PF (ADP1) PF PRESSURE SENSOR PRECISION SEMICONDUCTOR PRESSURE SENSOR FEATURES Silicon Piezo resistance strain gauge Anode junction Pressure Glass base Highly reliable wire bonding technology Pressure High reliability die bonding technology Very strong, heat resistant body RoHS compliant Example of pressure characteristics (ADP1141) Drive current: 1.5 mA rated current; ambient temperature: 25C 77F 100 Output voltage, mV <Cross-section of Sensor Chip> 1. A wide range of rated pressure, including a minute pressure There are 10 types of sensors covering a wide range of rated pressure from a minute pressure between 4.9 kPa {0.05 kgf/cm2}, to a maximum pressure of 980.7 kPa {10 kgf/cm2}. 2. Highly accurate, linear characteristics This sensor employs a semiconductor strain gauge method, ensuring accurate and linear detection characteristics. It also has excellent repeatability of pressure characteristics. 3. Wide range of products * Taking their place alongside the standard 5k bridge resistance models are those with a 3.3k resistance which is optimally suited to 5V drive circuits. * Economy model (no glass base) gives outstanding value for consumer appliances 40 kPa (0.4 kgf/cm2) and 49 kPa (0.5 kgf/ cm2) units are also available. 50 0 0 49 Pressure (gauge pressure), (kPa) 98.1 TYPICAL APPLICATIONS * Medical equipment: Electronic hemodynamometer * Home appliance: Vacuum cleaner * Gas equipment: Microprocessor gas meter, gas leakage detector * Industrial equipment: Absorption device, etc. ORDERING INFORMATION Ex. ADP 1 Part No. Terminal profile and direction Rated pressure Type Bridge resistance ADP1: PF pressure sensor 1: DIP terminal: Direction opposite the pressure inlet direction 0: 4.9 kPa 1: 14.7 kPa 2: 34.3 kPa 3: 49.0 kPa 4: 98.1 kPa 5: 196.1 kPa 6: 343.2 kPa 7: 490.3 kPa 8: 833.6 kPa 9: 980.7 kPa A: 40.0 kPa 1: Standard type (With glass base) 2: Economy type (Without glass base) Nill: 5.0k 3: 3.3k 2: DIP terminal: Pressure inlet direction Note: Some part numbers may not be available depending on the combination. Please refer to the Table of Product Types, below. ASCTB88E 201201-T Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e PF (ADP1) PRODUCT TYPES 1. DIP terminal 5.0k Pressure Standard type (with glass base) DIP terminal: Terminal Direction opposite the pressure inlet direction 4.9kPa ADP1101 14.7kPa ADP1111 34.3kPa ADP1121 49.0kPa ADP1131 98.1kPa ADP1141 196.1kPa ADP1151 343.2kPa ADP1161 490.3kPa ADP1171 833.6kPa ADP1181 980.7kPa ADP11910 Economy type (without glass base) 3.3k DIP terminal: Pressure inlet direction DIP terminal: Direction opposite the pressure inlet direction -- -- -- -- -- -- -- -- -- -- ADP1201 ADP1211 ADP1221 ADP1231 ADP1241 ADP1251 ADP1261 ADP1271 ADP1281 ADP1291 DIP terminal: Pressure inlet direction -- -- -- -- -- -- -- -- -- -- 40.0kPa -- -- ADP11A23 ADP12A23 49.0kPa ADP1132 ADP1232 -- -- SPECIFICATIONS Type Economy type (Without glass base) Standard type (With glass base) Type of pressure Pressure medium Rated Unit: kPa pressure Gauge pressure Air (For other medium, please consult us.) 4.9 14.7 34.3 Max. applied pressure 49.0 98.1 196.1 343.2 490.3 Twice the rated pressure Ambient temperature -20 to 100C -4 to 212F (no freezing or condensation) Storage temperature -40 to 120C -40 to 248F (no freezing or condensation) Temperature compensation range 0 to 50C 32 to 122F Drive current (constant current) Offset voltage Linearity Pressure hysteresis Offset voltage-temperature characteristics (0 to 50C 32 to 122F) Sensitivity-temperature characteristics (0 to 50C 32 to 122F) 980.7 50001000 Bridge resistance Output span voltage 833.6 1.5 times the rated pressure 1.5 mA DC 4020 mV 0.7%FS 0.6%FS 20 mV 0.3%FS 0.2%FS 49.0 Twice the rated pressure 3300 5000 600 1000 -5 to -20 to +50C +100C +23 to -4 to +122F +212F -20 to -40 to +70C +120C -4 to -40 to +158F +248F 5 to 45C 0 to 50C 41 to 32 to 113F 122F 1.5 mA DC 10040 mV 0.5%FS 0.4%FS 40.0 0.5%FS 0.6%FS 0.4%FS 8545 43.522.5 mV mV 15 mV 25 mV 0.3%FS 0.7%FS 15%FS 5.0%FS 10%FS 8%FS 10%FS 2.5%FS 1.3%FS 2.5%FS Notes) 1 Unless otherwise specified, measurements were taken with a drive current of1.5 mA 0.01 mA at a temperature of 25C 77F and humidity ranging from 25% to 85%. 2. Please consult us if a pressure medium other than air is to be used. 3. This is the regulation which applies within the compensation temperature range. 4. Please consult us if the intended use involves a negative pressure. Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e ASCTB88E 201201-T PF (ADP1) DATA 1. Characteristics data 1-(1) Output characteristics 1-(2) Offset voltage - temperature characteristics 1-(3) Sensitivity - temperature characteristics (%FS) ADP1141 Drive current: 1.5 mA; temperature: 25C 77F ADP1141 Drive current: 1.5 mA; rating 5%FS ADP1141 Drive current: 1.5 mA; rating 2.5%FS Output voltage (mV) 60 40 20 0 -20 -40 0 49 Sensitivity - temperature characteristics (%FS) 80 4 4 Offset voltage - temperature characteristics (%FS) 100 3 2 1 0 -1 -2 98.1 Rated pressure 0 32 25 47 kPa 3 2 1 0 -1 -2 50 122 Temperature (C F) 0 32 25 47 50 122 Temperature (C F) 2. Pressure cycle range (0 to rated pressure) Tested sample: ADP1131, temperature: 25C 77F 2-(1) Offset voltage range 2-(2) Output span voltage range 2 Output span voltage range (%FS) Offset voltage range (%FS) 2 1 0 -1 -2 0 1x105 5x105 1x106 Even after testing for 1 million times, the variations in the offset voltage and output span voltage are minimal. 1 0 -1 -2 Pressure cycle (cycle) 0 1x105 5x105 1x106 Pressure cycle (cycle) 3. Evaluation test Tested item Environmental characteristics Passed Storage at low temperature Temperature: Left in a -40C -40F constant temperature bath Time: 1,000 hrs. Passed Humidity Temperature/humidity: Left at 40C 104F, 90% RH Time: 1,000 hrs. Passed High temperature/high humidity operation Vibration resistance Mechanical characteristics Soldering Resistance Result Storage at high temperature Temperature cycle Endurance characteristics Tested condition Temperature: Left in a 120C 248F constant temperature bath Time: 1,000 hrs. Temperature: -40C to 120C -40F to 248F 1 cycle: 30 min. Times of cycle: 100 Temperature/humidity: 40C 104F, 90% RH Operation times: 106, rated voltage applied Double amplitude: 1.5 mm .059 inch Vibration: 10 to 55 Hz Applied vibration direction: X, Y, Z 3 directions Times: 2 hrs each Passed Passed Passed Dropping resistance Dropping height: 75 cm 29.528 inch Times: 2 times Passed Terminal strength Pulling strength: 9.8 N {1 kgf}, 10 sec. Bending strength: 4.9 N {0.5 kgf}, left and right 90 1 time Passed Soldered in DIP soldering bath Temperature: 230C 446F Time: 5 sec. Passed Temperature Temperature: 260C 500F Time: 10 sec. Passed Note: For details other than listed above, please consult us. ASCTB88E 201201-T Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e PF (ADP1) mm inch General tolerance: 0.3 .012 DIMENSIONS 1. Terminal direction: Direction opposite the pressure inlet derection ADP11 () Recommended PC board pattern (BOTTOM VIEW) 10 .394 Atmospheric pressure inlet hole 6-0.9 dia. 6-.035 dia. Pressure inlet hole 0.8 dia. .031 dia. 10.16 .400 8.6 .339 10.16 .400 C0.5 C.020 3 dia. .118 dia. 1.1 .043 Tolerance: 0.1 .004 R0.5 R.020 6 .236 Terminal connection diagram 3.3 .130 +Input 4.9 .193 R2 to 15 R1 0.25 .010 6 5 +Output -Output 0 0.6 .024 0.5 .020 1.2 .047 2.54 .100 2.54 .100 2.54 .100 5.08 .200 R3 2.54 .100 4 R4 -Input Terminal No. 1 2 3 4 5 6 JAPAN 1 2 3 Name Output (-) Power supply (+) Output (+) No connection Power supply (-) Output (-) Note: Leave terminal 4 unconnected. 2. Terminal direction: Pressure inlet direction ADP12 () Recommended PC board pattern (BOTTOM VIEW) 10 .394 Atmospheric pressure inlet hole 6-0.9 dia. 6-.035 dia. Pressure inlet hole 0.8 dia. .031 dia. 2.54 .100 1.2 .047 0.5 .020 10.16 .400 6 dia. .236 dia. 8.6 .339 3 dia. .118 dia. 2.54 .100 0 to C0.5 .020 0.25 .010 2.54 .100 2.54 .100 5.08 .200 15 Tolerance: 0.1 .004 Terminal connection diagram 0.6 .024 6 4 .236 .157 R0.5 .020 +Input 3.3 .130 0.25 .010 R2 10.16 .400 6 5 R1 +Output -Output 4 R3 R4 -Input JAPAN 1 2 Terminal No. 1 2 3 4 5 6 3 Name Output (-) Power supply (+) Output (+) No connection Power supply (-) Output (-) Note: Leave terminal 4 unconnected. Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e ASCTB88E 201201-T PF (ADP1) NOTES 1. Mounting Use lands on the printed-circuit boards to which the sensor can be securely fixed. 2. Soldering Due to its small size, the thermal capacity of the pressure sensor DIP type is low. Therefore, take steps to minimize the effects of external heat. Damage and changes to characteristics may occur due to heat deformation. Use a non-corrosive resin type of flux. Since the pressure sensor DIP type is exposed to the atmosphere, do not allow flux to enter inside. 1) Manual soldering * Set the soldering tip from 260 to 300C 500 to 572F (30W), and solder for no more than 5 seconds. * Please note that output may change if the pressure is applied on the terminals when the soldering. * Thoroughly clean the soldering iron. 2) DIP soldering (DIP terminal type) * Please keep the DIP solder bath temperature no higher than 260C 500F. When soldering, heat should be applied no longer than five seconds. * When mounting onto a PCB of low thermal capacity, please avoid DIP soldering as this may cause heat deformity. 3) Solder reworking * Finish reworking in one operation. * For reworking of the solder bridge, use a soldering iron with a flat tip. Please do not add more flux when reworking. * Please use a soldering iron that is below the temperature given in the specifications in order to maintain the correct temperature at the tip of the soldering iron. 4) Too much force on the terminals will cause deformation and loss in effectiveness of the solder. Therefore, please avoid dropping and careless handling of the product. 5) Please control warping of the PCB within 0.05 mm of the sensor width. 6) When cut folding the PCB after mount- ing the sensor, take measures to prevent stress to the soldered parts. 7) The sensor terminals are designed to be exposed, so contact of the terminals with metal shards and the like will cause output errors. Therefore, please be careful and prevent things such as metal shards and hands from contacting the terminals. 8) To prevent degradation of the PCB insulation after soldering, please be careful not to get chemicals on the sensor when coating. 9) Please consult us regarding the use of lead-free solder. 3. Cleaning 1) Since the pressure sensor chip is exposed to the atmosphere, do not allow cleaning fluid to enter inside. 2) Avoid ultrasonic cleaning since this may cause breaks or disconnections in the wiring. 4. Environment 1) Please avoid using or storing the pressure sensor chip in a place exposed to corrosive gases (such as the gases given off by organic solvents, sulfurous acid gas, hydrogen sulfides, etc.) which will adversely affect the performance of the pressure sensor chip. 2) Since this pressure sensor chip does not have a water-proof construction, please do not use the sensor in a location where it may be sprayed with water, etc. 3) Avoid using the pressure sensors chip in an environment where condensation may form. Furthermore, its output may fluctuate if any moisture adhering to it freezes. 4) The pressure sensor chip is constructed in such a way that its output will fluctuate when it is exposed to light. Especially when pressure is to be applied by means of a transparent tube, take steps to prevent the pressure sensor chip from being exposed to light. 5) Avoid using the pressure sensor chip where it will be susceptible to ultrasonic or APPLICATION CIRCUIT DIAGRAM (EXAMPLE) MOUNTING METHOD The pressure sensor is designed to convert a voltage by means of constant current drive and then, if necessary, it amplifies the voltage for use. The circuit shown below is a typical example of a circuit in which the pressure sensor is used. Amplifier circuit unit Constant current circuit unit Pressure sensor The general method for transmitting air pressures differs depending on whether the pressure is low or high. * Checkpoints for use <1> Select a pressure inlet pipe which is sturdy enough to prevent pressure leaks. <2> Fix the pressure inlet pipe securely so as to prevent pressure leaks. <3> Do not block the pressure inlet pipe. other high-frequency vibration. 5. Quality check under actual loading conditions To assure reliability, check the sensor under actual loading conditions. Avoid any situation that may adversely affect its performance. 6. Other handling precautions 1) That using the wrong pressure range or mounting method may result in accidents. 2) The only direct pressure medium you can use is dry air. The use of other media, in particular, corrosive gases (organic solvent based gases, sulfurous acid based gases, and hydrogen sulfide based gases, etc.) and media that contains moisture or foreign substances will cause malfunction and damage. Please do not use them. 3) The pressure sensor chip is positioned inside the pressure inlet. Never poke wires or other foreign matter through the pressure inlet since they may damage the chip or block the inlet. Avoid use when the atmospheric pressure inlet is blocked. 4) Use an operating pressure which is within the rated pressure range. Using a pressure beyond this range may cause damage. 5) Since static charge can damage the pressure sensor chip, bear in mind the following handling precautions. * When storing the pressure sensor chips, use a conductive material to short the pins or wrap the entire chip in aluminum foil. Plastic containers should not be used to store or transport the chips since they readily become charged. * When using the pressure sensor chips, all the charged articles on the bench surface and the work personnel should be grounded so that any ambient static will be safely discharged. 6) Based on the pressure involved, give due consideration to the securing of the pressure sensor DIP type and to the securing and selection of the inlet tube. Consult us if you have any queries. Methods of transmitting air pressures When the pressure is low (4.9 to 98.1 kPa) When the pressure is high (196.1 to 980.7 kPa) Printedcircuit board O-ring Tube Pressure inlet pipe If a tube is used as the pressure inlet pipe, it may become disengaged. Therefore, use a sturdy tube and secure it using O-rings. OP AMP OP AMP OP AMP ASCTB88E 201201-T Printedcircuit board Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e