124
Detector Slide Push Rotary Power
Dual-in-line
Package Type
Horizontal
Type
Vertical
Type
SPEF 1.5mm-travel Vertical Type
Surface mountable lead-free soldering push switch
SPEF120200
Japan Export
Non shorting PC board2.7
Latching
Alternate
SPEF210101
SPEF110100
SPEF210200
SPEF110200
3N
5N
3N
5N
1. 5
−
Reflow
Dip
Reflow
Dip
Reflow
Dip
Reflow
Dip
1
2
1
2
1
2
1
2
1, 3 2 0660
4,2001, 0 5 0
1, 3 2 0660
4,2001, 0 5 0
SPEF220100
1, 3 2 0660
SPEF120100
4,2001, 0 5 0
SPEF220200
1, 3 2 0660
4,2001, 0 5 0
Operating
force
Travel
（mm）
Changeover
timing Terminal type
Operating Product No.
Product Line
Mounting
method
Total travel
（mm）
Drawing
No.
Minimum order unit （pcs.）
Refer to P.130 for soldering conditions.
■Typical Specifications
Items Specifications
Rating （max.）/（min.）
（Resistive load）
1A 14.5V DC / 50μA 3V DC
Contact resistance
（Initial / After operating life）
100mΩ max. / 100mΩ max.
Operating force
3N, 5N
Operating life（With load）
30,000 cycles （1A 14.5V DC）
Poles-position
1-pole, 2-position
Product No. Number of packages （pcs.）
Tape width
（mm）
Export package
measurements（mm）
1 reel
1 case /
Japan
1 case / export packing
SPEF210101
SPEF210200
SPEF220100
SPEF220200
16 5 660 1, 3 2 0 32 403×4 03×360
Tray
Product No. Number of packages （pcs.）
Export package
measurements（mm）
1 case / Japan
1 case / export packing
SPEF110100
SPEF110200
SPEF120100
SPEF120200
1, 0 5 0 4,200 54 0×360×230
Unit:mm
Reel size
Packing Specifications
Taping
ø380 33.5
125
Detector Slide Push Rotary Power
Dual-in-line
Package Type
Horizontal
Type
Vertical
Type
SPEF／1.5mm-travel Vertical Type
PC board mounting hole dimensions
（Viewed from the direction A）
Circuit Diagram
（Viewed from Direction A）
1
2
C
（）
（）
（）
（）
No.
1
2
Reflow soldering type
Dimensions Unit:mm
Style
Dip soldering type
（）
（）
1.2
1.2
2.1 2.1
2
4.6
2.5
13.6
9.4
3.5
ø1.4
14.61.3
6.9
13.1
11.86
6
2.52.5
2.5
11.3
3.5
9
6.7
Terminal No.1
Terminal No.2
Terminal No. C
ø0.9
Full stroke position
Lock position
A
3.5
9.4
2.5
ø1.4 ø0.9
14.6
1.3
9.8
12.2
3.2
3.5
13.1
6.9
11.86
6
1.2
1 1
3.5
2.5
2.52.5
9
5.7
6.7
Terminal No. CTerminal No.1
Terminal No.2
PC board mounting face
Lock position
Full stroke position
A
110
Detector Slide Push Rotary Power
Dual-in-line
Package Type
Horizontal
Type
Vertical
Type
Series Vertical
SPEF SPED2 SPED3 SPED4 SPED5
Photo
Dimensions
（mm）
W
9.4 14 13 . 5
D
916 . 8 18 18 . 2
H
6.9 18 . 3 13 . 2 13 .1 14 . 3
Travel （mm）
1. 5 — — — —
Total travel （mm）
2.7 4.5 3.8
Number of poles
11
21
Operating
temperature range
−40℃ to ＋85℃ −40℃ to ＋95℃
Automotive use
●●●●●●
Life cycle
Rating （max.）
（Resistive load）
1A 14.5 V DC 2 A 14 . 5 V D C
Rating （min.）
（Resistive load）
50μA 3V DC ————
Durability
Operating life
without load
——————
Operating life with load
（at max. rated load）
30,000 cycles 100mΩ max.
Electrical
performance
Initial contact
resistance
10 0mΩ ma x .
Insulation
resistance
3 MΩ min . 10 0 V D C 3MΩ min. 500V DC
Voltage proof
10 0 V A C f o r 1m i n u t e
Mechanical
performance
Terminal
strength
—————
Wire strength 30N
Actuator
strength
Operating
direction
90N 98N 90N 98N
Pulling
direction
30N — — — —
Environmental
performance
Cold
−40℃ 96h
Dry heat
85℃ 96h
85℃ 96h (Connector type)
105℃ 192h (Dip type)
10 5 ℃ 192 h
Damp heat
40℃, 90 to 95%RH 96h
Page
12 4 12 6 12 8
Push Switches Soldering Conditions ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 130
Push Switches Cautions ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 131
Note
● Indicates applicability to all products in the series.
List of Varieties
Push Switches
130
Detector Slide Push Rotary Power
Dual-in-line
Package Type
Horizontal
Type
Vertical
Type
Soldering time
SPEH
Series
Series
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple φ 0.1 to 0.2 CA (K) or CC (T) at soldering portion (copper foil surface).
A heat resisting tape should be used for fixed measurement.
3. Temperature profile
300
200
100
A max.
B
E
D
Time (s)
C
Pre-heating
F max.
Room
temperature
Temperature (˚C )
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's
temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc.
The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.
Notes
260
Series（Reflow type）
230 40 18 0 15 0 12 0
SPEJ
SPEF
A（℃）
3s max. B（℃） C（s） D（℃） E（℃） F（s）
10 ±1s
Soldering temperature Duration of immersion
Preheating temperature
Preheating time
SPPJ2, SPPH1, SPED2, SPED4, SPEF
SPUJ, SPPH4
SPUN
SPPJ3 10 0 ℃ m a x . 60s max. 260±5℃ 5 ±1s
10 0 ℃ m a x . 60s max. 260±5℃ 10 ±1s
—260±5℃ 5 ±1s
—260±5℃
Items Dip soldering
Reference for Dip Soldering
(For PC board terminal types)
3 0 0 ±10 ℃
SPUJ 3 +1/ 0 s
350℃ max.
SPEH
SPEF
SPEJ
SPED2, SPED4
SPPJ3, SPPJ2, SPUN, SPPH4, SPPH1 3 5 0 ±10 ℃ 3 +1/ 0 s
3 5 0 ±10 ℃ 3±0.5s
3 5 0 ±10 ℃ 4s max.
350±5℃ 3s max.
3s max.
Soldering temperature
Reference for Hand Soldering
For PC board 端子タイプに適用
Push Switches / Soldering Conditions
