Z0107MNT1G - ON SEMICONDUCTOR

June, 2009 − Rev. 3

1Publication Order Number:

Z0103MN/D

Z0103MN, Z0107MN,

Z0109MN

Sensitive Gate Triac Series

Silicon Bidirectional Thyristors

Designed for use in solid state relays, MPU interface, TTL logic and

other light industrial or consumer applications. Supplied in surface

mount package for use in automated manufacturing.

Features

•Sensitive Gate Trigger Current in Four Trigger Modes

•Blocking Voltage to 600 V

•Glass Passivated Surface for Reliability and Uniformity

•Surface Mount Package

•These are Pb−Free Devices

MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)

Rating Symbol Value Unit

Peak Repetitive Off−State Voltage (Note 1)

(Sine Wave, 50 to 60 Hz, Gate Open,

TJ = −40 to +125°C)

VDRM,

VRRM

600 V

On−State Current RMS (TC = 80°C)

(Full Sine Wave 50 to 60 Hz)

IT(RMS) 1.0 A

Peak Non−repetitive Surge Current (One Full

Cycle Sine Wave, 60 Hz, TC = 25°C)

ITSM 8.0 A

Circuit Fusing Considerations

(Pulse Width = 8.3 ms)

I2t 0.4 A2s

Average Gate Power (TC = 80°C, t v 8.3 ms) PG(AV) 1.0 W

Peak Gate Current (t v 20 ms, TJ = +125°C) IGM 1.0 A

Operating Junction Temperature Range TJ−40 to

+125

°C

Storage Temperature Range Tstg −40 to

+150

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. VDRM and VRRM for all types can be applied on a continuous basis. Blocking

voltages shall not be tested with a constant current source such that the

voltage ratings of the devices are exceeded.

THERMAL CHARACTERISTICS

Characteristic Symbol Max Unit

Thermal Resistance, Junction−to−Ambient PCB

Mounted per Figure 1

RqJA 156 °C/W

Thermal Resistance, Junction−to−Tab Meas-

ured on MT2 Tab Adjacent to Epoxy

RqJT 25 °C/W

Maximum Device Temperature for

Soldering Purposes for 10 Secs Maximum

TL260 °C

TRIAC

1.0 AMPERE RMS

600 VOLTS

MT1

MT2

PIN ASSIGNMENT

3 Gate

Main Terminal 1

Main Terminal 2

4Main Terminal 2

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SOT−223

CASE 318E

STYLE 11

MARKING

DIAGRAM

AYW

10XMN G

A = Assembly Location

Y = Year

W = Work Week

10XMN = Device Code

x = 3, 7, 9

G= Pb−Free Package

(Note: Microdot may be in either location)

Device Package Shipping†

ORDERING INFORMATION

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

Z0103MNT1G SOT−223

(Pb−Free)

1000/Tape & Reel

Z0107MNT1G SOT−223

(Pb−Free)

1000/Tape & Reel

Z0109MNT1G SOT−223

(Pb−Free)

1000/Tape & Reel

Z0103MN, Z0107MN, Z0109MN

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ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted; Electricals apply in both directions)

Characteristic Symbol Min Typ Max Unit

OFF CHARACTERISTICS

Peak Repetitive Blocking Current TJ = 25°C

(VD = Rated VDRM, VRRM; Gate Open) TJ = +125°C

IDRM, IRRM −

−

5.0

500

ON CHARACTERISTICS

Peak On−State Voltage

(ITM = "1.4 A Peak; Pulse Width v 2.0 ms, Duty Cycle v 2.0%)

VTM − − 1.56 V

Gate Trigger Current (Continuous dc) Z0103MN

(VD = 12 Vdc, RL = 30 Ohms)

MT2(+), G(+)

MT2(+), G(−)

MT2(−), G(−)

MT2(−), G(+)

IGT

0.15

0.25

−

3.0

5.0

Gate Trigger Current (Continuous dc) Z0107MN

(VD = 12 Vdc, RL = 30 Ohms)

MT2(+), G(+)

MT2(+), G(−)

MT2(−), G(−)

MT2(−), G(+)

IGT

0.15

0.25

−

5.0

7.0

Gate Trigger Current (Continuous dc) Z0109MN

(VD = 12 Vdc, RL = 30 Ohms)

MT2(+), G(+)

MT2(+), G(−)

MT2(−), G(−)

MT2(−), G(+)

IGT

0.15

0.25

−

Latching Current (VD = 12 V, IG = 1.2 x IGT) Z0103MN

MT2(+), G(+) All Types

MT2(+), G(−) All Types

MT2(−), G(−) All Types

MT2(−), G(+) All Types

−

7.0

Latching Current (VD = 12 V, IG = 1.2 x IGT) Z0107MN

MT2(+), G(+) All Types

MT2(+), G(−) All Types

MT2(−), G(−) All Types

MT2(−), G(+) All Types

−

Latching Current (VD = 12 V, IG = 1.2 x IGT) Z0109MN

MT2(+), G(+) All Types

MT2(+), G(−) All Types

MT2(−), G(−) All Types

MT2(−), G(+) All Types

−

Gate Trigger Voltage (Continuous dc) (VD = 12 Vdc, RL = 30 Ohms) VGT − − 1.3 V

Gate Non−Trigger Voltage (VD = 12 V, RL = 30 Ohms, TJ = 125°C)

All Four Quadrants

VGD 0.2 − − V

Holding Current (Z0103MA)

(VD = 12 Vdc, Initiating Current = 50 mA, Gate Open) (Z0107MA, Z0109MA)

IH−

−

7.0

DYNAMIC CHARACTERISTICS

Rate of Change of Commutating Current

(VD = 400 V, ITM = 0.84 A, Commutating dv/dt = 1.5 V/ms, Gate Open,

TJ = 110°C, f = 250 Hz, with Snubber)

di/dt(c) 1.6 − − A/ms

Critical Rate of Rise of Off−State Voltage (VD = 67% Rated VDRM, Exponential

Waveform, Gate Open, TJ = 110°C) Z0103MN

Z0107MN

Z0109MN

dv/dt

−

V/ms

Repetitive Critical Rate of Rise of On−State Current, TJ = 125°C

Pulse Width = 20 ms, IPKmax = 15 A, diG/dt = 1 A/ms, f = 60 Hz

di/dt − − 20 A/ms

Z0103MN, Z0107MN, Z0109MN

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+ Current

+ Voltage

VTM

Symbol Parameter

VDRM Peak Repetitive Forward Off State Voltage

IDRM Peak Forward Blocking Current

VRRM Peak Repetitive Reverse Off State Voltage

IRRM Peak Reverse Blocking Current

Voltage Current Characteristic of Triacs

(Bidirectional Device)

IDRM at VDRM

on state

off state

IRRM at VRRM

Quadrant 1

MainTerminal 2 +

Quadrant 3

MainTerminal 2 −VTM

VTM Maximum On State Voltage

IHHolding Current

MT1

(+) IGT

GATE

(+) MT2

REF

MT1

(−) IGT

GATE

(+) MT2

REF

MT1

(+) IGT

GATE

(−) MT2

REF

MT1

(−) IGT

GATE

(−) MT2

REF

−

MT2 NEGATIVE

(Negative Half Cycle)

MT2 POSITIVE

(Positive Half Cycle)

Quadrant III Quadrant IV

Quadrant II Quadrant I

Quadrant Definitions for a Triac

IGT −+ IGT

All polarities are referenced to MT1.

With in−phase signals (using standard AC lines) quadrants I and III are used.

Z0103MN, Z0107MN, Z0109MN

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Figure 1. PCB for Thermal Impedance and Power Testing of SOT-223

0.079

2.0

0.079

2.0

0.059

1.5

0.091

2.3

0.091

2.3

inches

0.472

12.0

0.096

2.44

BOARD MOUNTED VERTICALLY IN CINCH 8840 EDGE CONNECTOR.

BOARD THICKNESS = 65 MIL., FOIL THICKNESS = 2.5 MIL.

MATERIAL: G10 FIBERGLASS BASE EPOXY

0.984

25.0

0.244

6.2

0.059

1.5

0.059

1.5

0.096

2.44

0.096

2.44

0.059

1.5

0.059

1.5

0.15

3.8

Z0103MN, Z0107MN, Z0109MN

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TA, MAXIMUM ALLOWABLE AMBIENT TEMPERATURE ( C)°

110

100

IT(RMS), RMS ON‐STATE CURRENT (AMPS)

110

100

TA, MAXIMUM ALLOWABLE AMBIENT TEMPERATURE ( C)°

Figure 2. On-State Characteristics Figure 3. Junction to Ambient Thermal

Resistance versus Copper Tab Area

Figure 4. Current Derating, Minimum Pad Size

Reference: Ambient Temperature

Figure 5. Current Derating, 1.0 cm Square Pad

Reference: Ambient Temperature

FOIL AREA (cm2)

θJA, JUNCTION TO AMBIENT THERMAL

, INSTANTANEOUS ON‐STATE VOLTAGE (VOLTS)

IT, INSTANTANEOUS ON‐STATE CURRENT (AMPS)

IT(RMS), RMS ON‐STATE CURRENT (AMPS)

Figure 6. Current Derating, 2.0 cm Square Pad

Reference: Ambient Temperature

1.0

0.1

0.01 5.04.03.02.0 30

160

2.00

110

0.5

0.30.20.10

IT(RMS), RMS ON‐STATE CURRENT (AMPS)

0.70.60.50.40.30.20.10

0.50.40.30.20.10

1.00 4.0 6.0 8.0 10

100

0.6 0.7 0.8

RESISTANCE, C/W°

150

140

130

120

110

100

TYPICAL

MAXIMUM

123

MINIMUM

FOOTPRINT = 0.076 cm2

DEVICE MOUNTED ON

FIGURE 1 AREA = L2

PCB WITH TAB AREA

AS SHOWN

0.4

TA, MAXIMUM ALLOWABLE

AMBIENT TEMPERATURE ( C)°

30°60°

90°

α = 180°

30°

MINIMUM FOOTPRINT

50 OR 60 Hz

120°

T(tab), MAXIMUM ALLOWABLE

TAB TEMPERATURE ( C)°

110

105

100

IT(RMS), ON‐STATE CURRENT (AMPS)

Figure 7. Current Derating

Reference: MT2 Tab

0.50.40.30.20.10 0.6 0.7 0.8

120°

30°

120°

90°

120°

90°

60°

30°

90°

TYPICAL AT TJ = 110°C

MAX AT TJ = 110°C

MAX AT TJ = 25°C

60°

α = 180°

1.0 cm2 FOIL AREA

50 OR 60 Hz

α = 180°α = 180°

REFERENCE:

FIGURE 1

60°

α = CONDUCTION

ANGLE

4.0 cm2 FOIL AREA

α = CONDUCTION

ANGLE

α = CONDUCTION

ANGLE

α = CONDUCTION

ANGLE

Z0103MN, Z0107MN, Z0109MN

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COMMUTATING dv/dt

dv/dt , (V/ S)

cμ

Figure 8. Power Dissipation

P(AV), MAXIMUM AVERAGE

POWER DISSIPATION (WATTS)

1.0

0.8

0.7

0.5

0.4

0.2

IT(RMS), RMS ON‐STATE CURRENT (AMPS)

Figure 9. Thermal Response, Device

Mounted on Figure 1 Printed Circuit Board

0.50.40.30.20.10 0.6 0.7 0.8

dc 90°

120°

1.0

di/dtc, RATE OF CHANGE OF COMMUTATING CURRENT (A/mS)

t, TIME (SECONDS)

r(t), TRANSIENT THERMAL

0.01

1.0

0.0010.0001

1.0

0.01 0.1 10 100

RESISTANCE (NORMALIZED)

0.1

1.0

TJ, JUNCTION TEMPERATURE (°C)

90807060 100 110

VDRM = 200 V

400 Hz

300 Hz

0.9

0.6

0.3

0.1

1.0

110°

VDRM

ITM

60 Hz

30°

f = 1

2 tw

COMMUTATING dv/dt

dv/dt , (V/ S)

cμ

60°

80°

180 Hz

α = 180°60°

(dińdt)c+

6fITM

1000

100°

α = CONDUCTION

ANGLE

Figure 10. Simplified Test Circuit to Measure the Critical Rate of Rise of Commutating Voltage (dv/dt)c

LL1N4007

200 V

MEASURE

CHARGE

CONTROL

CHARGE TRIGGER

NON‐POLAR

51 W

MT2

MT1

1N914

TRIGGER CONTROL

200 VRMS

ADJUST FOR

ITM, 60 Hz VAC

Note: Component values are for verification of rated (dv/dt)c. See AN1048 for additional information.

ADJUST FOR

dv/dt(c)

Figure 11. Typical Commutating dv/dt versus

Current Crossing Rate and Junction Temperature

Figure 12. Typical Commutating dv/dt versus

Junction Temperature at 0.8 Amps RMS

Z0103MN, Z0107MN, Z0109MN

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STATIC dv/dt (V/ s)

RG, GATE - MAIN TERMINAL 1 RESISTANCE (OHMS)

Figure 13. Exponential Static dv/dt versus

Gate − Main Terminal 1 Resistance

10 10,000

Figure 14. Typical Gate Trigger Current Variation

TJ, JUNCTION TEMPERATURE (°C)

0.1

0-40 20 100

1.0

V , GATE TRIGGER VOLTAGE (VOLTS)

1.1

0.3

TJ, JUNCTION TEMPERATURE (°C)

-40

600 Vpk

TJ = 110°C

IGT4

IGT1

1000100

IGT3

IGT2

GT, GATE TRIGGER CURRENT (mA)

-20 40 60 80

0 20 100-20 40 60 80

VGT2

VGT1

VGT3 VGT4

MAIN TERMINAL #2

POSITIVE

MAIN TERMINAL #1

POSITIVE

HOLDING CURRENT (mA)

6.0

TJ, JUNCTION TEMPERATURE (°C)

Figure 15. Typical Holding Current Variation

-40

5.0

4.0

3.0

2.0

1.0

I ,

0 20 100-20 40 60 80

MAIN TERMINAL #2

POSITIVE

MAIN TERMINAL #1

POSITIVE

Figure 16. Gate Trigger Voltage Variation

Z0103MN, Z0107MN, Z0109MN

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PACKAGE DIMENSIONS

SOT−223 (TO−261)

CASE 318E−04

ISSUE L

STYLE 11:

PIN 1. MT 1

2. MT 2

3. GATE

4. MT 2

123

0.08 (0003)

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

1.5

0.059 ǒmm

inchesǓ

SCALE 6:1

3.8

0.15

2.0

0.079

6.3

0.248

2.3

0.091

2.3

0.091

2.0

0.079

SOLDERING FOOTPRINT*

DIM

MIN NOM MAX MIN

MILLIMETERS

1.50 1.63 1.75 0.060

INCHES

A1 0.02 0.06 0.10 0.001

b0.60 0.75 0.89 0.024

b1 2.90 3.06 3.20 0.115

c0.24 0.29 0.35 0.009

D6.30 6.50 6.70 0.249

E3.30 3.50 3.70 0.130

e2.20 2.30 2.40 0.087

0.85 0.94 1.05 0.033

0.064 0.068

0.002 0.004

0.030 0.035

0.121 0.126

0.012 0.014

0.256 0.263

0.138 0.145

0.091 0.094

0.037 0.041

NOM MAX

L1 1.50 1.75 2.00 0.060

6.70 7.00 7.30 0.264

0.069 0.078

0.276 0.287

− −

0°10°0°10°

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

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Z0103MN/D

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