SPEF 1.5mm-travel Vertical Type Surface mountable lead-free soldering push switch Detector Typical Specifications Items Specifications Slide Ratingmax. / min. Resistive load 1A 14.5V DC / 50A 3V DC Contact resistance Initial / After operating life 100m max. / 100m max. Operating force 3N, 5N Push Operating lifeWith load 30,000 cycles1A 14.5V DC Poles-position 1-pole, 2-position Rotary Product Line Power Changeover timing Total travel Operating mm force Travel mm Mounting method 3N Dual-in-line Package Type 1.5 Latching 5N 2.7 Non shorting PC board 3N - Alternate Horizontal Type 5N Minimum order unitpcs. Product No. Drawing No. 1,320 SPEF210101 1 1,050 4,200 SPEF110100 2 Reflow 660 1,320 SPEF210200 1 Dip 1,050 4,200 SPEF110200 2 Reflow 660 1,320 SPEF220100 1 Dip 1,050 4,200 SPEF120100 2 Reflow 660 1,320 SPEF220200 1 Dip 1,050 4,200 SPEF120200 2 Operating Terminal type Japan Export Reflow 660 Dip Packing Specifications Vertical Type Taping Unit:mm Product No. SPEF210101 SPEF210200 SPEF220100 SPEF220200 Number of packagespcs. 1 reel 165 Tape width Export package 1 case / Japan 1 case / export packing mm measurementsmm 660 1,320 32 Reel size 403x403x360 o380 Tray Product No. SPEF110100 SPEF110200 SPEF120100 SPEF120200 Number of packagespcs. 1 case / Japan 1 case / export packing Export package measurementsmm 1,050 4,200 540x360x230 33.5 Refer to P.130 for soldering conditions. 124 SPEF1.5mm-travel Vertical Type Unit:mm No. PC board mounting hole dimensions Viewed from the direction A Style Slide Reflow soldering type Terminal No.1 2 1.2 Terminal No.2 Rotary 2.1 4.6 Push 2.1 Terminal No. C Detector Dimensions 1.2 A 1 11.3 9 3.5 2.5 Full stroke position 2.5 2.5 Lock position Power 13.6 9.4 3.5 2.5 Dual-in-line Package Type 6.9 11.86 13.1 14.6 o0.9 6 6.7 1.3 o1.4 Terminal No. C Horizontal Type Dip soldering type Terminal No.1 Terminal No.2 Vertical Type A 9.4 3.5 2.5 6 9.8 12.2 PC board mounting face 2.5 2.5 11.86 13.1 14.6 3.2 3.5 o0.9 1.3 o1.4 Lock position 6.9 2 9 3.5 2.5 Full stroke position 1 1 5.7 6.7 1.2 Circuit DiagramViewed from Direction A 1 C 2 125 Push Switches List of Varieties Vertical Detector Series SPEF SPED2 SPED3 SPED4 SPED5 Photo Slide W 9.4 D 9 16.8 H 6.9 18.3 13.2 13.1 14.3 Travelmm 1.5 -- -- -- -- Total travelmm 2.7 4.5 3.8 Number of poles 1 1 2 1 Dimensions mm Push Rotary Power Operating temperature range Automotive use 14 18 -40 to 85 13.5 18.2 -40 to 95 Dual-in-line Package Type Life cycle Ratingmax. Resistive load 1A 14.5V DC Ratingmin. Resistive load Durability Horizontal Type Vertical Type Electrical performance Operating life without load 50A 3V DC -- -- 2A 14.5V DC -- -- -- -- -- -- -- -- Operating life with load at max. rated load 30,000 cycles 100m max. Initial contact resistance 100m max. Insulation resistance 3M min. 100V DC Voltage proof Terminal strength Mechanical Operating performance Actuator direction strength Pulling direction 3M min. 500V DC 100V AC for 1minute -- -- -- 90N 30N -- Cold Environmental performance Dry heat -- Wire strength 30N 98N 90N 98N -- -- -- -40 96h 85 96h Damp heat Page -- 85 96h (Connector type) 105 192h (Dip type) 105 192h 40, 90 to 95%RH 96h 124 126 128 Push Switches Soldering Conditions 130 Push Switches Cautions 131 Note Indicates applicability to all products in the series. 110 Push Switches / Soldering Conditions Detector Example of Reflow Soldering Condition 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: T hermocouple 0.1 to 0.2 CA (K) or CC (T) at soldering portion (copper foil surface). A heat resisting tape should be used for fixed measurement. 3. Temperature profile Push Temperature (C ) Slide 300 A max. B 200 D E 100 Rotary Room temperature Time (s) Pre-heating F max. C Power Dual-in-line Package Type SeriesReflow type A 3s max. B Cs D E Fs 260 230 40 180 150 120 SPEJ SPEF SPEH Horizontal Type Notes 1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc. The above-stated conditions shall also apply to switch surface temperatures. 2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended. Vertical Type Reference for Hand Soldering Series Soldering temperature Soldering time SPPJ3, SPPJ2, SPUN, SPPH4, SPPH1 35010 3+1/0s SPED2, SPED4 35010 30.5s SPEJ 35010 4s max. SPEF 3505 3s max. SPEH 350 max. 3s max. SPUJ 30010 3+1/0s Reference for Dip Soldering (For PC board terminal types) Series 130 For PC board Items Dip soldering Preheating temperature Preheating time Soldering temperature Duration of immersion SPPJ3 100 max. 60s max. 2605 51s SPUN 100 max. 60s max. 2605 101s SPUJ, SPPH4 -- 2605 51s SPPJ2, SPPH1, SPED2, SPED4, SPEF -- 2605 101s