
(SDT9308-R)
Specification : TS-S00D022C
July, 2001
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10. Reliability Test (Plan)
Bellcore TA-NWT-000983 Issue 2, December 1993
Heading Test Reference Condition Sampling SEI Results
LTPD SS C SS F/C
Mechanica
Mechanical MIL-STD-883 Condition B
Integrity Shock Method 2002 5 times/axis
500G, 1.0 ms 20% 11 0 11 0
1,500G, 0.5ms 20% 11 0 --- ---
Vibration MIL-STD-883 Condition A 20% 11 0 11 0
Method 2007 20 G
20-2,000 Hz
4 min/cycle; 4 cycles/axis
Thermal Shock MIL-STD-883 ∆T=100°C 20% 11 0 11 0
Method 1011
Solderability MIL-STD-883 (steam aging not required) 20% 11 0 11 0
Method 2003
Fiber Pull 1 Kg; 3 times;5sec. 20% 11 0 --- ---
2 Kg; 3 times; 5sec. 20% 11 0 --- ---
Endurance Accel. Aging (R)-453 +85C; rated power
(High Temp.) Section 5.18 >5,000hrs. --- 25 --- 25 0
>10,000hrs. --- 10 --- --- ---
High Temp. ---------- max. storage T (T=85°C) 20% 11 0 --- ---
Storage >2,000
Low Temp. ---------- min. storage T (T=-40°C) 20% 11 0 11 0
Storage >2,000
Temperature Section 5.20 - 40°C to +85°C
Cycling 400 times pass/fail 20% 11 0 --- ---
500 times for info. --- 11 --- --- ---
500 times pass/fail 20% 11 0 11 0
1000 times for info. --- 11 --- 11 0
Damp Heat MIL-STD-202 M103 40°C , 95%, 56days 20% 11 0 11 0
(if using epoxy) or IEC 68-2-3 or 85°C /85%RH 2,000hrs
20% 11 0 --- ---
Cyclic Moisture Section 5.23 ---------- 20% 11 0 11 0
Resistance
Special Internal MIL-STD-883 < 5,000 ppm 20% 11 0 11 0
Tests Moisture Method 1018 water vapor
Flammability TR357:Sec. 4.4.2.5 ----------- ---- ---- --- ---- OK
ESD Threshold Section 5.22 ----------- ---- 6 --- 6 0
11. Ordering Information
Connector Pi
tail Len
th : mm Tc = 0 ~ 70°C
SC Connector 600 +/- 50 SDT9308-RC-QN
FC / PC Connector 600 +/- 50 SDT9308-RD-QN
FC / PC Connector 990 +/- 100 SDT9308-RD-YN