1
FEBRUARY 2009
DSC-5909/19
©2009 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
2.5 VOLT HIGH-SPEED TeraSync™ FIFO
18-BIT/9-BIT CONFIGURATIONS
2,048 x 18/4,096 x 9, 4,096 x 18/8,192 x 9, 8,192 x 18/16,384 x 9,
16,384 x 18/32,768 x 9, 32,768 x 18/65,536 x 9, 65,536 x 18/131,072 x 9,
131,072 x 18/262,144 x 9, 262,144 x 18/524,288 x 9, 524,288 x 18/1,048,576 x 9
IDT72T1845, IDT72T1855
IDT72T1865, IDT72T1875
IDT72T1885, IDT72T1895
IDT72T18105, IDT72T18115
IDT72T18125
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. TeraSync FIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
FEATURES:
Choose among the following memory organizations:
IDT72T1845
2,048 x 18/4,096 x 9
IDT72T1855
4,096 x 18/8,192 x 9
IDT72T1865
8,192 x 18/16,384 x 9
IDT72T1875
16,384 x 18/32,768 x 9
IDT72T1885
32,768 x 18/65,536 x 9
IDT72T1895
65,536 x 18/131,072 x 9
IDT72T18105
131,072 x 18/262,144 x 9
IDT72T18115
262,144 x 18/524,288 x 9
IDT72T18125
524,288 x 18/1,048,576 x 9
Up to 225 MHz Operation of Clocks
User selectable HSTL/LVTTL Input and/or Output
Read Enable & Read Clock Echo outputs aid high speed operation
User selectable Asynchronous read and/or write port timing
2.5V LVTTL or 1.8V, 1.5V HSTL Port Selectable Input/Ouput voltage
3.3V Input tolerant
Mark & Retransmit, resets read pointer to user marked position
Write Chip Select (WCS) input enables/disables Write operations
Read Chip Select (RCS) synchronous to RCLK
Programmable Almost-Empty and Almost-Full flags, each flag can
default to one of eight preselected offsets
Program programmable flags by either serial or parallel means
Selectable synchronous/asynchronous timing modes for Almost-
Empty and Almost-Full flags
Separate SCLK input for Serial programming of flag offsets
User selectable input and output port bus-sizing
- x9 in to x9 out
- x9 in to x18 out
- x18 in to x9 out
- x18 in to x18 out
Big-Endian/Little-Endian user selectable byte representation
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable settings
Empty, Full and Half-Full flags signal FIFO status
Select IDT Standard timing (using EF and FF flags) or First Word
Fall Through timing (using OR and IR flags)
Output enable puts data outputs into high impedance state
JTAG port, provided for Boundary Scan function
Available in 144-pin (13mm x 13mm) or 240-pin (19mm x 19mm)
PlasticBall Grid Array (PBGA)
Easily expandable in depth and width
Independent Read and Write Clocks (permit reading and writing
simultaneously)
High-performance submicron CMOS technology
Industrial temperature range (–40°°
°°
°C to +85°°
°°
°C) is available
Green parts are available, see ordering information
INPUT REGISTER
OUTPUT REGISTER
RAM ARRAY
2,048 x 18 or 4,096 x 9
4,096 x 18 or 8,192 x 9
8,192 x 18 or 16,384 x 9
16,384 x 18 or 32,768 x 9
32,768 x 18 or 65,536 x 9
65,536 x 18 or 131,072 x 9
131,072 x 18 or 262,144 x 9
262,144 x 18 or 524,288 x 9
524,288 x 18 or 1,048,576 x 9
FLAG
LOGIC
FF/IR
PAF
EF/OR
PAE
HF
READ POINTER
READ
CONTROL
LOGIC
WRITE CONTROL
LOGIC
WRITE POINTER
RESET
LOGIC
WEN WCLK/WR
D
0
-D
n
(x18 or x9)
LD
MRS
REN
RCLK/RD
OE
Q
0
-Q
n
(x18 or x9)
OFFSET REGISTER
PRS
FWFT/SI
SEN
RT
5909 drw01
BUS
CONFIGURATION
CONTROL
LOGIC
BE
OW
IP
PFM
FSEL0
FSEL1
IW
MARK
SCLK
RCS
JTAG CONTROL
(BOUNDARY SCAN)
TCK
TMS
TDO
TDI
TRST
ASYR
WCS
ERCLK
EREN
HSTL I/0
CONTROL
Vref
WHSTL
RHSTL
ASYW
SHSTL
FUNCTIONAL BLOCK DIAGRAM
2
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
WCS PRS LD FF/IR OW HF BE IP ASYR PFM EREN MARK
WCLK MRS FWFT/SI PAF FSEL0 SHSTL FSEL1 DNC RHSTL PAE EF/OR RCLK
WEN WHSTL V
DDQ
V
DDQ
V
DDQ
V
CC
V
CC
V
DDQ
V
DDQ
V
DDQ
REN RT
ASYW
SEN V
DDQ
V
CC
V
CC
GND GND V
CC
V
CC
V
DDQ
RCS OE
SCLK
VREF
V
DDQ
V
CC
V
CC
V
DDQ
Q17
IW
D17 V
CC
GND V
CC
V
DDQ
Q16
D15 D16 V
CC
GND V
CC
V
DDQ
Q15
D13 D14 V
DDQ
V
CC
V
DDQ
Q14 Q13
D11 D12 V
DDQ
V
CC
V
DDQ
Q12 Q11
D9 D10 V
DDQ
V
DDQ
V
DDQ
V
CC
V
CC
V
DDQ
V
DDQ
V
DDQ
Q10 Q9
D7 D3 D1 TRST TCK TDI ERCLK Q1 Q3 Q5 Q8
D6 D4 D2 D0 TMS TD0 Q0 Q2 Q4 Q6 Q7
A1 BALL PAD CORNER
A
B
C
D
E
F
G
H
J
K
L
M
123456789101112
5909 drw02
GND GND GND GND GND
GND GND GND GND GND
V
CC
GND GND GND GND GND
V
CC
GND GND V
CC
V
CC
GND GND GND GND
D5
D8
IDT72T1845/72T1855/72T1865/72T1875/72T1885/72T1895 Only
PBGA: 1mm pitch, 13mm x 13mm (BB144-1, order code: BB)
TOP VIEW
PIN CONFIGURATIONS
NOTE:
1. DNC - Do Not Connect.
3
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
PIN CONFIGURATIONS (CONTINUED)
IDT72T18105/72T18115/72T18125 Only
PBGA: 1mm pitch, 19mm x 19mm (BB240-1, order code: BB)
TOP VIEW
NOTE:
1. DNC - Do Not Connect.
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
D13
GND
TDO
GND
D4 TMS
GND
D5D10 D1 Q14GND Q0 Q2 Q11Q8Q3
GND
GND GNDGND GND GND
GND GND GND
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
GND
GND
GND
GND
GND
GND
GND
GND GND
GND
GND
GND
GND
GND
GND
GND
V
CC
REN
GND
PAF
EREN V
DDQ
OE
RCLKV
CC
V
CC
V
CC
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
12 3456 78 910111213141516
A1 BALL PAD CORNER
MRS
V
CC
V
CC
FF
EF
V
CC
V
CC
V
CC
DNC
V
CC
V
CC
V
CC
V
CC
SEN
V
CC
V
CC
V
CC
V
DDQ
V
DDQ
V
DDQ
V
DDQ
RCS V
DDQ
V
DDQ
V
CC
V
CC
V
CC
SCLK
V
CC
V
CC
V
CC
V
CC
WCS
V
CC
V
CC
V
CC
PAELD HF
GND V
DDQ
MARK V
DDQ
RT
SHSTLFWFT/SI FS0
OW IPFS1 BE
GND PFMDNC ASYR
RHSTL
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
WHSTL
ASYW
VREF
IW
GND
GND
GND
GND
V
CC
V
DDQ
V
DDQ
V
CC
WEN GND
WCLK PRS
V
CC
5909 drw02a
U
V
V
CC
D16 D15
TDI
TCK
TRST
D6 D0
D2
D9D12
D14D17
D3
Q15
Q16GND ERCLK Q4 Q13Q10Q7
Q5D11 D8D7 GND Q6Q1 Q9 Q12
17 18
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
Q17
DNC DNC
DNC DNC DNC
DNC DNC DNC
DNC DNC DNC
DNC DNC DNC
DNC DNC
DNC
DNC DNC DNC
DNC DNC DNC
DNC DNC DNC
DNC DNC DNC
DNC DNC
DNC DNC
DNC DNC
4
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
DESCRIPTION:
The IDT72T1845/72T1855/72T1865/72T1875/72T1885/72T1895/
72T18105/72T18115/72T18125 are exceptionally deep, extremely high
speed, CMOS First-In-First-Out (FIFO) memories with clocked read and write
controls and a flexible Bus-Matching x18/x9 data flow. These FIFOs offer
several key user benefits:
Flexible x18/x9 Bus-Matching on both read and write ports
A user selectable MARK location for retransmit
User selectable I/O structure for HSTL or LVTTL
Asynchronous/Synchronous translation on the read or write ports
The first word data latency period, from the time the first word is written to an
empty FIFO to the time it can be read, is fixed and short.
High density offerings up to 9 Mbit
Bus-Matching TeraSync FIFOs are particularly appropriate for network,
video, telecommunications, data communications and other applications that
need to buffer large amounts of data and match busses of unequal sizes.
Each FIFO has a data input port (Dn) and a data output port (Qn), both of
which can assume either a 18-bit or a 9-bit width as determined by the state of
external control pins Input Width (IW) and Output Width (OW) pin during the
Master Reset cycle.
The input port can be selected as either a Synchronous (clocked) interface,
or Asynchronous interface. During Synchronous operation the input port is
controlled by a Write Clock (WCLK) input and a Write Enable (WEN) input. Data
present on the Dn data inputs is written into the FIFO on every rising edge of
WCLK when WEN is asserted. During Asynchronous operation only the WR
input is used to write data into the FIFO. Data is written on a rising edge of WR,
the WEN input should be tied to its active state, (LOW).
The output port can be selected as either a Synchronous (clocked) interface,
or Asynchronous interface. During Synchronous operation the output port is
controlled by a Read Clock (RCLK) input and Read Enable (REN) input. Data
is read from the FIFO on every rising edge of RCLK when REN is asserted.
During Asynchronous operation only the RD input is used to read data from the
FIFO. Data is read on a rising edge of RD, the REN input should be tied to its
active state, LOW. When Asynchronous operation is selected on the output port
the FIFO must be configured for Standard IDT mode, also the RCS should be
tied LOW and the OE input used to provide three-state control of the outputs, Qn.
The output port can be selected for either 2.5V LVTTL or HSTL operation,
this operation is selected by the state of the RHSTL input during a master reset.
An Output Enable (OE) input is provided for three-state control of the outputs.
A Read Chip Select (RCS) input is also provided, the RCS input is synchronized
to the read clock, and also provides three-state control of the Qn data outputs.
When RCS is disabled, the data outputs will be high impedance. During
Asynchronous operation of the output port, RCS should be enabled, held LOW.
Echo Read Enable, EREN and Echo Read Clock, ERCLK outputs are
provided. These are outputs from the read port of the FIFO that are required
for high speed data communication, to provide tighter synchronization between
the data being transmitted from the Qn outputs and the data being received by
the input device. Data read from the read port is available on the output bus with
respect to EREN and ERCLK, this is very useful when data is being read at
high speed. The ERCLK and EREN outputs are non-functional when the Read
port is setup for Asynchronous mode.
The frequencies of both the RCLK and the WCLK signals may vary from 0
to fMAX with complete independence. There are no restrictions on the frequency
of the one clock input with respect to the other.
There are two possible timing modes of operation with these devices: IDT
Standard mode and First Word Fall Through (FWFT) mode.
In IDT Standard mode, the first word written to an empty FIFO will not appear
on the data output lines unless a specific read operation is performed. A read
operation, which consists of activating REN and enabling a rising RCLK edge,
will shift the word from internal memory to the data output lines.
In FWFT mode, the first word written to an empty FIFO is clocked directly
to the data output lines after three transitions of the RCLK signal. A REN does
not have to be asserted for accessing the first word. However, subsequent
words written to the FIFO do require a LOW on REN for access. The state of
the FWFT/SI input during Master Reset determines the timing mode in use.
For applications requiring more data storage capacity than a single FIFO
can provide, the FWFT timing mode permits depth expansion by chaining FIFOs
in series (i.e. the data outputs of one FIFO are connected to the corresponding
data inputs of the next). No external logic is required.
These FIFOs have five flag pins, EF/OR (Empty Flag or Output Ready),
FF/IR (Full Flag or Input Ready), HF (Half-full Flag), PAE (Programmable
Almost-Empty flag) and PAF (Programmable Almost-Full flag). The EF and FF
functions are selected in IDT Standard mode. The IR and OR functions are
selected in FWFT mode. HF, PAE and PAF are always available for use,
irrespective of timing mode.
PAE and PAF can be programmed independently to switch at any point in
memory. Programmable offsets determine the flag switching threshold and can
be loaded by two methods: parallel or serial. Eight default offset settings are also
provided, so that PAE can be set to switch at a predefined number of locations
from the empty boundary and the PAF threshold can also be set at similar
predefined values from the full boundary. The default offset values are set during
Master Reset by the state of the FSEL0, FSEL1, and LD pins.
For serial programming, SEN together with LD on each rising edge of
SCLK, are used to load the offset registers via the Serial Input (SI). For parallel
programming, WEN together with LD on each rising edge of WCLK, are used
to load the offset registers via Dn. REN together with LD on each rising edge
of RCLK can be used to read the offsets in parallel from Qn regardless of whether
serial or parallel offset loading has been selected.
During Master Reset (MRS) the following events occur: the read and write
pointers are set to the first location of the FIFO. The FWFT pin selects IDT
Standard mode or FWFT mode.
The Partial Reset (PRS) also sets the read and write pointers to the first
location of the memory. However, the timing mode, programmable flag
programming method, and default or programmed offset settings existing before
Partial Reset remain unchanged. The flags are updated according to the timing
mode and offsets in effect. PRS is useful for resetting a device in mid-operation,
when reprogramming programmable flags would be undesirable.
It is also possible to select the timing mode of the PAE (Programmable Almost-
Empty flag) and PAF (Programmable Almost-Full flag) outputs. The timing
modes can be set to be either asynchronous or synchronous for the PAE and
PAF flags.
If asynchronous PAE/PAF configuration is selected, the PAE is asserted
LOW on the LOW-to-HIGH transition of RCLK. PAE is reset to HIGH on the LOW-
to-HIGH transition of WCLK. Similarly, the PAF is asserted LOW on the LOW-
to-HIGH transition of WCLK and PAF is reset to HIGH on the LOW-to-HIGH
transition of RCLK.
If synchronous PAE/PAF configuration is selected , the PAE is asserted and
updated on the rising edge of RCLK only and not WCLK. Similarly, PAF is
asserted and updated on the rising edge of WCLK only and not RCLK. The mode
desired is configured during Master Reset by the state of the Programmable Flag
Mode (PFM) pin.
This device includes a Retransmit from Mark feature that utilizes two control
inputs, MARK and , RT (Retransmit). If the MARK input is enabled with respect
to the RCLK, the memory location being read at that point will be marked. Any
subsequent retransmit operation, RT goes LOW, will reset the read pointer to
this ‘marked’ location.
5
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
The device can be configured with different input and output bus widths as
shown in Table 1.
A Big-Endian/Little-Endian data word format is provided. This function is
useful when data is written into the FIFO in long word format (x18) and read
out of the FIFO in small word (x9) format. If Big-Endian mode is selected, then
the most significant byte (word) of the long word written into the FIFO will be read
out of the FIFO first, followed by the least significant byte. If Little-Endian format
is selected, then the least significant byte of the long word written into the FIFO
will be read out first, followed by the most significant byte. The mode desired is
configured during master reset by the state of the Big-Endian (BE) pin.
The Interspersed/Non-Interspersed Parity (IP) bit function allows the user
to select the parity bit in the word loaded into the parallel port (D0-Dn) when
programming the flag offsets. If Interspersed Parity mode is selected, then the
FIFO will assume that the parity bit is located in bit positions D8 during the parallel
programming of the flag offsets. If Non-Interspersed Parity mode is selected,
then D8 is assumed to be a valid bit and D16 and D17 are ignored. IP mode
is selected during Master Reset by the state of the IP input pin. This mode is
relevant only when the input width is set to x18 mode.
If, at any time, the FIFO is not actively performing an operation, the chip will
automatically power down. Once in the power down state, the standby supply
current consumption is minimized. Initiating any operation (by activating control
inputs) will immediately take the device out of the power down state.
Both an Asynchronous Output Enable pin (OE) and Synchronous Read
Chip Select pin (RCS) are provided on the FIFO. The Synchronous Read Chip
Select is synchronized to the RCLK. Both the output enable and read chip select
control the output buffer of the FIFO, causing the buffer to be either HIGH
impedance or LOW impedance.
A JTAG test port is provided, here the FIFO has fully functional Boundary
Scan feature, compliant with IEEE 1449.1 Standard Test Access Port and
Boundary Scan Architecture.
The TeraSync FIFO has the capability of operating its ports (write and/or
read) in either LVTTL or HSTL mode, each ports selection independent of the
other. The write port selection is made via WHSTL and the read port selection
via RHSTL. An additional input SHSTL is also provided, this allows the user
to select HSTL operation for other pins on the device (not associated with the
write or read ports).
The IDT72T1845/72T1855/72T1865/72T1875/72T1885/72T1895/
72T18105/72T18115/72T18125 are fabricated using IDT’s high speed sub-
micron CMOS technology.
6
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
IW OW Write Port Width Read Port Width
L L x18 x18
L H x18 x9
H L x9 x18
H H x9 x9
TABLE 1 — BUS-MATCHING CONFIGURATION MODES
Figure 1. Single Device Configuration Signal Flow Diagram
(x18, x9) DATA OUT (Q
0
- Q
n
)(x18, x9) DATA IN (D
0
- D
n
)
MASTER RESET (MRS)
READ CLOCK (RCLK/RD)
READ ENABLE (REN)
OUTPUT ENABLE (OE)
EMPTY FLAG/OUTPUT READY (EF/OR)
PROGRAMMABLE ALMOST-EMPTY (PAE)
WRITE CLOCK (WCLK/WR)
WRITE ENABLE (WEN)
LOAD (LD)
FULL FLAG/INPUT READY (FF/IR)
PROGRAMMABLE ALMOST-FULL (PAF)
IDT
72T1845
72T1855
72T1865
72T1875
72T1885
72T1895
72T18105
72T18115
72T18125
PARTIAL RESET (PRS)
FIRST WORD FALL THROUGH/
SERIAL INPUT (FWFT/SI) RETRANSMIT (RT)
5909 drw03
HALF-FULL FLAG (HF)
SERIAL ENABLE(SEN)
INPUT WIDTH (IW) OUTPUT WIDTH (OW)
BIG-ENDIAN/LITTLE-ENDIAN (BE)
INTERSPERSED/
NON-INTERSPERSED PARITY (IP)
SERIAL CLOCK (SCLK)
MARK
READ CHIP SELECT (RCS)
RCLK ECHO, ERCLK
REN ECHO, EREN
WRITE CHIP SELECT (WCS)
7
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
PIN DESCRIPTION
Symbol Name I/O TYPE Description
ASYR(1) Asynchronous LVTTL A HIGH on this input during Master Reset will select Synchronous read operation for the output port. A LOW
Read Port INPUT will select Asynchronous operation. If Asynchronous is selected the FIFO must operate in IDT Standard mode.
ASYW(1) Asynchronous LVTTL A HIGH on this input during Master Reset will select Synchronous write operation for the input port. A LOW
Write Port INPUT will select Asynchronous operation.
BE(1) Big-Endian/ LVTTL During Master Reset, a LOW on BE will select Big-Endian operation. A HIGH on BE during Master Reset
Little-Endian INPUT will select Little-Endian format.
D0–D17 Data Inputs HSTL-LVTTL Data inputs for an 18- or 9-bit bus. When in 18- or 9-bit mode, the unused input pins should be tied to GND.
INPUT
EF/OR Empty Flag/ HSTL-LVTTL In the IDT Standard mode, the EF function is selected. EF indicates whether or not the FIFO memory is empty.
Output Ready OUTPUT In FWFT mode, the OR function is selected. OR indicates whether or not there is valid data available at the
outputs.
ERCLK RCLK Echo HSTL-LVTTL Read clock Echo output, only available when the Read is setup for Synchronous mode.
OUTPUT
EREN Read Enable Echo HSTL-LVTTL Read Enable Echo output, only available when the Read is setup for Synchronous mode.
OUTPUT
FF/IR Full Flag/ HSTL-LVTTL In the IDT Standard mode, the FF function is selected. FF indicates whether or not the FIFO memory is
Input Ready OUTPUT full. In the FWFT mode, the IR function is selected. IR indicates whether or not there is space available for
writing to the FIFO memory.
FSEL0(1) Flag Select Bit 0 LVTTL During Master Reset, this input along with FSEL1 and the LD pin, will select the default offset values for the
INPUT programmable flags PAE and PAF. There are up to eight possible settings available.
FSEL1(1) Flag Select Bit 1 LVTTL During Master Reset, this input along with FSEL0 and the LD pin will select the default offset values for the
INPUT programmable flags PAE and PAF. There are up to eight possible settings available.
FWFT/ First Word Fall HSTL-LVTTL During Master Reset, selects First Word Fall Through or IDT Standard mode. After Master Reset, this pin
SI Through/Serial In INPUT functions as a serial input for loading offset registers. If Asynchronous operation of the read port has been
selected then the FIFO must be setup in IDT Standard mode.
HF Half-Full Flag HSTL-LVTTL HF indicates whether the FIFO memory is more or less than half-full.
OUTPUT
IP(1) Interspersed Parity LVTTL During Master Reset, a LOW on IP will select Non-Interspersed Parity mode. A HIGH will select Interspersed
INPUT Parity mode.
IW(1) Input Width LVTTL This pin, along with OW, selects the bus width of the write port. See Table 1 for bus size configuration.
INPUT
LD Load HSTL-LVTTL This is a dual purpose pin. During Master Reset, the state of the LD input along with FSEL0 and FSEL1,
INPUT determines one of eight default offset values for the PAE and PAF flags, along with the method by which these
offset registers can be programmed, parallel or serial (see Table 2). After Master Reset, this pin enables writing
to and reading from the offset registers. THIS PIN MUST BE HIGH AFTER MASTER RESET TO WRITE
OR READ DATA TO/FROM THE FIFO MEMORY.
MARK Mark for Retransmit HSTL-LVTTL When this pin is asserted the current location of the read pointer will be marked. Any subsequent Retransmit
INPUT operation will reset the read pointer to this position.
MRS Master Reset HSTL-LVTTL MRS initializes the read and write pointers to zero and sets the output register to all zeroes. During Master
INPUT Reset, the FIFO is configured for either FWFT or IDT Standard mode, Bus-Matching configurations,
Synchronous/Asynchronous operation of the read or write port, one of eight programmable flag default settings,
serial or parallel programming of the offset settings, Big-Endian/Little-Endian format, zero latency timing mode,
interspersed parity, and synchronous versus asynchronous programmable flag timing modes.
OE Output Enable HSTL-LVTTL OE provides Asynchronous three-state control of the data outputs, Qn. During a Master or Partial Reset the
INPUT OE input is the only input that provide High-Impedance control of the data outputs.
OW(1) Output Width LVTTL This pin, along with IW, selects the bus width of the read port. See Table 1 for bus size configuration.
INPUT
PAE Programmable HSTL-LVTTL PAE goes LOW if the number of words in the FIFO memory is less than offset n, which is stored in the Empty
Almost-Empty Flag OUTPUT Offset register. PAE goes HIGH if the number of words in the FIFO memory is greater than or equal to offset n.
PAF Programmable HSTL-LVTTL PAF goes HIGH if the number of free locations in the FIFO memory is more than offset m, which is stored in
Almost-Full Flag OUTPUT the Full Offset register. PAF goes LOW if the number of free locations in the FIFO memory is less than or equal
to m.
PFM(1) Programmable LVTTL During Master Reset, a LOW on PFM will select Asynchronous Programmable flag timing mode. A HIGH on
Flag Mode INPUT PFM will select Synchronous Programmable flag timing mode.
8
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
PRS Partial Reset HSTL-LVTTL PRS initializes the read and write pointers to zero and sets the output register to all zeroes. During Partial Reset,
INPUT the existing mode (IDT or FWFT), programming method (serial or parallel), and programmable flag settings
are all retained.
Q0–Q17 Data Outputs HSTL-LVTTL Data outputs for an 18- or 9-bit bus. When in 9-bit mode, any unused output pins should not be connected.
OUTPUT Outputs are not 5V tolerant regardless of the state of OE and RCS.
RCLK/ Read Clock/ HSTL-LVTTL If Synchronous operation of the read port has been selected, when enabled by REN, the rising edge of RCLK
RD Read Strobe INPUT reads data from the FIFO memory and offsets from the programmable registers. If LD is LOW, the values loaded
into the offset registers is output on a rising edge of RCLK. If Asynchronous operation of the read port has been
selected, a rising edge on RD reads data from the FIFO in an Asynchronous manner. REN should be tied LOW.
RCS Read Chip Select HSTL-LVTTL RCS provides synchronous control of the read port and output impedance of Qn, synchronous to RCLK. During
INPUT a Master or Partial Reset the RCS input is don’t care, if OE is LOW the data outputs will be Low-Impedance
regardless of RCS.
REN Read Enable HSTL-LVTTL If Synchronous operation of the read port has been selected, REN enables RCLK for reading data from the
INPUT FIFO memory and offset registers. If Asynchronous operation of the read port has been selected, the REN
input should be tied LOW.
RHSTL(1) Read Port HSTL LVTTL This pin is used to select HSTL or 2.5V LVTTL outputs for the FIFO. If HSTL or eHSTL outputs are
Select INPUT required, this input must be tied HIGH. Otherwise it should be tied LOW.
RT Retransmit HSTL-LVTTL RT asserted on the rising edge of RCLK initializes the READ pointer to zero, sets the EF flag to LOW (OR to HIGH
INPUT in FWFT mode) and doesn’t disturb the write pointer, programming method, existing timing mode or programmable
flag settings. If a mark has been set via the MARK input pin, then the read pointer will jump to the ‘mark’ location.
SCLK Serial Clock HSTL-LVTTL A rising edge on SCLK will clock the serial data present on the SI input into the offset registers providing that
INPUT SEN is enabled.
SEN Serial Enable HSTL-LVTTL SEN enables serial loading of programmable flag offsets.
INPUT
SHSTL System HSTL LVTTL All inputs not associated with the write or read port can be selected for HSTL operation via the SHSTL input.
Select INPUT
TCK(2) JTAG Clock HSTL-LVTTL Clock input for JTAG function. One of four terminals required by IEEE Standard 1149.1-1990. Test operations
INPUT of the device are synchronous to TCK. Data from TMS and TDI are sampled on the rising edge of TCK and
outputs change on the falling edge of TCK. If the JTAG function is not used this signal needs to be tied to GND.
TDI(2) JTAG Test Data HSTL-LVTTL One of four terminals required by IEEE Standard 1149.1-1990. During the JTAG boundary scan operation, test
Input INPUT data serially loaded via the TDI on the rising edge of TCK to either the Instruction Register, ID Register and Bypass
Register. An internal pull-up resistor forces TDI HIGH if left unconnected.
TDO(2) JTAG Test Data HSTL-LVTTL One of four terminals required by IEEE Standard 1149.1-1990. During the JTAG boundary scan operation, test
Output OUTPUT data serially loaded output via the TDO on the falling edge of TCK from either the Instruction Register, ID Register
and Bypass Register. This output is high impedance except when shifting, while in SHIFT-DR and SHIFT-IR
controller states.
TMS(2) JTAG Mode HSTL-LVTTL TMS is a serial input pin. One of four terminals required by IEEE Standard 1149.1-1990. TMS directs the
Select INPUT the device through its TAP controller states. An internal pull-up resistor forces TMS HIGH if left unconnected.
TRST(2) JTAG Reset HSTL-LVTTL TRST is an asynchronous reset pin for the JTAG controller. The JTAG TAP controller does not automatically
INPUT reset upon power-up, thus it must be reset by either this signal or by setting TMS= HIGH for five TCK cycles.
If the TAP controller is not properly reset then the FIFO outputs will always be in high-impedance. If the JTAG
function is used but the user does not want to use TRST, then TRST can be tied with MRS to ensure proper
FIFO operation. If the JTAG function is not used then this signal needs to be tied to GND.
WEN Write Enable HSTL-LVTTL When Synchronous operation of the write port has been selected, WEN enables WCLK for writing data into
INPUT the FIFO memory and offset registers. If Asynchronous operation of the write port has been selected, the
WEN input should be tied LOW.
WCS Write Chip Select HSTL-LVTTL The WCS pin can be regarded as a second WEN input, enabling/disabling write operations.
INPUT
WCLK/ Write Clock/ HSTL-LVTTL If Synchronous operation of the write port has been selected, when enabled by WEN, the rising edge of WCLK
WR Write Strobe INPUT writes data into the FIFO. If Asynchronous operation of the write port has been selected, WR writes data into
the FIFO on a rising edge in an Asynchronous manner, (WEN should be tied to its active state).
PIN DESCRIPTION (CONTINUED)
Symbol Name I/O TYPE Description
9
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
PIN DESCRIPTION (CONTINUED)
NOTES:
1. Inputs should not change state after Master Reset.
2. These pins are for the JTAG port. Please refer to pages 29-32 and Figures 6-8.
Symbol Name I/O TYPE Description
WHSTL(1) Write Port HSTL LVTTL This pin is used to select HSTL or 2.5V LVTTL inputs for the FIFO. If HSTL inputs are required, this input must
Select INPUT be tied HIGH. Otherwise it should be tied LOW.
VCC +2.5V Supply I These are VCC supply inputs and must be connected to the 2.5V supply rail.
GND Ground Pin I These are Ground pins and must be connected to the GND rail.
Vref Reference I This is a Voltage Reference input and must be connected to a voltage level determined from the table,
Voltage “Recommended DC Operating Conditions”. This provides the reference voltage when using HSTL class
inputs. If HSTL class inputs are not being used, this pin should be tied LOW.
VDDQ O/P Rail Voltage I This pin should be tied to the desired voltage rail for providing power to the output drivers.
10
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
Symbol Rating Commercial Unit
VTERM Terminal Voltage –0.5 to +3.6(2) V
with respect to GND
TSTG Storage Temperature –55 to +125 °C
IOUT DC Output Current –50 to +50 mA
Symbol Parameter Min. Typ. Max. Unit
VCC Supply Voltage 2.375 2.5 2.625 V
GND Supply Voltage 0 0 0 V
VIH Input High Voltage LVTTL 1.7 3.45 V
eHSTL VREF+0.2 VDDQ+0.3 V
HSTL VREF+0.2 VDDQ+0.3 V
VIL Input Low Voltage LVTTL -0.3 0.7 V
eHSTL -0.3 VREF-0.2 V
HSTL -0.3 VREF-0.2 V
VREF(1) Voltage Reference Input eHSTL 0 .8 0.9 1 .0 V
HSTL 0.68 0.75 0.9 V
TAOperating Temperature Commercial 0 70 °C
TAOperating Temperature Industrial -40 85 °C
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED DC OPERATING CONDITIONS
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
2. Compliant with JEDEC JESD8-5. VCC terminal only.
NOTE:
1. VREF is only required for HSTL or eHSTL inputs. VREF should be tied LOW for LVTTL operation.
2. Outputs are not 3.3V tolerant.
Symbol Parameter(1) Conditions Max. Unit
CIN(2,3) Input VIN = 0V 10(3) pF
Capacitance
COUT(1,2) Output VOUT = 0V 10 pF
Capacitance
CAPACITANCE (TA = +25°C, f = 1.0MHz)
NOTES:
1. With output deselected, (OE VIH).
2. Characterized values, not currently tested.
3. CIN for Vref is 20pF.
11
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
DC ELECTRICAL CHARACTERISTICS
(Commercial: VCC = 2.5V ± 0.125V, TA = 0°C to +70°C;Industrial: VCC = 2.5V ± 0.125V, TA = -40°C to +85°C)
Symbol Parameter Min. Max. Un it
ILI Input Leakage Current 10 10 µA
ILO Output Leakage Current 10 10 µA
VOH(5) Output Logic “1” Voltage, IOH = –8 mA @VDDQ = 2.5V ± 0.125V (LVTTL) VDDQ -0.4 V
IOH = –8 mA @VDDQ = 1.8V ± 0.1V (eHSTL) VDDQ -0.4 V
IOH = –8 mA @VDDQ = 1.5V ± 0.1V (HSTL) VDDQ -0.4 V
VOL Output Logic “0” Voltage, IOL = 8 mA @VDDQ = 2.5V ± 0.125V (LVTTL) 0.4V V
IOL = 8 mA @VDDQ = 1.8V ± 0.1V (eHSTL) 0.4V V
IOL = 8 mA @VDDQ = 1.5V ± 0.1V (HSTL) 0.4V V
IDT72T1845/72T1855/72T1865/72T1875/72T1885/72T1895
ICC1(1,2) Active VCC Current (VCC = 2.5V) I/O = LVTTL 40 mA
I/O = HSTL 60 mA
I/O = eHSTL 60 mA
ICC2(1) Standby VCC Current (VCC = 2.5V) I/O = LVTTL 1 0 mA
I/O = HSTL 50 mA
I/O = eHSTL 50 mA
IDT72T18105/72T18115/72T18125
ICC1(1,2) Active VCC Current (VCC = 2.5V) I/O = LVTTL 50 mA
I/O = HSTL 70 mA
I/O = eHSTL 70 mA
ICC2(1) Standby VCC Current (VCC = 2.5V) I/O = LVTTL 2 0 mA
I/O = HSTL 60 mA
I/O = eHSTL 60 mA
NOTES:
1 . Both WCLK and RCLK toggling at 20MHz. Data inputs toggling at 10MHz. WCS = HIGH, REN or RCS = HIGH.
2. For the IDT72T18105/72T18115/72T18125, typical ICC1 calculation (with data outputs in Low-Impedance):
for LVTTL I/O ICC1 (mA) = 1.0 x fs, fs = WCLK = RCLK frequency (in MHz)
for HSTL or eHSTL I/O ICC1 (mA) = 30 + (1.0 x fs), fs = WCLK = RCLK frequency (in MHz)
For the IDT72T1845/72T1855/72T1865/72T1875/72T1885/72T1895, typical ICC1 calculation (with data outputs in Low-Impedance):
for LVTTL I/O ICC1 (mA) = 0.7mA x fs, fs = WCLK = RCLK frequency (in MHz)
for HSTL or eHSTL I/O ICC1 (mA) = 30 + (0.7 x fs), fs = WCLK = RCLK frequency (in MHz).
3. For all devices, typical IDDQ calculation: with data outputs in High-Impedance: IDDQ (mA) = 0.15 x fs, fs = WCLK = RCLK frequency (in MHz)
with data outputs in Low-Impedance: IDDQ (mA) = (CL x VDDQ x fs x N)/2000
fs = WCLK = RCLK frequency (in MHz), VDDQ = 2.5V for LVTTL; 1.5V for HSTL; 1.8V for eHSTL, CL = capacitive load (pf), tA = 25°C,
N= Number of outputs switching.
4 . Total Power consumed: PT = (VCC x ICC) + VDDQ x IDDQ).
5. Outputs are not 3.3V tolerant.
12
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
AC ELECTRICAL CHARACTERISTICS(1) SYNCHRONOUS TIMING
(Commercial: VCC = 2.5V ± 5%, TA = 0°C to +70°C;Industrial: VCC = 2.5V ± 5%, TA = -40°C to +85°C)
NOTES:
1. All AC timings apply to both Standard IDT mode and First Word Fall Through mode.
2. Industrial temperature range product for the 5ns speed grade is available as a standard device. All other speed grades are available by special order.
3. Pulse widths less than minimum values are not allowed.
4. Values guaranteed by design, not currently tested.
Commercial Com’l & Ind’l(2) Commercial Commercial
IDT72T1845L4-4 IDT72T1845L5 IDT72T1845L6-7
IDT72T1855L4-4 IDT72T1855L5 IDT72T1855L6-7
IDT72T1865L4-4 IDT72T1865L5 IDT72T1865L6-7
IDT72T1875L4-4 IDT72T1875L5 IDT72T1875L6-7
IDT72T1885L4-4 IDT72T1885L5 IDT72T1885L6-7
IDT72T1895L4-4 IDT72T1895L5 IDT72T1895L6-7
IDT72T18105L4-4 IDT72T18105L5 IDT72T18105L6-7 IDT72T18105L10
IDT72T18115L4-4 IDT72T18115L5 IDT72T18115L6-7 IDT72T18115L10
IDT72T18125L4-4 IDT72T18125L5 IDT72T18125L6-7 IDT72T18125L10
Symbol Parameter Min. Max. Min. Max. Min. Max. Min. Max. Unit
fCClock Cycle Frequency (Synchronous) 2 25 200 150 10 0 MHz
tAData Access Time 0.6 3.4 0.6 3.6 0.6 3.8 0.6 4.5 ns
tCLK Clock Cycle Time 4.44 5 6.7 10 ns
tCLKH Clock High Time 2 .0 2. 3 2. 8 4 .5 n s
tCLKL Clock Low Time 2 .0 2. 3 2. 8 4. 5 n s
tDS Data Setup Time 1.2 1.5 2.0 3.0 ns
tDH Data Hold Time 0.5 0.5 0.5 0.5 ns
tENS Enable Setup Time 1.2 1.5 2.0 3.0 ns
tENH Enable Hold Time 0.5 0.5 0.5 0.5 ns
tLDS Load Setup Time 1.2 1.5 2.0 3.0 ns
tLDH Load Hold Time 0.5 0.5 0.5 0.5 ns
tWCSS WCS setup time 1.2 1.5 2.0 3.0 ns
tWCSH WCS hold time 0.5 0.5 0.5 0.5 ns
fSClock Cycle Frequency (SCLK) 10 10 10 10 MHz
tSCLK Serial Clock Cycle 100 100 100 100 ns
tSCKH Serial Clock High 45 45 45 45 n s
tSCKL Serial Clock Low 45 45 45 45 ns
tSDS Serial Data In Setup 15 15 15 15 ns
tSDH Serial Data In Hold 5 5 5 5 ns
tSENS Serial Enable Setup 5 5 5 5 ns
tSENH Serial Enable Hold 5 5 5 5 ns
tRS Reset Pulse Width(3) 30 30 30 30 ns
tRSS Reset Setup Time 15 15 15 15 ns
tHRSS HSTL Reset Setup Time 4 4 4 4 µs
tRSR Reset Recovery Time 10 10 10 10 ns
tRSF Reset to Flag and Output Time 10 12 15 15 ns
tWFF Write Clock to FF or IR 3.4 3.6 3.8 4.5 ns
tREF Read Clock to EF or OR 3.4 3.6 3.8 4.5 ns
tPAFS Write Clock to Synchronous Programmable Almost-Full Flag 3.4 3.6 3.8 4.5 ns
tPAES Read Clock to Synchronous Programmable Almost-Empty Flag 3.4 3.6 3.8 4.5 ns
tERCLK RCLK to Echo RCLK output 3. 8 4 4. 3 5 n s
tCLKEN RCLK to Echo REN output 3. 4 3.6 3. 8 4. 5 n s
tRCSLZ RCLK to Active from High-Z(4) 3.4 3.6 3.8 4.5 ns
tRCSHZ RCLK to High-Z(4) 3.4 3.6 3.8 4.5 ns
tSKEW1 Skew time between RCLK and WCLK for EF/OR and FF/IR 3.5—4—5—7ns
tSKEW2 Skew time between RCLK and WCLK for PAE and PAF 4—5—68—ns
13
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
AC ELECTRICAL CHARACTERISTICS ASYNCHRONOUS TIMING
(Commercial: VCC = 2.5V ± 5%, TA = 0°C to +70°C;Industrial: VCC = 2.5V ± 5%, TA = -40°C to +85°C)
Commercial Com’l & Ind’l(2) Commercial Commercial
IDT72T1845L4-4 IDT72T1845L5 IDT72T1845L6-7
IDT72T1855L4-4 IDT72T1855L5 IDT72T1855L6-7
IDT72T1865L4-4 IDT72T1865L5 IDT72T1865L6-7
IDT72T1875L4-4 IDT72T1875L5 IDT72T1875L6-7
IDT72T1885L4-4 IDT72T1885L5 IDT72T1885L6-7
IDT72T1895L4-4 IDT72T1895L5 IDT72T1895L6-7
IDT72T18105L4-4 IDT72T18105L5 IDT72T18105L6-7 IDT72T18105L10
IDT72T18115L4-4 IDT72T18115L5 IDT72T18115L6-7 IDT72T18115L10
IDT72T18125L4-4 IDT72T18125L5 IDT72T18125L6-7 IDT72T18125L10
Symbol Parameter Min. Max. Min. Max. Min. Max. Min. Max. Unit
fACycle Frequency (Asynchronous) 1 0 0 83 6 6 5 0 MHz
tAA Data Access Time 0.6 8 0.6 10 0.6 12 0.6 14 ns
tCYC Cycle Time 10 12 15 20 n s
tCYH Cycle HIGH Time 4.5 5 7 8 ns
tCYL Cycle LOW Time 4 .5 5 7 8 ns
tRPE Read Pulse after EF HIGH 8 10 12 14 n s
tFFA Clock to Asynchronous FF 8 10—12—14ns
tEFA Clock to Asynchronous EF 8 10—12—14ns
tPAFA Clock to Asynchronous Programmable Almost-Full Flag 8 1 0 12 14 ns
tPAEA Clock to Asynchronous Programmable Almost-Empty Flag 8 1 0 12 1 4 ns
tOLZ Output Enable to Output in Low Z(3) 0—0—00ns
tOE Output Enable to Output Valid 3.4 3.6 3.8 4.5 ns
tOHZ Output Enable to Output in High Z(3) 3.4 3.6 3.8 4.5 ns
tHF Clock to HF 8 10—12—14ns
NOTES:
1. All AC timings apply to both Standard IDT mode and First Word Fall Through mode.
2. Industrial temperature range product for the 5ns speed grade is available as a standard device. All other speed grades are available by special order.
3. Values guaranteed by design, not currently tested.
14
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
Input Pulse Levels 0.25 to 1.25V
Input Rise/Fall Times 0.4ns
Input Timing Reference Levels 0.75
Output Reference Levels VDDQ/2
HSTL
1.5V AC TEST CONDITIONS
Figure 2b. Lumped Capacitive Load, Typical Derating
AC TEST LOADS
Figure 2a. AC Test Load
Input Pulse Levels 0.4 to 1.4V
Input Rise/Fall Times 0.4ns
Input Timing Reference Levels 0.9
Output Reference Levels VDDQ/2
EXTENDED HSTL
1.8V AC TEST CONDITIONS
Input Pulse Levels GND to 2.5V
Input Rise/Fall Times 1ns
Input Timing Reference Levels VCC/2
Output Reference Levels VDDQ/2
2.5V LVTTL
2.5V AC TEST CONDITIONS
5909 drw04
50
VDDQ/2
I/O Z0 = 50
5909 drw04a
6
5
4
3
2
1
20 30 50 80 100 200
Capacitance (pF)
tCD
(Typical, ns)
NOTE:
1. VDDQ = 1.5V±.
NOTE:
1. VDDQ = 1.8V±.
NOTE:
1. For LVTTL VCC = VDDQ.
15
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
OUTPUT ENABLE & DISABLE TIMING
V
IH
OE
V
IL
tOE & tOLZ
VCC
2
VCC
2
100mV
100mV
tOHZ
100mV
100mV
Output
Normally
LOW
Output
Normally
HIGH
V
OL
V
OH
VCC
2
VCC
2
5909 drw04b
Output
Enable
Output
Disable
READ CHIP SELECT ENABLE & DISABLE TIMING
V
IH
RCS
V
IL
tENS
tENH
tRCSLZ
RCLK
VCC
2
VCC
2
100mV
100mV
tRCSHZ
100mV
100mV
Output
Normally
LOW
Output
Normally
HIGH
V
OL
V
OH
VCC
2
VCC
2
5909 drw04c
NOTES:
1. REN is HIGH.
2. RCS is LOW.
NOTES:
1. REN is HIGH.
2. OE is LOW.
16
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IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
FUNCTIONAL DESCRIPTION
TIMING MODES: IDT STANDARD vs FIRST WORD FALL THROUGH
(FWFT) MODE
The IDT72T1845/72T1855/72T1865/72T1875/72T1885/72T1895/
72T18105/72T18115/72T18125 support two different timing modes of opera-
tion: IDT Standard mode or First Word Fall Through (FWFT) mode. The
selection of which mode will operate is determined during Master Reset, by the
state of the FWFT/SI input.
If, at the time of Master Reset, FWFT/SI is LOW, then IDT Standard mode
will be selected. This mode uses the Empty Flag (EF) to indicate whether or not
there are any words present in the FIFO. It also uses the Full Flag function (FF)
to indicate whether or not the FIFO has any free space for writing. In IDT
Standard mode, every word read from the FIFO, including the first, must be
requested using the Read Enable (REN) and RCLK.
If, at the time of Master Reset, FWFT/SI is HIGH, then FWFT mode will be
selected. This mode uses Output Ready (OR) to indicate whether or not there
is valid data at the data outputs (Qn). It also uses Input Ready (IR) to indicate
whether or not the FIFO has any free space for writing. In the FWFT mode, the
first word written to an empty FIFO goes directly to Qn after three RCLK rising
edges, REN = LOW is not necessary. Subsequent words must be accessed
using the Read Enable (REN) and RCLK.
Various signals, both input and output signals operate differently depending
on which timing mode is in effect.
IDT STANDARD MODE
In this mode, the status flags, FF, PAF, HF, PAE, and EF operate in the
manner outlined in Table 3. To write data into to the FIFO, Write Enable (WEN)
must be LOW. Data presented to the DATA IN lines will be clocked into the FIFO
on subsequent transitions of the Write Clock (WCLK). After the first write is
performed, the Empty Flag (EF) will go HIGH. Subsequent writes will continue
to fill up the FIFO. The Programmable Almost-Empty flag (PAE) will go HIGH
after n + 1 words have been loaded into the FIFO, where n is the empty offset
value. The default setting for these values are stated in the footnote of Table 2.
This parameter is also user programmable. See section on Programmable Flag
Offset Loading.
If one continued to write data into the FIFO, and we assumed no read
operations were taking place, the Half-Full flag (HF) would toggle to LOW once
(D/2 + 1) words were written into the FIFO. If x18 Input or x18 Output bus Width
is selected, (D/2 + 1) = the 1,025th word for the IDT72T1845, 2,049th word for
IDT72T1855, 4,097th word for the IDT72T1865, 8,193rd word for the
IDT72T1875, 16,385th word for the IDT72T1885, 32,769th word for the
IDT72T1895, 65,537th word for the IDT72T18105, 131,073rd word for the
IDT72T18115 and 262,145th word for the IDT72T18125. If both x9 Input and
x9 Output bus Widths are selected, (D/2 + 1) = the 2,049th word for the
IDT72T1845, 4,097th word for IDT72T1855, 8,193rd word for the IDT72T1865,
16,385th word for the IDT72T1875, 32,769th word for the IDT72T1885,
65,537th word for the IDT72T1895, 131,073rd word for the IDT72T18105,
262,145th word for the IDT72T18115 and 524,289th word for the IDT72T18125.
Continuing to write data into the FIFO will cause the Programmable Almost-Full
flag (PAF) to go LOW. Again, if no reads are performed, the PAF will go LOW
after (D-m) writes to the FIFO. If x18 Input or x18 Output bus Width is selected,
(D-m) = (2,048-m) writes for the IDT72T1845, (4,096-m) writes for the
IDT72T1855, (8,192-m) writes for the IDT72T1865, (16,384-m) writes for the
IDT72T1875, (32,768-m) writes for the IDT72T1885, (65,536-m) writes for the
IDT72T1895, (131,072-m) writes for the IDT72T18105, (262,144-m) writes
for the IDT72T18115 and (524,288-m) writes for the IDT72T18125. If both x9
Input and x9 Output bus Widths are selected, (D-m) = (4,096-m) writes for the
IDT72T1845, (8,192-m) writes for the IDT72T1855, (16,384-m) writes for the
IDT72T1865, (32,768-m) writes for the IDT72T1875, (65,536-m) writes for the
IDT72T1885, (131,072-m) writes for the IDT72T1895, (262,144-m) writes for
the IDT72T18105, (524,288-m) writes for the IDT72T18115 and (1,048,576-m)
writes for the IDT72T18125. The offset “m” is the full offset value. The default
setting for these values are stated in the footnote of Table 2. This parameter is
also user programmable. See section on Programmable Flag Offset Loading.
When the FIFO is full, the Full Flag (FF) will go LOW, inhibiting further write
operations. If no reads are performed after a reset, FF will go LOW after D writes
to the FIFO. If the x18 Input or x18 Output bus Width is selected, D = 2,048 writes
for the IDT72T1845, 4,096 writes for the IDT72T1855, 8,192 writes for the
IDT72T1865, 16,384 writes for the IDT72T1875, 32,768 writes for the
IDT72T1885, 65,536 writes for the IDT72T1895, 131,072 writes for the
IDT72T18105, 262,144 writes for the IDT72T18115 and 524,288 writes for the
IDT72T18125. If both x9 Input and x9 Output bus Widths are selected, D = 4,096
writes for the IDT72T1845, 8,192 writes for the IDT72T1855, 16,384 writes for
the IDT72T1865, 32,768 writes for the IDT72T1875, 65,536 writes for the
IDT72T1885, 131,072 writes for the IDT72T1895, 262,144 writes for the
IDT72T18105, 524,288 writes for the IDT72T18115 and 1,048,576 writes for
the IDT72T18125, respectively.
If the FIFO is full, the first read operation will cause FF to go HIGH.
Subsequent read operations will cause PAF and HF to go HIGH at the conditions
described in Table 3. If further read operations occur, without write operations,
PAE will go LOW when there are n words in the FIFO, where n is the empty
offset value. Continuing read operations will cause the FIFO to become empty.
When the last word has been read from the FIFO, the EF will go LOW inhibiting
further read operations. REN is ignored when the FIFO is empty.
When configured in IDT Standard mode, the EF and FF outputs are double
register-buffered outputs.
Relevant timing diagrams for IDT Standard mode can be found in Figure
11, 12, 13 and 18.
FIRST WORD FALL THROUGH MODE (FWFT)
In this mode, the status flags, IR, PAF, HF, PAE, and OR operate in the
manner outlined in Table 4. To write data into to the FIFO, WEN must be LOW.
Data presented to the DATA IN lines will be clocked into the FIFO on subsequent
transitions of WCLK. After the first write is performed, the Output Ready (OR)
flag will go LOW. Subsequent writes will continue to fill up the FIFO. PAE will go
HIGH after n + 2 words have been loaded into the FIFO, where n is the empty
offset value. The default setting for these values are stated in the footnote of
Table 2. This parameter is also user programmable. See section on Program-
mable Flag Offset Loading.
If one continued to write data into the FIFO, and we assumed no read
operations were taking place, the HF would toggle to LOW once the (D/2 + 2)
words were written into the FIFO. If x18 Input or x18 Output bus Width is selected,
(D/2 + 2) = the 1,026th word for the IDT72T1845, 2,050th word for IDT72T1855,
4,098th word for the IDT72T1865, 8,194th word for the IDT72T1875, 16,386th
word for the IDT72T1885, 32,770th word for the IDT72T1895, 65,538th word
for the IDT72T18105, 131,074th word for the IDT72T18115 and 262,146th
word for the IDT72T18125. If both x9 Input and x9 Output bus Widths are
selected, (D/2 + 2) = the 2,050th word for the IDT72T1845, 4,098th word for
IDT72T1855, 8,194th word for the IDT72T1865, 16,386th word for the
IDT72T1875, 32,770th word for the IDT72T1885, 65,538th word for the
IDT72T1895, 131,074th word for the IDT72T18105, 262,146th word for the
IDT72T18115 and 524,290th word for the IDT72T18125. Continuing to write
data into the FIFO will cause the PAF to go LOW. Again, if no reads are
performed, the PAF will go LOW after (D-m) writes to the FIFO. If x18 Input or
x18 Output bus Width is selected, (D-m) = (2,049-m) writes for the IDT72T1845,
17
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TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
IDT72T18125. If both x9 Input and x9 Output bus Widths are selected, D = 4,097
writes for the IDT72T1845, 8,193 writes for the IDT72T1855, 16,385 writes
for the IDT72T1865, 32,769 writes for the IDT72T1875, 65,537 writes for the
IDT72T1885, 131,073 writes for the IDT72T1895, 262,145 writes for the
IDT72T18105, 524,289 writes for the IDT72T18115 and 1,048,577 writes for
the IDT72T18125, respectively. Note that the additional word in FWFT mode
is due to the capacity of the memory plus output register.
If the FIFO is full, the first read operation will cause the IR flag to go LOW.
Subsequent read operations will cause the PAF and HF to go HIGH at the
conditions described in Table 4. If further read operations occur, without write
operations, the PAE will go LOW when there are n + 1 words in the FIFO, where
n is the empty offset value. Continuing read operations will cause the FIFO to
become empty. When the last word has been read from the FIFO, OR will go
HIGH inhibiting further read operations. REN is ignored when the FIFO is
empty.
When configured in FWFT mode, the OR flag output is triple register-
buffered, and the IR flag output is double register-buffered.
Relevant timing diagrams for FWFT mode can be found in Figure 14, 15,
16 and 19.
PROGRAMMING FLAG OFFSETS
Full and Empty Flag offset values are user programmable. The IDT72T1845/
72T1855/72T1865/72T1875/72T1885/72T1895/72T18105/72T18115/
72T18125 have internal registers for these offsets. There are eight default offset
values selectable during Master Reset. These offset values are shown in Table
2. Offset values can also be programmed into the FIFO in one of two ways; serial
or parallel loading method. The selection of the loading method is done using
the LD (Load) pin. During Master Reset, the state of the LD input determines
whether serial or parallel flag offset programming is enabled. A HIGH on LD
during Master Reset selects serial loading of offset values. A LOW on LD during
Master Reset selects parallel loading of offset values.
In addition to loading offset values into the FIFO, it is also possible to read
the current offset values. Offset values can be read via the parallel output port
Q0-Qn, regardless of the programming mode selected (serial or parallel). It is
not possible to read the offset values in serial fashion.
Figure 3, Programmable Flag Offset Programming Sequence, summaries
the control pins and sequence for both serial and parallel programming modes.
For a more detailed description, see discussion that follows.
The offset registers may be programmed (and reprogrammed) any time
after Master Reset, regardless of whether serial or parallel programming has
been selected. Valid programming ranges are from 0 to D-1.
SYNCHRONOUS vs ASYNCHRONOUS PROGRAMMABLE FLAG
TIMING SELECTION
The IDT72T1845/72T1855/72T1865/72T1875/72T1885/72T1895/
72T18105/72T18115/72T18125 can be configured during the Master Reset
cycle with either synchronous or asynchronous timing for PAF and PAE flags
by use of the PFM pin.
If synchronous PAF/PAE configuration is selected (PFM, HIGH during
MRS), the PAF is asserted and updated on the rising edge of WCLK only and
not RCLK. Similarly, PAE is asserted and updated on the rising edge of RCLK
only and not WCLK. For detail timing diagrams, see Figure 23 for synchronous
PAF timing and Figure 24 for synchronous PAE timing.
If asynchronous PAF/PAE configuration is selected (PFM, LOW during
MRS), the PAF is asserted LOW on the LOW-to-HIGH transition of WCLK and
PAF is reset to HIGH on the LOW-to-HIGH transition of RCLK. Similarly, PAE
is asserted LOW on the LOW-to-HIGH transition of RCLK. PAE is reset to HIGH
on the LOW-to-HIGH transition of WCLK. For detail timing diagrams, see Figure 25
for asynchronous PAF timing and Figure 26 for asynchronous PAE timing.
(4,097-m) writes for the IDT72T1855, (8,193-m) writes for the IDT72T1865,
(16,385-m) writes for the IDT72T1875, (32,769-m) writes for the IDT72T1885,
(65,536-m) writes for the IDT72T1895, (131,073-m) writes for the IDT72T18105,
(262,145-m) writes for the IDT72T18115 and (524,289-m) writes for the
IDT72T18125. If both x9 Input and x9 Output bus Widths are selected, (D-m)
= (4,097-m) writes for the IDT72T1845, (8,193-m) writes for the IDT72T1855,
(16,385-m) writes for the IDT72T1865, (32,769-m) writes for the IDT72T1875,
(65,537-m) writes for the IDT72T1885, (131,073-m) writes for the IDT72T1895,
(262,145-m) writes for the IDT72T18105, (524,289-m) writes for the
IDT72T18115 and (1,048,577-m) writes for the IDT72T18125. The offset m
is the full offset value. The default setting for these values are stated in the footnote
of Table 2.
When the FIFO is full, the Input Ready (IR) flag will go HIGH, inhibiting further
write operations. If no reads are performed after a reset, IR will go HIGH after
D writes to the FIFO. If x18 Input or x18 Output bus Width is selected, D = 2,049
writes for the IDT72T1845, 4,097 writes for the IDT72T1855, 8,193 writes for
the IDT72T1865, 16,385 writes for the IDT72T1875, 32,769 writes for the
IDT72T1885, 65,536 writes for the IDT72T1895, 131,073 writes for the
IDT72T18105, 262,145 writes for the IDT72T18115 and 524,289 writes for the
TABLE 2 — DEFAULT PROGRAMMABLE
FLAG OFFSETS
NOTES:
1. n = empty offset for PAE.
2 . m = full offset for PAF.
3. As well as selecting serial programming mode, one of the default values will also
be loaded depending on the state of FSEL0 & FSEL1.
4. As well as selecting parallel programming mode, one of the default values will
also be loaded depending on the state of FSEL0 & FSEL1.
IDT72T1845 Offsets n,m
All Other x9 to x9
*LD FSEL1 FSEL0 Modes Mode
LHL 511 511
L L H 255 255
L L L 127 127
LHH 63 63
H L L 31 1,023
HHL 15 31
HLH 7 15
HHH 3 7
IDT72T1855, 72T1865, 72T1875, 72T1885,
72T1895, 72T18105, 72T181 15, 72T18125
*LD FSEL1 FSEL0 Offsets n,m
H L L 1,023
LHL 511
L L H 255
LLL 127
LHH 63
HHL 31
HLH 15
HHH 7
*LD FSEL1 FSEL0 Program Mode
H X X Serial(3)
L X X Parallel(4)
*THIS PIN MUST BE HIGH AFTER MASTER RESET TO WRITE
OR READ DAT A TO/FROM THE FIFO MEMORY.
18
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8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
0
1 to n
(1)
(n+1) to 1,024
1,025 to (2048-(m+1))
(2048-m) to 2,047
2,048
0
1 to n
(1)
(n+1) to 2,048
2,049 to (4,096-(m+1))
(4,096-m) to 4,095
4,096
TABLE 3 STATUS FLAGS FOR IDT STANDARD MODE
TABLE 4 STATUS FLAGS FOR FWFT MODE
FF PAF HF PAE EF
HHHL L
HHHL H
HHHHH
HHL HH
HLLHH
LLLHH
5909 drw05
IR PAF HF PAE OR
LH
HL H
LH
HLL
LH
HHL
LHLHL
LLLHL
HL
LHL
Number of
Words in
FIFO
IW = x18 or
OW = x18
IW = OW = x9 IDT72T18105IDT72T1895 IDT72T18115 IDT72T18125
0
1 to n+1
(1)
(n+2) to 32,769
32,770 to (65,537-(m+1))
(65,537-m) to 65,536
65,537
0
(n+2) to 65,537
65,538 to (131,073-(m+1))
(131,073-m) to 131,072
131,073
0
(n+2) to 131,073
131,074 to (262,145-(m+1))
262,145
(262,145-m) to 262,144
IDT72T18105 IDT72T18115 IDT72T18125
IDT72T1895
IDT72T1885
0
(n+2) to 262,145
262,146 to (524,289-(m+1))
(524,289-m) to 524,288
524,289
0
(n+2) to 524,289
524,290 to (1,048,577-(m+1))
1,048,577
(1,048,577-m) to 1,048,576
1 to n+1
(1)
1 to n+1
(1)
1 to n+1
(1)
1 to n+1
(1)
0
1 to n
(1)
(n+1) to 4,096
4,097 to (8,192-(m+1))
(8,192-m) to 8,191
8,192
0
1 to n (
1)
(n+1) to 8,192
8,193 to (16,384-(m+1))
(16,384-m) to 16,383
16,384
Number of
Words in
FIFO
IDT72T1855
IW = x18 or
OW = x18
IW = OW = x9 IDT72T1855IDT72T1845 IDT72T1865 IDT72T1875
IDT72T1865 IDT72T1875
IDT72T1845 IDT72T1885
0
1 to n
(1)
(n+1) to 16,384
16,385 to (32,768-(m+1))
(32,768-m) to 32,767
32,768
FF PAF HF PAE EF
HHHLL
HHHL H
HHHHH
HHLHH
HLLHH
LL
LHH
Number of
Words in
FIFO
IW = x18 or
OW = x18
IW = OW = x9 IDT72T18105IDT72T1895 IDT72T18115 IDT72T18125
0
1 to n
(1)
(n+1) to 32,768
32,769 to (65,536-(m+1))
(65,536-m) to 65,535
65,536
0
1 to n
(1)
(n+1) to 65,536
65,537 to (131,072-(m+1))
(131,072-m) to 131,071
131,072
0
1 to n
(1)
(n+1) to 131,072
131,073 to (262,144-(m+1))
262,144
(262,144-m) to 262,143
IDT72T18105 IDT72T18115 IDT72T18125
IDT72T1895
IDT72T1885
0
1 to n
(1)
(n+1) to 262,144
262,145 to (524,288-(m+1))
(524,288-m) to 524,287
524,288
0
1 to n
(1)
(n+1) to 524,288
524,289 to (1,048,576-(m+1))
1,048,576
(1,048,576-m) to 1,048,575
0
(n+2) to 1,025
1,026 to (2049-(m+1))
(2049-m) to 2,048
2,049
0
(n+2) to 2,049
2,050 to (4,097-(m+1))
(4,097-m) to 4,096
4,097
IR PAF HF PAE OR
LHHLH
LHHL L
LHHHL
LHLHL
LLLHL
HLLHL
0
(n+2) to 4,097
4,098 to (8,193-(m+1))
(8,193-m) to 8,192
8,193
0
(n+2) to 8,193
8,194 to (16,385-(m+1))
(16,385-m) to 16,384
16,385
Number of
Words in
FIFO
IDT72T1855
IW = x18 or
OW = x18
IW = OW = x9 IDT72T1855IDT72T1845 IDT72T1865 IDT72T1875
IDT72T1865 IDT72T1875
IDT72T1845 IDT72T1885
0
(n+2) to 16,385
16,386 to (32,769-(m+1))
(32,769-m) to 32,768
32,769
1 to n+1
(1)
1 to n+1
(1)
1 to n+1
(1)
1 to n+1
(1)
1 to n+1
(1)
NOTE:
1. See table 2 for values for n, m.
NOTE:
1. See table 2 for values for n, m.
2. Number of Words in FIFO = Depth + Output Register.
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FEBRUARY 10, 2009
Figure 3. Programmable Flag Offset Programming Sequence
WCLK RCLK
X
X
XX
X
X
XX
LD
0
0
X
1
1
1
0
WEN
0
1
1
0
X
1
1
REN
1
0
1
X
0
1
1X
SEN
1
1
1
X
X
X
0
No Operation
Write Memory
Read Memory
No Operation
Parallel write to registers:
Serial shift into registers:
Ending with Full Offset (MSB)
I
DT72T1845, IDT72T1855
IDT72T1865, IDT72T1875
IDT72T1885, IDT72T1895
IDT72T18105, IDT72T18115
IDT72T18125
24 bits for the IDT72T1845
26 bits for the IDT72T1855
28 bits for the IDT72T1865
30 bits for the IDT72T1875
32 bits for the IDT72T1885
34 bits for the IDT72T1895
36 bits for the IDT72T18105
38 bits for the IDT72T18115
40 bits for the IDT72T18125
1 bit for each rising SCLK edge
Starting with Empty Offset (LSB)
Serial shift into registers:
Ending with Full Offset (MSB)
22 bits for the IDT72T1845
24 bits for the IDT72T1855
26 bits for the IDT72T1865
28 bits for the IDT72T1875
30 bits for the IDT72T1885
32 bits for the IDT72T1895
34 bits for the IDT72T18105
36 bits for the IDT72T18115
38 bits for the IDT72T18125
1 bit for each rising SCLK edge
Starting with Empty Offset (LSB)
x9 to x9 Mode All Other Modes
5909 drw06
x18 input
Empty Offset
Full Offset
x18 input
(72T18105/115/125)
Empty Offset (LSB)
Empty Offset (MSB)
Full Offset (LSB)
Full Offset (MSB)
x9 input
Empty Offset (LSB)
Empty Offset (MSB)
Full Offset (LSB)
Full Offset (MSB)
x9 input
(72T1895/105/115/125)
Empty Offset (LSB)
Empty Offset
Empty Offset (MSB)
Full Offset (LSB)
Full Offset
Full Offset (MSB)
Parallel read from registers:
x18 input
Empty Offset
Full Offset
x18 input
(72T18105/115/125)
Empty Offset (LSB)
Empty Offset (MSB)
Full Offset (LSB)
Full Offset (MSB)
x9 input
Empty Offset (LSB)
Empty Offset (MSB)
Full Offset (LSB)
Full Offset (MSB)
x9 input
(72T1895/105/115/125)
Empty Offset (LSB)
Empty Offset
Empty Offset (MSB)
Full Offset (LSB)
Full Offset
Full Offset (MSB)
NOTES:
1. The programming method can only be selected at Master Reset.
2. Parallel reading of the offset registers is always permitted regardless of which programming method has been selected.
3. The programming sequence applies to both IDT Standard and FWFT modes.
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TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
Figure 3. Programmable Flag Offset Programming Sequence (Continued)
x9 to x9 Mode All Other Modes
# of Bits Used:
12 bits for the IDT72T1845
13 bits for the IDT72T1855
14 bits for the IDT72T1865
15 bits for the IDT72T1875
16 bits for the IDT72T1885
17 bits for the IDT72T1895
18 bits for the IDT72T18105
19 bits for the IDT72T18115
20 bits for the IDT72T18125
Note: All unused bits of the
LSB & MSB are don’t care
# of Bits Used:
Note: All unused bits of the
LSB & MSB are don’t care
11 bits for the IDT72T1845
12 bits for the IDT72T1855
13 bits for the IDT72T1865
14 bits for the IDT72T1875
15 bits for the IDT72T1885
16 bits for the IDT72T1895
17 bits for the IDT72T18105
18 bits for the IDT72T18115
19 bits for the IDT72T18125
D/Q8 D/Q0
EMPTY OFFSET REGISTER
12345678
1st Parallel Offset Write/Read Cycle
2nd Parallel Offset Write/Read Cycle
3rd Parallel Offset Write/Read Cycle
4th Parallel Offset Write/Read Cycle
D/Q8 D/Q0
EMPTY OFFSET REGISTER
910111213141516
D/Q8 D/Q0
FULL OFFSET REGISTER
12345678
D/Q8 D/Q0
EMPTY OFFSET REGISTER
17
5th Parallel Offset Write/Read Cycle
D/Q8 D/Q0
FULL OFFSET REGISTER
910111213141516
6th Parallel Offset Write/Read Cycle
D/Q8 D/Q0
17
FULL OFFSET REGISTER
IDT72T1895/72T18105/72T18115/72T18125
(1)
x9 Bus Width
D/Q8 D/Q0
EMPTY OFFSET REGISTER
12345678
1st Parallel Offset Write/Read Cycle
2nd Parallel Offset Write/Read Cycle
3rd Parallel Offset Write/Read Cycle
D/Q8 D/Q0
EMPTY OFFSET REGISTER
910111213141516
D/Q8 D/Q0
FULL OFFSET REGISTER
12345678
4th Parallel Offset Write/Read Cycle
D/Q8 D/Q0
FULL OFFSET REGISTER
910111213141516
IDT72T1845/72T1855/72T1865/72T1875/
72T1885/72T1895
(1)
x9 Bus Width
D/Q17 D/Q0D/Q16
EMPTY OFFSET REGISTER
Data Inputs/Outputs
# of Bits Used
123456789101112131415
16
1st Parallel Offset Write/Read Cycle
Data Inputs/Outputs
2nd Parallel Offset Write/Read Cycle
12345678101112131415 9
FULL OFFSET REGISTER
12345678910111213141516
12345678101112131415 9
Non-Interspersed
Parity
Interspersed
Parity
D/Q17 D/Q0
D/Q16
D/Q8
D/Q8
16
16
IDT72T1845/72T1855/72T1865/72T1875/
72T1885/72T1895
x18 Bus Width
4666 drw 06
D/Q17 D/Q0D/Q16
EMPTY OFFSET (LSB) REGISTER
Data Inputs/Outputs
# of Bits Used
123456789101112131415
EMPTY OFFSET (MSB) REGISTER
Data Inputs/Outputs
17
16
18
1st Parallel Offset Write/Read Cycle
2nd Parallel Offset Write/Read Cycle
Data Inputs/Outputs
Data Inputs/Outputs
3rd Parallel Offset Write/Read Cycle
4th Parallel Offset Write/Read Cycle
12345678101112131415 9
18 17
FULL OFFSET (LSB) REGISTER
12345678910111213141516
12345678101112131415 9
FULL OFFSET (MSB) REGISTER
1718
18 17
Non-Interspersed
Parity
Interspersed
Parity
D/Q17 D/Q0
D/Q16
D/Q17 D/Q0
D/Q16
D/Q17 D/Q0
D/Q16
D/Q8
D/Q8
16
16
IDT
72T18105/72T18115/72T18125
x18 Bus Width
5909 drw07
19
19
19
19
181920
181920
NOTES:
1. When programming the IDT72T1895 with an input bus width of x9 and output bus width of x18, 4 write cycles will be required. When Reading the IDT72T1895 with an output
bus width of x9 and input bus width of x18, 4 read cycles will be required. A total of 6 program/read cycles will be required if both the input and output bus widths are set to x9.
2. Consecutive reads of the offset registers is not permitted. The read operation must be disabled for a minimum of one RCLK cycle in between offset register accesses. (Please
refer to Figure 22, Parallel Read of Programmable Flag Registers (IDT Standard and FWFT Modes) for more details).
21
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
SERIAL PROGRAMMING MODE
If Serial Programming mode has been selected, as described above, then
programming of PAE and PAF values can be achieved by using a combination
of the LD, SEN, SCLK and SI input pins. Programming PAE and PAF proceeds
as follows: when LD and SEN are set LOW, data on the SI input are written, one
bit for each SCLK rising edge, starting with the Empty Offset LSB and ending
with the Full Offset MSB. If x9 to x9 mode is selected, a total of 24 bits for the
IDT72T1845, 26 bits for the IDT72T1855, 28 bits for the IDT72T1865, 30 bits
for the IDT72T1875, 32 bits for the IDT72T1885, 34 bits for the IDT72T1895,
36 bits for the IDT72T18105, 38 bits for the IDT72T18115 and 40 bits for the
IDT72T18125. For any other mode of operation (that includes x18 bus width
on either the Input or Output), minus 2 bits from the values above. So, a total
of 22 bits for the IDT72T1845, 24 bits for the IDT72T1855, 26 bits for the
IDT72T1865, 28 bits for the IDT72T1875, 30 bits for the IDT72T1885, 32 bits
for the IDT72T1895, 34 bits for the IDT72T18105, 36 bits for the IDT72T18115
and 38 bits for the IDT72T18125. See Figure 20, Serial Loading of Program-
mable Flag Registers, for the timing diagram for this mode.
Using the serial method, individual registers cannot be programmed
selectively. PAE and PAF can show a valid status only after the complete set
of bits (for all offset registers) has been entered. The registers can be
reprogrammed as long as the complete set of new offset bits is entered. When
LD is LOW and SEN is HIGH, no serial write to the registers can occur.
Write operations to the FIFO are allowed before and during the serial
programming sequence. In this case, the programming of all offset bits does not
have to occur at once. A select number of bits can be written to the SI input and
then, by bringing LD and SEN HIGH, data can be written to FIFO memory via
Dn by toggling WEN. When WEN is brought HIGH with LD and SEN restored
to a LOW, the next offset bit in sequence is written to the registers via SI. If an
interruption of serial programming is desired, it is sufficient either to set LD LOW
and deactivate SEN or to set SEN LOW and deactivate LD. Once LD and SEN
are both restored to a LOW level, serial offset programming continues.
From the time serial programming has begun, neither programmable flag
will be valid until the full set of bits required to fill all the offset registers has been
written. Measuring from the rising SCLK edge that achieves the above criteria;
PAF will be valid after three more rising WCLK edges plus tPAF, PAE will be valid
after the next three rising RCLK edges plus tPAE.
It is only possible to read the flag offset values via the parallel output port Qn.
PARALLEL MODE
If Parallel Programming mode has been selected, as described above, then
programming of PAE and PAF values can be achieved by using a combination
of the LD, WCLK , WEN and Dn input pins. If the FIFO is configured for an input
bus width and output bus width both set to x9, then the total number of write
operations required to program the offset registers is 4 for the IDT72T1845/
72T1855/72T1865/72T1875/72T1885 or 6 for the IDT72T1895/72T18105/
72T18115/72T18125. Refer to Figure 3, Programmable Flag Offset Pro-
gramming Sequence, for a detailed diagram of the data input lines D0-Dn used
during parallel programming. If the FIFO is configured for an input to output bus
width of x9 to x18, x18 to x9 or x18 to x18, then the following number of write
operations are required. For an input bus width of x18 a total of 2 write operations
will be required to program the offset registers for the IDT72T1845/72T1855/
72T1865/72T1875/72T1885/72T1895 or 4 for the IDT72T18105/72T18115/
72T18125. For an input bus width of x9 a total of 4 write operations will be
required to program the offset registers for the IDT72T1845/72T1855/72T1865/
72T1875/72T1885. A total of 6 will be required for the IDT72T1895/72T18105/
72T18115/72T18125. Refer to Figure 3, Programmable Flag Offset Pro-
gramming Sequence, for a detailed diagram.
For example, programming PAE and PAF on the IDT72T1895 configured
for x18 bus width proceeds as follows: when LD and WEN are set LOW, data
on the inputs Dn are written into the LSB of the Empty Offset Register on the first
LOW-to-HIGH transition of WCLK. Upon the second LOW-to-HIGH transition
of WCLK, data are written into the MSB of the Empty Offset Register. On the third
LOW-to-HIGH transition of WCLK, data are written into the LSB of the Full Offset
Register. On the fourth LOW-to-HIGH transition of WCLK, data are written into
the MSB of the Full Offset Register. The fifth LOW-to-HIGH transition of WCLK,
data are written, once again to the Empty Offset Register. Note that for x9 bus
width, one extra Write cycle is required for both the Empty Offset Register and
Full Offset Register. See Figure 21, Parallel Loading of Programmable Flag
Registers, for the timing diagram for this mode.
The act of writing offsets in parallel employs a dedicated write offset register
pointer. The act of reading offsets employs a dedicated read offset register
pointer. The two pointers operate independently; however, a read and a write
should not be performed simultaneously to the offset registers. A Master Reset
initializes both pointers to the Empty Offset (LSB) register. A Partial Reset has
no effect on the position of these pointers.
Write operations to the FIFO are allowed before and during the parallel
programming sequence. In this case, the programming of all offset registers does
not have to occur at one time. One, two or more offset registers can be written
and then by bringing LD HIGH, write operations can be redirected to the FIFO
memory. When LD is set LOW again, and WEN is LOW, the next offset register
in sequence is written to. As an alternative to holding WEN LOW and toggling
LD, parallel programming can also be interrupted by setting LD LOW and
toggling WEN.
Note that the status of a programmable flag (PAE or PAF) output is invalid
during the programming process. From the time parallel programming has
begun, a programmable flag output will not be valid until the appropriate offset
word has been written to the register(s) pertaining to that flag. Measuring from
the rising WCLK edge that achieves the above criteria; PAF will be valid after
two more rising WCLK edges plus tPAF, PAE will be valid after the next two rising
RCLK edges plus tPAE plus tSKEW2.
The act of reading the offset registers employs a dedicated read offset
register pointer. The contents of the offset registers can be read on the Q0-Qn
pins when LD is set LOW and REN is set LOW. It is important to note that
consecutive reads of the offset registers is not permitted. The read operation must
be disabled for a minimum of one RCLK cycle in between offset register
accesses. If the FIFO is configured for an input bus width and output bus width
both set to x9, then the total number of read operations required to read the offset
registers is 4 for the IDT72T1845/72T1855/72T1865/72T1875/72T1885 or 6
for the IDT72T1895/72T18105/72T18115/72T18125. Refer to Figure 3,
Programmable Flag Offset Programming Sequence, for a detailed diagram
of the data input lines D0-Dn used during parallel programming. If the FIFO is
configured for an input to output bus width of x9 to x18, x18 to x9 or x18 to x18,
then the following number of read operations are required: for an output bus
width of x18 a total of 2 read operations will be required to read the offset registers
for the IDT72T1845/72T1855/72T1865/72T1875/72T1885/72T1895 or 4 for
the IDT72T18105/72T18115/72T18125. For an output bus width of x9 a total
of 4 read operations will be required to read the offset registers for the
IDT72T1845/72T1855/72T1865/72T1875/72T1885. A total of 6 will be re-
quired for the IDT72T1895/72T18105/72T18115/72T18125. Refer to Figure
3, Programmable Flag Offset Programming Sequence, for a detailed diagram.
See Figure 22, Parallel Read of Programmable Flag Registers, for the timing
diagram for this mode.
It is permissible to interrupt the offset register read sequence with reads or
writes to the FIFO. The interruption is accomplished by deasserting REN, LD,
22
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
or both together. When REN and LD are restored to a LOW level, reading of
the offset registers continues where it left off. It should be noted, and care should
be taken from the fact that when a parallel read of the flag offsets is performed,
the data word that was present on the output lines Qn will be overwritten.
Parallel reading of the offset registers is always permitted regardless of
which timing mode (IDT Standard or FWFT modes) has been selected.
RETRANSMIT FROM MARK OPERATION
The Retransmit from Mark feature allows FIFO data to be read repeatedly
starting at a user-selected position. The FIFO is first put into retransmit mode that
will ‘mark’ a beginning word and also set a pointer that will prevent ongoing FIFO
write operations from over-writing retransmit data. The retransmit data can be
read repeatedly any number of times from the ‘marked’ position. The FIFO can
be taken out of retransmit mode at any time to allow normal device operation.
The ‘mark’ position can be selected any number of times, each selection over-
writing the previous mark location. Retransmit operation is available in both IDT
standard and FWFT modes.
During IDT standard mode the FIFO is put into retransmit mode by a Low-
to-High transition on RCLK when the ‘MARK’ input is HIGH and EF is HIGH.
The rising RCLK edge ‘marks’ the data present in the FIFO output register as
the first retransmit data. The FIFO remains in retransmit mode until a rising edge
on RCLK occurs while MARK is LOW.
Once a ‘marked’ location has been set (and the device is still in retransmit
mode, MARK is HIGH), a retransmit can be initiated by a rising edge on RCLK
while the retransmit input (RT) is LOW. REN must be HIGH (reads disabled)
before bringing RT LOW. The device indicates the start of retransmit setup by
setting EF LOW, also preventing reads. When EF goes HIGH, retransmit setup
is complete and read operations may begin starting with the first data at the MARK
location. Since IDT standard mode is selected, every word read including the
first ‘marked’ word following a retransmit setup requires a LOW on REN (read
enabled).
Note, write operations may continue as normal during all retransmit
functions, however write operations to the ‘marked’ location will be prevented.
See Figure 18, Retransmit from Mark (IDT standard mode), for the relevant
timing diagram.
During FWFT mode the FIFO is put into retransmit mode by a rising RCLK
edge when the ‘MARK’ input is HIGH and OR is LOW. The rising RCLK edge
‘marks’ the data present in the FIFO output register as the first retransmit data.
The FIFO remains in retransmit mode until a rising RCLK edge occurs while
MARK is LOW.
Once a marked location has been set (and the device is still in retransmit
can be initiated by a rising RCLK edge while the retransmit input (RT) is LOW.
REN must be HIGH (reads disabled) before bringing RT LOW. The device
indicates the start of retransmit setup by setting OR HIGH.
When OR goes LOW, retransmit setup is complete and on the next rising
RCLK edge after retransmit setup is complete, (RT goes HIGH), the contents
of the first retransmit location are loaded onto the output register. Since FWFT
mode is selected, the first word appears on the outputs regardless of REN, a
LOW on REN is not required for the first word. Reading all subsequent words
requires a LOW on REN to enable the rising RCLK edge. See Figure 19,
Retransmit from Mark timing (FWFT mode), for the relevant timing diagram.
Note, for the IDT72T1845/72T1855/72T1865/72T1875/72T1885/
72T1895 there must be a minimum of 32 bytes of data between the write pointer
and read pointer when the MARK is asserted, for the IDT72T18105/72T18115
there must be a minimum of 128 bytes and for the IDT72T18125 there must be
a minimum of 256 bytes. Remember, 2(x9) bytes = 1(x18) word. (32 bytes =
16 word = 8 long words). Also, once the MARK is set, the write pointer will not
increment past the “marked” location until the MARK is deasserted. This
prevents “overwriting” of retransmit data.
HSTL/LVTTL I/O
Both the write port and read port are user selectable between HSTL or
LVTTL I/O, via two select pins, WHSTL and RHSTL respectively. All other
control pins are selectable via SHSTL, see Table 5 for details of groupings.
Note, that when the write port is selected for HSTL mode, the user can reduce
the power consumption (in stand-by mode by utilizing the WCS input).
All “Static Pins” must be tied to VCC or GND. These pins are LVTTL only,
and are purely device configuration pins.
TABLE 5 — I/O CONFIGURATION
WHSTL SELECT RHSTL SELECT SHSTL SELECT STATIC PINS
WHSTL: HIGH = HSTL RHSTL: HIGH = HSTL SHSTL: HIGH = HSTL LVTTL ONLY
LOW = L VTTL LOW = L VTTL LOW = L VTTL
Dn (I/P) RCLK/RD (I/P) EF/OR (O/P) SCLK (I/P) PRS (I/P) IW (I/P) OW (I/P)
WCLK/WR (I/P) RCS (I/P) PAF (O/P) LD (I/P) TRST (I/P) BM (I/P) ASYW (I/P)
WEN (I/P) MARK (I/P) EREN (O/P) MRS (I/P) TDI (I/P) ASYR (I/P) BE (I/P)
WCS (I/P) REN (I/P) PAE (O/P) TCK (I/P) IP (I/P) FSEL0 (I/P)
OE (I/P) FF/IR (O/P) TMS (I/P) FSEL1 (I/P) PFM (I/P)
RT (I/P) HF (O/P) SEN (I/P) SHSTL (I/P) WHSTL (I/P)
Qn (O/P) ERCLK (O/P) FWFT/SI (I/P) RHSTL (I/P)
TDO (O/P)
23
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
SIGNAL DESCRIPTION
INPUTS:
DATA IN (D0 - Dn)
Data inputs for 18-bit wide data (D0 - D17) or data inputs for 9-bit wide data
(D0 - D8).
CONTROLS:
MASTER RESET ( MRS )
A Master Reset is accomplished whenever the MRS input is taken to a LOW
state. This operation sets the internal read and write pointers to the first location
of the RAM array. PAE will go LOW, PAF will go HIGH, and HF will go HIGH.
If FWFT/SI is LOW during Master Reset then the IDT Standard mode,
along with EF and FF are selected. EF will go LOW and FF will go HIGH. If
FWFT/SI is HIGH, then the First Word Fall Through mode (FWFT), along with
IR and OR, are selected. OR will go HIGH and IR will go LOW.
All control settings such as OW, IW, BE, RM, PFM and IP are defined during
the Master Reset cycle.
During a Master Reset, the output register is initialized to all zeroes. A Master
Reset is required after power up, before a write operation can take place. MRS
is asynchronous.
See Figure 9, Master Reset Timing, for the relevant timing diagram.
PARTIAL RESET (PRS)
A Partial Reset is accomplished whenever the PRS input is taken to a LOW
state. As in the case of the Master Reset, the internal read and write pointers
are set to the first location of the RAM array, PAE goes LOW, PAF goes HIGH,
and HF goes HIGH.
Whichever mode is active at the time of Partial Reset, IDT Standard mode
or First Word Fall Through, that mode will remain selected. If the IDT Standard
mode is active, then FF will go HIGH and EF will go LOW. If the First Word
Fall Through mode is active, then OR will go HIGH, and IR will go LOW.
Following Partial Reset, all values held in the offset registers remain
unchanged. The programming method (parallel or serial) currently active at
the time of Partial Reset is also retained. The output register is initialized to all
zeroes. PRS is asynchronous.
A Partial Reset is useful for resetting the device during the course of
operation, when reprogramming programmable flag offset settings may not be
convenient.
See Figure 10, Partial Reset Timing, for the relevant timing diagram.
ASYNCHRONOUS WRITE (ASYW)
The write port can be configured for either Synchronous or Asynchronous
mode of operation. If during Master Reset the ASYW input is LOW, then
Asynchronous operation of the write port will be selected. During Asynchro-
nous operation of the write port the WCLK input becomes WR input, this is the
Asynchronous write strobe input. A rising edge on WR will write data present
on the Dn inputs into the FIFO. (WEN must be tied LOW when using the write
port in Asynchronous mode).
When the write port is configured for Asynchronous operation the full flag
(FF) operates in an asynchronous manner, that is, the full flag will be updated
based in both a write operation and read operation. Note, if Asynchronous
mode is selected, FWFT is not permissable. Refer to Figures 30, 31, 34 and
35 for relevant timing and operational waveforms.
ASYNCHRONOUS READ (ASYR)
The read port can be configured for either Synchronous or Asynchronous
mode of operation. If during a Master Reset the ASYR input is LOW, then
Asynchronous operation of the read port will be selected. During Asynchro-
nous operation of the read port the RCLK input becomes RD input, this is the
Asynchronous read strobe input. A rising edge on RD will read data from the
FIFO via the output register and Qn port. (REN must be tied LOW during
Asynchronous operation of the read port).
The OE input provides three-state control of the Qn output bus, in an
asynchronous manner. (RCS, provides three-state control of the read port in
Synchronous mode).
When the read port is configured for Asynchronous operation the device
must be operating on IDT standard mode, FWFT mode is not permissible if the
read port is Asynchronous. The Empty Flag (EF) operates in an Asynchronous
manner, that is, the empty flag will be updated based on both a read operation
and a write operation. Refer to Figures 32, 33, 34 and 35 for relevant timing
and operational waveforms.
RETRANSMIT (RT)
The Retransmit (RT) input is used in conjunction with the MARK input,
together they provide a means by which data previously read out of the FIFO
can be reread any number of times. If retransmit operation has been selected
(i.e. the MARK input is HIGH), a rising edge on RCLK while RT is LOW will reset
the read pointer back to the memory location set by the user via the MARK input.
If IDT standard mode has been selected the EF flag will go LOW and remain
LOW for the time that RT is held LOW. RT can be held LOW for any number
of RCLK cycles, the read pointer being reset to the marked location. The next
rising edge of RCLK after RT has returned HIGH, will cause EF to go HIGH,
allowing read operations to be performed on the FIFO. The next read operation
will access data from the ‘marked’ memory location.
Subsequent retransmit operations may be performed, each time the read
pointer returning to the ‘marked’ location. See Figure 18, Retransmit from Mark
(IDT Standard mode) for the relevant timing diagram.
If FWFT mode has been selected the OR flag will go HIGH and remain HIGH
for the time that RT is held LOW. RT can be held LOW for any number of RCLK
cycles, the read pointer being reset to the ‘marked’ location. The next RCLK
rising edge after RT has returned HIGH, will cause OR to go LOW and due to
FWFT operation, the contents of the marked memory location will be loaded onto
the output register, a read operation being required for all subsequent data
reads.
Subsequent retransmit operations may be performed each time the read
pointer returning to the ‘marked’ location. See Figure 19, Retransmit from Mark
(FWFT mode) for the relevant timing diagram.
MARK
The MARK input is used to select Retransmit mode of operation. An RCLK
rising edge while MARK is HIGH will mark the memory location of the data
currently present on the output register, the device will also be placed into
retransmit mode. Note, for the IDT72T1845/72T1855/72T1865/72T1875/
72T1885/72T1895 there must be a minimum of 32 bytes of data between the
write pointer and read pointer when the MARK is asserted, for the IDT72T18105/
72T18115 there must be a minimum of 128 bytes and for the IDT72T18125
there must be a minimum of 256 bytes. Remember, 2(x9) bytes = 1(x18) word.
(32 bytes = 16 word = 8 long words). Also, once the MARK is set, the write
pointer will not increment past the “marked” location until the MARK is
deasserted. This prevents “overwriting” of retransmit data.
24
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
The MARK input must remain HIGH during the whole period of retransmit
mode, a falling edge of RCLK while MARK is LOW will take the device out of
retransmit mode and into normal mode. Any number of MARK locations can be
set during FIFO operation, only the last marked location taking effect. Once a
mark location has been set the write pointer cannot be incremented past this
marked location. During retransmit mode write operations to the device may
continue without hindrance.
FIRST WORD FALL THROUGH/SERIAL IN (FWFT/SI)
This is a dual purpose pin. During Master Reset, the state of the FWFT/
SI input determines whether the device will operate in IDT Standard mode or
First Word Fall Through (FWFT) mode.
If, at the time of Master Reset, FWFT/SI is LOW, then IDT Standard mode
will be selected. This mode uses the Empty Flag (EF) to indicate whether or
not there are any words present in the FIFO memory. It also uses the Full Flag
function (FF) to indicate whether or not the FIFO memory has any free space
for writing. In IDT Standard mode, every word read from the FIFO, including
the first, must be requested using the Read Enable (REN) and RCLK.
If, at the time of Master Reset, FWFT/SI is HIGH, then FWFT mode will be
selected. This mode uses Output Ready (OR) to indicate whether or not there
is valid data at the data outputs (Qn). It also uses Input Ready (IR) to indicate
whether or not the FIFO memory has any free space for writing. In the FWFT
mode, the first word written to an empty FIFO goes directly to Qn after three RCLK
rising edges, REN = LOW is not necessary. Subsequent words must be
accessed using the Read Enable (REN) and RCLK.
After Master Reset, FWFT/SI acts as a serial input for loading PAE and PAF
offsets into the programmable registers. The serial input function can only be
used when the serial loading method has been selected during Master Reset.
Serial programming using the FWFT/SI pin functions the same way in both IDT
Standard and FWFT modes.
WRITE STROBE & WRITE CLOCK (WR/WCLK)
If Synchronous operation of the write port has been selected via ASYW, this
input behaves as WCLK.
A write cycle is initiated on the rising edge of the WCLK input. Data setup
and hold times must be met with respect to the LOW-to-HIGH transition of the
WCLK. It is permissible to stop the WCLK. Note that while WCLK is idle, the FF/
IR, PAF and HF flags will not be updated. (Note that WCLK is only capable of
updating HF flag to LOW). The Write and Read Clocks can either be
independent or coincident.
If Asynchronous operation has been selected this input is WR (write strobe).
Data is Asynchronously written into the FIFO via the Dn inputs whenever there
is a rising edge on WR. In this mode the WEN input must be tied LOW.
WRITE ENABLE (WEN)
When the WEN input is LOW, data may be loaded into the FIFO RAM array
on the rising edge of every WCLK cycle if the device is not full. Data is stored
in the RAM array sequentially and independently of any ongoing read
operation.
When WEN is HIGH, no new data is written in the RAM array on each WCLK
cycle.
To prevent data overflow in the IDT Standard mode, FF will go LOW,
inhibiting further write operations. Upon the completion of a valid read cycle,
FF will go HIGH allowing a write to occur. The FF is updated by two WCLK
cycles + tSKEW after the RCLK cycle.
To prevent data overflow in the FWFT mode, IR will go HIGH, inhibiting
further write operations. Upon the completion of a valid read cycle, IR will go
LOW allowing a write to occur. The IR flag is updated by two WCLK cycles +
tSKEW after the valid RCLK cycle.
WEN is ignored when the FIFO is full in either FWFT or IDT Standard mode.
If Asynchronous operation of the write port has been selected, then WEN
must be held active, (tied LOW).
READ STROBE & READ CLOCK (RD/RCLK)
If Synchronous operation of the read port has been selected via ASYR, this
input behaves as RCLK. A read cycle is initiated on the rising edge of the RCLK
input. Data can be read on the outputs, on the rising edge of the RCLK input.
It is permissible to stop the RCLK. Note that while RCLK is idle, the EF/OR, PAE
and HF flags will not be updated. (Note that RCLK is only capable of updating
the HF flag to HIGH). The Write and Read Clocks can be independent or
coincident.
If Asynchronous operation has been selected this input is RD (Read
Strobe) . Data is Asynchronously read from the FIFO via the output register
whenever there is a rising edge on RD. In this mode the REN and RCS inputs
must be tied LOW. The OE input is used to provide Asynchronous control of the
three-state Qn outputs.
WRITE CHIP SELECT (WCS)
The WCS disables all Write Port inputs (data only) if it is held HIGH. To
perform normal operations on the write port, the WCS must be enabled, held
LOW.
READ ENABLE (REN)
When Read Enable is LOW, data is loaded from the RAM array into the
output register on the rising edge of every RCLK cycle if the device is not empty.
When the REN input is HIGH, the output register holds the previous data
and no new data is loaded into the output register. The data outputs Q0-Qn
maintain the previous data value.
In the IDT Standard mode, every word accessed at Qn, including the first
word written to an empty FIFO, must be requested using REN provided that
RCS is LOW. When the last word has been read from the FIFO, the Empty Flag
(EF) will go LOW, inhibiting further read operations. REN is ignored when the
FIFO is empty. Once a write is performed, EF will go HIGH allowing a read to
occur. The EF flag is updated by two RCLK cycles + tSKEW after the valid WCLK
cycle. Both RCS and REN must be active, LOW for data to be read out on the
rising edge of RCLK.
In the FWFT mode, the first word written to an empty FIFO automatically goes
to the outputs Qn, on the third valid LOW-to-HIGH transition of RCLK + tSKEW
after the first write. REN and RCS do not need to be asserted LOW for the First
Word to fall through to the output register. In order to access all other words,
a read must be executed using REN and RCS. The RCLK LOW-to-HIGH
transition after the last word has been read from the FIFO, Output Ready (OR)
will go HIGH with a true read (RCLK with REN = LOW;RCS = LOW), inhibiting
further read operations. REN is ignored when the FIFO is empty.
If Asynchronous operation of the Read port has been selected, then REN
must be held active, (tied LOW).
SERIAL ENABLE ( SEN )
The SEN input is an enable used only for serial programming of the offset
registers. The serial programming method must be selected during Master
Reset. SEN is always used in conjunction with LD. When these lines are both
LOW, data at the SI input can be loaded into the program register one bit for each
LOW-to-HIGH transition of SCLK.
When SEN is HIGH, the programmable registers retains the previous
settings and no offsets are loaded. SEN functions the same way in both IDT
Standard and FWFT modes.
25
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
OUTPUT ENABLE ( OE )
When Output Enable is enabled (LOW), the parallel output buffers receive
data from the output register. When OE is HIGH, the output data bus (Qn) goes
into a high impedance state. During Master or a Partial Reset the OE is the only
input that can place the output bus Qn, into High-Impedance. During Reset the
RCS input can be HIGH or LOW, it has no effect on the Qn outputs.
READ CHIP SELECT ( RCS )
The Read Chip Select input provides synchronous control of the Read
output port. When RCS goes LOW, the next rising edge of RCLK causes the
Qn outputs to go to the Low-Impedance state. When RCS goes HIGH, the next
RCLK rising edge causes the Qn outputs to return to HIGH Z. During a Master
or Partial Reset the RCS input has no effect on the Qn output bus, OE is the only
input that provides High-Impedance control of the Qn outputs. If OE is LOW the
Qn data outputs will be Low-Impedance regardless of RCS until the first rising
edge of RCLK after a Reset is complete. Then if RCS is HIGH the data outputs
will go to High-Impedance.
The RCS input does not effect the operation of the flags. For example, when
the first word is written to an empty FIFO, the EF will still go from LOW to HIGH
based on a rising edge of RCLK, regardless of the state of the RCS input.
Also, when operating the FIFO in FWFT mode the first word written to an
empty FIFO will still be clocked through to the output register based on RCLK,
regardless of the state of RCS. For this reason the user must take care when
a data word is written to an empty FIFO in FWFT mode. If RCS is disabled when
an empty FIFO is written into, the first word will fall through to the output register,
but will not be available on the Qn outputs which are in HIGH-Z. The user must
take RCS active LOW to access this first word, place the output bus in LOW-Z.
REN must remain disabled HIGH for at least one cycle after RCS has gone LOW.
A rising edge of RCLK with RCS and REN active LOW, will read out the next
word. Care must be taken so as not to lose the first word written to an empty
FIFO when RCS is HIGH. Refer to Figure 17, RCS and REN Read Operation
(FWFT Mode). The RCS pin must also be active (LOW) in order to perform
a Retransmit. See Figure 13 for Read Cycle and Read Chip Select Timing (IDT
Standard Mode). See Figure 16 for Read Cycle and Read Chip Select Timing
(First Word Fall Through Mode).
If Asynchronous operation of the Read port has been selected, then RCS
must be held active, (tied LOW). OE provides three-state control of Qn.
WRITE PORT HSTL SELECT (WHSTL)
The control inputs, data inputs and flag outputs associated with the write port
can be setup to be either HSTL or LVTTL. If WHSTL is HIGH during the Master
Reset, then HSTL operation of the write port will be selected. If WHSTL is LOW
at Master Reset, then LVTTL will be selected.
The inputs and outputs associated with the write port are listed in Table 5.
READ PORT HSTL SELECT (RHSTL)
The control inputs, data inputs and flag outputs associated with the read port
can be setup to be either HSTL or LVTTL. If RHSTL is HIGH during the Master
Reset, then HSTL operation of the read port will be selected. If RHSTL is LOW
at Master Reset, then LVTTL will be selected for the read port, then echo clock
and echo read enable will not be provided.
The inputs and outputs associated with the read port are listed in Table 5.
SYSTEM HSTL SELECT (SHSTL)
All inputs not associated with the write and read port can be setup to be either
HSTL or LVTTL. If SHSTL is HIGH during Master Reset, then HSTL operation
of all the inputs not associated with the write and read port will be selected. If
SHSTL is LOW at Master Reset, then LVTTL will be selected. The inputs
associated with SHSTL are listed in Table 5.
LOAD (LD)
This is a dual purpose pin. During Master Reset, the state of the LD input,
along with FSEL0 and FSEL1, determines one of eight default offset values for
the PAE and PAF flags, along with the method by which these offset registers
can be programmed, parallel or serial (see Table 2). After Master Reset, LD
enables write operations to and read operations from the offset registers. Only
the offset loading method currently selected can be used to write to the registers.
Offset registers can be read only in parallel.
After Master Reset, the LD pin is used to activate the programming process
of the flag offset values PAE and PAF. Pulling LD LOW will begin a serial loading
or parallel load or read of these offset values. THIS PIN MUST BE HIGH
AFTER MASTER RESET TO WRITE OR READ DATA TO/FROM THE FIFO
MEMORY.
BUS-MATCHING (IW, OW)
The pins IW and OW are used to define the input and output bus widths.
During Master Reset, the state of these pins is used to configure the device bus
sizes. See Table 1 for control settings. All flags will operate on the word/byte
size boundary as defined by the selection of bus width. See Figure 5 for Bus-
Matching Byte Arrangement.
BIG-ENDIAN/LITTLE-ENDIAN (BE)
During Master Reset, a LOW on BE will select Big-Endian operation. A
HIGH on BE during Master Reset will select Little-Endian format. This function
is useful when data is written into the FIFO in word format (x18) and read out
of the FIFO in word format (x18) or byte format (x9). If Big-Endian mode is
selected, then the most significant byte of the word written into the FIFO will be
read out of the FIFO first, followed by the least significant byte. If Little-Endian
format is selected, then the least significant byte of the word written into the FIFO
will be read out first, followed by the most significant byte. The mode desired
is configured during master reset by the state of the Big-Endian (BE) pin. See
Figure 5 for Bus-Matching Byte Arrangement.
PROGRAMMABLE FLAG MODE (PFM)
During Master Reset, a LOW on PFM will select Asynchronous Program-
mable flag timing mode. A HIGH on PFM will select Synchronous Program-
mable flag timing mode. If asynchronous PAF/PAE configuration is selected
(PFM, LOW during MRS), the PAE is asserted LOW on the LOW-to-HIGH
transition of RCLK. PAE is reset to HIGH on the LOW-to-HIGH transition of
WCLK. Similarly, the PAF is asserted LOW on the LOW-to-HIGH transition of
WCLK and PAF is reset to HIGH on the LOW-to-HIGH transition of RCLK.
If synchronous PAE/PAF configuration is selected (PFM, HIGH during
MRS) , the PAE is asserted and updated on the rising edge of RCLK only and
not WCLK. Similarly, PAF is asserted and updated on the rising edge of WCLK
only and not RCLK. The mode desired is configured during master reset by
the state of the Programmable Flag Mode (PFM) pin.
INTERSPERSED PARITY (IP)
During Master Reset, a LOW on IP will select Non-Interspersed Parity
mode. A HIGH will select Interspersed Parity mode. The IP bit function allows
the user to select the parity bit in the word loaded into the parallel port (D0-Dn)
when programming the flag offsets. If Interspersed Parity mode is selected, then
the FIFO will assume that the parity bit is located in bit position D8 and D17 during
the parallel programming of the flag offsets, and will therefore ignore D8 when
loading the offset register in parallel mode. This is also applied to the output
register when reading the value of the offset register. If Interspersed Parity is
selected then output Q8 will be invalid. If Non-Interspersed Parity mode is
selected, then D16 and D17 are the parity bits and are ignored during parallel
26
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
programming of the offsets. (D8 becomes a valid bit). Additionally, output Q8 will
become a valid bit when performing a read of the offset register. IP mode is
selected during Master Reset by the state of the IP input pin.
OUTPUTS:
FULL FLAG (FF/IR)
This is a dual purpose pin. In IDT Standard mode, the Full Flag (FF) function
is selected. When the FIFO is full, FF will go LOW, inhibiting further write
operations. When FF is HIGH, the FIFO is not full. If no reads are performed
after a reset (either MRS or PRS), FF will go LOW after D writes to the FIFO.
If x18 Input or x18 Output bus Width is selected, D = 2,048 for the IDT72T1845,
4,096 for the IDT72T1855, 8,192 for the IDT72T1865, 16,384 for the
IDT72T1875, 32,768 for the IDT72T1885, 65,536 for the IDT72T1895,
131,072 writes for the IDT72T18105, 262,144 writes for the IDT72T18115 and
524,288 writes for the IDT72T18125. If both x9 Input and x9 Output bus Widths
are selected, D = 4,096 for the IDT72T1845, 8,192 for the IDT72T1855,
16,384 for the IDT72T1865, 32,768 for the IDT72T1875, 65,536 for the
IDT72T1885, 131,072 for the IDT72T1895, 262,144 writes for the
IDT72T18105, 524,288 writes for the IDT72T18115 and 1,048,576 writes for
the IDT72T18125. See Figure 11, Write Cycle and Full Flag Timing (IDT
Standard Mode), for the relevant timing information.
In FWFT mode, the Input Ready (IR) function is selected. IR goes LOW
when memory space is available for writing in data. When there is no longer
any free space left, IR goes HIGH, inhibiting further write operations. If no reads
are performed after a reset (either MRS or PRS), IR will go HIGH after D writes
to the FIFO. If x18 Input or x18 Output bus Width is selected, D = 2,049 for the
IDT72T1845, 4,097 for the IDT72T1855, 8,193 for the IDT72T1865, 16,385
for the IDT72T1875, 32,769 for the IDT72T1885, 65,537 for the IDT72T1895,
131,073 writes for the IDT72T18105, 262,145 writes for the IDT72T18115 and
524,289 writes for the IDT72T18125. If both x9 Input and x9 Output bus Widths
are selected, D = 4,097 for the IDT72T1845, 8,193 for the IDT72T1855, 16,385
for the IDT72T1865, 32,769 for the IDT72T1875, 65,537 for the IDT72T1885,
131,073 for the IDT72T1895, 262,145 writes for the IDT72T18105, 524,289
writes for the IDT72T18115 and 1,048,577 writes for the IDT72T18125. See
Figure 14, Write Timing (FWFT Mode), for the relevant timing information.
The IR status not only measures the contents of the FIFO memory, but also
counts the presence of a word in the output register. Thus, in FWFT mode, the
total number of writes necessary to deassert IR is one greater than needed to
assert FF in IDT Standard mode.
FF/IR is synchronous and updated on the rising edge of WCLK. FF/IR are
double register-buffered outputs.
Note, when the device is in Retransmit mode, this flag is a comparison of the
write pointer to the ‘marked’ location. This differs from normal mode where this
flag is a comparison of the write pointer to the read pointer.
EMPTY FLAG (EF/OR)
This is a dual purpose pin. In the IDT Standard mode, the Empty Flag (EF)
function is selected. When the FIFO is empty, EF will go LOW, inhibiting further
read operations. When EF is HIGH, the FIFO is not empty. See Figure 12, Read
Cycle, Empty Flag and First Word Latency Timing (IDT Standard Mode), for
the relevant timing information.
In FWFT mode, the Output Ready (OR) function is selected. OR goes LOW
at the same time that the first word written to an empty FIFO appears valid on
the outputs. OR stays LOW after the RCLK LOW to HIGH transition that shifts the
last word from the FIFO memory to the outputs. OR goes HIGH only with a true
read (RCLK with REN = LOW). The previous data stays at the outputs, indicating
the last word was read. Further data reads are inhibited until OR goes LOW
again. See Figure 15, Read Timing (FWFT Mode), for the relevant timing
information.
EF/OR is synchronous and updated on the rising edge of RCLK.
In IDT Standard mode, EF is a double register-buffered output. In FWFT
mode, OR is a triple register-buffered output.
PROGRAMMABLE ALMOST-FULL FLAG (PAF)
The Programmable Almost-Full flag (PAF) will go LOW when the FIFO
reaches the almost-full condition. In IDT Standard mode, if no reads are
performed after reset (MRS), PAF will go LOW after (D-m) words are written
to the FIFO. If x18 Input or x18 Output bus Width is selected, (D-m) = (2,048-m)
writes for the IDT72T1845, (4,096-m) writes for the IDT72T1855, (8,192-m)
writes for the IDT72T1865, (16,384-m) writes for the IDT72T1875, (32,768-m)
writes for the IDT72T1885, (65,536-m) writes for the IDT72T1895, (131,072-m)
writes for the IDT72T18105, (262,144-m) writes for the IDT72T18115 and
(524,288-m) writes for the IDT72T18125. If both x9 Input and x9 Output bus
Widths are selected, (D-m) = (4,096-m) writes for the IDT72T1845, (8,192-m)
writes for the IDT72T1855, (16,384-m) writes for the IDT72T1865, (32,768-m)
writes for the IDT72T1875, (65,536-m) writes for the IDT72T1885, (131,072-m)
writes for the IDT72T1895, (262,144-m) writes for the IDT72T18105,
(524,288-m) writes for the IDT72T18115 and (1,048,576-m) writes for the
IDT72T18125. The offset “m” is the full offset value. The default setting for this
value is stated in Table 2.
In FWFT mode, if x18 Input or x18 Output bus Width is selected, the PAF
will go LOW after (2,049-m) writes for the IDT72T1845, (4,097-m) writes for the
IDT72T1855, (8,193-m) writes for the IDT72T1865, (16,385-m) writes for the
IDT72T1875, (32,769-m) writes for the IDT72T1885, (65,537-m) writes for the
IDT72T1895, (131,073-m) writes for the IDT72T18105, (262,145-m) writes
for the IDT72T18115 and (524,289-m) writes for the IDT72T18125. If both x9
Input and x9 Output bus Widths are selected, the PAF will go LOW after (4,097-
m) writes for the IDT72T1845, (8,193-m) writes for the IDT72T1855, (16,385-m)
writes for the IDT72T1865, (32,769-m) writes for the IDT72T1875, (65,537-m)
writes for the IDT72T1885, (131,073-m) writes for the IDT72T1895, (262,145-
m) writes for the IDT72T18105, (524,289-m) writes for the IDT72T18115
and (1,048,577-m) writes for the IDT72T18125. The offset m is the full offset
value. The default setting for this value is stated in Table 2.
See Figure 23, Synchronous Programmable Almost-Full Flag Timing (IDT
Standard and FWFT Mode), for the relevant timing information.
If asynchronous PAF configuration is selected, the PAF is asserted LOW
on the LOW-to-HIGH transition of the Write Clock (WCLK). PAF is reset to HIGH
on the LOW-to-HIGH transition of the Read Clock (RCLK). If synchronous PAF
configuration is selected, the PAF is updated on the rising edge of WCLK. See
Figure 25 for Asynchronous Programmable Almost-Full Flag Timing (IDT
Standard and FWFT Mode).
Note, when the device is in Retransmit mode, this flag is a comparison of the
write pointer to the ‘marked’ location. This differs from normal mode where this
flag is a comparison of the write pointer to the read pointer.
PROGRAMMABLE ALMOST-EMPTY FLAG (PAE)
The Programmable Almost-Empty flag (PAE) will go LOW when the FIFO
reaches the almost-empty condition. In IDT Standard mode, PAE will go LOW
when there are n words or less in the FIFO. The offset “n” is the empty offset
value. The default setting for this value is stated in Table 2.
In FWFT mode, the PAE will go LOW when there are n+1 words or less
in the FIFO. The default setting for this value is stated in Table 2.
See Figure 24, Synchronous Programmable Almost-Empty Flag Timing
(IDT Standard and FWFT Mode), for the relevant timing information.
27
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
If asynchronous PAE configuration is selected, the PAE is asserted LOW
on the LOW-to-HIGH transition of the Read Clock (RCLK). PAE is reset to HIGH
on the LOW-to-HIGH transition of the Write Clock (WCLK). If synchronous PAE
configuration is selected, the PAE is updated on the rising edge of RCLK. See
Figure 26, Asynchronous Programmable Almost-Empty Flag Timing (IDT
Standard and FWFT Mode), for the relevant timing information.
HALF-FULL FLAG (HF)
This output indicates a half-full FIFO. The rising WCLK edge that fills the FIFO
beyond half-full sets HF LOW. The flag remains LOW until the difference
between the write and read pointers becomes less than or equal to half of the
total depth of the device; the rising RCLK edge that accomplishes this condition
sets HF HIGH.
In IDT Standard mode, if no reads are performed after reset (MRS or PRS),
HF will go LOW after (D/2 + 1) writes to the FIFO. If x18 Input or x18 Output
bus Width is selected, D = 2,048 for the IDT72T1845, 4,096 for the IDT72T1855,
8,192 for the IDT72T1865, 16,384 for the IDT72T1875, 32,768 for the
IDT72T1885, 65,536 for the IDT72T1895, 131,072 for the IDT72T18105,
262,144 for the IDT72T18115 and 524,288 for the IDT72T18125. If both x9
Input and x9 Output bus Widths are selected, D = 4,096 for the IDT72T1845,
8,192 for the IDT72T1855, 16,384 for the IDT72T1865, 32,768 for the
IDT72T1875, 65,536 for the IDT72T1885, 131,072 for the IDT72T1895,
262,144 for the IDT72T18105, 524,288 for the IDT72T18115 and 1,048,576
for the IDT72T18125.
In FWFT mode, if no reads are performed after reset (MRS or PRS), HF
will go LOW after (D-1/2 + 2) writes to the FIFO. If x18 Input or x18 Output bus
Width is selected, D = 2,049 for the IDT72T1845, 4,097 for the IDT72T1855,
8,193 for the IDT72T1865, 16,385 for the IDT72T1875, 32,769 for the
IDT72T1885, 65,537 for the IDT72T1895, 131,073 for the IDT72T18105,
262,145 for the IDT72T18115 and 524,289 for the IDT72T18125. If both x9
Input and x9 Output bus Widths are selected, D = 4,097 for the IDT72T1845,
8,193 for the IDT72T1855, 16,385 for the IDT72T1865, 32,769 for the
IDT72T1875, 65,537 for the IDT72T1885, 131,073 for the IDT72T1895,
262,145 for the IDT72T18105, 524,289 for the IDT72T18115 and 1,048,577
for the IDT72T18125.
See Figure 27, Half-Full Flag Timing (IDT Standard and FWFT Mode),
for the relevant timing information. Because HF is updated by both RCLK and
WCLK, it is considered asynchronous.
ECHO READ CLOCK (ERCLK)
The Echo Read Clock output is provided in both HSTL and LVTTL mode,
selectable via RHSTL. The ERCLK is a free-running clock output, it will always
follow the RCLK input regardless of REN, RCS.
The ERCLK output follows the RCLK input with an associated delay. This
delay provides the user with a more effective read clock source when reading
data from the Qn outputs. This is especially helpful at high speeds when
variables within the device may cause changes in the data access times. These
variations in access time maybe caused by ambient temperature, supply
voltage, device characteristics. The ERCLK output also compensates for any
trace length delays between the Qn data outputs and receiving devices inputs.
Any variations effecting the data access time will also have a corresponding
effect on the ERCLK output produced by the FIFO device, therefore the ERCLK
output level transitions should always be at the same position in time relative to
the data outputs. Note, that ERCLK is guaranteed by design to be slower than
the slowest Qn, data output. Refer to Figure 4, Echo Read Clock and Data
Output Relationship, Figure 28, Echo Read Clock & Read Enable Operation
and Figure 29, Echo RCLK & Echo REN Operation for timing information.
ECHO READ ENABLE (EREN)
The Echo Read Enable output is provided in both HSTL and LVTTL mode,
selectable via RHSTL.
The EREN output is provided to be used in conjunction with the ERCLK
output and provides the reading device with a more effective scheme for reading
data from the Qn output port at high speeds. The EREN output is controlled by
internal logic that behaves as follows: The EREN output is active LOW for the
RCLK cycle that a new word is read out of the FIFO. That is, a rising edge of
RCLK will cause EREN to go active, LOW if both REN and RCS are active, LOW
and the FIFO is NOT empty.
SERIAL CLOCK (SCLK)
During serial loading of the programming flag offset registers, a rising edge
on the SCLK input is used to load serial data present on the SI input provided
that the SEN input is LOW.
DATA OUTPUTS (Q0-Qn)
(Q0 - Q17) data outputs for 18-bit wide data or (Q0 - Q8) data outputs for
9-bit wide data.
5909 drw08
ERCLK
tAtD
Q
SLOWEST
(3)
RCLK
tERCLK
tERCLK
Figure 4. Echo Read Clock and Data Output Relationship
NOTES:
1. REN is LOW;RCS is LOW.
2. tERCLK > tA, guaranteed by design.
3. Qslowest is the data output with the slowest access time, tA.
4. Time, tD is greater than zero, guaranteed by design.
28
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
D17-D9
A
A
B
B
(a) x18 INPUT to x18 OUTPUT - BIG ENDIAN
(b) x18 INPUT to x18 OUTPUT - LITTLE ENDIAN
Write to FIFO
Read from FIFO
BYTE ORDER ON INPUT PORT:
BYTE ORDER ON OUTPUT PORT:
BA
Read from FIFO
A
(c) x18 INPUT to x9 OUTPUT - BIG ENDIAN
1st: Read from FIFO
B2nd: Read from FIFO
B
(d) x18 INPUT to x9 OUTPUT - LITTLE ENDIAN
1st: Read from FIFO
A2nd: Read from FIFO
A
(a) x9 INPUT to x18 OUTPUT - BIG ENDIAN
1st: Write to FIFO
BYTE ORDER ON INPUT PORT:
B2nd: Write to FIFO
BYTE ORDER ON OUTPUT PORT:
AB
Read from FIFO
(a) x9 INPUT to x18 OUTPUT - LITTLE ENDIAN
BARead from FIFO
5909 drw09
BE IW OW
H L H
BE IW OW
L H L
BE IW OW
H H L
BE IW OW
L L H
BE IW OW
H L L
BE IW OW
L L L
D8-D0
Q17-Q9 Q8-Q0
Q17-Q9 Q8-Q0
Q17-Q9 Q8-Q0
Q17-Q9 Q8-Q0
Q17-Q9 Q8-Q0
Q17-Q9 Q8-Q0
D17-D9 D8-D0
D17-Q9 D8-Q0
Q17-Q9 Q8-Q0
Q17-Q9 Q8-Q0
Figure 5. Bus-Matching Byte Arrangement
29
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TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
Figure 6. Standard JTAG Timing
SYSTEM INTERFACE PARAMETERS
Parameter Symbol Test
Conditions Min. Max. Units
JTAG Clock Input Period tTCK - 100 - ns
JTAG Clock HIGH tTCKHIGH -40-ns
JTAG Clock Low tTCKLOW -40-ns
JTAG Clock Rise Time tTCKRISE --5
(1) ns
JTAG Clock Fall Time tTCKFALL --5
(1) ns
JTAG Reset tRST -50-ns
JTAG Reset Recovery tRSR -50-ns
JTAG
AC ELECTRICAL CHARACTERISTICS
(vcc = 2.5V ± 5%; Tcase = 0°C to +85°C)
IDT72T1845
IDT72T1855
IDT72T1865
IDT72T1875
IDT72T1885
IDT72T1895
IDT72T18105
IDT72T18115
IDT72T18125
Parameter Symbol Test Conditions Min. Max. Units
Data Output tDO(1) -20ns
Data Output Hold tDOH(1) 0-ns
Data Input tDS trise=3ns 10 - ns
tDH tfall=3ns 10 -
NOTE:
1. 50pf loading on external output signals.
JTAG TIMING SPECIFICATION
NOTE:
1. Guaranteed by design.
t4
t3
TDO
TDO
TDI/
TMS
TCK
TRST
t
DO
Notes to diagram:
t1 =
tTCKLOW
t2 =
tTCKHIGH
t3 =
tTCKFALL
t4 = tTCKRISE
t5 =
tRST
(reset pulse width)
t6 = tRSR (reset recovery)
5909 drw10
t5
t6
t1t2
t
TCK
t
DH
t
DS
30
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FEBRUARY 10, 2009
JTAG INTERFACE
Five additional pins (TDI, TDO, TMS, TCK and TRST) are provided to
support the JTAG boundary scan interface. The IDT72T1845/72T1855/
72T1865/72T1875/72T1885/72T1895/72T18105/72T18115/72T18125 in-
corporates the necessary tap controller and modified pad cells to implement the
JTAG facility.
Note that IDT provides appropriate Boundary Scan Description Language
program files for these devices.
The Standard JTAG interface consists of four basic elements:
Test Access Port (TAP)
TAP controller
Instruction Register (IR)
Data Register Port (DR)
The following sections provide a brief description of each element. For a
complete description refer to the IEEE Standard Test Access Port Specification
(IEEE Std. 1149.1-1990).
The Figure below shows the standard Boundary-Scan Architecture.
Figure 7. Boundary Scan Architecture
TEST ACCESS PORT (TAP)
The Tap interface is a general-purpose port that provides access to the
internal of the processor. It consists of four input ports (TCLK, TMS, TDI, TRST)
and one output port (TDO).
THE TAP CONTROLLER
The Tap controller is a synchronous finite state machine that responds to
TMS and TCLK signals to generate clock and control signals to the Instruction
and Data Registers for capture and update of data.
T
A
P
TAP
Cont-
roller
Mux
DeviceID Reg.
Boundary Scan Reg.
Bypass Reg.
clkDR, ShiftDR
UpdateDR
TDO
TDI
TMS
TCLK
TRST
clklR, ShiftlR
UpdatelR
Instruction Register
Instruction Decode
Control Signals
5909 drw11
31
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8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
Figure 8. TAP Controller State Diagram
Test-Logic
Reset
Run-Test/
Idle
1
0
0
Select-
DR-Scan
Select-
IR-Scan
111
Capture-IR
0
Capture-DR
0
0
EXit1-DR
1
Pause-DR
0
Exit2-DR
1
Update-DR
1
Exit1-IR
1
Exit2-IR
1
Update-IR
1
10
1
1
1
5909 drw12
0
Shift-DR
0
0
0
Shift-IR
0
0
Pause-IR
0
1
Input = TMS
0
01
Refer to the IEEE Standard Test Access Port Specification (IEEE Std.
1149.1) for the full state diagram
All state transitions within the TAP controller occur at the rising edge of the
TCLK pulse. The TMS signal level (0 or 1) determines the state progression
that occurs on each TCLK rising edge. The TAP controller takes precedence
over the FIFO memory and must be reset after power up of the device. See
TRST description for more details on TAP controller reset.
Test-Logic-Reset All test logic is disabled in this controller state enabling the
normal operation of the IC. The TAP controller state machine is designed in such
a way that, no matter what the initial state of the controller is, the Test-Logic-Reset
state can be entered by holding TMS at high and pulsing TCK five times. This
is the reason why the Test Reset (TRST) pin is optional.
Run-Test-Idle In this controller state, the test logic in the IC is active only if
certain instructions are present. For example, if an instruction activates the self
test, then it will be executed when the controller enters this state. The test logic
in the IC is idles otherwise.
Select-DR-Scan This is a controller state where the decision to enter the
Data Path or the Select-IR-Scan state is made.
Select-IR-Scan This is a controller state where the decision to enter the
Instruction Path is made. The Controller can return to the Test-Logic-Reset state
other wise.
Capture-IR In this controller state, the shift register bank in the Instruction
Register parallel loads a pattern of fixed values on the rising edge of TCK. The
last two significant bits are always required to be “01”.
Shift-IR In this controller state, the instruction register gets connected
between TDI and TDO, and the captured pattern gets shifted on each rising edge
of TCK. The instruction available on the TDI pin is also shifted in to the instruction
register.
Exit1-IR This is a controller state where a decision to enter either the Pause-
IR state or Update-IR state is made.
Pause-IR This state is provided in order to allow the shifting of instruction
register to be temporarily halted.
Exit2-DR This is a controller state where a decision to enter either the Shift-
IR state or Update-IR state is made.
Update-IR In this controller state, the instruction in the instruction register is
latched in to the latch bank of the Instruction Register on every falling edge of
TCK. This instruction also becomes the current instruction once it is latched.
Capture-DR In this controller state, the data is parallel loaded in to the data
registers selected by the current instruction on the rising edge of TCK.
Shift-DR, Exit1-DR, Pause-DR, Exit2-DR and Update-DR These
controller states are similar to the Shift-IR, Exit1-IR, Pause-IR, Exit2-IR and
Update-IR states in the Instruction path.
NOTES:
1. Five consecutive TCK cycles with TMS = 1 will reset the TAP.
2. TAP controller does not automatically reset upon power-up. The user must provide a reset to the TAP controller (either by TRST or TMS).
3. TAP controller must be reset before normal FIFO operations can begin.
32
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FEBRUARY 10, 2009
THE INSTRUCTION REGISTER
The Instruction register allows an instruction to be shifted in serially into the
processor at the rising edge of TCLK.
The Instruction is used to select the test to be performed, or the test data
register to be accessed, or both. The instruction shifted into the register is latched
at the completion of the shifting process when the TAP controller is at Update-
IR state.
The instruction register must contain 4 bit instruction register-based cells
which can hold instruction data. These mandatory cells are located nearest the
serial outputs they are the least significant bits.
TEST DATA REGISTER
The Test Data register contains three test data registers: the Bypass, the
Boundary Scan register and Device ID register.
These registers are connected in parallel between a common serial input
and a common serial data output.
The following sections provide a brief description of each element. For a
complete description, refer to the IEEE Standard Test Access Port Specification
(IEEE Std. 1149.1-1990).
TEST BYPASS REGISTER
The register is used to allow test data to flow through the device from TDI
to TDO. It contains a single stage shift register for a minimum length in serial path.
When the bypass register is selected by an instruction, the shift register stage
is set to a logic zero on the rising edge of TCLK when the TAP controller is in
the Capture-DR state.
The operation of the bypass register should not have any effect on the
operation of the device in response to the BYPASS instruction.
THE BOUNDARY-SCAN REGISTER
The Boundary Scan Register allows serial data TDI be loaded in to or read
out of the processor input/output ports. The Boundary Scan Register is a part
of the IEEE 1149.1-1990 Standard JTAG Implementation.
THE DEVICE IDENTIFICATION REGISTER
The Device Identification Register is a Read Only 32-bit register used to
specify the manufacturer, part number and version of the processor to be
determined through the TAP in response to the IDCODE instruction.
IDT JEDEC ID number is 0xB3. This translates to 0x33 when the parity is
dropped in the 11-bit Manufacturer ID field.
For the IDT72T1845/72T1855/72T1865/72T1875/72T1885/72T1895/
72T18105/72T18115/72T18125, the Part Number field contains the following
values:
IDT72T1845/55/65/75/85/95/105/115/125 JTAG Device Identification Register
31(MSB) 28 27 12 11 1 0(LSB)
V ersion (4 bits) Part Number (16-bit) Manufacturer ID (1 1-bit)
0X0 0X33 1
JTAG INSTRUCTION REGISTER
The Instruction register allows instruction to be serially input into the device
when the TAP controller is in the Shift-IR state. The instruction is decoded to
perform the following:
Select test data registers that may operate while the instruction is
current. The other test data registers should not interfere with chip
operation and the selected data register.
Define the serial test data register path that is used to shift data between
TDI and TDO during data register scanning.
The Instruction Register is a 4 bit field (i.e. IR3, IR2, IR1, IR0) to decode
16 different possible instructions. Instructions are decoded as follows.
Hex Instruction Function
Value
0x00 EXTEST Select Boundary Scan Register
0x02 IDCODE Select Chip Identification data register
0x01 SAMPLE/PRELOAD Select Boundary Scan Register
0x03 HIGH-IMPEDANCE JTAG
0x0F BYPASS Select Bypass Register
JTAG Instruction Register Decoding
The following sections provide a brief description of each instruction. For
a complete description refer to the IEEE Standard Test Access Port Specification
(IEEE Std. 1149.1-1990).
EXTEST
The required EXTEST instruction places the IC into an external boundary-
test mode and selects the boundary-scan register to be connected between TDI
and TDO. During this instruction, the boundary-scan register is accessed to
drive test data off-chip via the boundary outputs and receive test data off-chip
via the boundary inputs. As such, the EXTEST instruction is the workhorse of
IEEE. Std 1149.1, providing for probe-less testing of solder-joint opens/shorts
and of logic cluster function.
IDCODE
The optional IDCODE instruction allows the IC to remain in its functional mode
and selects the optional device identification register to be connected between
TDI and TDO. The device identification register is a 32-bit shift register containing
information regarding the IC manufacturer, device type, and version code.
Accessing the device identification register does not interfere with the operation
of the IC. Also, access to the device identification register should be immediately
available, via a TAP data-scan operation, after power-up of the IC or after the
TAP has been reset using the optional TRST pin or by otherwise moving to the
Test-Logic-Reset state.
SAMPLE/PRELOAD
The required SAMPLE/PRELOAD instruction allows the IC to remain in a
normal functional mode and selects the boundary-scan register to be connected
between TDI and TDO. During this instruction, the boundary-scan register can
be accessed via a date scan operation, to take a sample of the functional data
entering and leaving the IC. This instruction is also used to preload test data into
the boundary-scan register before loading an EXTEST instruction.
Device Part# Field
IDT72T1845 040E
IDT72T1855 040D
IDT72T1865 040C
IDT72T1875 040B
IDT72T1885 040A
IDT72T1895 0409
IDT72T18105 0419
IDT72T18115 0418
IDT72T18125 0417
33
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FEBRUARY 10, 2009
HIGH-IMPEDANCE
The optional High-Impedance instruction sets all outputs (including two-state
as well as three-state types) of an IC to a disabled (high-impedance) state and
selects the one-bit bypass register to be connected between TDI and TDO.
During this instruction, data can be shifted through the bypass register from TDI
to TDO without affecting the condition of the IC outputs.
BYPASS
The required BYPASS instruction allows the IC to remain in a normal
functional mode and selects the one-bit bypass register to be connected
between TDI and TDO. The BYPASS instruction allows serial data to be
transferred through the IC from TDI to TDO without affecting the operation of
the IC.
34
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8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
Figure 9. Master Reset Timing
5909 drw13
RT
SEN
tRSF
tRSF
OE = HIGH
OE = LOW
PAE
PAF, HF
Q0 - Qn
tRSF
EF/OR
FF/IR
tRSF
tRSF If FWFT = HIGH, OR = HIGH
If FWFT = LOW, EF = LOW
If FWFT = LOW, FF = HIGH
If FWFT = HIGH, IR = LOW
tRSS
tRSS
PFM
tHRSS
IP
tRS
MRS
tRSR
REN
tRSS
FWFT/SI
tRSR
tRSR
WEN
FSEL0,
FSEL1
OW, IW
BE
LD
tRSR
tRSS
WHSTL
RHSTL
SHSTL
tRSS
tRSS
tRSS
tRSS
tRSS
tRSS
tRSS
tHRSS
tHRSS
NOTE:
1 . During Master Reset the High-Impedance control of the Qn data outputs is provided by OE only, RCS can be HIGH or LOW until the first rising edge of RCLK after Master Reset
is complete.
35
COMMERCIAL AND INDUSTRIAL
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8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
Figure 10. Partial Reset Timing
tRS
PRS
tRSR
REN
tRSS
5909 drw14
tRSR
WEN
RT
SEN
tRSF
tRSF
OE = HIGH
OE = LOW
PAE
PAF, HF
Q0 - Qn
tRSF
EF/OR
FF/IR
tRSF
tRSF If FWFT = HIGH, OR = HIGH
If FWFT = LOW, EF = LOW
If FWFT = LOW, FF = HIGH
If FWFT = HIGH, IR = LOW
tRSS
tRSS
tRSS
NOTE:
1 . During Partial Reset the High-Impedance control of the Qn data outputs is provided by OE only, RCS can be HIGH or LOW until the first rising edge of RCLK after Master Reset
is complete.
36
COMMERCIAL AND INDUSTRIAL
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FEBRUARY 10, 2009
Figure 11. Write Cycle and Full Flag Timing (IDT Standard Mode)
D
0
- D
n
WEN
RCLK
REN
t
ENH
t
ENH
Q
0
- Q
nDATA READ NEXT DATA READ
t
SKEW1
(1)
5909 drw15
WCLK
NO WRITE
1212
NO WRITE
t
WFF
t
A
t
ENS
t
ENS
(1)
t
DS
t
A
D
X
t
DH
t
CLK
t
CLKH
FF
RCS
t
ENS
t
RCSLZ
t
WFF
t
SKEW1
t
CLKL
D
X+1
t
WFF
t
WFF
t
DS
t
DH
Figure 12. Read Cycle, Output Enable, Empty Flag and First Data Word Latency (IDT Standard Mode)
5909 drw16
D0 - Dn
t
DS
t
DH
D
0
D
1
t
DS
t
DH
NO OPERATION
RCLK
REN
EF
t
CLK
t
CLKH
t
CLKL
t
ENH
t
REF
t
A
t
OLZ
Q0 - Qn
OE
WCLK
(1)
tSKEW1
WEN
t
ENS
t
ENS
t
ENH
12
t
OLZ
NO OPERATION
LAST WORD D
0
D
1
t
ENS
t
ENH
t
OHZ
LAST WORD
t
REF
t
ENH
t
ENS
t
A
t
A
t
REF
t
ENS
t
ENH
WCS
t
OE
t
WCSS
t
WCSH
NOTES:
1. tSKEW1 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that EF will go HIGH (after one RCLK cycle plus tREF). If the time between the
rising edge of WCLK and the rising edge of RCLK is less than tSKEW1, then EF deassertion may be delayed one extra RCLK cycle.
2. LD = HIGH.
3. First data word latency = tSKEW1 + 1*TRCLK + tREF.
4. RCS is LOW.
NOTES:
1. tSKEW1 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that FF will go HIGH (after one WCLK cycle pus tWFF). If the time between the
rising edge of the RCLK and the rising edge of the WCLK is less than tSKEW1, then the FF deassertion may be delayed one extra WCLK cycle.
2. LD = HIGH, OE = LOW, EF = HIGH.
3. WCS = LOW.
37
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FEBRUARY 10, 2009
Figure 13. Read Cycle and Read Chip Select (IDT Standard Mode)
RCLK
REN
12
5909 drw 17
RCS
Q0 - Qn
WCLK
WEN
Dn
t
ENS
LAST DATA
D
x
t
ENS
t
ENS
t
ENS
EF
t
A
t
REF
t
REF
t
RCSLZ
LAST DATA-1
t
RCSHZ
t
RCSLZ
t
A
t
RCSHZ
t
SKEW1
(1)
t
ENH
t
ENS
t
DH
t
DS
t
ENH
NOTES:
1. tSKEW1 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that EF will go HIGH (after one RCLK cycle plus tREF). If the time between the
rising edge of WCLK and the rising edge of RCLK is less than tSKEW1, then EF deassertion may be delayed one extra RCLK cycle.
2. LD = HIGH.
3. First data word latency = tSKEW1 + 1*TRCLK + tREF.
4. OE is LOW.
38
COMMERCIAL AND INDUSTRIAL
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FEBRUARY 10, 2009
Figure 14. Write Timing (First Word Fall Through Mode)
NOTES:
1. tSKEW1 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that OR will go LOW after two RCLK cycles plus tREF. If the time between the rising edge of WCLK and the rising edge of RCLK
is less than tSKEW1, then OR assertion may be delayed one extra RCLK cycle.
2. tSKEW2 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that PAE will go HIGH after one RCLK cycle plus tPAES. If the time between the rising edge of WCLK and the rising edge of RCLK
is less than tSKEW2, then the PAE deassertion may be delayed one extra RCLK cycle.
3. LD = HIGH, OE = LOW
4. n = PAE offset, m = PAF offset and D = maximum FIFO depth.
5 . If x18 input or x18 output bus width is selected, D=2,049 for IDT72T1845, 4,097 for IDT72T1855, 8,193 for IDT72T1865, 16,385 for IDT72T1875, 32,769 for IDT72T1885, 65,537 for IDT72T1895, 131,073 for IDT72T18105, 262,145
for IDT72T18115, 524,288 for IDT72T18125.
If both x9 input and x9 output bus widths are selected, D=4,097 for IDT72T1845, 8,193 for IDT72T1855, 16,385 for IDT72T1865, 32,769 for IDT72T1875, 65,537 for IDT72T1885, 131,073 for IDT72T1895, 262,144 for IDT72T18105,
524,288 for IDT72T18115, 1,048,576 for IDT72T18125.
6. First data word latency = tSKEW1 + 2*TRCLK + tREF.
W
1
W
2
W
4
W
[n +2]
W
[D-m-1]
W
[D-m-2]
W
[D-1]
W
D
W
[n+3]
W
[n+4]
W
[D-m]
W
[D-m+1]
WCLK
WEN
D0 - Dn
RCLK
t
DH
t
DS
t
SKEW1
(1)
REN
Q0 - Qn
PAF
HF
PAE
IR
t
DS
t
DS
t
DS
t
SKEW2
t
A
t
REF
OR
t
PAES
t
HF
t
PAFS
t
WFF
W
[D-m+2]
W
1
t
ENH
5909 drw18
PREVIOUS DATA IN OUTPUT REGISTER
(2)
W
3
123
1
D-1
2+1
][
W
D-1
+2
][
W
2
D-1
+3
][
W
2
12
t
ENS
RCS
t
RCSLZ
t
ENS
39
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
Figure 15. Read Timing (First Word Fall Through Mode)
NOTES:
1. tSKEW1 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that IR will go LOW after one WCLK cycle plus tWFF. If the time between the rising edge of RCLK and the rising edge of WCLK
is less than tSKEW1, then the IR assertion may be delayed one extra WCLK cycle.
2. tSKEW2 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that PAF will go HIGH after one WCLK cycle plus tPAFS. If the time between the rising edge of RCLK and the rising edge of WCLK
is less than tSKEW2, then the PAF deassertion may be delayed one extra WCLK cycle.
3. LD = HIGH.
4. n = PAE Offset, m = PAF offset and D = maximum FIFO depth.
5 . If x18 input or x18 output bus width is selected, D=2,049 for IDT72T1845, 4,097 for IDT72T1855, 8,193 for IDT72T1865, 16,385 for IDT72T1875, 32,769 for IDT72T1885, 65,537 for IDT72T1895, 131,073 for IDT72T18105, 262,145
for IDT72T18115, 524,288 for IDT72T18125.
If both x9 input and x9 output bus widths are selected, D=4,097 for IDT72T1845, 8,193 for IDT72T1855, 16,385 for IDT72T1865, 32,769 for IDT72T1875, 65,537 for IDT72T1885, 131,073 for IDT72T1895, 262,144 for IDT72T18105,
524,288 for IDT72T18115, 1,048,576 for IDT72T18125.
6. RCS = LOW.
WCLK 12
WEN
D0 - Dn
RCLK
t
ENS
REN
Q0 - Qn
PAF
HF
PAE
IR
OR
W
1
W
1
W
2
W
3
W
m+2
W
[m+3]
t
OHZ
t
SKEW1
t
ENH
t
DS
t
DH
t
OE
t
A
t
A
t
A
t
PAFS
t
WFF
t
WFF
t
ENS
OE
t
SKEW2
W
D
5909 drw19
t
PAES
W
[D-n]
W
[D-n-1]
t
A
t
A
t
HF
t
REF
W
[D-1]
W
D
t
A
W
[D-n+1]
W
[m+4]
W
[D-n+2]
(1) (2)
t
ENS
D-1 + 1
][
W
2D-1 + 2
][
W
2
1
40
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
Figure 16. Read Cycle and Read Chip Select Timing (First Word Fall Through Mode)
WCLK
12
WEN
D0 - Dn
RCLK
REN
Q0 - Qn
PAF
HF
PAE
IR
OR
W
1
W
2
W
3
W
m+2
W
[m+3]
t
RCSHZ
t
SKEW1
t
ENH
t
DS
t
DH
t
A
t
A
t
PAFS
t
WFF
t
WFF
t
ENS
RCS
t
SKEW2
W
D
5909 drw20
t
PAES
W
[D-n]
W
[D-n-1]
t
A
t
A
W
[D-1]
W
D
t
A
W
[D-n+1]
W
[m+4]
W
[D-n+2]
(1) (2)
t
ENS
1
t
ENS
t
RCSLZ
t
ENS
t
HF
t
REF
D-1
+ 1
][
W2
D-1
+ 2
][
W2
t
ENH
NOTES:
1. tSKEW1 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that IR will go LOW after one WCLK cycle plus tWFF. If the time between the rising edge of RCLK and the rising edge of WCLK
is less than tSKEW1, then the IR assertion may be delayed one extra WCLK cycle.
2. tSKEW2 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that PAF will go HIGH after one WCLK cycle plus tPAFS. If the time between the rising edge of RCLK and the rising edge of WCLK
is less than tSKEW2, then the PAF deassertion may be delayed one extra WCLK cycle.
3. LD = HIGH.
4. n = PAE Offset, m = PAF offset and D = maximum FIFO depth.
5 . If x18 input or x18 output bus width is selected, D=2,049 for IDT72T1845, 4,097 for IDT72T1855, 8,193 for IDT72T1865, 16,385 for IDT72T1875, 32,769 for IDT72T1885, 65,537 for IDT72T1895, 131,073 for IDT72T18105, 262,145
for IDT72T18115, 524,288 for IDT72T18125.
If both x9 input and x9 output bus widths are selected, D=4,097 for IDT72T1845, 8,193 for IDT72T1855, 16,385 for IDT72T1865, 32,769 for IDT72T1875, 65,537 for IDT72T1885, 131,073 for IDT72T1895, 262,144 for IDT72T18105,
524,288 for IDT72T18115, 1,048,576 for IDT72T18125.
6. OE = LOW.
41
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
Figure 17 .
RCSRCS
RCSRCS
RCS
and
RENREN
RENREN
REN
Read Operation (FWFT Mode)
NOTES:
1 . It is very important that the REN be held HIGH for at least one cycle after RCS has gone LOW. If REN goes LOW on the same cycle as RCS or earlier, then Word, W1 will be lost, Word, W2 will be read on the output when the
bus goes to LOW-Z.
2. The 1st Word will fall through to the output register regardless of REN and RCS. However, subsequent reads require that both REN and RCS be active, LOW.
WCLK
RCLK
REN
Qn
12
WEN
3
t
ENS
t
ENH
t
ENS
t
ENS
t
ENS
t
ENH
t
ENS
t
REF
t
REF
RCS
OR
t
RCSLZ
W1 W2
t
RCSHZ
t
RCSLZ
t
A
W2
t
SKEW
t
ENS
t
ENH
W2
Dn
t
DH
t
DS
t
DH
t
DS
W1
1st Word falls through to
O/P register on this cycle
5909 drw21
HIGH-Z
42
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
tREF
tENS
tENH
5909 drw22
tENS
WMK-1
WCLK
RCLK
REN
RT
EF
PAF
HF
PAE
Qn
12
1
tPAFS
tREF
2
WEN
tENS
tA
tENS
WMK WMK+1
tAtA
WMK+n
tA
WMK WMK+1
tA
tENS
MARK
tENH
tENS
tPAES(6)
tA
tSKEW2
tHF
3
Figure 18. Retransmit from Mark (IDT Standard Mode)
NOTES:
1. Retransmit setup is complete when EF returns HIGH.
2. OE = LOW;RCS = LOW.
3. RT must be HIGH when reading from FIFO.
4. Once Mark is set, the write pointer will not increment past the ‘marked’ location, preventing overwrites of Retransmit data.
5 . Before a “MARK” can be set there must be at least 32 bytes of data between the Write Pointer and Read Pointer locations for the IDT72T1845/72T1855/72T1865/72T1875/72T1885/72T1895, 64 bytes of data for the IDT72T18105/
72T18115 and 128 bytes of data for the IDT72T18125. (32 bytes = 16 words = 8 long words).
6. A transition in the PAE flag may occur one RCLK cycle earlier than shown, (on cycle 2).
43
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
Figure 19. Retransmit from Mark (First Word Fall Through Mode)
t
REF
t
ENS
t
ENH
5909 drw23
t
ENS
W
MK-1
WCLK
RCLK
REN
RT
OR
PAF
HF
PAE
Q
n
12
1
t
PAFS
t
REF
2
WEN
t
ENS
t
A
t
ENS
W
MK
W
MK+1
t
A
t
A
W
MK+n
t
A
W
MK+1
W
MK+2
t
A
t
ENS
MARK
t
ENH
t
ENS
t
PAES
(6)
t
A
t
SKEW2
t
HF
W
MK
t
A
3
NOTES:
1. Retransmit setup is complete when OR returns LOW.
2. OE = LOW;RCS = LOW.
3. RT must be HIGH when reading from FIFO.
4. Once Mark is set, the write pointer will not increment past the ‘marked’ location, preventing overwrites of Retransmit data.
5 . Before a “MARK” can be set there must be at least 32 bytes of data between the Write Pointer and Read Pointer locations for the IDT72T1845/72T1855/72T1865/72T1875/72T1885/72T1895, 64 bytes of data for the IDT72T18105/
72T18115 and 128 bytes of data for the IDT72T18125. (32 bytes = 16 words = 8 long words).
6. A transition in the PAE flag may occur one RCLK cycle earlier than shown, (on cycle 2).
44
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
Figure 20. Serial Loading of Programmable Flag Registers (IDT Standard and FWFT Modes)
NOTES:
1. x9 to x9 mode: X =12 for the IDT72T1845, X = 13 for the IDT72T1855, X = 14 for the IDT72T1865, X = 15 for the IDT72T1875, X = 16 for the IDT72T1885, X = 17 for the IDT72T1895,
X = 18 for the IDT72T18105, X = 19 for the IDT72T18115 and X = 20 for the IDT72T18125.
2. All other modes: X=11 for the IDT72T1845, X = 12 for the IDT72T1855, X = 13 for the IDT72T1865, X = 14 for the IDT72T1875, X = 15 for the IDT72T1885 and X = 16 for the IDT72T1895,
X = 17 for the IDT72T18105, X = 18 for the IDT72T18115 and X = 19 for the IDT72T18125.
SCLK
SEN
SI
5909 drw24
LD
EMPTY OFFSET
FULL OFFSET
BIT X(1)
tSENS
tLDS
tSDS
tSENH
tLDS
BIT X(1) BIT 1
tENH
tLDH
tSDH
tSCLK
tSCKH tSCKL
BIT 1
NOTES:
1. OE = LOW.
2. The timing diagram illustrates reading of offset registers with an output bus width of 18 bits.
3 . The offset registers cannot be read on consecutive RCLK cycles. The read must be disabled (REN = HIGH) for a minimum of one RCLK cycle in between register accesses.
Figure 22. Parallel Read of Programmable Flag Registers (IDT Standard and FWFT Modes)
Figure 21. Parallel Loading of Programmable Flag Registers (IDT Standard and FWFT Modes)
NOTES:
1. This timing diagram is based on programming with a x18 bus width.
2. Overwrites previous offset value.
WCLK
LD
WEN
D
0
- D
17
5909 drw25
t
LDS
t
ENS
PAE OFFSET
t
DS
t
DH
t
LDH
t
ENH
t
CLK
t
CLKH
t
CLKL
PAF OFFSET PAE(2) OFFSET PAF(2) OFFSET
t
DH
t
DH
t
DH
t
DS
t
DS
t
DS
t
LDH
t
ENH
RCLK
LD
REN
Q
0
- Q
17 DATA IN OUTPUT REGISTER PAE OFFSET VALUE PAF OFFSET VALUE
5909 drw26
t
LDH
t
ENH
t
CLK
t
CLKL
t
CLKH
t
A
t
LDS
t
LDH
t
LDS
t
LDH
t
LDS
t
ENS
t
ENH
t
ENS
t
ENH
t
ENS
t
A
PAE OFFSET
t
A
45
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
NOTES:
1 . m = PAF offset .
2. D = maximum FIFO depth.
In IDT Standard mode: if x18 Input or x18 Output bus Width is selected, D = 2,048 for the IDT72T1845, 4,096 for the IDT72T1855, 8,192 for the IDT72T1865, 16,384 for the IDT72T1875,
32,768 for the IDT72T1885, 65,536 for the IDT72T1895, 131,072 for the IDT72T18105, 262,144 for the IDT72T18115 and 524,288 for the IDT72T18125. If both x9 Input and x9
Output bus Widths are selected, D = 4,096 for the IDT72T1845, 8,192 for the IDT72T1855, 16,384 for the IDT72T1865, 32,768 for the IDT72T1875, 65,536 for the IDT72T1885,
131,072 for the IDT72T1895, 262,144 for the IDT72T18105, 524,288 for the IDT72T18115 and 1,048,576 for the IDT72T18125.
In FWFT mode: if x18 Input or x18 Output bus Width is selected, D = 2,049 for the IDT72T1845, 4,097 for the IDT72T1855, 8,193 for the IDT72T1865, 16,385 for the IDT72T1875,
32,769 for the IDT72T1885, 65,537 for the IDT72T1895, 131,073 for the IDT72T18105, 262,145 for the IDT72T18115 and 524,289 for the IDT72T18125. If both x9 Input and x9
Output bus Widths are selected, D = 4,097 for the IDT72T1845, 8,193 for the IDT72T1855, 16,385 for the IDT72T1865, 32,769 for the IDT72T1875, 65,537 for the IDT72T1885,
131,073 for the IDT72T1895, 262,145 for the IDT72T18105, 524,289 for the IDT72T18115 and 1,048,577 for the IDT72T18125.
3. tSKEW2 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that PAF will go HIGH (after one WCLK cycle plus tPAFS). If the time between the
rising edge of RCLK and the rising edge of WCLK is less than tSKEW2, then the PAF deassertion time may be delayed one extra WCLK cycle.
4. PAF is asserted and updated on the rising edge of WCLK only.
5. Select this mode by setting PFM HIGH during Master Reset.
6. RCS is LOW.
Figure 23. Synchronous Programmable Almost-Full Flag Timing (IDT Standard and FWFT Modes)
WCLK
WEN
PAF
RCLK
REN
5909 drw27
1212
D-(m+1) words
in FIFO
(2)
D - m words in FIFO
(2)
D - (m +1) words in FIFO
(2)
t
ENH
t
ENS
t
PAFS
t
ENS
t
ENH
t
CLKL
t
SKEW2
(3)
t
PAFS
t
CLKL
NOTES:
1 . n = PAE offset.
2. For IDT Standard mode
3. For FWFT mode.
4.
tSKEW2 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that PAE will go HIGH (after one RCLK cycle plus tPAES). If the time between the
rising edge of WCLK and the rising edge of RCLK is less than tSKEW2, then the PAE deassertion may be delayed one extra RCLK cycle.
5. PAE is asserted and updated on the rising edge of WCLK only.
6. Select this mode by setting PFM HIGH during Master Reset.
7. RCS = LOW. Figure 24. Synchronous Programmable Almost-Empty Flag Timing (IDT Standard and FWFT Modes)
WCLK
WEN
PAE
RCLK
12 12
REN
5909 drw28
n + 1 words in FIFO
(2)
,
n + 2 words in FIFO
(3)
t
ENS
t
SKEW2
(4)
t
ENH
t
PAES
n words in FIFO
(2)
,
n + 1 words in FIFO
(3)
t
PAES
n words in FIFO
(2)
,
n + 1 words in FIFO
(3)
t
ENS
t
ENH
t
CLKH
t
CLKL
46
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
NOTES:
1. m = PAF offset.
2. D = maximum FIFO depth.
In IDT Standard mode: if x18 Input or x18 Output bus Width is selected, D = 2,048 for the IDT72T1845, 4,096 for the IDT72T1855, 8,192 for the IDT72T1865, 16,384 for the IDT72T1875,
32,768 for the IDT72T1885, 65,536 for the IDT72T1895, 131,072 for the IDT72T18105, 262,144 for the IDT72T18115 and 524,288 for the IDT72T18125. If both x9 Input and x9
Output bus Widths are selected, D = 4,096 for the IDT72T1845, 8,192 for the IDT72T1855, 16,384 for the IDT72T1865, 32,768 for the IDT72T1875, 65,536 for the IDT72T1885,
131,072 for the IDT72T1895, 262,144 for the IDT72T18105, 524,288 for the IDT72T18115 and 1,048,576 for the IDT72T18125.
In FWFT mode: if x18 Input or x18 Output bus Width is selected, D = 2,049 for the IDT72T1845, 4,097 for the IDT72T1855, 8,193 for the IDT72T1865, 16,385 for the IDT72T1875,
32,769 for the IDT72T1885, 65,537 for the IDT72T1895, 131,073 for the IDT72T18105, 262,145 for the IDT72T18115 and 524,289 for the IDT72T18125. If both x9 Input and x9
Output bus Widths are selected, D = 4,097 for the IDT72T1845, 8,193 for the IDT72T1855, 16,385 for the IDT72T1865, 32,769 for the IDT72T1875, 65,537 for the IDT72T1885,
131,073 for the IDT72T1895, 262,145 for the IDT72T18105, 524,289 for the IDT72T18115 and 1,048,577 for the IDT72T18125.
3. PAF is asserted to LOW on WCLK transition and reset to HIGH on RCLK transition.
4. Select this mode by setting PFM LOW during Master Reset.
5. RCS is LOW.
Figure 25. Asynchronous Programmable Almost-Full Flag Timing (IDT Standard and FWFT Modes)
WCLK
WEN
PAF D - (m + 1) words
in FIFO
RCLK
tPAFA
REN
5909 drw29
D - m words
in FIFO
D - (m + 1) words in FIFO
tENS
tPAFA
tENH
tENS
tCLKLtCLKH
NOTES:
1 . n = PAE offset.
2. For IDT Standard Mode.
3. For FWFT Mode.
4. PAE is asserted LOW on RCLK transition and reset to HIGH on WCLK transition.
5. Select this mode by setting PFM LOW during Master Reset.
6. RCS = LOW.
Figure 26. Asynchronous Programmable Almost-Empty Flag Timing (IDT Standard and FWFT Modes)
WCLK
WEN
PAE n words in FIFO
(2)
,
n + 1 words in FIFO
(3)
RCLK
REN
5909 drw30
t
PAEA
n + 1 words in FIFO
(2)
,
n + 2 words in FIFO
(3)
t
PAEA
t
ENS
t
ENS
t
ENH
t
CLKL
t
CLKH
n words in FIFO
(2)
,
n + 1 words in FIFO
(3)
47
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
NOTES:
1. In IDT Standard mode: D = maximum FIFO depth. If x18 Input or x18 Output bus Width is selected, D = 2,048 for the IDT72T1845, 4,096 for the IDT72T1855, 8,192 for the IDT72T1865,
16,384 for the IDT72T1875, 32,768 for the IDT72T1885, 65,536 for the IDT72T1895, 131,072 for the IDT72T18105, 262,144 for the IDT72T18115 and 524,288 for the IDT72T18125.
If both x9 Input and x9 Output bus Widths are selected, D = 4,096 for the IDT72T1845, 8,192 for the IDT72T1855, 16,384 for the IDT72T1865, 32,768 for the IDT72T1875, 65,536
for the IDT72T1885, 131,072 for the IDT72T1895, 262,144 for the IDT72T18105, 524,288 for the IDT72T18115 and 1,048,576 for the IDT72T18125.
2 . In FWFT mode: D = maximum FIFO depth. If x18 Input or x18 Output bus Width is selected, D = 2,049 for the IDT72T1845, 4,097 for the IDT72T1855, 8,193 for the IDT72T1865,
16,385 for the IDT72T1875, 32,769 for the IDT72T1885, 65,537 for the IDT72T1895, 131,073 for the IDT72T18105, 262,145 for the IDT72T18115 and 524,289 for the IDT72T18125.
If both x9 Input and x9 Output bus Widths are selected, D = 4,097 for the IDT72T1845, 8,193 for the IDT72T1855, 16,385 for the IDT72T1865, 32,769 for the IDT72T1875, 65,537
for the IDT72T1885, 131,073 for the IDT72T1895, 262,145 for the IDT72T18105, 524,289 for the IDT72T18115 and 1,048,577 for the IDT72T18125.
3. RCS = LOW.
Figure 27. Half-Full Flag Timing (IDT Standard and FWFT Modes)
WCLK
t
ENS
t
ENH
WEN
HF
t
ENS
t
HF
RCLK
t
HF
REN
5909 drw31
t
CLKL
t
CLKH
D/2 words in FIFO
(1)
,
[
+ 1
]
words in FIFO
(2)
D-1
2
D/2 + 1 words in FIFO
(1)
,
[
+ 2
]
words in FIFO
(2)
D/2 words in FIFO
(1)
,
[
+ 1
]
words in FIFO
(2)
D-1
2D-1
2
48
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
Figure 28. Echo Read Clock & Read Enable Operation (IDT Standard Mode Only)
t
ENS
t
ENH
t
ENS
RCS
RCLK
REN
Qn
t
ERCLK
t
ENS
5909 drw32
ERCLK
t
ENH
EREN
t
CLKEN
t
CLKEN
t
CLKEN
t
CLKEN
t
REF
EF
WD-4
t
A
t
OLZ
t
OHZ
t
A
t
OLZ
t
A
t
A
Last Word, WD
WD-3
WD-3
WD-2 WD-1
t
CLKEN
t
CLKEN
NOTES:
1. The EREN output is an “ANDed” function of RCS and REN and will follow these inputs provided that the FIFO is not empty. If the FIFO is empty, EREN will go HIGH, thus preventing any reads.
2. The EREN output is synchronous to RCLK.
49
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
Qn
O/P
Reg.
t
A
t
REF
OR
5909 drw33
t
RCSLZ
REN t
ENS
t
ENH
RCS
t
ENS
RCLK
abcdefghi
W
n+1
WCLK
WEN
D0 - Dn
t
SKEW1
t
ENS
t
DS
t
ENH
W
n+2
W
n+3
ERCLK
EREN
t
CLKEN
t
CLKEN
t
CLKEN
t
CLKEN
W
n+1
W
n+2
W
n+3
t
A
t
REF
W
n+1
W
n+2
W
n+3
t
A
W
n
Last Word
t
A
t
A
t
DH
t
DH
t
DH
t
DS
t
DS
12
t
ERCLK
HIGH-Z
Figure 29. Echo RCLK and Echo
RENREN
RENREN
REN
Operation (FWFT Mode Only)
NOTE:
1. The O/P Register is the internal output register. Its contents are available on the Qn output bus only when RCS and OE are both active, LOW, that is the bus is not in High-
Impedance state.
2. OE is LOW.
Cycle:
a&b. At this point the FIFO is empty, OR is HIGH.
RCS and REN are both disabled, the output bus is High-Impedance.
c. Word Wn+1 falls through to the output register, OR goes active, LOW.
RCS is HIGH, therefore the Qn outputs are High-Impedance. EREN goes LOW to indicate that a new word has been placed on the output register.
d. EREN goes HIGH, no new word has been placed on the output register on this cycle.
e. No Operation.
f. RCS is LOW on this cycle, therefore the Qn outputs go to Low-Impedance and the contents of the output register (Wn+1) are made available.
NOTE: In FWFT mode is important to take RCS active LOW at least one cycle ahead of REN, this ensures the word (Wn+1) currently in the output register is made
available for at least one cycle.
g. REN goes active LOW, this reads out the second word, Wn+2.
EREN goes active LOW to indicate a new word has been placed into the output register.
h. Word Wn+3 is read out, EREN remains active, LOW indicating a new word has been read out.
NOTE: Wn+3 is the last word in the FIFO.
i. This is the next enabled read after the last word, Wn+3 has been read out. OR flag goes HIGH and EREN goes HIGH to indicate that there is no new word available.
50
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
Figure 30. Asynchronous Write, Synchronous Read, Full Flag Operation (IDT Standard Mode)
Figure 31. Asynchronous Write, Synchronous Read, Empty Flag Operation (IDT Standard Mode)
RCLK
REN
5909 drw34
FF
Qn W0
tA
W1
tENHtENS
tFFA
tFFA
tFFA
WR tCYH
Dn
tDS
WD
tDH
WD+1
tCYC
RCLK
REN
5909 drw35
Qn
Last Word
t
A
W
0
t
ENH
t
ENS
t
SKEW
WR
Dn
W
0
t
DH
12
t
A
W
1
t
REF
t
REF
EF
t
CYL
t
DS
t
CYH
W
1
t
DH
t
DS
t
CYC
NOTE:
1. OE = LOW, WEN = LOW and RCS = LOW.
NOTE:
1. OE = LOW, WEN = LOW and RCS = LOW.
51
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
Figure 32. Synchronous Write, Asynchronous Read, Full Flag (IDT Standard Mode)
Figure 33. Synchronous Write, Asynchronous Read, Empty Flag Operation (IDT Standard Mode)
WCLK
WEN
5909 drw36
Qn
t
SKEW
RD
Dn D
F
12
t
WFF
t
WFF
FF
t
CYL
t
CYH
Last Word
No Write
D
F+1
t
AA
W
X
t
AA
W
X+1
t
CYC
WCLK
WEN
5909 drw37
Qn Last Word in Output Register W
0
RD
Dn
t
EFA
EF
t
CYH
t
ENS
t
ENH
W
0
t
DS
t
DH
t
EFA
t
AA
t
RPE
NOTES:
1. OE = LOW, RCS = LOW and REN = LOW.
2. Asynchronous Read is available in IDT Standard Mode only.
NOTES:
1. OE = LOW, RCS = LOW and REN = LOW.
2. Asynchronous Read is available in IDT Standard Mode only.
52
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
Figure 34. Asynchronous Write, Asynchronous Read, Empty Flag Operation (IDT Standard Mode)
Figure 35. Asynchronous Write, Asynchronous Read, Full Flag Operation (IDT Standard Mode)
5909 drw38
Qn Last Word in O/P Register
tAA
W0
tCYH
WR
Dn W0
tDH
tAA
W1
tEFA
tEFA
EF
tCYL
W1
tDH
tDS
RD
tCYC
tRPE
5909 drw39
tCYH
WR
Dn Wy
tDH
tFFA
FF
tCYL
tDS
Wy+1
tDH
tDS
RD
Wx
tAA
Wx+1 Wx+2
Qn
tFFA
tCYC
tCYH tCYL
tCYC
tAA
NOTES:
1. OE = LOW, WEN = LOW, REN = LOW and RCS = LOW.
2. Asynchronous Read is available in IDT Standard Mode only.
NOTES:
1. OE = LOW, WEN = LOW, REN = LOW and RCS = LOW.
2. Asynchronous Read is available in IDT Standard Mode only.
53
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
WRITE CLOCK (WCLK)
m + n mn
MASTER RESET (MRS)
READ CLOCK (RCLK)
DATA OUT
nm + n
WRITE ENABLE (WEN)
FULL FLAG/INPUT READY (FF/IR)
PROGRAMMABLE (PAF)
PROGRAMMABLE (PAE)
EMPTY FLAG/OUTPUT READY (EF/OR) #2
OUTPUT ENABLE (OE)
READ ENABLE (REN)
m
LOAD (LD)
IDT
72T1845
72T1855
72T1865
72T1875
72T1885
72T1895
72T18105
72T18115
72T18125
EMPTY FLAG/OUTPUT READY (EF/OR) #1
PARTIAL RESET (PRS)
5909 drw40
FULL FLAG/INPUT READY (FF/IR) #2
HALF-FULL FLAG (HF)
FIRST WORD FALL THROUGH/
SERIAL INPUT (FWFT/SI)
RETRANSMIT (RT)
#1
FIFO
#2
GATE
(1)
GATE
(1)
D
0
- D
m
DATA IN
D
m+1
- D
n
Q
0
- Qm
Q
m+1
- Q
n
FIFO
#1
IDT
72T1845
72T1855
72T1865
72T1875
72T1885
72T1895
72T18105
72T18115
72T18125
READ CHIP SELECT (RCS)
SERIAL CLOCK (SCLK)
OPTIONAL CONFIGURATIONS
WIDTH EXPANSION CONFIGURATION
Word width may be increased simply by connecting together the control
signals of multiple devices. Status flags can be detected from any one device.
The exceptions are the EF and FF functions in IDT Standard mode and the IR
and OR functions in FWFT mode. Because of variations in skew between RCLK
and WCLK, it is possible for EF/FF deassertion and IR/OR assertion to vary
by one cycle between FIFOs. In IDT Standard mode, such problems can be
avoided by creating composite flags, that is, ANDing EF of every FIFO, and
separately ANDing FF of every FIFO. In FWFT mode, composite flags can be
created by ORing OR of every FIFO, and separately ORing IR of every FIFO.
Figure 36 demonstrates a width expansion using two IDT72T1845/
72T1855/72T1865/72T1875/72T1885/72T1895/72T18105/72T18115/
72T18125 devices. D0 - D17 from each device form a 36-bit wide input bus and
Q0-Q17 from each device form a 36-bit wide output bus. Any word width can
be attained by adding additional IDT72T1845/72T1855/72T1865/72T1875/
72T1885/72T1895/72T18105/72T18115/72T18125 devices.
NOTES:
1. Use an AND gate in IDT Standard mode, an OR gate in FWFT mode.
2. Do not connect any output control signals directly together.
3. FIFO #1 and FIFO #2 must be the same depth, but may be different word widths.
Figure 36. Block Diagram of Width Expansion
For the x18 Input or x18 Output bus Width: 2,048 x 36, 4,096 x 36, 8,192 x 36, 16,384 x 18, 32,768 x 18, 65,536 x 36, 131,072 x 36,
262,144 x 36 and 524,288 x 36
For both x9 Input and x9 Output bus Widths: 4,096 x 18, 8,192 x 18, 16,384 x 18, 32,768 x 18, 65,536 x 18, 131,072 x 18, 262,144 x 18,
524,288 x 18 and 1,048,576 x 18
54
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO 2Kx18/4Kx9, 4Kx18/
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
FEBRUARY 10, 2009
DEPTH EXPANSION CONFIGURATION (FWFT MODE ONLY)
The IDT72T1845 can easily be adapted to applications requiring depths
greater than 2,048 when the x18 Input or x18 Output bus Width is selected, 4,096
for the IDT72T1855, 8,192 for the IDT72T1865, 16,384 for the IDT72T1875,
32,768 for the IDT72T1885, 65,536 for the IDT72T1895, 131,072 for the
IDT72T18105, 262,144 for the IDT72T18115 and 524,288 for the
IDT72T18125. When both x9 Input and x9 Output bus Widths are selected,
depths greater than 4,096 can be adapted for the IDT72T1845, 8,192 for the
IDT72T1855, 16,384 for the IDT72T1865, 32,768 for the IDT72T1875,
65,536 for the IDT72T1885, 131,072 for the IDT72T1895, 262,144 for the
IDT72T8105, 524,288 for the IDT72T18115 and 1,048,576 for the
IDT72T18125. In FWFT mode, the FIFOs can be connected in series (the data
outputs of one FIFO connected to the data inputs of the next) with no external
logic necessary. The resulting configuration provides a total depth equivalent
to the sum of the depths associated with each single FIFO. Figure 37 shows
a depth expansion using two IDT72T1845/72T1855/72T1865/72T1875/
72T1885/72T1895/72T18105/72T18115/72T18125 devices.
Care should be taken to select FWFT mode during Master Reset for all FIFOs
in the depth expansion configuration. The first word written to an empty
configuration will pass from one FIFO to the next ("ripple down") until it finally
appears at the outputs of the last FIFO in the chain – no read operation is
necessary but the RCLK of each FIFO must be free-running. Each time the data
word appears at the outputs of one FIFO, that device's OR line goes LOW,
enabling a write to the next FIFO in line.
For an empty expansion configuration, the amount of time it takes for OR of
the last FIFO in the chain to go LOW (i.e. valid data to appear on the last FIFO's
outputs) after a word has been written to the first FIFO is the sum of the delays
for each individual FIFO:
(N – 1)*(4*transfer clock) + 3*TRCLK
where N is the number of FIFOs in the expansion and TRCLK is the RCLK period.
Note that extra cycles should be added for the possibility that the tSKEW1
specification is not met between WCLK and transfer clock, or RCLK and transfer
clock, for the OR flag.
The "ripple down" delay is only noticeable for the first word written to an empty
depth expansion configuration. There will be no delay evident for subsequent
words written to the configuration.
The first free location created by reading from a full depth expansion
configuration will "bubble up" from the last FIFO to the previous one until it finally
moves into the first FIFO of the chain. Each time a free location is created in one
FIFO of the chain, that FIFO's IR line goes LOW, enabling the preceding FIFO
to write a word to fill it.
For a full expansion configuration, the amount of time it takes for IR of the first
FIFO in the chain to go LOW after a word has been read from the last FIFO is
the sum of the delays for each individual FIFO:
(N – 1)*(3*transfer clock) + 2 TWCLK
where N is the number of FIFOs in the expansion and TWCLK is the WCLK
period. Note that extra cycles should be added for the possibility that the tSKEW1
specification is not met between RCLK and transfer clock, or WCLK and transfer
clock, for the IR flag.
The Transfer Clock line should be tied to either WCLK or RCLK, whichever
is faster. Both these actions result in data moving, as quickly as possible, to the
end of the chain and free locations to the beginning of the chain.
Figure 37. Block Diagram of Depth Expansion
For the x18 Input or x18 Output bus Width:
4,096 x 18, 8,192 x 18, 16,384 x 18, 32,768 x 18, 65,536 x 18, 131,072 x 18, 262,144 x 18, 524,288 x 18 and 1,048,576 x 18
For both x9 Input and x9 Output bus Widths:
8,192 x 9, 16,384 x 9, 32,768 x 9, 65,536 x 9, 131,072 x 9, 262,144 x 9, 524,288 x 9, 1,048,576 x 9 and 2,097,152 x 9
Dn
INPUT READY
WRITE ENABLE
WRITE CLOCK
WEN
WCLK
IR
DATA IN
RCLK READ CLOCK
RCLK
REN
OE OUTPUT ENABLE
OUTPUT READY
Qn
Dn
IR
GND
WEN
WCLK
OR
REN
OE
Qn
READ ENABLE
OR
DATA OUT
TRANSFER CLOCK
5909 drw41
n
n n
FWFT/SI FWFT/SI
FWFT/SI
IDT
72T1845
72T1855
72T1865
72T1875
72T1885
72T1895
72T18105
72T18115
72T18125
RCS READ CHIP SELECT
RCS
IDT
72T1845
72T1855
72T1865
72T1875
72T1885
72T1895
72T18105
72T18115
72T18125
55
CORPORATE HEADQUARTERS for SALES: for Tech Support:
6024 Silver Creek Valley Road 800-345-7015 or 408-284-8200 408-360-1753
San Jose, CA 95138 fax: 408-284-2775 email: FIFOhelp@idt.com
www.idt.com
ORDERING INFORMATION
Plastic Ball Grid Array, PBGA BB144-1 (72T1845/55/65/75/85/95 Only)
Plastic Ball Grid Array, PBGA BB240-1 (72T18105/115/125 Only)
Commercial (0°C to +70°C)
Industrial (-40°C to +85°C)
Low Power
5909 drw42
Commercial Only
Commercial and Industrial
Commercial Only
Commercial Only
L
XXXXX
Device Type
X
Power
XX
Speed
X
Package
X
Process /
Temperature
Range
BLANK
I
(1)
72T1845 2,048 x 18/4,096 x 9 2.5V TeraSync FIFO
72T1855 4,096 x 18/8,192 x 9 2.5V TeraSync FIFO
72T1865 8,192 x 18/16,384 x 9 2.5V TeraSync FIFO
72T1875 16,384 x 18/32,768 x 9 2.5V TeraSync FIFO
72T1885 32,768 x 18/65,536 x 9 2.5V TeraSync FIFO
72T1895 65,536 x 18/131,072 x 9 2.5V TeraSync FIFO
72T18105 131,072 x 18/262,144 x 9 2.5V TeraSync FIFO
72T18115 262,144 x 18/524,288 x 9 2.5V TeraSync FIFO
72T18125 524,288 x 18/1,048,576 x 9 2.5V TeraSync FIFO
Clock Cycle Time (tCLK)
Speed in Nanoseconds
BB
BB
4-4
5
6-7
10
(3)
Green
G
(2)
X
DATASHEET DOCUMENT HISTORY
05/30/2001 pg. 18.
07/09/2001 pgs. 1, 7, 8, 19, and 50.
10/17/2001 pgs. 1-6, 8, 10, 11, 13-20, 23, 24, 26, 27, 29, 34, 35, 36, 38-43, 49-51.
11/19/2001 pgs. 1, 9, 12, 38, and 39.
11/29/2001 pgs. 1, 38, and 39.
01/15/2002 pg. 40.
03/04/2002 pgs. 9, 10, 17, and 27.
06/05/2002 pgs. 9, 10, and 14.
06/27/2002 pg. 20.
02/11/2003 pgs. 8, 9, and 31.
03/03/2003 pgs. 1, 11-13, 29, and 31-33.
09/02/2003 pgs. 7, 17, and 25.
01/11/2007 pgs. 1, 12, 13, and 55.
02/10/2009 pg. 55.
NOTES:
1. Industrial temperature range product for 5ns speed grade is available as a standard device. All other speed grades are available by special order.
2. Green parts available. For specific speeds and packages contact your sales office.
3. Available for IDT72T18105/72T18115/72T18125 only.