MCCSEMI.COM
Rev.3-3-12012020 1/4
PNP
Plastic Encapsulate
Transistor
BCX53,BCX53-10,BCX53-16
Features
Internal Structure
Marking:
BCX53=AH,
BCX53-10=AK
BCX53-16=AL
Collector Current IC
-1.0
A
Collector Power Dissipation PC
500
Collector-Emitter Voltage VCEO -80 V
Emitter-Base Voltage VEBO -5 V
Unit
Collector-Base Voltage VCBO -100 V
Parameter Symbol Rating
• Operating Junction Temperature Range: -55℃ to +150℃
•Storage Temperature Range: -55℃ to +150℃
• Thermal Resistance: 250 ℃/W Junction to Ambient
Maximum Ratings
•Halogen Free. “Green” Device (Note 1)
• Moisture Sensitivity Level 1
• Epoxy Meets UL 94 V-0 Flammability Rating
• Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHS
Compliant. See Ordering Information)
Suggested Solder Pad Layout
inches
mm
B
A
F
L
GH
K
J
C
D
E
1 2 3
2.600
0.102
1.400
0.055
4.400
0.173
3.200
0.126
1.900
0.075
0.800
0.032
0.900
0.035
1.500
0.059
1.400
0.055
MIN MAX MIN MAX
A0.169 0.185 4.30 4.70
B0.061 1.55
C 0.154 0.171 3.91 4.35
D 0.031 0.047 0.80 1.20
E0.089 0.104 2.25 2.65
F0.118 3.00 TYP.
G 0.013 0.020 0.33 0.52
H 0.015 0.021 0.38 0.53
J0.014 0.017 0.35 0.44
K 0.055 0.063 1.40 1.60
DIMENSIONS
DIM INCHES MM NOTE
L0.059 1.50TYP.
TYP.
L
SOT-89
E
BC
950
mW(Note3)
1350
mW(Note4)
mW(Note2)
Note: 1. Halogen free "Green” products are defined as those which contain <900ppm bromine,
<900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
2.Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, t
in-plated and standard footprint.
3.Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad
for collector 1 cm2.
4.Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad
for collector 6 cm2.