www.ti.com
FEATURES
DESCRIPTION
DGG OR DL PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
OEAB
LEAB
A1
GND
A2
A3
VCC
A4
A5
A6
GND
A7
A8
A9
A10
A11
A12
GND
A13
A14
A15
VCC
A16
A17
GND
A18
OEBA
LEBA
CLKENAB
CLKAB
B1
GND
B2
B3
VCC
B4
B5
B6
GND
B7
B8
B9
B10
B11
B12
GND
B13
B14
B15
VCC
B16
B17
GND
B18
CLKBA
CLKENBA
SN74ALVCH1660118-BIT UNIVERSAL BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
SCES027F – JULY 1995 – REVISED OCTOBER 2004
•Member of the Texas Instruments Widebus™Family
•UBT™ (Universal Bus Transceiver) CombinesD-Type Latches and D-Type Flip-Flops forOperation in Transparent, Latched, Clocked,or Clock-Enabled Modes•EPIC™ (Enhanced-Performance ImplantedCMOS) Submicron Process•ESD Protection Exceeds 2000 V PerMIL-STD-883, Method 3015; Exceeds 200 VUsing Machine Model (C = 200 pF, R = 0)•Latch-Up Performance Exceeds 250 mA PerJESD 17•Bus Hold on Data Inputs Eliminates the Needfor External Pullup/Pulldown Resistors•Package Options Include Plastic 300-milShrink Small-Outline (DL) and Thin ShrinkSmall-Outline (DGG) Packages
This 18-bit universal bus transceiver is designed for1.65-V to 3.6-V V
CC
operation.
The SN74ALVCH16601 combines D-type latches andD-type flip-flops to allow data flow in transparent,latched, and clocked modes.
Data flow in each direction is controlled byoutput-enable ( OEAB and OEBA), latch-enable(LEAB and LEBA), and clock (CLKAB and CLKBA)inputs. The clock can be controlled by theclock-enable ( CLKENAB and CLKENBA) inputs. ForA-to-B data flow, the device operates in thetransparent mode when LEAB is high. When LEAB islow, the A data is latched if CLKAB is held at a highor low logic level. If LEAB is low, the A data is storedin the latch/flip-flop on the low-to-high transition ofCLKAB. Output enable OEAB is active low. WhenOEAB is low, the outputs are active. When OEAB ishigh, the outputs are in the high-impedance state.<br/>
Data flow for B to A is similar to that of A to B, but uses OEBA, LEBA, CLKBA, and CLKENBA.
To ensure the high-impedance state during power up or power down, OE should be tied to V
CC
through a pullupresistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
The SN74ALVCH16601 is characterized for operation from -40 °C to 85 °C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.Widebus, UBT, EPIC are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 1995–2004, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
www.ti.com
CE
1D
C1
CLK
CE
1D
C1
CLK
B1
OEAB
CLKENAB
CLKAB
LEAB
LEBA
CLKBA
CLKENBA
OEBA
A1
1
56
55
2
28
30
29
27
354
To 17 Other Channels
SN74ALVCH16601
18-BIT UNIVERSAL BUS TRANSCEIVERWITH 3-STATE OUTPUTS
SCES027F – JULY 1995 – REVISED OCTOBER 2004
FUNCTION TABLE
(1)
INPUTS
OUTPUT
BCLKENAB OEAB LEAB CLKAB A
X H X X X ZX L H X L LX L H X H HH L L X X B
0
(2)
H L L X X B
0
(2)
L L L ↑L LL L L ↑H HL L L H X B
0
(2)
L L L L X B
0
(3)
(1) A-to-B data flow is shown; B-to-A flow is similar, but uses OEBA,LEBA, and CLKBA.(2) Output level before the indicated steady-state input conditions wereestablished, provided that CLKAB was high before LEAB went low(3) Output level before the indicated steady-state input conditions wereestablished
LOGIC DIAGRAM (POSITIVE LOGIC)
2
www.ti.com
ABSOLUTE MAXIMUM RATINGS
(1)
RECOMMENDED OPERATING CONDITIONS
(1)
SN74ALVCH1660118-BIT UNIVERSAL BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
SCES027F – JULY 1995 – REVISED OCTOBER 2004
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage range -0.5 4.6 VExcept I/O ports
(2)
-0.5 4.6V
I
Input voltage range VI/O ports
(2) (3)
-0.5 V
CC
+ 0.5V
O
Output voltage range
(2) (3)
-0.5 V
CC
+ 0.5 VI
IK
Input clamp current V
I
< 0 -50 mAI
OK
Output clamp current V
O
< 0 -50 mAI
O
Continuous output current ±50 mAContinuous current through each V
CC
or GND ±100 mADGG package 64θ
JA
Package thermal impedance
(4)
°C/WDL package 56T
stg
Storage temperature range -65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.(3) This value is limited to 4.6 V maximum.(4) The package thermal impedance is calculated in accordance with JESD 51.
MIN MAX UNIT
V
CC
Supply voltage 1.65 3.6 VV
CC
= 1.65 V to 1.95 V 0.65 ×V
CC
V
IH
High-level input voltage V
CC
= 2.3 V to 2.7 V 1.7 VV
CC
= 2.7 V to 3.6 V 2V
CC
= 1.65 V to 1.95 V 0.35 ×V
CC
V
IL
Low-level input voltage V
CC
= 2.3 V to 2.7 V 0.7 VV
CC
= 2.7 V to 3.6 V 0.8V
I
Input voltage 0 V
CC
VV
O
Output voltage 0 V
CC
VV
CC
= 1.65 V -4V
CC
= 2.3 V -12I
OH
High-level output current mAV
CC
= 2.7 V -12V
CC
= 3 V -24V
CC
= 1.65 V 4V
CC
= 2.3 V 12I
OL
Low-level output current mAV
CC
= 2.7 V 12V
CC
= 3 V 24∆t/ ∆v Input transition rise or fall rate 10 ns/VT
A
Operating free-air temperature -40 85 °C
(1) All unused control inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3
www.ti.com
ELECTRICAL CHARACTERISTICS
SN74ALVCH16601
18-BIT UNIVERSAL BUS TRANSCEIVERWITH 3-STATE OUTPUTS
SCES027F – JULY 1995 – REVISED OCTOBER 2004
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS V
CC
MIN TYP
(1)
MAX UNIT
I
OH
= -100 µA 1.65 V to 3.6 V V
CC
- 0.2I
OH
= -4 mA 1.65 V 1.2I
OH
= -6 mA 2.3 V 2V
OH
2.3 V 1.7 VI
OH
= -12 mA 2.7 V 2.23 V 2.4I
OH
= -24 mA 3 V 2I
OL
= 100 µA 1.65 V to 3.6 V 0.2I
OL
= 4 mA 1.65 V 0.45I
OL
= 6 mA 2.3 V 0.4V
OL
V2.3 V 0.7I
OL
= 12 mA
2.7 V 0.4I
OL
= 24 mA 3 V 0.55I
I
V
I
= V
CC
or GND 3.6 V ±5µAV
I
= 0.58 V 1.65 V 25V
I
= 1.07 V 1.65 V -25V
I
= 0.7 V 2.3 V 45I
I(hold)
V
I
= 1.7 V 2.3 V -45 µAV
I
= 0.8 V 3 V 75V
I
= 2 V 3 V -75V
I
= 0 to 3.6 V
(2)
3.6 V ±500I
OZ
(3)
V
O
= V
CC
or GND 3.6 V ±10 µAI
CC
V
I
= V
CC
or GND, I
O
= 0 3.6 V 40 µA∆I
CC
One input at V
CC
- 0.6 V, Other inputs at V
CC
or GND 3 V to 3.6 V 750 µAC
i
Control inputs V
I
= V
CC
or GND 3.3 V 4 pFC
io
A or B ports V
O
= V
CC
or GND 3.3 V 8 pF
(1) All typical values are at V
CC
= 3.3 V, T
A
= 25 °C.(2) This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state toanother.
(3) For I/O ports, the parameter I
OZ
includes the input leakage current.
4
www.ti.com
TIMING REQUIREMENTS
SWITCHING CHARACTERISTICS
OPERATING CHARACTERISTICS
SN74ALVCH1660118-BIT UNIVERSAL BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
SCES027F – JULY 1995 – REVISED OCTOBER 2004
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 through Figure 3 )
V
CC
= 2.5 V V
CC
= 3.3 VV
CC
= 1.8 V V
CC
= 2.7 V±0.2 V ±0.3 V
UNITMIN MAX MIN MAX MIN MAX MIN MAX
f
clock
Clock frequency
(1)
150 150 150 MHzLE high
(1)
3.3 3.3 3.3t
w
Pulse duration nsCLK high or low
(1)
3.3 3.3 3.3Data before CLK ↑
(1)
2.3 2.4 2.1CLK high
(1)
2 1.6 1.6t
su
Setup time Data before LE ↓nsCLK low
(1)
1.3 1.2 1.1CLKEN before CLK ↑
(1)
2 2 1.7Data after CLK ↑
(1)
0.7 0.7 0.8CLK high
(1)
1.3 1.6 1.4t
h
Hold time Data after LE ↓nsCLK low
(1)
1.7 2 1.7CLKEN after CLK ↑
(1)
0.3 0.5 0.6
(1) This information was not available at the time of publication.
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 through Figure 3 )
V
CC
= 2.5 V V
CC
= 3.3 VV
CC
= 1.8 V V
CC
= 2.7 VFROM TO
±0.2 V ±0.3 VPARAMETER UNIT(INPUT) (OUTPUT)
MIN TYP MIN MAX MIN MAX MIN MAX
f
max
(1)
150 150 150 MHzA or B B or A
(1)
1 4 4.6 4.1t
pd
LEAB or LEBA
(1)
1 4.6 5.3 4.7 nsA or BCLKAB or CLKBA
(1)
1.2 5.2 5.8 5t
en
OEAB or OEBA A or B
(1)
1.1 5.3 6.1 5.2 nst
dis
OEAB or OEBA A or B
(1)
1.4 4.9 4.8 4.4 ns
(1) This information was not available at the time of publication.
T
A
= 25 °C
V
CC
= 1.8 V V
CC
= 2.5 V V
CC
= 3.3 VPARAMETER TEST CONDITIONS UNITTYP TYP TYP
Outputs enabled
(1)
41 52C
pd
Power dissipation capacitance C
L
= 50 pF, f = 10 MHz pFOutputs disabled
(1)
6 6
(1) This information was not available at the time of publication.
5
www.ti.com
PARAMETER MEASUREMENT INFORMATION
VCC/2
VCC/2
VCC/2VCC/2
VCC/2VCC/2
VCC/2
VCC/2
VOH
VOL
th
tsu
From Output
Under Test
CL = 30 pF
(see Note A)
LOAD CIRCUIT
S1 Open
GND
1 kΩ
1 kΩ
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
tPZL
tPZH
tPLZ
tPHZ
0 V
VOL + 0.15 V
VOH − 0.15 V
0 V
VCC
0 V
0 V
tw
VCC VCC
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
Timing
Input
Data
Input
Input
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
GND
TEST S1
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
0 V
VCC
VCC/2
tPHL
VCC/2 VCC/2 VCC
0 V
VOH
VOL
Input
Output
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VCC/2 VCC/2
tPLH
2 × VCC
VCC
SN74ALVCH16601
18-BIT UNIVERSAL BUS TRANSCEIVERWITH 3-STATE OUTPUTS
SCES027F – JULY 1995 – REVISED OCTOBER 2004
V
CC
= 1.8 V
Figure 1. Load Circuit and Voltage Waveforms
6
www.ti.com
PARAMETER MEASUREMENT INFORMATION
VCC/2
VCC/2
VCC/2VCC/2
VCC/2VCC/2
VCC/2VCC/2
VOH
VOL
th
tsu
From Output
Under Test
CL = 30 pF
(see Note A)
LOAD CIRCUIT
S1 Open
GND
500 Ω
500 Ω
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
tPZL
tPZH
tPLZ
tPHZ
0 V
VOL + 0.15 V
VOH − 0.15 V
0 V
VCC
0 V
0 V
tw
VCC VCC
VOLTAGE WA VEFORMS
SETUP AND HOLD TIMES
VOLTAGE WA VEFORMS
PULSE DURATION
VOLTAGE WA VEFORMS
ENABLE AND DISABLE TIMES
Timing
Input
Data
Input
Input
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
GND
TEST S1
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤10 MHz, ZO = 50 Ω, tr ≤2 ns, tf ≤2 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
0 V
VCC
VCC/2
tPHL
VCC/2 VCC/2 VCC
0 V
VOH
VOL
Input
Output
VOLTAGE WA VEFORMS
PROPAGATION DELAY TIMES
VCC/2 VCC/2
tPLH
2 × VCC
VCC
SN74ALVCH1660118-BIT UNIVERSAL BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
SCES027F – JULY 1995 – REVISED OCTOBER 2004
V
CC
= 2.5 V ±0.2 V
Figure 2. Load Circuit and Voltage Waveforms
7
www.ti.com
PARAMETER MEASUREMENT INFORMATION
VOH
VOL
th
tsu
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
S1 6 V
Open
GND
500 Ω
500 Ω
tPLH tPHL
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 6 V
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
tPZL
tPZH
tPLZ
tPHZ
1.5 V1.5 V
1.5 V 1.5 V 2.7 V
0 V
1.5 V 1.5 V VOH
VOL
0 V
1.5 V VOL + 0.3 V
1.5 V VOH − 0.3 V
0 V
1.5 V 2.7 V
0 V
1.5 V 0 V
2.7 V
0 V
1.5 V 1.5 V
tw
Input
2.7 V 2.7 V
3 V
VOLTAGE WA VEFORMS
SETUP AND HOLD TIMES
VOLTAGE WA VEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WA VEFORMS
PULSE DURATION
VOLTAGE WA VEFORMS
ENABLE AND DISABLE TIMES
Timing
Input
Data
Input
Output
Input
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
6 V
GND
TEST S1
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
1.5 V
SN74ALVCH16601
18-BIT UNIVERSAL BUS TRANSCEIVERWITH 3-STATE OUTPUTS
SCES027F – JULY 1995 – REVISED OCTOBER 2004
V
CC
= 2.7 V AND 3.3 V ±0.3 V
Figure 3. Load Circuit and Voltage Waveforms
8
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
74ALVCH16601DGGRE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ALVCH16601DGGRG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ALVCH16601DGVRG4 ACTIVE TVSOP DGV 56 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ALVCH16601DLG4 ACTIVE SSOP DL 56 20 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ALVCH16601DLRG4 ACTIVE SSOP DL 56 1000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ALVCH16601DGGR ACTIVE TSSOP DGG 56 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ALVCH16601DGVR ACTIVE TVSOP DGV 56 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ALVCH16601DL ACTIVE SSOP DL 56 20 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ALVCH16601DLR ACTIVE SSOP DL 56 1000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 27-Sep-2007
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74ALVCH16601DGGR TSSOP DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1
SN74ALVCH16601DGVR TVSOP DGV 56 2000 330.0 24.4 6.8 11.7 1.6 12.0 24.0 Q1
SN74ALVCH16601DLR SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74ALVCH16601DGGR TSSOP DGG 56 2000 346.0 346.0 41.0
SN74ALVCH16601DGVR TVSOP DGV 56 2000 346.0 346.0 41.0
SN74ALVCH16601DLR SSOP DL 56 1000 346.0 346.0 49.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 2
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUAR Y 1998
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
4040078/F 12/97
48 PINS SHOWN
0,25
0,15 NOM
Gage Plane
6,00
6,20 8,30
7,90
0,75
0,50
Seating Plane
25
0,27
0,17
24
A
48
1
1,20 MAX
M
0,08
0,10
0,50
0°–8°
56
14,10
13,90
48
DIM
A MAX
A MIN
PINS **
12,40
12,60
64
17,10
16,90
0,15
0,05
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
4040048/E 12/01
48 PINS SHOWN
56
0.730
(18,54)
0.720
(18,29)
4828
0.370
(9,40)
(9,65)
0.380
Gage Plane
DIM
0.420 (10,67)
0.395 (10,03)
A MIN
A MAX
0.010 (0,25)
PINS **
0.630
(16,00)
(15,75)
0.620
0.010 (0,25)
Seating Plane
0.020 (0,51)
0.040 (1,02)
25
24
0.008 (0,203)
0.0135 (0,343)
48
1
0.008 (0,20) MIN
A
0.110 (2,79) MAX
0.299 (7,59)
0.291 (7,39)
0.004 (0,10)
M
0.005 (0,13)
0.025 (0,635)
0°–ā8°
0.005 (0,13)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118
MECHANICAL DATA
MPDS006C – FEBRUAR Y 1996 – REVISED AUGUST 2000
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50 4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
112
24 13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
382416
4,90
5,103,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers shouldobtain the latest relevant information before placing orders and should verify that such information is current and complete. All products aresold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standardwarranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except wheremandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license from TI to use such products or services or awarranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectualproperty of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompaniedby all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptivebusiness practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additionalrestrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids allexpress and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is notresponsible or liable for any such statements.TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonablybe expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governingsuch use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, andacknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their productsand any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may beprovided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products insuch safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely atthe Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products aredesignated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designatedproducts in automotive applications, TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers amplifier.ti.com Audio www.ti.com/audioData Converters dataconverter.ti.com Automotive www.ti.com/automotiveDSP dsp.ti.com Broadband www.ti.com/broadbandClocks and Timers www.ti.com/clocks Digital Control www.ti.com/digitalcontrolInterface interface.ti.com Medical www.ti.com/medicalLogic logic.ti.com Military www.ti.com/militaryPower Mgmt power.ti.com Optical Networking www.ti.com/opticalnetworkMicrocontrollers microcontroller.ti.com Security www.ti.com/securityRFID www.ti-rfid.com Telephony www.ti.com/telephonyRF/IF and ZigBee® Solutions www.ti.com/lprf Video & Imaging www.ti.com/videoWireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2008, Texas Instruments Incorporated
