HCC/HCF4511B
BCD-TO-SEVEN SEGMENT LATCH/DECODER/DRIVER
DESCRIPTION
.HIGH-OUTPUT-SOURCING CAPABILITY (up
to 25 mA)
.INPUT LATCHES FOR BCD CODE STORAGE
.LAMP TEST AND BLANKING CAPABILITY
.7-SEGMENT OUTPUTS BLANKED FOR BCD
INPUT CODES > 1001
.QUIESCENT CURRENT SPECIFIED TO 20V
FOR HCC DEVICE
.STANDARDIZED SYMMETRICAL OUTPUT
CHARACTERISTICS
.5V, 10V, AND 15VPARAMETRIC RATINGS
.INPUTCURRENTOF100mA AT18V AND25°C
FOR HCC DEVICE
.100% TESTEDFOR QUIESCENTCURRENT
.MEETSALLREQUIREMENTSOFJEDECTEN-
TATIVESTANDARDN°13A,STANDARD SPE-
CIFICATIONS FOR DESCRIPTION OF B”
SERIESCMOS DEVICES”
November1996
TheHCC4511B (extended temperature range)and
the HCF 4511B (intermediate temperature range)
are monolithic integrated circuits available in 16-le-
ad dual in-line plastic or ceramic package and pla-
stic micro package.
TheHCC/HCF4511B types areBCD-to-7-segment
latch decoder drivers constructed with COS/MOS
logic and n-p-n bipolar transistor output devices on
a singlemonolithic structure. These devices combi-
ne thelow quiescentpower dissipationandhigh noi-
se immunity features of COS/MOS with n-p-n
bipolar outputtransistors capable of sourcing up to
25 mA. This capability allows the HCC/HCF4511B
types to drive LED’s and other displays directly.
Lamp Test (LT), Blanking (BL), and Latch Enable or
Strobe inputs are provided to test the display, shut
off or intensity-modulate it, and store or strobe a
BCD code, respectively. Several different signal
may be multiplexed and displayed when external
multiplexing circuitry is used.
EY
(Plastic Package) F
(CeramicFrit Seal Package)
C1
(Plastic Chip Carrier)
ORDERCODES :
HCC4511BF HCF4511BM1
HCF4511BEY HCF4511BC1
PIN CONNECTIONS
M1
(Micro Package)
1/16
FUNCTIONAL DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
VDD* Supply Voltage :HCC Types
HCF Types 0.5 to + 20
0.5 to + 18 V
V
ViInput Voltage 0.5 to VDD + 0.5 V
IIDC Input Current (any one input) ±10 mA
Ptot Total Power Dissipation (per package)
Dissipation per Output Transistor
for Top = Full Package-temperature Range
200
100
mW
mW
Top Operating Temperature : HCC Types
HCF Types 55 to + 125
–40to+85 °C
°C
T
stg Storage Temperature 65 to + 150 °C
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Value Unit
VDD Supply Voltage : HCC Types
HCF Types 3to18
3to15 V
V
V
IInput Voltage 0 to VDD V
Top Operating Temperature : HCC Types
HCF Types 55 to + 125
–40to+85 °C
°C
Stresses above thoselisted under”Absolute Maximum Ratings”may cause permanent damage tothe device. This is a stressrating only and
functionnal operation of the device at these orany other conditions abovethose indicated in theoperational sections ofthis specification is not
implied.Exposure toabsolute maximum ratingconditions for external periods may affect device reliability.
*Allvoltage values are referred to VSS pinvoltage.
HCC/HFC4511B
2/16
LOGIC DIAGRAMS
HCC/HCF4511B
3/16
TRUTH TABLE
LE BI LT D C B A a b c d e f g Display
XX0X X X X 1 1 1 1 1 1 1 8
X 0 1 X X X X 0 0 0 0 0 0 0 Blank
0110 0 0 0 1 1 1 1 1 1 0 0
0110 0 0 1 0 1 1 0 0 0 0 1
0110 0 1 0 1 1 0 1 1 0 1 2
0110 0 1 1 1 1 1 1 0 0 1 3
0110 1 0 0 0 1 1 0 0 1 1 4
0110 1 0 1 1 0 1 1 0 1 1 5
01101
1 0 0 0 1 1 1 1 1 6
0110 1 1 1 1 1 1 0 0 0 0 7
0111 0 0 0 1 1 1 1 1 1 1 8
0111 0 0 1 1 1 1 0 0 1 1 9
0 1 1 1 0 1 0 0 0 0 0 0 0 0 Blank
0 1 1 1 0 1 1 0 0 0 0 0 0 0 Blank
0 1 1 1 1 0 0 0 0 0 0 0 0 0 Blank
0 1 1 1 1 0 1 0 0 0 0 0 0 0 Blank
0 1 1 1 1 1 0 0 0 0 0 0 0 0 Blank
0 1 1 1 1 1 1 0 0 0 0 0 0 0 Blank
1 1 1 X X X X * *
HCC/HFC4511B
4/16
STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions)
Test Conditions Value
VIVO|IO|V
DD TLow*25°CT
High*
Symbol Parameter (V) (V) (µA) (V) Min. Max. Min. Typ. Max. Min. Max.
Unit
ILQuiescent
Current HCC
Types
0/ 5 5 5 0.04 5 150
µA
0/10 10 10 0.04 10 300
0/15 15 20 0.04 20 600
0/20 20 100 0.08 100 3000
HCF
Types
0/ 5 5 20 0.04 20 150
0/10 10 40 0.04 40 300
0/15 15 80 0.04 80 600
VOH Output High
Voltage 0/ 5 5 4 4.1 4.55 4.2 V
0/10 10 9 9.1 9.55 9.2
0/15 15 14 14.1 14.55 14.2
VOL Output Low
Voltage 5/0 5 0.05 0.05 0.05 V
10/0 10 0.05 0.05 0.05
15/0 15 0.05 0.05 0.05
VIH Input High
Voltage 0.5/3.8 5 3.5 3.5 3.5
V
1/8.8 10 7 7 7
1.5/13.8 15 11 11 11
VIL Input Low
Voltage 3.8/0.5 5 1.5 1.5 1.5 V
8.8/1 10 3 3 3
13.8/1.5 15 4 4 4
VOH Output
Drive
Voltage
HCC
Types 0
5
4.1 4.10 4.55 4.20
V
5 4.25
10 3.80 3.90 4.10 3.90
15 3.95
20 3.55 3.40 3.75
25 3.40 3.10 3.55
0
10
9 9.10 9.55 9.20
V
5 9.25
10 8.85 9 9.15
15 9.05
20 8.70 8.60 8.90 8.40
25 8.60 8.30 8.75
0
15
14 14.10 14.55 14.20
V
5 14.30
10 13.90 14 14.20 14
15 14.10
20 13.75 13.70 13.95 13.50
25 13.65 13.50 13.80 13.10
*T
Low=–55°C for HCC device : 40°CforHCF device.
*T
High= +125°C for HCC device: + 85°C for HCF device.
TheNoiseMarginfor both”1” and”0” level is : 1V min.with VDD = 5V,2V min. with VDD =10V, 2.5 V min. withVDD = 15V.
HCC/HCF4511B
5/16
STATIC ELECTRICAL CHARACTERISTICS (continued)
Test Conditions Value
VIVO|IO|V
DD TLow*25°CT
High*
Symbol Parameter (V) (V) (µA) (V) Min. Max. Min. Typ. Max. Min. Max.
Unit
VOH Output
Drive
Voltage
HCF
Types
0
5
4.1 4.1 4.57 4.1
V
5 4.24
10 3.6 3.6 4.12 3.3
15 3.94
20 2.8 2.8 3.75 2.5
25 3.54
0
10
9.1 9.1 9.58 9.1
V
5 9.26
10 8.75 8.75 9.17 8.45
15 9.04
20 8.1 8.1 8.90 7.8
25 8.75
0
15
14.1 14.1 14.59 14.1
V
5 14.27
10 13.75 13.75 14.18 13.45
15 14.07
20 13.1 13.1 13.95 12.8
25 13.80
IOL Output
Sink
Current HCC
Types
0/ 5 0.4 5 0.64 0.51 1 0.36
mA
0/10 0.5 10 1.6 1.3 2.6 0.9
0/15 1.5 15 4.2 3.4 6.8 2.4
HCF
Types
0/ 5 0.4 5 0.52 0.44 1 0.36
0/10 0.5 10 1.3 1.1 2.6 0.9
0/15 1.5 15 3.6 3 6.8 2.4
IIH,I
IL Input
Leakage
Current
HCC
Types 0/18 Any Input 18 ± 0.1 ±10–5 ±0.1 ±1
µA
HCF
Types 0/15 15 ±0.3 ±10–5 ±0.3 ±1
CIInput Capacitance Any Input 5 7.5 pF
*T
Low=–55°C for HCC device : 40°CforHCF device.
*T
High= +125°C for HCC device: + 85°C for HCF device.
TheNoiseMarginfor both”1” and”0” level is : 1V min.with VDD = 5V,2V min. with VDD =10V, 2.5 V min. withVDD = 15V.
HCC/HFC4511B
6/16
DYNAMIC ELECTRICAL CHARACTERISTICS (Tamb =25o
C, CL=50pF,R
L= 200 K,
typical temperature coefficent for all VDD values is 03 %/oC, all input rise and fall times= 20 ns)
Symbol Parameter Test Conditions Value Unit
VDD (V) Min. Typ. Max.
tPHL Propagation Delay Time (data) 5 520 1040 ns
10 210 420
15 150 300
tPLH Propagation Delay Time (data) 5 660 1320 ns
10 260 520
15 180 360
tPHL Propagation Delay Time (BL) 5 350 700 ns
10 175 350
15 125 250
tPLH Propagation Delay Time (BL) 5 400 800 ns
10 175 350
15 150 300
tPHL Propagation Delay Time (LT) 5 250 500 ns
10 125 250
15 85 170
tPLH Propagation Delay Time (LT) 5 150 300 ns
10 75 150
15 50 100
tTLH Transition Time 5 40 80 ns
10 30 60
15 20 40
tTHL Transition Time 5 125 310 ns
10 75 185
15 65 160
tsetup Setup Time 5 150 75 ns
10 70 35
15 40 20
thold Hold Time 5 0 -75 ns
10 0 -35
15 0 -20
tWStrobe Pulse Width 5 400 200 ms
10 160 80
15 100 50
HCC/HCF4511B
7/16
Typical Output Low (sink) Current Characteristics. Typical data-to-output, low-to-high-level propaga-
tion delay time as a function of load capacitance.
Typical data-to-output, high-to-low-level propaga-
tion delay time as a function of load capacitance. Typical low-to-high level transition ime as a func-
tion of load capacitance.
Typical Voltage drop (VDD to output) vs. Output
source Current as a Function of Supply.
Typical high-to-low level transition ime as a func-
tion ofload capacitance.
HCC/HFC4511B
8/16
Typical Dynamic Power Dissipation Charac-
teristics. Derated Static Output Current PerOutput.
TYPICAL APPLICATIONS (interfacing with various displays)
DRIVINGCOMMON-CATHODE 7-SEGMENT LED DISPLAYS
Maximumcontinuous derated output current IOH applies to a single
output withall otheroutputs sourcing anequalamount of current at
the supply voltages shown. Operation above the derating curve is
not recommenced.
HCC/HCF4511B
9/16
Input Leakage Current.
Noise Immunity.
TEST CIRCUITS
Quiescent Device Current.
Driving Low-voltage Fluorescent Displays. Driving Incandescent Displays.
Data Propagation Delay.
Amedium-brightness intensity display canbe obtained with low-
voltage fluorescent displays such as the Tung-Sot Digivac S/G
series.
2 of 7 Segments ShownConnected
Resistors R from VDD VDD to each7-segment driver output
arechoosen tokeep allNumitronsegments slightlyon and
warm.
TYPICAL APPLICATIONS (continued)
HCC/HFC4511B
10/16
TEST CIRCUITS (continued)
Dynamic Power dissipation.
HCC/HCF4511B
11/16
Plastic DIP16 (0.25) MECHANICAL DATA
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
a1 0.51 0.020
B 0.77 1.65 0.030 0.065
b 0.5 0.020
b1 0.25 0.010
D 20 0.787
E 8.5 0.335
e 2.54 0.100
e3 17.78 0.700
F 7.1 0.280
I 5.1 0.201
L 3.3 0.130
Z 1.27 0.050
P001C
HCC/HFC4511B
12/16
Ceramic DIP16/1 MECHANICAL DATA
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 20 0.787
B 7 0.276
D 3.3 0.130
E 0.38 0.015
e3 17.78 0.700
F 2.29 2.79 0.090 0.110
G 0.4 0.55 0.016 0.022
H 1.17 1.52 0.046 0.060
L 0.22 0.31 0.009 0.012
M 0.51 1.27 0.020 0.050
N 10.3 0.406
P 7.8 8.05 0.307 0.317
Q 5.08 0.200
P053D
HCC/HCF4511B
13/16
SO16 (Narrow) MECHANICAL DATA
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 1.75 0.068
a1 0.1 0.2 0.004 0.007
a2 1.65 0.064
b 0.35 0.46 0.013 0.018
b1 0.19 0.25 0.007 0.010
C 0.5 0.019
c1 45°(typ.)
D 9.8 10 0.385 0.393
E 5.8 6.2 0.228 0.244
e 1.27 0.050
e3 8.89 0.350
F 3.8 4.0 0.149 0.157
G 4.6 5.3 0.181 0.208
L 0.5 1.27 0.019 0.050
M 0.62 0.024
S8°(max.)
P013H
HCC/HFC4511B
14/16
PLCC20 MECHANICAL DATA
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 9.78 10.03 0.385 0.395
B 8.89 9.04 0.350 0.356
D 4.2 4.57 0.165 0.180
d1 2.54 0.100
d2 0.56 0.022
E 7.37 8.38 0.290 0.330
e 1.27 0.050
e3 5.08 0.200
F 0.38 0.015
G 0.101 0.004
M 1.27 0.050
M1 1.14 0.045
P027A
HCC/HCF4511B
15/16
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such informationnor for any infringement of patents or other rights of third parties which may results from its use. No
licenseis granted by implication or otherwise under any patentor patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication aresubject to change withoutnotice. Thispublication supersedes and replacesall information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in lifesupport devices or systems without express
writtenapproval ofSGS-THOMSONMicroelectonics.
1996 SGS-THOMSONMicroelectronics -Printed in Italy- All Rights Reserved
SGS-THOMSONMicroelectronics GROUP OF COMPANIES
Australia