© Semiconductor Components Industries, LLC, 2006
February, 2006 Rev. 7
1Publication Order Number:
MC10H131/D
MC10H131
Dual D Type Master−Slave
Flip−Flop
Description
The MC10H131 is a MECL 10H part which is a functional/pinout
duplication of the standard MECL 10K family part, with 100%
improvement in clock speed and propagation delay and no increase in
powersupply current.
Features
Propagation Delay, 1.0 ns Typical
Power Dissipation, 235 mW Typical
Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
Voltage Compensated
MECL 10K Compatible
PbFree Packages are Available*
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
CDIP16
L SUFFIX
CASE 620A
MARKING DIAGRAMS*
PDIP16
P SUFFIX
CASE 648
http://onsemi.com
*For additional marking information, refer to
Application Note AND8002/D.
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
ORDERING INFORMATION
SOEIAJ16
CASE 966
16
1
16
1
MC10H131P
AWLYYWWG
1
16
MC10H131L
AWLYYWW
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G= PbFree Package
10H131
ALYWG
PLLC20
FN SUFFIX
CASE 775
20 110H131G
AWLYYWW
120
MC10H131
http://onsemi.com
2
Figure 1. Logic Diagram
Figure 2. Pin Assignment
VCC1
Q1
Q1
R1
S1
CE1
D1
VEE
VCC2
Q2
Q2
R2
S2
CE2
D2
CC
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
VCC1 = PIN 1
VCC2 = PIN 16
VEE = PIN 8
S1 5
D1 7
CE1 6
R1 4
CC 9
R2 13
CE2 11
D2 10
S2 12
Q1
Q1
Q2
Q2
2
3
14
15
Pin assignment is for DualinLine Package.
Table 1. RS TRUTH TABLE
R S Qn+1
L L Qn
L H H
H L L
H H ND
ND = Not Defined
Table 2. CLOCKED TRUTH TABLE
C D Qn+1
L X Qn
H L L
H H H
C = CE + CC
A clock H is a clock transition from a low to a high state.
Table 3. MAXIMUM RATINGS
Symbol Characteristic Rating Unit
VEE Power Supply (VCC = 0) 8.0 to 0 Vdc
VIInput Voltage (VCC = 0) 0 to VEE Vdc
Iout Output Current Continuous
Surge
50
100
mA
TAOperating Temperature Range 0 to +75 °C
Tstg Storage Temperature Range Plastic
Ceramic
55 to +150
55 to +165
°C
°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
MC10H131
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3
Table 4. ELECTRICAL CHARACTERISTICS (VEE = 5.2 V ±5%) (Note 1)
0°25°75°
Symbol Characteristic Min Max Min Max Min Max Unit
IEPower Supply Current 62 56 62 mA
IinH Input Current High
Pins 6, 11
Pin 9
Pins 7, 10
Pins 4, 5, 12, 13
530
660
485
790
310
390
285
465
310
390
285
465
mA
IinL Input Current Low 0.5 0.5 0.3 mA
VOH High Output Voltage 1.02 0.84 0.98 0.81 0.92 0.735 Vdc
VOL Low Output Voltage 1.95 1.63 1.95 1.63 1.95 1.60 Vdc
VIH High Input Voltage 1.17 0.84 1.13 0.81 1.07 0.735 Vdc
VIL Low Input Voltage 1.95 1.48 1.95 1.48 1.95 1.45 Vdc
1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is
maintained. Outputs are terminated through a 50 W resistor to 2.0 V.
Table 5. AC CHARACTERISTICS
0°25°75°
Symbol Characteristic Min Max Min Max Min Max Unit
tpd Propagation Delay
Clock, CE
Set, Reset
0.8
0.6
1.6
1.6
0.8
0.7
1.7
1.7
0.8
0.7
1.8
1.8
ns
trRise Time 0.6 2.0 0.6 2.0 0.6 2.2 ns
tfFall Time 0.6 2.0 0.6 2.0 0.6 2.2 ns
tset Setup Time 0.7 0.7 0.7 ns
thold Hold Time 0.8 0.8 0.8 ns
ftog Toggle Frequency 250 250 250 MHz
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
APPLICATION INFORMATION
The MC10H131 is a dual masterslave type D flipflop.
Asynchronous Set (S) and Reset (R) override Clock (CC)
and Clock Enable (CE) inputs. Each flipflop may be
clocked separately by holding the common clock in the new
low state and using the enable inputs for the clocking
function. If the common clock is to be used to clock the
flipflop, the Clock Enable inputs must be in the low state.
In this case, the enable inputs perform the function of
controlling the common clock.
The output states of the flipflop change on the positive
transition of the clock. A change in the information present
at the data (D) input will not affect the output information at
any other time due to master slave construction.
MC10H131
http://onsemi.com
4
ORDERING INFORMATION
Device Package Shipping
MC10H131FN PLLC20 46 Units / Rail
MC10H131FNG PLLC20
(PbFree)
46 Units / Rail
MC10H131FNR2 PLLC20 500 / Tape & Reel
MC10H131FNR2G PLLC20
(PbFree)
500 / Tape & Reel
MC10H131L CDIP16 25 Unit / Rail
MC10H131M SOEIAJ16 50 Unit / Rail
MC10H131MG SOEIAJ16
(PbFree)
50 Unit / Rail
MC10H131MEL SOEIAJ16 2000 / Tape & Reel
MC10H131MELG SOEIAJ16
(PbFree)
2000 / Tape & Reel
MC10H131P PDIP16 25 Unit / Rail
MC10H131PG PDIP16
(PbFree)
25 Unit / Rail
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MC10H131
http://onsemi.com
5
PACKAGE DIMENSIONS
M
N
L
Y BRK
W
V
D
D
S
L−M
M
0.007 (0.180) N S
T
S
L−M
M
0.007 (0.180) N S
T
S
L−M
S
0.010 (0.250) N S
T
XG1
B
U
Z
VIEW DD
20 1
S
L−M
M
0.007 (0.180) N S
T
S
L−M
M
0.007 (0.180) N S
T
S
L−M
S
0.010 (0.250) N S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
TSEATING
PLANE
S
L−M
M
0.007 (0.180) N S
T
S
L−M
M
0.007 (0.180) N S
T
H
VIEW S
K
K1
F
G1
20 LEAD PLLC
CASE 77502
ISSUE E
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS L, M, AND N DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM T, SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.385 0.395 9.78 10.03
B0.385 0.395 9.78 10.03
C0.165 0.180 4.20 4.57
E0.090 0.110 2.29 2.79
F0.013 0.019 0.33 0.48
G0.050 BSC 1.27 BSC
H0.026 0.032 0.66 0.81
J0.020 −−− 0.51 −−−
K0.025 −−− 0.64 −−−
R0.350 0.356 8.89 9.04
U0.350 0.356 8.89 9.04
V0.042 0.048 1.07 1.21
W0.042 0.048 1.07 1.21
X0.042 0.056 1.07 1.42
Y−−− 0.020 −−− 0.50
Z2 10 2 10
G1 0.310 0.330 7.88 8.38
K1 0.040 −−− 1.02 −−−
____
MC10H131
http://onsemi.com
6
PACKAGE DIMENSIONS
SOEIAJ16
CASE 96601
ISSUE A
HE
A1
DIM MIN MAX MIN MAX
INCHES
−−− 2.05 −−− 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.10 0.20 0.007 0.011
9.90 10.50 0.390 0.413
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059
0
0.70 0.90 0.028 0.035
−−− 0.78 −−− 0.031
A1
HE
Q1
LE
_10 _0
_10 _
LE
Q1
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
M
L
DETAIL P
VIEW P
c
A
b
e
M
0.13 (0.005) 0.10 (0.004)
1
16 9
8
D
Z
E
A
b
c
D
E
e
L
M
Z
CDIP16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620A01
ISSUE O NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
5 THIS DRAWING REPLACES OBSOLETE
CASE OUTLINE 620−10.
F
E
N
K
C
SEATING
PLANE
A
M
0.25 (0.010) T
M
L
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.750 0.785 19.05 19.93
B0.240 0.295 6.10 7.49
C−−− 0.200 −−− 5.08
D0.015 0.020 0.39 0.50
E0.050 BSC 1.27 BSC
F0.055 0.065 1.40 1.65
G0.100 BSC 2.54 BSC
H0.008 0.015 0.21 0.38
K0.125 0.170 3.18 4.31
L0.300 BSC 7.62 BSC
M0 15 0 15
N0.020 0.040 0.51 1.01
____
A
B
A
B
16
1
9
8
G
16X D
B
M
0.25 (0.010) T
T
16X J
MC10H131
http://onsemi.com
7
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
A
B
FC
S
H
GD
J
L
M
16 PL
SEATING
18
916
K
PLANE
T
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.740 0.770 18.80 19.55
B0.250 0.270 6.35 6.85
C0.145 0.175 3.69 4.44
D0.015 0.021 0.39 0.53
F0.040 0.70 1.02 1.77
G0.100 BSC 2.54 BSC
H0.050 BSC 1.27 BSC
J0.008 0.015 0.21 0.38
K0.110 0.130 2.80 3.30
L0.295 0.305 7.50 7.74
M0 10 0 10
S0.020 0.040 0.51 1.01
____
PDIP16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 64808
ISSUE R
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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Phone: 81357733850
MC10H131/D
MECL 10H and MECL 10K are trademarks of Motorola, Inc.
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