit specifies the bit to be sent at the
acknowledge timing.
0: 0 is sent at the acknowledge timing.
1: 1 is sent at the acknowledge timing.
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 250 of 408
REJ09B0105-0300
15.3.5 I2C Bus Status Register (ICSR)
ICSR performs confirmation of interrupt request flags and status.
Bit Bit Name Initial Value R/W Description
7 TDRE 0 R/W Transmit Data Register Empty
[Setting conditions]
• When data is transferred from ICDRT to ICDRS and
ICDRT becomes empty
• When TRS is set
• When a start condition (including re-transfer) has been
issued
• When transmit mode is entered from receive mode in
slave mode
[Clearing conditions]
• When 0 is written in TDRE after reading TDRE = 1
• When data is written to ICDRT with an instruction
6 TEND 0 R/W Transmit End
[Setting conditions]
• When the ninth clock of SCL rises with the I2C bus format
while the TDRE flag is 1
• When the final bit of transmit frame is sent with the clock
synchronous serial format
[Clearing conditions]
• When 0 is written in TEND after reading TEND = 1
• When data is written to ICDRT with an instruction
5 RDRF 0 R/W Receive Data Register Full
[Setting condition]
• When a receive data is transferred from ICDRS to ICDRR
[Clearing conditions]
• When 0 is written in RDRF after reading RDRF = 1
• When ICDRR is read with an instruction
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 251 of 408
REJ09B0105-0300
Bit Bit Name Initial Value R/W Description
4 NACKF 0 R/W No Acknowledge Detection Flag
[Setting condition]
• When no acknowledge is detected from the receive
device in transmission while the ACKE bit in ICIER is 1
[Clearing condition]
• When 0 is written in NACKF after reading NACKF = 1
3 STOP 0 R/W Stop Condition Detection Flag
[Setting conditions]
• In master mode, when a stop condition is detected after
frame transfer
• In slave mode, when a stop condition is detected
after the general call address or the first byte slave
address, next to detection of start condition, accords
with the address set in SAR
[Clearing condition]
• When 0 is written in STOP after reading STOP = 1
2 AL/OVE 0 R/W Arbitration Lost Flag/Overrun Error Flag
This flag indicates that arbitration was lost in master mode
with the I2C bus format and that the final bit has been
received while RDRF = 1 with the clocked synchronous
format.
When two or more master devices attempt to seize the bus
at nearly the same time, if the I2C bus interface detects data
differing from the data it sent, it sets AL to 1 to indicate that
the bus has been taken by another master.
[Setting conditions]
• If the internal SDA and SDA pin disagree at the rise of
SCL in master transmit mode
• When the SDA pin outputs high in master mode while a
start condition is detected
• When the final bit is received with the clocked
synchronous format while RDRF = 1
[Clearing condition]
• When 0 is written in AL/OVE after reading AL/OVE=1
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 252 of 408
REJ09B0105-0300
Bit Bit Name Initial Value R/W Description
1 AAS 0 R/W Slave Address Recognition Flag
In slave receive mode, this flag is set to 1 if the first frame
following a start condition matches bits SVA6 to SVA0 in
SAR.
[Setting conditions]
• When the slave address is detected in slave receive
mode
• When the general call address is detected in slave
receive mode.
[Clearing condition]
• When 0 is written in AAS after reading AAS=1
0 ADZ 0 R/W General Call Address Recognition Flag
This bit is valid in I2C bus format slave receive mode.
[Setting condition]
• When the general call address is detected in slave
receive mode
[Clearing condition]
• When 0 is written in ADZ after reading ADZ=1
15.3.6 Slave Address Register (SAR)
SAR selects the communication format and sets the slave address. When the chip is in slave mode
with the I2C bus format, if the upper 7 bits of SAR match the upper 7 bits of the first frame
received after a start condition, the chip operates as the slave device.
Bit Bit Name Initial Value R/W Description
7 to 1 SVA6 to
SVA0
All 0 R/W Slave Address 6 to 0
These bits set a unique address in bits SVA6 to SVA0,
differing form the addresses of other slave devices
connected to the I2C bus.
0 FS 0 R/W Format Select
0: I2C bus format is selected.
1: Clocked synchronous serial format is selected.
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 253 of 408
REJ09B0105-0300
15.3.7 I2C Bus Transmit Data Register (ICDRT)
ICDRT is an 8-bit readable/writable register that stores the transmit data. When ICDRT detects the
space in the shift register (ICDRS), it transfers the transmit data which is written in ICDRT to
ICDRS and starts transferring data. If the next transfer data is written to ICDRT during
transferring data of ICDRS, continuous transfer is possible. If the MLS bit of ICMR is set to 1 and
when the data is written to ICDRT, the MSB/LSB inverted data is read. The initial value of
ICDRT is H'FF.
15.3.8 I2C Bus Receive Data Register (ICDRR)
ICDRR is an 8-bit register that stores the receive data. When data of one byte is received, ICDRR
transfers the receive data from ICDRS to ICDRR and the next data can be received. ICDRR is a
receive-only register, therefore the CPU cannot write to this register. The initial value of ICDRR
is H'FF.
15.3.9 I2C Bus Shift Register (ICDRS)
ICDRS is a register that is used to transfer/receive data. In transmission, data is transferred from
ICDRT to ICDRS and the data is sent from the SDA pin. In reception, data is transferred from
ICDRS to ICDRR after data of one byte is received. This register cannot be read directly from the
CPU.
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 254 of 408
REJ09B0105-0300
15.4 Operation
The I2C bus interface can communicate either in I2C bus mode or clocked synchronous serial mode
by setting FS in SAR.
15.4.1 I2C Bus Format
Figure 15.3 shows the I2C bus formats. Figure 15.4 shows the I2C bus timing. The first frame
following a start condition always consists of 8 bits.
S SLA R/WA DATA A A/AP
1111n7
1m
(a) I
2
C bus format (FS = 0)
(b) I
2
C bus format (Start condition retransmission, FS = 0)
n: Transfer bit count
(n = 1 to 8)
m: Transfer frame count
(m ≥ 1)
S SLA R/WA DATA
111n17
1m1
S SLA R/WA DATA A/AP
111n27
1 m2
111
A/A
n1 and n2: Transfer bit count (n1 and n2 = 1 to 8)
m1 and m2: Transfer frame count (m1 and m2 ≥ 1)
11
Figure 15.3 I2C Bus Formats
SDA
SCL
S
1-7
SLA
8
R/W
9
A
1-7
DATA
89 1-7 89
A DATA P
A
Figure 15.4 I2C Bus Timing
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 255 of 408
REJ09B0105-0300
[Legend]
S: Start condition. The master device drives SDA from high to low while SCL is high.
SLA: Slave address
R/W: Indicates the direction of data transfer: from the slave device to the master device when
R/W is 1, or from the master device to the slave device when R/W is 0.
A: Acknowledge. The receive device drives SDA to low.
DATA: Transfer data
P: Stop condition. The master device drives SDA from low to high while SCL is high.
15.4.2 Master Transmit Operation
In master transmit mode, the master device outputs the transmit clock and transmit data, and the
slave device returns an acknowledge signal. For master transmit mode operation timing, refer to
figures 15.5 and 15.6. The transmission procedure and operations in master transmit mode are
described below.
1. Set the ICE bit in ICCR1 to 1. Set the MLS and WAIT bits in ICMR and the CKS3 to CKS0
bits in ICCR1 to 1. (Initial setting)
2. Read the BBSY flag in ICCR2 to confirm that the bus is free. Set the MST and TRS bits in
ICCR1 to select master transmit mode. Then, write 1 to BBSY and 0 to SCP using MOV
instruction. (Start condition issued) This generates the start condition.
3. After confirming that TDRE in ICSR has been set, write the transmit data (the first byte data
show the slave address and R/W) to ICDRT. At this time, TDRE is automatically cleared to 0,
and data is transferred from ICDRT to ICDRS. TDRE is set again.
4. When transmission of one byte data is completed while TDRE is 1, TEND in ICSR is set to 1
at the rise of the 9th transmit clock pulse. Read the ACKBR bit in ICIER, and confirm that the
slave device has been selected. Then, write second byte data to ICDRT. When ACKBR is 1,
the slave device has not been acknowledged, so issue the stop condition. To issue the stop
condition, write 0 to BBSY and SCP using MOV instruction. SCL is fixed low until the
transmit data is prepared or the stop condition is issued.
5. The transmit data after the second byte is written to ICDRT every time TDRE is set.
6. Write the number of bytes to be transmitted to ICDRT. Wait until TEND is set (the end of last
byte data transmission) while TDRE is 1, or wait for NACK (NACKF in ICSR = 1) from the
receive device while ACKE in ICIER is 1. Then, issue the stop condition to clear TEND or
NACKF.
7. When the STOP bit in ICSR is set to 1, the operation returns to the slave receive mode.
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 256 of 408
REJ09B0105-0300
TDRE
SCL
(Master output)
SDA
(Master output)
SDA
(Slave output)
TEND
[5] Write data to ICDRT (third byte)
ICDRT
ICDRS
[2] Instruction of start
condition issuance [3] Write data to ICDRT (first byte)
[4] Write data to ICDRT (second byte)
User
processing
1
Bit 7
Slave address
Address + R/WData 1
Data 1
Data 2
Address + R/W
Bit 6 Bit 7 Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0
2123456789
A
R/W
Figure 15.5 Master Transmit Mode Operation Timing (1)
TDRE
[6] Issue stop condition. Clear TEND.
[7] Set slave receive mode
TEND
ICDRT
ICDRS
19 23456789
AA/A
SCL
(Master output)
SDA
(Master output)
SDA
(Slave output)
Bit 7 Bit 6
Data n
Data n
Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
[5] Write data to ICDRT
User
processing
Figure 15.6 Master Transmit Mode Operation Timing (2)
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 257 of 408
REJ09B0105-0300
15.4.3 Master Receive Operation
In master receive mode, the master device outputs the receive clock, receives data from the slave
device, and returns an acknowledge signal. For master receive mode operation timing, refer to
figures 15.7 and 15.8. The reception procedure and operations in master receive mode are shown
below.
1. Clear the TEND bit in ICSR to 0, then clear the TRS bit in ICCR1 to 0 to switch from master
transmit mode to master receive mode. Then, clear the TDRE bit to 0.
2. When ICDRR is read (dummy data read), reception is started, and the receive clock is output,
and data received, in synchronization with the internal clock. The master device outputs the
level specified by ACKBT in ICIER to SDA, at the 9th receive clock pulse.
3. After the reception of first frame data is completed, the RDRF bit in ICST is set to 1 at the rise
of 9th receive clock pulse. At this time, the receive data is read by reading ICDRR, and RDRF
is cleared to 0.
4. The continuous reception is performed by reading ICDRR every time RDRF is set. If 8th
receive clock pulse falls after reading ICDRR by the other processing while RDRF is 1, SCL is
fixed low until ICDRR is read.
5. If next frame is the last receive data, set the RCVD bit in ICCR1 to 1 before reading ICDRR.
This enables the issuance of the stop condition after the next reception.
6. When the RDRF bit is set to 1 at rise of the 9th receive clock pulse, issue the stage condition.
7. When the STOP bit in ICSR is set to 1, read ICDRR. Then clear the RCVD bit to 0.
8. The operation returns to the slave receive mode.
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 258 of 408
REJ09B0105-0300
TDRE
TEND
ICDRS
ICDRR
[1] Clear TDRE after clearing
TEND and TRS
[2] Read ICDRR (dummy read)
[3] Read ICDRR
1
A
2134567899
A
TRS
RDRF
SCL
(Master output)
SDA
(Master output)
SDA
(Slave output) Bit 7
Master transmit mode Master receive mode
Bit 7Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
User
processing
Data 1
Data 1
Figure 15.7 Master Receive Mode Operation Timing (1)
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 259 of 408
REJ09B0105-0300
RDRF
RCVD
ICDRS
ICDRR
Data n-1 Data n
Data n
Data n-1
[5] Read ICDRR after setting RCVD [6] Issue stop
condition
[7] Read ICDRR,
and clear RCVD [8] Set slave
receive mode
19 23456789
AA/A
SCL
(Master output)
SDA
(Master output)
SDA
(Slave output) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
User
processing
Figure 15.8 Master Receive Mode Operation Timing (2)
15.4.4 Slave Transmit Operation
In slave transmit mode, the slave device outputs the transmit data, while the master device outputs
the receive clock and returns an acknowledge signal. For slave transmit mode operation timing,
refer to figures 15.9 and 15.10.
The transmission procedure and operations in slave transmit mode are described below.
1. Set the ICE bit in ICCR1 to 1. Set the MLS and WAIT bits in ICMR and the CKS3 to CKS0
bits in ICCR1 to 1. (Initial setting) Set the MST and TRS bits in ICCR1 to select slave receive
mode, and wait until the slave address matches.
2. When the slave address matches in the first frame following detection of the start condition,
the slave device outputs the level specified by ACKBT in ICIER to SDA, at the rise of the 9th
clock pulse. At this time, if the 8th bit data (R/W) is 1, the TRS and ICSR bits in ICCR1 are
set to 1, and the mode changes to slave transmit mode automatically. The continuous
transmission is performed by writing transmit data to ICDRT every time TDRE is set.
3. If TDRE is set after writing last transmit data to ICDRT, wait until TEND in ICSR is set to 1,
with TDRE = 1. When TEND is set, clear TEND.
4. Clear TRS for the end processing, and read ICDRR (dummy read). SCL is free.
5. Clear TDRE.
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 260 of 408
REJ09B0105-0300
TDRE
TEND
ICDRS
ICDRR
1
A
2134567899
A
TRS
ICDRT
SCL
(Master output)
Slave receive mode Slave transmit mode
SDA
(Master output)
SDA
(Slave output)
SCL
(Slave output)
Bit 7 Bit 7
Data 1
Data 1
Data 2 Data 3
Data 2
Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0
[2] Write data to ICDRT (data 1) [2] Write data to ICDRT (data 2) [2] Write data to ICDRT (data 3)
User
processing
Figure 15.9 Slave Transmit Mode Operation Timing (1)
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 261 of 408
REJ09B0105-0300
TDRE
Data n
TEND
ICDRS
ICDRR
19 23456789
TRS
ICDRT
A
SCL
(Master output)
SDA
(Master output)
SDA
(Slave output)
SCL
(Slave output)
Bit 7
Slave transmit mode
Slave receive
mode
Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
A
[3] Clear TEND [5] Clear TDRE
[4] Read ICDRR (dummy read)
after clearing TRS
User
processing
Figure 15.10 Slave Transmit Mode Operation Timing (2)
15.4.5 Slave Receive Operation
In slave receive mode, the master device outputs the transmit clock and transmit data, and the
slave device returns an acknowledge signal. For slave receive mode operation timing, refer to
figures 15.11 and 15.12. The reception procedure and operations in slave receive mode are
described below.
1. Set the ICE bit in ICCR1 to 1. Set the MLS and WAIT bits in ICMR and the CKS3 to CKS0
bits in ICCR1 to 1. (Initial setting) Set the MST and TRS bits in ICCR1 to select slave receive
mode, and wait until the slave address matches.
2. When the slave address matches in the first frame following detection of the start condition,
the slave device outputs the level specified by ACKBT in ICIER to SDA, at the rise of the 9th
clock pulse. At the same time, RDRF in ICSR is set to read ICDRR (dummy read). (Since the
read data show the slave address and R/W, it is not used.)
3. Read ICDRR every time RDRF is set. If 8th receive clock pulse falls while RDRF is 1, SCL is
fixed low until ICDRR is read. The change of the acknowledge before reading ICDRR, to be
returned to the master device, is reflected to the next transmit frame.
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 262 of 408
REJ09B0105-0300
4. The last byte data is read by reading ICDRR.
ICDRS
ICDRR
12 1345678 99
AA
RDRF
Data 1 Data 2
Data 1
SCL
(Master output)
SDA
(Master output)
SDA
(Slave output)
SCL
(Slave output)
Bit 7 Bit 7Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
[2] Read ICDRR (dummy read) [2] Read ICDRR
User
processing
Figure 15.11 Slave Receive Mode Operation Timing (1)
ICDRS
ICDRR
12345678 99
AA
RDRF
SCL
(Master output)
SDA
(Master output)
SDA
(Slave output)
SCL
(Slave output)
User
processing
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Data 1
[3] Set ACKBT [3] Read ICDRR [4] Read ICDRR
Data 2
Data 1
Figure 15.12 Slave Receive Mode Operation Timing (2)
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 263 of 408
REJ09B0105-0300
15.4.6 Clocked Synchronous Serial Format
This module can be operated with the clocked synchronous serial format, by setting the FS bit in
SAR to 1. When the MST bit in ICCR1 is 1, the transfer clock output from SCL is selected. When
MST is 0, the external clock input is selected.
(1) Data Transfer Format:
Figure 15.13 shows the clocked synchronous serial transfer format.
The transfer data is output from the rise to the fall of the SCL clock, and the data at the rising edge
of the SCL clock is guaranteed. The MLS bit in ICMR sets the order of data transfer, in either the
MSB first or LSB first. The output level of SDA can be changed during the transfer wait, by the
SDAO bit in ICCR2.
SDA Bit 0 Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7
SCL
Figure 15.13 Clocked Synchronous Serial Transfer Format
(2) Transmit Operation:
In transmit mode, transmit data is output from SDA, in synchronization with the fall of the transfer
clock. The transfer clock is output when MST in ICCR1 is 1, and is input when MST is 0. For
transmit mode operation timing, refer to figure 15.14. The transmission procedure and operations
in transmit mode are described below.
1. Set the ICE bit in ICCR1 to 1. Set the MST and CKS3 to CKS0 bits in ICCR1 to 1. (Initial
setting)
2. Set the TRS bit in ICCR1 to select the transmit mode. Then, TDRE in ICSR is set.
3. Confirm that TDRE has been set. Then, write the transmit data to ICDRT. The data is
transferred from ICDRT to ICDRS, and TDRE is set automatically. The continuous
transmission is performed by writing data to ICDRT every time TDRE is set. When changing
from transmit mode to receive mode, clear TRS while TDRE is 1.
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 264 of 408
REJ09B0105-0300
12 781 78 1
SCL
TRS
Bit 0
Data 1
Data 1
Data 2 Data 3
Data 2 Data 3
Bit 6 Bit 7 Bit 0 Bit 6 Bit 7 Bit 0
Bit 1
SDA
(Output)
TDRE
ICDRT
ICDRS
User
processing
[3] Write data
to ICDRT [3] Write data
to ICDRT [3] Write data
to ICDRT
[3] Write data
to ICDRT
[2] Set TRS
Figure 15.14 Transmit Mode Operation Timing
(3) Receive Operation:
In receive mode, data is latched at the rise of the transfer clock. The transfer clock is output when
MST in ICCR1 is 1, and is input when MST is 0. For receive mode operation timing, refer to
figure 15.15. The reception procedure and operations in receive mode are described below.
1. Set the ICE bit in ICCR1 to 1. Set the MST and CKS3 to CKS0 bits in ICCR1 to 1. (Initial
setting)
2. When the transfer clock is output, set MST to 1 to start outputting the receive clock.
3. When the receive operation is completed, data is transferred from ICDRS to ICDRR and
RDRF in ICSR is set. When MST = 1, the next byte can be received, so the clock is
continually output. The continuous reception is performed by reading ICDRR every time
RDRF is set. When the 8th clock is risen while RDRF is 1, the overrun is detected and
AL/OVE in ICSR is set. At this time, the previous reception data is retained in ICDRR.
4. To stop receiving when MST = 1, set RCVD in ICCR1 to 1, then read ICDRR. Then, SCL is
fixed high after receiving the next byte data.
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 265 of 408
REJ09B0105-0300
12 781 7812
SCL
MST
TRS
RDRF
ICDRS
ICDRR
SDA
(Input) Bit 0 Bit 6 Bit 7 Bit 0 Bit 6 Bit 7 Bit 0 Bit 1
Bit 1
User
processing
Data 1
Data 1
Data 2
Data 2
Data 3
[2] Set MST
(when outputting the clock) [3] Read ICDRR [3] Read ICDRR
Figure 15.15 Receive Mode Operation Timing
15.4.7 Noise Canceler
The logic levels at the SCL and SDA pins are routed through the noise canceler before being
latched internally. Figure 15.16 shows a block diagram of the noise canceler.
The noise canceler consists of two cascaded latches and a match detector. The SCL (or SDA)
input signal is sampled on the system clock, but is not passed forward to the next circuit unless the
outputs of both latches agree. If they do not agree, the previous value is held.
C
QD
March detector
Internal
SCL or SDA
signal
SCL or SDA
input signal
Sampling
clock
Sampling clock
System clock
period
Latch Latch
C
Q
D
Figure 15.16 Block Diagram of Noise Canceler
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 266 of 408
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15.4.8 Example of Use
Flowcharts in respective modes that use the I2C bus interface are shown in figures 15.17 to 15.20.
BBSY=0 ?
No
TEND=1 ?
No
Yes
Start
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10]
[11]
[13]
[14]
[15]
Initialize
Set MST and TRS
in ICCR1 to 1.
Write 1 to BBSY
and 0 to SCP.
Write transmit data
in ICDRT
Write 0 to BBSY
and SCP
Set MST to 1 and TRS
to 0 in ICCR1
Read BBSY in ICCR2
Read TEND in ICSR
Read ACKBR in ICIER
Mater receive mode
Yes
ACKBR=0 ?
Write transmit data in ICDRT
Read TDRE in ICSR
Read TEND in ICSR
Clear TEND in ICSR
Read STOP in ICSR
Clear TDRE in ICSR
End
Write transmit data in ICDRT
Transmit
mode?
No
Yes
TDRE=1 ?
Last byte?
STOP=1 ?
No
No
No
No
No
Yes
Yes
TEND=1 ?
Yes
Yes
Yes
[1] Test the status of the SCL and SDA lines.
[2] Set master transmit mode.
[3] Issue the start candition.
[4] Set the first byte (slave address + R/W) of transmit data.
[5] Wait for 1 byte to be transmitted.
[6] Test the acknowledge transferred from the specified slave device.
[7] Set the second and subsequent bytes (except for the final byte) of transmit data.
[8] Wait for ICDRT empty.
[9] Set the last byte of transmit data.
[10] Wait for last byte to be transmitted.
[11] Clear the TEND flag.
[12] Clear the STOP flag.
[13] Issue the stop condition.
[14] Wait for the creation of stop condition.
[15] Set slave receive mode. Clear TDRE.
[12]
Clear STOP in ICSR
Figure 15.17 Sample Flowchart for Master Transmit Mode
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 267 of 408
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No
Yes
RDRF=1 ?
No
Yes
RDRF=1 ?
Last receive
- 1?
Mater receive mode
Clear TEND in ICSR
Clear TRS in ICCR1 to 0
Clear TDRE in ICSR
Clear ACKBT in ICIER to 0
Dummy-read ICDRR
Read RDRF in ICSR
Read ICDRR
Set ACKBT in ICIER to 1
Set RCVD in ICCR1 to 1
Read ICDRR
Read RDRF in ICSR
Write 0 to BBSY
and SCP
Read STOP in ICSR
Read ICDRR
Clear RCVD in ICCR1 to 0
Clear MST in ICCR1 to 0
Note: Do not activate an interrupt during the execution of steps [1] to [3].
When one byte is received, steps [2] to [6] are skipped after step [1],
before jumping to step [7]. The step [8] is dammy-read in ICDRR.
Supplementary explanation:
End
No
Yes
STOP=1 ?
No
Yes
[1] Clear TEND, select master receive mode, and then clear TDRE.*
[2] Set acknowledge to the transmit device.*
[3] Dummy-read ICDDR.*
[4] Wait for 1 byte to be received
[5] Check whether it is the (last receive - 1).
[6] Read the receive data last.
[7] Set acknowledge of the final byte. Disable continuous reception (RCVD = 1).
[8] Read the (final byte - 1) of receive data.
[9] Wait for the last byte to be receive.
[10] Clear the STOP flag.
[11] Issue the stop condition.
[12] Wait for the creation of stop condition.
[13] Read the last byte of receive data.
[14] Clear RCVD.
[15] Set slave receive mode.
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[11]
[12]
[13]
Clear STOP in ICSR. [10]
[14]
[15]
Figure 15.18 Sample Flowchart for Master Receive Mode
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 268 of 408
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TDRE=1 ?
Yes
Yes
No
Slave transmit mode
Clear AAS in ICSR
Write transmit data
in ICDRT
Read TDRE in ICSR
Last
byte?
Write transmit data
in ICDRT
Read TEND in ICSR
Clear TEND in ICSR
Clear TRS in ICCR1 to 0
Dummy read ICDRR
Clear TDRE in ICSR
End
[1] Clear the AAS flag.
[2] Set transmit data for ICDRT (except for the last data).
[3] Wait for ICDRT empty.
[4] Set the last byte of transmit data.
[5] Wait for the last byte to be transmitted.
[6] Clear the TEND flag .
[7] Set slave receive mode.
[8] Dummy-read ICDRR to release the SCL line.
[9] Clear the TDRE flag.
No
No
Yes
TEND=1 ?
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
Figure 15.19 Sample Flowchart for Slave Transmit Mode
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 269 of 408
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No
Yes
RDRF=1 ?
No
Yes
RDRF=1 ?
Last receive
- 1?
Slave receive mode
Clear AAS in ICSR
Clear ACKBT in ICIER to 0
Dummy-read ICDRR
Read RDRF in ICSR
Read ICDRR
Set ACKBT in ICIER to 1
Read ICDRR
Read RDRF in ICSR
Read ICDRR
End
No
Yes
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10]
[1] Clear the AAS flag.
[2] Set acknowledge to the transmit device.
[3] Dummy-read ICDRR.
[4] Wait for 1 byte to be received.
[5] Check whether it is the (last receive - 1).
[6] Read the receive data.
[7] Set acknowledge of the last byte.
[8] Read the (last byte - 1) of receive data.
[9] Wait the last byte to be received.
[10] Read for the last byte of receive data.
When one byte is received, steps [2] to [6] are skipped after step [1],
before jumping to step [7]. The step [8] is dammy-read in ICDRR.
Supplementary explanation:
Figure 15.20 Sample Flowchart for Slave Receive Mode
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 270 of 408
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15.5 Interrupts
There are six interrupt requests in this module; transmit data empty, transmit end, receive data full,
NACK receive, STOP recognition, and arbitration lost/overrun error. Table 15.3 shows the
contents of each interrupt request.
Table 15.3 Interrupt Requests
Interrupt Request
Abbreviation
Interrupt Condition
I2C Mode
Clocked
Synchronous
Mode
Transmit Data Empty TXI (TDRE=1) • (TIE=1) { {
Transmit End TEI (TEND=1)
• (TEIE=1) { {
Receive Data Full RXI (RDRF=1)
• (RIE=1) { {
STOP Recognition STPI (STOP=1)
• (STIE=1) { ×
NACK Receive { ×
Arbitration
Lost/Overrun Error
NAKI {(NACKF=1)+(AL=1)}
•
(NAKIE=1) { {
When interrupt conditions described in table 15.3 are 1 and the I bit in CCR is 0, the CPU
executes an interrupt exception processing. Interrupt sources should be cleared in the exception
processing. TDRE and TEND are automatically cleared to 0 by writing the transmit data to
ICDRT. RDRF are automatically cleared to 0 by reading ICDRR. TDRE is set to 1 again at the
same time when transmit data is written to ICDRT. When TDRE is cleared to 0, then an excessive
data of one byte may be transmitted.
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 271 of 408
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15.6 Bit Synchronous Circuit
In master mode, this module has a possibility that high level period may be short in the two states
described below.
• When SCL is driven to low by the slave device
• When the rising speed of SCL is lowered by the load of the SCL line (load capacitance or pull-
up resistance)
Therefore, it monitors SCL and communicates by bit with synchronization.
Figure 15.21 shows the timing of the bit synchronous circuit and table 15.4 shows the time when
SCL output changes from low to Hi-Z then SCL is monitored.
SCL V
IH
SCL monitor
timing reference
clock
Internal SCL
Figure 15.21 Timing of Bit Synchronous Circuit
Table 15.4 Time for Monitoring SCL
CKS3 CKS2 Time for Monitoring SCL
0 7.5 tcyc 0
1 19.5 tcyc
0 17.5 tcyc 1
1 41.5 tcyc
Section 15 I2C Bus Interface 2 (IIC2)
Rev. 3.00 Sep. 14, 2006 Page 272 of 408
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15.7 Usage Notes
15.7.1 Issue (Retransmission) of Start/Stop Conditions
In master mode, when the start/stop conditions are issued (retransmitted) at the specific timing
under the following condition 1 or 2, such conditions may not be output successfully. To avoid
this, issue (retransmit) the start/stop conditions after the fall of the ninth clock is confirmed. Check
the SCLO bit in the I2C control register 2 (IICR2) to confirm the fall of the ninth clock.
1. When the rising of SCL falls behind the time specified in section 15.6, Bit Synchronous
Circuit, by the load of the SCL bus (load capacitance or pull-up resistance)
2. When the bit synchronous circuit is activated by extending the low period of eighth and ninth
clocks, that is driven by the slave device
15.7.2 WAIT Setting in I2C Bus Mode Register (IC MR )
If the WAIT bit is set to 1, and the SCL signal is driven low for two or more transfer clocks by the
slave device at the eighth and ninth clocks, the high period of ninth clock may be shortened. To
avoid this, set the WAIT bit in ICMR to 0.
Section 16 A/D Converter
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Section 16 A/D Converter
This LSI includes a successive approximation type 10-bit A/D converter that allows up to four
analog input channels to be selected. The block diagram of the A/D converter is shown in figure
16.1.
16.1 Features
• 10-bit resolution
• Four input channels
• Conversion time: At least 7 µs per channel (at 10 MHz operation)
• Two operating modes
Single mode: Single-channel A/D conversion
Scan mode: Continuous A/D conversion on 1 to 4 channels
• Four data registers
Conversion results are held in a 16-bit data register for each channel
• Sample and hold function
• Two conversion start methods
Software
External trigger signal
• Interrupt request
An A/D conversion end interrupt request (ADI) can be generated
Section 16 A/D Converter
Rev. 3.00 Sep. 14, 2006 Page 274 of 408
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Module data bus
Control circuit
Internal data bus
10-bit D/A
Comparator
+
Sample-and-
hold circuit ADI
interrupt request
Bus interface
Successive approximations
register
Analog multiplexer
A
D
C
S
R
A
D
C
R
A
D
D
R
D
A
D
D
R
C
A
D
D
R
B
A
D
D
R
A
AN0
AN1
AN2
AN3
[Legend]
ADCR: A/D control register
ADCSR: A/D control/status register
ADDRA: A/D data register A
ADDRB: A/D data register B
ADDRC: A/D data register C
ADDRD: A/D data register D
ADTRG
φ/4
φ/8
AV
CC
Figure 16.1 Block Diagram of A/D Converter
Section 16 A/D Converter
Rev. 3.00 Sep. 14, 2006 Page 275 of 408
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16.2 Input/Output Pins
Table 16.1 summarizes the input pins used by the A/D converter.
Table 16.1 Pin Configuration
Pin Name Symbol I/O Function
Analog power supply pin AVCC Input Analog block power supply pin
Analog input pin 0 AN0 Input
Analog input pin 1 AN1 Input
Analog input pin 2 AN2 Input
Analog input pin 3 AN3 Input
Analog input pins
A/D external trigger input pin ADTRG Input External trigger input pin for starting A/D
conversion
16.3 Register Description
The A/D converter has the following registers.
• A/D data register A (ADDRA)
• A/D data register B (ADDRB)
• A/D data register C (ADDRC)
• A/D data register D (ADDRD)
• A/D control/status register (ADCSR)
• A/D control register (ADCR)
16.3.1 A/D Data Registers A to D (ADDRA to ADDRD)
There are four 16-bit read-only ADDR registers; ADDRA to ADDRD, used to store the results of
A/D conversion. The ADDR registers, which store a conversion result for each channel, are shown
in table 16.2.
The converted 10-bit data is stored in bits 6 to 15. The lower 6 bits are always read as 0.
The data bus between the CPU and the A/D converter is 8 bits wide. The upper byte can be read
directly from the CPU, however the lower byte should be read via a temporary register. The
temporary register contents are transferred from the ADDR when the upper byte data is read.
Section 16 A/D Converter
Rev. 3.00 Sep. 14, 2006 Page 276 of 408
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Therefore, byte access to ADDR should be done by reading the upper byte first then the lower
one. ADDR is initialized to H'0000.
Table 16.2 Analog Input Channels and Corresponding ADDR Regi sters
Analog Input Channel A/D Data Register to Be Stored Results of A/D Conversion
AN0 ADDRA
AN1 ADDRB
AN2 ADDRC
AN3 ADDRD
16.3.2 A/D Control/Status Register (ADCSR)
ADCSR consists of the control bits and conversion end status bits of the A/D converter.
Bit Bit Name
Initial
Value R/W Description
7 ADF 0 R/W A/D End Flag
[Setting conditions]
• When A/D conversion ends in single mode
• When A/D conversion ends on all the channels
selected in scan mode
[Clearing condition]
• When 0 is written after reading ADF = 1
6 ADIE 0 R/W A/D Interrupt Enable
A/D conversion end interrupt (ADI) request enabled by
ADF when 1 is set
5 ADST 0 R/W A/D Start
Setting this bit to 1 starts A/D conversion. In single mode,
this bit is cleared to 0 automatically when conversion on
the specified channel is complete. In scan mode,
conversion continues sequentially on the specified
channels until this bit is cleared to 0 by software, a reset,
or a transition to standby mode.
Section 16 A/D Converter
Rev. 3.00 Sep. 14, 2006 Page 277 of 408
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Bit Bit Name
Initial
Value R/W Description
4 SCAN 0 R/W Scan Mode
Selects single mode or scan mode as the A/D conversion
operating mode.
0: Single mode
1: Scan mode
3 CKS 0 R/W Clock Select
Selects the A/D conversions time
0: Conversion time = 134 states (max.)
1: Conversion time = 70 states (max.)
Clear the ADST bit to 0 before switching the conversion
time.
2
1
0
CH2
CH1
CH0
0
0
0
R/W
R/W
R/W
Channel Select 0 to 2
Select analog input channels.
When SCAN = 0 When SCAN = 1
000: AN0 000: AN0
001: AN1 001: AN0 to AN1
010: AN2 010: AN0 to AN2
011: AN3 011: AN0 to AN3
Note: When executing the A/D conversion through AN3
or AN2, do not set the VDDII bit in LVDCR to 0. If 0
is set, the A/D conversion accuracy is not
guaranteed.
Section 16 A/D Converter
Rev. 3.00 Sep. 14, 2006 Page 278 of 408
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16.3.3 A/D Control Register (ADCR)
ADCR enables A/D conversion started by an external trigger signal.
Bit Bit Name
Initial
Value R/W Description
7 TRGE 0 R/W Trigger Enable
A/D conversion is started at the falling edge and the rising
edge of the external trigger signal (ADTRG) when this bit
is set to 1.
The selection between the falling edge and rising edge of
the external trigger pin (ADTRG) conforms to the WPEG5
bit in the interrupt edge select register 2 (IEGR2)
6 to 4 — All 1 — Reserved
These bits are always read as 1.
3, 2 — All 0 R/W Reserved
Although these bits are readable/writable, they should not
be set to 1.
1 — 1 R/W Reserved
This bit is always read as 1.
0 — 0 R/W Reserved
Although this bit is readable/writable, it should not be set
to 1.
Section 16 A/D Converter
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16.4 Operation
The A/D converter operates by successive approximation with 10-bit resolution. It has two
operating modes; single mode and scan mode. When changing the operating mode or analog input
channel, in order to prevent incorrect operation, first clear the bit ADST to 0 in ADCSR. The
ADST bit can be set at the same time as the operating mode or analog input channel is changed.
16.4.1 Single Mode
In single mode, A/D conversion is performed once for the analog input on the specified single
channel as follows:
1. A/D conversion is started from the first channel when the ADST bit in ADCSR is set to 1,
according to software or external trigger input.
2. When A/D conversion is completed, the result is transferred to the corresponding A/D data
register to the channel.
3. On completion of conversion, the ADF bit in ADCSR is set to 1. If the ADIE bit is set to 1 at
this time, an ADI interrupt request is generated.
4. The ADST bit remains set to 1 during A/D conversion. When A/D conversion ends, the
ADST bit is automatically cleared to 0 and the A/D converter enters the wait state.
16.4.2 Scan Mode
In scan mode, A/D conversion is performed sequentially for the analog input on the specified
channels (four channels maximum) as follows:
1. When the ADST bit is set to 1 by software, or external trigger input, A/D conversion starts on
the first channel in the group.
2. When A/D conversion for each channel is completed, the result is sequentially transferred to
the A/D data register corresponding to each channel.
3. When conversion of all the selected channels is completed, the ADF flag in ADCSR is set to 1.
If the ADIE bit is set to 1 at this time, an ADI interrupt is requested. Conversion of the first
channel in the group starts again.
4. The ADST bit is not automatically cleared to 0. Steps [2] to [3] are repeated as long as the
ADST bit remains set to 1. When the ADST bit is cleared to 0, A/D conversion stops.
Section 16 A/D Converter
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16.4.3 Input Sampling and A/D Conversion Time
The A/D converter has a built-in sample-and-hold circuit. The A/D converter samples the analog
input when the A/D conversion start delay time (tD) has passed after the ADST bit is set to 1, then
starts conversion. Figure 16.2 shows the A/D conversion timing. Table 16.3 shows the A/D
conversion time.
As indicated in figure 16.2, the A/D conversion time includes tD and the input sampling time. The
length of tD varies depending on the timing of the write access to ADCSR. The total conversion
time therefore varies within the ranges indicated in table 16.3.
In scan mode, the values given in table 16.3 apply to the first conversion time. In the second and
subsequent conversions, the conversion time is 128 states (fixed) when CKS = 0 and 66 states
(fixed) when CKS = 1.
(1)
(2)
t
D
t
SPL
t
CONV
φ
Address
Write signal
Input sampling
timing
ADF
[Legend]
(1): ADCSR write cycle
(2): ADCSR address
t
D
: A/D conversion start delay
t
SPL
: Input sampling time
t
CONV
: A/D conversion time
Figure 16.2 A/D Conversion Timing
Section 16 A/D Converter
Rev. 3.00 Sep. 14, 2006 Page 281 of 408
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Table 16.3 A/D Conversion Time (Single Mode)
CKS = 0 CKS = 1
Item Symbol Min. Typ. Max. Min. Typ. Max.
A/D conversion start delay tD 6 — 9 4 — 5
Input sampling time tSPL — 31 — — 15 —
A/D conversion time tCONV 131 — 134 69 — 70
Note: All values represent the number of states.
16.4.4 External Trigger Input Timing
A/D conversion can also be started by an external trigger input. When the TRGE bit is set to 1 in
ADCR, external trigger input is enabled at the ADTRG pin. A falling edge at the ADTRG input
pin sets the ADST bit to 1 in ADCSR, starting A/D conversion. Other operations, in both single
and scan modes, are the same as when the bit ADST has been set to 1 by software. Figure 16.3
shows the timing.
φ
ADTRG
Internal trigger signal
ADST
A/D conversion
Figure 16.3 External Trigger Input Timing
Section 16 A/D Converter
Rev. 3.00 Sep. 14, 2006 Page 282 of 408
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16.5 A/D Conversion Accuracy Definitions
This LSI's A/D conversion accuracy definitions are given below.
• Resolution
The number of A/D converter digital output codes
• Quantization error
The deviation inherent in the A/D converter, given by 1/2 LSB (see figure 16.4).
• Offset error
The deviation of the analog input voltage value from the ideal A/D conversion characteristic
when the digital output changes from the minimum voltage value 0000000000 to 0000000001
(see figure 16.5).
• Full-scale error
The deviation of the analog input voltage value from the ideal A/D conversion characteristic
when the digital output changes from 1111111110 to 1111111111 (see figure 16.5).
• Nonlinearity error
The error with respect to the ideal A/D conversion characteristics between zero voltage and
full-scale voltage. Does not include offset error, full-scale error, or quantization error.
• Absolute accuracy
The deviation between the digital value and the analog input value. Includes offset error, full-
scale error, quantization error, and nonlinearity error.
Section 16 A/D Converter
Rev. 3.00 Sep. 14, 2006 Page 283 of 408
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111
110
101
100
011
010
001
000
1
8
2
8
6
8
7
8
FS
Quantization error
Digital output
Ideal A/D conversion
characteristic
Analog
input voltage
3
8
4
8
5
8
Figure 16.4 A/D Conversion Accuracy Definitions (1)
FS
Digital output
Ideal A/D conversion
characteristic
Nonlinearity
error
Analog
input voltage
Offset error
Actual A/D conversion
characteristic
Full-scale error
Figure 16.5 A/D Conversion Accuracy Definitions (2)
Section 16 A/D Converter
Rev. 3.00 Sep. 14, 2006 Page 284 of 408
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16.6 Usage Notes
16.6.1 Permissible Signal Source Impedance
This LSI's analog input is designed such that conversion accuracy is guaranteed for an input signal
for which the signal source impedance is 5 kΩ or less. This specification is provided to enable the
A/D converter's sample-and-hold circuit input capacitance to be charged within the sampling time;
if the sensor output impedance exceeds 5 kΩ, charging may be insufficient and it may not be
possible to guarantee A/D conversion accuracy. However, for A/D conversion in single mode with
a large capacitance provided externally, the input load will essentially comprise only the internal
input resistance of 10 kΩ, and the signal source impedance is ignored. However, as a low-pass
filter effect is obtained in this case, it may not be possible to follow an analog signal with a large
differential coefficient (e.g., 5 mV/µs or greater) (see figure 16.6). When converting a high-speed
analog signal or converting in scan mode, a low-impedance buffer should be inserted.
16.6.2 Influences on Absolute Accuracy
Adding capacitance results in coupling with GND, and therefore noise in GND may adversely
affect absolute accuracy. Be sure to make the connection to an electrically stable GND.
Care is also required to ensure that filter circuits do not interfere with digital signals or act as
antennas on the mounting board.
20 pF
10 kΩ
C
in
=
15 pF
Sensor output
impedance
to 5 kΩ
This LSI
Low-pass
filter
C to 0.1 µF
Sensor input
A/D converter
equivalent circuit
Figure 16.6 Analog Input Circuit Example
Section 17 Band-Gap Circuit, Power-On Reset, and Low-Voltage Detection Circuits
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Section 17 Band-Gap Circuit, Power-On Reset, and
Low-Voltage Detection Circuits
This LSI can include a band-gap circuit (BGR, band-gap regulator), a power-on reset circuit and
low-voltage detection circuit.
BGR supplies a reference voltage to the on-chip oscillator and low-voltage detection circuit.
Figure 17.1 shows the block diagram of how BGR is allocated.
The low-voltage detection (LVD) circuit consists of two circuits: LVDI (interrupt by low voltage
detection) and LVDR (reset by low voltage detection) circuits.
This circuit is used to prevent abnormal operation (program runaway) from occurring due to the
power supply voltage fall and to recreate the state before the power supply voltage fall when the
power supply voltage rises again.
Even if the power supply voltage falls, the unstable state when the power supply voltage falls
below the guaranteed operating voltage can be removed by entering standby mode when
exceeding the guaranteed operating voltage and during normal operation. Thus, system stability
can be improved. If the power supply voltage falls more, the reset state is automatically entered. If
the power supply voltage rises again, the reset state is held for a specified period, then active mode
is automatically entered.
Figure 17.2 is a block diagram of the power-on reset circuit and the low-voltage detection circuit.
Section 17 Band-Gap Circuit, Power-On Reset, and Low-Voltage Detection Circuits
Rev. 3.00 Sep. 14, 2006 Page 286 of 408
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17.1 Features
• BGR circuit
Supplies stable reference voltage covering the entire operating voltage range and the operating
temperature range.
Reduces power consumption when BGR is disabled by setting registers.
• Power-on reset circuit
Uses an external capacitor to generate an internal reset signal when power is first supplied.
• Low-voltage detection circuit
LVDR: Monitors the power-supply voltage, and generates an internal reset signal when the
voltage falls below a given value.
LVDI: Monitors the power-supply voltage, and generates an interrupt when the voltage falls
below or rises above respective given values.
Two detection levels for reset generation voltage are available: when only the LVDR circuit is
used, or when the LVDI and LVDR circuits are both used.
[Legend]
Vcc: Power supply
BGRE: BGR circuit enable signal
VCL: Internal power supply generated from Vcc by the step-down circuit
VBGR: Reference voltage from BGR
VCLSEL: Select signal for the source of the on-chip oscillator power supply
RCSTP: On-chip oscillator stop signal
LVDE: LVD enable signal
Step-down circuit
On-chip
oscillator
LVD (low-voltage
detection circuit)
Vcc VCL
VBGR
VCLSEL
RCSTP
LVDE
BGRE BGR
Figure 17.1 Block Diagram arou nd BG R
Section 17 Band-Gap Circuit, Power-On Reset, and Low-Voltage Detection Circuits
Rev. 3.00 Sep. 14, 2006 Page 287 of 408
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φ
RES
C
RES
CK
RPSS
VBGR
ExtU
ExtD
VDDII
Vcc
R
S
Q
OVF
Vreset
VintD
VintU LVDRES
LVDCR
LVDSR
LVDINT
[Legend]
PSS: Prescaler S
LVDCR: Low-voltage-detection control register
LVDSR: Low-voltage-detection status register
VBGR: Reference voltage from BGR
ExtD: Compared voltage for falling external input voltage
ExtU: Compared voltage for rising external input voltage
VDDII: Bit 5 in LVDCR
Noise filter
circuit
Noise filter
circuit
Internal
reset signal
Power-on reset circuit
Interrupt
control
circuit
Internal data bus
Interrupt request
Ladder
network
External
power
supply
Figure 17.2 Block Diagram of Power-On Reset Circuit and Low-Voltage Detection Circuit
Section 17 Band-Gap Circuit, Power-On Reset, and Low-Voltage Detection Circuits
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17.2 Register Descriptions
The low-voltage detection circuit has the following registers.
• Low-voltage-detection control register (LVDCR)
• Low-voltage-detection status register (LVDSR)
17.2.1 Low-Voltage-Detection Control Register (LVDCR)
LVDCR enables or disables the low-voltage detection circuit and BGR circuit, selects the
compared voltage of the LVDI circuit, sets the detection levels for the LVDR circuit, enables or
disables the LVDR circuit, and enables or disables generation of an interrupt when the power-
supply voltage rises above or falls below the respective levels.
Table 17.1 shows the relationship between the LVDCR settings and functions to be selected.
LVDCR should be set according to table 17.1.
Bit Bit Name
Initial
Value R/W Description
7 LVDE 1* R/W LVD Enable
0: Low-voltage detection circuit is not used (standby
mode)
1: Low-voltage detection circuit is used
6 BGRE 1* R/W BGR Enable
0: BGR circuit is not used (standby mode)
1: BGR circuit is used
5 VDDII 1* R/W LVDR External Compared Voltage Input Inhibit
0: Use external voltage as LVDI compared voltage
1: Use internal voltage as LVDI compared voltage
4 1 Reserved
This bit is always read as 1 and cannot be modified.
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Bit Bit Name
Initial
Value R/W Description
3 LVDSEL 0* R/W LVDR Detection Level Select
0: Reset detection voltage is 2.3 V (Typ.)
1: Reset detection voltage is 3.6 V (Typ.)
When the falling or rising voltage detection interrupt is
used, the reset detection voltage of 2.3 V (Typ.) should
be used. When only a reset detection interrupt is used,
reset detection voltage of 3.6 V (Typ.) should be used.
2 LVDRE 1* R/W LVDR Enable
0: Disables an LVDR
1: Enables an LVDR
1 LVDDE 0 R/W Voltage-Fall-Interrupt Enable
0: Interrupt on the power-supply voltage falling disabled
1: Interrupt on the power-supply voltage falling enabled
0 LVDUE 0 R/W Voltage-Rise-Interrupt Enable
0: Interrupt on the power-supply voltage rising disabled
1: Interrupt on the power-supply voltage rising enabled
Note: * Not initialized by an LVDR but initialized by a power-on reset or a watchdog timer reset.
Table 17.1 LVDCR Settings and Select Functions
LVDCR Settings Select Functions
LVDE BGRE VDDII LVDSEL LVDRE LVDDE LVDUE Power-On
Reset LVDR
Low-
Voltage-
Detection
Fall
Interrupt
Low-
Voltage-
Detection
Rise
Interrupt
0 *1 *2 *2 *
2 *2 *2 √
1 1 *1 1 1 0 0 √ √
1 1 *1 0 0 1 0 √ √
1 1 *1 0 0 1 1 √ √ √
1 1 *1 0 1 1 1 √ √ √ √
Notes: 1. Set these bits if necessary.
2. Settings are ignored.
Section 17 Band-Gap Circuit, Power-On Reset, and Low-Voltage Detection Circuits
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17.2.2 Low-Voltage-Detection Status Register (LVDSR)
LVDSR indicates whether the power-supply voltage falls below or rises above the respective
given values.
Bit Bit Name
Initial
Value R/W Description
7 to 2 All 1 Reserved
These bits are always read as 1 and cannot be modified.
1 LVDDF 0* R/W LVD Power-Supply Voltage Fall Flag
[Setting condition]
• When the power-supply voltage falls below Vint (D)
(Typ. = 3.7 V)
[Clearing condition]
• When writing 0 to this bit after reading it as 1
0 LVDUF 0* R/W LVD Power-Supply Voltage Rise Flag
[Setting condition]
• When the power supply voltage falls below Vint (D)
while the LVDUE bit in LVDCR is set to 1 and then
rises above Vint (U) (Typ. = 4.0 V) before falling
below Vreset1 (Typ. = 2.3 V)
[Clearing condition]
• When writing 0 to this bit after reading it as 1
Note: * Initialized by an LVDR.
Section 17 Band-Gap Circuit, Power-On Reset, and Low-Voltage Detection Circuits
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17.3 Operations
17.3.1 Power-On Reset Circuit
Figure 17.3 shows the timing of the operation of the power-on reset circuit. As the power-supply
voltage rises, the capacitor which is externally connected to the RES pin is gradually charged via
the internal pull-up resistor (Typ. 150 kΩ). While the RES signal is driven low, the prescaler S and
the entire chip retains the reset state. When the level on the RES signal reaches the specified value,
the prescaler S is released from its reset state and it starts counting. The OVF signal is generated to
release the internal reset signal after the prescaler S has counted 131,072 cycles of the φ clock. The
noise filter circuit which removes noise with less than 400 ns (Typ.) is included to prevent the
incorrect operation of this LSI caused by noise on the RES signal.
To achieve stable operation of this LSI, the power supply needs to rise to its full level and settles
within the specified time. The maximum time required for the power supply to rise and settle
(tPWON) is determined by the oscillation frequency (fOSC) and capacitance which is connected to RES
pin (CRES). Where tPWON is assumed to be the time required to reach 90 % of the full level of the
power supply, the power supply circuit should be designed to satisfy the following formula.
tPWON (ms) ≤ 90 × CRES (µF) + 162/fOSC (MHz)
(tPWON ≤ 3000 ms, CRES ≥ 0.22 µF, and fOSC = 10 in 2-MHz to 10-MHz operation)
Note that the power supply voltage (Vcc) must fall below Vpor = 100 mV to remove charge on the
RES pin. After that, it can be risen. To remove charge on the RES pin, it is recommended that the
diode should be placed to Vcc. If the power supply voltage (Vcc) rises from the point above Vpor,
a power-on reset may not occur.
Section 17 Band-Gap Circuit, Power-On Reset, and Low-Voltage Detection Circuits
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RES
Vcc
PSS-reset
signal
Internal reset
signal
Vss
Vss
OVF
131,072 cycles
PSS counter starts Reset released
t
PWON
Vpor
Figure 17.3 Operational Timing of Power-On Reset Circuit
17.3.2 Low-Voltage Detection Circuit
(1) LVDR (Reset by Low Voltage Detec tion ) Ci rcui t
Figure 17.4 shows the timing of the operation of the LVDR circuit. The LVDR circuit is enabled
after a power-on reset is released. To cancel the LVDR circuit, first the LVDRE bit in LVDCR
should be cleared to 0 and then the LVDE bit in LVDCR and, if necessary, the BGRE bit should
be cleared to 0. The LVDE and the BGRE bits must not be cleared to 0 simultaneously with the
LVDRE bit because incorrect operation may occur. To restart the LVDR circuit, set the LVDE bit
and the BGRE bit to 1, wait for 50 µs (tLVDON) given by a software timer until the reference voltage
and the low-voltage-detection power supply have settled, then set the LVDRE bit to 1. After that,
the output settings of ports must be made.
When the power-supply voltage falls below the Vreset voltage (2.3 V or 3.6 V (Typ.)), the LVDR
circuit clears the LVDRES signal to 0, and resets prescaler S. The low-voltage detection reset state
remains in place until a power-on reset is generated. When the power-supply voltage rises above
the Vreset voltage again, prescaler S starts counting. It counts 131,072 clock (φ) cycles, and then
releases the internal reset signal. In this case, the LVDE, BGRE, VDDII, LVDSEL, and LVDRE
bits in LVDCR are not initialized.
Note that if the power supply voltage (Vcc) falls below VLVDRmin = 1.0 V and then rises from that
point, the low-voltage detection reset may not occur.
If the power supply voltage (Vcc) falls below Vpor = 100 mV, a power-on reset occurs.
Section 17 Band-Gap Circuit, Power-On Reset, and Low-Voltage Detection Circuits
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LVDRES
VCC Vreset
VSS
VLVDRmin
OVF
PSS-reset
signal
Internal reset
signal 131,072 cycles
PSS counter starts Reset released
Figure 17.4 Operating Timing of LVDR Circuit
(2) Low Voltage Detection Interrupt (LVDI) Circuit
(When Internally Generated Voltage is used for Detection)
Figure 17.5 shows the timing of the operation of the LVDI circuit.
The LVDI circuit is enabled after a power-on reset, however, the interrupt request is disabled. To
enable the LVDI, the LVDDF bit and LVDUF bit in LVDSR must be cleared to 0 and then the
LVDDE bit or LVDUE bit in LVDCR must be set to 1. After that, the output settings of ports
must be made.
To cancel the LVDI, follow the procedures written in section 17.3.2 (4), Operating Procedures for
Enabling/Disabling LVDR and LVDI Circuits.
To restart the LVDI circuit after standby mode, set the LVDE bit to 1, write 1 to VDDII (if
necessary), and wait for 50 µs (tLVDON) given by a software timer until the reference voltage and the
low-voltage detection power supply have settled. Then, clear the LVDDF and LVDUF bits to 0
and set the LVDDE or the LVDUE bit to 1. After that, the output settings of ports must be made.
When the power-supply voltage falls below Vint (D) (Typ. = 3.7 V) voltage, the LVDI circuit
clears the LVDINT signal to 0 and sets the LVDDF bit to 1. If the LVDDE bit is 1 at this time, an
IRQ0 interrupt request is generated. In this case, the necessary data must be saved in the external
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EEPROM and a transition to standby mode or subsleep mode must be made. Until this processing
is completed, the power supply voltage must be higher than the lower limit of the guaranteed
operating voltage.
When the power-supply voltage does not fall below the Vreset1 (Typ. = 2.3 V) voltage and rises
above the Vint (U) (Typ. = 4.0 V) voltage, the LVDI circuit sets the LVDINT signal to 1. If the
LVDUE bit is 1 at this time, the LVDUF bit in LVDSR is set to 1 and an IRQ0 interrupt request is
simultaneously generated.
If the power supply voltage (Vcc) falls below the Vreset1 (Typ. = 2.3 V) voltage, this LSI enters
low voltage detection reset operation (when LVDRE = 1).
LVDINT
Vcc Vint (D)
Vint (U)
VSS
LVDDF
LVDUE
LVDUF
IRQ0 interrupt generated IRQ0 interrupt generated
LVDDE
Vreset1
Figure 17.5 Operational Tim ing of LVDI Circuit
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(3) Low Voltage Detection Interrupt (LVDI) Circuit
(When Voltages Input via ExtU and ExtD Pins are used for Detection)
Figure 17.6 shows the timing of the LVDI circuit. The LVDI circuit is enabled after a power-on
reset, however, the interrupt request is disabled. To enable the LVDI, the LVDDF and LVDUF
bits in LVDSR must be cleared to 0 and the LVDDE or LVDUE bit in LVDCR must be set to 1.
When using external compared voltage, write 0 to the VDDII bit in LVDCR, and wait for 50 µs
(tLVDON) given by a software timer until the detection circuit has settled. Then clear the LVDDF and
LVDUF bits to 0 and set the LVDDE or LVDUE bit to 1. After that, the output settings of ports
must be made. The initial value of the external compared voltages input on the ExtU and ExtD
pins must be higher than the Vexd voltage.
To cancel the LVDI, follow the procedures written in section 17.3.2 (4), Operating Procedures for
Enabling/Disabling LVDR and LVDI Circuits.
When the external comparison voltage of ExtD pin falls below the Vexd (D) (Typ. = 1.15 V)
voltage, the LVDI clears the LVDINT signal to 0 and sets the LVDDF bit in LVDSR to 1. If the
LVDDE bit is 1 at this time, an IRQ0 interrupt request is generated. In this case, the necessary
data must be saved in the external EEPROM, and a transition to standby mode or subsleep mode
must be made. Until this processing is completed, the power supply voltage must be higher than
the lower limit of the guaranteed operating voltage.
When the power-supply voltage does not fall below the Vreset1 (Typ. = 2.3 V) voltage and the
input voltage of the ExtU pin rises above Vexd (Typ. = 1.15 V) voltage, the LVDI circuit sets the
LVDINT signal to 1. If the LVDUE bit is 1 at this time, the LVDUF bit in LVDSR is set to 1 and
an IRQ0 interrupt request is generated.
If the power supply voltage falls below the Vreset1 (Typ. = 2.3 V) voltage, this LSI enters low-
voltage detection reset operation. When the voltages input on the ExtU and ExtD pins are used as
the compared voltage, ensure to use the LVDR (reset detection voltage: Typ. = 2.3 V) circuit.
Section 17 Band-Gap Circuit, Power-On Reset, and Low-Voltage Detection Circuits
Rev. 3.00 Sep. 14, 2006 Page 296 of 408
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LVDINT
Vexd
V
SS
V
reset1
LVDDF
LVDUE
LVDUF
LVDDE
(1)
(2)
(3)
(4)
IRQ0 interrupt
generated
External power
supply voltage
ExtD input voltage
ExtU input voltage
IRQ0 interrupt
generated
Figure 17.6 Operational Timing of LVDI Circuit (When Compared Voltage is Input
through ExtU and ExtD Pins)
Section 17 Band-Gap Circuit, Power-On Reset, and Low-Voltage Detection Circuits
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(4) Operating Procedures for Enabling/Disabling LVDR and LVDI Circuits
The low-voltage detection circuit is enabled after reset. To enable or disable the low-voltage
detection circuit correctly, follow the procedure described below. Figure 17.7 shows the timing for
the operation and release of the low-voltage detection circuit.
1. To disable the low-voltage detection circuit, clear all of the LVDRE, LVDDE, and LVDUE
bits to 0. Then, clear the LVDE and BGRE bits to 0. Set the VDDII bit in LVDCR if
necessary. The LVDE and BGRE bits must not be cleared to 0 at the same timing as the
LVDRE, LVDDE, and LVDUE bits because incorrect operation may occur.
2. To enable the low-voltage detection circuit, set the LVDE and BGRE bits in LVDCR to 1.
When the voltages input on the ExtU and ExtD pins are used as the compared voltage, clear
the LVDDII bit to 0.
3. Wait for 50 µs (tLVDON) given by a software timer until the reference voltage and the low-
voltage-detection power supply have settled. Then, clear the LVDDF and LVDUF bits in
LVDSR to 0 and set the LVDRE, LVDDE, and LVDUE bits in LVDCR to 1, if necessary.
Longer than one instruction operation time
LVDRE
LVDDE
LVDUE
VDDII
t
LVDON
BGRE
LVDE
Figure 17.7 Timing for Enabling/ Di sa bling of Low-Voltage Detec tion Circuit
Section 17 Band-Gap Circuit, Power-On Reset, and Low-Voltage Detection Circuits
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Section 18 Power Supply Circuit
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Section 18 Power Supply Circuit
This LSI incorporates an internal power supply step-down circuit. Use of this circuit enables the
internal power supply to be fixed at a constant level of approximately 3.0 V, independently of the
voltage of the power supply connected to the external VCC pin. As a result, the current consumed
when an external power supply is used at 3.0 V or above can be held down to virtually the same
low level as when used at approximately 3.0 V. If the external power supply is 3.0 V or below, the
internal voltage will be practically the same as the external voltage. It is, of course, also possible
to use the same level of external power supply voltage and internal power supply voltage without
using the internal power supply step-down circuit.
18.1 When Using Internal Power Supply Step-Down Circuit
Connect the external power supply to the VCC pin, and connect a capacitance of approximately 0.1
µF between VCL and VSS, as shown in figure 18.1. The internal step-down circuit is made effective
simply by adding this external circuit. In the external circuit interface, the external power supply
voltage connected to VCC and the GND potential connected to VSS are the reference levels. For
example, for port input/output levels, the VCC level is the reference for the high level, and the VSS
level is that for the low level. The A/D converter analog power supply is not affected by the
internal step-down circuit.
V
CL
V
SS
Internal
logic
Step-down circuit
Internal
power
supply
Stabilization
capacitance
(approx. 0.1 µF)
V
CC
V
CC
= 3.0 to 5.5 V
Figure 18.1 Power Supply Connection when Internal Step-Down Circuit is Used
Section 18 Power Supply Circuit
Rev. 3.00 Sep. 14, 2006 Page 300 of 408
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18.2 When Not Using Internal Power Supply Step-Down Circuit
When the internal power supply step-down circuit is not used, connect the external power supply
to the VCL pin and VCC pin, as shown in figure 18.2. The external power supply is then input directly
to the internal power supply. The permissible range for the power supply voltage is 3.0 V to 3.6 V.
Operation cannot be guaranteed if a voltage outside this range (less than 3.0 V or more than 3.6 V)
is input.
V
CL
V
SS
Internal
logic
Step-down circuit
Internal
power
supply
V
CC
V
CC
= 3.0 to 3.6 V
Figure 18.2 Power Supply Connection when Internal Step-Down Circuit is Not Used
Section 19 List of Registers
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Section 19 List of Registers
The register list gives information on the on-chip I/O register addresses, how the register bits are
configured, and the register states in each operating mode. The information is given as shown
below.
1. Register addresses (address order)
• Registers are listed from the lower allocation addresses.
• Registers are classified by functional modules.
• The data bus width is indicated.
• The number of access states is indicated.
2. Register bits
• Bit configurations of the registers are described in the same order as the register addresses.
• Reserved bits are indicated by in the bit name column.
• When registers consist of 16 bits, bits are described from the MSB side.
3. Register states in each operating mode
• Register states are described in the same order as the register addresses.
• The register states described here are for the basic operating modes. If there is a specific reset
for an on-chip peripheral module, refer to the section on that on-chip peripheral module.
Section 19 List of Registers
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19.1 Register Addresses (Address Order)
The data bus width indicates the numbers of bits by which the register is accessed.
The number of access states indicates the number of states based on the specified reference clock.
Register Name Abbre-
viation Bit
No
Address Module
Name Data Bus
Width Access
State
Low-voltage-detection control
register
LVDCR 8 H'F730 Low-voltage
detection
circuit
8 2
Low-voltage-detection status
register
LVDSR 8 H'F731 Low-voltage
detection
circuit
8 2
Clock control status register CKCSR 8 H'F734 Clock
oscillator
8 2
RC control register RCCR 8 H'F735 On-chip
oscillator
8 2
RC trimming data protect register RCTRMDPR 8 H'F736 On-chip
oscillator
8 2
RC trimming data register RCTRMDR 8 H'F737 On-chip
oscillator
8 2
I2C bus control register 1 ICCR1 8 H'F748 IIC2 8 2
I2C bus control register 2 ICCR2 8 H'F749 IIC2 8 2
I2C bus mode register ICMR 8 H'F74A IIC2 8 2
I2C bus interrupt enable register ICIER 8 H'F74B IIC2 8 2
I2C bus status register ICSR 8 H'F74C IIC2 8 2
Slave address register SAR 8 H'F74D IIC2 8 2
I2C bus transmit data register ICDRT 8 H'F74E IIC2 8 2
I2C bus receive data register ICDRR 8 H'F74F IIC2 8 2
Timer mode register B1 TMB1 8 H'F760 Timer B1 8 2
Timer counter B1/Timer load
register B1
TCB1(R)/
TLB1 (W)
8 H'F761 Timer B1 8 2
Timer mode register W TMRW 8 H'FF80 Timer W 8 2
Timer control register W TCRW 8 H'FF81 Timer W 8 2
Timer interrupt enable register W TIERW 8 H'FF82 Timer W 8 2
Timer status register W TSRW 8 H'FF83 Timer W 8 2
Section 19 List of Registers
Rev. 3.00 Sep. 14, 2006 Page 303 of 408
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Register Name Abbre-
viation Bit
No
Address Module
Name Data Bus
Width Access
State
Timer I/O control register 0 TIOR0 8 H'FF84 Timer W 8 2
Timer I/O control register 1 TIOR1 8 H'FF85 Timer W 8 2
Timer counter TCNT 16 H'FF86 Timer W 16*1 2
General register A GRA 16 H'FF88 Timer W 16*1 2
General register B GRB 16 H'FF8A Timer W 16*1 2
General register C GRC 16 H'FF8C Timer W 16*1 2
General register D GRD 16 H'FF8E Timer W 16*1 2
Flash memory control register 1 FLMCR1 8 H'FF90 ROM 8 2
Flash memory control register 2 FLMCR2 8 H'FF91 ROM 8 2
Erase block register 1 EBR1 8 H'FF93 ROM 8 2
Flash memory enable register FENR 8 H'FF9B ROM 8 2
Timer control register V0 TCRV0 8 H'FFA0 Timer V 8 3
Timer control/status register V TCSRV 8 H'FFA1 Timer V 8 3
Timer constant register A TCORA 8 H'FFA2 Timer V 8 3
Timer constant register B TCORB 8 H'FFA3 Timer V 8 3
Timer counter V TCNTV 8 H'FFA4 Timer V 8 3
Timer control register V1 TCRV1 8 H'FFA5 Timer V 8 3
Serial mode register SMR 8 H'FFA8 SCI3 8 3
Bit rate register BRR 8 H'FFA9 SCI3 8 3
Serial control register 3 SCR3 8 H'FFAA SCI3 8 3
Transmit data register TDR 8 H'FFAB SCI3 8 3
Serial status register SSR 8 H'FFAC SCI3 8 3
Receive data register RDR 8 H'FFAD SCI3 8 3
Sampling mode register SPMR 8 H'FFAE SCI3 8 3
A/D data register A ADDRA 16 H'FFB0 A/D converter 8 3
A/D data register B ADDRB 16 H'FFB2 A/D converter 8 3
A/D data register C ADDRC 16 H'FFB4 A/D converter 8 3
A/D data register D ADDRD 16 H'FFB6 A/D converter 8 3
A/D control/status register ADCSR 8 H'FFB8 A/D converter 8 3
A/D control register ADCR 8 H'FFB9 A/D converter 8 3
Timer control/status register WD TCSRWD 8 H'FFC0 WDT*2 8 2
Section 19 List of Registers
Rev. 3.00 Sep. 14, 2006 Page 304 of 408
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Register Name Abbre-
viation Bit
No
Address Module
Name Data Bus
Width Access
State
Timer counter WD TCWD 8 H'FFC1 WDT*2 8 2
Timer mode register WD TMWD 8 H'FFC2 WDT*2 8 2
Address break control register ABRKCR 8 H'FFC8 Address break 8 2
Address break status register ABRKSR 8 H'FFC9 Address break 8 2
Break address register H BARH 8 H'FFCA Address break 8 2
Break address register L BARL 8 H'FFCB Address break 8 2
Break data register H BDRH 8 H'FFCC Address break 8 2
Break data register L BDRL 8 H'FFCD Address break 8 2
Port pull-up control register 1 PUCR1 8 H'FFD0 I/O port 8 2
Port pull-up control register 5 PUCR5 8 H'FFD1 I/O port 8 2
Port data register 1 PDR1 8 H'FFD4 I/O port 8 2
Port data register 2 PDR2 8 H'FFD5 I/O port 8 2
Port data register 5 PDR5 8 H'FFD8 I/O port 8 2
Port data register 7 PDR7 8 H'FFDA I/O port 8 2
Port data register 8 PDR8 8 H'FFDB I/O port 8 2
Port data register B PDRB 8 H'FFDD I/O port 8 2
Port data register C PDRC 8 H'FFDE I/O port 8 2
Port mode register 1 PMR1 8 H'FFE0 I/O port 8 2
Port mode register 5 PMR5 8 H'FFE1 I/O port 8 2
Port control register 1 PCR1 8 H'FFE4 I/O port 8 2
Port control register 2 PCR2 8 H'FFE5 I/O port 8 2
Port control register 5 PCR5 8 H'FFE8 I/O port 8 2
Port control register 7 PCR7 8 H'FFEA I/O port 8 2
Port control register 8 PCR8 8 H'FFEB I/O port 8 2
Port control register C PCRC 8 H'FFEE I/O port 8 2
System control register 1 SYSCR1 8 H'FFF0 Power-down 8 2
System control register 2 SYSCR2 8 H'FFF1 Power-down 8 2
Interrupt edge select register 1 IEGR1 8 H'FFF2 Interrupts 8 2
Interrupt edge select register 2 IEGR2 8 H'FFF3 Interrupts 8 2
Interrupt enable register 1 IENR1 8 H'FFF4 Interrupts 8 2
Interrupt enable register 2 IENR2 8 H'FFF5 Interrupts 8 2
Section 19 List of Registers
Rev. 3.00 Sep. 14, 2006 Page 305 of 408
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Register Name Abbre-
viation Bit
No
Address Module
Name Data Bus
Width Access
State
Interrupt flag register 1 IRR1 8 H'FFF6 Interrupts 8 2
Interrupt flag register 2 IRR2 8 H'FFF7 Interrupts 8 2
Wake-up interrupt flag register IWPR 8 H'FFF8 Interrupts 8 2
Module standby control register
1
MSTCR1 8 H'FFF9 Power-down 8 2
Module standby control register
2
MSTCR2 8 H'FFFA Power-down 8 2
Notes: 1. Only word access can be used.
2. WDT: Watchdog timer
Section 19 List of Registers
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19.2 Register Bits
Register bit names of the on-chip peripheral modules are described below.
Each line covers eight bits, and 16-bit registers are shown as 2 lines.
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0 Module
Name
LVDCR LVDE BGRE VDDII — LVDSEL LVDRE LVDDE LVDUE LVDC
LVDSR — — — — — — LVDDF LVDUF
CKCSR PMRC1 PMRC0 — OSCSEL CKSWIE CKSWIF — CKSTA Clock
oscillator
RCCR RCSTP FSEL VCLSEL — — — RCPSC1 RCPSC0 On-chip
oscillator
RCTRMDPR WRI PRWE LOCKDW TRMDRWE — — — —
RCTRMDR TRMD7 TRMD6 TRMD5 TRMD4 TRMD3 TRMD2 TRMD1 TRMD0
ICCR1 ICE RCVD MST TRS CKS3 CKS2 CKS1 CKS0 IIC2
ICCR2 BBSY SCP SDAO SDAOP SCLO — IICRST —
ICMR MLS WAIT — — BCWP BC2 BC1 BC0
ICIER TIE TEIE RIE NAKIE STIE ACKE ACKBR ACKBT
ICSR TDRE TEND RDRF NACKF STOP AL/OVE AAS ADZ
SAR SVA6 SVA5 SVA4 SVA3 SVA2 SVA1 SVA0 FS
ICDRT ICDRT7 ICDRT6 ICDRT5 ICDRT4 ICDRT3 ICDRT2 ICDRT1 ICDRT0
ICDRR ICDRR7 ICDRR6 ICDRR5 ICDRR4 ICDRR3 ICDRR2 ICDRR1 ICDRR0
TMB1 TMB17 — — — — TMB12 TMB11 TMB10
TCB1 (R)/
TLB1 (W)
BIT7 BIT6 BIT5 BIT4 BIT3 BIT2 BIT1 BIT0
Timer B1
TMRW CTS — BUFEB BUFEA — PWMD PWMC PWMB Timer W
TCRW CCLR CKS2 CKS1 CKS0 TOD TOC TOB TOA
TIERW OVIE — — — IMIED IMIEC IMIEB IMIEA
TSRW OVF — — — IMFD IMFC IMFB IMFA
TIOR0 — IOB2 IOB1 IOB0 — IOA2 IOA1 IOA0
TIOR1 — IOD2 IOD1 IOD0 — IOC2 IOC1 IOC0
TCNT TCNT15 TCNT14 TCNT13 TCNT12 TCNT11 TCNT10 TCNT9 TCNT8
TCNT7 TCNT6 TCNT5 TCNT4 TCNT3 TCNT2 TCNT1 TCNT0
GRA GRA15 GRA14 GRA13 GRA12 GRA11 GRA10 GRA9 GRA8
GRA7 GRA6 GRA5 GRA4 GRA3 GRA2 GRA1 GRA0
GRB GRB15 GRB14 GRB13 GRB12 GRB11 GRB10 GRB9 GRB8
GRB7 GRB6 GRB5 GRB4 GRB3 GRB2 GRB1 GRB0
Section 19 List of Registers
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Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0 Module
Name
GRC GRC15 GRC14 GRC13 GRC12 GRC11 GRC10 GRC9 GRC8 Timer W
GRC7 GRC6 GRC5 GRC4 GRC3 GRC2 GRC1 GRC0
GRD GRD15 GRD14 GRD13 GRD12 GRD11 GRD10 GRD9 GRD8
GRD7 GRD6 GRD5 GRD4 GRD3 GRD2 GRD1 GRD0
FLMCR1 — SWE ESU PSU EV PV E P ROM
FLMCR2 FLER — — — — — — —
EBR1 — — EB5 EB4 EB3 EB2 EB1 EB0
FENR FLSHE — — — — — — —
TCRV0 CMIEB CMIEA OVIE CCLR1 CCLR0 CKS2 CKS1 CKS0 Timer V
TCSRV CMFB CMFA OVF — OS3 OS2 OS1 OS0
TCORA TCORA7 TCORA6 TCORA5 TCORA4 TCORA3 TCORA2 TCORA1 TCORA0
TCORB TCORB7 TCORB6 TCORB5 TCORB4 TCORB3 TCORB2 TCORB1 TCORB0
TCNTV TCNTV7 TCNTV6 TCNTV5 TCNTV4 TCNTV3 TCNTV2 TCNTV1 TCNTV0
TCRV1 — — — TVEG1 TVEG0 TRGE — ICKS0
SMR COM CHR PE PM STOP MP CKS1 CKS0 SCI3
BRR BRR7 BRR6 BRR5 BRR4 BRR3 BRR2 BRR1 BRR0
SCR3 TIE RIE TE RE MPIE TEIE CKE1 CKE0
TDR TDR7 TDR6 TDR5 TDR4 TDR3 TDR2 TDR1 TDR0
SSR TDRE RDRF OER FER PER TEND MPBR MPBT
RDR RDR7 RDR6 RDR5 RDR4 RDR3 RDR2 RDR1 RDR0
SPMR — — — — — STDSPM — —
ADDRA AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 A/D converter
AD1 AD0 — — — — — —
ADDRB AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2
AD1 AD0 — — — — — —
ADDRC AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2
AD1 AD0 — — — — — —
ADDRD AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2
AD1 AD0 — — — — — —
ADCSR ADF ADIE ADST SCAN CKS CH2 CH1 CH0
ADCR TRGE — — — — — — —
TCSRWD B6WI TCWE B4WI TCSRWE B2WI WDON B0WI WRST WDT*
TCWD TCWD7 TCWD6 TCWD5 TCWD4 TCWD3 TCWD2 TCWD1 TCWD0
TMWD — — — — CKS3 CKS2 CKS1 CKS0
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Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0 Module
Name
ABRKCR RTINTE CSEL1 CSEL0 ACMP2 ACMP1 ACMP0 DCMP1 DCMP0 Address
break
ABRKSR ABIF ABIE — — — — — —
BARH BARH7 BARH6 BARH5 BARH4 BARH3 BARH2 BARH1 BARH0
BARL BARL7 BARL6 BARL5 BARL4 BARL3 BARL2 BARL1 BARL0
BDRH BDRH7 BDRH6 BDRH5 BDRH4 BDRH3 BDRH2 BDRH1 BDRH0
BDRL BDRL7 BDRL6 BDRL5 BDRL4 BDRL3 BDRL2 BDRL1 BDRL0
PUCR1 PUCR17 — — PUCR14 — — — — I/O port
PUCR5 — — PUCR55 — — — — —
PDR1 P17 — — P14 — — — —
PDR2 — — — — — P22 P21 P20
PDR5 P57 P56 P55 — — — — —
PDR7 — P76 P75 P74 — — — —
PDR8 — — — P84 P83 P82 P81 P80
PDRB — — — — PB3 PB2 PB1 PB0
PDRC — — — — — — PC1 PC0
PMR1 IRQ3 — — IRQ0 — — TXD —
PMR5 — — WKP5 — — — — —
PCR1 PCR17 — — PCR14 — — — —
PCR2 — — — — — PCR22 PCR21 PCR20
PCR5 PCR57 PCR56 PCR55 — — — — —
PCR7 — PCR76 PCR75 PCR74 — — — —
PCR8 — — — PCR84 PCR83 PCR82 PCR81 PCR80
PCRC — — — — — — PCRC1 PCRC0
SYSCR1 SSBY STS2 STS1 STS0 — — — — Power-down
SYSCR2 SMSEL — DTON MA2 MA1 MA0 — —
IEGR1 — — — — IEG3 — — IEG0 Interrupts
IEGR2 — — WPEG5 — — — — —
IENR1 IENDT — IENWP — IEN3 — — IEN0
IENR2 — — IENTB1 — — — — —
IRR1 IRRDT — — — IRRI3 — — IRRI0
IRR2 — — IRRTB1 — — — — —
IWPR — — IWPF5 — — — — —
MSTCR1 — MSTIIC MSTS3 MSTAD MSTWD MSTTW MSTTV — Power-down
MSTCR2 — — — MSTTB1 — — — —
Note: * WDT:Watchdog timer
Section 19 List of Registers
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19.3 Register States in Each Operating Mode
Register
Name
Reset
Active
Sleep
Subsleep
Standby
Module
LVDCR Initialized — — — — LVDC
LVDSR Initialized — — — —
CKCSR Initialized — — — — Clock oscillator
RCCR Initialized — — — — On-chip oscillation
RCTRMDPR Initialized — — — —
RCTRMDR Initialized — — — —
ICCR1 Initialized — — — — IIC2
ICCR2 Initialized — — — —
ICMR Initialized — — — —
ICIER Initialized — — — —
ICSR Initialized — — — —
SAR Initialized — — — —
ICDRT Initialized — — — —
ICDRR Initialized — — — —
TMB1 Initialized — — — — Timer B1
TCB1/TLB1 Initialized — — — —
TMRW Initialized — — — — Timer W
TCRW Initialized — — — —
TIERW Initialized — — — —
TSRW Initialized — — — —
TIOR0 Initialized — — — —
TIOR1 Initialized — — — —
TCNT Initialized — — — —
GRA Initialized — — — —
GRB Initialized — — — —
GRC Initialized — — — —
GRD Initialized — — — —
FLMCR1 Initialized — — Initialized Initialized ROM
FLMCR2 Initialized — — Initialized Initialized
EBR1 Initialized — — Initialized Initialized
FENR Initialized — — Initialized Initialized
TCRV0 Initialized — — Initialized Initialized Timer V
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Register
Name
Reset
Active
Sleep
Subsleep
Standby
Module
TCSRV Initialized — — Initialized Initialized Timer V
TCORA Initialized — — Initialized Initialized
TCORB Initialized — — Initialized Initialized
TCNTV Initialized — — Initialized Initialized
TCRV1 Initialized — — Initialized Initialized
SMR Initialized — — Initialized Initialized SCI3
BRR Initialized — — Initialized Initialized
SCR3 Initialized — — Initialized Initialized
TDR Initialized — — Initialized Initialized
SSR Initialized — — Initialized Initialized
RDR Initialized — — Initialized Initialized
SPMR Initialized — — Initialized Initialized
ADDRA Initialized — — Initialized Initialized A/D converter
ADDRB Initialized — — Initialized Initialized
ADDRC Initialized — — Initialized Initialized
ADDRD Initialized — — Initialized Initialized
ADCSR Initialized — — Initialized Initialized
ADCR Initialized — — Initialized Initialized
TCSRWD Initialized — — — — WDT*
TCWD Initialized — — — —
TMWD Initialized — — — —
ABRKCR Initialized — — — — Address Break
ABRKSR Initialized — — — —
BARH Initialized — — — —
BARL Initialized — — — —
BDRH Initialized — — — —
BDRL Initialized — — — —
PUCR1 Initialized — — — — I/O port
PUCR5 Initialized — — — —
PDR1 Initialized — — — —
PDR2 Initialized — — — —
PDR5 Initialized — — — —
PDR7 Initialized — — — —
PDR8 Initialized — — — —
PDRB Initialized — — — —
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Register
Name
Reset
Active
Sleep
Subsleep
Standby
Module
PDRC Initialized — — — — I/O port
PMR1 Initialized — — — —
PMR5 Initialized — — — —
PCR1 Initialized — — — —
PCR2 Initialized — — — —
PCR5 Initialized — — — —
PCR7 Initialized — — — —
PCR8 Initialized — — — —
PCRC Initialized — — — —
SYSCR1 Initialized — — — — Power-down
SYSCR2 Initialized — — — —
IEGR1 Initialized — — — — Interrupts
IEGR2 Initialized — — — —
IENR1 Initialized — — — —
IENR2 Initialized — — — —
IRR1 Initialized — — — —
IRR2 Initialized — — — —
IWPR Initialized — — — —
MSTCR1 Initialized — — — — Power-down
MSTCR2 Initialized — — — —
Note: is not initialized
* WDT: Watchdog timer
Section 19 List of Registers
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Section 20 Electrical Characteristics
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Section 20 Electrical Characteristics
20.1 Absolute Maximum Ratings
Table 20.1 Absolute Maximum Ratings
Item Symbol Value Unit Note
Power supply voltage VCC –0.3 to +7.0 V *
Analog power supply voltage AVCC –0.3 to +7.0 V
Ports other than port B –0.3 to VCC +0.3 V Input voltage
Port B
VIN
–0.3 to AVCC +0.3 V
Operating temperature Topr –20 to +75 °C
Storage temperature Tstg –55 to +125 °C
Note: * Permanent damage may result if maximum ratings are exceeded. Normal operation
should be under the conditions specified in Electrical Characteristics. Exceeding these
values can result in incorrect operation and reduced reliability.
Section 20 Electrical Characteristics
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20.2 Electrical Characteristics (F-ZTATTM Version)
20.2.1 Power Supply Voltage and Operating Ranges
1. Supply voltage and external oscillation frequency range
12.0
2.0
3.0 5.5 Vcc(V)
φosc(MHz)
AVcc = 3.0 to 5.5 V
• Active mode
• Sleep mode
2. Power supply voltage and operating frequency range
12.0
2.0
3.0 5.5 Vcc(V)
φosc(MHz)
1500
31.25
3.0 5.5 Vcc(V)
φ(kHz)
AVcc = 3.0 to 5.5 V
• Active mode
• Sleep mode
(When MA2 = 0 in SYSCR2)
AVcc = 3.0 to 5.5 V
• Active mode
• Sleep mode
(When MA2 = 1 in SYSCR2)
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3. Analog power supply voltage and A/D converter accuracy guarantee range
12.0
2.0
3.0 5.5 AVcc(V)
φosc(MHz)
Vcc = 3.0 to 5.5 V
• Active mode
• Sleep mode
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20.2.2 DC Characteristics
Table 20.2 DC Characteristics (1)
VCC = 3.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C unless otherwise indicated.
Values
Item Symbol
Applicable
Pins Test
Condition Min. Typ. Max. Unit Notes
VCC = 4.0 V to 5.5 V VCC × 0.8 — VCC + 0.3 V RES, NMI, WKP5,
IRQ0, IRQ3,
ADTRG, TMRIV,
TMCIV, FTCI,
FTIOA to FTIOD,
SCK3, TRGV
V
CC × 0.9 — VCC + 0.3 V
VCC = 4.0 V to 5.5 V VCC × 0.7 — VCC + 0.3 V RXD, SCL, SDA,
P17, P14,
P22 to P20,
P57 to P55,
P76 to P74,
P84 to P80,
PC1, PC0
V
CC × 0.8 — VCC + 0.3 V
AVCC = 4.0 V to 5.5 V AVCC × 0.7 — AVCC + 0.3 V PB3 to PB0
AVCC = 3.0 V to 5.5 V AVCC × 0.8 — AVCC + 0.3 V
VCC = 4.0 V to 5.5 V VCC – 0.5 — VCC + 0.3 V
Input high
voltage
VIH
OSC1
V
CC – 0.3 VCC + 0.3 V
VCC = 4.0 V to 5.5 V –0.3 — VCC × 0.2 V
RES, NMI, WKP5,
IRQ0, IRQ3,
ADTRG, TMRIV,
TMCIV, FTCI,
FTIOA to FTIOD,
SCK3, TRGV
–0.3 — VCC × 0.1 V
VCC = 4.0 V to 5.5 V –0.3 — VCC × 0.3 V RXD, SCL, SDA,
P17, P14,
P22 to P20,
P57 to P55,
P76 to P74,
P84 to P80,
PC1, PC0
–0.3 — VCC × 0.2 V
AVCC = 4.0 V to 5.5 V –0.3 — AVCC × 0.3 PB3 to PB0
AVCC = 3.0 V to 5.5 V –0.3 — AVCC × 0.2
V
VCC = 4.0 V to 5.5 V –0.3 — 0.5 V
Input low
voltage
VIL
OSC1
–0.3 — 0.3 V
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Values
Item Symbol
Applicable
Pins Test
Condition Min. Typ. Max. Unit Notes
VCC = 4.0 V to 5.5 V
–IOH = 4 mA
VCC – 1.0 — — V P17, P14,
P22 to P20,
P55,
P76 to P74,
P84 to P80,
PC1, PC0
–IOH = 0.1 mA VCC – 0.5 — — V
VCC = 4.0 V to 5.5 V
–IOH = 0.1 mA
VCC – 2.5 — — V
Output
high
voltage
VOH
P56, P57
VCC = 3.0 V to 4.0 V
–IOH = 0.1 mA
VCC – 2.2 — — V
VCC = 4.0 V to 5.5 V
IOL = 1.6 mA
— — 0.6 V
P17, P14,
P22 to P20,
P57 to P55,
P76 to P74,
PC1, PC0
IOL = 0.4 mA — — 0.4 V
VCC = 4.0 V to 5.5 V
IOL = 20.0 mA
— — 1.5 V
VCC = 4.0 V to 5.5 V
IOL = 10.0 mA
— — 1.0 V
VCC = 4.0 V to 5.5 V
IOL = 1.6 mA
— — 0.4 V
P84 to P80
IOL = 0.4 mA — — 0.4 V
VCC = 4.0 V to 5.5 V
IOL = 6.0 mA
— — 0.6 V
Output low
voltage
VOL
SCL, SDA
IOL = 3.0 mA — — 0.4 V
OSC1, NMI,
WKP5,
IRQ0, IRQ3,
ADTRG, TRGV,
TMRIV, TMCIV,
FTCI, FTIOA to
FTIOD, RXD,
SCK3, SCL, SDA
VIN = 0.5 V to
(VCC – 0.5 V)
— — 1.0 µA
P17, P14,
P22 to P20,
P57 to P55,
P76 to P74,
P84 to P80,
PC1, PC0
VIN = 0.5 V to
(VCC – 0.5 V)
— — 1.0 µA
Input/
output
leakage
current
| IIL |
PB3 to PB0 VIN = 0.5 V to
(AVCC – 0.5 V)
— — 1.0 µA
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Values
Item Symbol
Applicable
Pins Test
Condition Min. Typ. Max. Unit Notes
VCC = 5.0 V,
VIN = 0.0 V
50.0 — 300.0 µA
Pull-up
MOS
current
–Ip P17, P14, P55
VCC = 3.0 V,
VIN = 0.0 V
— 60.0 — µA Reference
value
Input
capaci-
tance
Cin All input pins
except power
supply pins
f = 1 MHz,
VIN = 0.0 V,
Ta = 25°C
— — 15.0 pF
Active mode 1
VCC = 5.0 V,
fOSC = 12 MHz
— 12.0 18.0 mA *
IOPE1 V
CC
Active mode 1
VCC = 3.0 V,
fOSC = 12 MHz
— 9.6 — mA Reference
value*
Active mode 2
VCC = 5.0 V,
fOSC = 12 MHz
— 2.0 2.5 mA *
Active
mode
current
consump-
tion
IOPE2 V
CC
Active mode 2
VCC = 3.0 V,
fOSC = 12 MHz
— 1.5 — mA Reference
value*
Sleep mode 1
VCC = 5.0 V,
fOSC = 12 MHz
— 7.2 12.0 mA *
ISLEEP1 V
CC
Sleep mode 1
VCC = 3.0 V,
fOSC = 12 MHz
— 6.0 — mA Reference
value*
Sleep mode 2
VCC = 5.0 V,
fOSC = 12 MHz
— 1.8 2.2 mA *
Sleep
mode
current
consump-
tion
ISLEEP2 V
CC
Sleep mode 2
VCC = 3.0 V,
fOSC = 12 MHz
— 1.4 — mA Reference
value*
Subsleep
mode
current
consump-
tion
ISUBSP V
CC V
CC = 5.0 V
LVDE = 0,
BGRE = 0
— — 5.0 µA *
Standby
mode
current
consump-
tion
ISTBY V
CC LVDE = 0,
BGRE = 0
— — 5.0 µA *
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Values
Item Symbol
Applicable
Pins Test
Condition Min. Typ. Max. Unit Notes
RAM data
retaining
voltage
VRAM V
CC 2.0 — — V
Note: * Pin states during current consumption measurement are given below (excluding current
in the pull-up MOS transistors and output buffers).
Mode RES Pin Internal State Other Pins Oscillator Pins
Active mode 1 Operates
Active mode 2
VCC
Operates (φ/64)
VCC
Sleep mode 1 Only timers operate
Sleep mode 2
VCC
Only timers operate (φ/64)
VCC
System clock:
Crystal or ceramic
resonator, and on-chip
oscillator
Subsleep mode
Standby mode
VCC CPU and timers both stop VCC —
Section 20 Electrical Characteristics
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Table 20.2 DC Characteristics (2)
VCC = 3.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise indicated.
Values
Item Symbol
Application
Pins Test
Condition Min. Typ. Max. Unit
Output pins except
P84 to P80, SCL, and
SDA
— — 2.0 mA
P84 to P80
VCC = 4.0 V to 5.5 V
— — 20.0 mA
Output pins except
P84 to P80, SCL, and
SDA
— — 0.5 mA
P84 to P80 — — 10.0 mA
Allowable output low
current (per pin)
IOL
SCL, SDA
— — 6.0 mA
∑IOL Output pins except
P84 to P80, SCL, and
SDA
— — 40.0 mA
P84 to P80, SCL, and
SDA
VCC = 4.0 V to 5.5 V
— — 80.0 mA
Output pins except
P84 to P80, SCL, and
SDA
— — 20.0 mA
Allowable output low
current (total)
P84 to P80, SCL, and
SDA
— — 40.0 mA
VCC = 4.0 V to 5.5 V — — 4.0 mA Output pins except
P56, P57 — — 0.2 mA
VCC = 4.0 V to 5.5 V — — 2.0 mA
Allowable output high
current (per pin)
I –IOH I
P56, P57
— — 0.2 mA
VCC = 4.0 V to 5.5 V — — 40.0 mA Allowable output high
current (total)
I –∑IOH I All output pins
— — 8.0 mA
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20.2.3 AC Characteristics
Table 20.3 AC Character i sti cs
VCC = 3.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Values
Item Symbol
Applicable
Pins Test
Condition Min. Typ. Max. Unit Reference
Figure
System clock
oscillation frequency
fOSC OSC1, OSC2 2.0 — 12.0 MHz
1 — 64 tOSC System clock (φ) cycle
time
tcyc
— — 32.0 µs
*1
Figure 20.1
Instruction cycle time 2 — — tcyc
Oscillation stabilization
time (crystal resonator)
trc OSC1, OSC2 — — 10.0 ms
Oscillation stabilization
time (ceramic
resonator)
trc OSC1, OSC2 — — 5.0 ms
External clock high
width
tCPH OSC1 35.0 — — ns
External clock low
width
tCPL OSC1 35.0 — — ns
External clock rise
time
tCPr OSC1 — — 15.0 ns
External clock fall time tCPf OSC1 — — 15.0 ns
Figure 20.1
RES pin low width*4 t
REL RES 2500 — — ns Figure 20.2
NMI pin high width tIHNMI NMI 1500 — — ns
NMI pin low width tILNMI NMI 1500 — — ns
Figure 20.3
Input pin high width tIH IRQ0 , IRQ3,
WKP5, TMCIV,
TMRIV, TRGV,
ADTRG, FTCI,
FTIOA to FTIOD
2 — — tcyc Figure 20.3
Input pin low width tIL IRQ0, IRQ3,
WKP5, TMCIV,
TMRIV, TRGV,
ADTRG, FTCI,
FTIOA to FTIOD
2 — — tcyc
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Values
Item Symbol
Applicable
Pins Test
Condition Min. Typ. Max. Unit Reference
Figure
VCC = 5.0 V
Ta = 25°C
FSEL = 0,
VCLSEL = 0
7.92*38.0 8.08*3 MHz
VCC = 4.0 V to 5.5 V
FSEL = 0,
VCLSEL = 0
7.76 8.0 8.24 MHz
On-chip oscillator
oscillation frequency *2
fRC
VCC = 4.0 V to 5.5 V
FSEL = 1,
VCLSEL = 0
9.6*3 10.0 10.4*3 MHz
Notes: 1. Determined by MA2 to MA0 in system control register 2 (SYSCR2).
2. For the oscillation frequency of the masked ROM version, refer to the electrical
characteristics specified separately.
3. The values are for reference.
4. Except when power-on reset circuit is used.
Section 20 Electrical Characteristics
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Table 20.4 I2C Bus Interface Timing
VCC = 3.0 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Values
Item Symbol
Applicable
Pins Test
Condition Min. Typ. Max.
Unit Reference
Figure
SCL input cycle time tSCL 12tcyc + 600 ns
SCL input high pulse
width
tSCLH 3tcyc + 300 ns
SCL input low pulse
width
tSCLL 5tcyc + 300 ns
SCL and SDA input fall
time
tSf 300 ns
SCL and SDA input
spike pulse removal
time
tSP 1tcyc ns
SDA input bus-free
time
tBUF 5tcyc ns
Start condition input
hold time
tSTAH 3tcyc ns
Retransmission start
condition input setup
time
tSTAS 3tcyc ns
Setup time for stop
condition input
tSTOS 3tcyc ns
Data input setup time tSDAS 1tcyc+ 20 ns
Data input hold time tSDAH 0 ns
Capacitive load of
SCL and SDA
cb 0 400 pF
VCC = 4.0
to 5.5 V
250 ns SCL and SDA output
fall time
tSf
300 ns
Figure
20.4
Section 20 Electrical Characteristics
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Table 20.5 Serial Interface (SCI3) Timing
VCC = 3.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Values
Item Symbol
Applicable
Pins Test
Condition Min. Typ. Max.
Unit Reference
Figure
Asynchro-
nous
4 — — tcyc Input
clock
cycle Clocked
synchronous
tscyc SCK3
6 — — tcyc
Input clock pulse width tSCKW SCK3 0.4 — 0.6 tscyc
Figure
20.5
Transmit data delay
time (clocked
synchronous)
tTXD TXD — — 1 tcyc
Receive data setup
time (clocked
synchronous)
tRXS RXD 83.3 — — ns
Receive data hold
time (clocked
synchronous)
tRXH RXD 83.3 — — ns
Figure
20.6
Section 20 Electrical Characteristics
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20.2.4 A/D Converter Characteristics
Table 20.6 A/D Converter Characteristics
VCC = 3.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Values
Item Symbol
Applicable
Pins Test
Condition Min. Typ. Max. Unit Notes
Analog power supply
voltage
AVCC AVCC 3.0 VCC 5.5 V *1
Analog input voltage AVIN AN3 to AN0 VSS –
0.3
— AVCC +
0.3
V
AIOPE AVCC AVCC = 5.0 V
fOSC = 12 MHz
— — 2.0 mA
AISTOP1 AVCC — 50 — µA *2
Reference
value
Analog power supply
current
AISTOP2 AVCC — — 5.0 µA *3
Analog input capacitance CAIN AN3 to AN0 — — 30.0 pF
Allowable signal source
impedance
RAIN AN3 to AN0 — — 5.0 kΩ
Resolution (data length) 10 10 10 bit
Conversion time (single
mode)
134 — — tcyc
Nonlinearity error — — ±7.5 LSB
Offset error — — ±7.5 LSB
Full-scale error — — ±7.5 LSB
Quantization error — — ±0.5 LSB
Absolute accuracy
AVCC = 3.0 V
to 5.5 V
— — ±8.0 LSB
Conversion time (single
mode)
70 — — tcyc
Nonlinearity error — — ±7.5 LSB
Offset error — — ±7.5 LSB
Full-scale error — — ±7.5 LSB
Quantization error — — ±0.5 LSB
Absolute accuracy
AVCC = 4.0 V
to 5.5 V
— — ±8.0 LSB
Section 20 Electrical Characteristics
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Values
Item Symbol
Applicable
Pins Test
Condition Min. Typ. Max. Unit Notes
Conversion time (single
mode)
134 — — tcyc
Nonlinearity error — — ±3.5 LSB
Offset error — — ±3.5 LSB
Full-scale error — — ±3.5 LSB
Quantization error — — ±0.5 LSB
Absolute accuracy
AVCC = 4.0 V
to 5.5 V
— — ±4.0 LSB
Notes: 1. Set AVCC = VCC when the A/D converter is not used.
2. AISTOP1 is the current in active and sleep modes while the A/D converter is idle.
3. AISTOP2 is the current at reset and in standby and subsleep modes while the A/D
converter is idle.
20.2.5 Watchdog Timer Characteristics
Table 20.7 Watchdog Timer Characteristics
VCC = 3.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Values
Item Symbol
Applicable
Pins Test
Condition Min. Typ. Max. Unit Notes
Internal
oscillator
overflow
time
tOVF 0.2 0.4 — s *
Note: * Shows the time to count from 0 to 255, at which point an internal reset is generated,
when the internal oscillator is selected.
Section 20 Electrical Characteristics
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20.2.6 Power-Supply-Voltage Detection Circuit Characteristics
Table 20.8 Power-Supply-Voltage Detection Circuit Characteristics
VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Values
Item Symbol
Test
Condition Min. Typ. Max. Unit
Power-supply falling detection
voltage
Vint(D) LVDSEL = 0 3.3 3.7 4.3 V
Power-supply rising detection
voltage
Vint(U) LVDSEL = 0 3.6 4.0 4.5 V
Reset detection voltage 1*1 Vreset1 LVDSEL = 0 2.0 2.3 2.7 V
Reset detection voltage 2*2 Vreset2 LVDSEL = 1 3.0 3.6 4.2 V
Lower-limit voltage of LVDR
operation*3
VLVDRmin 1.0 — — V
LVD stabilization time tLVDON 50 — — µs
Current consumption in standby
mode
ISTBY LVDE = 1,
BGRE = 1
Vcc = 5.0 V
— 350 µA
Notes: 1. This voltage should be used when the falling and rising voltage detection function is
used.
2. Select the low-voltage reset 2 when only the low-voltage detection reset is used.
3. When the power-supply voltage (Vcc) falls below VLVDRmin = 1.0 V and then rises, a reset
may not occur. Therefore sufficient evaluation is required.
20.2.7 LVDI External Voltage Detection Circuit Characteristics
Table 20.9 LVDI External Voltage Detection Circuit Characteristic s
Vcc = 4.5 to 5.5 V, AVcc = 3.0 to 5.5 V, VSS= 0.0 V, Ta = –20 to +75°C
Values
Item Symbol
Test
Condition Min. Typ. Max. Unit
ExtD/ExtU input
detection voltage
Vexd 0.85 1.15 1.45 V
ExtD/ExtU input voltage
range
VextD/U VextD > VextU −0.3 — Lower voltage,
either AVcc + 0.3
or Vcc + 0.3
V
Section 20 Electrical Characteristics
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20.2.8 Power-On Reset Ch aracteristics
Table 20.10 Power-On Reset Circuit Characteristics
VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Values
Item Symbol
Test
Condition Min. Typ. Max. Unit
Pull-up resistance of RES pin RRES 100 150 — kΩ
Power-on reset start voltage* V
por — — 100 mV
Note: * The power-supply voltage (Vcc) must fall below Vpor = 100 mV and then rise after
charge of the RES pin is removed completely. In order to remove charge of the RES
pin, it is recommended that the diode be placed in the Vcc side. If the power-supply
voltage (Vcc) rises from the point over 100 mV, a power-on reset may not occur.
Section 20 Electrical Characteristics
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20.2.9 Flash Memory Ch aracteristics
Table 20.11 Flash Memory Characteristi c s
VCC = 3.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Values
Item Symbol
Test
Condition Min. Typ. Max. Unit
Programming time (per 128 bytes)*1*2*4 t
P — 7 200 ms
Erase time (per block) *1*3*6 t
E — 100 1200 ms
Reprogramming count NWEC 1000 10000 — Times
Wait time after SWE
bit setting*1
x 1 — — µs
Wait time after PSU
bit setting*1
y 50 — — µs
z1 1 ≤ n ≤ 6 28 30 32 µs
z2 7 ≤ n ≤ 1000 198 200 202 µs
Wait time after P bit
setting*1*4
z3 Additional-
programming
8 10 12 µs
Wait time after P bit
clear*1
α 5 — — µs
Wait time after PSU
bit clear*1
β 5 — — µs
Wait time after PV
bit setting*1
γ 4 — — µs
Wait time after
dummy write*1
ε 2 — — µs
Wait time after PV
bit clear*1
η 2 — — µs
Wait time after SWE
bit clear*1
θ 100 — — µs
Programming
Maximum
programming count*1*4*5
N — — 1000 Times
Section 20 Electrical Characteristics
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Values
Item Symbol Test
Condition Min. Typ. Max. Unit
Wait time after SWE
bit setting*1
x 1 — — µs
Wait time after ESU
bit setting*1
y 100 — — µs
Wait time after E bit
setting*1*6
z 10 — 100 ms
Wait time after E bit
clear*1
α 10 — — µs
Wait time after ESU
bit clear*1
β 10 — — µs
Wait time after EV
bit setting*1
γ 20 — — µs
Wait time after
dummy write*1
ε 2 — — µs
Wait time after EV
bit clear*1
η 4 — — µs
Wait time after SWE
bit clear*1
θ 100 — — µs
Erase
Maximum erase
count*1*6*7
N — — 120 Times
Notes: 1. Make the time settings in accordance with the program/erase algorithms.
2. The programming time for 64 bytes. (Indicates the total time for which the P bit in flash
memory control register 1 (FLMCR1) is set. The program-verify time is not included.)
3. The time required to erase one block. (Indicates the time for which the E bit in flash
memory control register 1 (FLMCR1) is set. The erase-verify time is not included.)
4. Programming time maximum value (tP (max.)) = wait time after P bit setting (z) ×
maximum programming count (N)
5. Set the maximum programming count (N) according to the actual set values of z1, z2,
and z3, so that it does not exceed the programming time maximum value (tP (max.)).
The wait time after P bit setting (z1, z2) should be changed as follows according to the
value of the programming count (n).
Programming count (n)
1 ≤ n ≤ 6 z1 = 30 µs
7 ≤ n ≤ 1000 z2 = 200 µs
6. Erase time maximum value (tE (max.)) = wait time after E bit setting (z) × maximum
erase count (N)
7. Set the maximum erase count (N) according to the actual set value of (z), so that it
does not exceed the erase time maximum value (tE (max.)).
Section 20 Electrical Characteristics
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20.3 Electrical Characteristics (Masked ROM Version)
20.3.1 Power Supply Voltage and Operating Ranges
1. Supply voltage and external oscillation frequency range
12.0
2.0
2.7 5.5 Vcc(V)
φosc(MHz)
AVcc = 2.7 to 5.5 V
• Active mode
• Sleep mode
2. Power supply voltage and operating frequency range
12.0
2.0
2.7 5.5 Vcc(V)
φosc(MHz)
1500
31.25
2.7 5.5 Vcc(V)
φ(kHz)
AVcc = 2.7 to 5.5 V
• Active mode
• Sleep mode
(When MA2 = 0 in SYSCR2)
AVcc = 2.7 to 5.5 V
• Active mode
• Sleep mode
(When MA2 = 1 in SYSCR2)
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3. Analog power supply voltage and A/D converter accuracy guarantee range
12.0
2.0
2.7 5.5 AVcc(V)
φosc(MHz)
Vcc = 2.7 to 5.5 V
• Active mode
• Sleep mode
Section 20 Electrical Characteristics
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20.3.2 DC Characteristics
Table 20.12 DC Characteristics (1)
VCC = 2.7 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C unless otherwise indicated.
Values
Item Symbol
Applicable
Pins Test
Condition Min. Typ. Max. Unit Notes
VCC = 4.0 V to 5.5 V VCC × 0.8 — VCC + 0.3 V RES, NMI, WKP5,
IRQ0, IRQ3,
ADTRG, TMRIV,
TMCIV, FTCI,
FTIOA to FTIOD,
SCK3, TRGV
V
CC × 0.9 — VCC + 0.3 V
VCC = 4.0 V to 5.5 V VCC × 0.7 — VCC + 0.3 V RXD, SCL, SDA,
P17, P14,
P22 to P20,
P57 to P55,
P76 to P74,
P84 to P80,
PC1, PC0
V
CC × 0.8 — VCC + 0.3 V
AVCC = 4.0 V to 5.5 V AVCC × 0.7 — AVCC + 0.3 V PB3 to PB0
AVCC = 2.7 V to 5.5 V AVCC × 0.8 — AVCC + 0.3 V
VCC = 4.0 V to 5.5 V VCC – 0.5 — VCC + 0.3 V
Input high
voltage
VIH
OSC1
V
CC – 0.3 VCC + 0.3 V
VCC = 4.0 V to 5.5 V –0.3 — VCC × 0.2 V
RES, NMI, WKP5,
IRQ0, IRQ3,
ADTRG, TMRIV,
TMCIV, FTCI,
FTIOA to FTIOD,
SCK3, TRGV
–0.3 — VCC × 0.1 V
VCC = 4.0 V to 5.5 V –0.3 — VCC × 0.3 V RXD, SCL, SDA,
P17, P14,
P22 to P20,
P57 to P55,
P76 to P74,
P84 to P80,
PC1, PC0
–0.3 — VCC × 0.2 V
AVCC = 4.0 V to 5.5 V –0.3 — AVCC × 0.3 PB3 to PB0
AVCC = 2.7 V to 5.5 V –0.3 — AVCC × 0.2
V
VCC = 4.0 V to 5.5 V –0.3 — 0.5 V
Input low
voltage
VIL
OSC1
–0.3 — 0.3 V
Section 20 Electrical Characteristics
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Values
Item Symbol
Applicable
Pins Test
Condition Min. Typ. Max. Unit Notes
VCC = 4.0 V to 5.5 V
–IOH = 4 mA
VCC –
1.0
— — V P17, P14,
P22 to P20,
P55,
P76 to P74,
P84 to P80,
PC1, PC0
–IOH = 0.1 mA VCC –
0.5
— — V
VCC = 4.0 V to 5.5 V
–IOH = 0.1 mA
VCC –
2.5
— — V
Output
high
voltage
VOH
P56, P57
VCC = 2.7 V to 4.0 V
–IOH = 0.1 mA
VCC –
2.2
— — V
VCC = 4.0 V to 5.5 V
IOL = 1.6 mA
— — 0.6 V
P17, P14,
P22 to P20,
P57 to P55,
P76 to P74,
PC1, PC0
IOL = 0.4 mA — — 0.4 V
VCC = 4.0 V to 5.5 V
IOL = 20.0 mA
— — 1.5 V
VCC = 4.0 V to 5.5 V
IOL = 10.0 mA
— — 1.0 V
VCC = 4.0 V to 5.5 V
IOL = 1.6 mA
— — 0.4 V
P84 to P80
IOL = 0.4 mA — — 0.4 V
VCC = 4.0 V to 5.5 V
IOL = 6.0 mA
— — 0.6 V
Output low
voltage
VOL
SCL, SDA
IOL = 3.0 mA — — 0.4 V
OSC1, NMI,
WKP5,
IRQ0, IRQ3,
ADTRG, TRGV,
TMRIV, TMCIV,
FTCI, FTIOA to
FTIOD, RXD,
SCK3, SCL, SDA
VIN = 0.5 V to
(VCC – 0.5 V)
— — 1.0 µA
P17, P14,
P22 to P20,
P57 to P55,
P76 to P74,
P84 to P80,
PC1, PC0
VIN = 0.5 V to
(VCC – 0.5 V)
— — 1.0 µA
Input/
output
leakage
current
| IIL |
PB3 to PB0 VIN = 0.5 V to
(AVCC – 0.5 V)
— — 1.0 µA
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Values
Item Symbol
Applicable
Pins Test
Condition Min. Typ. Max. Unit Notes
VCC = 5.0 V,
VIN = 0.0 V
50.0 — 300.0 µA
Pull-up
MOS
current
–Ip P17, P14, P55
VCC = 2.7 V,
VIN = 0.0 V
— 60.0 — µA Reference
value
Input
capaci-
tance
Cin All input pins
except power
supply pins
f = 1 MHz,
VIN = 0.0 V,
Ta = 25°C
— — 15.0 pF
Active mode 1
VCC = 5.0 V,
fOSC = 12 MHz
— 12.0 18.0 mA *
IOPE1 V
CC
Active mode 1
VCC = 2.7 V,
fOSC = 12 MHz
— 9.6 — mA Reference
value*
Active mode 2
VCC = 5.0 V,
fOSC = 12 MHz
— 2.0 2.5 mA *
Active
mode
current
consump-
tion
IOPE2 V
CC
Active mode 2
VCC = 2.7 V,
fOSC = 12 MHz
— 1.5 — mA Reference
value*
Sleep mode 1
VCC = 5.0 V,
fOSC = 12 MHz
— 7.2 12.0 mA *
ISLEEP1 V
CC
Sleep mode 1
VCC = 2.7 V,
fOSC = 12 MHz
— 6.0 — mA Reference
value*
Sleep mode 2
VCC = 5.0 V,
fOSC = 12 MHz
— 1.8 2.2 mA *
Sleep
mode
current
consump-
tion
ISLEEP2 V
CC
Sleep mode 2
VCC = 2.7 V,
fOSC = 12 MHz
— 1.4 — mA Reference
value*
Subsleep
mode
current
consump-
tion
ISUBSP V
CC V
CC = 5.0 V
LVDE = 0,
BGRE = 0
— — 5.0 µA *
Standby
mode
current
consump-
tion
ISTBY V
CC LVDE = 0,
BGRE = 0
— — 5.0 µA *
Section 20 Electrical Characteristics
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Values
Item Symbol
Applicable
Pins Test
Condition Min. Typ. Max. Unit Notes
RAM data
retaining
voltage
VRAM V
CC 2.0 — — V
Note: * Pin states during current consumption measurement are given below (excluding current
in the pull-up MOS transistors and output buffers).
Mode RES Pin Internal State Other Pins Oscillator Pins
Active mode 1 Operates
Active mode 2
VCC
Operates (φ/64)
VCC
Sleep mode 1 Only timers operate
Sleep mode 2
VCC
Only timers operate (φ/64)
VCC
System clock:
Crystal or ceramic
resonator, and on-chip
oscillator
Subsleep mode
Standby mode
VCC CPU and timers both stop VCC —
Section 20 Electrical Characteristics
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Table 20.12 DC Characteristics (2)
VCC = 2.7 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise indicated.
Values
Item Symbol
Application
Pins Test
Condition Min. Typ. Max. Unit
Output pins except
P84 to P80, SCL,
and SDA
— — 2.0 mA
P84 to P80
VCC = 4.0 V to 5.5 V
— — 20.0 mA
Output pins except
P84 to P80, SCL,
and SDA
— — 0.5 mA
P84 to P80 — — 10.0 mA
Allowable output low
current (per pin)
IOL
SCL, SDA
— — 6.0 mA
∑IOL Output pins except
P84 to P80, SCL,
and SDA
— — 40.0 mA
P84 to P80, SCL,
and SDA
VCC = 4.0 V to 5.5 V
— — 80.0 mA
Output pins except
P84 to P80, SCL,
and SDA
— — 20.0 mA
Allowable output low
current (total)
P84 to P80, SCL,
and SDA
— — 40.0 mA
VCC = 4.0 V to 5.5 V — — 4.0 mA Output pins except
P56, P57 — — 0.2 mA
VCC = 4.0 V to 5.5 V — — 2.0 mA
Allowable output high
current (per pin)
I –IOH I
P56, P57
— — 0.2 mA
VCC = 4.0 V to 5.5 V — — 40.0 mA Allowable output high
current (total)
I –∑IOH I All output pins
— — 8.0 mA
Section 20 Electrical Characteristics
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20.3.3 AC Characteristics
Table 20.13 AC Characteristi c s
VCC = 2.7 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Values
Item Symbol
Applicable
Pins Test
Condition Min. Typ. Max. Unit
Reference
Figure
System clock
oscillation
frequency
fOSC OSC1, OSC2 2.0 — 12.0 MHz
1 — 64 tOSC System clock (φ)
cycle time
tcyc
— — 32.0 µs
*
Figure 20.1
Instruction cycle
time
2 — — tcyc
Oscillation
stabilization time
(crystal resonator)
trc OSC1, OSC2 — — 10.0 ms
Oscillation
stabilization time
(ceramic resonator)
trc OSC1, OSC2 — — 5.0 ms
External clock high
width
tCPH OSC1 35.0 — — ns
External clock low
width
tCPL OSC1 35.0 — — ns
External clock rise
time
tCPr OSC1 — — 15.0 ns
External clock fall
time
tCPf OSC1 — — 15.0 ns
Figure 20.1
RES pin low width* t
REL RES 2500 — — ns Figure 20.2
NMI pin high width tIHNMI NMI 1500 — — ns
NMI pin low width tILNMI NMI 1500 — — ns
Figure 20.3
Input pin high width tIH IRQ0 , IRQ3,
WKP5,TMCIV,
TMRIV, TRGV,
ADTRG, FTCI,
FTIOA to FTIOD
2 — — tcyc Figure 20.3
Note: * Except when power-on reset circuit is used.
Section 20 Electrical Characteristics
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Values
Item Symbol
Applicable
Pins Test
Condition Min. Typ. Max. Unit
Reference
Figure
Input pin low width tIL IRQ0, IRQ3,
WKP5, TMCIV,
TMRIV, TRGV,
ADTRG, FTCI,
FTIOA to FTIOD
2 — — tcyc Figure 20.3
VCC = 4.0 V to
5.5 V
FSEL = 0,
VCLSEL = 0
7.6 8.0 8.4 MHz
On-chip oscillator
oscillation
frequency
fRC
VCC = 4.0 V to
5.5 V
FSEL = 1,
VCLSEL = 0
9.4 10.0 10.6 MHz
Notes: * Determined by MA2 to MA0 in system control register 2 (SYSCR2).
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Table 20.14 I2C Bus Interface Timing
VCC = 2.7 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Values
Item Symbol
Applicable
Pins Test
Condition Min. Typ. Max. Unit Reference
Figure
SCL input cycle time tSCL 12tcyc + 600 ns
SCL input high pulse
width
tSCLH 3tcyc + 300 ns
SCL input low pulse
width
tSCLL 5tcyc + 300 ns
SCL and SDA input
fall time
tSf 300 ns
SCL and SDA input
spike pulse removal
time
tSP 1tcyc ns
SDA input bus-free
time
tBUF 5tcyc ns
Start condition input
hold time
tSTAH 3tcyc ns
Retransmission start
condition input setup
time
tSTAS 3tcyc ns
Setup time for stop
condition input
tSTOS 3tcyc ns
Data input setup time tSDAS 1tcyc+ 20 ns
Data input hold time tSDAH 0 ns
Capacitive load of
SCL and SDA
cb 0 400 pF
VCC = 4.0 to
5.5 V
250 ns SCL and SDA output
fall time
tSf
300 ns
Figure
20.4
Section 20 Electrical Characteristics
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Table 20.15 Serial Interface (SCI3) Timing
VCC = 2.7 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Values
Item Symbol
Applicable
Pins Test
Condition Min. Typ. Max.
Unit Reference
Figure
Asynchro-
nous
4 — — tcyc Input
clock
cycle Clocked
synchronous
tscyc SCK3
6 — — tcyc
Input clock pulse width tSCKW SCK3 0.4 — 0.6 tscyc
Figure
20.5
Transmit data delay
time (clocked
synchronous)
tTXD TXD — — 1 tcyc
Receive data setup
time (clocked
synchronous)s
tRXS RXD 83.3 — — ns
Receive data hold
time (clocked
synchronous)
tRXH RXD 83.3 — — ns
Figure
20.6
Section 20 Electrical Characteristics
Rev. 3.00 Sep. 14, 2006 Page 342 of 408
REJ09B0105-0300
20.3.4 A/D Converter Characteristics
Table 20.16 A/D Converter Characteristics
VCC = 2.7 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Values
Item Symbol
Applicable
Pins Test
Condition Min. Typ. Max. Unit Notes
Analog power supply
voltage
AVCC AVCC 2.7 VCC 5.5 V *1
Analog input voltage AVIN AN3 to AN0 VSS – 0.3 — AVCC + 0.3 V
AIOPE AVCC AVCC = 5.0 V
fOSC = 12 MHz
— — 2.0 mA
AISTOP1 AVCC — 50 — µA *2
Reference
value
Analog power supply
current
AISTOP2 AVCC — — 5.0 µA *3
Analog input
capacitance
CAIN AN3 to AN0 — — 30.0 pF
Allowable signal source
impedance
RAIN AN3 to AN0 — — 5.0 kΩ
Resolution (data length) 10 10 10 bit
Conversion time (single
mode)
134 — — tcyc
Nonlinearity error — — ±7.5 LSB
Offset error — — ±7.5 LSB
Full-scale error — — ±7.5 LSB
Quantization error — — ±0.5 LSB
Absolute accuracy
AVCC = 2.7 V
to 5.5 V
— — ±8.0 LSB
Conversion time (single
mode)
70 — — tcyc
Nonlinearity error — — ±7.5 LSB
Offset error — — ±7.5 LSB
Full-scale error — — ±7.5 LSB
Quantization error — — ±0.5 LSB
Absolute accuracy
AVCC = 4.0 V
to 5.5 V
— — ±8.0 LSB
Section 20 Electrical Characteristics
Rev. 3.00 Sep. 14, 2006 Page 343 of 408
REJ09B0105-0300
Values
Item Symbol
Applicable
Pins Test
Condition Min. Typ. Max. Unit Notes
Conversion time (single
mode)
134 — — tcyc
Nonlinearity error — — ±3.5 LSB
Offset error — — ±3.5 LSB
Full-scale error — — ±3.5 LSB
Quantization error — — ±0.5 LSB
Absolute accuracy
AVCC = 4.0 V
to 5.5 V
— — ±4.0 LSB
Notes: 1. Set AVCC = VCC when the A/D converter is not used.
2. AISTOP1 is the current in active and sleep modes while the A/D converter is idle.
3. AISTOP2 is the current at reset and in standby and subsleep modes while the A/D
converter is idle.
20.3.5 Watchdog Timer Characteristics
Table 20.17 Watchdog Timer Characteristics
VCC = 2.7 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Values
Item Symbol
Applicable
Pins Test
Condition Min. Typ. Max. Unit Notes
Internal oscillator
overflow time tOVF 0.2 0.4 — s *
Note: * Shows the time to count from 0 to 255, at which point an internal reset is generated,
when the internal oscillator is selected.
Section 20 Electrical Characteristics
Rev. 3.00 Sep. 14, 2006 Page 344 of 408
REJ09B0105-0300
20.3.6 Power-Supply-Voltage Detection Circuit Characteristics
Table 20.18 Power-Supply-Voltage Detection Circuit Characteristics
VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Values
Item Symbol
Test
Condition Min. Typ. Max. Unit
Power-supply falling detection
voltage
Vint(D) LVDSEL = 0 3.3 3.7 4.3 V
Power-supply rising detection
voltage
Vint(U) LVDSEL = 0 3.6 4.0 4.5 V
Reset detection voltage 1*1 Vreset1 LVDSEL = 0 2.0 2.3 2.7 V
Reset detection voltage 2*2 Vreset2 LVDSEL = 1 3.0 3.6 4.2 V
Lower-limit voltage of LVDR
operation*3
VLVDRmin 1.0 — — V
LVD stabilization time tLVDON 50 — — µs
Current consumption in standby
mode
ISTBY LVDE = 1,
BGRE = 1
Vcc = 5.0 V
— 350 µA
Notes: 1. This voltage should be used when the falling and rising voltage detection function is
used.
2. Select the low-voltage reset 2 when only the low-voltage detection reset is used.
3. When the power-supply voltage (Vcc) falls below VLVDRmin = 1.0 V and then rises, a reset
may not occur. Therefore sufficient evaluation is required.
20.3.7 LVDI External Voltage Detection Circuit Characteristics
Table 20.19 LVDI External Voltage Detection Circuit Characteristics
Vcc = 4.5 to 5.5 V, AVcc = 2.7 to 5.5 V, VSS= 0.0 V, Ta = –20 to +75°C
Values
Item Symbol
Test
Condition Min. Typ. Max. Unit
ExtD/ExtU input
detection voltage
Vexd 0.85 1.15 1.45 V
ExtD/ExtU input voltage
range
VextD/U VextD > VextU −0.3 — Lower voltage,
either AVcc + 0.3
or Vcc + 0.3
V
Section 20 Electrical Characteristics
Rev. 3.00 Sep. 14, 2006 Page 345 of 408
REJ09B0105-0300
20.3.8 Power-On Reset Ch aracteristics
Table 20.20 Power-On Reset Circuit Characteristics
VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Values
Item Symbol
Test
Condition Min. Typ. Max. Unit
Pull-up resistance of RES pin RRES 100 150 — kΩ
Power-on reset start voltage* V
por — — 100 mV
Note: * The power-supply voltage (Vcc) must fall below Vpor = 100 mV and then rise after
charge of the RES pin is removed completely. In order to remove charge of the RES
pin, it is recommended that the diode be placed in the Vcc side. If the power-supply
voltage (Vcc) rises from the point over 100 mV, a power-on reset may not occur.
Section 20 Electrical Characteristics
Rev. 3.00 Sep. 14, 2006 Page 346 of 408
REJ09B0105-0300
20.4 Operation Timing
OSC1
t
OSC
V
IH
V
IL
t
CPr
t
CPH
t
CPL
t
CPf
Figure 20.1 System Clock Input Timing
tREL
VIL
RES
tREL
VIL
Vcc × 0.7
Vcc
OSC1
Figure 20.2 RES Low Width Timing
tIL
VIH
VIL
tIH
IRQ0, IRQ3
WKP5, NMI
ADTRG
FTCI, FTIOA
FTIOB, FTIOC
FTIOD
TMCIV, TMRIV
TRGV
Figure 20.3 Input Timing
Section 20 Electrical Characteristics
Rev. 3.00 Sep. 14, 2006 Page 347 of 408
REJ09B0105-0300
SCL
V
IH
V
IL
t
STAH
t
BUF
P*S*
t
Sf
t
Sr
t
SCL
t
SDAH
t
SCLH
t
SCLL
SDA
Sr*
t
STAS
t
SP
t
STOS
t
SDAS
P*
Note: * S, P, and Sr represent the following:
S: Start condition
P: Stop comdition
Sr: Retransmission start condition
Figure 20.4 I2C Bus Interface Input/Output Timing
SCK3
tSCKW
tscyc
Figure 20.5 SCK3 Input Clock Timing
Section 20 Electrical Characteristics
Rev. 3.00 Sep. 14, 2006 Page 348 of 408
REJ09B0105-0300
t
scyc
t
TXD
t
RXS
t
RXH
V
OH
V or V
IH OH
V or V
IL OL
*
*
*
V
OL*
SCK3
TXD
(transmit data)
RXD
(receive data)
Note: *Output timing reference levels
Output high:
Output low:
Load conditions are shown in figure 20.7.
V = 2.0 V
V = 0.8 V
OH
OL
Figure 20.6 SCI3 Input/Output Timing in Clocked Synchronous Mode
20.5 Output Load Condition
V
CC
2.4 kΩ
12 kΩ30 pF
LSI output pin
Figure 20.7 Output Load Circuit
Appendix
Rev. 3.00 Sep. 14, 2006 Page 349 of 408
REJ09B0105-0300
Appendix A Instruction Set
A.1 Instruction List
• Operand Notation
Symbol Description
Rd General (destination*) register
Rs General (source*) register
Rn General register*
ERd General destination register (address register or 32-bit register)
ERs General source register (address register or 32-bit register)
ERn General register (32-bit register)
(EAd) Destination operand
(EAs) Source operand
PC Program counter
SP Stack pointer
CCR Condition-code register
N N (negative) flag in CCR
Z Z (zero) flag in CCR
V V (overflow) flag in CCR
C C (carry) flag in CCR
disp Displacement
→ Transfer from the operand on the left to the operand on the right, or transition from
the state on the left to the state on the right
+ Addition of the operands on both sides
– Subtraction of the operand on the right from the operand on the left
× Multiplication of the operands on both sides
÷ Division of the operand on the left by the operand on the right
∧ Logical AND of the operands on both sides
∨ Logical OR of the operands on both sides
⊕ Logical exclusive OR of the operands on both sides
¬ NOT (logical complement)
Appendix
Rev. 3.00 Sep. 14, 2006 Page 350 of 408
REJ09B0105-0300
Symbol Description
( ), < > Contents of operand
Note: General registers include 8-bit registers (R0H to R7H and R0L to R7L) and 16-bit registers
(R0 to R7 and E0 to E7).
• Condition Code Notation
Symbol Description
↔
Changed according to execution result
* Undetermined (no guaranteed value)
0 Cleared to 0
1 Set to 1
— Not affected by execution of the instruction
∆ Varies depending on conditions, described in notes
Appendix
Rev. 3.00 Sep. 14, 2006 Page 351 of 408
REJ09B0105-0300
Table A.1 Instruction Set
• Data transfer instructions
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes) No. of
States
*1
Condition Code
IHNZVC
#xx
Rn
@ERn
@(d, ERn)
@–ERn/@ERn+
@aa
@(d, PC)
@@aa
—
MOV.B #xx:8, Rd
MOV.B Rs, Rd
MOV.B @ERs, Rd
MOV.B @(d:16, ERs), Rd
MOV.B @(d:24, ERs), Rd
MOV.B @ERs+, Rd
MOV.B @aa:8, Rd
MOV.B @aa:16, Rd
MOV.B @aa:24, Rd
MOV.B Rs, @ERd
MOV.B Rs, @(d:16, ERd)
MOV.B Rs, @(d:24, ERd)
MOV.B Rs, @–ERd
MOV.B Rs, @aa:8
MOV.B Rs, @aa:16
MOV.B Rs, @aa:24
MOV.W #xx:16, Rd
MOV.W Rs, Rd
MOV.W @ERs, Rd
MOV.W @(d:16, ERs), Rd
MOV.W @(d:24, ERs), Rd
MOV.W @ERs+, Rd
MOV.W @aa:16, Rd
MOV.W @aa:24, Rd
MOV.W Rs, @ERd
MOV.W Rs, @(d:16, ERd)
MOV.W Rs, @(d:24, ERd)
Operation
#xx:8 → Rd8
Rs8 → Rd8
@ERs → Rd8
@(d:16, ERs) → Rd8
@(d:24, ERs) → Rd8
@ERs → Rd8
ERs32+1 → ERs32
@aa:8 → Rd8
@aa:16 → Rd8
@aa:24 → Rd8
Rs8 → @ERd
Rs8 → @(d:16, ERd)
Rs8 → @(d:24, ERd)
ERd32–1 → ERd32
Rs8 → @ERd
Rs8 → @aa:8
Rs8 → @aa:16
Rs8 → @aa:24
#xx:16 → Rd16
Rs16 → Rd16
@ERs → Rd16
@(d:16, ERs) → Rd16
@(d:24, ERs) → Rd16
@ERs → Rd16
ERs32+2 → @ERd32
@aa:16 → Rd16
@aa:24 → Rd16
Rs16 → @ERd
Rs16 → @(d:16, ERd)
Rs16 → @(d:24, ERd)
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
W
W
W
W
W
W
W
W
W
W
W
2
4
2
2
2
2
2
2
4
8
4
8
4
8
4
8
2
2
2
2
4
6
2
4
6
4
6
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
2
2
4
6
10
6
4
6
8
4
6
10
6
4
6
8
4
2
4
6
10
6
6
8
4
6
10
Normal
Advanced
↔
↔
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
MOV
Appendix
Rev. 3.00 Sep. 14, 2006 Page 352 of 408
REJ09B0105-0300
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes) No. of
States
*1
Condition Code
IHNZVC
#xx
Rn
@ERn
@(d, ERn)
@–ERn/@ERn+
@aa
@(d, PC)
@@aa
—
MOV.W Rs, @–ERd
MOV.W Rs, @aa:16
MOV.W Rs, @aa:24
MOV.L #xx:32, Rd
MOV.L ERs, ERd
MOV.L @ERs, ERd
MOV.L @(d:16, ERs), ERd
MOV.L @(d:24, ERs), ERd
MOV.L @ERs+, ERd
MOV.L @aa:16, ERd
MOV.L @aa:24, ERd
MOV.L ERs, @ERd
MOV.L ERs, @(d:16, ERd)
MOV.L ERs, @(d:24, ERd)
MOV.L ERs, @–ERd
MOV.L ERs, @aa:16
MOV.L ERs, @aa:24
POP.W Rn
POP.L ERn
PUSH.W Rn
PUSH.L ERn
MOVFPE @aa:16, Rd
MOVTPE Rs, @aa:16
Operation
ERd32–2 → ERd32
Rs16 → @ERd
Rs16 → @aa:16
Rs16 → @aa:24
#xx:32 → Rd32
ERs32 → ERd32
@ERs → ERd32
@(d:16, ERs) → ERd32
@(d:24, ERs) → ERd32
@ERs → ERd32
ERs32+4 → ERs32
@aa:16 → ERd32
@aa:24 → ERd32
ERs32 → @ERd
ERs32 → @(d:16, ERd)
ERs32 → @(d:24, ERd)
ERd32–4 → ERd32
ERs32 → @ERd
ERs32 → @aa:16
ERs32 → @aa:24
@SP → Rn16
SP+2 → SP
@SP → ERn32
SP+4 → SP
SP–2 → SP
Rn16 → @SP
SP–4 → SP
ERn32 → @SP
Cannot be used in
this LSI
Cannot be used in
this LSI
W
W
W
L
L
L
L
L
L
L
L
L
L
L
L
L
L
W
L
W
L
B
B
6
2
4
4
6
10
6
10
2
4
4
4
6
6
8
6
8
4
4
2
4
2
4
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
6
6
8
6
2
8
10
14
10
10
12
8
10
14
10
10
12
6
10
6
10
Normal
Advanced
↔
↔
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Cannot be used in
this LSI
Cannot be used in
this LSI
MOV
POP
PUSH
MOVFPE
MOVTPE
Appendix
Rev. 3.00 Sep. 14, 2006 Page 353 of 408
REJ09B0105-0300
• Arithmetic instructions
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes) No. of
States
*1
Condition Code
IHNZVC
#xx
Rn
@ERn
@(d, ERn)
@–ERn/@ERn+
@aa
@(d, PC)
@@aa
—
ADD.B #xx:8, Rd
ADD.B Rs, Rd
ADD.W #xx:16, Rd
ADD.W Rs, Rd
ADD.L #xx:32, ERd
ADD.L ERs, ERd
ADDX.B #xx:8, Rd
ADDX.B Rs, Rd
ADDS.L #1, ERd
ADDS.L #2, ERd
ADDS.L #4, ERd
INC.B Rd
INC.W #1, Rd
INC.W #2, Rd
INC.L #1, ERd
INC.L #2, ERd
DAA Rd
SUB.B Rs, Rd
SUB.W #xx:16, Rd
SUB.W Rs, Rd
SUB.L #xx:32, ERd
SUB.L ERs, ERd
SUBX.B #xx:8, Rd
SUBX.B Rs, Rd
SUBS.L #1, ERd
SUBS.L #2, ERd
SUBS.L #4, ERd
DEC.B Rd
DEC.W #1, Rd
DEC.W #2, Rd
Operation
Rd8+#xx:8 → Rd8
Rd8+Rs8 → Rd8
Rd16+#xx:16 → Rd16
Rd16+Rs16 → Rd16
ERd32+#xx:32 →
ERd32
ERd32+ERs32 →
ERd32
Rd8+#xx:8 +C → Rd8
Rd8+Rs8 +C → Rd8
ERd32+1 → ERd32
ERd32+2 → ERd32
ERd32+4 → ERd32
Rd8+1 → Rd8
Rd16+1 → Rd16
Rd16+2 → Rd16
ERd32+1 → ERd32
ERd32+2 → ERd32
Rd8 decimal adjust
→ Rd8
Rd8–Rs8 → Rd8
Rd16–#xx:16 → Rd16
Rd16–Rs16 → Rd16
ERd32–#xx:32 → ERd32
ERd32–ERs32 → ERd32
Rd8–#xx:8–C → Rd8
Rd8–Rs8–C → Rd8
ERd32–1 → ERd32
ERd32–2 → ERd32
ERd32–4 → ERd32
Rd8–1 → Rd8
Rd16–1 → Rd16
Rd16–2 → Rd16
B
B
W
W
L
L
B
B
L
L
L
B
W
W
L
L
B
B
W
W
L
L
B
B
L
L
L
B
W
W
2
4
6
2
4
6
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
(1)
(1)
(2)
(2)
—
—
—
—
—
—
—
—
*
(1)
(1)
(2)
(2)
—
—
—
—
—
—
2
2
4
2
6
2
2
2
2
2
2
2
2
2
2
2
2
2
4
2
6
2
2
2
2
2
2
2
2
2
Normal
Advanced
↔
↔
↔
↔↔↔↔↔↔
↔↔↔↔↔↔↔
—
—
—
—
—
—
↔↔↔↔↔↔↔↔↔↔↔↔↔
↔↔↔↔↔
(3)
(3)
—
—
—
(3)
(3)
—
—
—
↔↔↔
↔↔↔↔↔↔↔↔↔
↔↔↔↔↔↔
—
—
—
*
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔↔↔↔↔
↔
↔
↔
↔
↔↔↔
↔↔↔
↔↔↔
ADD
ADDX
ADDS
INC
DAA
SUB
SUBX
SUBS
DEC
Appendix
Rev. 3.00 Sep. 14, 2006 Page 354 of 408
REJ09B0105-0300
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes) No. of
States
*1
Condition Code
IHNZVC
#xx
Rn
@ERn
@(d, ERn)
@–ERn/@ERn+
@aa
@(d, PC)
@@aa
—
DEC.L #1, ERd
DEC.L #2, ERd
DAS.Rd
MULXU. B Rs, Rd
MULXU. W Rs, ERd
MULXS. B Rs, Rd
MULXS. W Rs, ERd
DIVXU. B Rs, Rd
DIVXU. W Rs, ERd
DIVXS. B Rs, Rd
DIVXS. W Rs, ERd
CMP.B #xx:8, Rd
CMP.B Rs, Rd
CMP.W #xx:16, Rd
CMP.W Rs, Rd
CMP.L #xx:32, ERd
CMP.L ERs, ERd
Operation
ERd32–1 → ERd32
ERd32–2 → ERd32
Rd8 decimal adjust
→ Rd8
Rd8 × Rs8 → Rd16
(unsigned multiplication)
Rd16 × Rs16 → ERd32
(unsigned multiplication)
Rd8 × Rs8 → Rd16
(signed multiplication)
Rd16 × Rs16 → ERd32
(signed multiplication)
Rd16 ÷ Rs8 → Rd16
(RdH: remainder,
RdL: quotient)
(unsigned division)
ERd32 ÷ Rs16 → ERd32
(Ed: remainder,
Rd: quotient)
(unsigned division)
Rd16 ÷ Rs8 → Rd16
(RdH: remainder,
RdL: quotient)
(signed division)
ERd32 ÷ Rs16 → ERd32
(Ed: remainder,
Rd: quotient)
(signed division)
Rd8–#xx:8
Rd8–Rs8
Rd16–#xx:16
Rd16–Rs16
ERd32–#xx:32
ERd32–ERs32
L
L
B
B
W
B
W
B
W
B
W
B
B
W
W
L
L
2
4
6
2
2
2
2
2
4
4
2
2
4
4
2
2
2
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
2
2
2
14
22
16
24
14
22
16
24
2
2
4
2
4
2
Normal
Advanced
↔
↔
↔
—
—
*
—
—
—
—
—
—
—
—
(1)
(1)
(2)
(2)
↔
↔
↔
↔
↔
*
—
—
—
—
—
—
—
—
—
—
(7)
(7)
(7)
(7)
—
—
(6)
(6)
(8)
(8)
↔
↔
↔
↔
—
—
—
—
—
—
—
—
—
—
—
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
DEC
DAS
MULXU
MULXS
DIVXU
DIVXS
CMP
Appendix
Rev. 3.00 Sep. 14, 2006 Page 355 of 408
REJ09B0105-0300
Mnemonic Operation
Operand Size
Addressing Mode and
Instruction Length (bytes) No. of
States
*1
Condition Code
IHNZVC
#xx
Rn
@ERn
@(d, ERn)
@–ERn/@ERn+
@aa
@(d, PC)
@@aa
—
NEG.B Rd
NEG.W Rd
NEG.L ERd
EXTU.W Rd
EXTU.L ERd
EXTS.W Rd
EXTS.L ERd
0–Rd8 → Rd8
0–Rd16 → Rd16
0–ERd32 → ERd32
0 → (<bits 15 to 8>
of Rd16)
0 → (<bits 31 to 16>
of ERd32)
(<bit 7> of Rd16) →
(<bits 15 to 8> of Rd16)
(<bit 15> of ERd32) →
(<bits 31 to 16> of
ERd32)
B
W
L
W
L
W
L
2
2
2
2
2
2
2
—
—
—
—
—
—
—
—
—
—
—
2
2
2
2
2
2
2
Normal
Advanced
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
0
0
0
0
0
0
—
—
—
—
↔↔↔↔
↔↔
NEG
EXTU
EXTS
Appendix
Rev. 3.00 Sep. 14, 2006 Page 356 of 408
REJ09B0105-0300
• Logic instructions
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes) No. of
States
*1
Condition Code
IHNZVC
#xx
Rn
@ERn
@(d, ERn)
@–ERn/@ERn+
@aa
@(d, PC)
@@aa
—
AND.B #xx:8, Rd
AND.B Rs, Rd
AND.W #xx:16, Rd
AND.W Rs, Rd
AND.L #xx:32, ERd
AND.L ERs, ERd
OR.B #xx:8, Rd
OR.B Rs, Rd
OR.W #xx:16, Rd
OR.W Rs, Rd
OR.L #xx:32, ERd
OR.L ERs, ERd
XOR.B #xx:8, Rd
XOR.B Rs, Rd
XOR.W #xx:16, Rd
XOR.W Rs, Rd
XOR.L #xx:32, ERd
XOR.L ERs, ERd
NOT.B Rd
NOT.W Rd
NOT.L ERd
Operation
Rd8∧#xx:8 → Rd8
Rd8∧Rs8 → Rd8
Rd16∧#xx:16 → Rd16
Rd16∧Rs16 → Rd16
ERd32∧#xx:32 → ERd32
ERd32∧ERs32 → ERd32
Rd8⁄#xx:8 → Rd8
Rd8⁄Rs8 → Rd8
Rd16⁄#xx:16 → Rd16
Rd16⁄Rs16 → Rd16
ERd32⁄#xx:32 → ERd32
ERd32⁄ERs32 → ERd32
Rd8⊕#xx:8 → Rd8
Rd8⊕Rs8 → Rd8
Rd16⊕#xx:16 → Rd16
Rd16⊕Rs16 → Rd16
ERd32⊕#xx:32 → ERd32
ERd32⊕ERs32 → ERd32
¬ Rd8 → Rd8
¬ Rd16 → Rd16
¬ Rd32 → Rd32
B
B
W
W
L
L
B
B
W
W
L
L
B
B
W
W
L
L
B
W
L
2
4
6
2
4
6
2
4
6
2
2
4
2
2
4
2
2
4
2
2
2
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
2
2
4
2
6
4
2
2
4
2
6
4
2
2
4
2
6
4
2
2
2
Normal
Advanced
↔
↔
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
AND
OR
XOR
NOT
Appendix
Rev. 3.00 Sep. 14, 2006 Page 357 of 408
REJ09B0105-0300
• Shift instructions
Mnemonic
Operand Size
No. of
States
*1
Condition Code
IHNZVC
SHAL.B Rd
SHAL.W Rd
SHAL.L ERd
SHAR.B Rd
SHAR.W Rd
SHAR.L ERd
SHLL.B Rd
SHLL.W Rd
SHLL.L ERd
SHLR.B Rd
SHLR.W Rd
SHLR.L ERd
ROTXL.B Rd
ROTXL.W Rd
ROTXL.L ERd
ROTXR.B Rd
ROTXR.W Rd
ROTXR.L ERd
ROTL.B Rd
ROTL.W Rd
ROTL.L ERd
ROTR.B Rd
ROTR.W Rd
ROTR.L ERd
B
W
L
B
W
L
B
W
L
B
W
L
B
W
L
B
W
L
B
W
L
B
W
L
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Normal
Advanced
↔
↔
↔
↔
Addressing Mode and
Instruction Length (bytes)
#xx
Rn
@ERn
@(d, ERn)
@–ERn/@ERn+
@aa
@(d, PC)
@@aa
—
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Operation
MSB LSB
0
C
MSB LSB
0
C
C
MSB LSB
0C
MSB LSB
C
MSB LSB
C
MSB LSB
C
MSB LSB
C
MSB LSB
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
SHAL
SHAR
SHLL
SHLR
ROTXL
ROTXR
ROTL
ROTR
Appendix
Rev. 3.00 Sep. 14, 2006 Page 358 of 408
REJ09B0105-0300
• Bit manipulation instructions
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes) No. of
States
*1
Condition Code
IHNZVC
#xx
Rn
@ERn
@(d, ERn)
@–ERn/@ERn+
@aa
@(d, PC)
@@aa
—
BSET #xx:3, Rd
BSET #xx:3, @ERd
BSET #xx:3, @aa:8
BSET Rn, Rd
BSET Rn, @ERd
BSET Rn, @aa:8
BCLR #xx:3, Rd
BCLR #xx:3, @ERd
BCLR #xx:3, @aa:8
BCLR Rn, Rd
BCLR Rn, @ERd
BCLR Rn, @aa:8
BNOT #xx:3, Rd
BNOT #xx:3, @ERd
BNOT #xx:3, @aa:8
BNOT Rn, Rd
BNOT Rn, @ERd
BNOT Rn, @aa:8
BTST #xx:3, Rd
BTST #xx:3, @ERd
BTST #xx:3, @aa:8
BTST Rn, Rd
BTST Rn, @ERd
BTST Rn, @aa:8
BLD #xx:3, Rd
Operation
(#xx:3 of Rd8) ← 1
(#xx:3 of @ERd) ← 1
(#xx:3 of @aa:8) ← 1
(Rn8 of Rd8) ← 1
(Rn8 of @ERd) ← 1
(Rn8 of @aa:8) ← 1
(#xx:3 of Rd8) ← 0
(#xx:3 of @ERd) ← 0
(#xx:3 of @aa:8) ← 0
(Rn8 of Rd8) ← 0
(Rn8 of @ERd) ← 0
(Rn8 of @aa:8) ← 0
(#xx:3 of Rd8) ←
¬ (#xx:3 of Rd8)
(#xx:3 of @ERd) ←
¬ (#xx:3 of @ERd)
(#xx:3 of @aa:8) ←
¬ (#xx:3 of @aa:8)
(Rn8 of Rd8) ←
¬ (Rn8 of Rd8)
(Rn8 of @ERd) ←
¬ (Rn8 of @ERd)
(Rn8 of @aa:8) ←
¬ (Rn8 of @aa:8)
¬ (#xx:3 of Rd8) → Z
¬ (#xx:3 of @ERd) → Z
¬ (#xx:3 of @aa:8) → Z
¬ (Rn8 of @Rd8) → Z
¬ (Rn8 of @ERd) → Z
¬ (Rn8 of @aa:8) → Z
(#xx:3 of Rd8) → C
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
2
2
2
2
2
2
2
2
2
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
2
8
8
2
8
8
2
8
8
2
8
8
2
8
8
2
8
8
2
6
6
2
6
6
2
Normal
Advanced
↔↔↔↔↔↔
↔
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
BSET
BCLR
BNOT
BTST
BLD
Appendix
Rev. 3.00 Sep. 14, 2006 Page 359 of 408
REJ09B0105-0300
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes) No. of
States*1
Condition Code
IHNZVC
#xx
Rn
@ERn
@(d, ERn)
@–ERn/@ERn+
@aa
@(d, PC)
@@aa
—
BLD #xx:3, @ERd
BLD #xx:3, @aa:8
BILD #xx:3, Rd
BILD #xx:3, @ERd
BILD #xx:3, @aa:8
BST #xx:3, Rd
BST #xx:3, @ERd
BST #xx:3, @aa:8
BIST #xx:3, Rd
BIST #xx:3, @ERd
BIST #xx:3, @aa:8
BAND #xx:3, Rd
BAND #xx:3, @ERd
BAND #xx:3, @aa:8
BIAND #xx:3, Rd
BIAND #xx:3, @ERd
BIAND #xx:3, @aa:8
BOR #xx:3, Rd
BOR #xx:3, @ERd
BOR #xx:3, @aa:8
BIOR #xx:3, Rd
BIOR #xx:3, @ERd
BIOR #xx:3, @aa:8
BXOR #xx:3, Rd
BXOR #xx:3, @ERd
BXOR #xx:3, @aa:8
BIXOR #xx:3, Rd
BIXOR #xx:3, @ERd
BIXOR #xx:3, @aa:8
Operation
(#xx:3 of @ERd) → C
(#xx:3 of @aa:8) → C
¬ (#xx:3 of Rd8) → C
¬ (#xx:3 of @ERd) → C
¬ (#xx:3 of @aa:8) → C
C → (#xx:3 of Rd8)
C → (#xx:3 of @ERd24)
C → (#xx:3 of @aa:8)
¬ C → (#xx:3 of Rd8)
¬ C → (#xx:3 of @ERd24)
¬ C → (#xx:3 of @aa:8)
C∧(#xx:3 of Rd8) → C
C∧(#xx:3 of @ERd24) → C
C∧(#xx:3 of @aa:8) → C
C∧ ¬ (#xx:3 of Rd8) → C
C∧ ¬ (#xx:3 of @ERd24) → C
C∧ ¬ (#xx:3 of @aa:8) → C
C⁄(#xx:3 of Rd8) → C
C⁄(#xx:3 of @ERd24) → C
C⁄(#xx:3 of @aa:8) → C
C⁄ ¬ (#xx:3 of Rd8) → C
C⁄ ¬ (#xx:3 of @ERd24) → C
C⁄ ¬ (#xx:3 of @aa:8) → C
C⊕(#xx:3 of Rd8) → C
C⊕(#xx:3 of @ERd24) → C
C⊕(#xx:3 of @aa:8) → C
C⊕ ¬ (#xx:3 of Rd8) → C
C⊕ ¬ (#xx:3 of @ERd24) → C
C⊕ ¬ (#xx:3 of @aa:8) → C
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
2
2
2
2
2
2
2
2
2
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
6
6
2
6
6
2
8
8
2
8
8
2
6
6
2
6
6
2
6
6
2
6
6
2
6
6
2
6
6
Normal
Advanced
↔↔↔↔↔
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔
BLD
BILD
BST
BIST
BAND
BIAND
BOR
BIOR
BXOR
BIXOR
Appendix
Rev. 3.00 Sep. 14, 2006 Page 360 of 408
REJ09B0105-0300
• Branching instructions
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Mnemonic
Operand Size
No. of
States
*1
Condition Code
IHNZVC
BRA d:8 (BT d:8)
BRA d:16 (BT d:16)
BRN d:8 (BF d:8)
BRN d:16 (BF d:16)
BHI d:8
BHI d:16
BLS d:8
BLS d:16
BCC d:8 (BHS d:8)
BCC d:16 (BHS d:16)
BCS d:8 (BLO d:8)
BCS d:16 (BLO d:16)
BNE d:8
BNE d:16
BEQ d:8
BEQ d:16
BVC d:8
BVC d:16
BVS d:8
BVS d:16
BPL d:8
BPL d:16
BMI d:8
BMI d:16
BGE d:8
BGE d:16
BLT d:8
BLT d:16
BGT d:8
BGT d:16
BLE d:8
BLE d:16
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
4
6
4
6
4
6
4
6
4
6
4
6
4
6
4
6
4
6
4
6
4
6
4
6
4
6
4
6
4
6
4
6
Normal
Advanced
Addressing Mode and
Instruction Length (bytes)
#xx
Rn
@ERn
@(d, ERn)
@–ERn/@ERn+
@aa
@(d, PC)
@@aa
—
2
4
2
4
2
4
2
4
2
4
2
4
2
4
2
4
2
4
2
4
2
4
2
4
2
4
2
4
2
4
2
4
Operation
Always
Never
C ⁄ Z = 0
C ⁄ Z = 1
C = 0
C = 1
Z = 0
Z = 1
V = 0
V = 1
N = 0
N = 1
N⊕V = 0
N⊕V = 1
Z ⁄ (N⊕V) = 0
Z ⁄ (N⊕V) = 1
If condition
is true then
PC ← PC+d
else next;
Branch
Condition
Bcc
Appendix
Rev. 3.00 Sep. 14, 2006 Page 361 of 408
REJ09B0105-0300
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes) No. of
States
*1
Condition Code
IHNZVC
#xx
Rn
@ERn
@(d, ERn)
@–ERn/@ERn+
@aa
@(d, PC)
@@aa
—
JMP @ERn
JMP @aa:24
JMP @@aa:8
BSR d:8
BSR d:16
JSR @ERn
JSR @aa:24
JSR @@aa:8
RTS
Operation
PC ← ERn
PC ← aa:24
PC ← @aa:8
PC → @–SP
PC ← PC+d:8
PC → @–SP
PC ← PC+d:16
PC → @–SP
PC ← ERn
PC → @–SP
PC ← aa:24
PC → @–SP
PC ← @aa:8
PC ← @SP+
—
—
—
—
—
—
—
—
—
2
2
4
4
2
4
2
2
2
—
—
—
—
—
—
—
—
—
4
6
Normal
Advanced
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
8
6
8
6
8
8
8
10
8
10
8
10
12
10
JMP
BSR
JSR
RTS
Appendix
Rev. 3.00 Sep. 14, 2006 Page 362 of 408
REJ09B0105-0300
• System control instructions
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes) No. of
States
*1
Condition Code
IHNZVC
#xx
Rn
@ERn
@(d, ERn)
@–ERn/@ERn+
@aa
@(d, PC)
@@aa
—
TRAPA #x:2
RTE
SLEEP
LDC #xx:8, CCR
LDC Rs, CCR
LDC @ERs, CCR
LDC @(d:16, ERs), CCR
LDC @(d:24, ERs), CCR
LDC @ERs+, CCR
LDC @aa:16, CCR
LDC @aa:24, CCR
STC CCR, Rd
STC CCR, @ERd
STC CCR, @(d:16, ERd)
STC CCR, @(d:24, ERd)
STC CCR, @–ERd
STC CCR, @aa:16
STC CCR, @aa:24
ANDC #xx:8, CCR
ORC #xx:8, CCR
XORC #xx:8, CCR
NOP
Operation
PC → @–SP
CCR → @–SP
<vector> → PC
CCR ← @SP+
PC ← @SP+
Transition to power-
down state
#xx:8 → CCR
Rs8 → CCR
@ERs → CCR
@(d:16, ERs) → CCR
@(d:24, ERs) → CCR
@ERs → CCR
ERs32+2 → ERs32
@aa:16 → CCR
@aa:24 → CCR
CCR → Rd8
CCR → @ERd
CCR → @(d:16, ERd)
CCR → @(d:24, ERd)
ERd32–2 → ERd32
CCR → @ERd
CCR → @aa:16
CCR → @aa:24
CCR∧#xx:8 → CCR
CCR⁄#xx:8 → CCR
CCR⊕#xx:8 → CCR
PC ← PC+2
—
—
—
B
B
W
W
W
W
W
W
B
W
W
W
W
W
W
B
B
B
—
2
2
2
2
2
2
4
4
6
10
6
10
4
4
6
8
6
8
2
2
1
—
—
—
—
—
—
—
—
—
10
2
2
2
6
8
12
8
8
10
2
6
8
12
8
8
10
2
2
2
2
Normal
Advanced
↔
↔
↔
↔
↔
↔
↔↔↔↔↔↔↔↔↔↔↔
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
↔↔↔↔↔↔↔↔↔↔↔
↔↔↔↔↔↔↔↔↔↔↔
↔↔↔↔↔↔↔↔↔↔↔
↔↔↔↔↔↔↔↔↔↔↔
↔↔↔↔↔↔↔↔↔↔↔
14 16
TRAPA
RTE
SLEEP
LDC
STC
ANDC
ORC
XORC
NOP
Appendix
Rev. 3.00 Sep. 14, 2006 Page 363 of 408
REJ09B0105-0300
• Block transfer instructions
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes) No. of
States
*1
Condition Code
IHNZVC
#xx
Rn
@ERn
@(d, ERn)
@–ERn/@ERn+
@aa
@(d, PC)
@@aa
—
EEPMOV. B
EEPMOV. W
Operation
if R4L ≠ 0 then
repeat @R5 → @R6
R5+1 → R5
R6+1 → R6
R4L–1 → R4L
until R4L=0
else next
if R4 ≠ 0 then
repeat @R5 → @R6
R5+1 → R5
R6+1 → R6
R4–1 → R4
until R4=0
else next
—
—
4
4
—
—
8+
4n
*2
Normal
Advanced
—
—
—
—
—
—
—
—
—
—8+
4n
*2
EEPMOV
Notes: 1. The number of states in cases where the instruction code and its operands are located
in on-chip memory is shown here. For other cases see appendix A.3, Number of
Execution States.
2. n is the value set in register R4L or R4.
(1) Set to 1 when a carry or borrow occurs at bit 11; otherwise cleared to 0.
(2) Set to 1 when a carry or borrow occurs at bit 27; otherwise cleared to 0.
(3) Retains its previous value when the result is zero; otherwise cleared to 0.
(4) Set to 1 when the adjustment produces a carry; otherwise retains its previous value.
(5) The number of states required for execution of an instruction that transfers data in
synchronization with the E clock is variable.
(6) Set to 1 when the divisor is negative; otherwise cleared to 0.
(7) Set to 1 when the divisor is zero; otherwise cleared to 0.
(8) Set to 1 when the quotient is negative; otherwise cleared to 0.
Appendix
Rev. 3.00 Sep. 14, 2006 Page 364 of 408
REJ09B0105-0300
A.2 Operation Code Map
Table A.2 Operation Code Map (1)
AH
AL 0123456789ABCDEF
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
F
NOP
BRA
MULXU
BSET
BRN
DIVXU
BNOT
STC
BHI
MULXU
BCLR
LDC
BLS
DIVXU
BTST
ORC
OR.B
BCC
RTS
OR
XORC
XOR.B
BCS
BSR
XOR
BOR
BIOR
BXOR
BIXOR
BAND
BIAND
ANDC
AND.B
BNE
RTE
AND
LDC
BEQ
TRAPA
BLD
BILD
BST
BIST
BVC
MOV
BPL
JMP
BMI
EEPMOV
ADDX
SUBX
BGT
JSR
BLE
MOV
ADD
ADDX
CMP
SUBX
OR
XOR
AND
MOV
Instruction when most significant bit of BH is 0.
Instruction when most significant bit of BH is 1.
Instruction code:
Table A-2
(2)
Table A-2
(2)
Table A-2
(2)
Table A-2
(2)
Table A-2
(2)
BVS BLTBGE
BSR
Table A-2
(2)
Table A-2
(2)
Table A-2
(2)
Table A-2
(2)
Table A-2
(2)
Table A-2
(2)
Table A-2
(2)
Table A-2
(2)
Table A-2
(2)
Table A-2
(2)
Table A-2
(3)
1st byte 2nd byte
AH BHAL BL
ADD
SUB
MOV
CMP
MOV.B
Appendix
Rev. 3.00 Sep. 14, 2006 Page 365 of 408
REJ09B0105-0300
Table A.2 Operation Code Map (2)
AH AL
BH 0123456789ABCDEF
01
0A
0B
0F
10
11
12
13
17
1A
1B
1F
58
79
7A
MOV
INC
ADDS
DAA
DEC
SUBS
DAS
BRA
MOV
MOV
BHI
CMP
CMP
LDC/STC
BCC
OR
OR
BPL BGT
Instruction code:
BVS
SLEEP
BVC BGE
Table A-2
(3)
Table A-2
(3)
Table A-2
(3)
ADD
MOV
SUB
CMP
BNE
AND
AND
INC
EXTU
DEC
BEQ
INC
EXTU
DEC
BCS
XOR
XOR
SHLL
SHLR
ROTXL
ROTXR
NOT
BLS
SUB
SUB
BRN
ADD
ADD
INC
EXTS
DEC
BLT
INC
EXTS
DEC
BLE
SHAL
SHAR
ROTL
ROTR
NEG
BMI
1st byte 2nd byte
AH BHAL BL
SUB
ADDS
SHLL
SHLR
ROTXL
ROTXR
NOT
SHAL
SHAR
ROTL
ROTR
NEG
Appendix
Rev. 3.00 Sep. 14, 2006 Page 366 of 408
REJ09B0105-0300
Table A.2 Operation Code Map (3)
AH
ALBH
BLCH
CL
0123456789ABCDEF
01406
01C05
01D05
01F06
7Cr06
7Cr07
7Dr06
7Dr07
7Eaa6
7Eaa7
7Faa6
7Faa7
MULXS
BSET
BSET
BSET
BSET
DIVXS
BNOT
BNOT
BNOT
BNOT
MULXS
BCLR
BCLR
BCLR
BCLR
DIVXS
BTST
BTST
BTST
BTST
OR XOR
BOR
BIOR
BXOR
BIXOR
BAND
BIAND
AND
BLD
BILD
BST
BIST
Instruction when most significant bit of DH is 0.
Instruction when most significant bit of DH is 1.
Instruction code:
*
*
*
*
*
*
*
*
1
1
1
1
2
2
2
2
BOR
BIOR
BXOR
BIXOR
BAND
BIAND
BLD
BILD
BST
BIST
Notes: 1.
2.
r is the register designation field.
aa is the absolute address field.
1st byte 2nd byte
AH BHAL BL
3rd byte
CH DHCL DL
4th byte
LDC
STC
LDC LDC LDC
STC STC STC
Appendix
Rev. 3.00 Sep. 14, 2006 Page 367 of 408
REJ09B0105-0300
A.3 Number of Execution States
The status of execution for each instruction of the H8/300H CPU and the method of calculating
the number of states required for instruction execution are shown below. Table A.4 shows the
number of cycles of each type occurring in each instruction, such as instruction fetch and data
read/write. Table A.3 shows the number of states required for each cycle. The total number of
states required for execution of an instruction can be calculated by the following expression:
Execution states = I × SI + J × SJ + K × SK + L × SL + M × SM + N × SN
Examples: When instruction is fetched from on-chip ROM, and an on-chip RAM is accessed.
BSET #0, @FF00
From table A.4:
I = L = 2, J = K = M = N= 0
From table A.3:
SI = 2, SL = 2
Number of states required for execution = 2 × 2 + 2 × 2 = 8
When instruction is fetched from on-chip ROM, branch address is read from on-chip ROM, and
on-chip RAM is used for stack area.
JSR @@ 30
From table A.4:
I = 2, J = K = 1, L = M = N = 0
From table A.3:
SI = SJ = SK = 2
Number of states required for execution = 2 × 2 + 1 × 2+ 1 × 2 = 8
Appendix
Rev. 3.00 Sep. 14, 2006 Page 368 of 408
REJ09B0105-0300
Table A.3 Number of Cycles in Each Instruction
Execution Status Access Location
(Instruction Cycle) On-Chip Memory On-Chip Peripheral Module
Instruction fetch SI 2 —
Branch address read SJ
Stack operation SK
Byte data access SL 2 or 3*
Word data access SM 2 or 3*
Internal operation SN 1
Note: * Depends on which on-chip peripheral module is accessed. See section 19.1, Register
Addresses (Address Order).
Appendix
Rev. 3.00 Sep. 14, 2006 Page 369 of 408
REJ09B0105-0300
Table A.4 Number of Cycles in Each Instruction
Instruction
Mnemonic
Instruction
Fetch
I
Branch
Addr. Read
J
Stack
Operation
K
Byte Data
Access
L
Word Data
Access
M
Internal
Operation
N
ADD ADD.B #xx:8, Rd
ADD.B Rs, Rd
ADD.W #xx:16, Rd
ADD.W Rs, Rd
ADD.L #xx:32, ERd
ADD.L ERs, ERd
1
1
2
1
3
1
ADDS ADDS #1/2/4, ERd 1
ADDX ADDX #xx:8, Rd
ADDX Rs, Rd
1
1
AND AND.B #xx:8, Rd
AND.B Rs, Rd
AND.W #xx:16, Rd
AND.W Rs, Rd
AND.L #xx:32, ERd
AND.L ERs, ERd
1
1
2
1
3
2
ANDC ANDC #xx:8, CCR 1
BAND BAND #xx:3, Rd
BAND #xx:3, @ERd
BAND #xx:3, @aa:8
1
2
2
1
1
Bcc BRA d:8 (BT d:8)
BRN d:8 (BF d:8)
BHI d:8
BLS d:8
BCC d:8 (BHS d:8)
BCS d:8 (BLO d:8)
BNE d:8
BEQ d:8
BVC d:8
BVS d:8
BPL d:8
BMI d:8
BGE d:8
2
2
2
2
2
2
2
2
2
2
2
2
2
Appendix
Rev. 3.00 Sep. 14, 2006 Page 370 of 408
REJ09B0105-0300
Instruction
Mnemonic
Instruction
Fetch
I
Branch
Addr. Read
J
Stack
Operation
K
Byte Data
Access
L
Word Data
Access
M
Internal
Operation
N
Bcc
BLT d:8
BGT d:8
BLE d:8
BRA d:16(BT d:16)
BRN d:16(BF d:16)
BHI d:16
BLS d:16
BCC d:16(BHS d:16)
BCS d:16(BLO d:16)
BNE d:16
BEQ d:16
BVC d:16
BVS d:16
BPL d:16
BMI d:16
BGE d:16
BLT d:16
BGT d:16
BLE d:16
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
BCLR BCLR #xx:3, Rd
BCLR #xx:3, @ERd
BCLR #xx:3, @aa:8
BCLR Rn, Rd
BCLR Rn, @ERd
BCLR Rn, @aa:8
1
2
2
1
2
2
2
2
2
2
BIAND BIAND #xx:3, Rd
BIAND #xx:3, @ERd
BIAND #xx:3, @aa:8
1
2
2
1
1
BILD BILD #xx:3, Rd
BILD #xx:3, @ERd
BILD #xx:3, @aa:8
1
2
2
1
1
Appendix
Rev. 3.00 Sep. 14, 2006 Page 371 of 408
REJ09B0105-0300
Instruction
Mnemonic
Instruction
Fetch
I
Branch
Addr. Read
J
Stack
Operation
K
Byte Data
Access
L
Word Data
Access
M
Internal
Operation
N
BIOR BIOR #xx:8, Rd
BIOR #xx:8, @ERd
BIOR #xx:8, @aa:8
1
2
2
1
1
BIST BIST #xx:3, Rd
BIST #xx:3, @ERd
BIST #xx:3, @aa:8
1
2
2
2
2
BIXOR BIXOR #xx:3, Rd
BIXOR #xx:3, @ERd
BIXOR #xx:3, @aa:8
1
2
2
1
1
BLD BLD #xx:3, Rd
BLD #xx:3, @ERd
BLD #xx:3, @aa:8
1
2
2
1
1
BNOT BNOT #xx:3, Rd
BNOT #xx:3, @ERd
BNOT #xx:3, @aa:8
BNOT Rn, Rd
BNOT Rn, @ERd
BNOT Rn, @aa:8
1
2
2
1
2
2
2
2
2
2
BOR BOR #xx:3, Rd
BOR #xx:3, @ERd
BOR #xx:3, @aa:8
1
2
2
1
1
BSET BSET #xx:3, Rd
BSET #xx:3, @ERd
BSET #xx:3, @aa:8
BSET Rn, Rd
BSET Rn, @ERd
BSET Rn, @aa:8
1
2
2
1
2
2
2
2
2
2
BSR BSR d:8
BSR d:16
2
2
1
1
2
BST BST #xx:3, Rd
BST #xx:3, @ERd
BST #xx:3, @aa:8
1
2
2
2
2
Appendix
Rev. 3.00 Sep. 14, 2006 Page 372 of 408
REJ09B0105-0300
Instruction
Mnemonic
Instruction
Fetch
I
Branch
Addr. Read
J
Stack
Operation
K
Byte Data
Access
L
Word Data
Access
M
Internal
Operation
N
BTST BTST #xx:3, Rd
BTST #xx:3, @ERd
BTST #xx:3, @aa:8
BTST Rn, Rd
BTST Rn, @ERd
BTST Rn, @aa:8
1
2
2
1
2
2
1
1
1
1
BXOR BXOR #xx:3, Rd
BXOR #xx:3, @ERd
BXOR #xx:3, @aa:8
1
2
2
1
1
CMP CMP.B #xx:8, Rd
CMP.B Rs, Rd
CMP.W #xx:16, Rd
CMP.W Rs, Rd
CMP.L #xx:32, ERd
CMP.L ERs, ERd
1
1
2
1
3
1
DAA DAA Rd 1
DAS DAS Rd 1
DEC DEC.B Rd
DEC.W #1/2, Rd
DEC.L #1/2, ERd
1
1
1
DUVXS DIVXS.B Rs, Rd
DIVXS.W Rs, ERd
2
2
12
20
DIVXU DIVXU.B Rs, Rd
DIVXU.W Rs, ERd
1
1
12
20
EEPMOV EEPMOV.B
EEPMOV.W
2
2
2n+2*1
2n+2*1
EXTS EXTS.W Rd
EXTS.L ERd
1
1
EXTU EXTU.W Rd
EXTU.L ERd
1
1
Appendix
Rev. 3.00 Sep. 14, 2006 Page 373 of 408
REJ09B0105-0300
Instruction
Mnemonic
Instruction
Fetch
I
Branch
Addr. Read
J
Stack
Operation
K
Byte Data
Access
L
Word Data
Access
M
Internal
Operation
N
INC INC.B Rd
INC.W #1/2, Rd
INC.L #1/2, ERd
1
1
1
JMP JMP @ERn
JMP @aa:24
JMP @@aa:8
2
2
2
1
2
2
JSR JSR @ERn
JSR @aa:24
JSR @@aa:8
2
2
2
1
1
1
1
2
LDC LDC #xx:8, CCR
LDC Rs, CCR
LDC@ERs, CCR
LDC@(d:16, ERs), CCR
LDC@(d:24,ERs), CCR
LDC@ERs+, CCR
LDC@aa:16, CCR
LDC@aa:24, CCR
1
1
2
3
5
2
3
4
1
1
1
1
1
1
2
MOV MOV.B #xx:8, Rd
MOV.B Rs, Rd
MOV.B @ERs, Rd
MOV.B @(d:16, ERs), Rd
MOV.B @(d:24, ERs), Rd
MOV.B @ERs+, Rd
MOV.B @aa:8, Rd
MOV.B @aa:16, Rd
MOV.B @aa:24, Rd
MOV.B Rs, @Erd
MOV.B Rs, @(d:16, ERd)
MOV.B Rs, @(d:24, ERd)
MOV.B Rs, @-ERd
MOV.B Rs, @aa:8
1
1
1
2
4
1
1
2
3
1
2
4
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
2
Appendix
Rev. 3.00 Sep. 14, 2006 Page 374 of 408
REJ09B0105-0300
Instruction
Mnemonic
Instruction
Fetch
I
Branch
Addr. Read
J
Stack
Operation
K
Byte Data
Access
L
Word Data
Access
M
Internal
Operation
N
MOV MOV.B Rs, @aa:16
MOV.B Rs, @aa:24
MOV.W #xx:16, Rd
MOV.W Rs, Rd
MOV.W @ERs, Rd
MOV.W @(d:16,ERs), Rd
MOV.W @(d:24,ERs), Rd
MOV.W @ERs+, Rd
MOV.W @aa:16, Rd
MOV.W @aa:24, Rd
MOV.W Rs, @ERd
MOV.W Rs, @(d:16,ERd)
MOV.W Rs, @(d:24,ERd)
2
3
2
1
1
2
4
1
2
3
1
2
4
1
1
1
1
1
1
1
1
1
1
1
2
MOV
MOV.W Rs, @-ERd
MOV.W Rs, @aa:16
MOV.W Rs, @aa:24
MOV.L #xx:32, ERd
MOV.L ERs, ERd
MOV.L @ERs, ERd
MOV.L @(d:16,ERs), ERd
MOV.L @(d:24,ERs), ERd
MOV.L @ERs+, ERd
MOV.L @aa:16, ERd
MOV.L @aa:24, ERd
MOV.L ERs,@ERd
MOV.L ERs, @(d:16,ERd)
MOV.L ERs, @(d:24,ERd)
MOV.L ERs, @-ERd
MOV.L ERs, @aa:16
MOV.L ERs, @aa:24
1
2
3
3
1
2
3
5
2
3
4
2
3
5
2
3
4
1
1
1
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
MOVFPE MOVFPE @aa:16, Rd*2 2 1
MOVTPE MOVTPE Rs,@aa:16*2 2 1
Appendix
Rev. 3.00 Sep. 14, 2006 Page 375 of 408
REJ09B0105-0300
Instruction
Mnemonic
Instruction
Fetch
I
Branch
Addr. Read
J
Stack
Operation
K
Byte Data
Access
L
Word Data
Access
M
Internal
Operation
N
MULXS MULXS.B Rs, Rd
MULXS.W Rs, ERd
2
2
12
20
MULXU MULXU.B Rs, Rd
MULXU.W Rs, ERd
1
1
12
20
NEG NEG.B Rd
NEG.W Rd
NEG.L ERd
1
1
1
NOP NOP 1
NOT NOT.B Rd
NOT.W Rd
NOT.L ERd
1
1
1
OR OR.B #xx:8, Rd
OR.B Rs, Rd
OR.W #xx:16, Rd
OR.W Rs, Rd
OR.L #xx:32, ERd
OR.L ERs, ERd
1
1
2
1
3
2
ORC ORC #xx:8, CCR 1
POP POP.W Rn
POP.L ERn
1
2
1
2
2
2
PUSH PUSH.W Rn
PUSH.L ERn
1
2
1
2
2
2
ROTL ROTL.B Rd
ROTL.W Rd
ROTL.L ERd
1
1
1
ROTR ROTR.B Rd
ROTR.W Rd
ROTR.L ERd
1
1
1
ROTXL ROTXL.B Rd
ROTXL.W Rd
ROTXL.L ERd
1
1
1
Appendix
Rev. 3.00 Sep. 14, 2006 Page 376 of 408
REJ09B0105-0300
Instruction
Mnemonic
Instruction
Fetch
I
Branch
Addr. Read
J
Stack
Operation
K
Byte Data
Access
L
Word Data
Access
M
Internal
Operation
N
ROTXR ROTXR.B Rd
ROTXR.W Rd
ROTXR.L ERd
1
1
1
RTE RTE 2 2 2
RTS RTS 2 1 2
SHAL SHAL.B Rd
SHAL.W Rd
SHAL.L ERd
1
1
1
SHAR SHAR.B Rd
SHAR.W Rd
SHAR.L ERd
1
1
1
SHLL SHLL.B Rd
SHLL.W Rd
SHLL.L ERd
1
1
1
SHLR SHLR.B Rd
SHLR.W Rd
SHLR.L ERd
1
1
1
SLEEP SLEEP 1
STC STC CCR, Rd
STC CCR, @ERd
STC CCR, @(d:16,ERd)
STC CCR, @(d:24,ERd)
STC CCR,@-ERd
STC CCR, @aa:16
STC CCR, @aa:24
1
2
3
5
2
3
4
1
1
1
1
1
1
2
SUB SUB.B Rs, Rd
SUB.W #xx:16, Rd
SUB.W Rs, Rd
SUB.L #xx:32, ERd
SUB.L ERs, ERd
1
2
1
3
1
SUBS SUBS #1/2/4, ERd 1
Appendix
Rev. 3.00 Sep. 14, 2006 Page 377 of 408
REJ09B0105-0300
Instruction
Mnemonic
Instruction
Fetch
I
Branch
Addr. Read
J
Stack
Operation
K
Byte Data
Access
L
Word Data
Access
M
Internal
Operation
N
SUBX SUBX #xx:8, Rd
SUBX. Rs, Rd
1
1
TRAPA TRAPA #xx:2 2 1 2 4
XOR XOR.B #xx:8, Rd
XOR.B Rs, Rd
XOR.W #xx:16, Rd
XOR.W Rs, Rd
XOR.L #xx:32, ERd
XOR.L ERs, ERd
1
1
2
1
3
2
XORC XORC #xx:8, CCR 1
Notes: 1. n: Specified value in R4L and R4. The source and destination operands are accessed
n+1 times respectively.
2. Cannot be used in this LSI.
Appendix
Rev. 3.00 Sep. 14, 2006 Page 378 of 408
REJ09B0105-0300
A.4 Combinations of Instructions and Addressing Modes
Table A.5 Combinations of Instructions and Addressing Modes
Addressing Mode
MOV
POP, PUSH
MOVFPE,
MOVTPE
ADD, CMP
SUB
ADDX, SUBX
ADDS, SUBS
INC, DEC
DAA, DAS
MULXU,
MULXS,
DIVXU,
DIVXS
NEG
EXTU, EXTS
AND, OR, XOR
NOT
BCC, BSR
JMP, JSR
RTS
TRAPA
RTE
SLEEP
LDC
STC
ANDC, ORC,
XORC
NOP
Data
transfer
instructions
Arithmetic
operations
Logical
operations
Shift operations
Bit manipulations
Branching
instructions
System
control
instructions
Block data transfer instructions
BWL
—
—
BWL
WL
B
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
B
—
B
—
—
#xx
Rn
@ERn
@(d:16.ERn)
@(d:24.ERn)
@ERn+/@ERn
@aa:8
@aa:16
@aa:24
@(d:8.PC)
@(d:16.PC)
@@aa:8
—
BWL
—
—
BWL
BWL
B
L
BWL
B
BW
BWL
WL
BWL
BWL
BWL
B
—
—
—
—
—
—
B
B
—
—
—
BWL
—
—
—
—
—
—
—
—
—
—
—
—
—
—
B
—
—
—
—
—
W
W
—
—
—
BWL
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
W
W
—
—
—
BWL
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
W
W
—
—
—
BWL
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
W
W
—
—
—
B
—
—
—
—
—
—
—
—
—
—
—
—
—
—
B
—
—
—
—
—
—
—
—
—
—
—
BWL
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
W
W
—
—
—
BWL
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
W
W
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
WL
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
BW
Functions Instructions
Appendix
Rev. 3.00 Sep. 14, 2006 Page 379 of 408
REJ09B0105-0300
Appendix B I/O Port Block Diagrams
B.1 I/O Port Block Diagrams
RES goes low in a reset, and SBY goes low in a reset and in standby mode.
PDR
PUCR
PMR
PCR
SBYRES
PUCR: Port pull-up control register
PMR: Port mode register
PDR: Port data register
PCR: Port control register
IRQ
TRGV
Internal data bus
Pull-up MOS
[Legend]
Figure B.1 Port 1 Block Diagram (P17)
Appendix
Rev. 3.00 Sep. 14, 2006 Page 380 of 408
REJ09B0105-0300
PDR
PUCR
PMR
PCR
SBYRES
PUCR: Port pull-up control register
PMR: Port mode register
PDR: Port data register
PCR: Port control register
IRQ
Internal data bus
Pull-up MOS
[Legend]
Figure B.2 Port 1 Block Diagram (P14)
Appendix
Rev. 3.00 Sep. 14, 2006 Page 381 of 408
REJ09B0105-0300
PDR
PMR
PCR
SBY
PMR: Port mode register
PDR: Port data register
PCR: Port control register
Internal data bus
TXD
SCI3
[Legend]
Figure B.3 Port 2 Block Diagram (P22)
Appendix
Rev. 3.00 Sep. 14, 2006 Page 382 of 408
REJ09B0105-0300
PDR
PCR
SBY
PDR: Port data register
PCR: Port control register
RE
Internal data bus
RXD
SCI3
[Legend]
Figure B.4 Port 2 Block Diagram (P21)
Appendix
Rev. 3.00 Sep. 14, 2006 Page 383 of 408
REJ09B0105-0300
PDR
PCR
SBY
PDR: Port data register
PCR: Port control register
SCKIE
Internal data bus
SCKI
SCI3
SCKOE
SCKO
[Legend]
Figure B.5 Port 2 Block Diagram (P20)
Appendix
Rev. 3.00 Sep. 14, 2006 Page 384 of 408
REJ09B0105-0300
PDR
PCR
SBY
ICE
SDAO/SCLO
SDAI/SCLI
IIC2
PDR:
PCR:
[Legend]
Portdata register
Portcontrol register
Internal data bus
Figure B.6 (1) Port 5 Block Diagram (P57, P56) (for H8/36912 Group)
Appendix
Rev. 3.00 Sep. 14, 2006 Page 385 of 408
REJ09B0105-0300
PDR
PCR
SBY
PDR:
PCR:
Portdata register
Portcontrol register
Internal data bus
[Legend]
Figure B.6 (2) Port 5 Block Diagram (P57, P56) (for H8/36902 Group)
Appendix
Rev. 3.00 Sep. 14, 2006 Page 386 of 408
REJ09B0105-0300
PDR
PUCR
PMR
PCR
SBYRES
PUCR: Port pull-up control register
PMR: Port mode register
PDR: Port data register
PCR: Port control register
WKP
Internal data bus
ADTRG
Pull-up MOS
[Legend]
Figure B.7 Port 5 Block Diagram (P55)
Appendix
Rev. 3.00 Sep. 14, 2006 Page 387 of 408
REJ09B0105-0300
PDR
PCR
SBY
OS3
OS2
OS1
OS0
TMOV
Internal data bus
Timer V
PDR:
PCR:
Portdata register
Portcontrol register
[Legend]
Figure B.8 Port 5 Block Diagram (P76)
Appendix
Rev. 3.00 Sep. 14, 2006 Page 388 of 408
REJ09B0105-0300
PDR
PCR
SBY
TMCIV
Internal data bus
Timer V
PDR:
PCR:
Portdata register
Portcontrol register
[Legend]
Figure B.9 Port 7 Block Diagram (P75)
Appendix
Rev. 3.00 Sep. 14, 2006 Page 389 of 408
REJ09B0105-0300
PDR
PCR
SBY
TMRIV
Internal data bus
Timer V
PDR:
PCR:
Portdata register
Portcontrol register
[Legend]
Figure B.10 Port 7 Block Diagram (P74)
Appendix
Rev. 3.00 Sep. 14, 2006 Page 390 of 408
REJ09B0105-0300
PDR
PCR
SBY
Internal data bus
FTIOA to D
Timer W
Output
control signal
A to D
PDR:
PCR:
Portdata register
Portcontrol register
[Legend]
Figure B.11 Port 8 Block Diagram (P84 to P81)
Appendix
Rev. 3.00 Sep. 14, 2006 Page 391 of 408
REJ09B0105-0300
PDR
PCR
SBY
FTCI
Internal data bus
Timer W
PDR:
PCR:
Portdata register
Portcontrol register
[Legend]
Figure B.12 Port 8 Block Diagram (P80)
Appendix
Rev. 3.00 Sep. 14, 2006 Page 392 of 408
REJ09B0105-0300
DEC
VIN
SCAN
CH3 to CH0
A/D converter
ExtD, ExtU
VDDII
Low voltage
detection circuit
Internal data bus
PDR:
PCR:
Portdata register
Portcontrol register
[Legend]
Figure B.13 Port B Block Diagram (PB3, PB2)
DEC
SCAN
CH3 to CH0
VIN
A/D converter
Internal data bus
Figure B.14 Port B Block Diagram (PB1, PB0)
Appendix
Rev. 3.00 Sep. 14, 2006 Page 393 of 408
REJ09B0105-0300
PDR
PCR
SBY
Internal data bus
PMRC1
PMRC0
XTALI
CPG
φ
PDR:
PCR:
Portdata register
Portcontrol register
[Legend]
Figure B.15 Port C Block Diagram (PC1)
Appendix
Rev. 3.00 Sep. 14, 2006 Page 394 of 408
REJ09B0105-0300
PDR
PCR
SBY
Internal data bus
PMRC0
EXTALI
CPG
PDR:
PCR:
Portdata register
Portcontrol register
[Legend]
Figure B.16 Port C Block Diagram (PC0)
B.2 Port States in Each Operating State
Port Reset Active Sleep Subsleep Standby
P17, P14 High impedance Functioning Retained Retained High impedance*
P22 to P20 High impedance Functioning Retained Retained High impedance
P57 to P55 High impedance Functioning Retained Retained High impedance*
P76 to P74 High impedance Functioning Retained Retained High impedance
P84 to P80 High impedance Functioning Retained Retained High impedance
PB3 to PB0 High impedance High
impedance
High
impedance
Retained High impedance
PC1, PC0 High impedance Functioning Retained Retained High impedance
Note: * High level output when the pull-up MOS is in on state.
Appendix
Rev. 3.00 Sep. 14, 2006 Page 395 of 408
REJ09B0105-0300
Appendix C Product Code Lineup
Product Type Product Code Model Marking Package Code
HD64F36912GFH LQFP-32 (FP-32A)
HD64F36912GTP SOP-32 (FP-32D)
Flash memory
version
HD64F36912G
HD64F36912GP SDIP-32 (32P4B)
HD64336912G (***) FH LQFP-32 (FP-32A)
H8/36912
Masked ROM
version
HD64336912G
HD64336912G (***) TP SOP-32 (FP-32D)
HD64336911G (***) FH LQFP-32 (FP-32A) H8/36911 Masked ROM
version
HD64336911G
HD64336911G (***) TP SOP-32 (FP-32D)
HD64F36902GFH LQFP-32 (FP-32A)
HD64F36902GTP SOP-32 (FP-32D)
Flash memory
version
HD64F36902G
HD64F36902GP SDIP-32 (32P4B)
HD64336902G (***) FH LQFP-32 (FP-32A)
H8/36902
Masked ROM
version
HD64336902G
HD64336902G (***) TP SOP-32 (FP-32D)
HD64336901G (***) FH LQFP-32 (FP-32A) H8/36901 Masked ROM
version
HD64336901G
HD64336901G (***) TP SOP-32 (FP-32D)
HD64336900G (***) FH LQFP-32 (FP-32A) H8/36900 Masked ROM
version
HD64336900G
HD64336900G (***) TP SOP-32 (FP-32D)
[Legend]
(***): ROM code
Appendix
Rev. 3.00 Sep. 14, 2006 Page 396 of 408
REJ09B0105-0300
Appendix D Package Dimensions
The package dimensions that are shows in the Renesas Semiconductor Packages Data Book have
priority.
Package Code
JEDEC
JEITA
Mass
(reference value)
FP-32D
Conforms
—
1.3 g
*Dimension including the plating thickness
Base material dimension
0.15
M
*
0.40 ± 0.08
20.45
1.00 Max
1.27
11.30
1.42
3.00 Max
*
0.22 ± 0.05
20.95 Max
32 17
116
0˚ – 8˚
0.80 ± 0.20
14.14 ± 0.30
0.10
0.38 ± 0.06
+ 0.12
– 0.10
0.15
0.20 ± 0.04
Unit: mm
Figure D.1 FP-32D Package Dimensions
Appendix
Rev. 3.00 Sep. 14, 2006 Page 397 of 408
REJ09B0105-0300
1 8
9
16
24 17
32
25
7
9.0 ± 0.2
0.10 ± 0. 07
0.17 ± 0. 05
0.15 ± 0. 04
*0.35 ± 0.05
0.5 ± 0.1
0.37 ± 0.05
0.20 M
0.70
0. 8
1. 0
0.10
1.40
1.70Max
*
0 ~ 10˚
Package Code
JEDEC
JEITA
Mass
(reference value)
FP-32A
FP-32AV
—
—
0.2 g
*Dimension including the plating thickness
Base material dimension
Unit: mm
Figure D.2 FP-32A Package Dimension
Appendix
Rev. 3.00 Sep. 14, 2006 Page 398 of 408
REJ09B0105-0300
116
17
32
E
e1 C
θ
AL
D
A1A2
b1
SEATING PLANE
bb2
e
A
A1
A2
b
b1
b2
c
D
E
e
e1
L
θ
−
0.51
−
0.35
0.9
0.63
0.22
27.8
8.75
−
−
3.0
0˚
−
−
3.8
0.45
1.0
0.73
0.27
28.0
8.9
1.778
10.16
−
−
5.08
−
−
0.55
1.3
1.03
0.34
28.2
9.05
−
−
−
15˚
Min
Symbol Dimension in Millmeters
Nom Max
Package Code
JEDEC
JEITA
Mass
(reference value)
32P4B
—
—
2.2
Unit: mm
Figure D.3 32P4B Package Dimension
Rev. 3.00 Sep. 14, 2006 Page 399 of 408
REJ09B0105-0300
Main Revisions and Additions in this Edition
Item Page Revision (See Manual for Details)
Preface When using an on-chip emulator (E7, E8) for H8/36912,
H8/36902 program development and debugging, the following
restrictions must be noted.
1. The NMI pin is reserved for the E7 or E8, and cannot be
used.
2. Area H'2000 to H'2FFF is used by the E7 or E8, and is not
available to the user.
3. Area H'F980 to H'FD7F must on no account be accessed.
4. When the E7 or E8 is used, address breaks can be set as
either available to the user or for use by the E7 or E8. If
address breaks are set as being used by the E7 or E8, the
address break control registers must not be accessed.
5. When the E7 or E8 is used, NMI is an input/output pin (open-
drain in output mode).
• On-chip memory
Product Classification Remarks
H8/36912 Under planning
H8/36911 Under planning
H8/36902 Under planning
H8/36901 Under planning
Masked ROM
version
H8/36900 Under planning
1
2
On-chip oscillator
Frequency accuracy: 8MHz ±1% (Typ.) Vcc = 5.0 V, Ta = 25˚C
(Flash memory version): 8MHz ±3% Vcc = 4.0 to 5.0 V, Ta = −20 to 75˚C
10MHz ±4% (Typ.) Vcc = 4.0 to 5.0 V, Ta = −20 to 75˚C
Package Code
LQFP-32 FP-32A
SOP-32 FP-32D
SDIP-32 32P4B
2
• Compact package
Package
LQFP-32
SOP-32
SDIP-32*
1.1 Features
2
Note: * Flash memory version only
Rev. 3.00 Sep. 14, 2006 Page 400 of 408
REJ09B0105-0300
Item Page Revision (See Manual for Details)
Figure 1.1 Internal Block
Diagram of H8/36912 Group
Figure 1.2 Internal Block
Diagram of H8/36902 Group
3, 4
PC0/OSC1
PC1/OSC2/CLKOUT
VCL
VSS
VCC
RES
TEST
NMI
AV
CC
E10T_0*
E10T_1*
E10T_2*
CPU
H8/300H
Data bus (lower)
Port C
PB3/AN3/ExtU
PB2/AN2/ExtD
PB1/AN1
PB0/AN0
Port B
On-chip
oscillator
(OSC1)
(OSC2)
System
clock
generator
Note: * Can also be used for the E7 or E8 emulator.
bus (upper)
Address bus
Figure 1.3 Pin Arrangement
of H8/36912 Group (FP-32A)
Figure 1.4 Pin Arrangement
of H8/36902 Group (FP-32A)
5, 6
28
29
30
31
32
P76/TMOV
PB3/AN3/ExtU
PB2/AN2/ExtD
PB1/AN1
PB0/AN0
E10T_2*
E10T_1*
E10T_0*
P17/IRQ3/TRGV
NMI
13
12
11
10
9
H8/36912 Group
(Top view)
V
CL
PC0/OSC1
PC1/OSC2/CLKOUT
Vss
TEST
RES
Vcc
AVcc
1
2
3
4
5
6
7
8
Note: * Can also be used for the E7 or E8 emulator.
Figure 1.5 Pin Arrangement
of H8/36912 Group (FP-32D,
32P4B),
Figure 1.6 Pin Arrangement
of H8/36902 Group (FP-32D,
32P4B)
7, 8
P57/SCL
E10T_2*
E10T_0*
E10T_1*
18
17
15
16
Note: * Can also be used for the E7 or E8 emulator.
Pin No.
Type Symbol FP-32D, 32P4B FP-32A Functions
E7, E8 E10T_0,
E10T_1,
E10T_2
15, 16, 17 11, 12,
13
Interface pins
for the E7 or E8
emulator
Table 1.1 Pin Functions 9, 10
Section 2 CPU 11 • High-speed operation
All frequently-used instructions execute in two or four states
Figure 2.1 Memory Map (1) 12
H8/36912F
H8/36902F
(Flash memory version)
Interrupt vector
Not used
E7 or E8 control
program area
(4 kbytes)
(E7 or E8 work area,
for flash memory
programming:
1 kbyte)
H'0000
H'0045
H'0046
H'1FFF
H'F980
H'2000
H'2FFF
H'0000
H'0045
H'0046
H'1FFF
H8/36912
H8/36902
(Masked ROM version
(under planning))
Interrupt vector
Not used
Not used
Rev. 3.00 Sep. 14, 2006 Page 401 of 408
REJ09B0105-0300
Item Page Revision (See Manual for Details)
Figure 2.1 Memory Map (2) 13
H8/36911
H8/36901
(Masked ROM version
(under planning))
Interrupt vector
H'0000
H'0045
H'0046
H8/36900
(Masked ROM version
(under planning))
Interrupt vector
H'0000
H'0045
H'0046
Relative Module Exception Sources
IIC2* IIC_2 transmit data empty
IIC_2 transmit end
IIC_2 receive error
Timer B1* Timer B1 overflow
Table 3.1 Exception Sources
and Vector Address
48
Note: * Available for the H8/36912 Group only.
Figure 5.1 Block Diagram of
Clock Pulse Generators
69
System
clock
oscillator
Duty
correction
circuit
OSC
1
OSC
2
φ
OSC
Clock
divider
On-chip
oscillator
R
OSC
R
OSC
R
OSC
/2
R
OSC
/4
Bit Bit Name
Description
1
0
RCPSC1
RCPSC0
Division Ratio Select for On-chip Oscillator
The division ratio of ROSC changes right after
rewriting this bit.
These bits can be written to only when the CKSTA
bit in CKCSR is 0.
0X: ROSC (not divided)
10: ROSC/2
11: ROSC /4
5.2.1 RC Control Register
(RCCR)
71
Bit Bit Name Description
4 TRMDRWE Trimming Date Register Write Enable
This register can be written to when the LOCKDW
bit is 0 and this bit is 1.
[Setting condition]
• When writing 0 to the WRI bit while writing 1 to
the TRMDRWE bit while the PRWE bit is 1
[Clearing conditions]
• Reset
• When writing 0 to the WRI bit and writing 0 to
the TRMDRWE bit while the PRWE bit is 1
5.2.2 RC Trimming Data
Protect Register
(RCTRMDPR)
73
Rev. 3.00 Sep. 14, 2006 Page 402 of 408
REJ09B0105-0300
Item Page Revision (See Manual for Details)
Bit Bit Name Description
7
6
5
4
3
2
1
0
TRMD7
TRMD6
TRMD5
TRMD4
TRMD3
TRMD2
TRMD1
TRMD0
Trimming Data
In the flash memory version, the trimming
data is loaded from the flash memory to this
register right after a reset. These bits are
always read as undefined value.
As for the masked ROM version (under
planning), the on-chip oscillator frequency
can be trimmed by rewriting these bits.
5.2.3 RC Trimming Data
Register (RCTRMDR)
73
Bit Bit Name Description
7
6
PMRC1
PMRC0
Port C Function Select 1 and 0
5.2.4 Clock Control/Status
Register (CKCSR)
74
Figure 5.5 Timing Chart of
Switching On-chip Oscillator
Clock to External Clock
78 Note: * The φ halt duration is the duration from the timing when the
φ clock stops to the first
rising edge of the φOSC clock after six clock cycles of the φRC
clock have elapsed.
Frequency (MHz) 12
R
S (Max.) 50 Ω
Table 5.1 Crystal Resonator
Parameters
82
Section 7 ROM 97 The features of the 12-kbyte (including 4 kbytes as the E7 or E8
control program area) flash memory built into the HD64F36912G
and HD64F36902G are summarized below.
Figure 7.1 Flash Memory
Block Configuration
98 ← Programming unit: 64 kbytes →
Host Bit Rate System Clock Frequency Rang e of LSI
9600bps 8 MHz (on-chip oscillator clock)
4800bps 8 MHz (on-chip oscillator clock)
2400bps 8 MHz (on-chip oscillator clock)
Table 7.3 System Clock
Frequencies for which
Automatic Adjustment of LSI
Bit Rate is Possible
105
Figure 7.4 Erase/Erase-
Verify Flowchart
111
Read verify data
Ye s
No
Increment address Verify data = all 1s ?
Section 8 RAM 115 Note: * When the E7 or E8 is used, area H'F980 to H'FD7F must
not be accessed.
Rev. 3.00 Sep. 14, 2006 Page 403 of 408
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Item Page Revision (See Manual for Details)
Bit Bit Name Description
4 TCSRWE Timer Control/Status Register WD Write Enable
The WDON and WRST bits can be written when
the TCSRWE bit is set to 1.
When writing data to this bit, the value for bit 5
must be 0.
13.2.1 Timer Control/Status
Register WD (TCSRWD)
192
14.8.2 Mark State and Break
Sending
236 Replaced
Bit Bit Name Description
3 STOP Stop Condition Detection Flag
[Setting conditions]
• In master mode, when a stop condition is
detected after frame transfer
• In slave mode, when a stop condition is
detected after the general call address or
the first byte slave address, next to
detection of start condition, accords with the
address set in SAR
……
15.3.5 I2C Bus Status
Register (ICSR)
251
Figure 15.15 Receive Mode
Operation Timing
265
Bit 7 Bit 0 Bit 1
SDA
(Input)
7812
Bit 6
SCL
MST
15.7 Usage Notes 272 Added
16.3.1 A/D Data Registers A
to D (ADDRA to ADDRD)
276 There are four 16-bit read-only ADDR registers; ……
Therefore, byte access to ADDR should be done by reading the
upper byte first then the lower one. ADDR is initialized to H'0000.
Figure 17.2 Block Diagram
of Power-On Reset Circuit
and Low-Voltage Detection
Circuit
287
RES
C
RES
20.3 Electrical
Characteristics (Masked
ROM Version)
331 20.3 Electrical Characteristics (Masked ROM Version) [Preliminary]
The guarantee value for the electrical characteristics of masked ROM
version is preliminary.
20.3.1 Power Supply Voltage and Operating Ranges
Rev. 3.00 Sep. 14, 2006 Page 404 of 408
REJ09B0105-0300
Item Page Revision (See Manual for Details)
Values
Item Symbol
Min. Typ. Max.
7.6 8.0 8.4
On-chip oscillator oscillation
frequency
fRC
9.4 10.0 10.6
Table 20.13 AC
Characteristics
339
Table A.1 Instruction Set
• Arithmetic instructions
353
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes) No. of
States
*1
Condition Code
IHNZVC
#xx
Rn
@ERn
@(d, ERn)
@–ERn/@ERn+
@aa
@(d, PC)
@@aa
—
ADD.B #xx:8, Rd
INC.L #2, ERd
DAA Rd
Operation
Rd8+#xx:8 → Rd8
ERd32+2 → ERd32
Rd8 decimal adjust
→ Rd8
B
L
B
2
2
2
—
—
—
—
*
2
2
2
Normal
Advanced
↔
↔
↔
↔↔
↔↔
↔↔
↔↔
*
ADD
DAA
Product Type Model Marking Package Code
HD64F36912GFH LQFP-32 (FP-32A)
HD64F36912GTP SOP-32 (FP-32D)
Flash memory
version
HD64F36912GP SDIP-32 (32P4B)
HD64336912G(***) FH LQFP-32 (FP-32A)
HD64336912G(***) TP SOP-32 (FP-32D)
H8/36912
Masked ROM
version
HD64336912G(***) P SDIP-32 (32P4B)
HD64336911G(***) FH LQFP-32 (FP-32A)
HD64336911G(***) TP SOP-32 (FP-32D)
H8/36911 Masked ROM
version
HD64336911G(***) P SDIP-32 (32P4B)
HD64F36902GFH LQFP-32 (FP-32A)
HD64F36902GTP SOP-32 (FP-32D)
Flash memory
version
HD64F36902GP SDIP-32 (32P4B)
HD64336902G(***) FH LQFP-32 (FP-32A)
HD64336902G(***) TP SOP-32 (FP-32D)
H8/36902
Masked ROM
version
HD64336902G(***) P SDIP-32 (32P4B)
HD64336901G(***) FH LQFP-32 (FP-32A)
HD64336901G(***) TP SOP-32 (FP-32D)
H8/36901 Masked ROM
version
HD64336901G(***) P SDIP-32 (32P4B)
HD64336900G(***) FH LQFP-32 (FP-32A)
HD64336900G(***) TP SOP-32 (FP-32D)
H8/36900 Masked ROM
version
HD64336900G(***) P SDIP-32 (32P4B)
Appendix C Product Code
Lineup
395
Package Code 32P4B
JEDEC —
JEITA —
Mass (reference value) 2.2
Figure D.3 32P4B Package
Dimension
398
Rev. 3.00 Sep. 14, 2006 Page 405 of 408
REJ09B0105-0300
Index
A
A/D converter ......................................... 273
A/D conversion time........................... 280
External trigger input.......................... 281
Sample-and-hold circuit...................... 280
Scan mode........................................... 279
Single mode ........................................ 279
Acknowledge.......................................... 255
Address break ........................................... 63
Addressing modes
Absolute address................................... 33
Immediate ............................................. 34
Memory indirect ................................... 34
Program-counter relative ...................... 34
Register direct....................................... 32
Register indirect.................................... 33
Register indirect with displacement...... 33
Register indirect with post-increment... 33
Register indirect with pre-decrement.... 33
B
Bit Synchronous Circuit ......................... 271
C
Clock pulse generators
System Prescaler S................................ 83
Clocked Synchronous Serial Format ...... 263
Condition field.......................................... 31
Condition-code register (CCR)................. 16
CPU .......................................................... 11
E
Effective address....................................... 35
Effective address extension ...................... 31
Exception handling ................................... 47
Reset exception handling ...................... 54
Stack status ...........................................58
Trap instruction..................................... 47
F
Flash memory ........................................... 97
Boot mode........................................... 102
Boot program ...................................... 102
Erase/erase-verify ............................... 109
Erasing units .........................................97
Error protection................................... 112
Hardware protection............................ 112
Program/program-verify ..................... 107
Programming units................................ 97
Programming/erasing in user program
mode....................................................106
Software protection............................. 112
G
General registers ....................................... 15
I
I/O ports .................................................. 117
I/O port block diagrams ...................... 379
I2C Bus Format ....................................... 254
I2C Bus Interface 2 (IIC2)....................... 239
Instruction set............................................21
Arithmetic operations instructions ........ 23
Bit Manipulation instructions................ 26
Block data transfer instructions............. 30
Branch instructions ............................... 28
Data Transfer instructions..................... 22
Logic Operations instructions ...............25
Rev. 3.00 Sep. 14, 2006 Page 406 of 408
REJ09B0105-0300
Shift Instructions .................................. 25
System control instructions................... 29
Internal power supply step-down
circuit...................................................... 299
Interrupt
Internal interrupts ................................. 56
Interrupt response time ......................... 59
IRQ3 to IRQ0 interrupts....................... 55
NMI interrupt........................................ 55
WKP5 to WKP0 interrupts ................... 55
L
Low-voltage detection circuit................. 285
LVDI .............................................. 293, 295
LVDI (interrupt by low voltage detect)
circuit.............................................. 293, 295
LVDR ..................................................... 292
LVDR (reset by low voltage detect)
circuit...................................................... 292
M
Memory map ............................................ 12
Module standby function .......................... 95
N
Noise Canceler........................................ 265
O
On-board programming modes............... 102
Operation field.......................................... 30
P
Package....................................................... 2
Package dimensions................................ 396
Power-down modes................................... 85
Sleep mode............................................ 93
Standby mode ....................................... 93
Subsleep mode ...................................... 94
Power-on reset ........................................ 285
Power-on reset circuit ............................. 291
Product code lineup ................................ 395
Program counter (PC) ............................... 16
PWM operation....................................... 176
R
Register
ABRKCR...................... 64, 304, 308, 310
ABRKSR ...................... 66, 304, 308, 310
ADCR ......................... 278, 303, 307, 310
ADCSR....................... 276, 303, 307, 310
ADDRA ...................... 275, 303, 307, 310
ADDRB ...................... 275, 303, 307, 310
ADDRC ...................... 275, 303, 307, 310
ADDRD ...................... 275, 303, 307, 310
BARH ........................... 66, 304, 308, 310
BARL............................ 66, 304, 308, 310
BDRH ........................... 66, 304, 308, 310
BDRL............................ 66, 304, 308, 310
BRR ............................ 206, 303, 307, 310
EBR1........................... 101, 303, 307, 309
FENR .......................... 101, 303, 307, 309
FLMCR1....................... 99, 303, 307, 309
FLMCR2..................... 100, 303, 307, 309
GRA............................ 171, 303, 306, 309
GRB ............................ 171, 303, 306, 309
GRC ............................ 171, 303, 307, 309
GRD............................ 171, 303, 307, 309
ICCR1 ......................... 242, 302, 306, 309
ICCR2 ......................... 245, 302, 306, 309
ICDRR ........................ 253, 302, 306, 309
ICDRS................................................. 253
ICDRT ........................ 253, 302, 306, 309
ICIER.......................... 248, 302, 306, 309
Rev. 3.00 Sep. 14, 2006 Page 407 of 408
REJ09B0105-0300
ICMR.......................... 246, 302, 306, 309
ICSR ........................... 250, 302, 306, 309
IEGR1........................... 49, 304, 308, 311
IEGR2........................... 50, 304, 308, 311
IENR1........................... 50, 304, 308, 311
IRR1 ............................. 52, 305, 308, 311
IWPR ............................ 53, 305, 308, 311
LVDCR....................... 288, 302, 306, 309
LVDSR ....................... 290, 302, 306, 309
MSTCR1....................... 89, 305, 308, 311
MSTCR2....................... 90, 305, 308, 311
PCR1........................... 119, 304, 308, 311
PCR2........................... 122, 304, 308, 311
PCR5........................... 125, 304, 308, 311
PCR7........................... 128, 304, 308, 311
PCR8........................... 131, 304, 308, 311
PDR1 .......................... 119, 304, 308, 310
PDR2 .......................... 122, 304, 308, 310
PDR5 .......................... 126, 304, 308, 310
PDR7 .......................... 129, 304, 308, 310
PDR8 .......................... 131, 304, 308, 310
PDRB.......................... 134, 304, 308, 310
PMR1.......................... 118, 304, 308, 311
PMR5.......................... 125, 304, 308, 311
PUCR1........................ 120, 304, 308, 310
PUCR5........................ 126, 304, 308, 310
RDR............................ 200, 303, 307, 310
RSR..................................................... 200
SAR ............................ 252, 302, 306, 309
SCR3........................... 202, 303, 307, 310
SMR............................ 201, 303, 307, 310
SPMR ......................... 211, 303, 307, 310
SSR............................. 204, 303, 307, 310
SYSCR1 ....................... 86, 304, 308, 311
SYSCR2 ....................... 88, 304, 308, 311
TCB1 .......................... 141, 302, 306, 309
TCNT.................................. 171, 306, 309
TCNTV....................... 147, 303, 307, 310
TCORA....................... 148, 303, 307, 310
TCORB ....................... 148, 303, 307, 310
TCRV0........................ 148, 303, 307, 309
TCRV1........................ 151, 303, 307, 310
TCRW......................... 164, 302, 306, 309
TCSRV........................ 150, 303, 307, 310
TCSRWD.................... 192, 303, 307, 310
TCWD......................... 194, 304, 307, 310
TDR ............................ 200, 303, 307, 310
TIERW........................ 165, 302, 306, 309
TIOR0 ......................... 168, 303, 306, 309
TIOR1 ......................... 169, 303, 306, 309
TLB1................................................... 141
TMB1.......................... 140, 302, 306, 309
TMRW........................ 163, 302, 306, 309
TMWD........................ 194, 304, 307, 310
TSR ..................................................... 200
TSRW ......................... 166, 302, 306, 309
Register field.............................................30
S
Serial communication interface 3
(SCI3) .....................................................197
Asynchronous mode............................ 212
Bit rate................................................. 206
Break................................................... 236
Clocked synchronous mode ................ 219
Framing error ...................................... 216
Multiprocessor communication
function ............................................... 227
Overrun error ...................................... 216
Parity error .......................................... 216
Slave address........................................... 255
Stack pointer (SP) ..................................... 16
Start condition......................................... 255
Stop condition ......................................... 255
System clocks ........................................... 69
Rev. 3.00 Sep. 14, 2006 Page 408 of 408
REJ09B0105-0300
T
Timer B1................................................. 139
Auto-reload timer operation ............... 142
Interval timer operation ...................... 142
Timer V .................................................. 145
Timer W ................................................. 159
Transfer Rate .......................................... 244
V
Vector address........................................... 47
W
Watchdog timer....................................... 191
Renesas 16-Bit Single-Chip Microcomputer
Hardware Manual
H8/36912 Group, H8/36902 Group
Publication Date: Rev.1.00, Nov. 07, 2003
Rev.3.00, Sep. 14, 2006
Published by: Sales Strategic Planning Div.
Renesas Technology Corp.
Edited by: Customer Support Department
Global Strategic Communication Div.
Renesas Solutions Corp.
2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
http://www.renesas.com
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
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Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
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Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
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H8/36912 Group, H8/36902 Group
REJ09B0105-0300
Hardware Manual
