CYNTEC CO., LTD. DOCUMENT : RB000000N REVISION : A1 PAGE : 1 OF 11 0603 Series Thin Film Chip Resistor 1. Scope This specification applies to 0.8mm x 1.6mm (0603) size, fixed metal chip resistors rectangular type for use in electronic equipment. 2. Type Designation RR0816 X -- XXX (1) (2) (3) Where -- X N (4) (5) (1) Series No. (2) Tolerance of TCR : P = 25ppm/ Q = 50ppm/ R = 100ppm/ (3) Nominal resistance value : For example -Three digits of number (E-24 Series) 100 = 10 102 = 1k Four digits of number (E-96 Series) 11R3 = 11.3 1131 =1.13k (4) Resistance tolerance : B = 0.1% D = 0.5% (5) N = Sn plating (Lead free , RoHS Compliant) 3. Electrical Specifications Power Rating* 1/10 W Resistance Values E-24 series , E-96 series Resistance Tolerance 0.5%(D) Resistance Range T.C.R. (Temperature Coefficient of Resistance) 1091 10033k 50ppm 25ppm Operating Temperature Range Max. Operating Voltage** 0.1%(B) , 0.5%(D) -55 to 125 75V 36k360k 25ppm 100ppm CYNTEC CO., LTD. DOCUMENT : RB000000N REVISION : A1 PAGE : 2 OF 11 RATED LOAD(%) Note: *Package Power Temperature Derating Curve 100 0 -55 70 125 AMBIENT TEMPERATURE() Figure 1.Power Temperature Derating Cure Note: **Resistors shall have a rated DC or AC(rms.) continuous operating voltage corresponding to the power rating, as calculated from the following formula Where V : Rated voltage (V) V = Px R P : Rated power (W) R : Nominal resistance () If the voltage so obtained exceeds the maximum operating voltage, this maximum voltage shall be the rated voltage. 4. Outline dimensions a L a W t Code Letter Dimension L 1.6 0.2 W 0.8 0.2 t 0.4 0.1 a 0.3 0.2 Unit : mm CYNTEC CO., LTD. DOCUMENT : RB000000N REVISION : A1 PAGE : 3 OF 11 5. Marking A rated resistance shall be marked on the protecting coat with three digits of number. (1) Resistance in E-24 Series : Example : 3.9k39 X 102392 (2) Resistance in E-96 Series : code 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 R value 100 102 105 107 110 113 115 118 121 124 127 130 133 137 140 143 147 150 154 158 162 165 169 174 code 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 R value 178 182 187 191 196 200 205 210 215 221 226 232 237 243 249 255 261 267 274 280 287 294 301 309 code 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 R value 316 324 332 340 348 357 365 374 383 392 402 412 422 432 442 453 464 475 487 499 511 523 536 549 code 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 R value 562 576 590 604 619 634 649 665 681 698 715 732 750 768 787 806 825 845 866 887 909 931 953 976 This table shows the first two digits for the three-digits E-96 series part marking scheme. The third character is a letter multiplier: S=10-2 R=10-1 A=100 Example : 10.2k102 X 10202C H=101 C=102 D=103 E=104 F=105 CYNTEC CO., LTD. DOCUMENT : RB000000N REVISION : A1 PAGE : 4 OF 11 6. Life Tests 6-1 Electrical Item Specification and Requirement Test Method Short Time Overload R: (0.5%+ 0.05) Without damage by flashover, spark, arcing, burning or breakdown (1) Applied voltage : 2.5 x rated voltage or 2 x maximum operating voltage which ever is less (2) Test time : 5 seconds Insulation Resistance Over 100 M on Overcoat layer face up Over 1,000 M on Substrate side face up (1) Setup as figure 2 (2) Test voltage : 100 VDC (3) Test time : 60 + 10 / -0 seconds Voltage Proof R: (0.5%+ 0.05) Without damage by flashover, spark, arcing, burning or breakdown (1) Setup as figure 2 (2) Test voltage : 100 VAC(rms.) (3) Test time : 60 +10 / -0 seconds Pressure Rod (Metal) Insulation Plate Measurement Point A (R=0.5 mm) Spring Sample Electrode Substrate A Over coat Film B Substrate Side Voltage Supply Metal Block Measurement Point B Figure 2 : Measurement Setup CYNTEC CO., LTD. DOCUMENT : RB000000N REVISION : A1 PAGE : 5 OF 11 6-2 Mechanical Item Solderability Specification and Requirement Test Method The surface of terminal immersed shall Solder bath : After immersing in flux, dip in be minimum of 95% covered with a new coating of solder 245 5 molten solder bath for 3 0.5 seconds Resistance to Solder R: (0.5%+ 0.05) Heat Without distinct deformation in appearance (1) Pre-heat : 100~110 for 30 seconds (2) Immersed at solder bath of 270 5 for 10 1 seconds (3) Measuring resistance 1 hour after test Vibration R: (0.5%+ 0.05) Without mechanical damage such as break (1) Vibration frequency : 10Hz to 55Hz to10Hz in 60 seconds as a period (2) Vibration time : period cycled for 2 hours in each of 3 mutual perpendicular directions (3) Amplitude : 1.5mm Shock R: (0.25%+ 0.05) Without mechanical damage such as break (1) Peak value : 490N (2) Duration of pulse : 11ms 3 times in each positive and negative direction of 3 mutual perpendicular directions Bending Test R: (0.5%+ 0.05) Without mechanical damage such as break Bending value : 3 mm for 30 1 seconds Solvent Resistance Marking should be legible Without mechanical and distinct damage in appearance (1) Solvent : Trichloroethane or Isopropyl alcohol (2) Immersed in solvent at room temperature for 90 seconds CYNTEC CO., LTD. DOCUMENT : RB000000N REVISION : A1 PAGE : 6 OF 11 6-3 Endurance Item Rapid change of Temperature Specification and Requirement Test Method (1) Repeat 5 cycle as follow : R: (0.5%+ 0.05) (-55 3,30minutes) (Room Without distinct damage in appearance temperature, 2~3 minutes) (+125 2,30minutes) (Room temperature, 2~3 minutes) (2) Measuring resistance 1 hour after test Moisture with Load R: (1.0%+ 0.05) Without distinct damage in appearance Marking should be legible Load Life (1) Environment condition : 40 2,90~95% RH (2) Applied Voltage : rated voltage (3) Test period: (1.5 hour ON) (0.5 hour OFF) cycled for total 1,000 + 48 / - 0 hours (4) Measuring resistance 1 hour after test (1) Test temperature : R: (1.0%+ 0.05) 70 2 Without distinct damage in appearance (2) Applied Voltage : rated voltage (3) Test period: (1.5 hour ON) (0.5 hour OFF) cycled for total 1,000 + 48 / - 0 hours (4) Measuring resistance 1 hour after test Low Temperature Store (1) Sto e temperature : R: (1.0%+ 0.05) -55 3 for total Without distinct damage in appearance 1,000 + 48 / - 0 hours (2) Measuring resistance 1 hour after test High Temperature Store (1) Store temperature : R: (1.0%+ 0.05) +125 2 for total Without distinct damage in appearance 1,000 + 48 / - 0 hours (2) Measuring resistance 1 hour after test CYNTEC CO., LTD. DOCUMENT : RB000000N REVISION : A1 PAGE : 7 OF 11 7. Recommend Land Pattern Dimensions A B C A 0.8 B 2.2 C 0.6~1.0 Unit : mm CYNTEC CO., LTD. DOCUMENT : RB000000N REVISION : A1 PAGE : 8 OF 11 8. Packaging 8-1 Dimensions 8-1-1 Tape packaging dimensions 1.5 +- 0.6 0.05 0.1 0.0 2.0 0.05 P Sprocket hole 1.75 0.1 A Chip 3.5 0.05 B 0.65 0.1 8.0 0.3 A = 1.1 0.1 B = 1.9 0.1 P(PITCH) = 4.0 0.1 Carries cavity P Unit : mm 8-1-2 Reel dimensions 13 1.4 105 2 0.5 R1 178 2.0 +1 60-0 13 0.2 21 0.8 9 0.3 Unit : mm CYNTEC CO., LTD. DOCUMENT : RB000000N REVISION : A1 PAGE : 9 OF 11 8-2 Peel force of top cover tape The peel speed shall be about 300 mm/minute The peel force of top cover tape shall be between 0.1 to 0.7 N Top Cover Tape 0.1N~0.7N 165~180 8-3 Numbers of taping 5,000 pieces/reel 8-4 Label marking The following items shall be marked on the production and shipping Label on the reel. 8-4-1 Production Label (1) Part No. (2) Description (3) Quantity (4) Taping No. 8-4-2 Shipping Label (1) *Customer's name (2) *Customer's part No. (3) Manufacturer's part No. (4) Manufacturer's name (5) Manufacturer's country *Note : Item (1) and (2) are listed by request CYNTEC CO., LTD. DOCUMENT : RB000000N REVISION : A1 PAGE : 10 OF 11 9. Care note 9-1 Care note for storage (1) Chip resistor shall be stored in a room where temperature and humidity must be controlled. (temperature 5 to 35, humidity 45 to 85% RH) However, a humidity keep it low, as it is possible. (2) Chip resistor shall be stored as direct sunshine doesn't hit on it. (3) Chip resistor shall be stored with no moisture, dust, a material that will make solderability inferior, and a harmful gas (Chloridation hydrogen, sulfurous acid gas, and sulfuration hydrogen) 9-2 Care note for operating and handling (1) It is necessary to protect the edge and protection coat of resistors from mechanical stress. (2) Handle with care when printing circuit board (PCB) is divided or fixed on support body, (3) (4) (5) (6) because bending of printing circuit board (PCB) mounting will make mechanical stress for resistors. Resistors shall be used with in rated range shown in specification. Especially, if voltage more than specified value will be loaded to resistor, there is a case it will make damage for machine because of temperature rise depending on generating of heat, and increase resistance value or breaks. In case that resistor is loaded a rated voltage, it is necessary to confirms temperature of a resistor and to reduce a load power according to load reduction curve, because a temperature rise of a resistor depends on influence of heat from mounting density and neighboring element. Observe Limiting element voltage and maximum overload voltage specified in each specification If there is possibility that a large voltage (pulse voltage, shock voltage) charge to resistor, it is necessary that operating condition shall be set up before use.