PROTECTION PRODUCTS
1www.semtech.com
PROTECTION PRODUCTS - RailClamp®®
®®
®
RClamp0521PA
Ultra-Low Capacitance
1-Line ESD protection
Description Features
Dimensions Schematic & PIN Configuration
Revision 03/18/2010
RailClamp® TVS arrays are ultra low capacitance ESD
protection devices designed to protect high speed
data interfaces. This series has been specifically
designed to protect sensitive components which are
connected to high-speed data and transmission lines
from overvoltage caused by ESD (electrostatic dis-
charge), CDE (Cable Discharge Events), and EFT
(electrical fast transients).
The RClamp®0521PA has a maximum capacitance of
only 0.50pF. This allows it to be used on circuits operat-
ing in excess of 3GHz without signal attenuation. They
may be used to meet the ESD immunity requirements of
IEC 61000-4-2, Level 4 (±15kV air, ±8kV contact
discharge).
The RClamp0521PA is in a 2-pin SLP1006P2 package
measuring 1.0 x 0.6 x 0.5mm. The leads are spaced
at a pitch of 0.65mm and feature a lead-free finish.
Each device will protect one high-speed line operating
at 5 volts. It gives the designer the flexibility to protect
single lines in applications where arrays are not practi-
cal. The combination of small size, low capacitance,
and high ESD surge capability makes them ideal for
use in applications such as cellular phones and digital
video interfaces.
Applications
Mechanical Characteristics
Cellular Handsets & Accessories
Digital Visual Interface (DVI)
Display Port
MDDI Ports
USB Ports
PCI Express
Serial ATA
Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)
Cable Discharge Event (CDE)
Ultra-small package (1.0 x 0.6 x 0.5mm)
Protects one data or I/O line
Low capacitance: 0.5pF
Low clamping voltage
Low operating voltage: 5.0V
Solid-state silicon-avalanche technology
SLP1006P2 package
Molding compound flammability rating: UL 94V-0
Marking: Marking code
Packaging: Tape and Reel
Lead Finish: NiPdAu
Pb-Free, Halogen Free, RoHS/WEEE Compliant
SLP1006P2 (Bottom View)
Maximum Dimensions (mm)
0.65
0.50
0.60
1.0
2© 2010 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
RClamp0521PA
Absolute Maximum Rating
Electrical Characteristics (T=25oC)
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© 2010 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
RClamp0521PA
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
0
10
20
30
40
50
60
70
80
90
100
110
0 25 50 75 100 125 150
Ambient Temperature - TA (oC)
% of Rated Power or IPP
Power Derating Curve
Clamping Voltage vs. Peak Pulse Current Normalized Capacitance vs. Reverse Voltage
ESD Clamping
(8kV Contact per IEC 61000-4-2) Insertion Loss S21
0
0.5
1
1.5
2
012345
Reverse Voltage - VR (V)
CJ(VR) / CJ(VR=0)
f = 1 MHz
START
. 030 MHz 3
STOP 000
. 000 000 MHz
CH1 S21 LOG 6 dB / REF 0 dB
1: -0.01950 dB
900 MHz
2: 0.02630 dB
1.8 GHz
3: 0.25850 dB
2.5 GHz
0 dB
-6 dB
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB
-42 dB
-48 dB 1
GHz
100
MHz 3
GHz
10
MHz
1
MHz
1 2 3
0.01
0.1
1
10
0.1 1 10 100 1000
Pulse Duration - tp (μs)
Peak Pulse Power - P
PP
(kW)
Note: Data is taken with a 10x attenuator
0
2
4
6
8
10
12
14
16
18
20
22
24
012345
Peak Pulse Current - IPP (A)
Clamping Voltage - VC (V)
Waveform
Parameters:
tr = 8μs
td = 20μs
4© 2010 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
RClamp0521PA
Equivalent Circuit Diagram
Device Connection Options
These low capacitance TVS diodes are designed to
provide common mode protection for one high-speed line
or differential protection for one line pair. The device is
bidirectional and may be used on lines where the signal
polarity is positive and negative.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
zPlace the TVS near the input terminals or connec-
tors to restrict transient coupling.
zMinimize the path length between the TVS and the
protected line.
zMinimize all conductive loops including power and
ground loops.
zThe ESD transient return path to ground should be
kept as short as possible.
zNever run critical signals near board edges.
zUse ground planes whenever possible.
Applications Information
5
© 2010 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
RClamp0521PA
Outline Drawing - SLP1006P2
Land Pattern - SLP1006P2
INCHES
.026 BSC
aaa
N
E
L
e
.008
.020
DIM
A
MIN
.018
.016
0.30
0.70
0.20
0.50
.003
2
.010
.024
.012
.028
0.08
2
0.25
0.60
0.65 BSC
MILLIMETERS
MAX
0.55
0.55
DIMENSIONS
MIN
0.45
NOM
.020
.020
MAX
.022
.022
NOM
0.40
0.50
0.50
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
NOTES:
1.
BOTTOM VIEW
TOP VIEW
AB
C
b
aaa C
SEATING
PLANE
bbb C A B
D.035 .039 .043 0.90 1.10
1.00
.004bbb 0.10
D
E
A1
A
bxN
e
A1 .000 .001 .002 0.00 0.03 0.05
R
2x L
PIN 1 ID
R .002 .004 .006 0.05 0.10 0.15
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
NOTES:
2.
DIM
Y
G
C
MILLIMETERSINCHES
(0.85)
.055
.012
.022
(.033)
1.40
0.55
0.30
DIMENSIONS
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
Z
Y
(C) GZ
X .024 0.60
X
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
6© 2010 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
RClamp0521PA
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
Marking Code Ordering Information
Tape and Reel Specification
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htdiW )xaM(,BD1DE F K
)xaM( P0P2PT
)xaM( W
mm8 mm2.4
)561.(
1.0+5.1
0.0-mm
95.0(mm
500.+
)000.-
mm8.0
52.0±
)130.(
1.0±057
.1
mm
)400.±960.(
50.0±5.3
mm
)200.±831.(
mm4.2
)490.(
01.0±0.4
mm
)400.±751.(
mm1.0±0.4
)400.±751.(
50.0±0.2
mm
)20
0.±970.(
mm4.0
)610.(
mm0.8
mm3.0+
mm1.0-
)210.±213.(
0A0B0K
mm01.0-/+96.0mm01.0-/+91.1mm01.0-/+66.0
RailClamp and RClamp are marks of Semtech Corporation.
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Device Orientation in Tape
Cathode Band/Date Code Location
User Direction of feed
N
Notes:
1)Marking will also include line matrix date code
2) Device is electrically symmetrical
