CY7C027V/027AV/028V/028AV
CY7C037AV/038V
3.3 V 32 K / 64 K × 16 / 18 Dual-Port
Static RAM
Cypress Semiconductor Corporation 198 Champion Court San Jose,CA 95134-1709 408-943-2600
Document Number: 38-06078 Rev. *H Revised August 23, 2013
3.3 V 32 K / 64 K × 16 / 18 Dual-Port Static RAM
Features
True dual-ported memory cells which allow simultaneous
access of the same memory location
32 K × 16 organization (CY7C027V/027AV [1])
64 K × 16 organization (CY7C028V/028AV [1])
32 K × 18 organization (CY7C037AV)
64 K × 18 organization (CY7C038V)
0.35 micron Complementary metal oxide semiconductor
(CMOS) for optimum speed and power
High speed access: 15, 20, and 25 ns
Low operating power
Active: ICC = 115 mA (typical)
Standby: ISB3 = 10 A (typical)
Fully asynchronous operation
Automatic power-down
Expandable data bus to 32/36 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flag for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and Industrial temperature ranges
100-pin Pb-free Thin quad plastic flatpack (TQFP) and 100-pin
TQFP
R/W
L
CE
0L
CE
1L
OE
L
I/O
8/9L
–I/O
15/17L
I/O
Control
Address
Decode
A
0L
–A
14/15L
CE
L
OE
L
R/W
L
BUSY
L
I/O
Control
CE
L
Interrupt
Semaphore
Arbitration
SEM
L
INT
L
M/S
UB
L
LB
L
I/O
0L
–I/O
7/8L
R/W
R
CE
0R
CE
1R
OE
R
I/O
8/9L
–I/O
15/17R
CE
R
UB
R
LB
R
I/O
0L
–I/O
7/8R
UB
L
LB
L
Logic Block Diagram
A
0L
–A
14/15L
True Dual-Ported
RAM Array
A
0R
–A
14/15R
CE
R
OE
R
R/W
R
BUSY
R
SEM
R
INT
R
UB
R
LB
R
Address
Decode A
0R
–A
14/15R
[2] [2]
[3] [3]
[4] [4]
[5] [5]
[4] [4]
15/16
8/9
8/9
15/16
8/9
8/9
15/16 15/16
Notes
1. CY7C027V, and CY7C027AV are functionally identical. CY7C028V and CY7C028AV are functionally identical.
2. I/O8–I/O15 for x16 devices; I/O9–I/O17 for x18 devices.
3. I/O0–I/O7 for x16 devices; I/O0–I/O8 for x18 devices.
4. A0–A14 for 32K; A0–A15 for 64K devices.
5. BUSY is an output in master mode and an input in slave mode.
CY7C027V/027AV/028V/028AV
CY7C037AV/038V
Document Number: 38-06078 Rev. *H Page 2 of 24
Contents
Pin Configurations ........................................................... 3
Selection Guide ................................................................5
Pin Definitions ..................................................................5
Architecture ......................................................................5
Functional Description .....................................................5
Write Operation ........................................................... 5
Read Operation ........................................................... 6
Interrupts ..................................................................... 6
Busy ............................................................................6
Master/Slave ...............................................................6
Semaphore Operation ................................................. 6
Maximum Ratings ............................................................. 7
Operating Range ............................................................... 7
Electrical Characteristics .................................................7
Capacitance ...................................................................... 7
AC Test Loads and Waveforms .......................................8
Data Retention Mode ........................................................8
Timing ................................................................................ 8
Switching Characteristics ................................................9
Switching Waveforms .................................................... 11
Non-Contending Read/Write .......................................... 17
Interrupt Operation Example ......................................... 17
Semaphore Operation Example .................................... 18
Ordering Information ...................................................... 19
32 K × 16 3.3 V Asynchronous Dual-Port SRAM ...... 19
64 K × 16 3.3 V Asynchronous Dual-Port SRAM ...... 19
32 K × 18 3.3 V Asynchronous Dual-Port SRAM ...... 19
64 K × 18 3.3 V Asynchronous Dual-Port SRAM ...... 19
Ordering Code Definitions ......................................... 20
Package Diagram ............................................................ 21
Acronyms ........................................................................ 22
Document Conventions ................................................. 22
Units of Measure ....................................................... 22
Document History Page ................................................. 23
Sales, Solutions, and Legal Information ...................... 24
Worldwide Sales and Design Support ....................... 24
Products .................................................................... 24
PSoC® Solutions ...................................................... 24
Cypress Developer Community ................................. 24
Technical Support ..................................................... 24
CY7C027V/027AV/028V/028AV
CY7C037AV/038V
Document Number: 38-06078 Rev. *H Page 3 of 24
Pin Configurations
Figure 1. 100-pin TQFP pinout (Top View)
1
3
2
92 91 90 848587 868889 83 82 81 7678 77798093949596979899100
59
60
61
67
66
64
65
63
62
68
69
70
75
73
74
72
71
A9R
A10R
A11R
A12R
A13R
A14R
UBR
NC
LBR
CE1R
SEMR
OER
GND
NC
A15R
GND
R/WR
GND
I/O15R
I/O14R
I/O13R
I/O12R
I/O11R
I/O10R
CE0R
58
57
56
55
54
53
52
51
CY7C027V/027AV (32 K × 16)
A9L
A10L
A11L
A12L
A13L
A14L
UBL
NC
LBL
CE1L
SEML
OEL
GND
NC
A15L
VCC
R/WL
GND
I/O15L
I/O14L
I/O13L
I/O12L
I/O11L
I/O10L
CE0L
17
16
15
9
10
12
11
13
14
8
7
6
4
5
18
19
20
21
22
23
24
25
A8L
A7L
A6L
A5L
A4L
A3L
INTL
A1L
NC
GND
M/S
A0R
A1R
A0L
A2L
BUSYR
INTR
A2R
A3R
A4R
A5R
A6R
A7R
A8R
BUSYL
34 35 36 424139 403837 43 44 45 5048 494746
NC
I/O9R
I/O8R
I/O7R
VCC
I/O6R
I/01R
I/O4R
I/O2R
GND
I/O0L
I/O2L
I/O3L
I/O3R
I/O5R
I/O1L
GND
I/O4L
I/O5L
I/O6L
I/O7L
VCC
I/O8L
I/O9L
I/O0R
3332313029282726
CY7C028V/028AV (64 K × 16)
[6] [6]
Note
6. This pin is NC for CY7C027V/027AV.
CY7C027V/027AV/028V/028AV
CY7C037AV/038V
Document Number: 38-06078 Rev. *H Page 4 of 24
Figure 2. 100-pin TQFP pinout (Top View)
Pin Configurations(continued)
1
3
2
92 91 90 848587 868889 83 82 81 7678 77798093949596979899100
59
60
61
67
66
64
65
63
62
68
69
70
75
73
74
72
71
A8R
A9R
A10R
A11R
A12R
A13R
CE0R
A15R
UBR
SEMR
R/WR
GND
I/O17R
LBR
A14R
GND
OER
GND
I/O16R
I/O15R
I/O14R
I/O13R
I/O12R
I/O11R
CE1R
58
57
56
55
54
53
52
51
CY7C037AV (32K x 18)
A9L
A10L
A11L
A12L
A13L
A14L
CE1L
LBL
CE0L
R/WL
OEL
I/O17L
I/O16L
UBL
A15L
VCC
GND
GND
I/O15L
I/O14L
I/O13L
I/O12L
I/O11L
I/O10L
SEML
17
16
15
9
10
12
11
13
14
8
7
6
4
5
18
19
20
21
22
23
24
25
A8L
A7L
A6L
A5L
A4L
A3L
BUSYL
A1L
INTL
GND
VCC
INTR
A0R
A0L
A2L
M/S
BUSYR
A1R
A2R
A3R
A4R
A5R
A6R
A7R
GND
34 35 36 424139 403837 43 44 45 5048 494746
I/O10R
I/O9R
I/O8R
I/O7R
VCC
I/O6R
I/01R
I/O4R
I/O2R
GND
I/O0L
I/O2L
I/O3L
I/O3R
I/O5R
I/O1L
GND
I/O4L
I/O5L
I/O6L
I/O7L
VCC
I/O8L
I/O9L
I/O0R
3332313029282726
CY7C038V (64K x 18)
[7]
[7]
Note
7. This pin is NC for CY7C037AV.
CY7C027V/027AV/028V/028AV
CY7C037AV/038V
Document Number: 38-06078 Rev. *H Page 5 of 24
Architecture
The CY7C027V/027AV/028V/028AV and CY7037AV/038V
consist of an array of 32K and 64K words of 16 and 18 bits each
of dual-port RAM cells, I/O and address lines, and control signals
(CE, OE, R/W). These control pins permit independent access for reads
or writes to any location in memory. To handle simultaneous
writes/reads to the same location, a BUSY pin is provided on each port.
Two interrupt (INT) pins can be utilized for port-to-port communication.
Two semaphore (SEM) control pins are used for allocating shared
resources. With the M/S pin, the devices can function as a master
(BUSY pins are outputs) or as a slave (BUSY pins are inputs). The
devices also have an automatic power down feature controlled by CE.
Each port is provided with its own output enable control (OE), which
allows data to be read from the device.
Functional Description
The CY7C027V/027AV/028V/028AV and CY7037AV/038V are
low power CMOS 32K, 64K x 16/18 dual-port static RAMs.
Various arbitration schemes are included on the devices to
handle situations when multiple processors access the same
piece of data. Two ports are provided, permitting independent,
asynchronous access for reads and writes to any location in
memory. The devices can be utilized as stand-alone 16/18-bit
dual-port static RAMs or multiple devices can be combined to
function as a 32/36-bit or wider master/slave dual-port static
RAM. An M/S pin is provided for implementing 32/36-bit or wider
memory applications without the need for separate master and
slave devices or additional discrete logic. Application areas
include interprocessor/multiprocessor designs, communications
status buffering, and dual-port video/graphics memory.
Each port has independent control pins: Chip Enable (CE), Read
or Write Enable (R/W), and Output Enable (OE). Two flags are
provided on each port (BUSY and INT). BUSY signals that the port is
trying to access the same location currently being accessed by the other
port. The interrupt flag (INT) permits communication between ports or
systems by means of a mail box. The semaphores are used to pass a
flag, or token, from one port to the other to indicate that a shared
resource is in use. The semaphore logic is comprised of eight shared
latches. Only one side can control the latch (semaphore) at any time.
Control of a semaphore indicates that a shared resource is in use. An
automatic power down feature is controlled independently on each port
by a chip select (CE) pin.
The CY7C027V/027AV/028V/028AV and CY7037AV/038V are
available in 100-pin Thin Quad Plastic Flatpacks (TQFP).
Write Operation
Data must be set up for a duration of tSD before the rising edge of
R/W to guarantee a valid write. A write operation is controlled by either
the R/W pin (see Figure 7) or the CE pin (see Figure 8). Required inputs
Selection Guide
Parameter -15 -20 -25 Unit
Maximum access time 15 20 25 ns
Typical operating current 125 120 115 mA
Typical standby current for ISB1 (Both ports TTL level) 35 35 30 mA
Typical standby current for ISB3 (Both ports CMOS level) 10 10 10 A
Pin Definitions
Left Port Right Port Description
CE0L, CE1L CE0R, CE1R Chip Enable (CE is LOW when CE0 VIL and CE1 VIH)
R/WLR/WRRead/Write Enable
OELOEROutput Enable
A0L–A15L A0R–A15R Address (A0–A14 for 32K; A0–A15 for 64K devices)
I/O0L–I/O17L I/O0R–I/O17R Data bus input/output (I/O0–I/O15 for × 16 devices; I/O0–I/O17 for × 18)
SEML SEMRSemaphore Enable
UBLUBRUpper byte select (I/O8–I/O15 for × 16 devices; I/O9–I/O17 for × 18 devices)
LBLLBRLower byte select (I/O0–I/O7 for × 16 devices; I/O0–I/O8 for × 18 devices)
INTLINTRInterrupt flag
BUSYLBUSYRBusy flag
M/S Master or Slave select
VCC Power
GND Ground
NC No connect
CY7C027V/027AV/028V/028AV
CY7C037AV/038V
Document Number: 38-06078 Rev. *H Page 6 of 24
for non-contention operations are summarized in Non-Contending
Read/Write on page 17.
If a location is being written to by one port and the opposite port
attempts to read that location, a port-to-port flowthrough delay
must occur before the data is read on the output; otherwise the
data read is not deterministic. Data is valid on the port tDDD after
the data is presented on the other port.
Read Operation
When reading the device, the user must assert both the OE and
CE pins. Data is available tACE after CE or tDOE after OE is asserted. If
the user wishes to access a semaphore flag, then the SEM pin must be
asserted instead of the CE pin, and OE must also be asserted.
Interrupts
The upper two memory locations may be used for message
passing. The highest memory location (7FFF for the
CY7C027V/037AV/027AV, FFFF for the CY7C028V/028AV/38V)
is the mailbox for the right port and the second-highest memory
location (7FFE for the CY7C027V/027AV/037AV, FFFE for the
CY7C028V/028AV/38V) is the mailbox for the left port. When
one port writes to the other port’s mailbox, an interrupt is
generated to the owner. The interrupt is reset when the owner
reads the contents of the mailbox. The message is user defined.
Each port can read the other port’s mailbox without resetting the
interrupt. The active state of the busy signal (to a port) prevents
the port from setting the interrupt to the winning port. Also, an
active busy to a port prevents that port from reading its own
mailbox and, thus, resetting the interrupt to it.
If an application does not require message passing, do not
connect the interrupt pin to the processor’s interrupt request
input pin.
The operation of the interrupts and their interaction with Busy are
summarized in Interrupt Operation Example on page 17.
Busy
The CY7C027V/027AV/028V/028AV and CY7037AV/038V
provide on-chip arbitration to resolve simultaneous memory
location access (contention). If both ports’ CEs are asserted and
an address match occurs within tPS of each other, the busy logic deter-
mines which port has access. If tPS is violated, one port definitely gains
permission to the location, but it is not predictable which port gets that
permission. BUSY is asserted tBLA after an address match or tBLC after
CE is taken LOW.
Master/Slave
A M/S pin is provided to expand the word width by configuring the
device as either a master or a slave. The BUSY output of the master is
connected to the BUSY input of the slave. This allows the device to
interface to a master device with no external components. Writing to
slave devices must be delayed until after the BUSY input has settled
(tBLC or tBLA), otherwise, the slave chip may begin a write cycle during
a contention situation. When tied HIGH, the M/S pin allows the device
to be used as a master and, therefore, the BUSY line is an output. BUSY
can then be used to send the arbitration outcome to a slave.
Semaphore Operation
The CY7C027V/027AV/028V/028AV and CY7037AV/038V
provide eight semaphore latches, which are separate from the
dual-port memory locations. Semaphores are used to reserve
resources that are shared between the two ports.The state of the
semaphore indicates that a resource is in use. For example, if
the left port wants to request a given resource, it sets a latch by
writing a zero to a semaphore location. The left port then verifies
its success in setting the latch by reading it. After writing to the
semaphore, SEM or OE must be deasserted for tSOP before
attempting to read the semaphore. The semaphore value is available
tSWRD + tDOE after the rising edge of the semaphore write. If the left port
was successful (reads a zero), it assumes control of the shared
resource, otherwise (reads a one) it assumes the right port has control
and continues to poll the semaphore. When the right side has relin-
quished control of the semaphore (by writing a one), the left side
succeeds in gaining control of the semaphore. If the left side no longer
requires the semaphore, a one is written to cancel its request.
Semaphores are accessed by asserting SEM LOW. The SEM pin
functions as a chip select for the semaphore latches (CE must remain
HIGH during SEM LOW). A0–2 represents the semaphore address. OE
and R/W are used in the same manner as a normal memory access.
When writing or reading a semaphore, the other address pins have no
effect.
When writing to the semaphore, only I/O0 is used. If a zero is written
to the left port of an available semaphore, a one appears at the same
semaphore address on the right port. That semaphore can now only be
modified by the side showing zero (the left port in this case). If the left
port now relinquishes control by writing a one to the semaphore, the
semaphore is set to one for both sides. However, if the right port had
requested the semaphore (written a zero) while the left port had control,
the right port would immediately own the semaphore as soon as the left
port released it. Semaphore Operation Example on page 18 shows
sample semaphore operations.
When reading a semaphore, all sixteen/eighteen data lines
output the semaphore value. The read value is latched in an
output register to prevent the semaphore from changing state
during a write from the other port. If both ports attempt to access
the semaphore within tSPS of each other, the semaphore is definitely
obtained by one side or the other, but there is no guarantee which side
controls the semaphore.
CY7C027V/027AV/028V/028AV
CY7C037AV/038V
Document Number: 38-06078 Rev. *H Page 7 of 24
Maximum Ratings
Exceeding maximum ratings may shorten the useful life of the
device. User guidelines are not tested.
Storage temperature ................................ –65 °C to +150 °C
Ambient temperature with
power applied .......................................... –55 °C to +125 °C
Supply voltage to ground potential ..............–0.5 V to +4.6 V
DC voltage applied to
outputs in High Z state ........................ –0.5 V to VCC + 0.5 V
DC input voltage [8] ............................. –0.5 V to VCC + 0.5 V
Output current into outputs (LOW) ............................. 20 mA
Static discharge voltage ......................................... > 1100 V
Latch-up current ................................................... > 200 mA
Operating Range
Range Ambient Temperature VCC
Commercial 0 °C to +70 °C 3.3 V 300 mV
Industrial [9] –40 °C to +85 °C 3.3 V 300 mV
Electrical Characteristics
Over the Operating Range
Parameter Description
CY7C027V/027AV/028V/028AV/CY7C037AV/CY7C038V
Unit-15 -20 -25
Min Typ Max Min Typ Max Min Typ Max
VOH Output HIGH voltage (VCC = Min., IOH = –4.0 mA) 2.4 2.4 2.4 V
VOL Output LOW voltage (VCC = Min., IOH = +4.0 mA) 0.4 0.4 0.4 V
VIH Input HIGH voltage 2.2 2.2 2.2 V
VIL Input LOW voltage 0.8 0.8 0.8 V
IIX Input leakage current 555555A
IOZ Output leakage current –10 10 –10 10 –10 10 A
ICC Operating current
(VCC = Max., IOUT = 0 mA)
outputs disabled
Commercial 125 185 120 175 115 165 mA
Industrial [9] 140 195 mA
ISB1 Standby current
(Both ports TTL level)
CEL & CER VIH, f = fMAX
Commercial 35 50 35 45 30 40 mA
Industrial [9] –4555–mA
ISB2 Standby current
(One port TTL level)
CEL | CER VIH, f = fMAX
Commercial 80 120 75 110 65 95 mA
Industrial [9] –85120mA
ISB3 Standby current
(Both ports CMOS level)
CEL & CER VCC 0.2 V, f = 0
Commercial 10 250 10 250 10 250 A
Industrial [9] –10250A
ISB4 Standby current
(One port CMOS level)
CEL | CER VIH, f = fMAX[10]
Commercial 75 105 70 95 60 80 mA
Industrial [9] –80105mA
Capacitance
Parameter [11] Description Test Conditions Max Unit
CIN Input capacitance TA = 25 °C, f = 1 MHz, VCC = 3.3 V 10 pF
COUT Output capacitance 10 pF
Notes
8. Pulse width < 20 ns.
9. Industrial parts are available in CY7C028V and CY7C038V, CY7C027V/027AV only.
10. fMAX = 1/tRC = All inputs cycling at f = 1/tRC (except output enable). f = 0 means no address or control lines change. This applies only to inputs at CMOS level standby ISB3.
11. Tested initially and after any design or process changes that may affect these parameters.
CY7C027V/027AV/028V/028AV
CY7C037AV/038V
Document Number: 38-06078 Rev. *H Page 8 of 24
Data Retention Mode
The CY7C027V/027AV/028V/028AV and CY7037AV/038V are
designed with battery backup in mind. Data retention voltage and
supply current are guaranteed over temperature. The following
rules ensure data retention:
1. Chip Enable (CE) must be held HIGH during data retention, within
VCC to VCC – 0.2 V
2. CE must be kept between VCC – 0.2 V and 70% of VCC during
the power up and power down transitions
3. The RAM can begin operation >tRC after VCC reaches the
minimum operating voltage (3.0 V)
AC Test Loads and Waveforms
Figure 3. AC Test Loads and Waveforms
3.0V
GND 90% 90%
10%
3ns 3ns
10%
ALL INPUT PULSES
(a) Normal Load (Load 1)
R1 = 590
3.3 V
OUTPUT
R2 = 435
C= 30pF
VTH = 1.4 V
OUTPUT
C= 30 pF
(b) Thévenin Equivalent (Load 1) (c) Three-State Delay(Load 2)
R1 = 590
R2 = 435
3.3 V
OUTPUT
C= 5pF
RTH = 250
including scope and jig)
(Used for tLZ, tHZ, tHZWE, & tLZWE
Timing
Parameter Test Conditions [12] Max Unit
ICCDR1 At VCCDR = 2 V 50 A
Data Retention Mode
3.0 V 3.0 V
VCC 2.0 V
VCC to VCC 0.2 V
VCC
CE
tRC
VIH
Note
12. CE = VCC, Vin = GND to VCC, TA = 25 C. This parameter is guaranteed but not tested.
CY7C027V/027AV/028V/028AV
CY7C037AV/038V
Document Number: 38-06078 Rev. *H Page 9 of 24
Switching Characteristics
Over the Operating Range
Parameter [13] Description
CY7C027V/027AV/028V/028AV/
CY7C037AV/CY7C038V
Unit
-15 -20 -25
Min Max Min Max Min Max
Read Cycle
tRC Read cycle time 15 20 25 ns
tAA Address to data valid 15 20 25 ns
tOHA Output hold from address change 3 3 3 ns
tACE[14] CE LOW to data valid –15–20–25ns
tDOE OE LOW to data valid 10 12 13 ns
tLZOE[15, 16, 17] OE LOW to Low Z 3–3–3–ns
tHZOE[15, 16, 17] OE HIGH to High Z 10 12 15 ns
tLZCE[15, 16, 17] CE LOW to Low Z 3–3–3–ns
tHZCE[15, 16, 17] CE HIGH to High Z 10 12 15 ns
tPU[17] CE LOW to power-up 0 0 0 ns
tPD[17] CE HIGH to power-down 15 20 25 ns
tABE[14] Byte enable access time 15 20 25 ns
Write Cycle
tWC Write cycle time 15 20 25 ns
tSCE[14] CE LOW to write end 12 16 20 ns
tAW Address valid to write end 12 16 20 ns
tHA Address hold from write end 0 0 0 ns
tSA[14] Address setup to write start 0 0 0 ns
tPWE Write pulse width 12 17 22 ns
tSD Data setup to write end 10 12 15 ns
tHD Data hold from write end 0 0 0 ns
tHZWE[16, 17] R/W LOW to High Z 10 12 15 ns
tLZWE[16, 17] R/W HIGH to Low Z 3 3 3 ns
tWDD[18] Write pulse to data delay 30 40 50 ns
tDDD[18] Write data valid to read data valid 25 30 35 ns
CY7C027V/027AV/028V/028AV
CY7C037AV/038V
Document Number: 38-06078 Rev. *H Page 10 of 24
Busy Timing[19]
tBLA BUSY LOW from address match 15 20 20 ns
tBHA BUSY HIGH from address
mismatch
–15–20–20ns
tBLC BUSY LOW from CE LOW 15 20 20 ns
tBHC BUSY HIGH from CE HIGH –15–16–17ns
tPS Port setup for priority 5 5 5 ns
tWB R/W HIGH after BUSY (Slave)0–0–0–ns
tWH R/W HIGH after BUSY HIGH (Slave)13–15–17–ns
tBDD[20] BUSY HIGH to data valid 15 20 25 ns
Interrupt Timing[19]
tINS INT set time –15–20–20ns
tINR INT reset time –15–20–20ns
Semaphore Timing
tSOP SEM flag update pulse (OE or
SEM)
10–10–12–ns
tSWRD SEM flag write to read time 5 5 5 ns
tSPS SEM flag contention window 5 5 5 ns
tSAA SEM address access time 15 20 25 ns
Switching Characteristics(continued)
Over the Operating Range
Parameter [13] Description
CY7C027V/027AV/028V/028AV/
CY7C037AV/CY7C038V
Unit
-15 -20 -25
Min Max Min Max Min Max
Notes
19. For information on port-to-port delay through RAM cells from writing port to reading port, refer to Figure 11 waveform.
20. tBDD is a calculated parameter and is the greater of tWDD–tPWE (actual) or tDDD–tSD (actual).
CY7C027V/027AV/028V/028AV
CY7C037AV/038V
Document Number: 38-06078 Rev. *H Page 11 of 24
Switching Waveforms
Figure 4. Read Cycle No. 1 (Either Port Address Access) [21, 22, 23]
Figure 5. Read Cycle No. 2 (Either Port CE/OE Access) [21, 24, 25]
Figure 6. Read Cycle No. 3 (Either Port) [21, 23, 24, 25]
tRC
tAA
tOHA
DATA VALIDPREVIOUS DATA VALID
DATA OUT
ADDRESS
tOHA
tACE
tLZOE
tDOE
tHZOE
tHZCE
DATA VALID
tLZCE
tPU tPD
ISB
ICC
DATA OUT
OE
CE and
LB or UB
CURRENT
UB or LB
DATA OUT
tRC
ADDRESS
tAA tOHA
CE
tLZCE
tABE
tHZCE
tHZCE
tACE
tLZCE
Notes
21. R/W is HIGH for read cycles.
22. Device is continuously selected CE = VIL and UB or LB = VIL. This waveform cannot be used for semaphore reads.
23. OE = VIL.
24. Address valid prior to or coincident with CE transition LOW.
25. To access RAM, CE = VIL, UB or LB = VIL, SEM = VIH. To access semaphore, CE = VIH, SEM = VIL.
CY7C027V/027AV/028V/028AV
CY7C037AV/038V
Document Number: 38-06078 Rev. *H Page 12 of 24
Figure 7. Write Cycle No. 1: R/W Controlled Timing [26, 27, 28, 29]
Figure 8. Write Cycle No. 2: CE Controlled Timing [26, 27, 28, 34]
Switching Waveforms(continued)
tAW
tWC
tPWE
tHD
tSD
tHA
CE
R/W
OE
DATAOUT
DATA IN
ADDRESS
tHZOE
tSA
tHZWE tLZWE
[32]
[32]
[29]
[30,31]
NOTE 33 NOTE 33
tAW
tWC
tSCE
tHD
tSD
tHA
CE
R/W
DATA IN
ADDRESS
tSA
[30,31]
Notes
26. R/W must be HIGH during all address transitions.
27. A write occurs during the overlap (tSCE or tPWE) of a LOW CE or SEM and a LOW UB or LB.
28. tHA is measured from the earlier of CE or R/W or (SEM or R/W) going HIGH at the end of write cycle.
29. If OE is LOW during a R/W controlled write cycle, the write pulse width must be the larger of tPWE or (tHZWE + tSD) to allow the I/O drivers to turn off and data to be placed on the bus
for the required tSD. If OE is HIGH during an R/W controlled write cycle, this requirement does not apply and the write pulse can be as short as the specified tPWE.
30. To access RAM, CE = VIL, SEM = VIH.
31. To access upper byte, CE = VIL, UB = VIL, SEM = VIH.
To access lower byte, CE = VIL, LB = VIL, SEM = VIH.
32. Transition is measured 500 mV from steady state with a 5 pF load (including scope and jig). This parameter is sampled and not 100% tested.
33. During this period, the I/O pins are in the output state, and input signals must not be applied.
34. If the CE or SEM LOW transition occurs simultaneously with or after the R/W LOW transition, the outputs remain in the high impedance state.
CY7C027V/027AV/028V/028AV
CY7C037AV/038V
Document Number: 38-06078 Rev. *H Page 13 of 24
Figure 9. Semaphore Read After Write Timing, Either Side [35]
Figure 10. Timing Diagram of Semaphore Contention [36, 37, 38]
Switching Waveforms(continued)
tSOP
tSAA
VALID ADRESS VALID ADRESS
tHD
DATAIN VALID DATAOUT VALID
tOHA
tAW
tHA
tACE
tSOP
tSCE
tSD
tSA tPWE
tSWRD tDOE
WRITE CYCLE READ CYCLE
OE
R/W
I/O 0
SEM
0–A 2
A
MATCH
tSPS
A0L–A2L
MATCH
R/WL
SEML
A0R–A2R
R/WR
SEM R
Notes
35. CE = HIGH for the duration of the above timing (both write and read cycle).
36. I/O0R = I/O0L = LOW (request semaphore); CER = CEL = HIGH.
37. Semaphores are reset (available to both ports) at cycle start.
38. If tSPS is violated, the semaphore is definitely obtained by one side or the other, but which side gets the semaphore is unpredictable.
CY7C027V/027AV/028V/028AV
CY7C037AV/038V
Document Number: 38-06078 Rev. *H Page 14 of 24
Figure 11. Timing Diagram of Read with BUSY (M/S = HIGH) [39]
Figure 12. Write Timing with Busy Input (M/S = LOW)
Switching Waveforms(continued)
VALID
tDDD
tWDD
MATCH
MATCH
R/WR
DATA INR
DATAOUTL
tWC
ADDRESSR
tPWE
VALID
tSD tHD
ADDRESSL
tPS
tBLA tBHA
tBDD
BUSYL
tPWE
R/W
BUSY
tWB tWH
Note
39. CEL = CER = LOW.
CY7C027V/027AV/028V/028AV
CY7C037AV/038V
Document Number: 38-06078 Rev. *H Page 15 of 24
Figure 13. Busy Timing Diagram No. 1 (CE Arbitration) [40]
Figure 14. Busy Timing Diagram No. 2 (Address Arbitration) [40]
Switching Waveforms(continued)
ADDRESS MATCH
tPS
tBLC tBHC
ADDRESS MATCH
tPS
tBLC tBHC
CERValid First:
ADDRESS L,R
BUSY
R
CEL
CER
BUSYL
CER
CE L
ADDRESSL,R
CELValid First:
ADDRESS MATCH
tPS
ADDRESSL
BUSYR
ADDRESS MISMATCH
tRC or tWC
tBLA tBHA
ADDRESSR
ADDRESS MATCH ADDRESS MISMATCH
tPS
ADDRESSL
BUSY L
tRC or tWC
tBLA tBHA
ADDRESSR
Right Address Valid First:
Left Address Valid First:
Note
40. If tPS is violated, the busy signal is asserted on one side or the other, but there is no guarantee to which side BUSY is asserted.
CY7C027V/027AV/028V/028AV
CY7C037AV/038V
Document Number: 38-06078 Rev. *H Page 16 of 24
Figure 15. Interrupt Timing Diagrams
Switching Waveforms(continued)
WRITE 7FFF (FFFF for CY7C028V/028AV/38V)
tWC
Right Side Clears INTR:
tHA
READ 7FFF
tRC
tINR
WRITE 7FFE (FFFE for CY7C028V/028AV/38V)
tWC
Right Side Sets INTL:
Left Side Sets INTR:
Left Side Clears INT L:
READ 7FFE
tINR
tRC
ADDRESSR
CE L
R/W L
INT L
OE L
ADDRESSR
R/WR
CE R
INTL
ADDRESSR
CER
R/WR
INTR
OE R
ADDRESSL
R/WL
CE L
INTR
tINS
tHA
tINS
(FFFF for CY7C028V/028AV/38V)
(FFFE for CY7C028V/028AV/38V)
[41]
[42]
[42]
[42]
[41]
[42]
Notes
41. tHA depends on which enable pin (CEL or R/WL) is deasserted first.
42. tINS or tINR depends on which enable pin (CEL or R/WL) is asserted last.
CY7C027V/027AV/028V/028AV
CY7C037AV/038V
Document Number: 38-06078 Rev. *H Page 17 of 24
Non-Contending Read/Write
Inputs Outputs
CE R/W OE UB LB SEM I/O9I/O17 I/O0I/O8Operation
H X X X X H High Z High Z Deselected: Power-down
X X X H H H High Z High Z Deselected: Power-down
L L X L H H Data in High Z Write to upper byte only
L L X H L H High Z Data in Write to lower byte only
L L X L L H Data in Data in Write to both bytes
L H L L H H Data out High Z Read upper byte only
L H L H L H High Z Data out Read lower byte only
L H L L L H Data out Data out Read both bytes
X X H X X X High Z High Z Outputs disabled
H H L X X L Data out Data out Read data in semaphore flag
X H L H H L Data out Data out Read data in semaphore flag
H X X X L Data in Data in Write DIN0 into semaphore flag
X X H H L Data in Data in Write DIN0 into semaphore flag
L X X L X L Not allowed
L X X X L L Not allowed
Interrupt Operation Example
(Assumes BUSYL = BUSYR = HIGH) [43]
Left Port Right Port
Function R/WLCELOELA0L–14LINTLR/WRCEROERA0R–14R INTR
Set right INTR flag LLX 7FFF XXXX X L
[44]
Reset right INTR flag XXX X XXL L 7FFF H
[45]
Set left INTL flag X X X X L[45] LLX 7FFE X
Reset left INTL flag X L L 7FFE H[44] XXXXX
Notes
43. A0L–15L and A0R–15R,FFFF/FFFE for the CY7C028V/038V.
44. If BUSYL=L, then no change.
45. If BUSYR=L, then no change.
CY7C027V/027AV/028V/028AV
CY7C037AV/038V
Document Number: 38-06078 Rev. *H Page 18 of 24
Semaphore Operation Example
Function I/O0I/O17 Left I/O0I/O17 Right Status
No action 1 1 Semaphore free
Left port writes 0 to semaphore 0 1 Left port has semaphore token
Right port writes 0 to semaphore 0 1 No change. Right side has no write access to semaphore
Left port writes 1 to semaphore 1 0 Right port obtains semaphore token
Left port writes 0 to semaphore 1 0 No change. Left port has no write access to semaphore
Right port writes 1 to semaphore 0 1 Left port obtains semaphore token
Left port writes 1 to semaphore 1 1 Semaphore free
Right port writes 0 to semaphore 1 0 Right port has semaphore token
Right port writes 1 to semaphore 1 1 Semaphore free
Left port writes 0 to semaphore 0 1 Left port has semaphore token
Left port writes 1 to semaphore 1 1 Semaphore free
CY7C027V/027AV/028V/028AV
CY7C037AV/038V
Document Number: 38-06078 Rev. *H Page 19 of 24
Ordering Information
32 K × 16 3.3 V Asynchronous Dual-Port SRAM
Speed
(ns) Ordering Code
Package
Name Package Type
Operating
Range
15 CY7C027V-15AXC A100 100-pin TQFP (Pb-free) Commercial
CY7C027V-15AXI A100 100-pin TQFP (Pb-free) Industrial
20 CY7C027V-20AC A100 100-pin TQFP Commercial
CY7C027V-20AXC A100 100-pin TQFP (Pb-free) Commercial
25 CY7C027V-25AC A100 100-pin TQFP Commercial
CY7C027V-25AXC A100 100-pin TQFP (Pb-free) Commercial
CY7C027AV-25AXI A100 100-pin TQFP (Pb-free) Industrial
64 K × 16 3.3 V Asynchronous Dual-Port SRAM
Speed
(ns) Ordering Code
Package
Name Package Type
Operating
Range
15 CY7C028V-15AXC A100 100-pin TQFP (Pb-free) Commercial
CY7C028V-15AXI A100 100-pin TQFP (Pb-free) Industrial
20 CY7C028V-20AXC A100 100-pin TQFP (Pb-free) Commercial
CY7C028V-20AI A100 100-pin TQFP Industrial
CY7C028V-20AXI A100 100-pin TQFP (Pb-free) Industrial
25 CY7C028V-25AC A100 100-pin TQFP Commercial
CY7C028V-25AXC A100 100-pin TQFP (Pb-free) Commercial
CY7C028AV-25AXC A100 100-pin TQFP (Pb-free) Commercial
32 K × 18 3.3 V Asynchronous Dual-Port SRAM
Speed
(ns) Ordering Code
Package
Name Package Type
Operating
Range
20 CY7C037AV-20AXC A100 100-pin TQFP (Pb-free) Commercial
CY7C037AV-20AXI A100 100-pin TQFP (Pb-free) Industrial
64 K × 18 3.3 V Asynchronous Dual-Port SRAM
Speed
(ns) Ordering Code
Package
Name Package Type
Operating
Range
20 CY7C038V-20AXI A100 100-pin TQFP (Pb-free) Industrial
CY7C027V/027AV/028V/028AV
CY7C037AV/038V
Document Number: 38-06078 Rev. *H Page 20 of 24
Ordering Code Definitions
CY 7C 0X XX
Company ID: CY = Cypress
7C = Dual Port SRAM
Width: 02=x16 or 03=x18
Operating Range
C = Commercial I = Industrial
X
Depth: 7=32K or 8=64K
AX
Package: A=TQFP
Speed Grade : 15ns/20ns/25ns
X
X : Pb free (RoHS Compliant)
X
X = V/AV : 3.3 V
CY7C027V/027AV/028V/028AV
CY7C037AV/038V
Document Number: 38-06078 Rev. *H Page 21 of 24
Package Diagram
Figure 16. 100-pin TQFP (14 × 14 × 1.4 mm) A100SA Package Outline, 51-85048
51-85048 *H
CY7C027V/027AV/028V/028AV
CY7C037AV/038V
Document Number: 38-06078 Rev. *H Page 22 of 24
Acronyms Document Conventions
Units of Measure
Acronym Description
CMOS Complementary Metal Oxide Semiconductor
I/O Input/Output
SRAM Static Random Access Memory
TQFP Thin Quad Flat Pack
Symbol Unit of Measure
°C degree Celsius
MHz megahertz
µA microampere
mA milliampere
mV millivolt
ns nanosecond
ohm
pF picofarad
Vvolt
Wwatt
CY7C027V/027AV/028V/028AV
CY7C037AV/038V
Document Number: 38-06078 Rev. *H Page 23 of 24
Document History Page
Document Title: CY7C027V/027AV/028V/028AV/CY7C037AV/038V, 3.3 V 32 K / 64 K × 16 / 18 Dual-Port Static RAM
Document Number: 38-06078
Rev. ECN No. Orig. of
Change
Submission
Date Description of Change
** 237626 YDT 6/30/04 Converted data sheet from old spec 38-00670 to conform with new data sheet.
Removed cross information from features section
*A 259110 JHX See ECN Added Pb-Free packaging information.
*B 2623540 VKN /
PYRS
12/17/08 Added CY7C027VN, CY7C027AV and CY7C037AV parts
Updated Ordering information table
*C 2897217 RAME 03/22/2010 Updated Ordering Information
Updated Package Diagram
*D 3093542 ADMU 11/25/2010 Removed information on CY7C027VN and CY7C037V
Updated as per new template
Added Acronyms and Units of Measure table
Added Ordering Code Definitions
Updated all footnotes
*E 3403652 ADMU 10/14/2011 removed pruned parts CY7C027V-25AI, CY7C038V-20AI from Ordering Infor-
mation
Updated Package Diagram.
*F 3845411 ADMU 01/29/2013 Updated Ordering Information (Updated part numbers).
Updated Package Diagram:
spec 51-85048 – Changed revision from *E to *G.
*G 3896090 ADMU 02/05/2013 Updated Ordering Information (Updated part numbers).
*H 4103305 ADMU 08/23/2013 Updated Features:
Included CY7C028AV related information.
Updated Pin Configurations:
Included CY7C028AV related information.
Updated Architecture:
Included CY7C028AV related information.
Updated Functional Description:
Included CY7C028AV related information.
Updated Electrical Characteristics:
Included CY7C028AV related information.
Updated Data Retention Mode:
Included CY7C028AV related information.
Updated Switching Characteristics:
Included CY7C028AV related information.
Updated Switching Waveforms:
Included CY7C028AV related information.
Updated Ordering Information (Updated part numbers).
Updated Package Diagram:
spec 51-85048– Changed revision from *G to *H.
Updated in new template.
Document Number: 38-06078 Rev. *H Revised August 23, 2013 Page 24 of 24
All products and company names mentioned in this document may be the trademarks of their respective holders.
CY7C027V/027AV/028V/028AV
CY7C037AV/038V
© Cypress Semiconductor Corporation, 2009-2013. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
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