NX5P3090 USB PD and type C current-limited power switch Rev. 1 -- 1 August 2016 Product data sheet 1. General description The NX5P3090 is a precision adjustable current-limited power switch for USB PD application. The device includes under voltage lockout, over-temperature protection, and reverse current protection circuits to automatically isolate the switch terminals when a fault condition occurs. The 29 V tolerance on VBUS pin ensures the device is able to work on a USB PD port; a current limit input (ILIM) pin defines the over-current limit threshold; an open-drain fault output (FAULT) indicates when a fault condition has occurred. The over-current limit threshold can be programmed from 400 mA to 3.3 A, using an external resistor between the ILIM pin and GND pin. In the over current condition, the device will clamp the output current to the value set by ILIM and keep the switch on while assert the FAULT flag. To minimize current surges during turn on, the device has built in soft start which controls the power switch rise time. Surge protection has been integrated in the device to enhance system robustness. The enable input includes integrated logic level translation making the device compatible with lower voltage processors and controllers. NX5P3090 is offered in a 12 bump 1.35 x 1.65 mm, 0.4 mm pitch WLCSP package. 2. Features and benefits VINT supply voltage range from 2.5 V to 5.5 V 29 V tolerance on VBUS and EN pin Adjustable current limit from 400 mA to 3.3 A Clamped current output in over-current condition Very low ON resistance: 34 m (typical) Active HIGH EN pin with internal pull down resistor All time Reverse Current Protection Over Temperature Protection Surge protection: IEC61000-4-5 exceeds 80 V on VBUS Safety approvals UL 62368-1, 2nd Edition, File no. 20160526-E470128 IEC 62368-1 (ed.2), File no. DK-54536-UL ESD protection IEC61000-4-2 contact discharge exceeds 8 kV on VBUS HBM ANSI/ESDA/JEDEC JS-001 Class 2 exceeds 2 kV CDM AEC standard Q100-01 (JESD22-C101E) exceeds 500 V Specified from 40 C to +85 C ambient temperature NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch 3. Applications Notebook and Ultrabook USB PD and Type C port/hubs Tablet and Smart phone 4. Ordering information Table 1. Ordering information Type number NX5P3090UK Topside marking Package Name Description Version X5PT2 WLCSP12 wafer level chip-scale package; 12 bumps; 1.65 x 1.35 x 0.525 mm; 0.4 mm pitch (backside coating included) SOT1390-5 4.1 Ordering options Table 2. Ordering options Type number Orderable part number Package Packing method Minimum order quantity Temperature NX5P3090UK NX5P3090UKZ WLCSP12 REEL 7" Q1/T1 *SPECIAL MARK CHIPS DP 3000 Tamb = 40 C to +85 C 5. Marking Table 3. Marking Line Marking Description A X5PT2 basic type name B mmmmm wafer lot code (mmmmm) C Z5YWW manufacturing code Z = foundry location 5 = assembly location Y = assembly year code WW = assembly week code NX5P3090 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 2 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch 6. Functional diagram REVERSE-CURRENT PROTECTION ILIM OVER-CURRENT CLAMPING VINT VBUS UVLO SURGE PROTECTION EN CONTROL Rpd FAULT THERMAL SHUTDOWN aaa-024124 Fig 1. Logic diagram NX5P3090 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 3 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch 7. Pinning information 7.1 Pinning ball A1 index area NX5P3090 1 2 NX5P3090 3 1 2 3 A A EN /FAULT ILIM B B VINT VINT GND C C VINT VBUS GND D D VBUS VBUS GND Transparent top view Transparent top view aaa-024125 Fig 2. aaa-024126 Pin configuration Fig 3. Pin map 7.2 Pin description Table 4. Pin description Symbol Pin Description VBUS C2, D1, D2 power output; 29 V tolerance ILIM A3 current limiter setting. connects a resistor to GND to set the threshold FAULT A2 fault condition indicator (open-drain output) EN A1 enable input (active HIGH) GND B3, C3, D3 ground (0 V) VINT B1, C1, B2 power input NX5P3090 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 4 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch 8. Functional description Table 5. Function table[1] EN VINT VBUS FAULT Switch X <2.5V X Z under voltage lockout, switch open L 2.5V to 5.5V X Z disabled; switch open H 2.5V to 5.5V VBUS=VINT Z enabled; switch closed H 2.5V to 5.5V 0V to VINT L over-current, clamped current output, switch closed H 2.5V to 5.5V VBUS>VINT+40mV (>4ms) L reverse current; switch open H 2.5V to 5.5V Z L Over-temperature; switch open [1] H = HIGH voltage level; L = LOW voltage level. 8.1 EN Input When the EN pin is set LOW, the N-channel MOSFET will be disabled, the device will enter low-power mode disabling all protection circuits and setting the FAULT pin high impedance. When EN is set HIGH, all protection circuits will be enabled and then, if no fault conditions exist, the N-channel MOSFET will be turn on. There is a 100 us de-glitch time on EN pin from LOW to HIGH. 8.2 Under-voltage lock-out Independently of the logic level on the EN pin, the under-voltage lockout (UVLO) circuit disables the N-channel MOSFET and enters low power mode until the input voltage reaches the UVLO turn-on threshold level VUVLO. 8.3 ILIM The over-current protection circuit's (OCP) trigger value Iocp can be set using an external resistor RILIM connected between ILIM pin and GND pin. When EN is HIGH and the ILIM pin is pulled to ground, the N-channel MOSFET will be disabled and the FAULT output set LOW. The detailed IOCP setting is given in Section 8.4. 8.4 Over-current protection (OCP) The device offers over current protection when enabled, three possible over-current conditions can occur. These conditions are: * Over-current at start-up, ISW > Iocp when enabling the N-channel MOSFET. * Over-current after enabled, ISW > Iocp when the N-channel MOSFET is already ON. * Short circuit after enabled, ISW > 10 A (typical). In the over current condition, because the device clamps the output current rather than completely shut down the switch, the power dissipation on the device might be increased which could lead to over temperature protection (see Section 8.7). 8.4.1 Over-current at start-up If the device senses a VBUS short to GND or over-current while enabling the N-channel MOSFET, OCP is triggered. It limits the output current to Iocp and after the de-glitch time sets the FAULT output LOW. NX5P3090 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 5 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch 8.4.2 Over-current when enabled If the device senses ISW > Iocp after enabled, OCP is triggered. It limits the output current to Iocp and after the de-glitch time sets the FAULT output LOW. Limiting the output current reduces VO(VOUT). 8.4.3 Short circuit when enabled If the device senses ISW > 10 A after enabled, a short circuit is detected. The device disables the N-channel MOSFET immediately. It then re-enables the N-channel MOSFET and limit the output current to Iocp, and after the de-glitch time the FAULT output is set LOW. 8.5 Reverse-Current protection (RCP) When the VBUS pin voltage exceeds the input voltage by 40 mV (typical) the device will protect itself from damage by switching off the MOSFET after 4 ms de-glitch time. When the VBUS pin voltage exceeds the VINT voltage by 100 mV, the device will shutdown the FET immediately without any de-glitch time. FAULT pin will be set LOW in the reverse-current protection condition. In the RCP state, when the VBUS voltage drops below VINT voltage, the device will exit the RCP state in 128 us and resume normal operation. Before normal turn on, the device will always check the RCP condition first, if higher voltage is detected on VBUS pin, it will never turn on the power MOSFET even EN pin is pulled HIGH. 8.6 FAULT output The FAULT output is an open-drain output that requires an external pull-up resistor. If any of the protection circuits is activated, the FAULT output will be set LOW to indicate a fault has occurred. The FAULT output will return to the high impedance state automatically once the fault condition is removed. An internal delay (de-glitch) circuit for the over-current protection (8 ms typical) and reverse-current protection (4 ms typical) is used when entering fault conditions. This ensures that FAULT is not accidentally asserted. Over-temperature condition will not be deglitched, the FAULT signal will be asserted immediately. 8.7 Over-temperature protection When EN is HIGH, the device junction temperature exceeds 140 C, the over-temperature protection (OTP) circuit will disable the N-channel MOSFET and indicate a fault condition by setting the FAULT pin LOW. Any transition on the EN pin will have no effect. Once the device temperature decreases below 115 C the device will return to the defined state. NX5P3090 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 6 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch 9. Application diagram USB connector 5V SOURCE VINT VBUS VBUS CINT VDD CBUS 47 K /FAULT USB CONTROLLER/ PROCESSOR ILIM EN GND RILIM GND aaa-024128 0.1 F ceramic capacitor (CINT) is required for local decoupling. Higher capacitor values CINT further reduce the voltage drop at the input. When driving inductive loads, a larger capacitance CINT prevents voltage spikes from exceeding absolute maximum voltage of VIN. The CBUS capacitor should be placed as closer as possible to VBUS pin. Fig 4. Application diagram NX5P3090 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 7 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch 10. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter input voltage VI Conditions Min Max Unit VBUS, EN [1] 0.5 +29 V VINT [2] 0.5 +6 V 0.5 +6 V 0.5 +6 V ILIM [1] VO output voltage FAULT IIK input clamping current input EN: VI(EN) < 0.5 V 50 - mA input ILIM: VI(ILIM) < 0.5 V 50 - mA II(source) input source current input IILIM - 1 mA IOK output clamping current VO < 0 V 50 - mA ISK switch clamping current input VIN: VI(VIN) < 0.5 V 50 - mA ISW switch current Tj(max) maximum junction temperature Tstg storage temperature Ptot total power dissipation output VOUT: VO(VOUT) < 0.5 V VSW > 0.5 V [3] [4] 50 - mA - 3.6 A 40 +150 C 65 +150 C - 910 mW [1] The minimum input voltage rating may be exceeded if the input current rating is observed. [2] The minimum and maximum switch voltage ratings may be exceeded if the switch clamping current rating is observed. [3] Internally limited. [4] The (absolute) maximum power dissipation depends on the junction temperature Tj. Higher power dissipation is allowed in conjunction with lower ambient temperatures. The conditions to determine the specified values are Tamb = 25 C and the use of a two layer PCB. 11. Recommended operating conditions Table 7. Recommended operating conditions Symbol Parameter input voltage VI Conditions Min Max Unit VINT 2.5 5.5 V EN; VBUS (OFF state) 0 20 V VO Output voltage VBUS 0 5 V ISW switch current Tj = 40 C to +85 C 0 3 A 10 - mA 16 140 k 0.1 - F 40 +85 C IO(sink) output sink current output FAULT RILIM current limit resistance input ILIM Cdec decoupling capacitance VIN to GND Tamb ambient temperature [1] [1] Current-limit threshold resistor range from ILIM to GND. NX5P3090 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 8 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch 12. Thermal characteristics Table 8. Symbol Rth(j-a) [1] Thermal characteristics Parameter Conditions [1] thermal resistance from junction to ambient Typ Unit 109 K/W Rth(j-a) is dependent upon board layout. To minimize Rth(j-a), ensure all pins have a solid connection to larger copper layer areas. In multi-layer PCBs, the second layer should be used to create a large heat spreader area below the device. Avoid using solder-stop varnish under the device. 13. Static characteristics Table 9. Static characteristics At recommended operating conditions; VI(VINT) = VI(EN), RFAULT = 10 k unless otherwise specified; Voltages are referenced to GND (ground = 0 V). See Figure 10 Symbol Parameter Conditions Min Typ[1] Max Unit VIH HIGH-level input voltage EN input; VI(VINT) = 2.5 V to 5.5 V; 1.2 - - V VIL LOW-level input voltage EN input; VIVINT) = 2.5 V to 5.5 V; - - 0.4 V II input leakage current EN input; VI(VINT) = 5.0 V; - - 7.5 A I(VIN) supply current VBUS open; VI(VINT) = 5.0 V EN = GND (low power mode); - 0.9 5 A EN = VI(VIN); RILIM = 33 k - 196 280 A EN = VI(VIN); RILIM = 16 k - 210 290 A VBUS OFF-State leakage current VI(VINT) = 5.0 V; VI(VBUS) = 0 V; EN = LOW - 1 10 A VINT OFF-state leakage current VI(VBUS) = 5.0 V; VI(VINT) = 0 V; EN = LOW - 1 10 A IS(ON) RCP leakage current VI(VINT) = 0 V; VI(VBUS) = 5 V; EN = 5 V - 0.9 10 A Rpd EN pin Pull-down resistance VI(VINT) = 5 V Vtrip trip level voltage RCP; VI(VINT) = 2.5 V to 5.5 V - 40 - mV VUVLO under voltage lockout voltage VINT pin - 2.27 2.45 V Vhys(UVLO) under voltage lockout hysteresis voltage - 100 - mV VOL LOW-level output voltage - - 0.5 V CI EN pin - 13.5 - pF IS(OFF) [1] 1 FAULT; IO = 8 mA M Typical values are measured at Tamb = 25 C. NX5P3090 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 9 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch 13.1 Graphs DDD , 9,1 X$ 7DPE & VI(EN) = GND; VI(VINT) = 5.0 V Fig 5. OFF state supply current versus temperature DDD , 9,1 X$ 7DPE & VI(EN) = VI(VINT); VI(VINT) = 5.0 V (1) RILIM = 33 K (2) RILIM = 16 K Fig 6. NX5P3090 Product data sheet ON state supply current versus temperature All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 10 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch DDD ,RII 9,17 X$ 9, 9,17 9 VI(EN) = GND; VI(VBUS) = 0 V; RILIM = 16 K (1) Tamb = -40 C (2) Tamb = +25 C (3) Tamb = +85 C Fig 7. VBUS off state leakage versus temperature DDD ,RII 9%86 $ 9, 9%86 9 VI(EN) = GND; VI(VINT) = 0 V; RILIM = 16 K (1) Tamb = -40 C (2) Tamb = +25 C (3) Tamb = +85 C Fig 8. NX5P3090 Product data sheet VINT off state leakage versus temperature All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 11 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch DDD 9%869,17 9 ,%86 $ 7LPH V RILIM = 20 k; VI(VINT) = 0 V (1) Surge current (2) Surge voltage on VBUS Fig 9. Surge protection waveform VIN 10 k FAULT signal control signal VINT VBUS VOUT 10 F 1 F ILIM FAULT RILIM EN GND aaa-024133 Fig 10. Typical characteristics reference schematic 13.2 Thermal shutdown Table 10. Thermal shutdown VI(VINT) = VI(EN), RFAULT = 10 k unless otherwise specified; Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max Unit Tth(ots) over temperature shutdown threshold temperature VI(VINT) = 2.5 to 5.5 V - 140 - C Tth(otp)hys hysteresis of over temperature protection threshold temperature VI(VINT) = 2.5 to 5.5 V - 25 - C NX5P3090 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 12 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch 13.3 ON resistance Table 11. ON resistance VI(VINT) = VI(EN), RFAULT = 10 k unless otherwise specified; Voltages are referenced to GND (ground = 0 V). See Figure 10 Symbol Parameter Conditions Min RON ON resistance VI(VINT) = 2.5 to 5.5 V; see Figure 11 Typ Max Unit Tamb = 25 C - 34 37 m Tamb = 40 C to +85 C - - 46 m 13.4 ON resistance graphs DDD 5RQ P 7DPE & VI(VINT) = 5.0 V Fig 11. Typical ON resistance versus temperature DDD 5RQ P 7LPH PV VI(VINT) = 5.0 V Fig 12. Typical ON resistance versus enable time NX5P3090 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 13 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch 13.5 Current limit Table 12. Current limit VI(VINT) = VI(EN), RFAULT = 10 k unless otherwise specified; Voltages are referenced to GND (ground = 0 V). See Figure 10 Symbol Parameter Conditions Iocp over current protection current VI(VINT) = 2.5 to 5.5 V; Tamb = 40 C to +85 C; [1] Min Typ[1] Max Unit RILIM = 140 k 330 421 465 mA RILIM = 100 k 480 581 625 mA RILIM = 54 k 915 1057 1107 mA RILIM = 33 k 1505 1723 1780 mA RILIM = 24.5 k 2085 2330 2398 mA RILIM = 20 k 2567 2848 2920 mA RILIM = 16 k 3186 3490 3585 mA ILIM shorted to VINT 125 180 220 mA Typical values are measured at Tamb = 25 C. 1 % tolerance resistor is recommend for RILIM Iocp can be calculated with below equation, x = RILIM (k): I OCP MAX = 49495x - 0.948 (1) I OCP TYP = 52775x -0.979 (2) I OCP MIN = 57949x -1.042 (3) 13.6 Current limit graphs DDD ,2&3 $ 5,/,0 . Fig 13. Typical over current protection current versus external resistor value RILIM NX5P3090 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 14 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch 14. Dynamic characteristics Table 13. Dynamic characteristics At recommended operating conditions; VI(VINT) = VI(EN), RFAULT = 10 k unless otherwise specified; voltages are referenced to GND (ground = 0 V). Min Typ[1] Max Unit VI(VINT) = 5.0 V - 2.5 - ms VI(VINT) = 2.5 V - 1.4 - ms VI(VINT) = 5.0 V - 0.2 - ms VI(VINT) = 2.5 V - 0.2 - ms - 1.5 - ms - 13 - s FAULT in OCP; VI(VINT) = 5 V - 8 - ms RCP; FAULT in RCP; VI(VINT) = 5 V - 4 - ms Symbol Parameter Conditions tTLH LOW to HIGH output transition time VOUT; CL = 1 F; RL = 100 ; see Figure 14 and Figure 15 VOUT; CL = 1 F; RL = 100 ; see Figure 14 and Figure 15 HIGH to LOW output transition time tTHL EN to VOUT; CL = 1 F; RL = 100 ; seeFigure 14and Figure 15 enable time ten VI(VINT) = 5.0 V EN to VOUT; CL = 1 F; RL = 100 ; see Figure 14 and Figure 15 disable time tdis VI(VINT) = 5.0 V deglitch time tdegl [1] Typical values are measured at Tamb = 25 C. 14.1 Waveform and test circuits VI EN input VM GND ten tdis VOH Vx VBUS output VY GND tTHL tTLH aaa-024134 Measurement points are given in Table 14. Logic level: VOH is the typical output voltage that occurs with the output load. Fig 14. Switching times and rise and fall times Table 14. Measurement points Supply voltage EN Input Output VI(VIN) VM VX VY 5.0 V 0.5 VI(EN) 0.9 VOH 0.1 VOH NX5P3090 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 15 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch EN VOUT VI G VIN VEXT CL RL aaa-011077 Test data is given in Table 15. Definitions test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. VEXT = External voltage for measuring switching times. Fig 15. Test circuit for measuring switching times Table 15. Test data Supply voltage EN Input Load VEXT VI(EN) CL RL 5.0 V 0 to VI(VIN) 1 F 100 DDD 9%86(1 9 ,9,1 $ WLPH PV VI(VINT) = 5 V; RL = 5.1 ; CL = 1 F; (1) VO(VBUS) (2) I(VIN) (3) VI(EN) Fig 16. Typical 1 F load enable time and inrush current NX5P3090 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 16 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch DDD 9%86(1 9 ,9,1 $ WLPH PV VI(VIN) = 5 V; RL = 5.1 ; CL = 100 F; (1) VO(VBUS) (2) I(VIN) (3) VI(EN) Fig 17. Typical 100 F load enable time and inrush current DDD 9%86(1 9 ,9,1 $ WLPH XV VI(VINT) = 5 V; RL = 5.1 ; CL = 1 F; (1) VO(VBUS) (2) I(VIN) (3) VI(EN) Fig 18. Typical 1 F load turn off NX5P3090 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 17 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch DDD 9%86(1 9 ,9,1 $ WLPH PV VI(VIN) = 5 V; RL = 5.1 ; CL = 100 F (1) VO(VBUS) (2) I(VIN) (3) VI(EN) Fig 19. Typical 100 F load turn off DDD 9%86 9,17)/7 9 ,9,1 $ 7LPH PV VI(VINT) = 4 V (1) VO(VBUS) (2) VI(VINT) (3) I(VIN) (4) FAULT Fig 20. Reverse-current protection response NX5P3090 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 18 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch DDD ,9,1 $ 9%86 9,17)/7 9 7LPH PV VI(VIN) = 4V (1) VO(VBUS) (2) VI(VINT) (3) I(VIN) (4) FAULT Fig 21. Reverse-current protection recovery 9%86 9,17)/7 9 DDD ,9,1 $ 7LPH PV VI(VIN) = 5 V; RILIM = 33 k. (1) VO(VBUS). (2) VI(VINT) (3) I(VIN) (4) FAULT Fig 22. Device into current limit after enabled NX5P3090 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 19 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch DDD 9%86 9,17)/7 9 ,9,1 $ 7LPH PV VI(VIN) = 5 V; RILIM = 33 k. (1) VO(VBUS) (2) VI(VINT) (3) I(VIN) (4) FAULT Fig 23. Device start up with VBUS short to GND NX5P3090 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 20 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch 15. Package outline :/&63ZDIHUOHYHOFKLSVFDOHSDFNDJH EXPSV[[PP %DFNVLGHFRDWLQJLQFOXGHG ( $ 627 % EDOO$ LQGH[DUHD $ $ ' $ GHWDLO; H H & Y Z E & $ % & \ ' H & H H % $ EDOO$ LQGH[DUHD ; PP VFDOH 'LPHQVLRQV PPDUHWKHRULJLQDOGLPHQVLRQV 8QLW PP $ $ $ E PD[ QRP PLQ ' ( H H H Y Z \ 1RWH%DFNVLGHFRDWLQJP 2XWOLQH YHUVLRQ VRWBSR 5HIHUHQFHV ,(& 627 -('(& -(,7$ (XURSHDQ SURMHFWLRQ ,VVXHGDWH Fig 24. Package outline WLCSP12 NX5P3090 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 21 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch 16. Packing information 16.1 Packing method %DUFRGHODEHO 'U\DJHQW %DJ (6'SULQW 5HODWLYHKXPLGLW\ LQGLFDWRU 0RLVWXUHFDXWLRQ SULQW (6'HPERVVHG 7DSH 5HHODVVHPEO\ %DUFRGHODEHO *XDUGEDQG 3ULQWHGSODQRER[ &LUFXODUVSURFNHWKROHVRSSRVLWHWKH ODEHOVLGHRIUHHO &RYHUWDSH 4$VHDO &DUULHUWDSH 6SDFHIRUDGGLWLRQDO ODEHO 3UHSULQWHG(6' ZDUQLQJ %DUFRGHODEHO 'U\SDFN,'VWLFNHU 3ULQWHGSODQRER[ DDD Fig 25. Reel dry pack for SMD: guard band; embossed tape NX5P3090 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 22 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch Table 16. Dimensions and quantities Reel dimensions d w (mm) [1] SPQ/PQ (pcs) [2] Reels per box Outer box dimensions l w h (mm) 180 8 3000 1 209 206 34 [1] d = reel diameter; w = tape width. [2] Packing quantity dependent on specific product type. View ordering and availability details at NXP order portal, or contact your local NXP representative. 16.2 Product orientation 47 47 EDOO 47 47 DDD DDD Tape pocket quadrants Ball 1 is in quadrant Q1/T1 Fig 26. Product orientation in carrier tape 16.3 Carrier tape dimensions 4 mm W K0 A0 B0 P1 T direction of feed 001aao148 Fig 27. Carrier tape dimensions Table 17. Carrier tape dimensions In accordance with IEC 60286-3. NX5P3090 Product data sheet A0 (mm) B0 (mm) K0 (mm) T (mm) P1 (mm) W (mm) 1.61 0.05 1.78 0.05 0.73 0.05 0.25 0.02 4.0 0.1 8 0.3 / 0.1 All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 23 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch 16.4 Reel dimensions A Z W2 B OC OD detail Z 001aao149 Fig 28. Schematic view of reel Table 18. Reel dimensions In accordance with IEC 60286-3. NX5P3090 Product data sheet A [nom] (mm) W2 [max] (mm) B [min] (mm) C [min] (mm) D [min] (mm) 180 14.4 1.5 12.8 20.2 All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 24 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch 16.5 Barcode label Fixed text Country of origin i.e. "Made in....." or "Diffused in EU [+] Assembled in...... Packing unit (PQ) identification 2nd traceability lot number* 2nd (youngest) date code* 2nd Quantity* Traceability lot number Date code With linear barcode Quantity With linear barcode Type number NXP 12NC With linear barcode NXP SEMICONDUCTORS MADE IN >COUNTRY< [PRODUCT INFO] (Q) QTY Optional product information* Re-approval date code* Origin code Product Manufacturing Code MSL at the Peak Body solder temperature with tin/lead* MSL at the higher lead-free Peak Body Temperature* 2D matrix with all data (including the data identifiers) HALOGEN FREE (30P) TYPE RoHS compliant (1P) CODENO Additional info if halogen free product Additional info on RoHS (33T) PUID: B.0987654321 (30T) LOT2 (31D) REDATE (30D) DATE2 (32T) ORIG (30Q) QTY2 (31T) PMC (31P) MSL/PBT (1T) LOT MSL/PBT (9D) DATE Lead-free symbol 001aak714 Fig 29. Example of typical box and reel information barcode label Table 19. NX5P3090 Product data sheet Barcode label dimensions Box barcode label l w (mm) Reel barcode label l w (mm) 100 75 100 75 All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 25 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch 17. Soldering of WLCSP packages 17.1 Introduction to soldering WLCSP packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note AN10439 "Wafer Level Chip Scale Package" and in application note AN10365 "Surface mount reflow soldering description". Wave soldering is not suitable for this package. All NXP WLCSP packages are lead-free. 17.2 Board mounting Board mounting of a WLCSP requires several steps: 1. Solder paste printing on the PCB 2. Component placement with a pick and place machine 3. The reflow soldering itself 17.3 Reflow soldering Key characteristics in reflow soldering are: * Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 30) than a SnPb process, thus reducing the process window * Solder paste printing issues, such as smearing, release, and adjusting the process window for a mix of large and small components on one board * Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature), and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic) while being low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 20. Table 20. Lead-free process (from J-STD-020D) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 30. NX5P3090 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 26 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 30. Temperature profiles for large and small components For further information on temperature profiles, refer to application note AN10365 "Surface mount reflow soldering description". 17.3.1 Stand off The stand off between the substrate and the chip is determined by: * The amount of printed solder on the substrate * The size of the solder land on the substrate * The bump height on the chip The higher the stand off, the better the stresses are released due to TEC (Thermal Expansion Coefficient) differences between substrate and chip. 17.3.2 Quality of solder joint A flip-chip joint is considered to be a good joint when the entire solder land has been wetted by the solder from the bump. The surface of the joint should be smooth and the shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps after reflow can occur during the reflow process in bumps with high ratio of bump diameter to bump height, i.e. low bumps with large diameter. No failures have been found to be related to these voids. Solder joint inspection after reflow can be done with X-ray to monitor defects such as bridging, open circuits and voids. 17.3.3 Rework In general, rework is not recommended. By rework we mean the process of removing the chip from the substrate and replacing it with a new chip. If a chip is removed from the substrate, most solder balls of the chip will be damaged. In that case it is recommended not to re-use the chip again. NX5P3090 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 27 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch Device removal can be done when the substrate is heated until it is certain that all solder joints are molten. The chip can then be carefully removed from the substrate without damaging the tracks and solder lands on the substrate. Removing the device must be done using plastic tweezers, because metal tweezers can damage the silicon. The surface of the substrate should be carefully cleaned and all solder and flux residues and/or underfill removed. When a new chip is placed on the substrate, use the flux process instead of solder on the solder lands. Apply flux on the bumps at the chip side as well as on the solder pads on the substrate. Place and align the new chip while viewing with a microscope. To reflow the solder, use the solder profile shown in application note AN10365 "Surface mount reflow soldering description". 17.3.4 Cleaning Cleaning can be done after reflow soldering. NX5P3090 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 28 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch 18. Abbreviations Table 21. Abbreviations Acronym Description ESD ElectroStatic Discharge CDM Charged Device Model HBM Human Body Model USB Universal Serial Bus VOIP Voice over Internet Protocol NX5P3090 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 29 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch 19. Revision history Table 22. Revision history Document ID Release date Data sheet status Change notice Supersedes NX5P3090 v.1 20160801 Product data sheet - - NX5P3090 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 30 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch 20. Legal information 20.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term `short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 20.2 Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification -- The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 20.3 Disclaimers Limited warranty and liability -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. NX5P3090 Product data sheet Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customer(s). Customer is responsible for doing all necessary testing for the customer's applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer's third party customer(s). NXP does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 31 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products -- Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors' warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors' specifications such use shall be solely at customer's own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors' standard warranty and NXP Semiconductors' product specifications. Translations -- A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 20.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 21. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com NX5P3090 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 1 August 2016 (c) NXP Semiconductors N.V. 2016. All rights reserved. 32 of 33 NX5P3090 NXP Semiconductors USB PD and type C current-limited power switch 22. Contents 1 2 3 4 4.1 5 6 7 7.1 7.2 8 8.1 8.2 8.3 8.4 8.4.1 8.4.2 8.4.3 8.5 8.6 8.7 9 10 11 12 13 13.1 13.2 13.3 13.4 13.5 13.6 14 14.1 15 16 16.1 16.2 16.3 16.4 16.5 17 17.1 17.2 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 EN Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Under-voltage lock-out . . . . . . . . . . . . . . . . . . . 5 ILIM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Over-current protection (OCP) . . . . . . . . . . . . . 5 Over-current at start-up . . . . . . . . . . . . . . . . . . 5 Over-current when enabled . . . . . . . . . . . . . . . 6 Short circuit when enabled . . . . . . . . . . . . . . . . 6 Reverse-Current protection (RCP) . . . . . . . . . . 6 FAULT output . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Over-temperature protection . . . . . . . . . . . . . . 6 Application diagram . . . . . . . . . . . . . . . . . . . . . 7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8 Recommended operating conditions. . . . . . . . 8 Thermal characteristics . . . . . . . . . . . . . . . . . . 9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 9 Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Thermal shutdown . . . . . . . . . . . . . . . . . . . . . 12 ON resistance . . . . . . . . . . . . . . . . . . . . . . . . . 13 ON resistance graphs . . . . . . . . . . . . . . . . . . . 13 Current limit . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Current limit graphs . . . . . . . . . . . . . . . . . . . . 14 Dynamic characteristics . . . . . . . . . . . . . . . . . 15 Waveform and test circuits . . . . . . . . . . . . . . . 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 21 Packing information . . . . . . . . . . . . . . . . . . . . 22 Packing method . . . . . . . . . . . . . . . . . . . . . . . 22 Product orientation . . . . . . . . . . . . . . . . . . . . . 23 Carrier tape dimensions . . . . . . . . . . . . . . . . . 23 Reel dimensions . . . . . . . . . . . . . . . . . . . . . . . 24 Barcode label . . . . . . . . . . . . . . . . . . . . . . . . . 25 Soldering of WLCSP packages. . . . . . . . . . . . 26 Introduction to soldering WLCSP packages . . 26 Board mounting . . . . . . . . . . . . . . . . . . . . . . . 26 17.3 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . 17.3.1 Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17.3.2 Quality of solder joint . . . . . . . . . . . . . . . . . . . 17.3.3 Rework. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17.3.4 Cleaning. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 19 Revision history . . . . . . . . . . . . . . . . . . . . . . . 20 Legal information . . . . . . . . . . . . . . . . . . . . . . 20.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 20.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 20.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Contact information . . . . . . . . . . . . . . . . . . . . 22 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 27 27 27 28 29 30 31 31 31 31 32 32 33 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP Semiconductors N.V. 2016. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 1 August 2016 Document identifier: NX5P3090