Memory Product Specification
DDR3-1333 SO-DIMM
Description
The Module is DDR3-1333 CL9 Small Outline Memory module. The Module density from 1GB
to 4GB, it consists 128M/256Mx8 bit DDR3-1333MHz Synchronous DRAMs in FBGA
packages, Memory Module intented for mounting into 204-pin edge connector sockets. The
electrical and mechanical specifications are as follows.
Features
• JEDEC Standard
• DDR3 Speed Grade : 1333Mbps
• SO-DIMM : 204-pin
• Memory Organization : x8 FBGA DRAM chip
• DDR3 DRAM interface : SSTL_15
• CAS latency : 9-9-9
• Bandwidth : 10600MB/s
• VDD voltage : 1.5+-0.075V
• VDDQ voltage : 1.5+-0.075V
• Serial presence detect with EEPROM.
• PCB height : 1.181 inch
• RoHS Compliant
• Application : NoteBook
