SG55327/SG75327
4/90 Rev 1.2 7/96 LINFINITY Microelectronics Inc.
Copyright 1994 11861 Western Avenue
Garden Grove, CA 92841
1(714) 898-8121
FAX: (714) 893-2570
QUAD SOURCE MEMORY DRIVER
FEATURES
Quad source memory drivers
600mA output current capability
VCC2 drive voltage variable to 24V
Output capable of swinging between VCC2 and
ground
High-repetition-rate driver compatible with high–
speed magnetic memories
Inputs compatible with TTL decoders
Minimum time skew between strobe and output–
current rise
Pulse-transformer coupling eliminated
Drive-line lengths reduced
HIGH RELIABILITY FEATURES - SG55327
Available to MIL-STD-883
Scheduled for MIL-M-38510 QPL listing
LMI level “S” processing available
DESCRIPTION
The SG55327/SG75327 is a monolithic quad source driver
designed to meet the high current and fast switching speed
requirements of magnetic memory systems. Each driver is
independently controlled and capable of sinking up to 600mA.
Paired with the SG55326 Quad Sink Driver, the SG55327/
SG75327 provides the current drive necessary for many sink/
source applications.
The SG55327/SG75327 has also been used in many non-memory
applications: for example, as the driver for a clock circuit, relay,
lamp, or small motor, or any application where a 600mA source
driver is needed.
The SG55327 is characterized for use over the full military
operating ambient temperature range of -55°C to 125°C while the
SG75327 is characterized from 0°C to 70°C.
These devices are available in 16-pin ceramic DIP, 16-pin plastic
DIP and 16-pin flatpack.
BLOCK DIAGRAM
SG55327/SG75327
4/90 Rev 1.2 7/96 LINFINITY Microelectronics Inc.
Copyright 1994 11861 Western Avenue
Garden Grove, CA 92841
2(714) 898-8121
FAX: (714) 893-2570
ABSOLUTE MAXIMUM RATINGS (Note1)
Supply Voltage (VCC1) (Note 2) ............................................
Supply Voltage (VCC2) .........................................................
Input Voltage (any address or strobe input) ......................
Output Collector Voltage ....................................................
7.0V
25V
5.5V
25V
750mA
150°C
150°C
-65°C to 150°C
300°C
Output Collector Current .............................................
Operating Junction Temperature (TC)
Hermetic (J, F-Packages) .........................................
Plastic (N-Package) ..................................................
Storage Temperature Range ..........................
Lead Temperature (Soldering, 10 seconds) ..................
Note 1. Values beyond which damage may occur.
Note 2. Voltage values are with respect to network ground terminal.
THERMAL DATA
J Package:
Thermal Resistance-Junction to Case, θJC .................. 30°C/W
Thermal Resistance-Junction to Ambient, θJA ............... 80°C/W
N Package:
Thermal Resistance-Junction to Case, θJC .................. 40°C/W
Thermal Resistance-Junction to Ambient, θJA .............. 65°C/W
F Package:
Thermal Resistance-Junction to Case, θJC ................... 70°C/W
Thermal Resistance-Junction to Ambient, θJA ............ 115°C/W
Note 3. Range over which the device is functional.
Output Collector Current .................................................
Operating Ambient Temperature Range:
SG55327 .......................................................
SG75327 .............................................................
4.5V to 5.5V
4.5V to 24V
24V
600mA
-55°C to 125°C
0°C to 70°C
Supply Voltage (VCC1) ............................................
Supply Voltage (VCC2) .............................................
Output Collector Voltage ....................................................
RECOMMENDED OPERATING CONDITIONS (Note 3)
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, these specifications apply over the operating ambient temperatures for SG55327 with -55 °C TA 125°C, and SG75327
with 0°C TA 70°C. Low duty cycle pulse testing techniques are used which maintains junction and case temperatures equal to the ambient
temperature.)
2
VCC1 = 4.5V, IIN = -10mA, TA = 25°C
VCC1 = 4.5V, VCOL = 24V
VCC1 = 4.5V, VCOL = 24V, TA = 25°C
VCC1 = 4.5V, VOUT = 0V, ISOURCE = –600mA
TA = 25°C
VIN = 5.5V
VIN = 2.4V
VIN = 0.4V
Test ConditionsParameter Units
Min. Typ.
Static Section
High-Level Input Voltage (VIH)
Low-Level Input Voltage (VIL)
Input Clamp Voltage (VIK)
Collectors Terminal Off-State
Current (IOFF)
Saturation Voltage (VSAT) (Note 4)
Input Current (IIN)
Address
Strobe
High-Level Input Current (IIH)
Address
Strobe
Low-Level Input Current (IIL)
Address
Strobe
Min. Typ.
SG75327SG55327 Max.Max.
-1.0
0.43
-1.0
-4.0
0.8
-1.7
500
150
0.90
0.70
1
4
40
160
-1.6
-6.4
2
-1.0
0.43
-1.0
-4.0
0.8
-1.7
200
200
0.90
0.75
1
4
40
160
-1.6
-6.4
V
V
V
µA
µA
V
V
mA
mA
µA
µA
mA
mA
Note A. Junction Temperature Calculation: TJ = TA + (P D x θJA).
Note B. The above numbers for θJC are maximums for the limiting thermal
resistance of the package in a standard mounting configuration.
The θJA numbers are meant to be guidelines for the thermal
performance of the device/pc-board system. All of the above
assume no ambient airflow.
SG55327/SG75327
4/90 Rev 1.2 7/96 LINFINITY Microelectronics Inc.
Copyright 1994 11861 Western Avenue
Garden Grove, CA 92841
3(714) 898-8121
FAX: (714) 893-2570
ELECTRICAL CHARACTERIZATICS (continued)
All outputs off, all inputs at 5V, TA=25°C
One output on, ISOURCE = -50mA,
VCOL = 6V, TA = 25°C
Test ConditionsParameter Units
SG75327
Min. Typ. Max.
Min. Typ. Max.
SG55327
Supply Current (ICC(OFF))
From VCC1
From VCC2
Supply Current (ICC(ON))
From VCC1
From VCC2
Static Section (continued)
Test ConditionsParameter Units
SG55327/75327
Min. Typ. Max.
Dynamic Section (Note 5) Coll. W, Z or X, Y
Coll. W, Z or X, Y
W, X, Y, or Z
W, X, Y, or Z
Coll. W, Z or X, Y
Propagation Delay, Low to High (TPLH)
Propagation Delay, High to Low (TPHL)
Transition Time, Low to High (TTLH)
Transition Time, High to Low (TTHL)
High-Level Output Voltage (VOH)
(Note 6)
VS = VCC2 = 15V, RL = 24
VS = VCC2 = 15V, RL = 24
VCOL = VCC2 = 20V, RL = 100
VCOL = VCC2 = 20V, RL = 100
VS = VCC2 = 24V, R
L = 4
7,
ISINK 500mA
To (output)
CONNECTION DIAGRAMS & ORDERING INFORMATION (See Notes Below)
Ambient
Temperature Range
Part No.Package Connection Diagram
SG55327J/883B -55°C to 125°C
SG55327J -55°C to 125°C
SG75327J 0°C to 70°C
16-PIN CERAMIC DIP
J - PACKAGE
16-PIN CERAMIC
FLAT PACK
F - PACKAGE
SG55327F/883B -55°C to 125°C
SG55327F -55°C to 125°C
SG75327N 0°C to 70°C
16-PIN PLASTIC DIP
N - PACKAGE 6
8
11
14
9
10
GND (Note 2)
X
B
RINT
COLLECTORS X, Y
Y
C
VCC1
16
15
3
7
NODE R 4S
AD
WZ
VCC2 COLLECTORS W, Z
125
13
2
1
RINT
Z
D
S
VCC1
C
Y
COLL. X, Y
2
3
4
5
6
7
8
1
13
12
11
14
15
10
9
16
GND
X
B
NODE R
A
W
VCC2 COLL. W, Z
55
55
35
30
30
10
ns
ns
ns
ns
mVVS–25
7.0
13
8.0
36
10
20
12
55
7.0
13
8.0
36
10
20
12
55
mA
mA
mA
mA
Note 4. Under these conditions, not more than one output is to be on any one time.
Note 5. Unless otherwise specified, V CC1 = 5V, CL = 25pF, and TA = 25°C.
Note 6. Guaranteed but not tested.
Note 1. All packages are viewed from the top.
Note 2. Pin 8 is in electrical contact with the metal base.