SDLS025B - DECEMBER 1983 - REVISED OCTOBER 2003 D Package Options Include Plastic Small-Outline (D, NS, PS), Shrink Small-Outline (DB), and Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) DIPs SN5400 . . . J PACKAGE SN54LS00, SN54S00 . . . J OR W PACKAGE SN7400, SN74S00 . . . D, N, OR NS PACKAGE SN74LS00 . . . D, DB, N, OR NS PACKAGE (TOP VIEW) 1A 1B 1Y 2A 2B 2Y GND 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC 4B 4A 4Y 3B 3A 3Y 2 13 3 12 VCC 2Y 2A 2B 4 11 5 10 6 9 7 8 1 8 2 7 3 6 4 5 VCC 2B 2A 2Y SN54LS00, SN54S00 . . . FK PACKAGE (TOP VIEW) 1B 1A NC VCC 4B 14 SN74LS00, SN74S00 . . . PS PACKAGE (TOP VIEW) 4Y 4B 4A GND 3B 3A 3Y 1Y NC 2A NC 2B 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 4A NC 4Y NC 3B 2Y GND NC 3Y 3A 1 Positive-NAND Gate in Small-Outline (PS) Package 1A 1B 1Y GND SN5400 . . . W PACKAGE (TOP VIEW) 1A 1B 1Y D Also Available as Dual 2-Input NC - No internal connection description/ordering information These devices contain four independent 2-input NAND gates. The devices perform the Boolean function Y = A * B or Y = A + B in positive logic. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated ! "#$ ! %#&'" ($) (#"! " !%$""! %$ *$ $! $+! !#$! !(( ,-) (#" %"$!!. ($! $"$!!'- "'#($ $!. '' %$$!) %(#"! "%' / 0121 '' %$$! $ $!$( #'$!! *$,!$ $() '' *$ %(#"! %(#" %"$!!. ($! $"$!!'- "'#($ $!. '' %$$!) POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SDLS025B - DECEMBER 1983 - REVISED OCTOBER 2003 description/ordering information (continued) ORDERING INFORMATION PDIP - N Tube SOIC - D 0C 0 C to 70 70C C SOP - NS -55C to 125C ORDERABLE PART NUMBER PACKAGE TA SN74LS00N SN74LS00N SN74S00N SN74S00N Tape and reel SN7400DR Tube SN74LS00D Tape and reel SN74LS00DR Tube SN74S00D Tape and reel SN74S00DR Tape and reel SSOP - DB Tape and reel CDIP - J Tube Tube LCCC - FK SN7400N SN7400D SOP - PS CFP - W SN7400N Tube Tape and reel Tube TOP-SIDE MARKING 7400 LS00 S00 SN7400NSR SN7400 SN74LS00NSR 74LS00 SN74S00NSR 74S00 SN74LS00PSR LS00 SN74S00PSR S00 SN74LS00DBR LS00 SNJ5400J SNJ5400J SNJ54LS00J SNJ54LS00J SNJ54S00J SNJ54S00J SNJ5400W SNJ5400W SNJ54LS00W SNJ54LS00W SNJ54S00W SNJ54S00W SNJ54LS00FK SNJ54LS00FK SNJ54S00FK SNJ54S00FK Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE (each gate) INPUTS A B OUTPUT Y H H L L X H X L H logic diagram, each gate (positive logic) A Y B 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SDLS025B - DECEMBER 1983 - REVISED OCTOBER 2003 schematic '00 VCC 4 k 130 1.6 k A B Y 1 k GND 'LS00 'S00 VCC 20 k VCC 120 8 k 900 2.8 k 50 A 3.5 k A B 12 k 4 k Y B Y 500 1.5 k 250 3 k GND GND Resistor values shown are nominal. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SDLS025B - DECEMBER 1983 - REVISED OCTOBER 2003 absolute maximum ratings over operating free-air temperature (unless otherwise noted) Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V Input voltage: '00, 'S00 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V 'LS00 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V Package thermal impedance, JA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86C/W DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76C/W PS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. Voltage values are with respect to network ground terminal. 2. The package termal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) SN5400 VCC VIH Supply voltage VIL IOH Low-level input voltage IOL TA Low-level output current High-level input voltage SN7400 MIN NOM MAX MIN NOM MAX 4.5 5 5.5 4.75 5 5.25 2 2 High-level output current -55 V V 0.8 0.8 V -0.4 -0.4 mA 16 mA 70 C 16 Operating free-air temperature UNIT 125 0 NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) SN5400 TEST CONDITIONS PARAMETER VIK VOH VCC = MIN, VCC = MIN, II = -12 mA VIL = 0.8 V, VOL II VCC = MIN, VCC = MAX, VIH = 2 V, VI = 5.5 V IIH IIL VCC = MAX, VCC = MAX, VI = 2.4 V VI = 0.4 V IOS VCC = MAX ICCH ICCL VCC = MAX, VCC = MAX, MIN TYP 2.4 3.4 SN7400 MAX MIN TYP 2.4 3.4 -1.5 IOH = -0.4 mA IOL = 16 mA 0.2 -1.5 0.4 0.2 1 UNIT V V 0.4 1 V mA 40 40 A -1.6 -1.6 mA -55 mA 4 8 mA 12 22 12 For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions. All typical values are at VCC = 5 V, TA = 25C. Not more than one output should be shorted at a time. 22 mA 4 -20 MAX VI = 0 V VI = 4.5 V POST OFFICE BOX 655303 -55 4 * DALLAS, TEXAS 75265 8 -18 SDLS025B - DECEMBER 1983 - REVISED OCTOBER 2003 switching characteristics, VCC = 5 V, TA = 25C (see Figure 1) PARAMETER tPLH FROM (INPUT) TO (OUTPUT) A or B Y SN5400 SN7400 TEST CONDITIONS MIN RL = 400 , tPHL UNIT TYP MAX 11 22 7 15 CL = 15 pF ns recommended operating conditions (see Note 4) SN54LS00 VCC VIH Supply voltage VIL IOH Low-level input voltage IOL TA Low-level output current SN74LS00 MIN NOM MAX MIN NOM MAX 4.5 5 5.5 4.75 5 5.25 High-level input voltage 2 2 High-level output current -55 V V 0.7 0.8 V -0.4 -0.4 mA 8 mA 70 C 4 Operating free-air temperature UNIT 125 0 NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) VIK VOH SN54LS00 TEST CONDITIONS PARAMETER VCC = MIN, VCC = MIN, II = -18 mA VIL = MAX, MIN TYP SN74LS00 MAX MIN TYP -1.5 IOH = -0.4 mA IOL = 4 mA 2.5 3.4 -1.5 2.7 0.25 MAX 0.4 3.4 UNIT V V 0.25 0.4 0.35 0.5 VOL VCC = MIN, VIH = 2 V II IIH VCC = MAX, VCC = MAX, VI = 7 V VI = 2.7V 0.1 0.1 20 20 A IIL VCC = MAX, VI = 0.4 V -0.4 -0.4 mA IOS VCC = MAX -100 mA ICCH ICCL VCC = MAX, VCC = MAX, IOL = 8mA -20 -100 VI = 0 V VI = 4.5 V -20 V mA 0.8 1.6 0.8 1.6 mA 2.4 4.4 2.4 4.4 mA For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions. All typical values are at VCC = 5 V, TA = 25C. Not more than one output should be shorted at a time. switching characteristics, VCC = 5 V, TA = 25C (see Figure 1) PARAMETER tPLH FROM (INPUT) TO (OUTPUT) A or B Y tPHL POST OFFICE BOX 655303 TEST CONDITIONS SN54LS00 SN74LS00 MIN RL = 2 k, CL = 15 pF * DALLAS, TEXAS 75265 UNIT TYP MAX 9 15 10 15 ns 5 SDLS025B - DECEMBER 1983 - REVISED OCTOBER 2003 recommended operating conditions (see Note 5) SN54S00 SN74S00 MIN NOM MAX MIN NOM MAX 4.5 5 5.5 4.75 5 5.25 UNIT VCC VIH Supply voltage VIL IOH Low-level input voltage 0.8 0.8 V High-level output current -1 -1 mA IOL TA Low-level output current 20 20 mA 70 C High-level input voltage 2 Operating free-air temperature 2 -55 125 V V 0 NOTE 5: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) SN54S00 TEST CONDITIONS PARAMETER VIK VOH VCC = MIN, VCC = MIN, II = -18 mA VIL = 0.8 V, VOL II VCC = MIN, VCC = MAX, VIH = 2 V, VI = 5.5 V IIH IIL VCC = MAX, VCC = MAX, VI = 2.7 V VI = 0.5V IOS VCC = MAX ICCH ICCL VCC = MAX, VCC = MAX, MIN TYP 2.5 3.4 SN74S00 MAX MIN TYP 2.7 3.4 -1.2 IOH = -1 mA IOL = 20 mA -40 MAX -1.2 UNIT V V 0.5 0.5 1 1 50 50 A -2 -2 mA -100 mA 10 16 mA 20 36 20 For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions. All typical values are at VCC = 5 V, TA = 25C. Not more than one output should be shorted at a time. 36 mA VI = 0 V VI = 4.5 V -100 10 -40 V mA 16 switching characteristics, VCC = 5 V, TA = 25C (see Figure 1) PARAMETER tPLH FROM (INPUT) TO (OUTPUT) A or B Y tPHL tPLH A or B Y tPHL 6 POST OFFICE BOX 655303 SN54S00 SN74S00 TEST CONDITIONS MIN RL = 280 , CL = 15 pF RL = 280 , CL = 50 pF * DALLAS, TEXAS 75265 UNIT TYP MAX 3 4.5 3 5 4.5 5 ns ns SDLS025B - DECEMBER 1983 - REVISED OCTOBER 2003 PARAMETER MEASUREMENT INFORMATION SERIES 54/74 DEVICES VCC Test Point VCC RL From Output Under Test CL (see Note A) CL (see Note A) High-Level Pulse 1.5 V S2 LOAD CIRCUIT FOR 3-STATE OUTPUTS 3V Timing Input 1.5 V 1 k Test Point LOAD CIRCUIT FOR OPEN-COLLECTOR OUTPUTS LOAD CIRCUIT FOR 2-STATE TOTEM-POLE OUTPUTS S1 (see Note B) CL (see Note A) RL (see Note B) RL From Output Under Test VCC From Output Under Test Test Point 1.5 V 0V tw Low-Level Pulse 1.5 V tsu 0V In-Phase Output (see Note D) tPHL VOH 1.5 V Out-of-Phase Output (see Note D) 1.5 V 3V 1.5 V Waveform 1 (see Notes C and D) tPLZ VOH 1.5 V 1.5 V VOL VOL Waveform 2 (see Notes C and D) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES 1.5 V 1.5 V tPZH tPLH 1.5 V 0V tPZL VOL tPHL 1.5 V 0V Output Control (low-level enabling) 1.5 V tPLH 1.5 V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V 1.5 V 3V Data Input 1.5 V VOLTAGE WAVEFORMS PULSE DURATIONS Input th VOL + 0.5 V tPHZ VOH 1.5 V VOH - 0.5 V 1.5 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS NOTES: A. CL includes probe and jig capacitance. B. All diodes are 1N3064 or equivalent. C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. D. S1 and S2 are closed for tPLH, tPHL, tPHZ, and tPLZ; S1 is open and S2 is closed for tPZH; S1 is closed and S2 is open for tPZL. E. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO 50 ; tr and tf 7 ns for Series 54/74 devices and tr and tf 2.5 ns for Series 54S/74S devices. F. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuits and Voltage Waveforms POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 7 PACKAGE OPTION ADDENDUM www.ti.com 23-Mar-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/00104BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/07001BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/07001BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30001B2A ACTIVE LCCC FK 20 1 TBD JM38510/30001BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30001BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30001SCA ACTIVE CDIP J 14 25 TBD A42 N / A for Pkg Type JM38510/30001SDA ACTIVE CFP W 14 25 TBD A42 N / A for Pkg Type M38510/00104BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type M38510/00104BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type M38510/07001BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type M38510/07001BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type POST-PLATE N / A for Pkg Type M38510/30001B2A ACTIVE LCCC FK 20 1 TBD M38510/30001BCA ACTIVE CDIP J 14 1 TBD POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type M38510/30001BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type M38510/30001SCA ACTIVE CDIP J 14 25 TBD A42 N / A for Pkg Type M38510/30001SDA ACTIVE CFP W 14 25 TBD A42 N / A for Pkg Type SN5400J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54LS00J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN54S00J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN7400D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN7400DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN7400DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN7400N ACTIVE PDIP N 14 25 Pb-Free (RoHS) SN7400N3 OBSOLETE PDIP N 14 SN7400NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) Addendum-Page 1 CU NIPDAU N / A for Pkg Type Call TI Samples (Requires Login) JM38510/00104BCA TBD (3) Call TI CU NIPDAU N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com 23-Mar-2012 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty 50 Eco Plan (2) Green (RoHS & no Sb/Br) Lead/ Ball Finish MSL Peak Temp ACTIVE SOIC D 14 SN74LS00DBLE OBSOLETE SSOP DB 14 SN74LS00DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS00DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS00DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS00DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS00DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS00DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS00DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS00DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TBD CU NIPDAU Level-1-260C-UNLIM Call TI Call TI SN74LS00J OBSOLETE CDIP J 14 SN74LS00N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS00NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS00NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS00NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS00PSR ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS00PSRE4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS00PSRG4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S00D NRND SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 2 Call TI Samples (Requires Login) SN74LS00D TBD (3) Call TI PACKAGE OPTION ADDENDUM www.ti.com 23-Mar-2012 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp NRND SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S00DG4 NRND SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S00N NRND PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74S00N3 OBSOLETE PDIP N 14 SN74S00NE4 NRND PDIP N 14 25 Pb-Free (RoHS) SNJ5400J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type 1 TBD A42 N / A for Pkg Type TBD A42 N / A for Pkg Type SNJ5400W ACTIVE CFP W 14 SNJ5400WA OBSOLETE CFP WA 14 SNJ54LS00FK ACTIVE LCCC FK 20 1 TBD Samples (Requires Login) SN74S00DE4 TBD (3) Call TI Call TI CU NIPDAU N / A for Pkg Type POST-PLATE N / A for Pkg Type SNJ54LS00J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS00W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S00FK ACTIVE LCCC FK 20 1 TBD SNJ54S00J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S00W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type POST-PLATE N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 23-Mar-2012 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN5400, SN54LS00, SN54LS00-SP, SN54S00, SN7400, SN74LS00, SN74S00 : * Catalog: SN7400, SN74LS00, SN54LS00, SN74S00 * Military: SN5400, SN54LS00, SN54S00 * Space: SN54LS00-SP NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Military - QML certified for Military and Defense Applications * Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2011 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SN74LS00DBR SSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) DB 14 2000 330.0 16.4 8.2 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 6.6 2.5 12.0 16.0 Q1 SN74LS00DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74LS00NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74LS00PSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2011 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS00DBR SSOP DB 14 2000 346.0 346.0 33.0 SN74LS00DR SOIC D 14 2500 346.0 346.0 33.0 SN74LS00NSR SO NS 14 2000 346.0 346.0 33.0 SN74LS00PSR SO PS 8 2000 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated