VCEW1151CDS-3BZH3-TR
Page : 1
Higher reliability with using silicone resin
Outer dimension: 1.6 x 0.8 x 0.7mm ( L x W x H )
Equivalent to JEDEC Level 2a
Corresponds to demand of ”Corporate Color”
Consideration of IF derating is unnecessary until 85
Lead-free soldering compatible
RoHS compliant
Package
Product features
Recommended Applications
Features
Light source for interior for Automotive, various indicator etc.
Standard Product Reference Sheet
2016.12.9
VCEW1151CDS-3BZH3-TR
No. Item Material Qty.
LED Die InGaN 1
Mold Resin Silicone Resin 1
PCB Glass fabrics 1
Electrode Copper (Au Plating) 2
Recommended soldering Pattern
Outline Dimensions
Unit mm
Weight 1.4mg
Tolerance ±0.1
Unitmm
Page : 2
2016.12.9
VCEW1151CDS-3BZH3-TR
Specifications
Page : 3
mA
100
Soldering Temperature  "Reflow Soldering"
Tsld
260
Notes2
ESD testing method : EIAJ4701/300(304) Human Body Model(HBM)  1.5kΩ,100pF
Reverse Voltage
RESIN COLOR EMITTING AREA
Notes1
IFRM
Operating Temperature
Topr
mA
20
Repetitive Peak Forward Current "1ms,1/10duty"
Storage Temperature
Tstg
5
-40 +100
VR
Electrostatic Discharge Threshold "HBM"
Please refer to the attached sheets page 9, Soldering Conditions.
V
-40 +110
ESD
1,000
Notes2
Notes1
110
Junction Temperature
Tj
DIE MATERIAL
EMITTING COLOR
Power Dissipation
Pd
ΔIFRM
0.8
IFRM Derate Linearly from "85"
74
IF Derate Linearly from "85"
ΔIF
4.0
mW
ITEM
SYMBOL
MAXIMUM RATINGS
mA/
UNITS
(Ta=25)
V
mA/
Product Overview
Absolute Maximum Ratings
Forward Current
IF
/W
ITEM
SYMBOL
Thermal resistance Junction - Ambient
Rth(j-a)
Thermal resistance Junction - solder point
Rth(j-s)
UNITS
TYP.
Thermal Characteristics
(Ta=25)
/W
Notes3
Rth(j-a) Measurement condition
SubstrateFR4 ( t=1.6mm )
Pattern size16mm2
Notes3
450
300
2016.12.9
VCEW1151CDS-3BZH3-TR
Specifications
Page : 4
-
Notes4
Notes5
Notes6
Half Intensity Angle
Notes6
Notes7
Viewing Angle at 50% Iv, Δθx ; Housing long side axis, Δθy ; Housing short side axis
Chromaticity coordinates ; x and y according to CIE1931
Notes4
Tolerance:±0.1V
(Ta=25)
ITEM
CONDITIONS
UNITS
V
10
3.5
-
ΦV
-
82
150
Luminous Intensity
Luminous Flux
IF = 10mA
-
IR
MIN.
TYP.
Chromaticity Coordinates
Forward Voltage
VF
IF = 10mA
2.8
VR = 5V
μA
120
-
-
-
0.263
Electro-Optical Characteristics
3.1
SYMBOL
0.281
MAX.
Notes5, 6
Please refer to the attached sheets, each sorting chart.
Δθx
Reverse Current
IV
mcd
Notes7
Δθy
-
168
mlm
700
-
-
IF = 10mA
-
deg.
deg.
160
-
IF = 10mA
IF = 10mA
Δθx
Δθy
2016.12.9
VCEW1151CDS-3BZH3-TR
Specifications
Page : 5
C2
120
150
IF = 10mA
Ta=25
LEDs shall be sorted out into the following chart and each rank parts shall be packed separately when shipping.
82
100
Min.
BZ
C1
Max.
100
120
Notes : Luminous intensity Tolerance each Rank: ±10%
Luminous intensity
IV (mcd)
Sorting chart for Luminous intensity IV
Rank
Condition
Sorting Chart for Chromaticity Coordinates, x,y
LEDs shall be sorted out into the following chart and each rank parts shall be packed separately when shipping.
0.00
0.10
0.20
0.30
0.40
0.50
0.60
0.70
0.80
0.90
0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80
y
x
0.22
0.24
0.26
0.28
0.30
0.24 0.26 0.28 0.30 0.32
y
x
3D
4D
0.276
0.288
0.258
4D
0.274
0.268
0.286
0.285
0.300
x
y
0.258
0.276
0.241
3D
0.262
0.250
0.274
0.268
0.288
(IF=10mA, Ta=25)
Notes
Chromaticity coordinates tlerance Each rank ±0.01
Rank
Left Down
Left Upper
Right Upper
Right Down
x
y
x
y
x
y
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VCEW1151CDS-3BZH3-TR
0.0
0.2
0.4
0.6
0.8
1.0
1.2
380 430 480 530 580 630 680 730 780
Relative Intensity vs. wavelength
Condition: Ta = 25, IF =10mA
Wavelength (nm)
Spatial Distribution
Condition: Ta = 25, IF=10mA
Relative Intensity (%)
Technical Data
Relative Intensity
Page : 6
x direction
y direction
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VCEW1151CDS-3BZH3-TR
0.1
1
10
-40 -20 0 20 40 60 80 100
0.0
0.5
1.0
1.5
2.0
0 2 4 6 8 10 12 14 16 18 20
CI
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
-40 -20 0 20 40 60 80 100
1
10
100
2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
-40
25
60
85
100 -20
0
Relative Intensity vs. Ambient Temp.
Condition : IF=10mA
Ambient Temperature Ta ()
Relative Intensity vs. Forward Current
Condition : Ta=25
Forward Current : IF (mA)
Forward Current vs. Forward Voltage
Condition: Ta = 25
Forward Voltage VF (V)
Forward Voltage vs. Ambient Temp.
Condition : IF = 120mA
Ambient Temperature : Ta ()
Relative Intensity
Relative Flux
Forward Current IF (mA)
Forward Voltage : VF (V)
Technical Data
Page : 7
15mA
5mA 2mA 1mA
20mA
10mA
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VCEW1151CDS-3BZH3-TR
0.240
0.260
0.280
0.300
0.240 0.260 0.280 0.300
0.240
0.250
0.260
0.270
0.280
0.260 0.270 0.280 0.290 0.300
CI
Chromaticity vs. Forward Current
Condition : Ta = 25
Chromaticity vs. Ambient Temp.
Condition : IF = 10mA
1
10
100
110 100
Max. Forward Current vs. Duty Cycle
Duty Ratio : (%)
0
20
40
60
80
100
120
-40 -20 0 20 40 60 80 100 120
DC
Duty 10%
Duty 20%
Duty 50%
Max. Forward Current vs. Ambient Temp.
Ambient Temperature Ta ()
Technical Data
Page : 8
x
y
x
y
Maximum Forward Current IFMAX (mA)
Repetition Frequencyf50Hz
Maximum Forward Current IFMAX (mA)
2016.12.21
15mA
5mA
2mA
1mA 60
20mA
0
25
10mA
100
85 -20
-40
VCEW1151CDS-3BZH3-TR
Soldering condition
1. Heat stress during soldering will influence the reliability of LEDs, however that effect will vary on heating method.
Also, if components of varying shape are soldered together, it is recommended to set the soldering pad temperature
according to the component most vulnerable to heat (e.g., surface mount LED).
2. LED parts including the resin are not stable immediately after soldering ( when they are not at room temperature),
any mechanical stress may cause damage to the product. Please avoid such stress after soldering, especially
stacking of the boards which may cause the boards to warp and any other types of friction with hard materials.
3. High hardness silicone resin is used for this product's lens, but the silicone resin has the characteristic that softens
at the high temperature. There is a possibility of causing the transformation, the breakage, and
peeling off of the lens when it touches the resin lens at the high temperature such as immediately after soldering.
Please avoid touching the lens at the high temperature.
4. Recommended temperature profile for the Reflow soldering is listed as the temperature of the resin surface.
Temperature distribution varies on heating method, PCB material, other components in the assembly,
and mounting density .
Please do not repeat the heating process in Reflow process more than twice.
Notes 1 Temperature Profile for the reflow should be set to the surface temperature of resin which is on the
top of LED. This should be the maximum temperature for soldering. Lowering the heating temperature and
decreasing heating time is very effective in achieving higher reliability.
Notes 2 The reflow soldering process should be done up to twice(2 times Max). When second process is
performed, interval between first and second process should be as short as possible to prevent absorption of
moisture to resin of LED. The second soldering process should not be done until LEDs have returned to room
temperature (by nature-cooling) after first soldering process.
Soldering Precaution
(acc.to EIAJ-4701/300)
Page : 9
Recommended Reflow Soldering Condition
40sec MAX.
150180
+1.5+5/s
260MAX.
-1.5-5/s
120sec MAX.
Pre-heating
(Soldering
230MAX.
Peak Temperature
2016.12.9
VCEW1151CDS-3BZH3-TR
Soldering condition
5. If soldering manually, Stanley recommends using a soldering iron equipped with temperature control.
During the actual soldering process, make sure that the soldering iron never touches the LED itself,
and avoid the LED's electrode heating temperature reaching above the heating temperature of the solder pad.
All repairs must be performed only once in the same spot, and please avoid reusing components.
6. In soldering process, immediately after iron tip is cleaned, please make sure that the soldering iron reaches
the appropriate temperature, before using. Also, please avoid applying any types of pressure to the soldered
components before the solder has been cooled and hardened, as it may deteriorate solder performance and
solder quality.
7. When using adhesive material for tentative fixatives, thermosetting resin or Ultraviolet radiation (UV)
setting resin with heat shall be recommended.
8. When cleaning, isopropyl alcohol shall be recommended. Some chemicals, including Freon substitute
detergent could corrode or affect the optical characteristics of the lens or the casing surface.
Please review the reference chart below for cleaning.
Cleaning with ultrasonic shall not be recommended.
9. Flow soldering (dip soldering) is not recommended for this product.
Recommended Manual Soldering Condition
Temperature of Iron Tip 350MAX.
Soldering Duration, Time 3sec.Max.,1 time
Page : 10
×
Adaptability
×
×
○/×
Thinner
Chemical
Acetone
×
Chlorothene
Trichloroethylene
Isopropyl Alcohol
2016.12.9
VCEW1151CDS-3BZH3-TR
Handling Precaution
InGaN die LEDs are sensitive to voltage surges generated by On/Off status change and friction with synthetic
materials, which may cause severe damage to the die or undermine its reliability.
Damaged products may experience conditions such as extremely high reverse voltage or decrease of forward rise
voltage deteriorating their optical characteristic.
Stanley InGaN products are packed with anti-static components.
However, the following precautions must be taken into account upon product shipment.
Do not place electrified non-conductive materials near the LED product.
Avoid LED products from coming into contact with metallic materials.( Should the metallic material be
electrified , the sudden surge voltage will most likely damage the product.)
Avoid a working process which may cause the LED product to rub against other materials.
Install ground wires for any equipment, where they can be installed, with measures to avoid static electricity
surges.
Prepare a ESD protective area by placing a Conductive Mattress (1MΩ MAX.) and Ionizer to remove any
static electricity.
Operators should wear a protective wrist-strap.
Operators should wear conductive work-clothes and shoes.
To handle the products directly, Stanley recommends the use of ceramic, and not metallic, tweezers.
2. Working Environment
Dry environment is more likely to cause static electricity. Although a dry environment is ideal for storage
state of LED products, Stanley recommends an environment with approximately 50% humidity after the
soldering process.
Recommended static electricity level in the working environment is 150V, which is the same value as
Integrated Circuits (which are sensitive to static electricity).
For Electric Static Discharge ( ESD)
1. Electrification/Static Electricity protection
In order to avoid product (die) damage from static electricity caused by electrified operator and other materials
electrified friction coming in contact with the product, Stanley recommends taking the following precautions.
Page : 11
2016.12.9
VCEW1151CDS-3BZH3-TR
Recommendation
Handling Precaution
Handling Precautions for Product Mounting
Page : 12
Load : less than 10N
(to avoid the product breakage)
During mounting, because of the mounter nozzle‘s load and shape, the lens may break and the shape may change.
Therefore, please adjust the load / nozzle adsorption point and the nozzle diameter before use.
Moreover, since the occurrence of product remnants of the nozzle part is possible,
please adjust the conditions before vacuum break or air discharge.
Not just the nozzle, but also regarding other tools/instruments/parts, please do not put pressure on the lens.
2016.12.9
VCEW1151CDS-3BZH3-TR
Handling Precaution
Other Precautions
1. The products are designed to achieve higher performance reliability, however, they can be influenced by usage
conditions.
2. Absolute maximum ratings are set to prevent LED products from failing due to excess stress (temperature, current,
voltage, etc.). These ratings must never be overrun even for a moment.
3. To achieve the highest performance reliability, it is necessary to take into account, factors such as forward voltage
adjusted to the usage temperature condition, derating of the power consumption, and other variable factors.
4. Please insert Straight Protective Resistors into the circuit in order to stabilize LED operation and to prevent the
device from igniting due to excess current.
5. Please avoid to stick foreign material because molding resin in the products has adhesiveness.
And please don't touch lens portion.
6. Please check the actual performance in the assembly because the Specification Sheets are described for LED
device only.
7. Please refrain from looking directly at the light source of LED at high output, as it may harm your vision.
8. The products are designed to operate without failure in recommended usage conditions.
However, please take the necessary precautions to prevent fire, injury, and other damages should any malfunction
or failure arise.
9. The products are manufactured to be used for ordinary electronic equipment.
Please contact our sales staff beforehand when exceptional quality and reliability are required,
and the failure or malfunction of the products might directly jeopardize life or health
(such as for airplanes, aerospace, transport equipment, medical applications, nuclear reactor control systems
and so on)..
10. When there is a process of supersonic wave welding etc. after mounting the product,
there is a possibility of affecting on the reliability of junction part in package
(junction part of die bonding and wire bonding).
Please use after affirming beforehand there is no problem.
11. The formal specification sheets shall be valid only by exchange of documents by both parties.
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VCEW1151CDS-3BZH3-TR
Packaging Specifications
This products are baked (moisture removal) before packaging, and are shipped in moisture-proof packaging
(as shown below) to minimize moisture absorption during transportation.
However, in regards to storing the products, the use of dry-box under the following conditions is recommended.
Moisture-proof bag as the packaging is made of anti-static material but packaging box is not.
Time elapsed after Package Opening
Page : 14
Recommended Storage Condition / Products Warranty Period
Temperature +530
Humidity Under 70%
The package should not be opened until immediately prior to its use,
and please keep the time frame between package opening and soldering which is maximum 672h.
If the device needs to be soldered twice, both soldering must be completed within 672h.
If any components should remain after their use, please seal the package and store them under the conditions
Described in the Recommended Storage Condition .
The product must be required to perform baking process (moisture removal)
for at least 10h and not exceed for 12h , at 60+/-5 degrees C if following conditions apply.
1. In the case of color of indicators (those are in the package of desiccant) change or lose its blue color.
2. In the case of time is passed for 672h after the package is opened once.
Please backing process must be performed after putting out from package.
Baking may be performed in the tape-reel form, however if it is performed with the reel stacked over one another,
it may case deformation of the reels and taping materials, which may cause problems during production.
Please make sure that the product has cooled to normal temperature after performing the baking process.
Provided that, baking process shall be 2 times MAX.
In the case of the package unopened , 6 months under Recommended Storage Condition .
Please avoid rapid transition from low temp. condition to high temp. condition
and storage in corroding and dusty environment.
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VCEW1151CDS-3BZH3-TR
Moisture-proof Packaging Specification Fastener for re-storage
after opening bag.
Customer's opening position.
Product Label
Desiccant with indicator for
moisture level is enclosed.
1
A
Heat Sealing position (after product being put in)
Page : 15
NO. PART NAME MATERIALS REMARKS
Moisture-proof bag
with Aluminum layer
PET+Al+PE with ESD
protection
Yes No
Yes No
Yes No
Baking LED under recommended condition
Product Mounting
Unused-product remained
Return to moisture-proof package and seal
Finished
Reopen the moisture-proof package
Flow chartPackage Opening to Mounting
Stored under recommended condition
Moisture-proof package first time opening
Allowable leaving time exceeded (*)
Discoloration of silica gel
Allowable leaving time means the
maximum allowable leaving time after
opening package, which depends on
each LED type.
The allowable leaving time should be
calculated form the first opening of
package to the time when soldering
process is finished.
When judging if the allowable leaving
time has exceeded or not, please
subtract the soldering time. The
allowable leaving time after reopening
should be calculated form the first
opening of package, or from the time
when baking process is finished.
Flow Chart-package Opening to Mounting
Packaging Specifications
2016.12.9
VCEW1151CDS-3BZH3-TR
Packing box
( RoHSELV Compliant )
The above measure is all the reference value.
The box is selected out of the above table by shipping quantity.
Box TYPE Outline dimension
L × W × H (mm) Capacity of the box
Type A 280 × 265 × 45 3 reel
Type B 310 × 235 × 265 15 reel
Type C 440 × 310 × 265 30 reel
Type A
Material / box Cardboard C5BF Type B,C
Material / box Cardboard K5AF
Partition Cardboard K5BF
Page : 16
NO. PART NAME MATERIAL REMARKS
Packing Box
Corrugated
Cardbord
without ESD
protection
Packaging Specifications
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VCEW1151CDS-3BZH3-TR
Label Specification
(acc.to JIS-X0503(Code-39))
Product label
A. Parts number
B. Bar-code for parts number
C. Parts code (In-house identification code for each parts number)
D. Packed parts quantity
E. Bar-Code for packed parts quantity
F. Lot number & Rank
(Please refer to Lot Number Notational System for details )
G. Bar-Code for Lot number & Rank
Opto device label
A. Customer Name
B. Parts Type
C. Parts Code
D. Parts Number
E. Packed Parts Quantity
F. Carton Number
G. Shipping Date
H. Bar-Code for In-house identification Number
<Remark> Bar-code font : acc.to Code-39(JIX0503)
B
A
Page : 17
Packaging Specifications
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VCEW1151CDS-3BZH3-TR
Taping and Reel Specifications
(acc.to JIS-C0806-03
Appearance
Note
"-TR" means Cathode Side of LEDs should be placed on the sprocket-hole side.
Items Specifications Remarks
Leader area
Cover-tape Cover-tape shall be longer
than 300mm without carrier-tape The end of cover-tape shall be
held with adhesive tape.
Carrier-tape Empty pocket shall be more than
25 pieces. Please refer to the above figure
for Taping & reel orientation .
Trailer area Empty pocket shall be more than
40 pieces. The end of taping shall be
inserted into a slit of the hub.
Page : 18
Direction to take out
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VCEW1151CDS-3BZH3-TR
Taping Dimensions
Reel Dimensions
Taping and Reel Specifications
(acc.to JIS-C0806-03 Unit :mm
Page : 19
NO. PART NAME REMARKS
Carrier reel with ESD protection
Cover tape with ESD protection
Carrier tape with ESD protection
(Center hole)
(Center hole)
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VCEW1151CDS-3BZH3-TR
Taping and Reel Specifications
(acc.to JIS-C0806-03
Qty. per Reel
Mechanical strength
Others
Cover-tape adhesive strength shall be 0.11.0N ( An angle between carrier-tape and cover-tape shall be170 deg. ).
Both tapes shall be so sealed that the contained parts will not come out from the tape when it is bent at a radius of
15mm.
Reversed-orientation, Up-side down placing, side placing and out of spec. parts mix shall not be held.
Max qty. of empty pocket per reel shall be defined as follows.
Page : 20
4,000 parts/reel
Minimum Qty. per reel might be 500 parts when getting less than 4,000 parts.
In such case, parts of 500-unit-qty. shall be packed in a reel and the qty. shall be identified on the label.
-
500
3,000
3
No continuance
3
1,000
1
2,000
1
1,500
Remarks
Max. qty. of empty pocket
Qty./reel
2
-
2,500
-
No continuance
2
No continuance
4,000
4
No continuance
3,500
4
No continuance
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VCEW1151CDS-3BZH3-TR
Lot Number Notational System
- 1digit Production Location (Mark identify alphabet)
- 1digit Production Year (Last digit of Production Year 2009→9,2010→0,2011→1,・・・)
- 2digits Production Month (Jan. to Sep. , should be 01,02,03,・・・・・)
- 2digits Production Date
- 3digits Serial Number
- 2digits Tape and Reel following Number
Page : 21
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VCEW1151CDS-3BZH3-TR
Correspondence to RoHSELV instruction
This product is in compliance with RoHSELV.
Prohibition substance and it's criteria value of RoHSELV are as follows.
RoHS instruction …… Refer to following (1)(6).
ELV instruction ………. Refer to following (1)(4).
Substance Group Name Criteria Value
(1) Lead and its compounds 1,000ppm Max
(2) Cadmium and its compounds 100ppm Max
(3) Mercury and its compounds 1,000ppm Max
(4) Hexavalent chromium 1,000ppm Max
(5) PBB 1,000ppm Max
(6) PBDE 1,000ppm Max
Page : 22
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VCEW1151CDS-3BZH3-TR
Reliability Testing Result
1 Maximum Rated Current at Maximum Rated Operating Temperature
2 Reference test
1. Reliability Testing Result
2. Failure Criteria
Page : 23
Resistance to Reflow Soldering
EIAJ ED-4701
/300(301)
Moisture Soak 60 60% 121h
Preheating 150180℃ 90120s
Soldering 260 5sec
2 times
0 / 20
EIAJ ED-4701
/300(304)
C=100pF R2=1.5kΩ ±2,000V
3 times of
each polarity
0 / 10
Test Condition
Ta=25 Maximum Rated Current
Ta=85 Maximum Rated Current 1
Ta=-40 Maximum Rated Current
1,000h
0 / 20
0 / 20
Wet High Temperature Storage Life
Wet High Temperature Operating Life
Duration
1,000h
0 / 20
EIAJ ED-4701
/100(101)
Low Temperature Storage Life
Ta=60 Rh=90%
Ta= Tstg max. Tstg min.
(each 15min)
Electric Static Discharge(ESD) 2
1,000h
EIAJ ED-4701
/100(102)
1,000
cycles
1,000h
Ta=60 Rh=90% Maximum Rated Current
Low Temperature Operating Life
EIAJ ED-4701
/200(201)
Ta = Tstg max. Maximum Storage Temperature
0 / 20
High Temperature Storage Life
EIAJ ED-4701
/200(202)
EIAJ ED-4701
/100(105)
Thermal Shock
Ta = Tstg min. Minimum Storage Temperature
Standard
Test Item
1,000h
High Temperature Operating Life
EIAJ ED-4701
/100(101)
Operating Life
EIAJ ED-4701
/100(101)
EIAJ ED-4701
/100(101)
0 / 20
0 / 20
0 / 20
1,000h
1,000h
Failure
0 / 20
Vibration, Variable Frequency
EIAJ ED-4701
/400(403)
98.1m/s2(10G) 1002,000Hz 20min Sweep
XYZ direction
2h of each
direction
0 / 10
Testing Min. Value Standard Min. Value × 0.5
10mA
IV
Luminous Intensity
-
Reverse Current
IR
VR=5V
Condition
-
Notable, decollation, deformation and cracking
10mA
VF
Forward Voltage
Testing Max. Value Standard Max. Value × 1.2
Item
Symbol
Cosmetic appearance
Testing Max. Value Standard Max. Value × 2.5
Failure Criteria
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VCEW1151CDS-3BZH3-TR
Special Notice to Customers Using the Products and
Technical Information Shown in This Data Sheet
1) The technical information shown in the data sheets are limited to the typical characteristics and circuit
examples of the referenced products. It does not constitute the warranting of industrial property nor the
granting of any license.
2) For the purpose of product improvement, the specifications, characteristics and technical data described in
the data sheets are subject to change without prior notice. Therefore it is recommended that the most
updated specifications be used in your design.
3) When using the products described in the data sheets, please adhere to the maximum ratings for operating
voltage, heat dissipation characteristics, and other precautions for use. We are not responsible for any
damage which may occur if these specifications are exceeded.
4) The products that have been described to this catalog are manufactured so that they will be used for the
electrical instrument of the benchmark (OA equipment, telecommunications equipment, AV machine, home
appliance and measuring instrument).
The application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear
power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might
influence the life or the human body. Please consult us beforehand if you plan to use our product for the usages of
aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control
equipment, etc. except OA equipment, telecommunications equipment, AV machine, home appliance and
measuring instrument.
5) In order to export the products or technologies described in this data sheet which are under the
“Foreign Exchange and Foreign Trade Control Law,” it is necessary to first obtain an export permit from the
Japanese government.
6) No part of this data sheet may be reprinted or reproduced without prior written permission from Stanley
Electric Co., Ltd.
7) The most updated edition of this data sheet can be obtained from the address below:
http://www.stanley-components.com/en
Page : 24
2016.12.9