G3VM-61GR2(TR05) - OMRON - Datasheet.Live

1. General description

The NX5P3090 is a precision adjustable current-limited power switch for USB PD

application. The device includes under voltage lockout, over-temperature protection, and

reverse current protection circuits to automatically isolate the switch terminals when a

fault condition occurs. The 29 V tolerance on VBUS pin ensures the device is able to work

on a USB PD port; a current limit inpu t (ILIM) pin defines the over-current limit threshold;

an open-drain fault output (FAULT) indicates when a fault condition has occurred.

The over-current limit threshold can be programmed from 400 mA to 3.3 A, using an

external resistor between the ILIM pin and GND pin. In the over current condition, the

device will clamp the output current to the value set by ILIM and keep the switch on while

assert the FAULT flag. To minimize current surges during turn on, the device has built in

soft start which controls the power switch rise time.

Surge protection has been integrated in the device to enhance system robustness. The

enable input includes integrated logic level translation making the device compatible with

lower voltage processors and controllers.

NX5P3090 is offered in a 12 bump 1.35 x 1.65 mm, 0.4 mm pitch WLCSP package.

2. Features and benefits

VINT supply voltage range from 2.5 V to 5.5 V

29 V tolerance on VBUS and EN pin

Adjustable current limit from 400 mA to 3.3 A

Clamped current output in over-current condition

Ve ry low ON resistance: 34 m (typical)

Active HIGH EN pin with internal pull down resistor

All time Reverse Current Protection

Over Temperature Protection

Surge protec tion : IEC6 100 0- 4 -5 exceed s ±8 0 V on VBUS

Safety approvals

UL 62368-1, 2nd Edition, File no. 20160526-E470128

IEC 62368-1 (ed.2), File no. DK-54536-UL

ESD protection

 IEC61000-4-2 contact discharge exceeds 8 kV on VBUS

 HBM ANSI/ESDA/JEDEC JS-001 Class 2 exceeds 2 kV

CDM AEC standard Q100-01 (JESD22-C101E) exceeds 500 V

Specified from 40 Cto+85C ambient temperature

NX5P3090

USB PD and type C current-limited power switch

Rev. 1 — 1 August 2016 Product data sheet

Product data sheet Rev. 1 — 1 August 2016 2 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

3. Applications

Notebook and Ultrabook

USB PD and Type C port/hubs

Tablet and Sm ar t ph on e

4. Ordering information

4.1 Ordering options

5. Marking

Table 1. Ordering information

Type number Topside

marking Package

Name Description Version

NX5P3090UK X5PT2 WLCSP12 wafer level chip-scale package; 12 bumps; 1.65 x 1.35 x

0.525 mm; 0.4 mm pitch (backside coating included) SOT1390-5

Table 2. Ordering options

Type number Orderable

part number Package Packing method Minimum

order quantity Temperature

NX5P3090UK NX5P3090UKZ WLCSP12 REEL 7" Q1/T1

*SPECIAL MARK

CHIPS DP

3000 Tamb =40 C to +85 C

Table 3. Marking

Line Marking Description

A X5PT2 basic type name

B mmmmm wafer lot code (mmmmm)

C Z5YWW manufacturing code

Z = foundry location

5 = assembly loca ti on

Y = assembly year code

WW = assembly week code

Product data sheet Rev. 1 — 1 August 2016 3 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

6. Functional diagram

Fig 1. Lo gic diagram

OVER-CURRENT

CLAMPING

VBUS VINT

FAULT

ILIM

REVERSE-CURRENT

PROTECTION

UVLO

SURGE

PROTECTION

THERMAL

SHUTDOWN

Rpd

CONTROL

aaa-024124

Product data sheet Rev. 1 — 1 August 2016 4 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

7. Pinning information

7.1 Pinning

7.2 Pin description

Fig 2. Pin configuration Fig 3. Pin map

aaa-024125

123

Transparent top view

ball A1

index area NX5P3090

EN /FAULT ILIM

VINT VINT GND

VINT VBUS GND

VBUS VBUS GND

312

Transparent top view

aaa-024126

NX5P3090

Table 4. Pin description

Symbol Pin Description

VBUS C2, D1, D2 power output; 29 V tolerance

ILIM A3 current limiter setting. connects a resistor to GND to set the threshold

FAULT A2 fault condition indicator (open-drain output)

EN A1 enable input (active HIGH)

GND B3, C3, D3 ground (0 V)

VINT B1, C1, B2 power input

Product data sheet Rev. 1 — 1 August 2016 5 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

8. Functional description

[1] H = HIGH voltage level; L = LOW voltage level.

8.1 EN Input

When the EN pin is set LOW, the N-channel MOSFET will be disabled, the device will

enter low-pow er mod e disa blin g all pr ot ect ion c ircu its and settin g th e FAULT pin high

impedance. When EN is set HIGH, all protection circuits will be enabled and then, if no

fault conditions exist, the N-channel MOSFET will be turn on. There is a 100 us de-glitch

time on EN pin from LOW to HIGH.

8.2 Under-voltage lock-out

Independently of the logic level on the EN pin, the under-voltage lockout (UVLO) circuit

disables the N-channel MOSFET and enters low power mode until the input voltage

reaches the UVLO turn-on threshold level VUVLO.

8.3 ILIM

The over-current protection circuit's (OCP) trigger value Iocp can be set using an external

resistor RILIM connected between ILIM pin and GND pin. When EN is HIGH and the ILIM

pin is pulled to ground, the N-channel MOSFET will be disabled and the FAULT output set

LOW. The detailed IOCP setting is given in Section 8.4.

8.4 Over-current protection (OCP)

The device offers over current protection when enabled, three possible over-current

conditions can occur. These conditions are:

•Over-current at start-up, ISW > Iocp when enabling the N-channel MOSFET.

•Over-current after enabled, ISW > Iocp when the N-channel MOSFET is already ON.

•Short circuit after enabled, ISW > 10 A (typic al) .

In the over current condition, because the device clamps the output current rather than

completely shut down the switch, the power dissipation on the device might be increased

which could lead to over temperature protection (see Section 8.7).

8.4.1 Over-current at start-up

If the device senses a VBUS short to GND or over-current while enabling the N-channel

MOSFET, OCP is triggered. It limits the outp ut current to Iocp and after the de-glitch time

sets the FAULT output LOW.

Table 5. Function table[1]

EN VINT VBUS FAULT Switch

X <2.5V X Z under voltage lockout, switch open

L 2.5V to 5.5V X Z disabled; switch open

H 2.5V to 5.5V VBUS=VINT Z enabled; switch closed

H 2.5V to 5.5V 0V to VINT L over-current , clamped current output, switch closed

H 2.5V to 5.5V VBUS>VINT+40mV (>4ms) L reverse current; switch open

H 2.5V to 5.5V Z L Over-temperature; switch open

Product data sheet Rev. 1 — 1 August 2016 6 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

8.4.2 Over-current when enabled

If the device senses ISW > Iocp after enabled, OCP is triggered. It limits the output current

to Iocp and af ter the de-g litch time sets the F AULT output LOW. Limiting the output current

reduces VO(VOUT).

8.4.3 Short circuit when enabled

If the device senses ISW > 10 A after enabled, a short circuit is detected. The device

disables the N-channe l MOSFET immediately. It then re-enables the N-chan nel MOSFET

and limit the output current to Iocp, and after the de-glitch time the FAULT output is set

LOW.

8.5 Reverse-Current protection (RCP)

When the VBUS pin voltage exceeds the input voltage by 40 mV (typical) the device will

protect itself from damage by switching of f the MOSFET after 4 ms de-glitch time.

When the VBUS pin voltage exceeds the VINT voltage by 100 mV, the device will

shutdown the FET imme dia te l y with ou t an y de -g litch time .

FAULT pin will be set LOW in the reverse-current protection condition.

In the RCP state, when the VBUS voltage drops below VINT voltage, the device will exit

the RCP state in 128 us and resume normal operation.

Before normal turn on, the device will always check the RCP condition first, if higher

voltage is detected on VBUS pin, it will never turn on the power MOSFET even EN pin is

pulled HIGH.

8.6 FAULT output

The FAULT output is an open-drain ou tput th at requir es an external pu ll-up resistor. If any

of the protection circuits is activated, the FAULT output will be set LOW to indicate a fault

has occurred. The FAULT output will return to the high impedance state automatically

once the fault condition is removed. An internal delay (de-glitch) circuit for the over-cur rent

protection (8 ms typical) and reverse-current protection (4 ms typical) is used when

entering fault conditions. This ensures that FAULT is not accide ntally asserte d .

Over-temperature condition will not be deglitched, the FAULT signal will be asserted

immediately.

8.7 Over-temperature protection

When EN is HIGH, the device junction temperature exceeds 140 °C, the over-temperature

protection (OTP) circuit will disable the N-channel MOSFET and indicate a fault condition

by setting the FAULT pin LOW. Any transition on the EN pin will have no effect. Once the

device temperature decreases below 115 °C the device will return to the defined state.

Product data sheet Rev. 1 — 1 August 2016 7 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

9. Application diagram

0.1 F ceramic capacitor (CINT) is required for local decoupling. Higher capacitor values CINT further reduce the voltage drop at

the input. When driving inductive loads, a larger capacitance CINT prevents voltage spikes from exceeding absolute maximum

voltage of VIN. The CBUS capacitor should be placed as closer as possible to VBUS pin.

Fig 4. App lic a t io n dia gram

5 V

SOURCE

USB connector

VINT

VBUS

ILIM

GND

USB

CONTROLLER/

PROCESSOR

VBUS

GND

VDD

47 KΩ

CINT

CBUS

/FAULT

aaa-024128

RILIM

Product data sheet Rev. 1 — 1 August 2016 8 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

10. Limiting values

[1] The minimum input voltage rating may be exceeded if the input current rating is observed.

[2] The minimum and maximum switch voltage ratings may be exceeded if the switch clamping current rating is observed.

[3] Internally limited.

[4] The (absolute) maximum power dissipation depends on the junction temperature Tj. Higher power dissipation is allowed in conjunction

with lower ambient temperatures. The conditions to determine the specified values are Tamb = 25 °C and the use of a two layer PCB.

11. Recommended operating conditions

[1] Current-limit threshold resistor range from ILIM to GND.

Table 6. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions Min Max Unit

VIinput voltage VBUS, EN [1] 0.5 +29 V

VINT [2] 0.5 +6 V

ILIM 0.5 +6 V

VOoutput voltage FAULT [1] 0.5 +6 V

IIK input clamping current input EN: VI(EN) <0.5 V 50 - mA

input ILIM: VI(ILIM) <0.5 V 50 - mA

II(source) input source current input IILIM - 1 mA

IOK output clamping current VO<0V 50 - mA

ISK switch clamping current input VIN: VI(VIN) <0.5 V 50 - mA

output VOUT: VO(VOUT) <0.5 V 50 - mA

ISW switch current VSW >0.5 V [3] -3.6A

Tj(max) maximum junction

temperature 40 +150 C

Tstg storage temperature 65 +150 C

Ptot total power dissipation [4] -910mW

Table 7. Recommended operating con ditions

Symbol Parameter Conditions Min Max Unit

VIinput voltage VINT 2.5 5.5 V

EN; VBUS (OFF state) 0 20 V

VO Output voltage VBUS 0 5 V

ISW switch current Tj = 40 C to +85 C03A

IO(sink) output sink current output FAULT 10 - mA

RILIM current limit resistance input ILIM [1] 16 140 k

Cdec decoupling capacitance VIN to GND 0.1 - F

Tamb ambient temperature 40 +85 C

Product data sheet Rev. 1 — 1 August 2016 9 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

12. Thermal characteristics

[1] Rth(j-a) is dependent upon board layout. To minimize Rth(j-a), ensure all pins have a solid connection to larger copper layer areas. In

multi-layer PCBs, the second layer should be used to create a large heat spreader area below the device. Avoid using solder-stop

varnish under the device.

13. Static characteristics

[1] Typical values are measured at Tamb = 25 C.

Table 8. Thermal characteristics

Symbol Parameter Conditions Typ Unit

Rth(j-a) thermal resistance from junction to ambient [1] 109 K/W

Table 9. Static characteristics

At recommended operating conditions; VI(VINT) = VI(EN), RFAULT = 10 k



unless otherwise specified; Voltages are referenced

to GND (ground = 0 V). See Figure 10

Symbol Parameter Conditions Min Typ[1] Max Unit

VIH HIGH-level input

voltage EN input; VI(VINT) = 2.5 V to 5.5 V; 1.2 - - V

VIL LOW-level input

voltage EN input; VIVINT) = 2.5 V to 5.5 V; - - 0.4 V

IIinput leakage

current EN input; VI(VINT) = 5.0 V; - - 7.5 A

I(VIN) supply current VBUS open; VI(VINT) = 5.0 V

EN = GND (low power mode); - 0.9 5 A

EN = VI(VIN); RILIM = 33 k - 196 280 A

EN = VI(VIN); RILIM = 16 k - 210 290 A

IS(OFF) VBUS OFF-State

leakage current VI(VINT) =5.0V; V

I(VBUS) = 0 V; EN = LOW - 1 10 A

VINT OFF-state

leakage current VI(VBUS) = 5.0 V; VI(VINT) =0V;

EN = LOW -110A

IS(ON) RCP leakage

current VI(VINT) =0V; V

I(VBUS) =5 V; EN = 5 V - 0.9 10 A

Rpd EN pin Pull-down

resistance VI(VINT) = 5 V 1 M

Vtrip trip le ve l vo ltage RCP; VI(VINT) = 2.5 V to 5.5 V - 40 - mV

VUVLO under voltage

lockout voltage VINT pin - 2.27 2.45 V

Vhys(UVLO) under vo ltage

lockout hysteresis

voltage

-100-mV

VOL LOW-level output

voltage FAULT; IO=8 mA - - 0.5 V

CI EN pin - 13.5 - pF

Product data sheet Rev. 1 — 1 August 2016 10 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

13.1 Graphs

VI(EN) = GND; VI(VINT) = 5.0 V

Fig 5. OFF state supply current versus temperature

VI(EN) = VI(VINT); VI(VINT) = 5.0 V

(1) RILIM = 33 K

(2) RILIM = 16 K

Fig 6. O N state supply curre nt versus temperature

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Product data sheet Rev. 1 — 1 August 2016 11 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

VI(EN) = GND; VI(VBUS) = 0 V; RILIM = 16 K

(1) Tamb = -40 C

(2) Tamb = +25 C

(3) Tamb = +85 C

Fig 7. VBUS off state leakage versu s temperature

VI(EN) = GND; VI(VINT) = 0 V; RILIM = 16 K

(1) Tamb = -40 C

(2) Tamb = +25 C

(3) Tamb = +85 C

Fig 8. VINT off state leakage versus temperature

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Product data sheet Rev. 1 — 1 August 2016 12 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

13.2 Thermal shutdown

RILIM = 20 k; VI(VINT) = 0 V

(1) Surge current

(2) Surge voltage on VBUS

Fig 9. Surge prote c tio n wa v efo rm

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Fig 10. Typical characteristics refer ence schematic

aaa-024133

VINT VBUS

ILIM

GND

FAULT

10 kΩ

RILIM

1 μF

FAULT signal

control signal

VIN VOUT

10 μF

Table 10. T hermal shutdown

VI(VINT) = VI(EN), RFAULT = 10 k



unless otherwise specified; Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions Min Typ Max Unit

Tth(ots) over temperature shutdown

threshold temperature VI(VINT) = 2.5 to 5.5 V - 140 - C

Tth(otp)hys hysteresis of over temperature

protection threshold temperature VI(VINT) = 2.5 to 5.5 V - 25 - C

Product data sheet Rev. 1 — 1 August 2016 13 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

13.3 ON resistance

13.4 ON resistance graphs

Table 11. ON resistance

VI(VINT) = VI(EN), RFAULT = 10 k



unless otherwise specified; Voltages are referenced to GND (ground = 0 V). See Figure 10

Symbol Parameter Conditions Min Typ Max Unit

RON ON resistance VI(VINT) = 2.5 to 5.5 V; see Figure 11

Tamb = 25 C - 34 37 m

Tamb = 40 C to +85 C--46m

VI(VINT) = 5.0 V

Fig 11. Typical ON resistance versus temperature

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Fig 12. Typical ON resistance versus enable time

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Product data sheet Rev. 1 — 1 August 2016 14 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

13.5 Current limit

[1] Typical values are measured at Tamb = 25 C. 1 % tolerance resistor is recommend for RILIM

Iocp can be calculated with below equation, x = RILIM (k):

(1)

(2)

(3)

13.6 Current limit graphs

Table 12. Current limit

VI(VINT) = VI(EN), RFAULT = 10 k



unless otherwise specified; Voltages are referenced to GND (ground = 0 V). See Figure 10

Symbol Parameter Conditions Min Typ[1] Max Unit

Iocp over current

protection current VI(VINT) = 2.5 to 5.5 V; Tamb = 40 C to +85 C;

RILIM = 140 k330 421 465 mA

RILIM = 100 k480 581 625 mA

RILIM = 54 k915 1057 1107 mA

RILIM = 33 k1505 1723 1780 mA

RILIM = 24.5 k2085 2330 2398 mA

RILIM = 20 k2567 2848 2920 mA

RILIM = 16 k3186 3490 3585 mA

ILIM shorted to VINT 125 180 220 mA

IOCP MAX

49495x 0.948–

IOCP TYP52775x 0.979–

IOCP MIN57949x 1.042–

Fig 13. Typical over current prot ection current versus externa l resistor value RILIM

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Product data sheet Rev. 1 — 1 August 2016 15 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

14. Dynamic characteristics

[1] Typical values are measured at Tamb = 25 C.

14.1 Waveform and test circuits

Table 13. Dynamic characteristics

At recommended operating conditions; VI(VINT) = VI(EN), RFAULT = 10 k



unless otherwise specified; voltages are referenced to

GND (ground = 0 V).

Symbol Parameter Conditions Min Typ[1] Max Unit

tTLH LOW to HIGH output

transition time VOUT; CL = 1 F; RL = 100 ; see Figure 14

and Figure 15

VI(VINT) =5.0V - 2.5 - ms

VI(VINT) =2.5V - 1.4 - ms

tTHL HIGH to LOW output

transition time VOUT; CL = 1 F; RL = 100 ; see Figure 14

and Figure 15

VI(VINT) =5.0V - 0.2 - ms

VI(VINT) =2.5V - 0.2 - ms

ten enable time EN to VOUT; CL = 1 F; RL = 100 ;

seeFigure 14and Figure 15

VI(VINT) =5.0V - 1.5 - ms

tdis disable time EN to VOUT; CL = 1 F; RL = 100 ; see

Figure 14 and Figure 15

VI(VINT) =5.0V - 13 - s

tdegl deglitch time FAULT in OCP; VI(VINT) =5V - 8 - ms

RCP; FAULT in RCP; VI(VINT) =5V - 4 - ms

Measurement points are given in Table 14.

Logic level: VOH is the typical output voltage that occurs with the output load.

Fig 14. Switc hin g time s a nd ris e an d fa ll time s

aaa-024134

EN input

VBUS output

ten tdis

tTHL

tTLH

VOH

GND

Table 14. Measurement points

Supply voltage EN Input Output

VI(VIN) VMVXVY

5.0 V 0.5  VI(EN) 0.9  VOH 0.1  VOH

Product data sheet Rev. 1 — 1 August 2016 16 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

Test data is given in Table 15.

Definitions test circuit:

RL = Load resistance.

CL = Load capacitance including jig and probe capacitance.

VEXT = External voltage for measuring switching times.

Fig 15. Test circuit for measuring switching times

aaa-011077

VOUT

VIN

VEXT

VIRL

Table 15. Test data

Supply voltage EN Input Load

VEXT VI(EN) CLRL

5.0 V 0 to VI(VIN) 1F 100 

VI(VINT) = 5 V; RL = 5.1 ; CL = 1 F;

(1) VO(VBUS)

(2) I(VIN)

(3) VI(EN)

Fig 16. Typical 1 F load enable time and inrush current

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Product data sheet Rev. 1 — 1 August 2016 17 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

VI(VIN) = 5 V; RL = 5.1 ; CL = 100 F;

(1) VO(VBUS)

(2) I(VIN)

(3) VI(EN)

Fig 17. Typical 100 F load enab le time and inrush current

VI(VINT) = 5 V; RL = 5.1 ; CL = 1 F;

(1) VO(VBUS)

(2) I(VIN)

(3) VI(EN)

Fig 18. Typical 1 F load turn off

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Product data sheet Rev. 1 — 1 August 2016 18 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

VI(VIN) = 5 V; RL = 5.1 ; CL = 100 F

(1) VO(VBUS)

(2) I(VIN)

(3) VI(EN)

Fig 19. Typical 100 F load turn off

VI(VINT) = 4 V

(1) VO(VBUS)

(2) VI(VINT)

(3) I(VIN)

(4) FAULT

Fig 20. Reverse-current protection response

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Product data sheet Rev. 1 — 1 August 2016 19 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

VI(VIN) = 4V

(1) VO(VBUS)

(2) VI(VINT)

(3) I(VIN)

(4) FAULT

Fig 21. Reverse-current protection recovery

VI(VIN) = 5 V; RILIM = 33 k.

(1) VO(VBUS).

(2) VI(VINT)

(3) I(VIN)

(4) FAULT

Fig 22. Device into current limit after enabled

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Product data sheet Rev. 1 — 1 August 2016 20 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

VI(VIN) = 5 V; RILIM = 33 k.

(1) VO(VBUS)

(2) VI(VINT)

(3) I(VIN)

(4) FAULT

Fig 23. Device start up with VBUS short to GND

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Product data sheet Rev. 1 — 1 August 2016 21 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

15. Package outline

Fig 24. Package outline WLCSP12

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Product data sheet Rev. 1 — 1 August 2016 22 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

16. Packing information

16.1 Packing method

Fig 25. Reel dry pack for SMD: guard band; embossed tape

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Product data sheet Rev. 1 — 1 August 2016 23 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

[1] d = reel diameter; w = tape width.

[2] Packing quantity dependent on specific product type.

View ordering and availability details at NXP order portal, or contact your local NXP representative.

16.2 Product orientation

16.3 Carrier tape dimensions

Ta ble 16. Dimensions and quantities

Reel dimensions

dw (mm) [1] SPQ/PQ

(pcs) [2] Reels

per box Outer box dimensions

lwh (mm)

180 8 3000 1 209 206 34

Tape pocket quadrants Ball 1 is in quadrant Q1/T1

Fig 26. Product orientation in carrier tape

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Table 17. Carrier tape dimensions

In accordance with IEC 60286-3.

A0 (mm) B0 (mm) K0 (mm) T (mm) P1 (mm) W (mm)

1.61 0.05 1.78 0.05 0.73 0.05 0.25 0.02 4.0 0.1 8 0.3 /  0.1

001aao148

4 mm

direction of feed

Product data sheet Rev. 1 — 1 August 2016 24 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

16.4 Reel dimensions

Fig 28. Schematic view of reel

Table 18. Reel dimensions

In accordance with IEC 60286-3.

A [nom]

(mm) W2 [max]

(mm) B [min]

(mm) C [min]

(mm) D [min]

(mm)

180 14.4 1.5 12.8 20.2

detail Z

001aao149

Ø C Ø D

Product data sheet Rev. 1 — 1 August 2016 25 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

16.5 Barcode label

Fig 29. Example of typi cal box and reel information barcode label

Table 19. Barcode label dimensions

Box barcode label

lw (mm) Reel barcode label

lw (mm)

100 75 100 75

001aak714

NXP SEMICONDUCTORS

MADE IN >COUNTRY<

[PRODUCT INFO]

(33T) PUID: B.0987654321

(30T) LOT2

(30D) DATE2

(30Q) QTY2

(31D) REDATE

(32T) ORIG

(31T) PMC

(31P) MSL/PBT

MSL/PBT

Optional product information*

Fixed text

Country of origin

i.e. "Made in....." or

"Diffused in EU [+]

Assembled in......

Packing unit (PQ) identification

2nd traceability lot number*

Traceability lot number

Date code

With linear barcode

Type number

NXP 12NC

Quantity

2nd (youngest) date code*

2nd Quantity*

Re-approval date code*

Origin code

Product Manufacturing Code

MSL at the Peak Body solder

temperature with tin/lead*

MSL at the higher lead-free

Peak Body Temperature*

2D matrix with all data

(including the data identifiers)

Additional info if halogen

free product

Additional info on RoHS

Lead-free symbol

HALOGEN FREE

RoHS compliant

(1T) LOT

(9D) DATE

(Q) QTY

(30P) TYPE

(1P) CODENO

Product data sheet Rev. 1 — 1 August 2016 26 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

17. Soldering of WLCSP packages

17.1 Introduction to soldering WLCSP packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note

AN10439 “W afer Level Chip Scale Package” and in application note AN10365 “Surface

mount reflow soldering description”.

Wave soldering is not suitable for this package.

All NXP WLCSP packages are lead-free.

17.2 Board mounting

Board mounting of a WLCSP requires several steps:

1. Solder paste printing on the PCB

2. Component placement with a pick and place machine

3. The reflow soldering itself

17.3 Reflow soldering

Key characteristics in reflow soldering are :

•Lead-free ve rsus SnPb soldering; note th at a lead-free reflow process usua lly leads to

higher minimum peak temperatures (see Figure 30) than a SnPb process, thus

reducing the process window

•Solder paste printing issues, such as smearing, release, and adjusting the process

window for a mix of large and small components on one board

•Reflow temperature profile; this profile includes preheat, reflow (in which the board is

heated to the peak temperature), and cooling down. It is imperative that the peak

temperature is high enoug h for the solder to make reliable solder joint s (a solder paste

characterist ic) while be ing low en oug h th at th e packages an d/or boards are no t

damaged. The pea k temperature of the package depends on packag e thickness and

volume and is classified in accordance with Table 20.

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 30.

Table 20. Lead-free process (from J-STD-020D)

Package thickness (mm) Package reflow temperature (C)

Volume (mm3)

< 350 350 to 2000 > 2000

< 1.6 260 260 260

1.6 to 2.5 260 250 245

> 2.5 250 245 245

Product data sheet Rev. 1 — 1 August 2016 27 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

For further information on temperature profiles, refe r to application note AN10365

“Surface mount reflow soldering description”.

17.3.1 Stand off

The stand off between the substrate and the chip is determined by:

•The amount of printed solder on the substrate

•The size of the solder land on the substrate

•The bump height on the chip

The higher the stand of f, the better the stresses are released due to TEC (Thermal

Expansion Coefficient) differences between substrate and chip.

17.3.2 Quality of solder joint

A flip-chip joint is considered to be a good joint when the entire solder land has been

wetted by the solder from the bump. The surface of the joint should be smooth and the

shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps

after reflow can occur during the reflow process in bumps with high ratio of bump diameter

to bump height, i.e. low bumps with large diameter. No failures have been found to be

related to these voids. Solder joint inspection after reflow can be done with X-ray to

monitor defects such as bridging, open circuits and voids.

17.3.3 Rework

In general, rework is not recommended. By rework we mean the process of removing the

chip from the substrate and replacing it with a new chip. If a chip is removed from the

substrate, most solder balls of the chip will be damaged. In that case it is recommended

not to re-use the chip again.

MSL: Moisture Sensitivity Level

Fig 30. Temperature profiles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Product data sheet Rev. 1 — 1 August 2016 28 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

Device removal can be done when the substrate is heated until it is certain that all solder

joints are molten. The chip can then be carefully removed from the substrate without

damaging the tracks and solder lands on the substrate. Removing the device must be

done using plastic tweezers, because metal tweezers can damage the silicon. The

surface of the substrate should be carefully cleaned and all solder and flux residues

and/or underfill removed. When a new chip is placed on the substrate, use the flux

process instead of solder on the sold er lands. Apply flux on the bumps at the chip side as

well as on the solder pads on the substrate. Place and align the new chip while viewing

with a microscope. To reflow the solder, use the solder profile shown in application note

AN10365 “Surface mount reflow soldering description”.

17.3.4 Cleaning

Cleaning can be done after reflow soldering.

Product data sheet Rev. 1 — 1 August 2016 29 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

18. Abbreviations

Table 21. Abbreviations

Acronym Description

ESD ElectroStatic Discharge

CDM Charged Device Mo del

HBM Human Body Model

USB Universal Serial Bus

VOIP Voice over Internet Protocol

Product data sheet Rev. 1 — 1 August 2016 30 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

19. Revision history

Table 22. Revision history

Document ID Release date Data sheet status Change notice Supersedes

NX5P3090 v.1 20160801 Product data sheet - -

Product data sheet Rev. 1 — 1 August 2016 31 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

20. Legal information

20.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

20.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full dat a sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semicond uctors sales

office. In case of any inconsistency or conflict with the shor t data sheet, the

full data sheet shall pre va il.

Product specificat io n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

20.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warrant ies, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggreg ate and cumulative l iability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconduct ors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in app lications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or envi ronmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications and ther efore such inclu sion and/or use is at the cu stomer’s own

risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for t he customer’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Custo mers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party custo mer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings onl y and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or the gr ant,

conveyance or implication of any license under any copyrights, patents or

other industrial or inte llectual property rights.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contain s data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 1 — 1 August 2016 32 of 33

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automo tive use. It i s neit her qua lif ied nor test ed

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standards, custome r

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such au tomotive applicat ions, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconduct ors for an y

liability, damages or failed product claims resulting f rom customer design an d

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

20.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

21. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors NX5P3090

USB PD and type C current-limited power switch

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 1 August 2016

Document identifier: NX5P3090

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

22. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4.1 Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 2

5 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3

7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Functional description . . . . . . . . . . . . . . . . . . . 5

8.1 EN Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

8.2 Under-voltage lock-out . . . . . . . . . . . . . . . . . . . 5

8.3 ILIM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

8.4 Over-current protection (OCP) . . . . . . . . . . . . . 5

8.4.1 Over-current at start-up . . . . . . . . . . . . . . . . . . 5

8.4.2 Over-current when enabled . . . . . . . . . . . . . . . 6

8.4.3 Short circuit when enabled . . . . . . . . . . . . . . . . 6

8.5 Reverse-Current protection (RCP) . . . . . . . . . . 6

8.6 FAULT output . . . . . . . . . . . . . . . . . . . . . . . . . . 6

8.7 Over-temperature protection . . . . . . . . . . . . . . 6

9 Application diagram . . . . . . . . . . . . . . . . . . . . . 7

10 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8

11 Recommended operating conditions. . . . . . . . 8

12 Thermal characteristics . . . . . . . . . . . . . . . . . . 9

13 Static characteristics. . . . . . . . . . . . . . . . . . . . . 9

13.1 Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

13.2 Thermal shutdown . . . . . . . . . . . . . . . . . . . . . 12

13.3 ON resistance. . . . . . . . . . . . . . . . . . . . . . . . . 13

13.4 ON resistance graphs. . . . . . . . . . . . . . . . . . . 13

13.5 Current limit . . . . . . . . . . . . . . . . . . . . . . . . . . 14

13.6 Current limit graphs . . . . . . . . . . . . . . . . . . . . 14

14 Dynamic characteristics . . . . . . . . . . . . . . . . . 15

14.1 Waveform and test circuits . . . . . . . . . . . . . . . 15

15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 21

16 Packing information . . . . . . . . . . . . . . . . . . . . 22

16.1 Packing method . . . . . . . . . . . . . . . . . . . . . . . 22

16.2 Product orientation . . . . . . . . . . . . . . . . . . . . . 23

16.3 Carrier tape dimensions . . . . . . . . . . . . . . . . . 23

16.4 Reel dimensions. . . . . . . . . . . . . . . . . . . . . . . 24

16.5 Barcode label . . . . . . . . . . . . . . . . . . . . . . . . . 25

17 Soldering of WLCSP packages. . . . . . . . . . . . 26

17.1 Introduction to soldering WLCSP packages. . 26

17.2 Board mounting . . . . . . . . . . . . . . . . . . . . . . . 26

17.3 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . 26

17.3.1 Stand off. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

17.3.2 Quality of solder joint . . . . . . . . . . . . . . . . . . . 27

17.3.3 Rework. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

17.3.4 Cleaning. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

18 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 29

19 Revision history . . . . . . . . . . . . . . . . . . . . . . . 30

20 Legal information . . . . . . . . . . . . . . . . . . . . . . 31

20.1 Data sheet status. . . . . . . . . . . . . . . . . . . . . . 31

20.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

20.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 31

20.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 32

21 Contact information . . . . . . . . . . . . . . . . . . . . 32

22 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33