EE80C321 - Intel - Datasheet.Live

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July, 2004COPYRIGHT

INTEL CORPORATION, 2004 Order Number: 272336-005

8XC52/54/58

CHMOS SINGLE-CHIP 8-BIT MICROCONTROLLER

Commercial/Express

87C52/80C52/80C32/87C54/80C54/87C58/80C58

*See Table 1 for Proliferation Options

YHigh Performance CHMOS EPROM/

ROM/CPU

Y12/24/33 MHz Operations

YThree 16-Bit Timer/Counters

YProgrammable Clock Out

YUp/Down Timer/Counter

YThree Level Program Lock System

Y8K/16K/32K On-Chip Program Memory

Y256 Bytes of On-Chip Data RAM

YImproved Quick Pulse Programming

Algorithm

YBoolean Processor

Y32 Programmable I/O Lines

Y6 Interrupt Sources

YProgrammable Serial Channel with:

Ð Framing Error Detection

Ð Automatic Address Recognition

YTTL and CMOS Compatible Logic

Levels

Y64K External Program Memory Space

Y64K External Data Memory Space

YMCSÉ51 Microcontroller Compatible

Instruction Set

YPower Saving Idle and Power Down

Modes

YONCE (On-Circuit Emulation) Mode

YFour-Level Interrupt Priority

YExtended Temperature Range Except

for 33 MHz Offering (b40§Ctoa

85§C)

MEMORY ORGANIZATION

ROM EPROM ROMless ROM/EPROM RAM

Device Version Version Bytes Bytes

80C52 87C52 80C32 8K 256

80C54 87C54 80C32 16K 256

80C58 87C58 80C32 32K 256

These devices can address up to 64 Kbytes of external program/data memory.

The Intel 8XC52/8XC54/8XC58 is a single-chip control-oriented microcontroller which is fabricated on Intel’s

reliable CHMOS III-E technology. Being a member of the MCS 51 family of controllers, the 8XC52/8XC54/

8XC58 uses the same powerful instruction set, has the same architecture, and is pin-for-pin compatible with

the existing MCS 51 family of products. The 8XC52/8XC54/8XC58 is an enhanced version of the

87C51/80C51BH/80C31BH. The added features make it an even more powerful microcontroller for applica-

tions that require clock output, and up/down counting capabilities such as motor control. It also has a more

versatile serial channel that facilitates multi-processor communications.

Throughout this document 8XC5X will refer to the 8XC52, 80C32, 8XC54 and 8XC58 unless information

applies to a specific device.

8XC52/54/58

Table 1. Proliferations Options

Standard*1-1 -2 -24 -33

80C32 X X X X X

80C52 X X X X X

87C52 X X X X X

80C54 X X X X X

87C54 X X X X X

80C58 X X X X X

87C58 X X X X X

NOTES:

*1 3.5 MHz to 12 MHz; 5V g20%

-1 3.5 MHz to 16 MHz; 5V g20%

-2 0.5 MHz to 12 MHz; 5V g20%

-24 3.5 MHz to 24 MHz; 5V g20%

-33 3.5 MHz to 33 MHz; 5V g10%

272336–1

Figure 1. 8XC5X Block Diagram

8XC52/54/58

PROCESSINFORMATION

This device is manufactured on P629.0, a CHMOS

III-E process. Additional process and reliability infor-

mation is available in the Intel®

Quality System

Handbook

PACKAGES

40-Pin Plastic DIP (OTP)

40-Pin CERDIP (EPROM)

44-Pin PLCC (OTP)

44-Pin QFP (OTP)

272336–2

DIP

272336–3

PLCC

272336–4

*Do not connect reserved pins. QFP

Figure 2. Pin Connections

8XC52/54/58

PIN DESCRIPTIONS

VCC:Supply voltage.

VSS:Circuit ground.

VSS1:Secondary ground (not on DIP). Provided to

reduce ground bounce and improve power supply

by-passing.

NOTE:

This pin is not a substitute for the VSS pin (pin 22).

(Connection not necessary for proper operation.)

Port 0: Port 0 is an 8-bit, open drain, bidirectional

I/O port. As an output port each pin can sink several

LS TTL inputs. Port 0 pins that have 1’s written to

them float, and in that state can be used as high-im-

pedance inputs.

Port 0 is also the multiplexed low-order address and

data bus during accesses to external Program and

Data Memory. In this application it uses strong inter-

nal pullups when emitting 1’s, and can source and

sink several LS TTL inputs.

Port 0 also receives the code bytes during EPROM

programming, and outputs the code bytes during

program verification. External pullup resistors are re-

quired during program verification.

Port 1: Port 1 is an 8-bit bidirectional I/O port with

internal pullups. The Port 1 output buffers can drive

LS TTL inputs. Port 1 pins that have 1’s written to

them are pulled high by the internal pullups, and in

that state can be used as inputs. As inputs, Port 1

pins that are externally pulled low will source current

(IIL, on the data sheet) because of the internal pull-

ups.

In addition, Port 1 serves the functions of the follow-

ing special features of the 8XC5X:

Port Pin Alternate Function

P1.0 T2 (External Count Input to Timer/

Counter 2), Clock-Out

P1.1 T2EX (Timer/Counter 2 Capture/

Reload Trigger and Direction Control)

Port 1 receives the low-order address bytes during

EPROM programming and verifying.

Port 2: Port 2 is an 8-bit bidirectional I/O port with

internal pullups. The Port 2 output buffers can drive

LS TTL inputs. Port 2 pins that have 1’s written to

them are pulled high by the internal pullups, and in

that state can be used as inputs. As inputs, Port 2

pins that are externally pulled low will source current

(IIL, on the data sheet) because of the internal pull-

ups.

Port 2 emits the high-order address byte during

fetches from external Program Memory and during

accesses to external Data Memory that use 16-bit

addresses (MOVX @DPTR). In this application it

uses strong internal pullups when emitting 1’s. Dur-

ing accesses to external Data Memory that use 8-bit

addresses (MOVX @Ri), Port 2 emits the contents of

the P2 Special Function Register.

Some Port 2 pins receive the high-order address bits

during EPROM programming and program verifica-

tion.

Port 3: Port 3 is an 8-bit bidirectional I/O port with

internal pullups. The Port 3 output buffers can drive

LS TTL inputs. Port 3 pins that have 1’s written to

them are pulled high by the internal pullups, and in

that state can be used as inputs. As inputs, Port 3

pins that are externally pulled low will source current

(IIL, on the data sheet) because of the pullups.

Port 3 also serves the functions of various special

features of the 8051 Family, as listed below:

Port Pin Alternate Function

P3.0 RXD (serial input port)

P3.1 TXD (serial output port)

P3.2 INT0 (external interrupt 0)

P3.3 INT1 (external interrupt 1)

P3.4 T0 (Timer 0 external input)

P3.5 T1 (Timer 1 external input)

P3.6 WR (external data memory write strobe)

P3.7 RD (external data memory read strobe)

RST: Reset input. A high on this pin for two machine

cycles while the oscillator is running resets the de-

vice. The port pins will be driven to their reset condi-

tion when a minimum VIHI voltage is applied whether

the oscillator is running or not. An internal pulldown

resistor permits a power-on reset with only a capaci-

tor connected to VCC.

ALE: Address Latch Enable output pulse for latching

the low byte of the address during accesses to ex-

ternal memory. This pin (ALE/PROG) is also the

program pulse input during EPROM programming for

the 87C5X.

In normal operation ALE is emitted at a constant

rate of (/6 the oscillator frequency, and may be used

for external timing or clocking purposes. Note, how-

ever, that one ALE pulse is skipped during each ac-

cess to external Data Memory.

8XC52/54/58

If desired, ALE operation can be disabled by setting

bit 0 of SFR location 8EH. With this bit set, the pin is

weakly pulled high. However, the ALE disable fea-

ture will be suspended during a MOVX or MOVC in-

struction, idle mode, power down mode and ICE

mode. The ALE disable feature will be terminated by

reset. When the ALE disable feature is suspended or

terminated, the ALE pin will no longer be pulled up

weakly. Setting the ALE-disable bit has no affect if

the microcontroller is in external execution mode.

Throughout the remainder of this data sheet, ALE

will refer to the signal coming out of the ALE/PROG

pin, and the pin will be referred to as the ALE/PROG

pin.

PSEN:Program Store Enable is the read strobe to

external Program Memory.

When the 8XC5X is executing code from external

Program Memory, PSEN is activated twice each

machine cycle, except that two PSEN activations

are skipped during each access to external Data

Memory.

EA/VPP:External Access enable. EA must be

strapped to VSS in order to enable the device to

fetch code from external Program Memory locations

0000H to 0FFFFH. Note, however, that if any of the

Lock bits are programmed, EA will be internally

latched on reset.

EA should be strapped to VCC for internal program

executions.

This pin also receives the programming supply volt-

age (VPP) during EPROM programming.

XTAL1: Input to the inverting oscillator amplifier.

XTAL2: Output from the inverting oscillator amplifi-

er.

OSCILLATOR CHARACTERISTICS

XTAL1 and XTAL2 are the input and output, respec-

tively, of a inverting amplifier which can be config-

ured for use as an on-chip oscillator, as shown in

Figure 3. Either a quartz crystal or ceramic resonator

may be used. More detailed information concerning

the use of the on-chip oscillator is available in Appli-

cation Note AP-155, ‘‘Oscillators for Microcontrol-

lers’’, Order No. 230659.

272336–5

C1, C2 e30 pF g10 pF for Crystals

For Ceramic Resonators, contact resonator manufac-

turer.

Figure 3. Oscillator Connections

To drive the device from an external clock source,

XTAL1 should be driven, while XTAL2 floats, as

shown in Figure 4. There are no requirements on the

duty cycle of the external clock signal, since the in-

put to the internal clocking circuitry is through a di-

vide-by-two flip-flop, but minimum and maximum

high and low times specified on the data sheet must

be observed.

An external oscillator may encounter as much as a

100 pF load at XTAL1 when it starts up. This is due

to interaction between the amplifier and its feedback

capacitance. Once the external signal meets the VIL

and VIH specifications the capacitance will not ex-

ceed 20 pF.

272336–6

Figure 4. External Clock Drive Configuration

IDLE MODE

The user’s software can invoke the Idle Mode. When

the microcontroller is in this mode, power consump-

tion is reduced. The Special Function Registers and

the onboard RAM retain their values during Idle, but

the processor stops executing instructions. Idle

Mode will be exited if the chip is reset or if an en-

abled interrupt occurs.

8XC52/54/58

Table 2. Status of the External Pins during Idle and Power Down

Mode Program ALE PSEN PORT0 PORT1 PORT2 PORT3

Memory

Idle Internal 1 1 Data Data Data Data

Idle External 1 1 Float Data Address Data

Power Down Internal 0 0 Data Data Data Data

Power Down External 0 0 Float Data Data Data

POWER DOWN MODE

To save even more power, a Power Down mode can

be invoked by software. In this mode, the oscillator

is stopped and the instruction that invoked Power

Down is the last instruction executed. The on-chip

RAM and Special Function Registers retain their val-

ues until the Power Down mode is terminated.

On the 8XC5X either a hardware reset or an external

interrupt can cause an exit from Power Down. Reset

redefines all the SFRs but does not change the on-

chip RAM. An external interrupt allows both the

SFRs and on-chip RAM to retain their values.

To properly terminate Power Down, the reset or ex-

ternal interrupt should not be executed before VCC is

restored to its normal operating level, and must be

held active long enough for the oscillator to restart

and stabilize (normally less than 10 ms).

With an external interrupt, INT0 and INT1 must be

enabled and configured as level-sensitive. Holding

the pin low restarts the oscillator but bringing the pin

back high completes the exit. Once the interrupt is

serviced, the next instruction to be executed after

RETI will be the one following the instruction that put

the device into Power Down.

DESIGN CONSIDERATION

#The window on the D87C5X must be covered by

an opaque label. Otherwise, the DC and AC char-

acteristics may not be met, and the device may

be functionally impaired.

#When the idle mode is terminated by a hardware

reset, the device normally resumes program exe-

cution, from where it left off, up to two machine

cycles before the internal reset algorithm takes

control. On-chip hardware inhibits access to inter-

nal RAM in this event, but access to the port pins

is not inhibited. To eliminate the possibility of an

unexpected write when Idle is terminated by re-

set, the instruction following the one that invokes

Idle should not be one that writes to a port pin or

to external memory.

ONCE MODE

The ONCE (‘‘On-Circuit Emulation’’) Mode facilitates

testing and debugging of systems using the 8XC5X

without the 8XC5X having to be removed from the

circuit. The ONCE Mode is invoked by:

1) Pull ALE low while the device is in reset and

PSEN is high;

2) Hold ALE low as RST is deactivated.

While the device is in ONCE Mode, the Port 0 pins

float and the other port pins and ALE and PSEN are

weakly pulled high. The oscillator circuit remains ac-

tive. While the 8XC5X is in this mode, an emulator or

test CPU can be used to drive the circuit. Normal

operation is restored when a normal reset is applied.

NOTE:

For more detailed information on the reduced power modes refer to current Embedded Microcontrollers and Processors

Handbook Volume I, (Order No. 270645) and Application Note AP-252 (Embedded Applications Handbook, Order No.

270648), ‘‘Designing with the 80C51BH.’’

8XC52/54/58

8XC5XEXPRESS

The Intel EXPRESS system offers enhancements to

the operational specifications of the MCS 51 family

of microcontrollers. These EXPRESS products are

designed to meet the needs of those applications

whose operating requirements exceed commercial

standards.

The EXPRESS program includes the commercial

standard temperature range with burn-in and an ex-

tended temperature range with or without burn-in.

With the commercial standard temperature range,

operational characteristics are guaranteed over the

temperature range of 0°

C to a70°

C. With the ex-

tended temperature range option, operational char-

acteristics are guaranteed over the range of -40°

to +85°

The optional burn-in is dynamic for a minimum time

of 168 hours at 125°

C with VCC =6.9V ±0.25V,

following guidelines in MIL-STD-883, Method 1015.

For the extended temperature range option, this

data sheet specifies the parameters which deviate

from their commercial temperature range limits.

NOTE:

Intel offers Express Temperature specifica-

tions for all 8XC5X speed options except for

33 MHz.

8XC52/54/58

ABSOLUTE MAXIMUM RATINGS*

Ambient Temperature Under Bias Àb40§Ctoa

85§C

Storage Temperature ÀÀÀÀÀÀÀÀÀÀb65§Ctoa

150§C

Voltage on EA/VPP Pin to VSS ÀÀÀÀÀÀÀ0V to a13.0V

Voltage on Any Other Pin to VSS ÀÀb0.5V to a6.5V

IOL Per I/O Pin ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ15 mA

Power DissipationÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ1.5W

(based on PACKAGE heat transfer limitations, not

device power consumption)

NOTICE: This data sheet contains preliminary infor-

mation on new products in production. The specifica-

tions are subject to change without notice. Verify with

your local Intel Sales office that you have the latest

data sheet before finalizing a design.

WARNING: Stressing the device beyond the ‘‘Absolute

Maximum Ratings’’ may cause permanent damage.

These are stress ratings only. Operation beyond the

‘‘Operating Conditions’’ is not recommended and ex-

tended exposure beyond the ‘‘Operating Conditions’’

may affect device reliability.

OPERATING CONDITIONS

Symbol Description Min Max Units

TAAmbient Temperature Under Bias

Commercial 0 a70 §C

Express b40 a85 §C

VCC Supply Voltage 4.0 6.0 V

8XC5X-33 4.5 5.5 V

fOSC Oscillator Frequency

8XC5X 3.5 12 MHz

8XC5X-1 3.5 16 MHz

8XC5X-2 0.5 12 MHz

8XC5X-24 3.5 24 MHz

8XC5X-33 3.5 33 MHz

DC CHARACTERISTICS (Over Operating Conditions)

All parameter values apply to all devices unless otherwise indicated.

Symbol Parameter Min Typ Max Unit Test Conditions

(Note 4)

VIL Input Low Voltage b0.5 0.2 VCCb0.1 V

VIL1 Input Low Voltage EA 0 0.2 VCCb0.3 V

VIH Input High Voltage 0.2 VCCa0.9 VCCa0.5 V

(Except XTAL1, RST)

VIH1 Input High Voltage 0.7 VCC VCCa0.5 V

(XTAL1, RST)

VOL Output Low Voltage (Note 5) 0.3 V IOL e100 mA (Note 1)

(Ports 1, 2 and 3) 0.45 V IOL e1.6 mA (Note 1)

1.0 V IOL e3.5 mA (Note 1)

VOL1 Output Low Voltage (Note 5) 0.3 V IOL e200 mA (Note 1)

(Port 0, ALE, PSEN) 0.45 V IOL e3.2 mA (Note 1)

1.0 V IOL e7.0 mA (Note 1)

VOH Output High Voltage VCCb0.3 V IOH eb

10 mA

(Ports 1, 2 and 3, ALE, PSEN) VCCb0.7 V IOH eb

30 mA

VCCb1.5 V IOH eb

60 mA

8XC52/54/58

DC CHARACTERISTICS (Over Operating Conditions) (Continued)

All parameter values apply to all devices unless otherwise indicated.

Symbol Parameter Min Typ Max Unit Test Conditions

(Note 4)

VOH1 Output High Voltage VCCb0.3 V IOH eb

200 mA

(Port 0 in External Bus Mode) VCCb0.7 V IOH eb

3.2 mA

VCCb1.5 V IOH eb

7.0 mA

IIL Logical 0 Input Current

(Ports 1, 2 and 3) b50 mAV

IN e0.45V

ILI Input leakage Current (Port 0) g10 mAV

IN eVIL or VIH

ITL Logical 1 to 0 Transition Current

(Ports 1, 2 and 3)

Commercial b650 mAV

IN e2V

Express b750 mA

RRST RST Pulldown Resistor 40 225 KX

CIO Pin Capacitance 10 pF @1 MHz, 25§C

ICC Power Supply Current: (Note 3)

Active Mode

at 12 MHz (Figure 5) 15 30 mA

at 16 MHz 20 38 mA

at 24 MHz 28 56 mA

at 33 MHz (8XC5X-33) 35 56 mA

Idle Mode

at 12 MHz (Figure 5) 5 7.5 mA

at 16 MHz 6 9.5 mA

at 24 MHz 7 13.5 mA

at 33 MHz (8XC5X-33) 7 15 mA

Power Down Mode 5 75 mA

8XC5X-33 5 50 mA

NOTES:

1. Capacitive loading on Ports 0 and 2 may cause noise pulses above 0.4V to be superimposed on the VOLs of ALE and

Ports 1, 2 and 3. The noise is due to external bus capacitance discharging into the Port 0 and Port 2 pins when these pins

change from 1 to 0. In applications where capacitive loading exceeds 100 pF, the noise pulses on these signals may exceed

0.8V. It may be desirable to qualify ALE or other signals with a Schmitt Triggers, or CMOS-level input logic.

2. Capacitive loading on Ports 0 and 2 cause the VOH on ALE and PSEN to drop below the 0.9 VCC specification when the

address lines are stabilizing.

3. See Figures 6–9 for test conditions. Minimum VCC for Power Down is 2V.

4. Typicals are based on a limited number of samples and are not guaranteed. The values listed are at room temperature

and 5V.

5. Under steady state (non-transient) conditions, IOL must be externally limited as follows:

Maximum IOL per port pin: 10mA

Maximum IOL per 8-bit portÐ

Port 0: 26 mA

Ports 1, 2 and 3: 15 mA

Maximum total IOL for all output pins: 71 mA

If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater

than the listed test conditions.

8XC52/54/58

272336–7

NOTE:

ICC Max at 33 MHz is at 5V g10% VCC, while

ICC Max at 24 MHz and below is at 5V g20% VCC

Figure 5. 8XC52/54/58 ICC vs Frequency

272336–8

All other pins disconnected

TCLCH eTCHCL e5ns

Figure 6. ICC Test Condition, Active Mode

8XC52/54/58

272336–9

All other pins disconnected

TCLCH eTCHCL e5ns

Figure 7. ICC Test Condition Idle Mode

272336–10

All other pins disconnected

Figure 8. ICC Test Condition, Power Down Mode

VCC e2.0V to 6.0V

272336–11

Figure 9. Clock Signal Waveform for ICC Tests in Active and Idle Modes. TCLCH eTCHCL e5ns

8XC52/54/58

EXPLANATION OF THE AC SYMBOLS

Each timing symbol has 5 characters. The first char-

acter is always a ‘T’ (stands for time). The other

characters, depending on their positions, stand for

the name of a signal or the logical status of that

signal. The following is a list of all the characters and

what they stand for.

A: Address

C: Clock

D: Input Data

H: Logic level HIGH

I: Instruction (program memory contents)

L: Logic level LOW, or ALE

P: PSEN

Q: Output Data

R: RD signal

T: Time

V: Valid

W: WR signal

X: No longer a valid logic level

Z: Float

For example,

TAVLL eTime from Address Valid to ALE Low

TLLPL eTime from ALE Low to PSEN Low

AC CHARACTERISTICS (Over Operating Conditions, Load Capacitance for Port 0, ALE/PROG and

PSEN e100 pF, Load Capacitance for All Other Outputs e80 pF)

EXTERNAL MEMORY CHARACTERISTICS

All parameter values apply to all devices unless otherwise indicated. In this table, 8XC5X refers to 8XC5X,

8XC5X-1, and 8XC5X-2.

Symbol Parameter

Oscillator

Units

12 MHz 24 MHz 33 MHz Variable

Min Max Min Max Min Max Min Max

1/TCLCL Oscillator Frequency

8XC5X 3.5 12 MHz

8XC5X-1 3.5 16 MHz

8XC5X-2 0.5 12 MHz

8XC5X-24 3.5 24 MHz

8XC5X-33 3.5 33 MHz

TLHLL ALE Pulse Width 127 43 21 2 TCLCL b40 ns

TAVLL Address Valid to

ALE Low

8XC5X 43 TCLCL b40 ns

8XC5X-24 12 TCLCL b30 ns

8XC5X-33 5 TCLCL b25 ns

TLLAX Address Hold After

ALE Low

8XC5X/-24 53 12 TCLCL b30 ns

8XC5X-33 5 TCLCL b25 ns

TLLIV ALE Low to Valid

Instruction In

8XC5X 234 4 TCLCL b100 ns

8XC5X-24 91 4 TCLCL b75 ns

8XC5X-33 56 4 TCLCL b65 ns

8XC52/54/58

EXTERNAL MEMORY CHARACTERISTICS (Continued)

All parameter values apply to all devices unless otherwise indicated.

Symbol Parameter

Oscillator

Units

12 MHz 24 MHz 33 MHz Variable

Min Max Min Max Min Max Min Max

TLLPL ALE Low to

PSEN Low

8XC5X/-24 53 12 TCLCL b30 ns

8XC5X-33 5 TCLCL b25 ns

TPLPH PSEN Pulse 205 80 46 3 TCLCL b45 ns

Width

TPLIV PSEN Low to

Valid

Instruction In

8XC5X 145 3 TCLCL b105 ns

8XC5X-24 35 3 TCLCL b90 ns

8XC5X-33 35 3 TCLCL b55 ns

TPXIX Input 0 0 0 0 ns

Instruction

Hold After

PSEN

TPXIZ Input

Instruction

Float After

PSEN

8XC5X 59 TCLCL b25 ns

8XC5X-24 21 TCLCL b20 ns

8XC5X-33 5 TCLCL b25 ns

TAVIV Address to

Valid

Instruction In

8XC5X/-24 312 103 5 TCLCL b105 ns

8XC5X-33 71 5 TCLCL b80 ns

TPLAZ PSEN Low to 10 10 10 10 ns

Address

Float

TRLRH RD Pulse 400 150 82 6 TCLCL b100 ns

Width

TWLWH WR Pulse 400 150 82 6 TCLCL b100 ns

Width

8XC52/54/58

EXTERNAL MEMORY CHARACTERISTICS (Continued)

All parameter values apply to all devices unless otherwise indicated.

Symbol Parameter

Oscillator

Units

12 MHz 24 MHz 33 MHz Variable

Min Max Min Max Min Max Min Max

TRLDV RD Low to Valid

Data In

8XC5X 252 5 TCLCL b165 ns

8XC5X-24 113 5 TCLCL b95 ns

8XC5X-33 61 5 TCLCL b90 ns

TRHDX Data Hold After 0 0 0 0 ns

TRHDZ Data Float After

8XC5X/-24 107 23 2 TCLCL b60 ns

8XC5X-33 35 2 TCLCL b25 ns

TLLDV ALE Low to

Valid Data In

8XC5X 517 8 TCLCL b150 ns

8XC5X-24/33 243 150 8 TCLCL b90 ns

TAVDV Address to

Valid Data In

8XC5X 585 9 TCLCL b165 ns

8XC5X-24/33 285 180 9 TCLCL b90 ns

TLLWL ALE Low to RD 200 300 75 175 41 140 3 TCLCL b50 3 TCLCL a50 ns

or WR Low

TAVWL Address to RD

or WR Low

8XC5X 203 4 TCLCL b130 ns

8XC5X-24 77 4 TCLCL b90 ns

8XC5X-33 46 4 TCLCL b75 ns

8XC52/54/58

EXTERNAL MEMORY CHARACTERISTICS (Continued)

All parameter values apply to all devices unless otherwise indicated.

Symbol Parameter

Oscillator

Units

12 MHz 24 MHz 33 MHz Variable

Min Max Min Max Min Max Min Max

TQVWX Data Valid to

WR Transition

8XC5X 33 TCLCL b50 ns

8XC5X-24/33 12 0 TCLCL b30 ns

TWHQX Data Hold After

8XC5X 33 TCLCL b50 ns

8XC5X-24 7 TCLCL b35 ns

8XC5X-33 3 TCLCL b27 ns

TQVWH Data Valid to

WR High

8XC5X 433 7 TCLCL b150 ns

8XC5X-24/33 222 142 7 TCLCL b70 ns

TRLAZ RD Low to 0 0 0 0 ns

Address Float

TWHLH RD or WR High

to ALE High

8XC5X 43 123 TCLCL b40 TCLCL a40 ns

8XC5X-24 12 71 TCLCL b30 TCLCL a30 ns

8XC5X-33 5 55 TCLCL b25 TCLCL a25 ns

8XC52/54/58

EXTERNAL PROGRAM MEMORY READ CYCLE

272336–25

EXTERNAL DATA MEMORY READ CYCLE

272336–26

EXTERNAL DATA MEMORY WRITE CYCLE

272336–27

8XC52/54/58

SERIAL PORT TIMING - SHIFT REGISTER MODE

Test Conditions: Over Operating Conditions; Load Capacitance e80 pF

Symbol Parameter

Oscillator

Units

12 MHz 24 MHz 33 MHz Variable

Min Max Min Max Min Max Min Max

TXLXL Serial Port 1 0.50 0.36 12 TCLCL ms

Clock

Cycle Time

TQVXH Output Data 700 284 167 10 TCLCL b133 ns

Setup to Clock

Rising Edge

TXHQX Output Data

Hold after Clock

Rising Edge

8XC5X 50 2 TCLCL b117 ns

8XC5X-24/33 34 10 2 TCLCL b50 ns

TXHDX Input Data Hold 0 0 0 0 ns

After Clock

Rising Edge

TXHDV Clock Rising 700 283 167 10 TCLCL b133 ns

Edge to Input

Data Valid

SHIFT REGISTER MODE TIMING WAVEFORMS

272336–15

8XC52/54/58

EXTERNAL CLOCK DRIVE

Symbol Parameter Min Max Units

1/TCLCL Oscillator Frequency MHz

8XC5X 3.5 12 MHz

8XC5X-1 3.5 16 MHz

8XC5X-2 0.5 12 MHz

8XC5X-24 3.5 24 MHz

8XC5X-33 3.5 33 MHz

TCHCX High Time 20 ns

8XC5X-24/33 0.35 TOSC 0.65 TOSC ns

TCLCX Low Time 20 ns

8XC5X-24/33 0.35 TOSC 0.65 TOSC ns

TCLCH Rise Time 20 ns

8XC5X-24 10 ns

8XC5X-33 5 ns

TCHCL Fall Time 20 ns

8XC5X-24 10 ns

8XC5X-33 5 ns

EXTERNAL CLOCK DRIVE WAVEFORM

272336–16

AC TESTING INPUT, OUTPUT WAVEFORMS

272336–19

AC Inputs during testing are driven at VCCb0.5V for a Logic ‘‘1’’

and 0.45V for a Logic ‘‘0’’. Timing measurements are made at VIH

min for a Logic ‘‘1’’ and VIL max for a Logic ‘‘0’’.

FLOAT WAVEFORMS

272336–20

For timing purposes a port pin is no longer floating when a

100 mV change from load voltage occurs, and begins to float

when a 100 mV change from the loaded VOH/VOL level occurs.

IOL/IOH eg20 mA.

8XC52/54/58

PROGRAMMING THE EPROM

The part must be running with a 4 MHz to 6 MHz

oscillator. The address of an EPROM location to be

programmed is applied to address lines while the

code byte to be programmed in that location is ap-

plied to data lines. Control and program signals must

be held at the levels indicated in Table 4. Normally

EA/VPP is held at logic high until just before ALE/

PROG is to be pulsed. The EA/VPP is raised to VPP,

ALE/PROG is pulsed low and then EA/VPP is re-

turned to a high (also refer to timing diagrams).

NOTES:

#Exceeding the VPP maximum for any amount of

time could damage the device permanently. The

VPP source must be well regulated and free of

glitches.

DEFINITION OF TERMS

ADDRESS LINES: P1.0– P1.7, P2.0– P2.5 respec-

tively for A0– A13.

DATA LINES: P0.0– P0.7 for D0– D7.

CONTROL SIGNALS: RST, PSEN, P2.6, P2.7, P3.3,

P3.6, P3.7

PROGRAM SIGNALS: ALE/PROG,EA/VPP

Table 4. EPROM Programming Modes

Mode RST PSEN ALE/ EA/ P2.6 P2.7 P3.3 P3.6 P3.7

PROG VPP

Program Code Data H L ß12.75V L H H H H

Verify Code Data H L H H L L L H H

Program Encryption H L ß12.75V L H H L H

Array Address 0– 3FH

Program Lock Bit 1 H L ß12.75V H H H H H

Bits Bit 2 H L ß12.75V H H H L L

Bit 3 H L ß12.75V H L H H L

Read Signature Byte H L H H L L L L L

8XC52/54/58

272336–21

*See Table 4 for proper input on these pins

Figure 10. Programming the EPROM

PROGRAMMING ALGORITHM

Refer to Table 4 and Figures 10 and 11 for address,

data, and control signals set up. To program the

87C5X the following sequence must be exercised.

1. Input the valid address on the address lines.

2. Input the appropriate data byte on the data

lines.

3. Activate the correct combination of control sig-

nals.

4. Raise EA/VPP from VCC to 12.75V g0.25V.

5. Pulse ALE/PROG 5 times for the EPROM ar-

ray, and 25 times for the encryption table and

the lock bits.

Repeat 1 through 5 changing the address and data

for the entire array or until the end of the object file is

reached.

PROGRAM VERIFY

Program verify may be done after each byte or block

of bytes is programmed. In either case a complete

verify of the programmed array will ensure reliable

programming of the 87C5X.

The lock bits cannot be directly verified. Verification

of the lock bits is done by observing that their fea-

tures are enabled.

272336–22

Figure 11. Programming Signal’s Waveforms

8XC52/54/58

ROM and EPROM Lock System

The program lock system, when programmed, pro-

tects the onboard program against software piracy.

The 80C5X has a one-level program lock system

and a 64-byte encryption table. See line 2 of Table

5. If program protection is desired. the user submits

the encryption table with their code. and both the

lock-bit and encryption array are programmed by the

factory. The encryption array is not available without

the lock bit. For the lock bit to be programmed, the

user must submit an encryption table.

The 87C5X has a 3-level program lock system and a

64-byte encryption array. Since this is an EPROM

device, all locations are user-programmable. See

Table 5.

Encryption Array

Within the EPROM array are 64 bytes of Encryption

Array that are initially unprogrammed (all 1’s). Every

time that a byte is addressed during a verify, 6 ad-

dress lines are used to select a byte of the Encryp-

tion Array. This byte is then exclusive-NOR’ed

(XNOR) with the code byte, creating an Encryption

Verify byte. The algorithm, with the array in the un-

programmed state (all 1’s), will return the code in its

original, unmodified form. For programming the En-

cryption Array, refer to Table 4 (Programming the

EPROM).

When using the encryption array, one important fac-

tor needs to be considered. If a code byte has the

value 0FFH, verifying the byte will produce the en-

cryption byte value. If a large block (l64 bytes) of

code is left unprogrammed, a verification routine will

display the contents of the encryption array. For this

reason all unused code bytes should be pro-

grammed with some value other than 0FFH, and not

all of them the same value. This will ensure maxi-

mum program protection.

Program Lock Bits

The 87C5X has 3 programmable lock bits that when

programmed according to Table 5 will provide differ-

ent levels of protection for the on-chip code and

data.

Erasing the EPROM also erases the encryption ar-

ray and the program lock bits, returning the part to

full functionality.

Reading the Signature Bytes

The 8XC5X has 3 signature bytes in locations 30H,

31H, and 60H. To read these bytes follow the proce-

dure for EPROM verify, but activate the control lines

provided in Table 4 for Read Signature Byte.

Location Device Contents

30H All 89H

31H All 58H

60H 80C52 12H

87C52 52H

80C54 14H

87C54 54H

80C58 18H

87C58 58H

Erasure Characteristics

(Windowed Packages Only)

Erasure of the EPROM begins to occur when the

chip is exposed to light with wavelength shorter than

approximately 4,000 Angstroms. Since sunlight and

fluorescent lighting have wavelengths in this range,

exposure to these light sources over an extended

time (about 1 week in sunlight, or 3 years in room-

level fluorescent lighting) could cause inadvertent

erasure. If an application subjects the device to this

type of exposure, it is suggested that an opaque la-

bel be placed over the window.

The recommended erasure procedure is exposure

to ultraviolet light (at 2537 Angstroms) to an integrat-

ed dose of at least 15 W-sec/cm2. Exposing the

EPROM to an ultraviolet lamp of 12,000 mW/cm2

rating for 30 minutes, at a distance of about 1 inch,

should be sufficient.

Erasure leaves all the EPROM Cells in a 1’s state.

8XC52/54/58

Table 5. Program Lock Bits and the Features

Program Lock Bits Protection Type

LB1 LB2 LB3

1 U U U No Program Lock features enabled. (Code verify will still be encrypted by the

Encryption Array if programmed.)

2 P U U MOVC instructions executed from external program memory are disabled from

fetching code bytes from internal memory, EA is sampled and latched on

Reset, and further programming of the EPROM is disabled.

3 P P U Same as 2, also verify is disabled.

4 P P P Same as 3, also external execution is disabled.

NOTE:

Any other combination of the lock bits is not defined.

EPROM PROGRAMMING AND VERIFICATION CHARACTERISTICS

(TAe21§Cto27

C; VCC e5V g20%; VSS e0V)

Symbol Parameter Min Max Units

VPP Programming Supply Voltage 12.5 13.0 V

IPP Programming Supply Current 75 mA

1/TCLCL Oscillator Frequency 4 6 MHz

TAVGL Address Setup to PROG Low 48TCLCL

TGHAX Address Hold after PROG 48TCLCL

TDVGL Data Setup to PROG Low 48TCLCL

TGHDX Data Hold after PROG 48TCLCL

TEHSH (Enable) High to VPP 48TCLCL

TSHGL VPP Setup to PROG Low 10 ms

TGHSL VPP Hold after PROG 10 ms

TGLGH PROG Width 90 110 ms

TAVQV Address to Data Valid 48TCLCL

TELQV ENABLE Low to Data Valid 48TCLCL

TEHQZ Data Float after ENABLE 0 48TCLCL

TGHGL PROG High to PROG Low 10 ms

8XC52/54/58

EPROM PROGRAMMINGANDVERIFICATIONWAVEFORMS

272336–23

*5 pulses for the EPROM array. 25 pulses for the encryption table and lock bits.

ThermalImpedance

All thermal impedance data is approximate for static

air conditions at 1W of power dissipation. Values will

change depending on operating conditions and ap-

plications. See the Intel Packaging Handbook (Order

Number 240800) for a description of Intel’s thermal

impedance test methodology.

DATA SHEET REVISION HISTORY

Data sheets are changed as new device information

becomes available. Verify with your local Intel sales

office that you have the latest version before finaliz-

ing a design or ordering devices.

The following differences exist between datasheet

(272336-003) and the previous version

(272336-002).

1. Removed 8XC5X-3 and 8XC5X-20 from the data

sheet.

2. Included 8XC5X-24 and 8XC5X-33 devices.

3. Removed the statement ‘‘The 80C32 standard, -1

and -2, and 80C52 standard, -1 and -2, do not

have the . . . ’’ from the section DESIGN CONSID-

ERATION.

The following differences exist between this data-

sheet (272336-002) and the previous version

(272336-001).

1. Removed 8XC5X-L from the data sheet.

2. Included features not available in 80C32-Stan-

dard, -1 and -2, and 80C52-Standard, -1 and -2

devices.

This 8XC5X datasheet (272336-001) replaces the

following datasheets:

87C52/80C52/80C32 270757-003

87C52/80C52/80C32 EXPRESS 270868-002

87C52-20/80C52-20/80C32-20 272272-001

87C54/80C54 270816-004

87C54/80C54 EXPRESS 270901-001

87C54-20/-3 80C54-20/-3 270941-003

87C54/80C58 270900-003

87C58/80C58 EXPRESS 270902-001

87C58-20/-3 80C58-20/-3 272029-002

The following differences exist between this data-

sheet (272336-005) and the previous version

(272336-004/-003).

1. Removed references to package prefixes. When

possible, prefix variables replaced with x.