3.2X1.6mm SMD CHIP LED LAMP PRELIMINARY SPEC APK3216SYCK Features Description !3.2mmX1.6mm SMT LED, 1.1mm THICKNESS. The Super Bright Yellow source color devices !LOW POWER CONSUMPTION. are made with DH InGaAlP on GaAs substrate !WIDE VIEWING ANGLE. Light Emitting Diode. !IDEAL SUPER BRIGHT YELLOW FOR BACKLIGHT AND INDICATOR. ! VARIOUS COLORS AND LENS TYPES AVAILABLE. !PACKAGE :2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.2(0.0079") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAC0328 APPROVED:J.Lu REV NO: V.1 CHECKED:Allen Liu DATE:NOV/14/2002 DRAWN: X.T.HU PAGE: 1 OF 4 Selection Guide P ar t N o . Dic e APK3216SYCK Iv (m c d ) @ 20 m A L en s Ty p e SUPER BRIGHT YELLOW (InGaAlP) V i ew i n g An g l e Min . Ty p . 21/2 36 90 90 WATER CLEAR Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25C Sy m b o l P ar am et er D ev i c e peak Peak Wavelength Super Bright Yellow D Dominate Wavelength 1/2 Ty p . Max . Un its Tes t Co n d it io n s 590 nm I F =20mA Super Bright Yellow 590 nm I F =20mA Spectral Line Half-width Super Bright Yellow 20 nm I F =20mA C Capacitance Super Bright Yellow 20 pF V F =0V;f =1MHz VF Forward Voltage Super Bright Yellow 2.0 2.5 V I F =20mA IR Reverse Current Super Bright Yellow 10 uA V R = 5V Absolute Maximum Ratings at TA=25C P ar am et er Su p er B r ig h t Yello w Un its Power dissipation 125 mW DC Forward Current 30 mA Peak Forward Current [1] 175 mA Reverse Voltage 5 V Operating/Storage Temperature -40C To +85C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAC0328 APPROVED:J.Lu REV NO: V.1 CHECKED:Allen Liu DATE:NOV/14/2002 DRAWN: X.T.HU PAGE: 2 OF 4 Super Bright Yellow SPEC NO: DSAC0328 APPROVED:J.Lu APK3216SYCK REV NO: V.1 CHECKED:Allen Liu DATE:NOV/14/2002 DRAWN: X.T.HU PAGE: 3 OF 4 APK3216SYCK SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAC0328 APPROVED:J.Lu REV NO: V.1 CHECKED:Allen Liu DATE:NOV/14/2002 DRAWN: X.T.HU PAGE: 4 OF 4