RClamp0542Z Ultra Small RClamp(R) 2-Line ESD Protection PROTECTION PRODUCTS - RailClamp(R) Description Features RClamp 0542Z is an ultra low capacitance ESD protection device designed to protect two high-speed lines in an 0201 footprint. This revolutionary package design reduces board space requirements by more than 50% over existing single line solutions. RClamp0542Z is a three pin device with identical low capacitance TVS diodes connected to each pin. Any two pins may be connected to high-speed lines, while the third pin is connected to ground. This gives the designer maximum flexibility in pcb routing. Each line has a maximum capacitance of only 0.30pF allowing it to be used on circuits operating in excess of 6GHz without appreciable signal attenuation. RClamp0542Z is in a 3-pin SLP0603P3X3A package. It measures 0.62 x 0.32 mm with a nominal height of only 0.25mm. Leads partially extend up the side of the package for ease of soldering and are finished with lead-free NiAu. The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and tablets. (R) High ESD withstand Voltage: +/-10kV (Contact) and +/- 15kV (Air) per IEC 61000-4-2 Able to withstand over 1000 ESD strikes per IEC 61000-4-2 Level 4 1 pack age Ultra-small 020 0201 package Protects two high-speed data lines Low reverse current: <1nA typical (VR=5V) Working voltage: 5V Low capacitance: 0.30pF maximum Dynamic resistance: 0.67 Ohms (Typ) Solid-state silicon-avalanche technology Mechanical Characteristics SLP0603P3X3A package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions: 0.6 x 0.3 x 0.25 mm Lead Finish: NiAu Molding compound flammability rating: UL 94V-0 Marking: Marking code + dot matrix date code Packaging: Tape and Reel Applications Nominal Dimensions MIPI / MDDI Thunderbolt USB 3.0 eSATA HDMI eDP MHL Schematic 0.62 1 0.115 1 2 3 3 0.32 0.100 0.250 2 Nominal Dimensions (in mm) Revision 12/8/2014 1 www.semtech.com RClamp0542Z PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20s) Pp k 30 Watts Peak Pulse Current (tp = 8/20s) IP P 2 A ESD per IEC 61000-4-2 (Air)1 ESD per IEC 61000-4-2 (Contact)1 VESD +/- 15 +/- 10 kV TJ -55 to +125 C TSTG -55 to +150 C Operating Temperature Storage Temperature Electrical Characteristics (T=25oC) Parameter Symbol Conditions Minimum Typical Maximum Units 5 V 9 11 V 1 50 nA 15 V Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Between any 2 pins Reverse Leakage Current IR VRWM = 5V, T=25C Between any 2 pins Clamping Voltage VC IPP = 2A, tp = 8/20s Between any 2 pins ESD Clamping Voltage2 VC IPP = 4A, tlp = 0.2/100ns Pin 1 to 2 or 3 to 2 12 V ESD Clamping Voltage2 VC IPP = 16A, tlp = 0.2/100ns Pin 1 to 2 or 3 to 2 20 V Dynamic Resistance2,3 RD tp = 100ns Pin 1 to 2 or 3 to 2 0.67 Ohms Junction Capacitance Cj VR = 0V to 5V, f = 1MHz Between any 2 pins 0.25 CjVR VR = 0V to 5V, f = 1MHz Change in Capacitance Over VR 7 0.30 pF 0.030 pF Notes 1)ESD gun return path connected to ESD ground reference plane. 2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns. 3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A (c) 2014 Semtech Corporation 2 www.semtech.com RClamp0542Z PROTECTION PRODUCTS Typical Characteristics Clamping Voltage vs. Peak Pulse Current (tp=8/20us) Non-Repetitive Peak Pulse Power vs. Pulse Time 20 1000 Peak Pulse Power - PPP (W) TA = 25OC 15 Peak Clamping Voltage VC (V) 100 10 DR040412-30 1 0.1 1 10 10 5 TA = 25OC Waveform: tp= 8x20us 0 100 0 0.5 1 1.5 Peak Pulse Current IPP (A) Pulse Duration - tp (s) Junction Capacitance vs. Reverse Voltage 2 2.5 TLP Characteristic 20 0.35 Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns 0.30 15 TLP Current (A) Junction Capacitance CJ (pF) 0.25 0.20 0.15 0.10 Pin 1 to Pin 2 and Pin 3 to Pin 2 10 Pin 1 to Pin 3 5 0.05 f = 1MHz 0 0.00 0 1 2 Voltage (V) 3 4 0 5 5 10 ESD Clamping (+8kV Contact per IEC 61000-4-2) 20 25 30 ESD Clamping (-8kV Contact per IEC 61000-4-2) 100 20 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane. Pin 1 to Pin3 80 0 Pin 1 to Pin2 and Pin 3 to Pin 2 Clamping Voltage VC (V) Clamping Voltage VC (V) 15 Clamping Voltage (V) 60 40 20 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane. 0 20 40 60 Pin 1 to Pin 2 and Pin 3 to Pin 2 80 Pin 1 to Pin3 RC0542Z_AR_N8_ESD 100 20 10 0 10 20 (c) 2014 Semtech Corporation 30 40 Time (ns) 50 60 70 10 80 3 0 10 20 30 40 Time (ns) 50 60 70 80 www.semtech.com RClamp0542Z PROTECTION PRODUCTS Typical Characteristics Analog Cross Talk Typical Insertion Loss S21 0 -0.1 10 -0.2 20 -0.3 30 Insertion Loss IL (dB) S21 (dB) 0 -0.4 -0.5 -0.6 -0.7 -0.8 -0.9 40 50 60 70 80 90 -1 0.1 1 10 100 1000 10000 100 Frequency (MHz) 0.3 3 30 300 3000 Frequency (MHz) Applications Information Assembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joints. The figure at the right details Semtech's recommended aperture based on the assembly guidelines detailed in the table below. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. Exact manufacturing parameters will require some experimentation to get the desired solder application. Assembly Parameter Laser cut, Electro-polished Aper ture shape Rectangular with rounded corners Solder Paste Type Solder Reflow Profile PCB Solder Pad Design PCB Pad Finish (c) 2014 Semtech Corporation 0.130 0.450 R ecommendation Solder Stencil Design Solder Stencil Thickness 0.325 0.220 0.170 Stencil opening for solder print Solder Mask 0.100 mm (0.004") Land Pattern Type 4 size sphere or smaller All Dimensions are in mm Recommended Mounting Pattern (All dimensions are in mm) Per JEDEC J-STD-020 N on-Solder mask defined OSP OR N iAu 4 www.semtech.com RClamp0542Z PROTECTION PRODUCTS Outline Drawing - SLP0603P3X3A B D A DIM A A1 b D E e L L1 N aaa bbb E TOP VIEW 0.050 TYP DIMENSIONS MILLIMETERS MIN NOM MAX 0.235 0.250 0.265 0.005 0.015 0.050 0.290 0.32 0.350 0.590 0.62 0.650 0.290 0.32 0.350 0.253 BSC 0.090 0.115 0.140 0.090 0.100 0.125 3 0.08 0.10 A SEATING PLANE aaa C C A1 2X L bxN bbb C A B L1 e BOTTOM VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS(ANGLES IN DEGREES). Land Pattern - SLP0603P3X3A Z Y1 DIMENSIONS DIM C G X Y Y1 Z X G MILLIMETERS (0.275) 0.113 0.430 0.200 0.125 0.750 Y (C) NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. (c) 2014 Semtech Corporation 5 www.semtech.com RClamp0542Z PROTECTION PRODUCTS Marking Code Ordering Information 7 Part Number Qty per Reel Pocket Pitch Reel Size RClamp0542Z.TFT 15,000 2mm 7 Inch Notes: RailClamp and RClamp are trademarks of Semtech Corporation Note: Device is electrically symmetrical Carrier Tape Specification 7 7 7 Date Code Location (Towards Sprocket Holes) Device Orientation in Tape (c) 2014 Semtech Corporation 6 www.semtech.com RClamp0542Z PROTECTION PRODUCTS Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 (c) 2014 Semtech Corporation 7 www.semtech.com