W24258
Publication Release Date: November 1998
- 11 - Revision A8
VERSION HISTORY
VERSION DATE PAGE DESCRIPTION
A4 Mar. 1997 8Add bonding PAD diagram
A5 Jan. 1998 8Modify bonding PAD diagram
A6 Feb. 1998 1, 2, 4, 7 Delete operating temperature (SL = 0 to 70 °C)
A7 Apr. 1998 3Add standby power supply current (ISB1) typical
parameter when operation temperature TA = 25° C
A8 Nov. 1998 1, 3, 7, 10 Deduct reverse type one TSOP package
Headquarters
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 886-3-5770066
FAX: 886-3-5796096
http://www.winbond.com.tw/
Voice & Fax-on-demand: 886-2-27197006
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: 886-2-27190505
FAX: 886-2-27197502
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II,
123 Hoi Bun Rd., Kwun Tong,
Kowloon, Hong Kong
TEL: 852-27513100
FAX: 852-27552064
Winbond Electronics North America Corp.
Winbond Memory Lab.
Winbond Microelectronics Corp.
Winbond Systems Lab.
2727 N. First Street, San Jose,
CA 95134, U.S.A.
TEL: 408-9436666
FAX: 408-5441798
Note: All data and specifications are subject to change without notice.