Description
The Avago ACMD-7402 is a miniature duplexer designed
for US PCS handsets.
The ACMD-7402 is designed with Avago Technologies’
Film Bulk Acoustic Resonator (FBAR) technology, which
makes possible ultra-small, high-Q filters at a fraction of
their usual size.
The ACMD-7402 also utilizes Avago’s innovative
Microcap bonded-wafer, chip scale packaging
technology. This process allows the filters to be
assembled in a molded chip-on-board module that is
less than 1.3 mm high with a footprint of only 3.8 x
3.8 mm.
The ACMD-7402 enhances the sensitivity and dynamic
range of PCS receivers by providing more than 54 dB
attenuation of the transmitted signal at the receiver
input and more than 45 dB rejection of transmit-
generated noise in the receive band.
Maximum Insertion Loss in the Tx channel is only 3.5
dB, which minimizes current drain from the power
amplifier. Insertion Loss in the Rx channel is 3.8 dB max,
improving receiver sensitivity.
The excellent power handling capability of the FBAR
bulk-mode resonators supports the high output power
levels needed in PCS handsets while adding virtually no
distortion.
Features
•Miniature size
-3.8 x 3.8 mm footprint size
-1.3 mm max height
•High power rating size
-+33 dBm max Tx power
•Lead-free construction
Specifications
•Performance guaranteed –30 to +85°C
•Rx band performance (1930.5 – 1989.5 mHz) size
-Insertion loss: 3.8 dB max size
-Noise blocking: 43 dB min
•Tx band performance (1850.5 – 1909.5 mHz) size
-Insertion loss: 3.5 dB max size
-Interferer blocking: 52 dB min
Applications
•Handsets or data terminals operating in the US
PCS frequency band
ACMD-7402
Miniature PCS Band Duplexer
Data Sheet
Functional Block Diagram
Tx
PORT 1
Rx
PORT 2
ANT PORT 3
2
ACMD-7402 Electrical Specifications, Z0 = 50 Ω, TC [1,2] as indicated
– 30°C[2] +25°C[2] +85°C[2]
Symbol Parameter Units Min Typ[3] Max Min Typ[3] Max Min Typ[3] Max
Antenna Port to Receive Port
S23 Insertion Loss in Receive Band dB 3.8 1.5 3.5 3.5
(1930.5 – 1989.5 MHz)
∆S23 Ripple (p-p) in Receive Band dB 3.0 1.5 2.6 2.6
S22 Return Loss of Receive Port dB 9.5 9.5 17 9.5
in Receive Band
S23 Attenuation in Transmit Band dB 52 52 56 52
(1850.5 – 1909.5 MHz)
S23 Attenuation 0 – 1600 MHz dB 20 31
S23 Attenuation in Receive 2nd dB 18 19
Harmonic Band
(3861 – 3979 MHz)
Transmit Port to Antenna Port
S31 Insertion Loss in Transmit Band dB 3.0 1.1 3.0 3.5[4]
(1850.5 – 1909.5 MHz)
∆S31 Ripple (p-p) in Transmit Band dB 2.3 0.9 2.3 2.8
S11 Return Loss of Transmit Port dB 9.5 9.5 20 9.5
in Transmit Band
S31 Attenuation in Receive Band dB 43 43 48 43
(1930.5 – 1989.5 MHz)
S31 Attenuation 0 – 1600 MHz dB 22 34
S31 Attenuation in Transmit 2nd dB 8 13
Harmonic Band
(3701 – 3819 MHz)
Antenna Port
S33 Return Loss of Antenna Port in dB 9 9 16 9
Receive Band
(1930.5 – 1989.5 MHz)
S33 Return Loss of Antenna Port in dB 9 9 19 9
Transmit Band
(1850.5 – 1909.5 MHz)
Isolation Transmit Port to Receive Port
S21 Tx-Rx Isolation in Receive Band dB 45 45 48 45
(1930.5 – 1989.5 MHz)
S21 Tx-Rx Isolation in Transmit Band dB 54 54 58 54
(1850.5 – 1909.5 MHz)
Notes:
1. TC is the case temperature and is defined as the temperature of the underside of the Duplexer where it makes contact with the circuit
board.
2. Min/Max specifications are guaranteed at the indicated temperature with the input power to the Tx ports equal to or less than +29 dBm
over all Tx frequencies unless otherwise noted.
3. Typical data is the average value of the parameter over the indicated band at the specified temperature. Typical values may vary over time.
Refer to “Characterization” section for measurement details.
4. At Tx input power between +26 dBm and +29 dBm, the Insertion Loss at the upper edge of the Tx band (1907– 1909.5 MHz) will be slightly
degraded. From 1907 to 1909.5 MHz, the maximum Insertion Loss specification at Tc = +85°C is guaranteed to +26 dBm input power.
3
Absolute Maximum Ratings[1]
Parameter Unit Value
Storage Temperature °C–65 to +125
Maximum RF Input Power dBm +33
to Tx Ports
Maximum Recommended Operating Conditions[2]
Parameter Unit Value
Operating Temperature, Tc[3],°C–40 to +100
Tx Power 29 dBm
Operating temperature, Tc[3],°C–40 to +85
Tx Power 30 dBm
Notes:
1. Operation in excess of any one of these conditions may result in
permanent damage to the device.
2. The device will function over the recommended range without
degradation in reliability or permanent change in performance,
but is not guaranteed to meet electrical specifications.
3. TC is defined as case temperature, the temperature of the
underside of the Duplexer where it makes contact with the circuit
board.
Characterization
A test circuit similar to that shown in Figure 1 was used
to measure typical device performance. This circuit is
designed to interface with Air Coplanar (ACP), Ground-
Signal-Ground (GSG) RF probes of the type commonly
used to test semiconductor wafers.
The test circuit is a 7 x 7 mm PCB with a well-grounded
pad to which the device under test (DUT) is solder-
mounted.
Short lengths of 50-ohm microstripline connect the DUT
to the ACP probe patterns on the board.
A test circuit with a ACMD-7402 mounted in place is
shown in Figure 2. S-parameters are then measured
using a network analyzer and calibrated ACP probe set
Phase data for s-parameters measured with ACP probe
circuits are adjusted to place the reference plane at the
edge of the Duplexer.
Figure 1. ACP probe test circuit Figure 2. Test circuit with ACMD-7402 duplexer
4
Figure 8. Antenna port return loss
Figure 7. Tx–Rx isolation
Figure 6. Tx rejection in Rx band and Rx rejection in Tx bandFigure 5. Tx and Rx port return loss
Figure 4. Ant–Rx insertion lossFigure 3. Tx–Ant insertion loss
Typical Performance at Tc = 25°C
-4.0
-3.0
-2.0
-1.0
0.0
1850 1860 1870 1880 1890 1900 1910
Frequency [MHz]
Insertion Loss [dB]
-4.0
-3.0
-2.0
-1.0
0.0
1930 1940 1950 1960 1970 1980 1990
Frequency [MHz]
Insertion Loss [dB]
-25
-20
-15
-10
-5
0
1750 1800 1850 1900 1950 2000 2050 2100
Frequency[MHz]
Return Loss [dB]
-60
-50
-40
-30
-20
-10
0
1750 1800 1850 1900 1950 2000 2050 2100
Frequency[MHz]
Insertion Loss [dB]
-80
-75
-70
-65
-60
-55
-50
-45
-40
-35
1750 1800 1850 1900 1950 2000 2050 2100
Insertion Loss [dB]
-25
-20
-15
-10
-5
0
1750 1800 1850 1900 1950 2000 2050 2100
Frequency [MHz]
Return Loss [dB]
5
Figure 12. Ant–Rx low frequency rejectionFigure 11. Tx–Ant low frequency rejection
Figure 10. Tx–Ant and Ant–Rx wideband insertion lossFigure 9. Tx–Ant rejection at Tx second harmonic
-40
-30
-20
-10
0
3700 3720 3740 3760 3780 3800 3820
Frequency [MHz]
Insertion Loss [dB]
-60
-50
-40
-30
-20
-10
0
0.0 1.0 2.0 3.0 4.0 5.0 6.0
Frequency [GHz]
Insertion Loss [dB]
-60
-50
-40
-30
-20
-10
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Frequency [GHz]
Insertion Loss [dB]
-60
-50
-40
-30
-20
-10
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Frequency [GHz]
Insertion Loss [dB]
6
Figure 14. Package marking
Figure 13. Package outline drawing
H FB Y
WW DC
N N N N
TxRx
Ant
PACKAGE
ORIENTATION
H = ACMD-7402
FB = Avago ID
Y = Year
WW = Work Week
DC = Date Code
NNNN = Lot Number
(PRODUCT
MARKING) Tx 3.8Rx
3.8
Ant
Tx
SOLDER MASK
OVER VIAS (2 PLS)
NOTES:
1. DIMENSIONS IN MILLIMETERS (mm).
2. TOLERANCE: X.X ± 0.1, X.XX ± 0.05
3. PACKAGE HEIGHT = 1.3 mm MAX.
4. CONTACT AREAS ARE GOLD PLATED.
5. NON-GROUND VIAS SHOWN FOR REFERENCE ONLY;
COVERED WITH 0.51 mm ∅ SOLDER MASK.
1.9
Rx
2.4
Ant
1.9
1.4
0.40
2.8 1.1
1.8
1.4
0.8
0.50
0.1
1.2
Lead Free
Lead Free
7
Figure 16. Duplexer superposed on PCB land print
Figure 15. Recommended PCB land print
1.8 1.01.0
1.2
1.4
1.2
0.8 0.2
0.4
0.3
0.3
0.6
WT
1.0
1.8
1.2 1.2 1.21.2
1.4
0.3 0.3
0.2 0.2
0.4 0.4
0.3 0.3
0.5 0.5
NOTES:
DIMENSIONS IN MILLIMETERS (mm)
ALL VIAS ∅ 0.40
ANGLES 45°
RF PORTS ARE CPW
T AND W SELECTED FOR 50 OHMS
PATTERN CENTERED ON DUPLEXER
8
Figure 18. Duplexer superposed on solder s stencilFigure 17. Recommended solder stencil
Package Moisture Sensitivity
Feature Test Method Performance
Moisture Sensitivity Level (MSL) at 260°CJ-STD-020C Level 3
Figure 19. Verified SMT solder profile
TEMPERATURE °C
0
0
TIME, SECONDS
250
300
100
150
200
250
150 200 300
50
10050
3.25
1.00
1.00
3.40
NOTES:
1. DIMENSIONS IN MILLIMETERS (mm).
2. SOLDER STRIPES (14 PLS) ARE 0.20 WIDE, PITCH.
3. SOLDER PADS FOR I/O ARE 0.35 x 0.35.
4. STENCIL PATTERN IS CENTERED ON DUPLEXER.
1.63
1.25
2.70
0.40
9
Figure 20. SMD tape packing
Figure 21. Unit orientation In tape
TAPE
WIDTH
H FB Y
WW DC
N N N N
H FB Y
WW DC
N N N N
PACKAGE PIN 1 ORIENTATIONSPROCKET HOLES
POCKET CAVITY
1.75 ± 0.10
5.50 ± 0.05
12.00 ± 0.10
8.00 ± 0.10 ∅ 1.50 (MIN.)
∅ 1.55 ± 0.05
4.00 ± 0.10 SEE NOTE 2
2.00 ± 0.05
AA
B
B
Bo
Ko
5° MAX.
SECTION B-B
Ao
SECTION A-A
5° MAX.
0.30 ± 0.05
Ao
Bo
Ko
PITCH
WIDTH
= 4.10
= 4.10
= 1.45
= 8.00
= 12.00
NOTES:
1. Ao and Bo MEASURED AT 0.3 mm ABOVE BASE OF POCKET.
2. 10 PITCHES CUMULATIVE TOLERANCE ± 0.2 mm.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved.
AV01-0261EN July 12, 2006
Ordering Information
Part Number No. of Devices Container
ACMD-7402-BLK 25 Anti-static Bag
ACMD-7402-TR1 1000 7-inch Reel