ST11B5.0ST5G - ON SEMICONDUCTOR

October, 2017 − Rev. 7

1Publication Order Number:

ESD11B/D

ESD11B

ESD Protection Diode

Micro−Packaged Diodes for ESD Protection

The ESD11B Series is designed to protect voltage sensitive

components from ESD. Excellent clamping capability, low leakage,

and fast response time provide best in class protection on designs that

are exposed to ESD. Because of its small size, it is suited for use in

cellular phones, MP3 players, digital cameras and many other portable

applications where board space comes at a premium.

Specification Features

•Low Capacitance 12 pF

•Low Clamping Voltage

•Small Body Outline Dimensions: 0.60 mm x 0.30 mm

•Low Body Height: 0.3 mm

•Stand−off Voltage: 5.0 V

•Low Leakage

•Response Time is < 1 ns

•IEC61000−4−2 Level 4 ESD Protection

•IEC61000−4−4 Level 4 EFT Protection

•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

Mechanical Characteristics

MOUNTING POSITION: Any

QUALIFIED MAX REFLOW TEMPERATURE: 260°C

Device Meets MSL 3 Requirements

MAXIMUM RATINGS

Rating Symbol Value Unit

IEC 61000−4−2 (ESD) Contact

Air

±15

Total Power Dissipation on FR−5 Board

(Note 1) @ TA = 25°C

Thermal Resistance, Junction−to−Ambient

°PD°

RqJA

250

400

°C/W

Junction and Storage Temperature Range TJ, Tstg −40 to +125 °C

Lead Solder Temperature − Maximum

(10 Second Duration)

TL260 °C

Peak Pulse Current, 8 x 20 ms double

exponential waveform (Figure 5)

Ipp 2.0 A

Stresses exceeding those listed in the Maximum Ratings table may damage the

device. If any of these limits are exceeded, device functionality should not be

assumed, damage may occur and reliability may be affected.

1. FR−5 = 1.0 x 0.75 x 0.62 in.

See Application Note AND8308/D for further description of survivability specs.

Device Package Shipping†

ORDERING INFORMATION

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

www.onsemi.com

ESD11B5.0ST5G DSN2

(Pb−Free)

5000/Tape & Reel

DSN2

CASE 152AA

MARKING

DIAGRAM

PIN 1

XXXX = Specific Device Code

YYY = Year Code

XXXX

YYY

Bi−Directional

IPP

VRWM

VCVBR

VRWM VC

VBR

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ELECTRICAL CHARACTERISTICS

(TA = 25°C unless otherwise noted)

Symbol Parameter

IPP Maximum Reverse Peak Pulse Current

VCClamping Voltage @ IPP

VRWM Working Peak Reverse Voltage

IRMaximum Reverse Leakage Current @ VRWM

VBR Breakdown Voltage @ IT

ITTest Current

*See Application Note AND8308/D for detailed explanations of

datasheet parameters.

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)

Device

Marking

VRWM

(V)

IR (mA)

@ VRWM

VBR (V) @ IT

(Note 2) ITC (pF)

VC (V) @

1 A VC

Max Max Min mA Typ Max

Max

(Note 3)

Per IEC61000−4−2

(Note 4)

ESD11B5.0ST5G 11B5 5.0 1.0 5.8 1.0 12 13.5 10 Figures 1 and 2

See Below

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

2. VBR is measured with a pulse test current IT at an ambient temperature of 25°C.

3. Surge current waveforms per Figure 5.

4. For test procedure see Figures 3 and 4 and Application Note AND8307/D.

Figure 1. ESD Clamping Voltage Screenshot

Positive 8 kV Contact per IEC61000−4−2

Figure 2. ESD Clamping Voltage Screenshot

Negative 8 kV Contact per IEC61000−4−2

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IEC 61000−4−2 Spec.

Level

Test Volt-

age (kV)

First Peak

Current

(A)

Current at

30 ns (A)

Current at

60 ns (A)

1 2 7.5 4 2

2 4 15 8 4

3 6 22.5 12 6

4 8 30 16 8

Ipeak

90%

10%

IEC61000−4−2 Waveform

100%

I @ 30 ns

I @ 60 ns

tP = 0.7 ns to 1 ns

Figure 3. IEC61000−4−2 Spec

Figure 4. Diagram of ESD Test Setup

50 W

Cable

Device

Under

Test Oscilloscope

ESD Gun

The following is taken from Application Note

AND8308/D − Interpretation of Datasheet Parameters

for ESD Devices.

ESD Voltage Clamping

For sensitive circuit elements it is important to limit the

voltage that an IC will be exposed to during an ESD event

to as low a voltage as possible. The ESD clamping voltage

is the voltage drop across the ESD protection diode during

an ESD event per the IEC61000−4−2 waveform. Since the

IEC61000−4−2 was written as a pass/fail spec for larger

systems such as cell phones or laptop computers it is not

clearly defined in the spec how to specify a clamping voltage

at the device level. ON Semiconductor has developed a way

to examine the entire voltage waveform across the ESD

protection diode over the time domain of an ESD pulse in the

form of an oscilloscope screenshot, which can be found on

the datasheets for all ESD protection diodes. For more

information on how ON Semiconductor creates these

screenshots and how to interpret them please refer to

AND8307/D.

Figure 5. 8 X 20 ms Pulse Waveform

100

0020406080

t, TIME (ms)

% OF PEAK PULSE CURRENT

PULSE WIDTH (tP) IS DEFINED

AS THAT POINT WHERE THE

PEAK CURRENT DECAY = 8 ms

PEAK VALUE IRSM @ 8 ms

HALF VALUE IRSM/2 @ 20 ms

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The following is taken from Application Note

AND8398/D − Board Level Application Note for 0201

DSN2 Package.

Printed Circuit Board Solder Pad Design

Based on results of board mount testing, ON

Semiconductor’s recommended mounting pads and solder

mask opening are shown in Figure 6. Maximum acceptable

PCB mounting pads and solder mask opening are shown in

Figure 7.

Figure 6. Recommended Mounting Pattern

Figure 7. Maximum Recommended Mounting

Solder Mask

Two types of PCB solder mask openings commonly used

for surface mount leadless style packages are:

1. Non Solder Masked Defined (NSMD)

2. Solder Masked Defined (SMD)

The solder mask is pulled away from the solderable

metallization for NSMD pads, while the solder mask

overlaps the edge of the metallization for SMD pads as

shown in Figure 8. For SMD pads, the solder mask restricts

the flow of solder paste on the top of the metallization and

prevents the solder from flowing down the side of the metal

pad. This is different from the NSMD configuration where

the solder flows both across the top and down the sides of the

PCB metallization.

NSMD SMD

Figure 8. Comparison of NSMD vs. SMD Pads

Solder Mask Openings

Solder

Mask

Overlay

Solderable

PCB

Typically, NSMD pads are preferred over SMD pads. It is

easier to define and control the location and size of copper

pad verses the solder mask opening. This is because the

copper etch process capability has a tighter tolerance than

that of the solder mask process. NSMD pads also allow for

easier visual inspection of the solder fillet.

Many PCB designs include a solder mask web between

mounting pads to prevent solder bridging. For this package,

testing has shown that the solder mask web can cause

package tilting during the board mount process. Thus, a

solder mask web is not recommended.

PCB Solderable Metallization

There are currently three common solderable coatings

which are used for PCB surface mount devices- OSP,

ENiAu, and HASL.

The first coating consists of an Organic Solderability

Protectant (OSP) applied over the bare copper features. OSP

coating assists in reducing oxidation in order to preserve the

copper metallization for soldering. It allows for multiple

passes through reflow ovens without degradation of

solderability. The OSP coating is dissolved by the flux when

solder paste is applied to the metal features. Coating

thickness recommended by OSP manufacturers is between

0.25 and 0.35 microns.

The second coating is plated electroless nickel/immersion

gold over the copper pad. The thickness of the electroless

nickel layer is determined by the allowable internal material

stresses and the temperature excursions the board will be

subjected to throughout its lifetime. Even though the gold

metallization is typically a self-limiting process, the

thickness should be at least 0.05 mm thick, but not consist of

more than 5% of the overall solder volume. Excessive gold

in the solder joint can create gold embrittlement. This may

affect the reliability of the joint.

The third is a tin-lead coating, commonly called Hot Air

Solder Level (HASL). This type of PCB pad finish is not

recommended for this type packages. The major issue is the

inability to consistently control the amount of solder coating

applied to each pad. This results in dome-shaped pads of

various heights. As the industry moves to finer and finer

pitch, solder bridging between mounting pads becomes a

common problem when using this coating.

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It is imperative that the coating is conformal, uniform, and

free of impurities to insure a consistent mounting process.

Due to the package’s extremely small size, we only

recommend the use of the electroless nickel/ immersion gold

metallization over the copper pads.

PCB Circuit Trace Width

The width of the PCB circuit trace plays an important role

in the reduction of component tilting when the solder is

reflowed. A solderable circuit trace allows the solder to wick

or run down the trace, reducing the overall thickness of the

solder on the PCB and under the component. Due to the

small nature of the solder pad and component, the solder on

the PCB will tend to form a bump causing the component to

slide down the side of that solder bump resulting in a tilted

component on the PCB. Allowing the solder to wick or run

down the PCB circuit trace, will reduce the solder thickness

and in turn prevent the solder from forming a ball on the PCB

pad. This was observed during ON Semiconductor board

mounting evaluations. The best results to prevent tilting

used a PCB circuit trace equal to the width of the mounting

pad. The length of the solder wicking or run out is controlled

by the solder mask opening.

Solder Type

Solder pastes such as Cookson Electronics’ WS3060 with

a Type 4 or smaller sphere size are recommended. WS3060

has a water-soluble flux for cleaning. Cookson Electronics’

PNC0106A can be used if a no-clean flux is preferred.

Solder Stencil Screening

Stencil screening of the solder paste onto the PCB is

commonly used in the industry. The recommended stencil

thickness for this part is 0.1 mm (0.004 in). The sidewalls of

the stencil openings should be tapered approximately five

degrees along with an electro-polish finish to aid in the

release of the paste when the stencil is removed from the

PCB. See Figure 9 for the recommended stencil opening size

and pitch shown on the recommended PCB mounting pads

and solder mask opening from Figure 6.

Figure 9. Recommended Stencil Pattern.

A second stencil option is shown in Figure 10. This option

increases the amount of solder paste applied to the PCB

through the stencil. This second option increases the stencil

opening size and pitch. The PCB mounting pads and solder

mask opening on the board do not change from the

recommendations in Figure 6.

Figure 10. Maximum Stencil Pattern

Note: If the maximum stencil opening option from

Figure 10 is used, tilt may occur on some of the packages.

This was evident in the board mounting study we conducted.

The stencil with the largest openings may improve solder

release from the stencil along with slightly increasing the

package shear strength.

Package Placement

Due to the small package size and because the pads are on

the underside of the package, an automated pick and place

procedure with magnification is recommended. A dual

image optical system where the underside of the package can

be aligned to the PCB should be used. Pick and place

equipment with a standard tolerance of +/- 0.05 mm (0.002

in) or better is recommended. The package self aligns during

the reflow process due to the surface tension of the solder.

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PACKAGE DIMENSIONS

DSN2, 0.6x0.3, 0.4P, (0201)

CASE 152AA

ISSUE A

MOUNTING FOOTPRINT*

DIMENSIONS: MILLIMETERS

0.75

0.28

0.30

0.28

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

XXXX

YYY

JAN

XXXX

Y09

YEAR CODE

DEVICE CODE

FEB

MAR

SEP

DEC

JUN

OCTNOV

INDICATES AUG 2009

(EXAMPLE)

CATHODE BAND MONTH CODING

See Application Note AND8398/D for more mounting details

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

BOTTOM VIEW

0.05 BAC

L2X

2X 0.06 C

TOP VIEW

2X 0.06 C

0.05 C

CSEATING

PLANE

SIDE VIEW

DIM MIN MAX

MILLIMETERS

A0.24 0.30

A1 0.00 0.01

b0.20 0.22

D0.30 BSC

E0.60 BSC

e0.40 BSC

L0.10 0.12

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EDS11B/D

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