0.5 mm-pitch Rotary-lock Type XF2H
New rotary-lock concept achieves high
reliability and superior work efficiency.
The unique rotary lock construction significantly
improves work efficiency during FPC mounting.
Double-sided contacts maintain a stable contact force.
Discrimination between FPC upper and lower contacts
is unnecessary.
Low-profile, protruding only 2 mm on the PCB.
Specifications
Dimensions
Ordering Information
Materials/Finish
Rated current 0.5 A
50 VDC
30
m max.
(max.
20
mV,
max.
100 mA)
Housing
Slider
Contact
Hold-down
100 M min. (at 250 VDC)
250 VAC 1 min. (leakage current: 1 mA
max.)
PA46 resin (UL94V-0)/natural
LCP resin (UL94V-0)/black
Copper-alloy/nickel spring substrate (2
m)
plated with tin alloy (2
m)
Copper-alloy/copper substrate (2 m) plated with
tin alloy (2 m)
-
30
to
+85°C
(No
condensation
at
low
temperatures.)
20 times
Rated voltage
Contact resistance
Insulation resistance
Withstand voltage
Insertion tolerance
Ambient temperature
1,500
Table of Dimensions
Poles Model
Poles Model Quantity per reel*
10
20
24
30
35
40
45
50
10
20
24
30
35
40
45
50
9.1
14.1
16.1
19.1
21.6
24.1
26.6
29.1
4.5
9.5
11.5
14.5
17.0
19.5
22.0
24.5
5.6
10.6
12.6
15.6
18.1
20.6
23.1
25.6
8.5
13.5
15.5
18.5
21.0
23.5
26.0
28.5
6.5
11.5
13.5
16.5
19.0
21.5
24.0
26.5
10.1
15.1
17.1
20.1
22.6
25.1
27.6
30.1
ABCDEF
XF2H-1015-1
XF2H-2015-1
XF2H-2415-1
XF2H-3015-1
XF2H-3515-1
XF2H-4015-1
XF2H-4515-1
XF2H-5015-1
XF2H-1015-1
XF2H-2015-1
XF2H-2415-1
XF2H-3015-1
XF2H-3515-1
XF2H-4015-1
XF2H-4515-1
XF2H-5015-1
C
D
A
B
0.5
7.3
1
3.2
2
(8.1)
6.74
6.35
3.44
(1.9)
B±0.05
E±0.1
F±0.1
0.5±0.05 (0.25)
1.3
1.5
2.2
Printed Circuit Board Matching
Dimensions (Top View)
* Order an integer multiple of the quantity per reel.
Applicable FPC Dimensions
2.8MIN
0.5±0.1 (C
-
0.1)±0.07
B±0.05
0.5±0.05 0.35±0.03
T=0.3±0.05
(Copper conductors)
XF2H- 15-1
4
0.5 mm-pitch ZIF-Slide Type XF2J
Top-entry ZIF Connector
Slider achieves secure locking.
Low-profile, protruding only 4.15 mm on the PCB.
Adhesion face on top of the connector suits automatic
mounting.
Specifications
Dimensions
Ordering Information
Materials/Finish
Rated current 0.5 A
50 VDC
30
m max.
(max.
20
mV,
max.
100 mA)
Housing
Slider
Contact
Hold-down
100 M min. (at 100 VDC)
250 VAC 1 min. (leakage current: 1 mA
max.)
PA46 resin (UL94V-0)/natural
PPS resin (UL94V-0)/black
Copper-alloy/nickel spring substrate (2
m)
plated with tin alloy (2 m)
Copper-alloy/copper substrate (2 m) plated with
tin alloy (2
m)
-
30
to
+85°C
(No
condensation
at
low
temperatures.)
30 times
Rated voltage
Contact resistance
Insulation resistance
Withstand voltage
Insertion tolerance
Ambient temperature
1,000
XF2J- 24-11
Table of Dimensions
Poles Model
Poles Model Quantity per reel*
6
8
12
14
16
22
28
6
8
12
14
16
22
28
7.5
8.5
10.5
11.5
12.5
15.5
18.5
2.5
3.5
5.5
6.5
7.5
10.5
13.5
3.6
4.6
6.6
7.6
8.6
11.6
14.6
6.9
7.9
9.9
10.9
11.9
14.9
17.9
ABCD
XF2J-0624-11
XF2J-0824-11
XF2J-1224-11
XF2J-1424-11
XF2J-1624-11
XF2J-2224-11
XF2J-2824-11
XF2J-0624-11
XF2J-0824-11
XF2J-1224-11
XF2J-1424-11
XF2J-1624-11
XF2J-2224-11
XF2J-2824-11
Printed Circuit Board Matching
Dimensions (Top View)
* Order an integer multiple of the quantity per reel.
Applicable FPC Dimensions
2.3
0.2
1.3
0.8
D
C
B
A
1
0.5
B±0.05
0.5±0.05
0.5±0.05
2.9
1.4 1.4
11
1.6
1.64
2.95
4.15
3.4
2.4
0.5±0.1 (C
-
0.1)±0.07
B±0.05
0.5±0.05 0.35±0.03
T=0.3±0.05
(Copper conductors)
3MIN
5
Ultra-low-profile Connector (SMT Terminal)
Side-entry Non-ZIF Type XF2E
Optimum low-profile design.
Ultra-low-profile FPC/FFC connector only
1.5 mm above the PCB.
Ultra-low-profile
only
1.5
mm
on
the
PCB
allows
mounting in spaces with restricted height.
0.8
mm-pitch
SMT
connectors
allow
high-density
mounting.
Modified-PA-resin housing is compatible with VPS, IR
reflow, etc.
Double-sided contacts maintain a stable contact force.
Standard
tape
packing
compatible
with
automatic
mounting.
Specifications
Dimensions
Ordering Information
Mounted Image
Rated current 0.5 A
50 VDC
30
m
max.
(max.
20
mV,
max.
100 mA)
100 M min. (at 100 VDC)
500 VAC 1 min.
(leakage current: 1 mA max.)
Materials/Finish
Housing
Contact
Modified PA resin containing glass (UL94V-0)/opal
Copper-alloy/nickel spring substrate (2
m) plated
with tin alloy (2 m)
-
30
to
+85°C
(No
condensation
at
low temperatures.)
Poles x 0.3 N (200 gf) max.
Rated voltage
Contact resistance
Insulation resistance
Withstand voltage
Total removal force Poles x 2.0 N (200 gf) max.
Total insertion force
10 times
Insertion tolerance
Ambient temperature
4,000
Table of Dimensions
Poles
Poles Model Quantity per reel*
5
6
7
8
9
10
12
15
17
20
5
6
7
8
9
10
12
15
17
20
7.6
8.4
9.2
10.0
10.8
11.6
13.2
15.6
17.2
19.6
4.9
5.7
6.5
7.3
8.1
8.9
10.5
12.9
14.5
16.9
3.2
4.0
4.8
5.6
6.4
7.2
8.8
11.2
12.8
15.2
6.2
7.0
7.8
8.6
9.4
10.2
11.8
14.2
15.8
18.2
ABCD
XF2E-0515-1
XF2E-0615-1
XF2E-0715-1
XF2E-0815-1
XF2E-0915-1
XF2E-1015-1
XF2E-1215-1
XF2E-1515-1
XF2E-1715-1
XF2E-2015-1
Printed Circuit Board Matching
Dimensions (Top View)
* Order an integer multiple of the quantity per reel.
Applicable FPC Dimensions
Height 1.5 mm XF2E
Printed circuit board
FPC/FFC
(0.25)
(D+0.1)±0.05 0.6+0.1
0
0
-0.05
0.8±0.05 C±0.05 0.3
(1.4)
2.8
2.1
2.8
0.8±0.05
0.8±0.15
(B
-
0.1)±0.07
C±0.05
0.5±0.05
A
C
D
1.2 0.8 0.2
0.6
2.85
4.9
5.6
B0.3
1.5 0.1
XF2E- 15-1(SMT Terminal)
6
Non-ZIF Type XF2K/XF2G
XF2K 0.5 mm-pitch Non-ZIF Type
Low-profile, protruding only 1.5 mm on the PCB.
Double-sided
contacts
maintain
a
stable
contact
force.
Discrimination
between
FPC
upper
and
lower
contacts
is unnecessary.
Dimensions Poles
Printed Circuit Board Matching
Dimensions (Top View)
Printed Circuit Board Matching
Dimensions (Top View)
XF2G 0.5 mm-pitch N-ZIF Type
Low-profile, protruding only 4.15 mm on the PCB.
Adhesion face on top of the connector suits automatic
mounting.
Dimensions
6Quantity Per Reel
4,000
Applicable FPC Dimensions
Poles
16 , 20 , 30
Quantity Per Reel
1,000
Applicable FPC Dimensions
A
0.5
0.25
A+2.4
A+3.8
A=0.5 x (N-1)
1.2 0.5
1
0.6 A + 1.1
A + 2.4
2.85
4.9
5.6
1.5
N=Poles
1.4
0.3
2.8
2.1
0.6
2.8MIN
0.5±0.1 (A+1)±0.07
A±0.05
0.5±0.05 0.35±0.03
T=0.3±0.05
(Copper conductors)
2.8MIN
0.5±0.1 (A+1)±0.07
A±0.05
0.5±0.05 0.35±0.03
T=0.3±0.05
(Copper conductors)
A + 2.4
A=0.5 x (N
-
1)
A +1.1
0.5
2.95
2.4
3.4
4.15
0.2
N=Poles
1.4 1.411
2.9 4
0.5±0.05
A±0.05
0.5±0.05
1.6
1.6
0.2
0.1
0.4
7
XF2K/XF2G XF2K/XF2G
Precautions
Recommended Reflow Conditions
Pre-heat
temperature: 150 ± 10°C
Time: 60 to 120 seconds
Soldering
temperature: 200 to 240°C
Time: Not exceeding 30 seconds
(Not exceeding 10 seconds at 240°C
maximum temperature.)
Storage
Do not store under high humidity levels as this may cause
deterioration of the insulation.
Handling the FPC
Do not forcibly bend or pull an FPC which has been mounted and
locked. This may cause discontinuities in the FPC.
OMRON SALES OFFICES
ASIA/OCEANIA
OMRON CORPORATION
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Osaka 540-6028
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Phone:81-6-6949-6010 Fax:81-6-6949-6019
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Phone:1-847-843-7910 Fax:1-847-843-3887
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Ontario M1B 5V8
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Phone:31-23-56-81100 Fax:31-23-56-81188
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Norway
Phone:47-22-65-75-00 Fax:47-22-65-83-00
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Phone:34-1-3-77-9000 Fax:34-1-3-77-9056
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London NW2 7HF
United Kingdom
Phone:44-181-450-4646 Fax:44-181-450-8087
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Altmannsdorferstrasse
142 A-1231 Vienna
Austria
Phone:43-1-801-90-0 Fax:43-1-804-48-46
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Stationsstraat 24 B-1702
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Phone:32-2-466-2480 Fax:32-2-466-0687
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Phone:42-2-67311-254 Fax:42-2-740333
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Phone:45-43-44-00-11 Fax:45-43-44-02-11
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239920
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Phone:65-835-3011 Fax:65-835-2711
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Road, Ladyao Chatuchak, Bangkok 10900
Thailand
Phone:66-2-937-0500 Fax:66-2-937-0501
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Phone:61-2-9878-6377 Fax:61-2-9878-6981
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Symonds Street Auckland
New Zealand
Phone:64-9-358-4400 Fax:64-9-358-4411
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Jakarta 12930
Indonesia
Phone:62-21-577-0833 Fax:62-21-577-0840
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BRASIL LTDA.
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Brazil
Phone:55-11-5564-6488 Fax:55-11-5564-7751
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AND SERVICE(M) SDN. BHD. (222675-U)
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Selangor Darul Ehsan
Malaysia
Phone:60-3-754-7323 Fax:60-3-754-6618
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HEAD QUARTERS
6F, Home Young Bldg., NO. 363,
Fu-Shing N. Road. Taipei
Taiwan
Phone:886-2-2715-3331 Fax:886-2-2712-6712
ALL DIMENSIONS SHOWN ARE IN MILLIMETERS.
To convert millimeters into inches, multiply by 0.03937. To convert grams into ounces, multiply by 0.03527.
Cat. No. G011-E1-01 In the interest of product improvement, specifications are subject to change without notice.
OMRON Corporation
C&C Components Division H.Q.
Mechanical - Components Division
28th FI., Crystal Tower Bldg.,
1-2-27 , Shiromi, Chuo-ku,
Osaka 540-6028 Japan
Phone: (81)6-6949-6017 Fax: (81)6-6949-6034 Printed in Japan
0199-1M (0199) W
