Effective April 2020 Supersedes May 2017 Technical Data 4378 42510ESDA-TR1 Four channel ultra low capacitance ESD Suppressor Applications HALOGEN HF FREE Pb * Laptops, notebooks, desktop * HDTV, set top box * GPS and Bluetooth communication antenna * USB 2.0, 3.0 and 3.1 * HDMI 1.3, 1.4a, 2.0 * DisplayPort TM * SATA and eSATA Ordering part number Product features * Ultra low capacitance ESD suppressor ideally suited for protecting high speed data applications with virtually no signal distortion * Four channel, bi-directional device helps provide significant PCB layout space savings and trace layout complexity * Maintains an extremely low leakage current at rated voltage * Provides ESD protection with fast response time (<1 ns) allowing equipment to pass IEC 61000-4-2 level 4 test * Matches footprint of common higher capacitance DFN2510-10 TVS diode packages 4 2510 ESDA -TR1 4 channel device 2.5 x 1.0 mm footprint ESDA family Packaging Package suffix -TR1: 5000 parts on a 7" diameter reel Product specifications Electrical specifications Minimum Typical Rated voltage Trigger voltage2 Clamping voltage Maximum Units 12 Vdc 300 Vdc 30 Vdc Capacitance @ 1 MHz 0.1 pF Leakage current @ 12 Vdc 0.01 uA Response time 0.1 ns 1 ESD Voltage capability to IEC6100-4-2 (contact) 10 ESD Voltage capability to IEC6100-4-2 (air) 15 ESD withstand pulses kV kV 1000 1. Maximum peak voltage with a 8/20 s waveform and a 1 A pulse current per IEC 61000-4-2 level 4 2. Trigger voltage: Trigger measurement made using Transmission Line Pulse (TLP) method. Number of pulses 42510ESDA-TR1 Four channel ultra low capacitance ESD Suppressor Technical Data 4378 Effective April 2020 Equivelent circuit 10 9 GND 8 7 6 1 2 GND 3 4 5 Dimensions--mm Recommended pad layout P1 P W B Y L Z C G T X D 2 C E X1 L W T B C D E Y G Z X X1 P P1 C 2.5 0.1 1.0 0.1 0.5 0.1 0.2 0.1 0.3 0.05 0.2 0.05 0.5 0.05 0.6 0.2 1.4 0.2 0.3 0.5 1.0 0.8 www.eaton.com/electronics Technical Data 4378 42510ESDA-TR1 Four channel ultra low capacitance ESD Suppressor Effective April 2020 General specifications Operating temperature: - 55 C to +125 C Storage temperature (component): - 55 C to +125 C High temperature load voltage: +125 C for 1000 hours at rated voltage Thermal shock: 100 cycles, -55 C to +125 C, 30 minuets dwell time Resistance to solder heat: +260 C 5 C 10 seconds Moisture sensitivity level (MSL): 2 HDMI layout eSATA layout HDMI Port HDMI Chipset eSATA GND Port TX+ D2+ Ground D2- TX- Outside World D1+ Ground eSATA Interface D1- Ground IC GND D0+ D0- RXCLK+ Ground Case Ground RX+ CLKCase Ground Signal Ground GND Packaging information- mm Supplied in tape and reel packaging, 5000 parts per seven inch (178 mm) reel per EIA Standard 481-1 E C F B L A D W A B C D E F L W 8.0 0.30 3.50 0.05 1.75 0.10 2.00 0.05 4.00 0.10 1.5 0.10 2.9 0.20 1.40 0.20 www.eaton.com/electronics 3 42510ESDA-TR1 Four channel ultra low capacitance ESD Suppressor Technical Data 4378 Effective April 2020 Wave solder profile tp Temperature Tp First Wave Second Wave Tsmax Tstyp Tsmin Preheat area Cool down area Time Reference EN 61760-1:2006 Profile feature Preheat Standard SnPb solder Lead (Pb) free solder * Temperature min. (Tsmin) 100 C 100 C * Temperature typ. (Tstyp) 120 C 120 C * Temperature max. (Tsmax) 130 C 130 C * Time (Tsmin to Tsmax) (ts) 70 seconds 70 seconds D preheat to max Temperature 150 C max. 150 C max. Peak temperature (TP)* 235 C - 260 C 250 C - 260 C Time at peak temperature (tp) 10 seconds max 5 seconds max each wave 10 seconds max 5 seconds max each wave Ramp-down rate ~ 2 K/s min ~3.5 K/s typ ~5 K/s max ~ 2 K/s min ~3.5 K/s typ ~5 K/s max Time 25 C to 25 C 4 minutes 4 minutes Manual solder +280 C (3 seconds maximum by soldering iron), generally manual/hand soldering is not recommended. 4 www.eaton.com/electronics 42510ESDA-TR1 Four channel ultra low capacitance ESD Suppressor Technical Data 4378 Effective April 2020 Solder reflow profile TP TC -5C tP Max. Ramp Up Rate = 3C/s Max. Ramp Down Rate = 6C/s Temperature TL Preheat A T smax t Table 1 - Standard SnPb solder (Tc) Package thickness Volume mm3 <350 Volume mm3 350 <2.5 mm) 235 C 220 C 2.5 mm 220 C 220 C Table 2 - Lead (Pb) free solder (Tc) Tsmin ts 25C Time 25C to Peak Package thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6 mm 260 C 260 C 260 C 1.6 - 2.5 mm 260 C 250 C 245 C >2.5 mm 250 C 245 C 245 C Time Reference J-STD-020 Profile feature Preheat and soak Standard SnPb solder Lead (Pb) free solder * Temperature min. (Tsmin) 100 C 150 C * Temperature max. (Tsmax) 150 C 200 C 60-120 seconds 60-120 seconds Ramp up rate TL to Tp * Time (Tsmin to Tsmax) (ts) 3 C/ second max. 3 C/ second max. Liquidous temperature (Tl) Time (tL) maintained above TL 183 C 60-150 seconds 217 C 60-150 seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)* within 5 C of the specified classification temperature (Tc) 20 seconds* 30 seconds* Ramp-down rate (Tp to TL) Time 25 C to peak temperature 6 C/ second max. 6 C/ second max. 6 minutes max. 8 minutes max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States Eaton.com/electronics (c) 2020 Eaton All Rights Reserved Printed in USA Publication No. 4378 BU-MC20073 April 2020 Eaton is a registered trademark. All other trademarks are property of their respective owners. Follow us on social media to get the latest product and support information.