2N5114UB thru 2N5116UB Screening in reference to MIL-PRF-19500 available P-CHANNEL J-FET Available on commercial versions DESCRIPTION This low-profile surface mount device is available in military equivalents for high-reliability applications. Microsemi also offers numerous other products to meet higher and lower power voltage regulation applications. Important: For the latest information, visit our website http://www.microsemi.com. FEATURES * Surface mount equivalent to JEDEC registered 2N5114 thru 2N5116 series. * Low-profile ceramic surface mount package. * Up-screening in reference to MIL-PRF-19500 is available. (See part nomenclature.) * RoHS compliant versions available (commercial grade only). UB Package Also available in: TO-18 package APPLICATIONS / BENEFITS * Low-profile UB package. * Lightweight. (leaded) 2N5114 - 2N5116 MAXIMUM RATINGS @ T C = +25 oC unless otherwise noted. Parameters/Test Conditions Junction and Storage Temperature (1) Gate-Source Voltage Drain-Source Voltage (1) Drain-Gate Voltage Gate Current o (2) Steady-State Power Dissipation @ TA = +25 C Symbol Value TJ and TSTG V GS V DS V DG IG PD -65 to +200 30 30 30 50 0.500 Notes: 1. Symmetrical geometry allows operation of those units with source / drain leads interchanged. 2. Derate linearly 3.0 mW/C for T A > +25 C. Unit o C V V V mA W MSC - Lawrence 6 Lake Street, Lawrence, MA 01841 Tel: 1-800-446-1158 or (978) 620-2600 Fax: (978) 689-0803 MSC - Ireland Gort Road Business Park, Ennis, Co. Clare, Ireland Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 Website: www.microsemi.com T4-LDS-0006-1, Rev. 1 (111983) (c)2011 Microsemi Corporation Page 1 of 5 2N5114UB thru 2N5116UB MECHANICAL and PACKAGING * * * * * * CASE: Ceramic. TERMINALS: Gold plating over nickel underplate. RoHS compliant matte/tin available on commercial grade only. MARKING: Part number, date code, manufacturer's ID. TAPE & REEL option: Standard per EIA-418D. Consult factory for quantities. WEIGHT: < 0.04 grams. See Package Dimensions on last page. PART NOMENCLATURE MX 2N5114 UB (e3) Reliability Level MQ (reference JAN) MX (reference JANTX) MV (reference JANTXV) Blank = Commercial RoHS Compliance e3 = RoHS Compliant (available on commercial grade only) Blank = non-RoHS Compliant Surface Mount Package JEDEC type number (see Electrical Characteristics table) T4-LDS-0006-1, Rev. 1 (111983) (c)2011 Microsemi Corporation Page 2 of 5 2N5114UB thru 2N5116UB ELECTRICAL CHARACTERISTICS @ T A = +25 oC unless otherwise noted. Parameters / Test Conditions Symbol Min. Gate-Source Breakdown Voltage VDS = 0, IG = 1.0 A V(BR)GSS 30 Drain-Source "On" State Voltage VGS = 0 V, ID = -15 mA VGS = 0 V, ID = -7.0 mA VGS = 0 V, ID = -3.0 mA 2N5114UB 2N5115UB 2N5116UB Gate Reverse Current VDS = 0, VGS = 20 V Max. Unit V VDS(on) -1.3 -0.8 -0.6 V IGSS 500 pA -500 -500 -500 pA Drain Current Cutoff VGS = 12 V, VDS = -15 V VGS = 7.0 V, VDS = -15 V VGS = 5.0 V, VDS = -15 V 2N5114UB 2N5115UB 2N5116UB ID(off) Zero Gate Voltage Drain Current VGS = 0, VDS = -18V VGS = 0, VDS = -15V VGS = 0, VDS = -15V 2N5114UB 2N5115UB 2N5116UB IDSS -30 -15 -5.0 -90 -60 -25 mA Gate-Source Cutoff VDS = -15, ID = -1.0 nA VDS = -15, ID = -1.0 nA VDS = -15, ID = -1.0 nA 2N5114UB 2N5115UB 2N5116UB VGS(off) 5.0 3.0 1.0 10 6.0 4.0 V Symbol Min. Max. Unit DYNAMIC CHARACTERISTICS Parameters / Test Conditions Small-Signal Drain-Source "On" State Resistance VGS = 0, ID = -1.0 mA Small-Signal Drain-Source "On" State Resistance VGS = 0, ID = 0; f = 1 kHz Small-Signal, Common-Source Short-Circuit Reverse Transfer Capacitance VGS = 12 V, VDS = 0 VGS = 7.0 V, VDS = 0 VGS = 5.0 V, VDS = 0 2N5114UB 2N5115UB 2N5116UB rds(on)1 75 100 175 2N5114UB 2N5115UB 2N5116UB rds(on)2 75 100 175 2N5114UB 2N5115UB 2N5116UB Crss 7.0 pF Ciss 25 27 pF Small-Signal, Common-Source Short-Circuit Input Capacitance VGS = 0, VDS = -15 V, f = 1.0 MHz 2N5114UB, 2N5115UB 2N5116UB T4-LDS-0006-1, Rev. 1 (111983) (c)2011 Microsemi Corporation Page 3 of 5 2N5114UB thru 2N5116UB ELECTRICAL CHARACTERISTICS @ T A = +25 oC unless otherwise noted. (continued) SWITCHING CHARACTERISTICS Parameters / Test Conditions Turn-On Delay Time Rise Time Turn-Off Delay Time T4-LDS-0006-1, Rev. 1 (111983) Symbol Max. Unit Td(on) 6 10 25 s 2N5114UB 2N5115UB 2N5116UB tr 10 20 35 s 2N5114UB 2N5115UB 2N5116UB Td(off) 6 8 20 s 2N5114UB 2N5115UB 2N5116UB (c)2011 Microsemi Corporation Min. Page 4 of 5 2N5114UB thru 2N5116UB PACKAGE DIMENSIONS Dimensions Symbol inch Dimensions millimeters Min Max Min Max BH BL .046 .115 .056 .128 1.17 2.92 1.42 3.25 BW CL .085 .108 .128 2.16 Note Symbol inch millimeters Min Max Min Max LS1 LS2 .036 .071 .040 .079 0.91 1.81 1.02 2.01 2.74 3.25 LW r 0.16 0.24 .008 0.41 0.61 .203 r1 r2 CW LL1 .022 .108 .038 0.56 2.74 0.97 LL2 .017 .035 0.43 0.89 .012 .022 Note .305 .559 NOTES: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. Hatched areas on package denote metallized areas (tungsten with gold plating 60 micro inches minimum over 80 micro inches minimum nickel). 4. Pad 1 = drain, Pad 2 = source, Pad 3 = gate, Pad 4 = shielding connected to the lid. 5. In accordance with ASME Y14.5M, diameters are equivalent to x symbology. 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